A detection method for measuring the grinding thickness of surface grinding processing on line without damage

Abstract

The application discloses a kind of detection methods for measuring face grinding processing grinding thickness on line nondestructively, comprising the following steps: customizing, installing laser coaxial displacement meter;Planning sampling point of laser coaxial displacement meter and data calculation model;Laser coaxial displacement meter real-time detection glass substrate thickness data and upload detection data to host computer;According to the received detection data, the host computer calculates the face grinding processing grinding thickness T pm The thickness of glass substrate before and after grinding is measured on line in real time by using optical coaxial thickness measuring probe, and the difference between the upper and lower surfaces is the thickness of glass substrate, which can avoid test error caused by glass transmission jitter, and realize high-precision and high-stability thickness measurement. The glass substrate thickness size and grinding thickness data can be measured on line nondestructively, and the problems of existing detection methods, such as offline measurement, low efficiency and destructive test for large substrate glass, are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of glass substrate thickness detection, and particularly relates to a detection method for on-line nondestructive measurement of face grinding processing grinding thickness. BACKGROUND

[0002] In the process of face grinding processing of a glass substrate, the grinding amount of face grinding needs to be detected. There are two existing detection methods, namely a weight loss method and a step method. The experimental processes of the two methods are described as follows.

[0003] The weight loss method is as follows: the weight of the glass substrate before face grinding is measured as m0, then the glass substrate is subjected to face grinding processing, and the weight of the glass substrate after face grinding is measured as m1. The grinding removal amount m is obtained by subtracting the weight of the glass substrate after face grinding from the weight of the glass substrate before face grinding, that is, m = m0-m1. p The grinding time is t, the surface area subjected to grinding processing is s, and the density of the glass substrate is p. The grinding thickness h can be calculated according to the formula h = (m0-m1) / (s*p).

[0004] The step method is as follows: a portion of the glass substrate is covered with a wear-resistant material, then the glass substrate is subjected to face grinding processing, and then the wear-resistant material is removed. The thickness of the glass substrate is measured by using a surface profiler or a three-coordinate method. The thickness of the glass substrate in the area covered with the wear-resistant material is h0, and the thickness of the glass substrate in the area not covered with the wear-resistant material is h1. The grinding thickness h can be calculated according to the formula h = h0-h1.

[0005] However, it can be known from the above experimental processes that the weight loss method needs to measure the weight of the glass substrate offline. If the weight loss method is applied to the measurement of a high-generation substrate, the size of the weighing scale is limited, and the glass substrate needs to be cut for weighing. Therefore, the method is only suitable for the measurement of the grinding thickness of a small-size substrate. The step method needs to make marks on the surface of the glass substrate, and the marked area is not subjected to grinding processing due to the coverage of the wear-resistant material. This will cause the sample glass to be scrapped, and the thickness of the glass substrate needs to be measured offline by using a surface profiler or a three-coordinate method. The size of the measurement platform of the surface profiler or the three-coordinate method is limited, and the glass substrate needs to be cut for measurement.

[0006] In summary, the two existing detection methods for the grinding thickness of face grinding processing of a glass substrate (the weight loss method and the step method) both need to perform destructive tests on the glass, are not suitable for the detection of the face grinding thickness of a large-size substrate, and are time-consuming and laborious in the offline measurement process, and have low detection efficiency. SUMMARY

[0007] The present application solves the technical problem that the existing detection methods for the grinding thickness of face grinding processing of a glass substrate (the weight loss method and the step method) both need to perform destructive tests on the glass, are not suitable for the detection of the face grinding thickness of a large-size substrate, and are time-consuming and laborious in the offline measurement process, and have low detection efficiency.

[0008] The object of the present application can be achieved by the following technical solutions:

[0009] A detection method for measuring the grinding thickness of surface grinding processing in an online nondestructive manner comprises the following steps:

[0010] Customize and install a laser coaxial displacement meter, and the thickness measurement probe of the laser coaxial displacement meter is directed towards the glass substrate;

[0011] Plan the sampling point positions of the laser coaxial displacement meter and a data calculation model;

[0012] The laser coaxial displacement meter detects the thickness data of the glass substrate in real time and uploads the detection data to the host computer;

[0013] The host computer calculates the surface grinding processing grinding thickness T according to the received detection data pm ;

[0014] In the case of a known surface grinding processing time t, the surface grinding processing rate RR is calculated according to RR=T pm / t.

[0015] As a further scheme of the present application, the planning method of the sampling point positions of the laser coaxial displacement meter is as follows:

[0016] The substrate glass is evenly divided into m sub-zones along the short edge direction and evenly divided into n sub-zones along the long edge direction of the glass, the thickness of the glass at the center point of each zone is measured, the number of sampling points is m lines*n points, and the average value obtained after multi-point measurement is the surface grinding processing grinding thickness T pm .

[0017] As a further scheme of the present application, m coaxial thickness measurement probes are arranged along the direction perpendicular to the glass flow direction, and the connecting line formed by the plurality of coaxial thickness measurement probes is parallel to the glass substrate.

[0018] As a further scheme of the present application, m=7 and n=21.

[0019] As a further scheme of the present application, the measurement sampling point positions of the thickness measurement before surface grinding and the thickness measurement after surface grinding overlap.

[0020] As a further scheme of the present application, the laser coaxial displacement meter comprises a laser coaxial displacement meter before surface grinding and a laser coaxial displacement meter after surface grinding.

[0021] As a further scheme of the present application, the light source of the thickness measurement probe of the laser coaxial displacement meter is a multi-color light source.

[0022] According to the detection method for measuring the grinding thickness of surface grinding processing in an online nondestructive manner, at least one of the following technical effects is achieved:

[0023] (1) The optical coaxial thickness measuring probe is used to measure the thickness of the glass substrate before and after grinding in real time, and the difference between the upper and lower surfaces is the thickness of the glass substrate, which can avoid the test error caused by the transmission jitter of the glass, and realize high-precision and high-stability thickness measurement.

[0024] (2) The optical coaxial probe is used to measure the thickness of the glass substrate before and after grinding in real time, and since the light source is conical, the test error caused by the uneven surface of the glass can be avoided, and high-reliability thickness measurement can be realized.

[0025] (3) The same measuring point of the glass substrate before and after grinding can avoid the measurement error caused by different points.

[0026] (4) Multi-line and multi-point measurement takes average value, which effectively improves the accuracy; at the same time, the grinding thickness can be calculated according to the process requirements; the glass substrate is divided into zones and defined as ID, when the data of a certain position is obviously abnormal, the problem area can be quickly and accurately located, and the processing decision is made.

[0027] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter in the description of embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the description of embodiments, taken in conjunction with the following drawings in which:

[0029] Fig. 1 is a schematic diagram of the light source irradiation in the optical coaxial thickness measuring principle of the present application;

[0030] Fig. 2 is a schematic diagram of thickness calculation in the optical coaxial thickness measuring principle of the present application;

[0031] Fig. 3 is a schematic diagram of the glass substrate being divided into zones and defined as ID in the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described in detail below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0033] In the description of the present application, it should be understood that the orientation description, such as the orientation or positional relationship indicated by the upper, lower, front, rear, left, right and the like, is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0034] In the description of the present application, one or more is meant to be one or more, more than two is meant to be two or more, greater than, less than, more than, etc. is understood to not include the number, above, below, within, etc. is understood to include the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0035] Please refer to Figs. 1-3 The present application is a kind of on-line nondestructive testing of surface grinding processing grinding thickness detection method, comprising the following steps: custom, installation laser coaxial displacement meter, laser coaxial displacement meter's thickness probe is oriented to the direction of glass substrate;Planning laser coaxial displacement meter's sampling point and data calculation model;Laser coaxial displacement meter real-time detection glass substrate thickness data and upload detection data to host computer;Host computer according to the received detection data, calculate the surface grinding processing grinding thickness T pm ;In the case of known surface grinding processing time t, according to RR=T pm / t calculate the surface grinding processing rate RR.

[0036] Please refer to Figs. 1-2 In one embodiment of the present application, first, custom, install laser coaxial displacement meter, install laser coaxial displacement meter so that the thickness probe of laser coaxial displacement meter is oriented to the direction of the position of glass substrate;That is, the thickness probe can emit a light beam towards the direction of the glass substrate, and the light beam is conical, the conical light beam can reduce the influence of the surface of the product to be measured on the detection, even if there are pits and steps on the surface, there is no dead angle for detection, and the multi-point detection can effectively reduce the rejection rate. Further, the laser coaxial displacement meter comprises a laser coaxial displacement meter before surface grinding and a laser coaxial displacement meter after surface grinding. The size data before and after surface grinding is detected by different laser coaxial displacement meters respectively, so as to ensure the measurement accuracy and avoid misjudgment and confusion. The light source of the thickness probe of the laser coaxial displacement meter is a multi-color light source. Blue laser is irradiated on a fluorescent body that emits red and green light at the same time to generate multi-color light. Compared with ordinary white LED light source, stable high brightness can be achieved in a wider wavelength range. At any position in the measurement range, sufficient light quantity can be ensured to achieve high precision measurement.

[0037] Please refer to Figs. 1-3In one embodiment of the present invention, the sampling points and data calculation model of the laser coaxial displacement meter are planned. The sampling point planning method of the laser coaxial displacement meter is as follows: the substrate glass is evenly divided into m sections along the short side direction and n sections along the long side direction of the glass. The glass thickness at the center point of each block is measured. The number of sampling points is m lines * n points. After multi-point measurement, the average value is taken to obtain the surface grinding thickness T. pm By taking the average of multiple measurements, we effectively reduce detection errors and accurately measure glass thickness. m coaxial thickness gauges are evenly distributed perpendicular to the glass flow direction, with the line connecting the multiple coaxial thickness gauges parallel to the glass substrate. This means a coaxial thickness gauge is placed in each section along the short side, and measurements are taken at fixed intervals. Each thickness gauge measures a total of n points, meaning a large glass substrate can be inspected at m lines and n points.

[0038] See also Figs. 1-3 In one embodiment of the present invention, a laser coaxial displacement meter detects the thickness data of the glass substrate in real time and uploads the detection data to the host computer; the thickness of the glass substrate before surface grinding T prd , the thickness of the glass substrate after surface grinding is T apd The difference between the two is the glass grinding thickness T pm The host computer calculates the grinding thickness T of the surface grinding process based on the received detection data. pm ; When the surface grinding time t is known, according to RR=T pm To avoid measurement errors caused by different measurement positions, the sampling points for thickness measurement before and after surface grinding overlap.

[0039] Working principle of the present invention:

[0040] 1. Customize, install and calibrate online laser coaxial displacement meter (coaxial optical thickness inspection machine) before and after surface grinding.

[0041] 2. Plan the sampling points and data calculation model of the laser coaxial displacement meter before and after surface grinding. This embodiment uses 7 lines and 21 points as an example. In actual application, the glass plate can be divided into zones according to the size of the glass plate and the detection requirements.

[0042] See also Fig. 3In one embodiment of the present application, the glass substrate is evenly divided into 7 sub-zones along the short side direction and 21 sub-zones along the long side direction, and the thickness of the glass substrate at the center of each sub-zone is measured; 7 coaxial thickness measuring probes are evenly arranged along the vertical direction of the glass flow, and the position of each thickness measuring probe matches the center position of the sub-zone, so that the thickness of the glass substrate at the position of the 7 lines can be detected in real time. The sampling interval of each detection line is adjusted, and 21 points are evenly taken on each line. A total of 147 points are sampled, and the final data is obtained by averaging the detection data of all points. After the sub-zones are divided, the ID of each sub-zone is defined on the upper computer, and then the data calculation model is planned, wherein the glass ID is the short side sub-zone + the long side sub-zone, such as the ID of the first sub-zone of the short side and the first sub-zone of the long side, which is T X1Y1 , and the ID of the seventh sub-zone of the short side and the first sub-zone of the long side is T X1Y7 The glass substrate is divided into sub-zones and defined as ID, and when the data at a certain position is obviously abnormal, the problem area can be quickly and accurately located, and a treatment decision can be made, such as re-detection, cutting, scrapping, or other processing methods.

[0043] 3. Turn on the pre-grinding laser coaxial displacement meter, and calculate the thickness T pre of the glass substrate before grinding in real time. Report the glass ID and detection data to the upper computer in real time.

[0044] 4. After face grinding, turn on the post-grinding laser coaxial displacement meter, and calculate the thickness T apd of the glass substrate after grinding in real time. Report the glass ID and detection data to the upper computer in real time.

[0045] 5. The upper computer receives the glass ID and detection data reported by the pre-grinding laser coaxial displacement meter and the post-grinding laser coaxial displacement meter, and the difference between the thickness data of the same ID number is the face grinding processing grinding thickness T pm .

[0046] 6. In the case where the face grinding processing time t is known, the face grinding processing rate RR is further calculated.

[0047] The above describes one embodiment of the present application in detail, but the above description is only a preferred embodiment of the present application and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made according to the scope of the present application should still be included in the scope of the claims of the present application.

Claims

1. A method for measuring the grinding thickness of a surface during online non-destructive grinding, characterized in that: The steps include: Customize and install a laser coaxial displacement meter, with the thickness measuring probe of the laser coaxial displacement meter facing the direction of the glass substrate; the thickness measuring probe can emit a light beam toward the direction of the glass substrate, and the light beam is cone-shaped; Plan the sampling points and data calculation model of the laser coaxial displacement meter; The laser coaxial displacement meter detects the thickness of the glass substrate in real time and uploads the detection data to the host computer; The host computer calculates the grinding thickness T of the surface grinding process based on the received detection data. pm ; When the surface grinding time t is known, according to RR=T pm / tCalculate the surface grinding rate RR; The planning method of the sampling point of the laser coaxial displacement meter is as follows: Divide the substrate glass into m partitions evenly along the short side and n partitions evenly along the long side of the glass. Measure the glass thickness at the center of each block. The number of sampling points is m. n points, and the average value is taken after multi-point measurement to obtain the grinding thickness T of the surface grinding process pm After dividing the areas, define the ID for each area on the host computer, and then complete the planning of the data calculation model.

2. The method for detecting the grinding thickness of a surface grinding process by online non-destructive measurement according to claim 1 is characterized in that: M coaxial thickness measuring probes are evenly distributed in a direction perpendicular to the glass flow direction, and a connecting line formed by the multiple coaxial thickness measuring probes is parallel to the glass substrate.

3. The method for detecting the grinding thickness of a surface grinding process by online non-destructive measurement according to claim 2, characterized in that: m=7,n=21.

4. The method for detecting the grinding thickness of a surface grinding process by online non-destructive measurement according to claim 3 is characterized in that: The measurement sampling points for thickness measurement before surface grinding and thickness measurement after surface grinding overlap.

5. The method for detecting the grinding thickness of a surface grinding process by online non-destructive measurement according to claim 4 is characterized in that: The laser coaxial displacement meter includes a laser coaxial displacement meter before surface grinding and a laser coaxial displacement meter after surface grinding.

6. The method for detecting the grinding thickness of a surface grinding process by online non-destructive measurement according to claim 5, characterized in that: The light source of the thickness measuring probe of the laser coaxial displacement meter is a multi-color light source.

Images