Adjusting device and method of controlling the adjusting device

Abstract

The present disclosure relates to a conditioning device including an eductor for ejecting steam onto a rotating polishing pad, and an eductor support supporting the eductor. The eductor includes a plurality of nozzles for ejecting the steam toward the polishing pad, and a nozzle heater for heating the plurality of nozzles. The nozzle heater heats nozzles of the plurality of nozzles corresponding to a peripheral region of the polishing pad to a higher temperature than nozzles of the plurality of nozzles corresponding to a central region of the polishing pad.

Description

Adjustment device and method for controlling the adjustment device Technical Field

[0001] This disclosure relates to an adjusting device and a method for controlling the adjusting device. Background Technology

[0002] Recently, with the miniaturization of individual semiconductor chips, the increase in chip integration, and the refinement of circuit patterns formed on chips, the importance of chemical mechanical polishing (CMP) processes is increasing.

[0003] In the CMP process, a polishing slurry is supplied to a rotating polishing pad. As the pad rotates, the slurry is evenly distributed across its surface. When the surface of the rotating polishing pad, coated with the slurry, comes into contact with the surface of the rotating object to be polished (substrate, semiconductor device, circuit pattern, etc.), the object's surface is polished. The object's surface undergoes chemical polishing via the slurry. Additionally, the rotating object's surface undergoes mechanical polishing through physical contact with the surface of the rotating polishing pad.

[0004] The CMP process is a process of smoothing the surface of an object to be polished, or removing accumulated substances, scratches, and contaminants from the surface. In the CMP process, a polishing pad is used to polish the surface of the object. The polishing pad used in the CMP process is a process component that uses friction to process the surface of the object to be polished to the desired level, and is one of the factors determining the uniformity of the thickness, flatness, and quality of the polished surface.

[0005] When the CMP process is repeated, the polishing performance of the polishing pads deteriorates due to wear. Polishing pads with deteriorated performance need to be replaced with new ones, while the old ones are discarded. Therefore, the replacement cost of polishing pads is incurred regularly because they are discarded instead of reused, and the environmental pollution caused by discarded polishing pads is also aggravated.

[0006] Therefore, there is a growing need for a device that can repair and reuse polishing pads whose polishing performance has deteriorated, and minimize the waste of polishing pads due to their reuse. Summary of the Invention

[0007] In view of the above, one embodiment of this disclosure provides an adjustment device capable of restoring a polishing pad with degraded polishing performance to a reusable state.

[0008] Furthermore, one embodiment of this disclosure provides an adjustment device that can increase the lifespan of a polishing pad to minimize the waste of the polishing pad.

[0009] According to a first aspect of this disclosure, an adjustment device is provided, comprising: an injector for injecting steam onto a rotating polishing pad; and an injector support for supporting the injector, wherein the injector includes a plurality of nozzles for injecting the steam onto the polishing pad and a nozzle heater for heating the plurality of nozzles, and the nozzle heater heats a nozzle of the plurality of nozzles corresponding to a peripheral region of the polishing pad to a higher temperature than a nozzle of the plurality of nozzles corresponding to a central region of the polishing pad.

[0010] The regulating device may further include: a sensor for measuring the temperature of the polishing pad; and a controller for controlling the injector based on the measurement result of the sensor, wherein the peripheral region is disposed outside the central region in the radial direction of the polishing pad to surround the central region, and the regulating device calculates the difference between the central temperature and the peripheral temperature, and when the difference is greater than a preset set value, controls the nozzle heater so that the nozzle corresponding to the peripheral region among the plurality of nozzles is heated to a higher temperature than the nozzle corresponding to the central region among the plurality of nozzles, wherein the central temperature is the temperature of the central region, and the peripheral temperature is the temperature of the peripheral region.

[0011] The peripheral region may include: an inner peripheral region surrounding the central region; and an outer peripheral region disposed outside the inner peripheral region in the radial direction to surround the inner peripheral region. The controller calculates a first difference and a second difference, where the first difference is the difference between the central temperature and a first peripheral temperature, the first peripheral temperature being the temperature of the inner peripheral region; the second difference is the difference between the central temperature and a second peripheral temperature, the second peripheral temperature being the temperature of the outer peripheral region. When the first difference is less than a set value and the second difference is greater than the set value, the controller controls the nozzle heater to heat the nozzle corresponding to the inner peripheral region among the plurality of nozzles to a higher temperature than the nozzle corresponding to the outer peripheral region among the plurality of nozzles.

[0012] When the difference is greater than the set value, the controller can determine the heating time corresponding to the difference, and within the determined heating time, control the nozzle heater so that the nozzle corresponding to the peripheral region among the plurality of nozzles is heated to a higher temperature than the nozzle corresponding to the central region among the plurality of nozzles.

[0013] The plurality of nozzles are spaced apart in the radial direction of the polishing pad, and a steam chamber for containing the steam may be formed in the ejector, and the steam chamber may extend in the radial direction and communicate with the plurality of nozzles.

[0014] The regulating device may further include: a steam chamber heater for heating the steam chamber to prevent the steam contained in the steam chamber from condensing.

[0015] The steam chamber may be located above the plurality of nozzles.

[0016] The adjustment device may further include: a driver, including a vertical driver, for moving the injector support in the up-down direction to adjust the vertical separation distance between the polishing pad and the injector.

[0017] The adjusting device may further include: a controller for controlling the driver, wherein the controller calculates the jet pattern angle of the steam based on the jet pressure of the steam ejected from the plurality of nozzles, determines a target separation distance based on the calculated jet pattern angle, and controls the vertical driver to make the vertical separation distance between the plurality of nozzles and the upper surface of the polishing pad reach the target separation distance.

[0018] The ejector may extend in the radial direction of the polishing pad, and the driver may further include a linear driver that moves the ejector in the radial direction relative to the polishing pad.

[0019] According to a second aspect of this disclosure, a method for controlling an adjustment device is provided, comprising the steps of: injecting steam onto a rotating polishing pad through a plurality of nozzles; and heating the plurality of nozzles such that a nozzle corresponding to a peripheral region of the polishing pad is heated to a higher temperature than a nozzle corresponding to a central region of the polishing pad.

[0020] The method may further include: measuring the temperature of the polishing pad; and calculating the difference between the center temperature and the peripheral temperature, wherein the center temperature is the temperature of the central region and the peripheral temperature is the temperature of the peripheral region, wherein, in the step of heating the plurality of nozzles, when the difference is greater than a preset set value, the nozzle corresponding to the peripheral region of the polishing pad is heated to a higher temperature than the nozzle corresponding to the central region, and the peripheral region is disposed outside the central region in the radial direction of the polishing pad to surround the central region.

[0021] The peripheral region may include: an inner peripheral region surrounding the central region, and an outer peripheral region disposed outside the inner peripheral region in the radial direction to surround the inner peripheral region. The step of measuring the temperature of the polishing pad includes the following steps: measuring the central temperature; measuring a first peripheral temperature, the first peripheral temperature being the temperature of the inner peripheral region; and measuring a second peripheral temperature, the second peripheral temperature being the temperature of the outer peripheral region. The calculation of the difference includes the following steps: calculating a first difference, the first difference being the difference between the central temperature and the first peripheral temperature; and calculating a second difference, the second difference being the difference between the central temperature and the second peripheral temperature. Heating the plurality of nozzles includes: when the first difference is less than a set value and the second difference is greater than the set value, the nozzle corresponding to the inner peripheral region among the plurality of nozzles is heated to a higher temperature than the nozzle adjacent to the outer peripheral region among the plurality of nozzles.

[0022] The method may further include: when the difference is greater than the set value, determining a heating time corresponding to the difference, wherein the heating of the plurality of nozzles is performed within the determined heating time.

[0023] A polishing pad with reduced polishing performance can be repaired and reused using an adjustment device according to an embodiment of the present disclosure.

[0024] Furthermore, the lifespan of the polishing pad can be increased by using the adjustment device according to an embodiment of the present disclosure, thereby minimizing the waste of the polishing pad. Attached Figure Description

[0025] Figure 1 is a side view of an adjustment device according to an embodiment of the present disclosure;

[0026] Figure 2 is a plan view of an adjustment device according to an embodiment of the present disclosure;

[0027] Figure 3 is a longitudinal cross-sectional view taken along line III-III in Figure 2;

[0028] Figure 4 is a plan view showing the state of the injector moving radially along the polishing pad according to an embodiment of the present disclosure;

[0029] Figure 5 is a plan view showing the rotation state of the injector bracket according to an embodiment of the present disclosure;

[0030] Figure 6 is a flowchart schematically illustrating a control method of an adjustment device according to an embodiment of the present disclosure. Detailed Implementation

[0031] The specific embodiments for implementing the technical concept of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] In the description of this invention, detailed descriptions of known configurations or functions will be omitted if it is determined that such detailed descriptions may obscure the main points of the invention.

[0033] Furthermore, when a component is referred to as being "connected" to, "placed" on, or "supported" by another component, it can be understood that the component can be directly connected to, placed on, or supported by another component, but there may also be other components in between.

[0034] The terminology used herein is for illustrative purposes only and is not intended to limit the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions.

[0035] Various elements may be described using terms including ordinal numbers such as 1, 2, etc., but the corresponding elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0036] It is understood that the terms such as “comprising” as used in this specification are intended to indicate the presence of a particular feature, region, integer, step, operation, element, composition and / or combination thereof disclosed in the specification, and not to exclude the presence or additional possibility of one or more other particular features, regions, integers, steps, operations, elements, compositions and / or combinations thereof.

[0037] Furthermore, it should be noted in advance that the expressions such as "above," "below," and "upper surface" are based on the accompanying drawings, but other expressions may appear if the orientation of the corresponding object changes. Additionally, in this specification, "inward" and "outward" directions can be the right and left directions in Figures 2 and 3, respectively. Furthermore, a direction in this specification can be understood as including the radial direction of the polishing pad. The radial direction includes both inward and outward radial directions; the inward radial direction can be defined as a direction parallel to the horizontal direction and close to the center of the polishing pad P. Furthermore, the outward radial direction can be defined as the opposite direction to the inward radial direction.

[0038] The specific configuration of the adjustment device 1 according to an embodiment of the present disclosure will now be described with reference to the accompanying drawings.

[0039] CMP equipment may include a substrate carrier, a slurry supply device, and a conditioning device 1. A semiconductor substrate may be mounted on the substrate carrier. The substrate carrier is capable of rotating the mounted substrate. The surface of the substrate mounted on the substrate carrier can be polished when it comes into contact with the edge portion of the polishing surface of a polishing pad P. For example, the substrate carrier can press the substrate in contact with the polishing surface onto the polishing pad P while rotating the substrate. When the substrate is polished, the slurry supply device can supply polishing slurry to the polishing surface of the rotating polishing pad P. Thus, the CMP equipment can perform a CMP process involving mechanical polishing of the substrate by the substrate carrier and chemical polishing of the substrate by the slurry supply device.

[0040] Referring to Figures 1 and 2, the adjusting device 1 can restore the polishing pad P after a predetermined time or longer of CMP process. The material of the polishing pad P may include polyurethane. The polyurethane included in the polishing pad P can deform under pressure applied by the polishing object and can return to its original shape when heated. In other words, the polishing pad P has self-healing ability through heating. The polishing pad P may have a cylindrical shape with predetermined radii Rc, Rm, and Re. The adjusting device 1 can inject steam onto the upper surface of the polishing pad P. The adjusting device 1 may include an injector 100, a steam supply unit 200, an injector support 300, a pad support 400, an actuator 500, a sensor 600, and a controller 700.

[0041] Referring further to Figure 3, the ejector 100 can receive steam from the steam supply unit 200 and eject the supplied steam onto the upper surface of the polishing pad P. The lower end of the ejector 100 can face the upper surface of the polishing pad P placed on the pad support 400. The ejector 100 can extend in the radial direction.

[0042] The inner end of the ejector 100 can be positioned facing the center of the pad support 400. Furthermore, the outer end of the ejector 100 can be connected to the ejector support 300. The outer end of the ejector 100 can refer to the end opposite to the inner end of the ejector 100. A steam chamber 100a can be formed in the ejector 100. Additionally, the ejector 100 may include a nozzle 110, a heater 120, and a frame 130.

[0043] Steam chamber 100a can receive steam supplied from steam supply unit 200. Steam chamber 100a can extend in a radial direction. Steam chamber 100a can be an elongated orifice with a closed inner end in a horizontal direction. For example, the inner end of steam chamber 100a can be closed, and its outer end can be open to provide a steam inlet through which steam supplied from steam supply unit 200 can be introduced.

[0044] The steam chamber 100a can communicate with multiple nozzles, described later. Furthermore, the steam chamber 100a can be positioned above the multiple nozzles. For example, steam received in the steam chamber 100a can flow to multiple nozzles. Through the steam chamber 100a, the variation in steam pressure supplied to each of the multiple nozzles can be minimized. In other words, steam supplied from the steam supply unit 200 fills the steam chamber 100a until the pressure in the steam chamber 100a reaches equilibrium with atmospheric pressure. After the steam pressure reaches equilibrium with atmospheric pressure, the steam can be sprayed onto the polishing pad P through the multiple nozzles.

[0045] Nozzle 110 can spray steam received in steam chamber 100a onto polishing pad P. The temperature of the steam sprayed from nozzle 110 can be, for example, 55°C to 70°C. The lower part of nozzle 110 can have a tapered shape with its width widening downwards. Injector 100 may include multiple nozzles 110.

[0046] Multiple nozzles 110 may be radially spaced. Multiple nozzles 110 may communicate with the steam chamber 100a. Furthermore, multiple nozzles 110 may be disposed below the steam chamber 100a. Multiple nozzles 110 may include a central nozzle portion 111, an intermediate nozzle portion 112, and an edge nozzle portion 113.

[0047] The central nozzle portion 111 may correspond to the central region Pc of the polishing pad. For example, the central nozzle portion 111 may face the upper surface of the central region Pc. The central nozzle portion 111 may spray steam onto the upper surface of the central region Pc of the polishing pad placed on the pad support 400. The central region Pc may refer to the "center portion of the pad". For example, the central region Pc may be cylindrical, with a radius of 1 / 3 of the radius (Rc+Rm+Re) of the polishing pad P. The central region Pc may be surrounded by the peripheral regions Pm and Pe of the polishing pad. The peripheral regions Pm and Pe may be disposed radially outside the central region Pc. The peripheral regions Pm and Pe may include an inner peripheral region Pm and an outer peripheral region Pe. Furthermore, the central nozzle portion 111 may be further disposed inside the intermediate nozzle portion 112.

[0048] The intermediate nozzle portion 112 may correspond to the inner peripheral region Pm. For example, the intermediate nozzle portion 112 may face the upper surface of the inner peripheral region Pm. The intermediate nozzle portion 112 may inject steam onto the upper surface of the inner peripheral region Pm of the polishing pad P placed on the pad support 400. The inner peripheral region Pm may refer to the "middle portion of the pad". The inner peripheral region Pm may have a hollow cylindrical shape. For example, the radius of the inner peripheral surface of the inner peripheral region Pm may be the radius of the outer peripheral surface of the central region Pc. The inner peripheral region Pm may surround the central region Pc. For example, the inner peripheral region Pm may be disposed outside the central region Pc in the radial direction.

[0049] Furthermore, the outer peripheral surface of the inner peripheral region Pm can be annular, with a radius equal to the radius of the inner circumferential surface of the outer peripheral region Pe of the polishing pad P (described later). In the radial direction of the polishing pad P, the distance between the inner and outer peripheral surfaces of the inner peripheral region Pm can be, for example, 1 / 3 of the radius of the polishing pad P (Rc+Rm+Re). Furthermore, the inner peripheral region Pm can be positioned between the central region Pc and the outer peripheral region Pe of the polishing pad P. Additionally, the intermediate nozzle portion 112 can be positioned between the central nozzle portion 111 and the edge nozzle portion 113. For example, the intermediate nozzle portion 112 can be further positioned inside the edge nozzle portion 113.

[0050] The edge nozzle portion 113 may correspond to the outer peripheral region Pe. For example, the edge nozzle portion 113 may face the upper surface of the outer peripheral region Pe. The edge nozzle portion 113 may inject steam onto the upper surface of the outer peripheral region Pe of the polishing pad P placed on the pad support 400. The outer peripheral region Pe of the polishing pad P may refer to the "pad edge portion". The edge nozzle portion 113 may include multiple nozzles. The outer peripheral region Pe may have a hollow cylindrical shape. For example, the radius of the inner peripheral surface of the outer peripheral region Pe may be the radius of the outer peripheral surface of the inner peripheral region Pm. Furthermore, the radius of the outer peripheral surface of the outer peripheral region Pe may be the radius of the polishing pad P. In the radial direction of the polishing pad P, the distance between the inner and outer peripheral surfaces of the outer peripheral region Pe may be, for example, 1 / 3 of the radius (Rc+Rm+Re) of the polishing pad P.

[0051] Heater 120 may include nozzle heater 121 and steam chamber heater 122. Nozzle heater 121 may heat some or all of the plurality of nozzles 110. For example, nozzle heater 121 may increase the temperature of steam passing through the plurality of nozzles 110. Nozzle heater 121 may independently heat each of the plurality of nozzles 110. In other words, nozzle heater 121 may be controlled by controller 700 so that the plurality of nozzles 110 eject steam at different temperatures. For example, multiple nozzle heaters 121 independently controlled by controller 700 may be provided. However, this is merely an example; a single nozzle heater 121 may be provided to independently heat multiple nozzles 110. Nozzle heater 121 may be controlled by controller 700.

[0052] The steam chamber heater 122 heats the steam contained in the steam chamber 100a. Condensation of the steam contained in the steam chamber 100a is prevented by the steam chamber heater 122. The steam chamber heater 122 can be positioned above the steam chamber 100a. Because the steam chamber heater 122 is positioned above the steam chamber 100a, multiple nozzles are prevented from being heated by the steam chamber heater 122. The frame 130 supports the nozzle 110 and the heater 120. The frame 130 shapes the appearance of the injector 100.

[0053] Steam supply unit 200 can supply steam to steam chamber 100a. The steam supplied by steam supply unit 200 to steam chamber 100a can be, for example, water vapor. The temperature of the steam supplied by steam supply unit 200 to steam chamber 100a can be, for example, 70°C to 110°C.

[0054] The ejector holder 300 can support the ejector 100. A polishing pad P can be placed on the upper surface of the pad holder 400, and the polishing pad P can be supported thereon. The pad holder 400 can fix the position of the polishing pad P, placing it in a predetermined position. For example, the center position of the polishing pad P placed on the pad holder 400 can be fixed. With the polishing pad P supported on the pad holder 400, the pad holder 400 can rotate together with the polishing pad P about a pad rotation axis extending vertically. For example, the ejector 100 can inject steam onto the upper surface of the polishing pad P while the pad holder 400 is rotating.

[0055] Furthermore, the ideas in this disclosure are not necessarily limited to the above-described contents; the pad support 400 may be a component separate from the adjustment device 1. In other words, the pad support 400 may be included in the CMP equipment, but may not be included in the adjustment device 1.

[0056] The actuator 500 can be controlled by the controller 700. The actuator 500 may include a vertical actuator 510, a linear actuator 520, a rotary actuator 530, and a pad actuator 540. The vertical actuator 510 can adjust the vertical separation distance between the polishing pad P and the ejector 100, which are positioned at a predetermined location. The vertical actuator 510 can move the ejector holder 300 in the vertical direction relative to the pad holder 400. For example, the vertical actuator 510 can be an actuator.

[0057] Referring further to Figure 4, the linear actuator 520 can move the injector 100 relative to the injector support 300 in the radial direction. In other words, the linear actuator 520 can move the injector 100 linearly relative to the injector support 300. Furthermore, although not shown in the figures, a guide protrusion can be formed on one of the injector 100 and the injector support 300, and a guide groove engaging with the guide protrusion can be formed on the other. As a more specific example, an upwardly projecting guide protrusion can be formed at the upper end of the injector 100, and an upwardly recessed guide groove extending in the radial direction can be formed at the lower end of the injector support 300. The guide protrusion of the injector 100 can move radially along the guide groove 320 while engaging with the guide groove of the injector support 300. For example, the linear actuator 520 can be an actuator.

[0058] Referring further to Figure 5, the rotary driver 530 can rotate the injector holder 300 about an injector rotation axis extending in the vertical direction. For example, when the rotary driver 530 rotates the injector holder 300, the inner end of the injector 100 can reciprocate between the outer and inner sides of the polishing pad P while facing the upper surface of the polishing pad P. For example, the rotary driver 530 may include a motor and a shaft rotated by the motor.

[0059] The pad driver 540 can rotate the pad holder 400 about a pad rotation axis extending in the vertical direction. The pad rotation axis can be spaced apart from the ejector rotation axis. For example, when the polishing pad P is placed on the pad holder 400, the pad driver 540 rotates the pad holder 400, causing the polishing pad P to rotate together with the pad holder 400. For example, the pad driver 540 may include a motor and a shaft rotated by the motor.

[0060] Sensor 600 can measure the temperature of the polishing pad P. Sensor 600 may include multiple sensors 600. The multiple sensors 600 can respectively measure the temperature of the central region Pc, the inner peripheral region Pm, and the outer peripheral region Pe. The temperatures of the central region Pc, the inner peripheral region Pm, and the outer peripheral region Pe can be referred to as the center temperature, the first peripheral temperature, and the second peripheral temperature, respectively. Further, for example, the multiple sensors 600 can be disposed in the injector 100. For example, some of the multiple sensors 600 can be disposed in the central nozzle section 111, another portion in the intermediate nozzle section 112, and still others in the edge nozzle section 113.

[0061] The controller 700 can control the injector 100 based on the measurement results of the sensor 600. The controller 700 can calculate the difference between the center temperature (i.e., the temperature of the central region Pc) and the peripheral temperature (i.e., the temperature of the peripheral regions Pm and Pe of the polishing pad). The center temperature and peripheral temperature can be the average temperature of the central region Pc and the average temperature of the peripheral regions Pm and Pe of the polishing pad, respectively. The average temperature can be defined as the sum of the temperatures of multiple unit areas on the upper surface of the polishing pad P, divided by the number of unit areas.

[0062] For example, the controller 700 can calculate a first difference and a second difference, where the first difference is the temperature difference between the central region Pc and the inner peripheral region Pm, and the second difference is the temperature difference between the central region Pc and the outer peripheral region Pe. The controller 700 can compare a predetermined setpoint with the first and second differences. For example, when the first difference is greater than the setpoint, the controller 700 can control the nozzle heater 121 to heat the intermediate nozzle section 112 and the edge nozzle section 113 to a higher temperature than the central nozzle section 111.

[0063] Furthermore, when the first difference is less than the set value and the second difference is greater than the set value, the controller 700 can control the nozzle heater 121 to heat the edge nozzle section 113 to a higher temperature than the center nozzle section 111 and the middle nozzle section 112.

[0064] When the difference is greater than a set value, the controller 700 can determine the heating time corresponding to the difference. For example, when the difference is greater than the set value, the heating time determined by the controller 700 can become longer as the difference increases.

[0065] Referring again to Figure 3, the controller 700 can calculate the steam injection pattern angle based on the injection pressure of the steam ejected from the multiple nozzles 110. The injection pattern angle can be defined as the angle by which the injection pattern formed by a set of steam particles ejected from the nozzles 110 expands. For example, the injection pattern angle can be defined as the angle between a virtual straight line passing through the center of the nozzles 110 and a straight line passing through the outer peripheral surface of the injection pattern. The injection pattern angle can increase with increasing injection pressure of the steam ejected from the nozzles 110.

[0066] The controller 700 can determine the target separation distance based on the calculated jet pattern angle. The target separation distance can be defined as the separation distance between the nozzle 110 and the upper surface of the polishing pad P when the intersection of the first straight line L1 and the second straight line L2 is located at a predetermined position below the upper surface of the polishing pad P. The first straight line L1 can be defined as an imaginary straight line passing through the inner outer peripheral surface of the jet pattern formed by the steam ejected from the first nozzle. The second straight line L2 can be defined as an imaginary straight line passing through the outer outer peripheral surface of the jet pattern formed by the steam ejected from the second nozzle.

[0067] The first nozzle and the second nozzle can refer to any two nozzles adjacent to each other among the plurality of nozzles 110. The first nozzle can be arranged radially outward relative to the second nozzle. Furthermore, the first straight line L1 can be defined as an imaginary straight line passing through the inner slope of the first nozzle in a longitudinal cross-sectional view of the injector 100 cut along the vertical direction (see Figure 3). Furthermore, the second straight line L2 can be defined as an imaginary straight line passing through the outer slope of the second nozzle in a longitudinal cross-sectional view of the injector 100 cut along the vertical direction (see Figure 3).

[0068] The controller 700 can control the vertical drive 510 based on a determined target separation distance. For example, the controller 700 can control the vertical drive 510 so that the distance between the plurality of nozzles 110 and the upper surface of the polishing pad P reaches the target separation distance.

[0069] Therefore, since the controller 700 controls the vertical driver 510 so that the intersection of the first straight line L1 and the second straight line L2 is located below the upper surface of the polishing pad P, it can prevent the steam ejected from two adjacent nozzles among the multiple nozzles from colliding with each other and being condensed.

[0070] The controller 700 can be implemented by a computing device including a microprocessor, and since the implementation method is obvious to those skilled in the art, further detailed description thereof will be omitted.

[0071] The operation and effects of the adjustment device 1 according to an embodiment of the present disclosure will now be described.

[0072] The polishing pad P, placed on the pad support 400 of the adjusting device 1, can be positioned at a predetermined location. The polishing pad P can be rotated around the pad rotation axis by the pad driver 540, while the center of the polishing pad P is fixed. When the polishing pad P rotates, the injector 100 located above the polishing pad P can spray steam onto the upper surface of the polishing pad P.

[0073] Steam supplied from the steam supply unit 200 can be contained in the steam chamber 100a of the ejector 100. Steam can be filled into the steam chamber 100a until the pressure in the steam chamber 100a reaches equilibrium with atmospheric pressure. Due to the upward flow characteristic of the steam introduced into the steam chamber 100a, steam is prevented from flowing to the multiple nozzles located below the steam chamber 100a until the steam chamber 100a is in equilibrium. Then, when the pressure in the steam chamber 100a is greater than atmospheric pressure, steam can flow to the multiple nozzles. The pressure of the steam flowing to the multiple nozzles can be uniform. Through the steam chamber 100a, it is possible to achieve the effect of directly supplying steam with uniform pressure to the multiple nozzles without requiring multiple steam supply units to supply steam to each of the multiple nozzles.

[0074] Since the steam chamber 100a is heated by the steam chamber heater 122, condensation of the steam contained in the steam chamber 100a can be prevented. Furthermore, multiple nozzles can receive steam from the steam chamber 100a and spray the steam onto the polishing pad P. The controller 700 can control the vertical drive 510 so that the steam ejected from two adjacent nozzles among the multiple nozzles does not come into contact with each other. As described above, since the steam ejected from two adjacent nozzles among the multiple nozzles does not come into contact with each other, condensation of the steam is prevented when the steam is ejected from the nozzles.

[0075] Furthermore, as the polishing pad P rotates, the area of ​​the polishing pad P exposed to external air (e.g., the air in the work area) per unit time can increase radially outward. Therefore, as the polishing pad P rotates, its cooling area can increase radially outward. For example, if the process of injecting steam into the rotating polishing pad P continues for a predetermined time, the average temperature of the central region Pc, the inner peripheral region Pm, and the outer peripheral region Pe can decrease sequentially.

[0076] The controller 700 of the regulating device 1 can control the nozzle heater 121 so that the heating temperature of at least one of the center nozzle section 111, the middle nozzle section 112 and the edge nozzle section 113 is different from the others, so as to reduce the deviation of the average temperature between different areas of the polishing pad P.

[0077] The adjusting device 1 compares the average temperature of different areas of the polishing pad P and adjusts the temperature of at least one of the central nozzle section 111, the middle nozzle section 112 and the edge nozzle section 113 that is heated, thereby reducing the deviation of the average temperature of the polishing pad P.

[0078] Hereinafter, with reference to FIG6, a method S10 for controlling and adjusting the device according to an embodiment of the present disclosure will be described. In describing the method S10 for controlling and adjusting the device, the same parts as those in the description of the controller 700 and the reference numerals are referred to above.

[0079] The method S10 for controlling the regulating device includes an injection step S100, a temperature measurement step S200, a difference calculation step S300, a comparison step S400, a heating time determination step S500, and a nozzle heating step S600.

[0080] In the spraying step S100, steam can be sprayed onto the polishing pad P through multiple nozzles. The spraying step S100 can be performed while the polishing pad P is rotating around the pad rotation axis, in which case the polishing pad is placed in a predetermined position.

[0081] In temperature measurement step S200, the temperature of the polishing pad P can be measured. Temperature measurement step S200 may include a center temperature measurement step S210 and a peripheral temperature measurement step S220. In center temperature measurement step S210, the center temperature can be measured. Peripheral temperature measurement step S220 may include a first peripheral temperature measurement step S221 and a second peripheral temperature measurement step S222.

[0082] In the first peripheral temperature measurement step S221, the first peripheral temperature of the polishing pad can be measured. Furthermore, in the second peripheral temperature measurement step S222, the second peripheral temperature of the polishing pad can be measured. The center temperature measurement step S210, the first peripheral temperature measurement step S221, and the second peripheral temperature measurement step S222 can be performed simultaneously or at different times.

[0083] In the difference calculation step S300, the difference between the center temperature and the outer perimeter temperature can be calculated. The difference calculation step S300 may include a first difference calculation step S310 and a second difference calculation step S320. In the first difference calculation step S310, a first difference can be calculated, which is the difference between the center temperature and the first outer perimeter temperature. In the second difference calculation step S320, a second difference can be calculated, which is the difference between the center temperature and the second outer perimeter temperature.

[0084] In comparison step S400, a set value and a difference can be compared. For example, in comparison step S400, the magnitude relationship between a first difference and a set value can be compared, or the magnitude relationship between a second difference and a set value can be compared.

[0085] In the heating time determination step S500, when the difference is greater than a set value, a pre-input heating time corresponding to the difference can be determined. In the nozzle heating step S600, multiple nozzles can be heated to different temperatures based on the comparison result in the comparison step S400. In the nozzle heating step S600, when the difference is greater than a set value, the middle nozzle portion 112 and the edge nozzle portion 113 can be heated to a higher temperature than the center nozzle portion 111. Furthermore, in the nozzle heating step S600, when the first difference is less than a set value and the second difference is greater than a set value, the edge nozzle portion 113 can be heated to a higher temperature than the middle nozzle portion 112. The nozzle heating step S600 can be performed for the heating time determined in the heating time determination step S500.

[0086] The embodiments of this disclosure have been described as specific examples as described above, but these are merely examples, and the scope of this disclosure is not limited thereto. It should be understood that the technical concepts set forth in this specification have the broadest possible application. Those skilled in the art can combine / replace the disclosed embodiments to achieve patterns of shapes not disclosed, but this does not depart from the scope of this disclosure. Furthermore, those skilled in the art can readily modify or alter the disclosed embodiments according to this specification, and such modifications or alterations obviously also fall within the scope of this disclosure.

Claims

1. An adjusting device, characterized in that, include: An injector is used to spray steam onto a rotating polishing pad; Injector bracket, supporting the injector; A sensor is used to measure the temperature of the polishing pad; The controller controls the injector based on the measurement results of the sensor. The injector includes a plurality of nozzles for injecting steam into the polishing pad and a nozzle heater for heating the nozzles. The nozzle heater heats the nozzles corresponding to the peripheral region of the polishing pad to a higher temperature than the nozzles corresponding to the central region of the polishing pad. The peripheral region is located radially outside the central region of the polishing pad, surrounding the central region. The controller calculates the difference between the central temperature and the peripheral temperature. When the difference is greater than a preset value, the controller controls the nozzle heater to heat the nozzles corresponding to the peripheral region to a higher temperature than the nozzles corresponding to the central region. The temperature of the central region is defined as the temperature of the outer perimeter region, and the outer perimeter region includes: an inner peripheral region surrounding the central region; and an outer peripheral region disposed outside the inner peripheral region in the radial direction to surround the inner peripheral region. The controller calculates a first difference and a second difference, where the first difference is the difference between the central temperature and the first outer perimeter temperature, and the first outer perimeter temperature is the temperature of the inner peripheral region. The second difference is the difference between the central temperature and the second outer perimeter temperature, and the second outer perimeter temperature is the temperature of the outer peripheral region. When the first difference is less than a set value and the second difference is greater than the set value, the controller controls the nozzle heater to heat the nozzle corresponding to the inner peripheral region among the plurality of nozzles to a higher temperature than the nozzle corresponding to the outer peripheral region among the plurality of nozzles.

2. The adjusting device as described in claim 1, characterized in that, When the difference is greater than the set value, the controller determines the heating time corresponding to the difference, and within the determined heating time, controls the nozzle heater so that the nozzle corresponding to the peripheral region among the plurality of nozzles is heated to a higher temperature than the nozzle corresponding to the central region among the plurality of nozzles.

3. The adjusting device as described in claim 1, characterized in that, The plurality of nozzles are spaced apart in the radial direction of the polishing pad, and a steam chamber for containing the steam is formed in the ejector, and the steam chamber extends in the radial direction and communicates with the plurality of nozzles.

4. The adjusting device as described in claim 3, characterized in that, Also includes: A steam chamber heater is used to heat the steam chamber to prevent the steam contained in the steam chamber from condensing.

5. The adjusting device as described in claim 3, characterized in that, The steam chamber is located above the plurality of nozzles.

6. The adjusting device as described in claim 1, characterized in that, Also includes: A driver, including a vertical driver, is used to move the ejector holder in the up-down direction to adjust the vertical separation distance between the polishing pad and the ejector.

7. The adjusting device as described in claim 6, characterized in that, Also includes: A controller is used to control the driver, wherein the controller calculates the jet pattern angle of the steam based on the jet pressure of the steam ejected from the plurality of nozzles, determines a target separation distance based on the calculated jet pattern angle, and controls the vertical driver to make the vertical separation distance between the plurality of nozzles and the upper surface of the polishing pad reach the target separation distance.

8. The adjusting device as described in claim 6, characterized in that, The ejector extends in the radial direction of the polishing pad, and the driver further includes a linear driver that moves the ejector in the radial direction relative to the polishing pad.

9. A method for controlling and adjusting a device, characterized in that, The method controls the regulating device as described in any one of claims 1 to 8, comprising the following steps: injecting steam onto a rotating polishing pad through a plurality of nozzles; heating the plurality of nozzles such that the nozzles corresponding to the peripheral region of the polishing pad are heated to a higher temperature than the nozzles corresponding to the central region of the polishing pad; measuring the temperature of the polishing pad; and calculating the difference between the central temperature and the peripheral temperature, wherein the central temperature is the temperature of the central region and the peripheral temperature is the temperature of the peripheral region, wherein, in the step of heating the plurality of nozzles, when the difference is greater than a preset set value, the nozzle corresponding to the peripheral region of the polishing pad is heated to a higher temperature than the nozzle corresponding to the central region, and the peripheral region is disposed outside the central region in the radial direction of the polishing pad to surround the central region, the peripheral region comprising: an inner circumference A region, surrounding the central region and an outer peripheral region, is disposed radially outside the inner peripheral region to surround the inner peripheral region, wherein the step of measuring the temperature of the polishing pad includes the following steps: measuring the central temperature; measuring a first peripheral temperature, the first peripheral temperature being the temperature of the inner peripheral region; and measuring a second peripheral temperature, the second peripheral temperature being the temperature of the outer peripheral region, wherein the calculation of the difference includes the following steps: calculating a first difference, the first difference being the difference between the central temperature and the first peripheral temperature; and calculating a second difference, the second difference being the difference between the central temperature and the second peripheral temperature, wherein heating the plurality of nozzles includes: when the first difference is less than a set value and the second difference is greater than the set value, the nozzle corresponding to the inner peripheral region among the plurality of nozzles is heated to a higher temperature than the nozzle adjacent to the outer peripheral region among the plurality of nozzles.

10. The method for controlling and adjusting the device as described in claim 9, characterized in that, It also includes the following steps: When the difference is greater than the set value, a heating time corresponding to the difference is determined, wherein the heating of the plurality of nozzles is performed within the determined heating time.

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