Single tube blue light semiconductor laser external cavity device

Abstract

The application discloses a single-tube blue light semiconductor laser external cavity device and relates to the technical field of semiconductor lasers.The single-tube blue light semiconductor laser external cavity device comprises an emitter, a heat sinking assembly and an optical assembly, the bottom of the emitter is fixedly connected with the top of the heat sinking assembly; the single-tube blue light semiconductor laser is provided with a copper sleeve and the heat sinking assembly; in the process of air extraction, the connecting pipe can convey the air in the internal of the negative pressure fan into the internal of the conveying pipe, then the air is conveyed into the internal of the heat absorbing pipe through the conveying pipe; because the flow cavity in the internal of the heat absorbing pipe is twice as much as the absorbing port, the absorbing port can generate negative pressure in the process that the air flows in the internal of the heat absorbing pipe at high speed; when the heat is deposited in the internal of the bottom heat exchange plate and is conveyed into the internal of the absorbing port through the sleeve cavity, the external air can be conveyed into the internal of the bottom heat exchange plate in the process that the absorbing port generates negative pressure; with the air cold and heat exchange, the heat sinking efficiency can be accelerated.

Description

Technical Field

[0001] This invention relates to the field of conductor laser technology, specifically to an external cavity device for a single-tube blue semiconductor laser. Background Technology

[0002] Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as their active medium. Due to differences in material structure, the specific processes by which different types of materials generate laser light vary. Commonly used active media include gallium arsenide (GaAs), cadmium sulfide (CdS), indium phosphide (InP), and zinc sulfide (ZnS). Excitation methods include electrical injection, electron beam excitation, and optical pumping. Semiconductor laser devices can be classified into several types, such as homojunction, single heterojunction, and double heterojunction lasers. Homojunction lasers and single heterojunction lasers are mostly pulsed devices at room temperature, while double heterojunction lasers can achieve continuous operation at room temperature.

[0003] 1. Blue semiconductor lasers have unique advantages over lasers of other wavelengths in industrial welding and other fields. To date, the methods for achieving high-power output of blue semiconductor lasers are basically spatial beam combining. The goal of this project is to improve the output power while improving the quality of the final output beam, based on the PLPT9450LB_E blue semiconductor laser single tube from the German company OSRAM.

[0004] 2. The most important way to dissipate heat in semiconductor lasers is through heat sinks. Using diamond plates as heat sink materials has become one of the important applications in the field of semiconductor lasers. In high-power semiconductor lasers, commonly used heat sink materials for packaging include AlN and Cu.

[0005] 3. Existing lasers use heat sinks to cool the laser during operation. However, current heat sinks use copper for cooling, followed by airflow for further cooling. This slows down the cooling process when there is no airflow. Additionally, existing lasers are prone to dust generation during operation. When dust floats, it can adhere to the beam assembly. Dust on the surface can cause uneven laser intensity as it passes through the surface, resulting in high peak density in some areas that exceeds the device's damage threshold, leading to device failure. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this invention provides an external cavity device for a single-tube blue semiconductor laser. It solves the problems of existing heat sink methods that rely on copper for cooling, followed by airflow for further cooling. This method is slowed down when there is no airflow during cooling. Furthermore, existing lasers are prone to dust generation during operation. This dust can adhere to the beam assembly, causing uneven laser intensity as it passes through the surface, resulting in high peak density in some areas that exceeds the device's damage threshold and leads to device failure.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, the present invention provides the following technical solution: an external cavity device for a single-tube blue semiconductor laser, comprising an emitter, a heat sink assembly, and an optical assembly. The bottom of the emitter and the top of the heat sink assembly are fixedly connected, and one side of the emitter is fixedly connected to the outer wall of the optical assembly. A copper sleeve is fitted onto the outer wall of the emitter. The copper sleeve includes a suction port, a negative pressure fan, a connecting pipe, and a delivery pipe. The suction port is located on the back of the connecting pipe. The bottom of the negative pressure fan and the top of the copper sleeve are fitted together. The top of the negative pressure fan and the bottom of the connecting pipe are fixedly connected. The interior of the connecting pipe and the outer wall of the delivery pipe are fixedly connected. The bottom of the delivery pipe and the… The heat sink assembly is internally fixedly connected, and a second suction port is opened on one side surface of the copper sleeve. The heat sink assembly includes a bottom heat exchange plate, an installation cavity, a heat absorption tube, a sleeve cavity, and an absorption port. The installation cavity is located inside the heat sink assembly and is fixedly connected to the outer wall of the bottom heat exchange plate. The heat absorption tube is located in the middle of the installation cavity. A sleeve cavity is opened inside the heat sink assembly. Absorption ports are provided on both sides of the circumference of the heat absorption tube. A third suction port is opened on the side of the heat sink assembly. The back of the heat absorption tube is fixedly connected to the bottom of the delivery pipe. By setting the copper sleeve, the airflow can be accelerated during the cooling process, thereby assisting in cooling and improving the working efficiency.

[0010] Preferably, the surface of the heat absorption tube and the interior of the exhaust pipe are fixedly connected; the exhaust pipe includes a fixed plate, a rubber hose, a movable rod, and an exhaust head, the outer wall of the fixed plate is fixedly connected to both sides of the exhaust pipe, the other side of the fixed plate is movably connected to the outer wall of the movable rod, the interior of the exhaust head is fixedly connected to the outer wall of the rubber hose, and the back of the rubber hose is fixedly connected to the interior of the exhaust pipe.

[0011] Preferably, the transmitter has clamping plates attached to its two outer walls; each clamping plate includes a rubber plate, a synthetic diamond plate, and thermally insulating silicone. The outer walls of the clamping plates and the synthetic diamond plate are fixedly connected. The surface of the thermally insulating silicone is uniformly filled with thermally insulating silicone. Rubber plates are fixedly installed on both sides of the clamping plates. The outer walls of the thermally insulating silicone are in contact with the two sides of the copper sleeve. The back of the synthetic diamond plate is in contact with the two sides of the transmitter. By setting the clamping plates, heat conduction is facilitated during operation, thereby facilitating the transfer of temperature to the required working position.

[0012] Preferably, a connection port is provided inside the other side of the fixed plate, and a limit rod is fixedly installed inside one side of the movable rod. The outer wall of the limit rod and the inside of the connection port are movably connected. By setting the fixed plate and the movable rod, the angle can be adjusted so that the air outlet can be aligned with the optical component, preventing dust from adhering to the outer wall of the optical component and effectively cooling it.

[0013] Preferably, a connecting rod is fixedly installed on the back of the transmitter, and the inside of the connecting rod is fixedly connected to the outer wall of the wire. By setting the connecting rod and the wire, power can be delivered into the interior of the transmitter.

[0014] Preferably, the heat absorption tube has a flow cavity inside, which is connected to the absorption port. The size of the flow cavity is twice the size of the absorption port. By setting the flow cavity, the high-speed airflow in the flow cavity can create a negative pressure at the absorption port during operation. At this time, the absorption port can draw heat into the interior, so that the heat can be delivered to the position where it needs to work.

[0015] Preferably, the outer walls on both sides of the negative pressure fan and the top of the mounting port are interlocked, and the bottom of the copper sleeve and the top of the heat sink assembly are fixedly connected. The negative pressure fan can be installed at the location where it needs to work by setting the mounting port.

[0016] Preferably, the interior of the copper sleeve further includes a copper plate, a heat exchange plate, a mounting port, and a heat conduction cavity. The mounting port is located at the top of the copper sleeve, and the interior of the mounting port is fixedly connected to the bottom of the copper plate. Both the copper plate and the heat exchange plate are provided with heat conduction cavities. By providing the heat exchange plate, the heat exchange area can be increased during operation, which facilitates cooling.

[0017] (III) Beneficial Effects

[0018] This invention provides an external cavity device for a single-tube blue semiconductor laser. Compared with the prior art, it has the following advantages:

[0019] (1) In this single-tube blue semiconductor laser, through the copper sleeve and heat sink assembly, during the air extraction process, the connecting pipe can transport the air inside the negative pressure fan into the inside of the conveying pipe, and then transport it into the inside of the heat absorber tube through the conveying pipe. Because the flow cavity inside the heat absorber tube is twice the size of the absorption port, the absorption port will generate negative pressure during the high-speed flow of air inside the heat absorber tube. When the heat is deposited inside the bottom heat exchange plate, the heat will be transported into the inside of the absorption port through the sleeve cavity. At the same time, during the generation of negative pressure at the absorption port, the suction port will transport the external air into the inside of the bottom heat exchange plate. With the exchange of air heat, the heat sinking efficiency can be accelerated.

[0020] (2) In this single-tube blue semiconductor laser, when the emitter generates heat, the heat dissipation silicone will transfer the heat into the interior of the copper sleeve. Due to the thermal conductivity of the metal, the heat will be conducted into the heat exchange plate and the interior of the copper plate. When the negative pressure fan starts, it will draw air. During the air drawing process, suction port 2 and suction port 1 will deliver cold air from the outside into the installation port. At this time, the installation port can effectively cool the outer wall of the emitter through the cooling and heating.

[0021] (3) The single-tube blue semiconductor laser uses a heat sink assembly and an exhaust pipe to pinch the outer wall of the exhaust head and flip the exhaust head. When flipped, the outer wall of the movable rod can rotate inside the fixed plate. When the exhaust head rotates to a 90-degree angle, it stops rotating and the airflow is sprayed onto the bottom of the optical component. When dust is generated during the processing of the optical component, the sprayed airflow can effectively remove the dust and prevent it from adhering to the bottom of the optical component. This allows the dust to be effectively blown away while exhausting the air, ensuring its efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the front structure of the copper sleeve of the present invention;

[0024] Figure 3 This is a schematic diagram of the bottom structure of the heat sink component of the present invention;

[0025] Figure 4 This is a schematic diagram of the overall structure of the card plate of the present invention;

[0026] Figure 5 This is a schematic diagram of the overall structure of the copper sleeve of the present invention in cross-section;

[0027] Figure 6 This is a schematic diagram of the internal structure of the heat sink component of the present invention;

[0028] Figure 7 For the present invention Figure 3 Overall structural diagram at point A.

[0029] In the diagram: 1. Emitter; 2. Heat sink assembly; 201. Bottom heat exchange plate; 202. Mounting cavity; 203. Heat absorption pipe; 204. Sleeve cavity; 205. Absorption port; 3. Suction port three; 4. Wire; 5. Clamping plate; 501. Rubber plate; 502. Artificial diamond plate; 503. Heat dissipation silicone; 6. Copper sleeve; 601. Copper plate; 602. Heat exchange plate; 603. Mounting port; 604. Heat conduction cavity; 7. Suction port one; 8. Negative pressure fan; 9. Connecting pipe; 10. Delivery pipe; 11. Suction port two; 12. Optical assembly; 13. Exhaust pipe; 131. Fixing plate; 132. Rubber hose; 133. Movable rod; 14. Air outlet. Detailed Implementation

[0030] The technical solutions in the embodiments of the present invention have been clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see Figure 1-7 This invention provides a technical solution: a single-tube blue semiconductor laser external cavity device, including an emitter 1, a heat sink assembly 2, and an optical assembly 12. The bottom of the emitter 1 and the top of the heat sink assembly 2 are fixedly connected, and one side of the emitter 1 is fixedly connected to the outer wall of the optical assembly 12. A copper sleeve 6 is fitted onto the outer wall of the emitter 1. The copper sleeve 6 includes a suction port 7, a negative pressure fan 8, a connecting pipe 9, and a delivery pipe 10. The suction port 7 is located on the back of the connecting pipe 9. The bottom of the negative pressure fan 8 and the top of the copper sleeve 6 are fitted together. The top of the negative pressure fan 8 and the bottom of the connecting pipe 9 are fixedly connected. The interior of the connecting pipe 9 and the outer wall of the delivery pipe 10 are fixedly connected. The bottom of the 10 is fixedly connected to the interior of the heat sink assembly 2. A suction port 21 is provided on one side surface of the copper sleeve 6. The heat sink assembly 2 includes a bottom heat exchange plate 201, an installation cavity 202, a heat absorption pipe 203, a sleeve cavity 204, and an absorption port 205. The installation cavity 202 is located inside the heat sink assembly 2. The interior of the installation cavity 202 is fixedly connected to the outer wall of the bottom heat exchange plate 201. The heat absorption pipe 203 is located in the middle of the installation cavity 202. A sleeve cavity 204 is provided inside the heat sink assembly 2. Absorption ports 205 are provided on both sides of the circumference of the heat absorption pipe 203. A suction port 3 is provided on the side of the heat sink assembly 2. The back of the heat absorption pipe 203 is fixedly connected to the bottom of the conveying pipe 10.

[0032] In this embodiment, before cooling, the outer wall of the card plate 5 is coated with heat-dissipating silicone 503. Then, the heat-dissipating silicone 503 and the outer wall of the emitter 1 are bonded together. Next, the rubber plate 501 and the two sides of the copper sleeve 6 are bonded together. When the emitter 1 generates heat, the heat-dissipating silicone 503 transfers the heat into the interior of the copper sleeve 6. Through the thermal conductivity of metal, the heat is conducted into the heat exchange plate 602 and the interior of the copper plate 601. When the negative pressure fan 8 starts, it draws air. During this process, suction port 2 11 and suction port 1 7 deliver cold air from outside into the mounting port 603. At this time, the mounting port 603, through the interaction of hot and cold air, effectively cools the outer wall of the emitter 1. During the cooling and evacuation process, the connecting pipe 9 can transport the air inside the negative pressure fan 8 into the conveying pipe 10, and then transport it into the heat absorption pipe 203 through the conveying pipe 10. Because the flow chamber inside the heat absorption pipe 203 is twice the size of the absorption port 205, the absorption port 205 will generate negative pressure during the high-speed flow of air inside the heat absorption pipe 203. When the heat settles inside the bottom heat exchange plate 201, it will be transported into the absorption port 205 through the sleeve cavity 204. At the same time, during the generation of negative pressure in the absorption port 205, the suction port 3 will transport the outside air into the bottom heat exchange plate 201. With the exchange of hot and cold air, the heat sinking efficiency can be accelerated.

[0033] Specifically, the surface of the heat absorption pipe 203 is fixedly connected to the interior of the exhaust pipe 13; the exhaust pipe 13 includes a fixed plate 131, a rubber hose 132, a movable rod 133, and an exhaust head 14. The outer wall of the fixed plate 131 is fixedly connected to both sides of the exhaust pipe 13, the other side of the fixed plate 131 is movably connected to the outer wall of the movable rod 133, the interior of the exhaust head 14 is fixedly connected to the outer wall of the rubber hose 132, and the back of the rubber hose 132 is fixedly connected to the interior of the exhaust pipe 13. The interior of the copper sleeve 6 also includes a copper plate 601, a heat exchange plate 602, an installation port 603, and a heat conduction cavity 604. The installation port 603 is located at the top of the copper sleeve 6, and the interior of the installation port 603 is fixedly connected to the bottom of the copper plate 601. Both the copper plate 601 and the heat exchange plate 602 are provided with heat conduction cavities 604.

[0034] In this embodiment, when it is necessary to prevent dust from adhering to the outer wall of the optical component 12 during operation, simply supply air from the intake port 205 into the interior of the exhaust pipe 13. At this time, the exhaust pipe 13 will supply airflow into the interior of the rubber hose 132, allowing airflow to be discharged from the interior of the exhaust head 14. Then, simply pinch the outer wall of the exhaust head 14 and flip it over. When flipping, the outer wall of the movable rod 133 can rotate inside the fixed plate 131. When the exhaust head 14 is rotated to a 90-degree angle, it stops rotating, and the airflow will be sprayed onto the bottom of the optical component 12. When dust is generated during the processing of the optical component 12, the sprayed airflow can effectively discharge the dust, preventing it from adhering to the bottom of the optical component 12, thereby ensuring the efficiency of use.

[0035] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single-tube blue semiconductor laser external cavity device, comprising an emitter (1), a heat sink assembly (2), and an optical assembly (12), wherein the bottom of the emitter (1) is fixedly connected to the top of the heat sink assembly (2), and one side of the emitter (1) is fixedly connected to the outer wall of the optical assembly (12), characterized in that: The outer wall of the transmitter (1) is fitted with a copper sleeve (6); The copper sleeve (6) includes a suction port (7), a negative pressure fan (8), a connecting pipe (9), and a conveying pipe (10). The suction port (7) is located on the back of the connecting pipe (9). The bottom of the negative pressure fan (8) and the top of the copper sleeve (6) are connected to each other. The top of the negative pressure fan (8) and the bottom of the connecting pipe (9) are fixedly connected. The inside of the connecting pipe (9) and the outer wall of the conveying pipe (10) are fixedly connected. The bottom of the conveying pipe (10) and the inside of the heat sink assembly (2) are fixedly connected. A second suction port (11) is opened on one side surface of the copper sleeve (6). The heat sink assembly (2) includes a bottom heat exchange plate (201), an installation cavity (202), a heat absorption pipe (203), a sleeve cavity (204), and an absorption port (205). The installation cavity (202) is located inside the heat sink assembly (2). The interior of the installation cavity (202) is fixedly connected to the outer wall of the bottom heat exchange plate (201). The heat absorption pipe (203) is located in the middle of the installation cavity (202). The sleeve cavity (204) is opened inside the heat sink assembly (2). Absorption ports (205) are provided on both sides of the circumference of the heat absorption pipe (203). A suction port (3) is opened on the side of the heat sink assembly (2). The back of the heat absorption pipe (203) is fixedly connected to the bottom of the delivery pipe (10).

2. The external cavity device for a single-tube blue semiconductor laser according to claim 1, characterized in that: The interior of the copper sleeve (6) also includes a copper plate (601), a heat exchange plate (602), a mounting port (603), and a heat conduction cavity (604). The mounting port (603) is located at the top of the copper sleeve (6), and the interior of the mounting port (603) is fixedly connected to the bottom of the copper plate (601). Both the copper plate (601) and the heat exchange plate (602) are provided with heat conduction cavities (604).

3. The external cavity device for a single-tube blue semiconductor laser according to claim 1, characterized in that: The surface of the heat absorption tube (203) and the interior of the exhaust pipe (13) are fixedly connected; The exhaust pipe (13) includes a fixed plate (131), a rubber hose (132), a movable rod (133), and an exhaust head (14). The outer wall of the fixed plate (131) is fixedly connected to both sides of the exhaust pipe (13), the other side of the fixed plate (131) is movably connected to the outer wall of the movable rod (133), the inside of the exhaust head (14) is fixedly connected to the outer wall of the rubber hose (132), and the back of the rubber hose (132) is fixedly connected to the inside of the exhaust pipe (13).

4. The external cavity device for a single-tube blue semiconductor laser according to claim 1, characterized in that: The transmitter (1) has clips (5) attached to the outer walls on both sides; The card plate (5) includes a rubber plate (501), an artificial diamond plate (502), and a heat-dissipating silicone (503). The outer wall of the card plate (5) and the outer wall of the artificial diamond plate (502) are fixedly connected. The surface of the heat-dissipating silicone (503) is uniformly filled with heat-dissipating silicone (503). The rubber plate (501) is fixedly installed on both sides of the card plate (5). The outer wall of the heat-dissipating silicone (503) and the two sides of the copper sleeve (6) are in contact with each other. The back of the artificial diamond plate (502) and the two sides of the transmitter (1) are in contact with each other.

5. The external cavity device for a single-tube blue semiconductor laser according to claim 2, characterized in that: The outer walls on both sides of the negative pressure fan (8) and the top of the mounting port (603) are interlocked, and the bottom of the copper sleeve (6) and the top of the heat sink assembly (2) are fixedly connected.

6. The external cavity device for a single-tube blue semiconductor laser according to claim 3, characterized in that: The fixed plate (131) has a connection port on the other side, and a limit rod is fixedly installed on one side of the movable rod (133). The outer wall of the limit rod and the inside of the connection port are movably connected.

7. The external cavity device for a single-tube blue semiconductor laser according to claim 1, characterized in that: The heat absorption tube (203) has a flow cavity inside, and the interior of the flow cavity is connected to the absorption port (205). The size of the flow cavity is twice the size of the absorption port (205).

8. The external cavity device for a single-tube blue semiconductor laser according to claim 1, characterized in that: A connecting rod is fixedly installed on the back of the transmitter (1), and the inside of the connecting rod is fixedly connected to the outer wall of the wire (4).

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