PCB, PCB temperature measurement circuits and electronic equipment

Abstract

The embodiments of the present application provide a PCB, a PCB temperature measurement circuit, and an electronic device, relating to the field of electronic technology. The PCB not only has a simple structure and low cost, but also eliminates the need to solder temperature sensors on the PCB, thereby saving space for placing components on the PCB. The resulting temperature measurement circuit has low power consumption. The PCB includes N metal layers, and the PCB also includes: a first material trace, the first material trace including a first material sub-trace; a second material trace, the second material trace including a second material sub-trace; the first end of the first material trace is connected to the first end of the second material trace, and the contact surface between the first material sub-trace and the second material sub-trace serves as a temperature measurement point; and also includes a first solder pad and a second solder pad, the first solder pad and the second solder pad being used to connect to a temperature acquisition and processing circuit. Wherein, N ≥ 1, N is an integer, and the first material sub-trace and the second material sub-trace are respectively composed of a first material and a second material. The first material and the second material are different.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a PCB, a PCB temperature measurement circuit, and an electronic device. Background Art

[0002] With technological advancements, electronic products are increasingly compact, with increasingly higher chip integration. Each chip consumes a certain amount of power, and some highly integrated chips consume even higher amounts. The compact placement of various components, including chips, on the surface of a printed circuit board (PCB) can lead to higher temperatures in certain areas of the PCB, which in turn affects all components in that area to varying degrees. Consequently, PCB-level temperature requirements are becoming increasingly stringent.

[0003] In related technologies, end-user consumer electronics often use negative temperature coefficient thermistors (NTC resistors) to measure PCB temperature. For example, the desired temperature points are first located on the PCB. These points can be near high-power devices and are designated as temperature measurement points. At least one NTC resistor temperature measurement circuit is then installed at each temperature measurement point. The temperature at each measurement point is determined by the NTC resistor temperature measurement circuit, enabling better temperature control of the entire device.

[0004] However, this temperature measurement method causes the NTC resistor to occupy more device placement space and the temperature measurement circuit consumes high power. Summary of the Invention

[0005] To address the above technical issues, the present application provides a PCB, a PCB temperature measurement circuit, and an electronic device. These devices can reduce the space required for PCB components while achieving temperature measurement. Furthermore, the PCB temperature measurement circuit is low-cost and consumes low power.

[0006] An embodiment of the present application provides a PCB, comprising N metal layers, the PCB further comprising: a first material trace, the first material trace being located in the metal layer, the first material trace comprising a first end, a second end, and a first material sub-trace; a second material trace being located in the metal layer, the second material trace comprising a first end, a second end, and a second material sub-trace; the first end of the first material trace being connected to the first end of the second material trace, such that the first material sub-trace and the second material sub-trace are connected, with the contact surface between the first material sub-trace and the second material sub-trace serving as a temperature measurement point; a first solder pad, the first solder pad being located in the metal layer, the first solder pad being connected to the second end of the first material trace, the first solder pad being used to connect to a first end of a temperature acquisition and processing circuit; and a second solder pad, the second solder pad being located in the metal layer, the second solder pad being connected to the second end of the second material trace, the second solder pad being used to connect to a second end of the temperature acquisition and processing circuit; wherein N ≥ 1, N is an integer, the first material sub-trace is composed of the first material, the second material sub-trace is composed of the second material, the first material and the second material are conductors or semiconductors, and the first material and the second material are different.

[0007] This PCB only needs to be connected to the temperature acquisition and processing circuit to achieve temperature measurement. This not only simplifies the structure and reduces costs, but also eliminates the need to solder the temperature sensor onto the PCB, thus saving space for placing components on the PCB. The traces used for temperature measurement do not require power, so the resulting temperature measurement circuit has low power consumption.

[0008] In some possible implementations, the metal layer includes a first metal layer, and the sub-routing of the first material and the sub-routing of the second material are both located in the first metal layer. The sub-routing of the first material and the sub-routing of the second material are arranged in the same metal layer, so that the two materials form a contact surface in the same layer, which simplifies the structure.

[0009] In some possible implementations, a first via is further included. The metal layer includes a first metal layer and a second metal layer. A sub-trace of the first material is located in the first metal layer, and a sub-trace of the second material is located in the second metal layer. The first via penetrates the first metal layer and the second metal layer, and the first via is used to connect a first end of the sub-trace of the first material to a first end of the sub-trace of the second material. As needed, traces of different materials can be placed in different metal layers and connected via a via. This configuration provides greater flexibility.

[0010] In some possible implementations, the first metal layer includes a first functional trace, and the first material sub-trace is made of the same material as the first functional trace; the second metal layer includes a second functional trace, and the second material sub-trace is made of the same material as the second functional trace. During PCB fabrication, each metal layer can be produced using only a single metal forming process, resulting in fewer PCB processing steps, improved PCB production efficiency, and reduced production costs.

[0011] In some possible implementations, the first material trace further includes a first connecting sub-trace, and the second material trace further includes a second connecting sub-trace. The first end of the first material sub-trace is connected to the first end of the second material sub-trace, the second end of the first material sub-trace is connected to the first end of the first connecting sub-trace, and the second end of the first connecting sub-trace is connected to the first solder pad. The second end of the second material sub-trace is connected to the first end of the second connecting sub-trace, and the second end of the second connecting sub-trace is connected to the second solder pad. Providing the first and second connecting sub-trace can shorten the lengths of the first and second material sub-trace, reduce the use of special materials on the PCB board, and thus reduce costs.

[0012] In some possible implementations, the metal layer includes a first metal layer and a second metal layer, the first connecting sub-trace and the second connecting sub-trace are arranged in the first metal layer, and the first material sub-trace and the second material sub-trace are arranged in the second metal layer; the first material trace also includes a second via, the second via passes through the first metal layer and the second metal layer, and connects the first material sub-trace and the first connecting sub-trace, and the second material trace also includes a third via, the third via passes through the first metal layer and the second metal layer, and connects the second material sub-trace and the second connecting sub-trace. By connecting the connecting sub-trace and the material sub-trace to each other through the vias, on the one hand, the material sub-trace can be set in other metal layers other than the metal layer on the surface of the PCB, thereby reducing the area occupied by the material trace on the metal layer on the surface of the PCB, which is conducive to setting more pads on the metal layer on the surface of the PCB. On the other hand, setting the connecting sub-trace can make the setting position of the first pad and the second pad more flexible, which is convenient for setting the position of the temperature acquisition and processing circuit.

[0013] In some possible implementations, the metal layer includes functional traces, and the material of the first material sub-trace is the same as the material of the functional trace. Because the traces in the same metal layer are made of the same material, all traces in the metal layer can be formed in the same metal production process, thereby saving production processes and reducing costs.

[0014] In some possible implementations, the first material sub-trace is made of copper or a copper alloy. Since copper or copper alloys are commonly used materials for PCB metal layers, this material selection allows the metal layer containing the first material sub-trace to be produced using common processes and materials, further reducing PCB processing costs.

[0015] An embodiment of the present application further provides a PCB temperature measurement circuit, comprising any of the above-mentioned PCBs, and further comprising: a temperature acquisition and processing circuit, the temperature acquisition and processing circuit comprising a first end and a second end, the first end of the temperature acquisition and processing circuit being connected to the second end of the first material trace through a first solder pad; the second end of the temperature acquisition and processing circuit being connected to the second end of the second material trace through a second solder pad; the temperature acquisition and processing circuit being configured to acquire an electromotive force between the first material trace and the second material trace, and determine the temperature of a temperature measurement point based on the electromotive force and an electromotive force-temperature correspondence.

[0016] The PCB temperature measurement circuit described above is not only simple in structure and low in cost, but also eliminates the need to solder a temperature sensor onto the PCB, thus saving space for component placement. The traces used for temperature measurement do not require electrical power, resulting in a low-power temperature measurement circuit.

[0017] An embodiment of the present application further provides an electronic device, comprising any one of the above-mentioned PCBs, or comprising the above-mentioned PCB temperature measurement circuit.

[0018] PCB temperature measurement circuits in electronic devices offer simple structure and low cost. They also eliminate the need for soldering temperature sensors onto the PCB, saving space for component placement. The traces used for temperature measurement require no electrical power, resulting in a low-power temperature measurement circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A front view diagram of a mobile phone provided by an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of the back of a mobile phone provided by an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the structure of an NTC resistor temperature measurement circuit provided for related technology;

[0022] Figure 4 A PCB side view of a temperature measurement circuit using an NTC resistor is provided for related technology;

[0023] Figure 5 A schematic diagram of a PCB temperature measurement circuit provided by an embodiment of the present invention;

[0024] Figure 6 A schematic diagram of another PCB temperature measurement circuit provided by an embodiment of the present invention;

[0025] Figure 7 A schematic diagram of another PCB temperature measurement circuit provided by an embodiment of the present invention;

[0026] Figure 8A schematic diagram of the structure of a temperature acquisition and processing circuit provided by an embodiment of the present invention;

[0027] Figure 9 A schematic structural diagram of another temperature acquisition and processing circuit provided by an embodiment of the present invention;

[0028] Figure 10 A schematic diagram of the structure of another temperature acquisition and processing circuit provided by an embodiment of the present invention;

[0029] Figure 11 A schematic structural diagram of another temperature acquisition and processing circuit provided by an embodiment of the present invention;

[0030] Figure 12 A schematic structural diagram of a PCB temperature measurement circuit provided by an embodiment of the present invention in a first usage scenario;

[0031] Figure 13 A schematic structural diagram of another PCB temperature measurement circuit provided by an embodiment of the present invention in a second usage scenario.

[0032] 001-display screen; 002-battery cover; 003-middle frame;

[0033] vcc-voltage source; R1-voltage divider resistor; R2-NTC resistor; 01-analog-to-digital conversion voltage acquisition device; 02-PCB;

[0034] 1-first material routing; 11-first material sub-routing; 111-first first material sub-routing; 112-second first material sub-routing; 113-third first material sub-routing; 12-first connecting sub-routing;

[0035] 2-second material routing; 21-second material sub-routing; 211-first second material sub-routing; 212-second second material sub-routing; 213-third second material sub-routing; 22-second connecting sub-routing;

[0036] 3-temperature acquisition and processing circuit; 31-amplification circuit; 32-analog-to-digital conversion circuit; 33-microcontroller;

[0037] 4-temperature measuring point; 41-first temperature measuring point; 42-second temperature measuring point; 43-third temperature measuring point;

[0038] s-preset distance; s1-first preset distance; s2-second preset distance; s3-third preset distance;

[0039] 5-heating device; 51-system on chip; 52-camera module; 53-power management chip;

[0040] 6-First reference point;

[0041] 7- Second reference point;

[0042] 8- Temperature reference area;

[0043] 91-first via hole; 92-second via hole; 93-third via hole

[0044] 10-NTC resistor temperature measurement circuit. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0046] The term "and / or" in this article is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0047] The terms "upper," "lower," "left," and "right" used herein to indicate directions are intended only to clarify the embodiments and to describe one possible arrangement or configuration of components. They are not intended to limit the relationships between components or their orientation.

[0048] In the description and claims of the embodiments of this application, the terms "first" and "second" are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first target object" and "second target object" are used to distinguish different objects, rather than to describe a specific order of objects.

[0049] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0050] In the description of the embodiments of this application, unless otherwise specified, "multiple" means two or more. For example, "multiple processing units" means two or more processing units; "multiple systems" means two or more systems.

[0051] The present application provides an electronic device. The electronic device may be any electronic device, such as a mobile phone, a computer, a tablet computer, a personal digital assistant (PDA), an in-car computer, a television, a smart wearable device, or a smart home device. The structure of the electronic device is described below using a mobile phone as an example.

[0052] See also Figure 1 and Figure 2 The electronic device includes a display screen 001, a battery cover 002, and a midframe 003. These three components enclose a housing cavity, within which a PCB (not shown) is located. The PCB often houses a variety of electronic components, each with its own power consumption and the ability to dissipate heat. For some high-heat generating components, their own heat can cause a certain area on the PCB to heat up. Under the influence of high temperatures, some components located in this (high-temperature) area may malfunction, or even fail. Therefore, it is necessary to obtain real-time temperature data for each PCB area so that the operating conditions of the heating components can be adjusted accordingly, maintaining the PCB temperature within a reasonable range.

[0053] To address these issues, related technologies have proposed an NTC resistor temperature measurement circuit that can determine the temperature measurement point for real-time temperature monitoring based on actual needs. For example, if the temperature of a system-on-chip (SOC) is to be monitored in the area surrounding the SOC, an NTC resistor can be placed near the SOC. The NTC resistor measures the temperature in the SOC area, and the SOC's operating conditions are adjusted based on the temperature near the SOC measured by the NTC resistor temperature measurement circuit. The specific structure and operating principle of the NTC resistor temperature measurement circuit are described below.

[0054] See also Figure 3The figure shows a voltage source Vcc, a voltage divider resistor R1, an NTC resistor R2, and an analog-to-digital converter (ADC) voltage acquisition device 01. The first end of the voltage divider resistor R1 is connected to the voltage source Vcc, and the second end of the voltage divider resistor R1 is connected to the first end of the NTC resistor R2. The second end of the NTC resistor R2 is connected to a reference voltage or ground. In other words, the voltage divider resistors R1 and R2 are connected in series between the voltage source Vcc and the reference voltage. The NTC resistor R2 contains a semiconductor material that increases the number of charge carriers as the temperature rises. Therefore, the resistance of the NTC resistor R2 decreases with increasing temperature. This characteristic of the NTC resistor R2 allows the NTC resistor R2 and the voltage divider resistor R1 to be connected in series between the voltage source Vcc and the reference voltage. Since the total voltage difference between the voltage source Vcc and the reference voltage remains constant, when the temperature rises, the resistance of NTC resistor R2 decreases, the voltage across NTC resistor R2 decreases, and the voltage at the acquisition point between NTC resistor R2 and voltage divider resistor R1 decreases. When the temperature drops, the resistance of NTC resistor R2 increases, the voltage across NTC resistor R2 increases, and the voltage at the acquisition point between NTC resistor R2 and voltage divider resistor R1 increases. Therefore, the voltage at the acquisition point can be acquired by ADC voltage acquisition device 01, and the real-time temperature of the temperature measurement point can be determined based on the voltage.

[0055] See also Figure 4 Because this solution involves at least two components—the NTC resistor R2 and the voltage divider resistor R1—it requires space on PCB 02 for them, which takes up increasingly scarce component space. This arrangement is therefore detrimental to the miniaturization and thinness of electronic products. Furthermore, the current flowing through the NTC resistor R2 and the voltage divider resistor R1 increases the power consumption of the electronic product.

[0056] In view of this, an embodiment of the present invention provides a PCB temperature measurement circuit, comprising a PCB and a temperature acquisition and processing circuit. The PCB comprises N metal layers. N can be equal to 1, meaning the PCB has only one metal layer. Alternatively, N can be a positive integer greater than or equal to 2, with adjacent metal layers separated by a dielectric layer. The metal layers of the PCB comprise traces made of a first material and traces made of a second material. The traces made of the first material disposed in the PCB metal layer include at least a first sub-trace made of the first material, and the traces made of the second material disposed in the PCB metal layer include at least a second sub-trace made of the second material. The first material and the second material can be two different conductors or semiconductors. Exemplarily, the first material and the second material can be two different conductors, two different semiconductors, or one conductor and the other semiconductor. For example, the conductor can be a pure metal such as copper, iron, or aluminum, or an alloy. The semiconductor can be silicon, germanium, gallium arsenide, or the like. The sub-trace made of the first material is disposed in one of the N metal layers, and the sub-trace made of the second material is disposed in one of the N metal layers. The sub-trace made of the first material and the sub-trace made of the second material can be located in the same metal layer or in different metal layers.

[0057] See also Figure 5 , the first material sub-trace and the second material sub-trace are located in the same metal layer. The first end of the first material sub-trace 11 is connected to the first end of the second material sub-trace 21 to form a temperature measuring point 4. The temperature measuring point 4 can be set at a position at a preset distance s from the heating device 5. The size of the preset distance s can be determined according to actual needs. The metal layer of the PCB includes a first soldering pad (not shown in the figure) and a second soldering pad (not shown in the figure). The second end of the first material sub-trace 11 is connected to the first end of the temperature acquisition and processing circuit 3 through the first soldering pad to form a first reference point 6; the second end of the second material sub-trace 21 is connected to the second end of the temperature acquisition and processing circuit 3 through the second soldering pad to form a second reference point 7. The first reference point 6 and the second reference point 7 are both set in the temperature reference area 8. The temperature reference area 8 can be an area on the PCB02 where there are fewer heating devices, low heating power, or no heating devices. The temperature of this area is similar to the ambient temperature.

[0058] See also Figure 6, the first material sub-trace and the second material sub-trace are respectively arranged in different metal layers. Exemplarily, the PCB may include four metal layers, wherein the first metal layer is provided with pads for connecting to the device, and the pads include a first pad and a second pad. The first material sub-trace 11 is arranged in the second metal layer, and the second material sub-trace 21 is arranged in the third metal layer. The first via 91 passes through the dielectric layer between the second metal layer and the third metal layer, connecting the first end of the first material sub-trace 11 with the first end of the second material sub-trace 21 to form a temperature measuring point 4. The temperature measuring point 4 can be set at a position at a preset distance s from the heating device 5, and the size of the preset distance s can be determined according to actual needs. PCB 02 also includes a first blind via (not shown) and a second blind via (not shown). The first blind via penetrates the first metal layer, the second metal layer, and the dielectric layer between the first and second metal layers, connecting the first pad of the first metal layer to the second end of the first material sub-trace 11. The second blind via penetrates the first metal layer, the second metal layer, the third metal layer, the dielectric layer between the first and second metal layers, and the dielectric layer between the second and third metal layers, connecting the second pad of the first metal layer to the second end of the second material sub-trace 21. By providing the first and second blind vias, the second end of the first material sub-trace 11 is connected to the first end of the temperature acquisition and processing circuit 3 through the first blind via (not shown) and the first pad, forming a first reference point 6. The second end of the second material sub-trace 21 is connected to the second end of the temperature acquisition and processing circuit 3 through the second blind via (not shown) and the second pad, forming a second reference point 7. The first reference point 6 and the second reference point 7 are both set in the temperature reference area 8. The temperature reference area 8 can be an area on PCB02 with fewer heating devices, low heating power, or no heating devices. The temperature of this area is close to the ambient temperature.

[0059] In a scheme where the sub-routes of the first material and the sub-routes of the second material are arranged in different metal layers, the material of the metal layer containing the sub-routes of the first material can be determined as the first material, and the material of the metal layer containing the sub-routes of the second material can be determined as the second material. For example, the PCB may include four metal layers, with the sub-routes 11 of the first material arranged in the second metal layer, and the sub-routes 21 of the second material arranged in the third metal layer. The material of the second metal layer can be copper or a copper alloy, and the material of the third metal layer can be aluminum or an aluminum alloy. Functional routes such as signal transmission lines or power lines arranged in the second metal layer can be made of the same material as the sub-routes 11 of the first material, namely copper or a copper alloy; while the functional routes arranged in the third metal layer can be made of the same material as the sub-routes of the second material, namely aluminum or an aluminum alloy. This arrangement has the advantage that, since each metal layer is made of only one material, only a single metal forming process is required during production, eliminating the need to form a second material on top of the metal layer. Therefore, this arrangement simplifies the process, improves production efficiency, and reduces production costs.

[0060] This embodiment utilizes the Seebeck effect, also known as the first thermoelectric effect, which refers to the thermoelectric phenomenon in which a voltage difference between two materials is caused by a temperature difference between two different conductors or semiconductors. Specifically, a first material trace 1 and a second material trace 2 are interconnected at one end at a temperature measurement point 4, and the first material trace 1 and the second material trace 2 are interconnected at the other end via a temperature acquisition and processing circuit 3, thereby forming a loop. When there is a temperature difference between the temperature measurement point 4 and the temperature reference area 8, an electromotive force (EMF) is generated in this loop. The direction and magnitude of this EMF are related to the materials of the first and second materials, as well as the temperatures of the temperature measurement point 4 and the temperature reference area 8. The greater the temperature difference between the temperature measurement point 4 and the temperature reference area 8, the greater the magnitude of the EMF. Compared to NTC resistor temperature measurement circuits, the PCB temperature measurement circuit provided by this embodiment of the present invention eliminates the NTC resistor and voltage divider resistor soldered to the PCB, saving space for component placement on the PCB. Furthermore, the temperature measurement principle based on the EMF generated by the temperature difference between the temperature measurement point 4 and the temperature reference area 8 enables this PCB temperature measurement circuit to have a fast response speed and a wide temperature measurement range. Because the only components generating electromotive force are the first material trace 1 and the second material trace 2, the cost is relatively low. Since the first material trace 1 and the second material trace 2 operate based on the spontaneous generation of electromotive force due to the first thermoelectric effect, they are passive components, resulting in lower power consumption compared to other active temperature measurement circuits. Because the PCB temperature measurement circuit only measures the temperature at the intersection of the first and second materials, it is also capable of measuring the temperature of specific points within a small range.

[0061] As mentioned above, the first material and the second material can be any two different conductor or semiconductor materials, for example, the first material is steel and the second material is aluminum. In other embodiments, the first material can also be determined to be copper or a copper alloy, and the second material can be a conductor or semiconductor material other than copper. The advantage of this arrangement is that the metal layer on the PCB is often provided with a variety of functional traces, such as power lines and signal transmission lines. The material of these functional traces is often copper. If the first material is copper, the functional traces and the first material sub-traces can be formed in the same production process without changing the main material of the metal layer or setting up a separate step for forming the first material during the production process. The formation process of the first material is merged with the formation process of the functional traces on the PCB. This achieves the effect of reducing the production process and improving production efficiency.

[0062] This embodiment does not limit the material of the temperature acquisition and processing circuit 3. The material of the temperature acquisition and processing circuit 3 can be the first material, the second material, or another material different from either the first or second material. This is because when a third metal material is connected to the loop, as long as the temperatures of the two connection points of the third metal material are the same, the thermoelectric potential generated by the loop will remain unchanged, that is, it will not be affected by the connection of the third metal to the loop. Therefore, the material of the temperature acquisition and processing circuit 3 can be any material. In other words, if the temperature acquisition and processing circuit 3 includes a corresponding chip, regardless of the material of the chip's pins, it will not affect the temperature measurement accuracy of the PCB temperature measurement circuit.

[0063] Based on the above principles, see Figure 7 In other embodiments, the first material routing 1 includes a first material sub-routing 11 and a first connecting sub-routing 12. The second material routing 2 includes a second material sub-routing 21 and a second connecting sub-routing 22. The first end of the first material sub-routing 11 is connected to the first end of the second material sub-routing 21 to form a temperature measurement point 4. The first end of the first connecting sub-routing 12 is connected to the second end of the first material sub-routing 11 to form a first reference point 6. The second end of the first connecting sub-routing 12 is connected to the first end of the temperature acquisition and processing circuit 3. The first end of the second connecting sub-routing 22 is connected to the second end of the second material sub-routing 21 to form a second reference point 7. The second end of the second connecting sub-routing 22 is connected to the second end of the temperature acquisition and processing circuit 3. The first reference point 6 and the second reference point 7 are both set in the temperature reference area 8. According to the above theory, the first connecting sub-routing 12 and the second connecting sub-routing 22 can be made of any metal material without affecting the electromotive force of the loop.

[0064] See also Figure 8In some embodiments, the temperature acquisition and processing circuit 3 may include an amplifier circuit 31, an analog-to-digital conversion circuit 32, and a microcontroller 33. Due to the physical properties of some of the first material and the second material, the electromotive force generated by the combination of the two is small and smaller than the preset electromotive force. Therefore, it is necessary to set an amplifier circuit 31 to amplify the electromotive force, so that the electromotive force is recognized by the digital-to-analog conversion circuit. The two ends of the amplifier circuit 31 are respectively connected to the second end of the first material trace 1 and the second end of the second material trace 2. After the electromotive force is amplified by the amplifier circuit 31, an amplified analog electromotive force is obtained. The analog-to-digital conversion circuit 32 converts the amplified analog electromotive force into an amplified digital electromotive force. The microcontroller 33 obtains the temperature of the temperature measuring point 4 based on the amplified digital electromotive force and the electromotive force-temperature correspondence. The preset electromotive force can be determined according to actual needs, and the electromotive force-temperature correspondence can be obtained in the following way.

[0065] When determining the electromotive force-temperature correspondence, the temperature of the measurement environment can be adjusted to a preset reference temperature. The temperature of temperature measurement point 4 can then be varied, and the electromotive force corresponding to different temperatures at temperature measurement point 4 can be sequentially measured and recorded. The resulting electromotive force-temperature correspondence table is stored in microcontroller 33 as the electromotive force-temperature correspondence. When the electronic device performs temperature measurement, the temperature acquisition and processing circuit 3 obtains the real-time electromotive force and then queries the electromotive force-temperature correspondence table, thereby determining the temperature corresponding to the real-time electromotive force as the temperature value at temperature measurement point 4. The preset reference temperature can be determined based on actual needs; for example, it can be set to 25°C. This embodiment has a simple structure, can determine the approximate temperature of temperature measurement point 4, and significantly reduces the PCB space occupied by the temperature measurement circuit.

[0066] During the process of determining the electromotive force-temperature correspondence, the electromotive forces corresponding to different temperatures at the temperature measurement point 4 are sequentially measured and recorded. After obtaining this correspondence, a two-dimensional coordinate system can be established. Based on the relationship between temperature and electromotive force, an electromotive force-temperature curve can be plotted on the two-dimensional coordinate system. A functional relationship curve that most closely matches the electromotive force-temperature curve can be fitted based on the electromotive force-temperature curve. Based on this functional relationship curve, the electromotive force-temperature functional relationship can be determined. The electromotive force-temperature functional relationship is stored in the microcontroller 33. When the electronic device performs temperature measurement, the temperature acquisition and processing circuit 3 obtains the real-time electromotive force and substitutes the electromotive force into the electromotive force-temperature functional relationship to determine the temperature at the temperature measurement point 4.

[0067] When determining the electromotive force-temperature correspondence, the electromotive force corresponding to each temperature difference between the temperature measurement point 4 and the temperature reference area 8 can also be measured and recorded in sequence, and the resulting electromotive force-temperature difference correspondence table can be stored in the microcontroller 33. The sum of the reference temperature of the temperature reference area 8 and the temperature difference corresponding to the electromotive force is used as the temperature of the temperature measurement point 4. The temperature of the temperature measurement point 4 and its corresponding electromotive force form an electromotive force-temperature correspondence. The reference temperature of the temperature reference area 8 can be the preset reference temperature described above, or it can be the actual measured temperature. A temperature measurement circuit can be provided in the temperature reference area 8, such as an NTC resistor temperature measurement circuit 10, and the actual temperature value of the temperature reference area 8 can be measured using the temperature measurement circuit, and the actual temperature value is used as the reference temperature. Taking the solution where the NTC resistor temperature measurement circuit 10 is installed in the temperature reference area 8 as an example, when measuring temperature, the temperature acquisition and processing circuit 3 obtains the real-time collected electromotive force and then queries the electromotive force-temperature difference correspondence table to determine the temperature difference between the temperature measurement point 4 and the temperature reference area 8. The temperature difference is then added to the reference temperature actually measured by the NTC resistor temperature measurement circuit 10 to obtain the temperature of the temperature measurement point 4. This embodiment provides a more accurate temperature measurement point 4. When the PCB temperature measurement circuit measures the temperature of multiple points, only one set of NTC resistor temperature measurement circuits 10 is required, reducing the space occupied by the temperature measurement circuit on the PCB.

[0068] During the process of determining the electromotive force-temperature correspondence, the electromotive force corresponding to each temperature difference between the temperature measurement point 4 and the temperature reference region 8 is measured and recorded. After obtaining the above correspondence, a two-dimensional coordinate system can be established. Based on the relationship between the temperature difference and the electromotive force, an electromotive force-temperature difference curve can be plotted on the two-dimensional coordinate system. A functional relationship curve that is closest to the electromotive force-temperature difference curve can be fitted based on the electromotive force-temperature difference curve. Based on this functional relationship curve, the electromotive force-temperature difference functional relationship can be determined. The electromotive force-temperature difference functional relationship is stored in the microcontroller 33. When the electronic device performs temperature measurement, the temperature acquisition and processing circuit 3 obtains the real-time electromotive force and substitutes the electromotive force into the electromotive force-temperature difference functional relationship to obtain the temperature difference. The temperature difference is then added to the reference temperature of the temperature reference region 8 to obtain the temperature of the temperature measurement point 4.

[0069] As can be seen from the foregoing, there are various ways to determine the electromotive force-temperature correspondence. The embodiments of the present invention exemplify several methods for determining the electromotive force-temperature correspondence. In actual implementation, the method for determining the electromotive force-temperature correspondence can be determined based on actual needs, and the embodiments of the present invention are not limited to the method for determining the electromotive force-temperature correspondence.

[0070] See also Figure 9In other embodiments, due to the physical properties of certain first and second materials, the electromotive force generated by their combination is relatively large, greater than or equal to a predetermined electromotive force. Therefore, without providing an amplifier circuit, the electromotive force can be recognized by the digital-to-analog conversion circuit. The temperature acquisition and processing circuit 3 may include an analog-to-digital conversion circuit 32 and a microcontroller 33. The analog-to-digital conversion circuit 32 can convert the analog electromotive force between the first material trace 1 and the second material trace 2 into a digital electromotive force. The microcontroller 33 then determines the temperature of the temperature measurement point 4 based on the digital electromotive force and the electromotive force-temperature correspondence.

[0071] See also Figure 10 In other embodiments, the temperature acquisition and processing circuit 3 may include a microcontroller 33. Since some microcontrollers have a digital-to-analog conversion function, the first material trace 1 and the second material trace 2 may be connected between two digital-to-analog conversion pins of the microcontroller 33. The electromotive force between the first material trace 1 and the second material trace 2 is directly obtained by the microcontroller 33, and then the temperature of the temperature measurement point 4 is obtained based on the electromotive force and the electromotive force-temperature correspondence relationship. Figure 11 Of course, for some combinations of the first material and the second material, the electromotive force generated is small, less than the preset electromotive force. The temperature acquisition and processing circuit 3 can also be provided with an amplifier circuit 31 to amplify the electromotive force so that the electromotive force is easier to be captured and identified by the microcontroller.

[0072] Scene 1

[0073] See also Figure 12The motherboard of a mobile phone is a multi-layer PCB, with an SOC51 disposed on the top metal layer of PCB02. SOC51 generates a high amount of heat, so the area where it is located needs to be temperature monitored. However, several components are disposed around SOC51. To avoid conflicts with the position of the components around SOC51, the first material sub-routing 11 and the second material sub-routing 21 can be disposed on the second top metal layer of PCB02, or on other metal layers other than the top and second top layers. Temperature measuring point 4 is disposed at a predetermined distance from SOC51, thereby achieving temperature measurement in the area where SOC51 is located without occupying the top metal layer of PCB02 used to place components. In addition, since there is a predetermined distance s between temperature measuring point 4 and SOC51, drastic temperature fluctuations at temperature measuring point 4 can be avoided, and the resulting temperature measurement results are more valuable for reference. The temperature acquisition and processing circuit 3 includes devices that need to be set on the top metal layer of PCB02. Therefore, the temperature acquisition and processing circuit 3 can be set on the top metal layer of PCB02. The first connecting sub-route 12 and the second connecting sub-route 22 connected to the temperature acquisition and processing circuit 3 are connected to the first material sub-route 11 and the first connecting sub-route 12 of different layers through the second via 92 that passes through the metal layer where the first material sub-route 11 is located and the metal layer where the first connecting sub-route 12 is located. The second material sub-route 21 and the second connecting sub-route 22 of different layers are connected through the third via 93 that passes through the metal layer where the second material sub-route 21 is located and the metal layer where the second connecting sub-route 22 is located, thereby forming a complete PCB temperature measurement circuit.

[0074] Scene 2

[0075] See also Figure 13The mobile phone's motherboard is a multi-layer PCB. The top metal layer of PCB02 houses an SOC 51, a camera module 52, and a power management chip 53. Because these components generate high heat, temperature monitoring is required. A temperature acquisition and processing circuit 3, three first-material sub-routes 11, and three second-material sub-routes 21 can be located on the top metal layer of PCB02. The first end of the first first-material sub-routes 111 and the first end of the first second-material sub-routes 211 coincide with a first temperature measurement point 41, with a first preset distance s1 separating the first temperature measurement point 41 and the SOC 51. The second end of the first first-material sub-routes 111 is connected to the first end of the temperature acquisition and processing circuit 3, while the second end of the first second-material sub-routes 211 is connected to the second end of the temperature acquisition and processing circuit 3. The first end of the second first-material sub-routes 112 and the first end of the second second-material sub-routes 212 coincide with a second temperature measurement point 42, with a second preset distance s2 separating the second temperature measurement point 42 and the camera module 52. The second end of the second first material sub-trace 112 is connected to the third end of the temperature acquisition and processing circuit 3, and the second end of the second second material sub-trace 212 is connected to the fourth end of the temperature acquisition and processing circuit 3. The first end of the third first material sub-trace 113 and the first end of the third second material sub-trace 213 overlap at the third temperature measurement point 43. A third preset distance s3 separates the third temperature measurement point 43 from the power management chip 53. The second end of the third first material sub-trace 113 is connected to the fifth end of the temperature acquisition and processing circuit 3, and the second end of the third second material sub-trace 213 is connected to the sixth end of the temperature acquisition and processing circuit 3. The first preset distance s1, the second preset distance s2, and the third preset distance s3 can be determined according to actual needs. An NTC resistor temperature measurement circuit 10 is provided at the second end of each first material sub-trace and second material sub-trace. The NTC resistor temperature measurement circuit 10 acquires the reference temperature of the temperature reference area 8 in real time. The temperature acquisition and processing circuit 3 obtains the measured reference temperature and outputs a first temperature at a first temperature measurement point 41, a second temperature at a second temperature measurement point 42, and a third temperature at a third temperature measurement point 43. By simply installing a single NTC resistor temperature measurement circuit 10 on PCB 02, the PCB temperature measurement circuit of this embodiment of the present invention can accurately measure temperatures at multiple points.

[0076] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A PCB having a system-on-chip chip, a camera module, a power management chip, an NTC resistor temperature measurement circuit, and a temperature acquisition and processing circuit welded thereon, characterized in that: The PCB includes N metal layers, and further includes: three first material traces, each of the first material traces being located in the metal layer, and each of the first material traces comprising a first end, a second end, and a first material sub-trace; three second material traces, each of the second material traces being located in the metal layer, and each of the second material traces comprising a first end, a second end, and a second material sub-trace; The first end of the first routing line of the first material is connected to the first end of the first routing line of the second material, so that the first sub-routing line of the first material and the first sub-routing line of the second material are connected, and the contact surface between the first sub-routing line of the first material and the first sub-routing line of the second material is used as a first temperature measurement point, and the first temperature measurement point is used to measure the temperature of the system-on-chip chip; The first end of the second routing line of the first material is connected to the first end of the second routing line of the second material, so that the second sub-routing line of the first material is connected to the second sub-routing line of the second material, and the contact surface between the second sub-routing line of the first material and the second sub-routing line of the second material is used as a second temperature measuring point, and the second temperature measuring point is used to measure the temperature of the camera module; The first end of the third routing line of the first material is connected to the first end of the third routing line of the second material, so that the third sub-routing line of the first material and the third sub-routing line of the second material are connected, and the contact surface between the third sub-routing line of the first material and the third sub-routing line of the second material is used as a third temperature measurement point, and the third temperature measurement point is used to measure the temperature of the power management chip; a first pad, the first pad being located in the metal layer, the first pad being connected to the second end of the first wire of the first material, and the first pad being used to connect to the first end of the temperature acquisition and processing circuit; a second pad, the second pad being located in the metal layer, the second pad being connected to the second end of the first trace of the second material, and the second pad being used to connect to the second end of the temperature acquisition and processing circuit; a third pad, the third pad being located in the metal layer, the third pad being connected to the second end of the second trace of the first material, and the third pad being used to connect to the third end of the temperature acquisition and processing circuit; a fourth pad, the fourth pad being located in the metal layer, the fourth pad being connected to the second end of the second trace made of the second material, and the fourth pad being used to connect to the fourth end of the temperature acquisition and processing circuit; a fifth pad, the fifth pad being located in the metal layer, the fifth pad being connected to the second end of the third trace made of the first material, and the fifth pad being used to connect to the fifth end of the temperature acquisition and processing circuit; a sixth pad, the sixth pad being located in the metal layer, the sixth pad being connected to the second end of the third trace made of the second material, and the sixth pad being used to connect to the sixth end of the temperature acquisition and processing circuit; The NTC resistance temperature measurement circuit is used to collect the reference temperature; The temperature acquisition and processing circuit is configured to determine a first temperature at the first temperature measurement point based on the reference temperature and a first electrical signal between a first first material trace and a first second material trace; determine a second temperature at the second temperature measurement point based on the reference temperature and a second electrical signal between a second first material trace and a second second material trace; and determine a third temperature at the third temperature measurement point based on the reference temperature and a third electrical signal between a third first material trace and a third second material trace; Wherein, N ≥ 2, N is an integer, all the first material sub-routes are composed of the first material, all the second material sub-routes are composed of the second material, the first material and the second material are conductors or semiconductors, and the first material and the second material are different; Wherein, it also includes a first via, a second via and a third via, the metal layer includes a first metal layer and a second metal layer, the first sub-route of the first material, the second sub-route of the first material and the third sub-route of the first material are all located in the first metal layer, the first sub-route of the second material, the second sub-route of the second material and the third sub-route of the second material are all located in the second metal layer, the first via, the second via and the third via all pass through the first metal layer and the second metal layer, the first via is used to connect the first end of the first sub-route of the first material and the first end of the first sub-route of the second material, the second via is used to connect the first end of the second sub-route of the first material and the first end of the second sub-route of the second material, and the third via is used to connect the first end of the third sub-route of the first material and the first end of the third sub-route of the second material; Among them, the first metal layer includes a first functional routing, and the material of the first material sub-routing is consistent with the material of the first functional routing; the second metal layer includes a second functional routing, and the material of the second material sub-routing is consistent with the material of the second functional routing, the material of the first metal layer is the first material, and the material of the second metal layer is the second material.

2. The PCB according to claim 1, wherein: The first material route also includes a first connecting sub-route, and the second material route also includes a second connecting sub-route. The first end of the first material sub-route is connected to the first end of the second material sub-route, the second end of the first material sub-route is connected to the first end of the first connecting sub-route, and the second end of the first connecting sub-route is connected to the first pad; the second end of the second material sub-route is connected to the first end of the second connecting sub-route, and the second end of the second connecting sub-route is connected to the second pad.

3. The PCB according to claim 1, wherein: The material of the first material sub-routing is copper or copper alloy.

4. A PCB temperature measurement circuit, characterized in that: The PCB according to any one of claims 1 to 3 further comprises: The temperature acquisition and processing circuit includes a first end and a second end, the first end of the temperature acquisition and processing circuit is connected to the second end of the first material routing through the first solder pad; the second end of the temperature acquisition and processing circuit is connected to the second end of the second material routing through the second solder pad; the temperature acquisition and processing circuit is used to acquire the electromotive force between the first material routing and the second material routing, and determine the temperature of the temperature measurement point according to the electromotive force and the electromotive force-temperature correspondence relationship.

5. An electronic device, characterized in that: The device comprises the PCB according to any one of claims 1 to 3, or comprises the PCB temperature measurement circuit according to claim 4.

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