A method for cutting a crystal bar

Abstract

The application provides a crystal bar cutting method, and belongs to the technical field of crystal silicon processing, and solves the problem of easy wire breakage in simultaneous cutting of multiple crystal bars in the prior art. The application comprises the following steps: setting a unit length, arranging at least one crystal bar on each side of the radial direction of the cutting line every 1 unit length interval; feeding each crystal bar to the cutting line to obtain wire bow information of the cutting line; and adjusting the feeding speed and / or position of the crystal bar according to the wire bow information. The application arranges at least one crystal bar on each side of the radial direction of the cutting line, so that the force direction between adjacent crystal bars is opposite, the stress in a single direction of the cutting line is reduced, and thus the wire breakage rate of the cutting line is reduced; the wire bow information of the cutting line is obtained, and the feeding speed and / or position of the crystal bar is adjusted according to the wire bow information, so that the wire breakage rate is further reduced.

Description

Technical Field

[0001] This invention belongs to the field of crystalline silicon processing technology, and more specifically, relates to a method for cutting crystal rods. Background Technology

[0002] Currently, mature slicing equipment generally includes a cutting chamber, which contains multiple main rollers with cutting lines surrounding them. The cutting lines can be driven by the main rollers to move back and forth in both directions. The crystal rod can be fed towards the cutting lines by the feeding device, thereby realizing the cutting and processing of the crystal rod.

[0003] Existing slicing machines require at least two main rollers to cut a single crystal ingot. To cut multiple crystal ingots simultaneously, even more main rollers are needed. If multiple crystal ingots are placed between only two main rollers for cutting, the spacing between the main rollers needs to be increased, and the length of the cutting line segment in the cutting area also needs to be increased. This setup leads to an increase in the bowing of the cutting line, resulting in a significant increase in the breakage rate of the cutting line, and the quality of the cut wafers is also easily affected.

[0004] Based on the above, the technical problem to be solved by this application is: how to reduce the wire breakage rate when cutting multiple crystal rods simultaneously. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned problems in the prior art by proposing a crystal rod cutting method that solves the problem of wire breakage when cutting multiple crystal rods simultaneously. The technical advantage of this solution is that it reduces the wire breakage rate when cutting multiple crystal rods simultaneously.

[0006] The objective of this invention can be achieved through the following technical solution: a crystal rod cutting method, comprising the following steps: setting a unit length, and arranging at least one crystal rod on each side of the radial direction of the cutting line at intervals of one unit length; feeding each crystal rod to abut against the cutting line, and obtaining the line bow information of the cutting line; adjusting the feeding speed and / or position of the crystal rod according to the line bow information.

[0007] It is understandable that by arranging at least one crystal rod on each side of the radial direction of the cutting line, the forces between adjacent crystal rods are opposite in direction, which can reduce the force on the cutting line in a single direction and thus reduce the breakage rate of the cutting line. Furthermore, based on the real-time detection of the wire bow information of the cutting line, the force situation of each cutting line segment where the crystal rod is located can be simulated, such as whether it is relaxed. The feed speed can be increased, maintained or decreased, or the feed position of the crystal rod can be adjusted to adjust the wire bow size of the corresponding crystal rod, so as to control the wire bow size of each cutting line segment to be basically the same, thereby further reducing the breakage rate of the cutting line.

[0008] In the above-described crystal rod cutting method, the unit length is not less than the circumference of the crystal rod, and the projections of the crystal rods onto the cutting line do not overlap. It is understood that at least two crystal rods need to be arranged for cutting at one unit length, assuming that half the circumference of each crystal rod is connected to the cutting line for cutting; that is, one unit length of the cutting line is at least not less than the circumference of the crystal rod. Regarding the projections of the crystal rods onto the cutting line, if the projections of two crystal rods onto the cutting line partially or completely overlap, it is difficult to cut these two crystal rods simultaneously.

[0009] In the above-mentioned crystal rod cutting method, the acquisition of the wire bow information of the cutting line includes the following methods: acquisition by capturing images through the first imaging unit, and / or acquisition by detection through the detection unit.

[0010] It is understandable that the first imaging unit can be a high-precision camera. The first imaging unit can be driven by a linear drive unit to move and capture the bow at various positions on the cutting line. In actual acquisition, one or more first imaging units can be configured on both sides of the radial direction of the cutting line, and a vertical drive mechanism can be configured for the first imaging unit to adjust the height position of the first imaging unit and better capture the cutting line at different height positions. As another implementation method, bow information can also be obtained by detection through a detection unit. For example, the lowest or highest point of the crystal rod can be detected by a photoelectric sensor to indirectly obtain bow information. In some embodiments, the first imaging unit or the detection unit can capture the contact points between each crystal rod and the cutting line to calculate the bow value.

[0011] In the above-mentioned crystal rod cutting method, adjusting the crystal rod feed speed according to the wire bow information includes the following steps: dividing the wire bow into at least two different numerical ranges, and configuring different crystal rod feed speeds for the two numerical ranges respectively; wherein, a smaller crystal rod feed speed is configured for the larger numerical range of the wire bow.

[0012] Understandably, once the bow length exceeds a certain value, the probability of wire breakage will increase rapidly. As the ingot feeds a certain distance towards the cutting line, the bow length gradually approaches the breakage threshold. At this point, ingot feeding should be stopped or the ingot feed speed reduced to zero. When the bow length is small, the cutting line can still withstand a relatively fast ingot feed speed. It should be noted that in some implementations, to reduce the breakage rate, the wire feed speed can also be reduced when the bow length exceeds a set value.

[0013] In the above-described crystal rod cutting method, the numerical ranges of the wire bows are set as X1, X2, and X3, respectively, and the corresponding crystal rod feed speeds for the wire bows X1, X2, and X3 are V1, V2, and V3, respectively. Specifically, the setting range for X1 is X1 < 10 mm, the setting range for X2 is 10 mm ≤ X2 < 20 mm, and the setting range for X3 is X3 ≥ 20 mm. The setting range for V1 is 5 mm / s to 10 mm / s, the setting range for V2 is 2 mm / s to 4.5 mm / s, and the setting range for V3 is -10 mm / s to 0 mm / s.

[0014] Understandably, when the wire bow is within the X1 range, the ingot can be fed quickly at a speed of V1. When the wire bow is within the X2 range, the ingot can be fed at a normal speed of V2. When the wire bow is within the X3 range, the ingot needs to be fed at a low speed of V3, or even fed in reverse to adjust the wire bow size and prevent the wire from breaking during cutting.

[0015] In the above-mentioned crystal rod cutting method, adjusting the feed position of the crystal rod according to the bow information includes the following steps: judging and comparing the size of the bow of the cutting line generated by adjacent crystal rods, so that the crystal rod with the smaller bow is fed towards the crystal rod with the larger bow.

[0016] Understandably, by judging the size of the arcuate curves generated by adjacent crystal rods, the position of one of the crystal rods can be moved to reduce the arcuate curves generated by its adjacent crystal rods, thereby improving the stability of the cutting process and reducing the breakage rate of the cutting line. In actual cutting, considering that the diameters of the crystal rods are not necessarily equal and the distribution of the crystal rods is not necessarily uniform, the position of the crystal rod can be adjusted by judging the size of the arcuate curves, so that the arcuate curves of each segment on the cutting line do not exceed their elastic deformation range.

[0017] The above-mentioned crystal rod cutting method also includes the following steps: obtaining the feeding direction information of the cutting line, and adjusting the feeding angle of the crystal rod according to the feeding direction information of the cutting line.

[0018] It is understandable that configuring the ingot feeding direction and the dicing wire conveying direction to be close to each other can significantly improve the ingot cutting efficiency. There are many ways to obtain the dicing wire conveying direction information. For example, the dicing wire is generally arranged between two main rollers, and the conveying direction of the dicing wire can be obtained by obtaining the rotation direction of the main rollers. The preferred range for setting the ingot feeding angle is 30° to 150°.

[0019] The above-mentioned crystal rod cutting method further includes the following steps: obtaining the position information of the cutting line entering the crystal rod; adjusting the feed speed and / or position of the crystal rod according to the position information of the cutting line entering the crystal rod.

[0020] Understandably, the diameter and position of the crystal ingot, as well as the bow size of the cutting line, all affect cutting efficiency, which can easily lead to inconsistent cutting depths among the ingots. Inconsistent cutting depths reduce overall cutting efficiency. To ensure that the cutting depths of all ingots remain relatively consistent and that cutting is completed synchronously, it is necessary to adjust the ingot feed speed and / or position. For example, when an ingot cuts too deeply, its feed speed can be reduced or it can be reversed to decrease the resistance to the cutting line at that point, allowing it to continue feeding once other ingots have cut to the same depth, thus improving overall cutting efficiency.

[0021] In the above-mentioned crystal rod cutting method, the position information of the cutting line entering the crystal rod is obtained by capturing images with a second imaging unit. The brightness of the imaging area and / or the imaging angle of the second imaging unit are adjusted according to the image clarity captured by the second imaging unit.

[0022] Understandably, the imaging unit captures the positions of the cutting lines at both ends of the crystal rod's slit to determine the depth to which the cutting lines penetrate the crystal rod. Furthermore, due to the influence of cutting dust or other factors on the shooting scene, unclear pixel areas can be identified by analyzing various elements in the image. To make these unclear pixel areas clearer, an illumination unit can be added. This illumination unit can adjust its angle and / or brightness to target the shooting area with light of varying intensities. Similarly, the second imaging unit can also adjust its angle to focus on unclear areas in the image and retake the shot.

[0023] In the above-described crystal rod cutting method, after the steps of adjusting the feed speed and / or position of the crystal rod: obtaining the position information of the crystal rod; determining whether the crystal rod exceeds the initial arrangement range; and controlling the crystal rod to continue feeding, stop feeding, or reset according to the determination result.

[0024] For a situation where the crystal rod exceeds the initial arrangement range, it can be understood that there is a gap in the crystal rod within one unit length along the cutting line. That is, a crystal rod was originally arranged within this unit length, but after the position of the crystal rod was adjusted, it has exceeded the initial arrangement range. For example, if the determination result is that the crystal rod exceeds the initial arrangement range, the crystal rod is controlled to stop feeding or reset. If the determination result is that the crystal rod does not exceed the initial arrangement range, the crystal rod is controlled to continue feeding or stop feeding.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. By arranging at least one crystal rod on each side of the radial direction of the cutting line, the forces between adjacent crystal rods are opposite in direction, which can reduce the force on the cutting line in a single direction and thus reduce the breakage rate of the cutting line.

[0027] 2. By acquiring the wire bow information of the cutting wire and adjusting the feed speed and / or position of the crystal rod according to the wire bow information, the wire breakage rate can be further reduced.

[0028] 3. By adjusting the brightness of the shooting area and / or the shooting angle of the second shooting unit, the accuracy of image acquisition is improved, thereby improving the accuracy of cutting control;

[0029] 4. By pausing / slowing down the feed of the crystal rod that cuts deeper into the cutting line, the resistance to the cutting line at a certain position is reduced, the cutting efficiency of other crystal rods is increased, and the cutting depth of each crystal rod can be kept basically consistent. Attached Figure Description

[0030] Figure 1 This is a schematic flowchart of Embodiment 1 of the crystal rod cutting method of the present invention;

[0031] Figure 2 This is a flowchart of S300 in this invention. Figure 1 ;

[0032] Figure 3 This is a flowchart of S300 in this invention. Figure 2 ;

[0033] Figure 4 This is a schematic flowchart of Embodiment 2 of the crystal rod cutting method of the present invention;

[0034] Figure 5 This is a schematic flowchart of Embodiment 3 of the crystal rod cutting method of the present invention;

[0035] Figure 6 This is a simplified schematic diagram of the application of the present invention to a cutting structure;

[0036] Figure 7 This is a simplified schematic diagram of the present invention after applying the feeding device;

[0037] In the diagram, 100 is the cutting line; 200 is the crystal rod; 300 is the first imaging unit; 400 is the detection unit; 500 is the second imaging unit; 600 is the illumination unit; 700 is the feeding device; and 800 is the main roller. Detailed Implementation

[0038] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0044] Please refer to the attached diagram in the instruction manual. Figure 1 and Figure 6 The crystal rod cutting method of this application specifically includes the following steps:

[0045] S100. Set a unit length, and within each unit length interval of the cutting line 100, arrange at least one crystal rod 200 on each side of the radial direction of the cutting line 100.

[0046] S200a: Feed each crystal rod 200 to abut against the cutting line 100 and obtain the bow information of the cutting line 100;

[0047] S300a. Adjust the feed speed and / or position of the crystal rod 200 according to the bow information.

[0048] It is understandable that by arranging at least one crystal rod 200 on each side of the radial direction of the cutting line 100, the forces acting between adjacent crystal rods 200 are opposite in direction, which can reduce the force on the cutting line 100 in a single direction, thereby reducing the breakage rate of the cutting line 100. Furthermore, based on real-time detection of the arcing information of the cutting line 100, the force situation of each segment of the cutting line 100 containing each crystal rod 200 can be simulated, such as whether it is relaxed. The feed speed can be increased, maintained, or decreased, or the feed position of the crystal rod 200 can be adjusted to adjust the arcing size of the corresponding crystal rod 200, controlling the arcing size of each segment of the cutting line 100 to be basically the same, thereby further reducing the breakage rate of the cutting line 100. See also Figure 7 The feeding of the crystal rod 200 can be achieved by the feeding device 700, which is generally an electric cylinder or a hydraulic cylinder.

[0049] Furthermore, one unit length is not less than the circumference of the crystal rod 200. It can be understood that at least two crystal rods 200 need to be arranged for cutting to one unit length. Assuming that half of the circumference of each crystal rod 200 is connected to the cutting line 100 for cutting, that is, one unit length of the cutting line 100 is at least not less than the circumference of the crystal rod 200.

[0050] In some embodiments, the bow information of the cutting line 100 is acquired by capturing images with the first imaging unit 300 and / or by detecting images with the detection unit 400. It is understood that the first imaging unit 300 can be a high-precision camera, and can be driven by a linear drive unit to move and capture images of the bow at various positions on the cutting line 100. In practice, one or more first imaging units 300 can be configured on both sides of the cutting line 100 in the radial direction, and a vertical drive mechanism can be configured for the first imaging unit 300 to adjust its height and position, thus better capturing images of the cutting line 100 at different heights. Alternatively, the bow information can also be acquired through detection by the detection unit 400. In some embodiments, the first imaging unit 300 or the detection unit 400 can capture the contact points between each crystal rod 200 and the cutting line 100, thereby calculating the bow value.

[0051] See Figure 2 Adjusting the feed speed of the crystal rod 200 based on the bow information includes the following steps:

[0052] S310a. Divide the arc length into at least two distinct numerical ranges, and configure different ingot 200 feed speeds for each range; the range with a larger arc length is configured with a smaller ingot 200 feed speed. It is understood that once the arc length exceeds a certain value, the probability of wire breakage of the cutting wire 100 will increase rapidly. When the arc length generated after the ingot 200 has fed a certain distance towards the cutting wire 100 gradually approaches the breakage threshold, the ingot 200 feed should be stopped or the ingot 200 feed speed reduced to 0. When the arc length is small, the cutting wire 100 can still withstand a relatively fast ingot 200 feed speed.

[0053] The numerical ranges of the wire bow are set as X1, X2, and X3, and the corresponding feed speeds of the crystal ingot 200 for the wire bows X1, X2, and X3 are V1, V2, and V3, respectively. Specifically, the setting range for X1 is X1 < 10 mm, the setting range for X2 is 10 mm ≤ X2 < 20 mm, and the setting range for X3 is X3 ≥ 20 mm. The setting range for V1 is 5 mm / s to 10 mm / s, the setting range for V2 is 2 mm / s to 4.5 mm / s, and the setting range for V3 is -10 mm / s to 0 mm / s. It can be understood that when the wire bow is within the X1 range, the crystal ingot 200 can be fed quickly at the V1 speed; when the wire bow is within the X2 range, the crystal ingot 200 can be fed at the normal V2 speed; and when the wire bow is within the X3 range, the crystal ingot 200 needs to be fed at the low speed of V3, or even fed in reverse, to adjust the wire bow size and prevent the cutting wire 100 from breaking.

[0054] See Figure 3Adjusting the feed position of the crystal rod 200 based on the bow information includes the following steps:

[0055] S310b: Determine and compare the size of the arc of the cutting line 100 generated by adjacent crystal rods 200, and feed the crystal rod 200 with the smaller arc towards the crystal rod 200 with the larger arc. It can be understood that by determining the size of the arc generated by adjacent crystal rods 200, the position of one of the crystal rods 200 is moved, reducing the arc generated by its adjacent crystal rods 200, thereby improving the stability of the cutting process and reducing the breakage rate of the cutting line 100. In specific cutting operations, considering that the diameters of the crystal rods 200 are not necessarily equal, and the positional distribution of the crystal rods 200 is not necessarily uniform, the position of the crystal rod 200 can be adjusted by determining the arc size, so that the arc of each segment on the cutting line 100 does not exceed its elastic deformation range.

[0056] See Figure 4 The crystal rod 200 cutting method of this application also includes the following steps:

[0057] S200b: Obtain the conveying direction information of the cutting line 100;

[0058] S300b: Adjust the feed angle of the crystal ingot 200 according to the conveying direction information of the cutting wire 100. It is understood that configuring the feed direction of the crystal ingot 200 and the conveying direction of the cutting wire 100 to be close to each other can significantly improve the cutting efficiency of the crystal ingot 200. There are many ways to obtain the conveying direction information of the cutting wire 100. For example, the cutting wire 100 is generally arranged between two main rollers 800, and the conveying direction of the cutting wire 100 can be obtained by obtaining the rotation direction of the main rollers 800. The preferred range for setting the feed angle of the crystal ingot 200 is 30° to 150°.

[0059] See Figure 5 The crystal rod 200 cutting method of this application also includes the following steps:

[0060] S220c: Obtain the position information of the cutting line 100 cutting into the crystal rod 200;

[0061] S300c: Based on the position information of the cutting line 100 entering the crystal ingot 200, adjust the feed speed and / or position of the crystal ingot 200. It is understood that the diameter and position of the crystal ingot 200, as well as the bow size of the cutting line 100, all affect the cutting efficiency, thus easily causing inconsistent cutting depths among the crystal ingots 200 during cutting. Inconsistent cutting depths of the crystal ingots 200 lead to a decrease in overall cutting efficiency. To ensure that the cutting depths of each crystal ingot 200 remain basically consistent and that cutting is completed synchronously, it is necessary to adjust the feed speed and / or position of the crystal ingots 200. For example, when a certain crystal ingot 200 cuts too deeply, its feed speed can be reduced or it can be fed in reverse to reduce the resistance of that position to the cutting line 100, allowing it to continue feeding when other crystal ingots 200 cut to the same depth, thereby improving the overall cutting efficiency.

[0062] The position information of the cutting line 100 entering the crystal rod 200 is obtained by capturing images with the second imaging unit 500. Based on the image clarity acquired by the second imaging unit 500, the brightness of the shooting area and / or the shooting angle of the second imaging unit 500 are adjusted. It can be understood that the depth of the cutting line 100 entering the crystal rod 200 is obtained by capturing the positions of the cutting lines 100 at both ends of the cut. Furthermore, due to the influence of cutting dust or other factors on the shooting scene, unclear pixel areas are identified by analyzing various elements in the image. To make these unclear pixel areas clear, an illumination unit 600 can be added. The illumination unit 600 can adjust its angle and / or brightness to align light of different brightness levels with the shooting area. Similarly, the second imaging unit 500 can also adjust its angle to focus on unclear areas in the image and re-capture the image.

[0063] See Figure 1 or Figure 5 After adjusting the feed speed and / or position of the crystal ingot 200:

[0064] S400: Obtain the position information of the crystal rod 200; determine whether the crystal rod 200 exceeds the initial arrangement range; based on the determination result, control the crystal rod 200 to continue feeding, stop feeding, or reset.

[0065] For "exceeding the initial arrangement range," it can be understood that within one unit length on the cutting line 100, there is a gap in the crystal rod 200. That is, there was originally a crystal rod 200 arranged within that unit length, but after the position of the crystal rod 200 is adjusted, it exceeds the initial arrangement range. For example, if the determination result is that the crystal rod 200 exceeds the initial arrangement range, the crystal rod 200 is controlled to stop feeding or reset. If the determination result is that the crystal rod 200 does not exceed the initial arrangement range, the crystal rod 200 is controlled to continue feeding or stop feeding.

[0066] Beneficial effects: By arranging at least one crystal rod 200 on each side of the radial direction of the cutting line 100, the forces between adjacent crystal rods 200 are opposite, which reduces the force on the cutting line 100 in a single direction, thereby reducing the breakage rate of the cutting line 100; by acquiring the bow information of the cutting line 100 and adjusting the feed speed and / or position of the crystal rods 200 according to the bow information, the breakage rate is further reduced; by adjusting the brightness of the imaging area and / or the imaging angle of the second imaging unit 500, the accuracy of image acquisition is improved, thereby improving the cutting control accuracy; by pausing / slowing down the feed of the crystal rods 200 that have cut deeper into the cutting line 100, the resistance to the cutting line 100 at a certain position is reduced, the cutting efficiency of other crystal rods 200 is increased, and the cutting depth of each crystal rod 200 can be controlled to remain basically consistent.

[0067] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A method of cutting a boule, comprising: The method comprises the following steps: Setting a unit length, arranging at least one crystal bar (200) on both sides of the cutting line (100) in the radial direction of the cutting line (100) every 1 unit length, the total number of crystal bars (200) is not less than 3, and each crystal bar (200) can be independently controlled; Feeding each crystal bar (200) to the cutting line (100) to obtain the line bow information of the cutting line (100); Adjusting the feeding speed and position of the crystal bar (200) according to the line bow information, which comprises the following steps: comparing the line bow size of the adjacent crystal bar (200) to make the crystal bar (200) that generates smaller line bow feed towards the crystal bar (200) that generates larger line bow.

2. The method of claim 1, wherein, The 1 unit length is not less than the circumference of the crystal bar (200), and the projections of the crystal bars (200) on the cutting line (100) do not overlap.

3. The method of claim 1, wherein the step of cutting the ingot is performed by a wire sawing method. The line bow information of the cutting line (100) is obtained by the following methods: through a first shooting unit (300) and / or a detection unit (400).

4. The method of claim 1, wherein, Adjusting the feeding speed of the crystal bar (200) according to the line bow information, which comprises the following steps: dividing the line bow into at least two different numerical ranges, and configuring different feeding speeds of the crystal bar (200) for the two numerical ranges; wherein the numerical range with larger line bow is configured with smaller feeding speed of the crystal bar (200).

5. The method of claim 4, wherein the step of cutting the ingot is performed by a wire sawing method. The numerical ranges of the line bow are set as X1, X2 and X3, and the feeding speeds of the crystal bar (200) corresponding to the line bows X1, X2 and X3 are V1, V2 and V3 in turn; wherein the set range of X1 is X1<10mm, the set range of X2 is 10mm≤X2<20mm, and the set range of X3 is X3≥20mm; the set range of V1 is 5mm / s~10mm / s, the set range of V2 is 2mm / s~4.5mm / s, and the set range of V3 is -10mm / s~0mm / s.

6. The method of claim 1, wherein, Further comprising the following steps: Obtaining the conveying direction information of the cutting line (100), and adjusting the feeding angle of the crystal bar (200) according to the conveying direction information of the cutting line (100).

7. The method of claim 1, wherein the step of cutting the ingot is performed by a wire sawing method. Further comprising the following steps: Obtaining the position information of the cutting line (100) cutting into the crystal bar (200); and adjusting the feeding speed and / or position of the crystal bar (200) according to the position information of the cutting line (100) cutting into the crystal bar (200).

8. The method of claim 7, wherein the step of cutting the ingot is performed by a wire sawing method. The position information of the cutting line (100) cutting into the crystal bar (200) is obtained by a second shooting unit (500), and the brightness of the shooting area and / or the shooting angle of the second shooting unit (500) is adjusted according to the image clarity obtained by the second shooting unit (500).

9. The method of claim 7, wherein the step of cutting the ingot is performed by a wire sawing method. After the step of adjusting the feeding speed of the crystal bar (200) and / or the position of the crystal bar (200): Obtaining the position information of the crystal bar (200); Judging whether the crystal bar (200) exceeds the initial arrangement range; According to the judgment result, the crystal bar (200) is controlled to continue feeding or stop feeding or reset.

Images