Liquid cooling heat dissipation structure and electronic equipment

Abstract

The application relates to the electronic field and discloses a liquid cooling heat dissipation structure and electronic equipment. The liquid cooling heat dissipation structure comprises a base provided with a containing cavity, the containing cavity comprises a liquid-containing area at the bottom, a liquid storage tank storing cooling liquid, a liquid injection pipe comprising a liquid inlet communicated with the liquid storage tank and a liquid outlet facing the liquid-containing area, a heat dissipation element, the lower part of which is immersed in the cooling liquid in the liquid-containing area, and the upper part of which is exposed above the liquid-containing area, a return heat pipe provided with a liquid outlet hole and a return port communicated with each other, the liquid outlet hole is located above the heat dissipation element and faces the heat dissipation element, and the return port is used for connecting the outlet end of the heat pipe in a target heat dissipation object, an outflow heat pipe provided with a liquid suction hole and an outflow port communicated with each other, the liquid suction hole is immersed in the cooling liquid in the liquid-containing area, and the outflow port is used for connecting the inlet end of the heat pipe in the target heat dissipation object, and a liquid pump drivingly connected with the outflow heat pipe. The application can effectively improve the heat dissipation performance, guarantee the working performance of the electronic equipment and prolong the service life of the electronic equipment.

Description

Technical Field

[0001] This invention relates to the field of electronic technology, and in particular to a liquid cooling heat dissipation structure and electronic device. Background Technology

[0002] With the continuous development of electronic technology, the heat dissipation of electronic devices is constantly increasing. Overheating of electronic devices will lead to a series of problems, such as affecting the lifespan of the electronic devices and the stability of the entire system. As heat dissipation environments become increasingly demanding, electronic heat dissipation technology has become a bottleneck that seriously restricts the development of electronic technology.

[0003] Currently, high-end gaming laptops and other electronic devices typically use external cooling systems for heat dissipation. These systems use heat pipes to deliver coolant to the inside of the device to absorb heat, then output the cooled coolant through the heat pipes. As the coolant passes through the heatsink and fin, the heat dissipates through the heat pipe walls. Airflow then cools the heatsink and fin. The cooled coolant in the heat pipes flows to the reservoir and is then recycled back into the device. This cooling solution does not fully utilize the advantages of water cooling, and its performance urgently needs improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a liquid cooling heat dissipation structure and electronic device to improve heat dissipation performance.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A liquid cooling heat dissipation structure, comprising:

[0007] A base, the base being provided with a receiving cavity, the receiving cavity including a liquid-containing area located at its bottom for receiving coolant;

[0008] A liquid storage tank is installed outside the liquid-containing area and stores coolant inside;

[0009] The injection tube includes an inlet communicating with the storage tank and an outlet facing the liquid-containing area;

[0010] A heat dissipation element, wherein the lower part of the heat dissipation element is immersed in the coolant in the liquid-containing area, and the upper part of the heat dissipation element is exposed above the liquid-containing area;

[0011] A reflux heat pipe is provided with a liquid outlet and a reflux port connected to each other. The liquid outlet is located above the heat dissipation element and faces the heat dissipation element. The reflux port is used to connect to the outlet end of the heat pipe inside the target heat dissipation object.

[0012] An outflow heat pipe is provided with a liquid suction hole and an outflow port that are connected to each other. The liquid suction hole is immersed in the coolant in the liquid-containing area, and the outflow port is used to connect to the inlet end of the heat pipe inside the target heat dissipation object.

[0013] A liquid pump, which is driven by the outflow heat pipe;

[0014] The controller is used to control the liquid storage tank to inject a preset amount of coolant into the liquid-containing area of ​​the base through the injection pipe, and to control the liquid pump to drive the outflow heat pipe to draw coolant from the liquid-containing area of ​​the base and output it to the heat pipe inside the target heat dissipation object.

[0015] Optionally, the heat dissipation element includes multiple heat dissipation fins arranged vertically and side by side, with gaps between adjacent heat dissipation fins.

[0016] Optionally, the heat dissipation element further includes: a first heat pipe mounting position located at the top of the heat dissipation fins, and a second heat pipe mounting position located at the bottom of the heat dissipation fins; the return heat pipe is mounted at the first heat pipe mounting position, and the outflow heat pipe is mounted at the second heat pipe mounting position.

[0017] Optionally, the number of liquid outlet holes on the reflux heat pipe and / or liquid suction holes on the effluent heat pipe is multiple, and they are arranged sequentially at intervals along the arrangement direction of the heat dissipation fins.

[0018] Optionally, the receiving cavity of the base further includes an air cavity channel located above the liquid-containing area, and a fan is provided in the air cavity channel; the upper part of the heat dissipation element is located in the air cavity channel.

[0019] Optionally, the air inlet and outlet of the air cavity flow channel are respectively provided with dustproof and breathable covers.

[0020] Optionally, the air cavity flow channel has an arc-shaped structure, and the receiving cavity of the base further includes a first mounting cavity and a second mounting cavity, both located inside the inner ring of the air cavity flow channel. The controller is installed in the first mounting cavity, and the liquid storage tank is installed in the second mounting cavity.

[0021] Optionally, the dustproof and ventilated cover, the controller, and the liquid storage tank are arranged in a straight line.

[0022] Optionally, the fan is installed inside the dustproof and breathable cover at the air inlet of the air cavity channel.

[0023] An electronic device includes a target heat dissipation object and a liquid cooling heat dissipation structure as described in any of the above.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] In this embodiment of the invention, the coolant supplied to the target heat dissipation object consists of two parts: a portion is the coolant that has been cooled by the heat dissipation element and a portion is the coolant that is directly injected into the liquid-containing area of ​​the base from the storage tank. The mixed application of these two parts of coolant not only realizes the recycling of part of the coolant, but also, since the coolant that was originally left in the liquid-containing area has a lower heat value than the coolant that was returned, it can further reduce the heat of the returned coolant, thereby improving the final heat dissipation performance. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is an assembly structure diagram of the liquid cooling heat dissipation structure provided in an embodiment of the present invention.

[0028] Figure 2 This is a cross-sectional view of the liquid cooling structure provided in an embodiment of the present invention.

[0029] Figure 3 An assembly structure diagram of the liquid cooling heat dissipation structure provided in an embodiment of the present invention, located inside the base;

[0030] Figure 4 An assembly structure diagram of the heat dissipation element and heat pipe of the liquid cooling heat dissipation structure provided in the embodiment of the present invention;

[0031] Figure 5 This is a structural diagram of the reflux heat pipe and the outflow heat pipe provided in an embodiment of the present invention;

[0032] Figure 6 A schematic diagram illustrating the heat dissipation principle of the liquid cooling structure provided in an embodiment of the present invention.

[0033] Illustration:

[0034] 1. Base, 11. Liquid-containing area, 12. Air cavity flow channel, 2. Liquid storage tank, 3. Liquid injection pipe, 4. Heat dissipation element, 41. Heat dissipation fins, 5. Return heat pipe, 51. Liquid outlet, 52. Return port, 6. Outflow heat pipe, 61. Liquid suction hole, 62. Outflow port, 7. Liquid pump, 8. Controller, 9. Dustproof and breathable cover, 10. Fan. Detailed Implementation

[0035] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0036] Example 1

[0037] To improve heat dissipation performance, please refer to Figures 1 to 6 This invention provides a liquid cooling heat dissipation structure, comprising:

[0038] The base 1 is provided with a receiving cavity, the receiving cavity including a liquid-containing area 11 located at its bottom for receiving coolant;

[0039] A liquid storage tank 2 is installed outside the liquid-containing area 11 and stores coolant inside.

[0040] The injection pipe 3 includes an inlet connected to the storage tank 2 and an outlet facing the liquid-containing area 11;

[0041] Heat dissipation element 4, the lower part of which is immersed in the coolant in the liquid-containing zone 11, and the upper part of which is exposed above the liquid-containing zone 11;

[0042] The reflux heat pipe 5 has a liquid outlet 51 and a reflux port 52 connected to each other. The liquid outlet 51 is located above the heat dissipation element 4 and faces the heat dissipation element 4. The reflux port 52 is used to connect to the outlet end of the heat pipe inside the target heat dissipation object.

[0043] Outflow heat pipe 6, the outflow heat pipe 6 is provided with a liquid suction hole 61 and an outlet 62 connected to each other, the liquid suction hole 61 is immersed in the coolant in the liquid-containing area 11, and the outlet 62 is used to connect to the inlet end of the heat pipe inside the target heat dissipation object.

[0044] Liquid pump 7, which drives the outflow heat pipe 6;

[0045] The controller 8 is used to control the liquid storage tank 2 to inject a preset amount of coolant into the liquid-containing area 11 of the base 1 through the liquid injection pipe 3, and to control the liquid pump 7 to drive the outflow heat pipe 6 to draw coolant from the liquid-containing area 11 of the base 1 and output it to the heat pipe inside the target heat dissipation object.

[0046] The working principle of the above liquid cooling heat dissipation structure is as follows:

[0047] Coolant is injected into the storage tank 2, and a certain amount of coolant is injected into the liquid-containing area 11 of the base 1 through the injection pipe 3, so that the heat dissipation element 4 is partially immersed in the coolant and partially exposed to the outside of the coolant.

[0048] The liquid pump 7 drives the outflow heat pipe 6 to draw coolant from the liquid-containing area 11 through the liquid suction hole 61 and output it to the interior of the target heat dissipation object, so that the output coolant absorbs the excess heat generated inside the target heat dissipation object and achieves the purpose of heat dissipation.

[0049] After absorbing heat, the coolant flows back into the return heat pipe 5 through the return port 52, and flows out to the surface of the heat dissipation element 4 through the liquid outlet 51 of the return heat pipe 5, where the heat dissipation element 4 cools the returned coolant.

[0050] After being cooled by the heat dissipation element 4, the returned coolant will flow back to the liquid-containing area 11 of the base 1 for recycling.

[0051] In summary, in this embodiment of the invention, the coolant supplied to the target heat dissipation object consists of two parts: one part is the coolant that has been cooled by the heat dissipation element 4 after being returned, and the other part is the coolant that is directly injected into the liquid-containing area 11 of the base 1 from the liquid storage tank 2. The mixed application of these two parts of coolant not only realizes the recycling of part of the coolant, but also, since the coolant that was originally left in the liquid-containing area 11 has a lower heat than the returned coolant, it can further reduce the heat of the returned coolant, thereby improving the final heat dissipation performance.

[0052] The heat dissipation element 4 can be a copper heat dissipation plate or heat dissipation fins 41. In practical applications, one or a combination of them can be used, and the specific application is not limited. In an optional embodiment, the heat dissipation element 4 includes multiple heat dissipation fins 41 arranged vertically and side by side, with gaps between adjacent heat dissipation fins 41. Based on this, gaps are left between each heat dissipation fin 41, which serve as flow channels for the returning coolant. At this time, since the returning coolant flows downward through the multiple flow channels provided by the heat dissipation element 4, the effective contact area between the coolant and the heat dissipation fins 41 is increased, thus effectively ensuring the heat dissipation effect of the heat dissipation element 4 on the returning coolant.

[0053] To improve assembly convenience, the heat dissipation element 4 also includes: a first heat pipe mounting position located at the top of the heat dissipation fins 41, and a second heat pipe mounting position located at the bottom of the heat dissipation fins 41; the return heat pipe 5 is installed at the first heat pipe mounting position, and the outflow heat pipe 6 is installed at the second heat pipe mounting position. In this way, the assembly operation between the return heat pipe 5, the outflow heat pipe 6, and the heat dissipation element 4 can be completed simply and quickly, and it can also ensure that the liquid outlet 51 of the return heat pipe 5 and the liquid suction hole 61 of the outflow heat pipe 6 can be aligned with the multiple flow channels provided by the heat dissipation element 4 to achieve smooth liquid outlet and liquid suction operations.

[0054] Furthermore, the number of liquid outlet holes 51 on the return heat pipe 5 and / or liquid suction holes 61 on the outflow heat pipe 6 are multiple, and they are arranged sequentially and at intervals along the arrangement direction of the heat dissipation fins 41. In this way, uniform heat dissipation can be achieved for the return coolant.

[0055] Example 2

[0056] Based on Example 1, please refer to Figures 1 to 6 In this second embodiment, the accommodating cavity of the base 1 also includes an air cavity flow channel 12 located above the liquid-containing area 11, and a fan 10 is provided in the air cavity flow channel 12; the upper part of the heat dissipation element 4 is located in the air cavity flow channel 12.

[0057] Specifically, the working process of the liquid cooling heat dissipation structure in this embodiment two is as follows:

[0058] Coolant is injected into the storage tank 2. The coolant flows into the liquid-containing zone 11 through the outlet of the injection pipe 3. A small portion of the outflow heat pipe 6, liquid pump 7 and heat dissipation element 4 are immersed in the liquid-containing zone 11. When the coolant in the liquid-containing zone 11 reaches a certain amount, water no longer flows out of the outlet of the injection pipe 3 to ensure that the air has enough space to pass through the heat dissipation element 4.

[0059] Meanwhile, the outflow heat pipe 6 has a liquid suction hole 61 in the corresponding area of ​​the heat dissipation element 4. The liquid pump 7 drives the outflow heat pipe 6 to work. The coolant in the liquid-containing area 11 is absorbed through the liquid suction hole 61 of the outflow heat pipe 6 and output. It enters the heat pipe for external connection of the target heat dissipation object through the conventional interface. After absorbing the heat in the target heat dissipation object, the coolant flows back to the return heat pipe 5 with the heat.

[0060] The return heat pipe 5 also has a liquid outlet hole 51 in the corresponding area of ​​the heat dissipation element 4. The return heat pipe 5 guides the coolant carrying heat to the heat dissipation element 4 through the liquid outlet hole 51. The fan 10 blows air through the air cavity flow channel 12 to dissipate the heat on the heat dissipation element 4. The coolant is blown by the wind as it flows from top to bottom due to gravity. Some of the coolant evaporates and dissipates, taking away a large amount of heat, while some of the coolant flows down and is recycled.

[0061] Based on this, the embodiments of the present invention can further utilize the fan 10 to blow air along the air cavity channel to remove heat from the heat dissipation element 4, on the basis of contact heat dissipation of the recirculated coolant using the heat dissipation element 4. At the same time, the coolant on the heat dissipation element 4 will partially evaporate under the action of the wind, and a large amount of heat will be further removed during the evaporation process. Therefore, the embodiments of the present invention can further improve the heat dissipation effect of the recirculated coolant, and ultimately improve the heat dissipation performance of the target heat dissipation object.

[0062] To prevent dust from entering the air cavity flow channel 12, the air inlet and air outlet of the air cavity flow channel 12 are respectively equipped with dustproof and breathable covers 9.

[0063] In one optional embodiment, the air cavity flow channel 12 has an arc-shaped structure. The receiving cavity of the base 1 further includes a first mounting cavity and a second mounting cavity, both located within the inner ring of the air cavity flow channel 12. The controller 8 is installed in the first mounting cavity, and the liquid storage tank 2 is installed in the second mounting cavity. Simultaneously, the two dustproof vent covers 9, the controller 8, and the liquid storage tank 2 are arranged in a straight line. The fan 10 is installed inside the dustproof vent cover 9 located at the air inlet of the air cavity flow channel 12. This facilitates both rapid assembly and maintenance.

[0064] Example 3

[0065] This third embodiment provides an electronic device, including a target heat dissipation object and a liquid cooling heat dissipation structure as described in embodiment one or embodiment two.

[0066] The electronic device in this embodiment can be any type of device with heat dissipation requirements, such as a laptop computer, and is not specifically limited thereto; the target heat dissipation object can be a component in the electronic device that generates a large amount of heat (such as the motherboard) and its surrounding components. Because this electronic device uses the aforementioned liquid cooling structure for heat dissipation, it can achieve a better heat dissipation effect, thereby effectively ensuring the good working performance of the electronic device and extending its service life.

[0067] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid-cooled heat dissipation structure, characterized in that, include: The base (1) is provided with a receiving cavity, the receiving cavity including a liquid-containing area (11) located at its bottom for receiving coolant; A liquid storage tank (2) is installed outside the liquid-containing area (11) and contains coolant inside; The injection tube (3) includes an inlet connected to the storage tank (2) and an outlet facing the liquid-containing area (11); Heat dissipation element (4), the lower part of which is immersed in the coolant of the liquid-containing area (11), and the upper part of which is exposed above the liquid-containing area (11); The reflux heat pipe (5) has a liquid outlet (51) and a reflux port (52) connected to each other. The liquid outlet (51) is located above the heat dissipation element (4) and faces the heat dissipation element (4). The reflux port (52) is used to connect the outlet end of the heat pipe inside the target heat dissipation object. After the refluxed coolant is cooled by the heat dissipation element (4), it flows back to the liquid-containing area 11 of the base (1) for recycling. Outflow heat pipe (6), the outflow heat pipe (6) is provided with a liquid suction hole (61) and an outlet (62) that are connected to each other. The liquid suction hole (61) is immersed in the coolant in the liquid-containing area (11), and the outlet (62) is used to connect to the inlet end of the heat pipe inside the target heat dissipation object. A liquid pump (7) is connected to the outflow heat pipe (6); The controller (8) is used to control the liquid storage tank (2) to inject a preset amount of coolant into the liquid-containing area (11) of the base (1) through the liquid injection pipe (3), and to control the liquid pump (7) to drive the outflow heat pipe (6) to draw coolant from the liquid-containing area (11) of the base (1) and output it to the heat pipe inside the target heat dissipation object.

2. The liquid cooling heat dissipation structure according to claim 1, characterized in that, The heat dissipation element (4) includes multiple heat dissipation fins (41) arranged vertically and side by side, with gaps between adjacent heat dissipation fins (41).

3. The liquid cooling heat dissipation structure according to claim 2, characterized in that, The heat dissipation element (4) further includes: a first heat pipe mounting position located at the top of the heat dissipation fin (41), and a second heat pipe mounting position located at the bottom of the heat dissipation fin (41); the return heat pipe (5) is mounted at the first heat pipe mounting position, and the outflow heat pipe (6) is mounted at the second heat pipe mounting position.

4. The liquid cooling heat dissipation structure according to claim 3, characterized in that, The number of liquid outlet holes (51) on the return heat pipe (5) and / or liquid suction holes (61) on the outflow heat pipe (6) are multiple, and they are arranged sequentially at intervals along the arrangement direction of the heat dissipation fins (41).

5. The liquid cooling heat dissipation structure according to claim 1, characterized in that, The accommodating cavity of the base (1) also includes a wind cavity channel (12) located above the liquid-containing area (11), and a fan (10) is provided in the wind cavity channel (12); the upper part of the heat dissipation element (4) is located in the wind cavity channel (12).

6. The liquid cooling heat dissipation structure according to claim 5, characterized in that, The air inlet and outlet of the air cavity flow channel (12) are respectively provided with dustproof and breathable covers (9).

7. The liquid cooling heat dissipation structure according to claim 6, characterized in that, The air cavity flow channel (12) has an arc-shaped structure. The accommodating cavity of the base (1) also includes a first mounting cavity and a second mounting cavity, both located inside the inner ring of the air cavity flow channel (12). The controller (8) is installed in the first mounting cavity, and the liquid storage tank (2) is installed in the second mounting cavity.

8. The liquid cooling heat dissipation structure according to claim 7, characterized in that, The dustproof and breathable cover (9), the controller (8), and the liquid storage tank (2) are arranged in a straight line.

9. The liquid cooling heat dissipation structure according to claim 6, characterized in that, The fan (10) is installed inside the dustproof and breathable cover (9) at the air inlet of the air cavity channel (12).

10. An electronic device, characterized in that, It includes the target heat dissipation object and the liquid cooling heat dissipation structure as described in any one of claims 1 to 9.

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