Slurry polishing equipment for silicon wafer production

Abstract

The present invention discloses a slurry grinding device for silicon wafer production, comprising a grinding device body, wherein the grinding device body comprises a grinding mechanism, a slurry regrinding mechanism, a preliminary grinding mechanism, grinding balls and a discharge pipe, wherein the grinding mechanism comprises a discharge port and a grinding cone, wherein the discharge port is provided with a scraper driving mechanism, wherein the scraper driving mechanism comprises a scraper, a filter plate and a second drive motor, and wherein the scraper is fixedly connected to one side end face of the discharge port. The slurry regrinding mechanism is located on one side end face of the scraper, and the slurry regrinding mechanism comprises a storage box, an extraction pump and a third regrinding slurry delivery pipe. The present application realizes that when the slurry for silicon wafer production is ground, the slurry has a grinding device that grinds the slurry multiple times to ensure that the slurry particles are of uniform size. The conductive particles after grinding can pass through the mesh smoothly, thereby improving the film-forming performance of the slurry, and at the same time, the slurry can better adhere to the silicon wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production, in particular to slurry grinding equipment for silicon wafer production. Background Art

[0002] Conductive paste is the main material of crystalline silicon solar cells. During the screen printing production process of solar cells, silver-aluminum paste must be printed first and dried, then aluminum paste must be printed and dried, and finally silver paste must be printed and dried before entering the co-firing process.

[0003] In the cost structure of solar cells, paste is the most important material affecting the cost of solar cells besides silicon wafers.

[0004] In the process of preparing conductive silver paste, common problems include uneven particle size and poor adhesion, which directly affect the performance and conductivity of the silver paste.

[0005] The size of slurry particles affects the conductivity of silicon wafers. Given the same volume, larger particles have a lower probability of contact between them, leaving more space for the non-conductive resin to occupy, thus blocking the conductive particles and reducing conductivity. Conversely, smaller particles have a higher probability of contact, improving conductivity. The effect of particle size on conductivity, as shown above, is only a relative relationship.

[0006] In the prior art, due to the influence of processing conditions and screen printing methods, the existing slurry particles have different sizes, which easily leads to the slurry not meeting the requirements, affecting the qualified rate of silicon wafers.

[0007] Therefore, the slurry must not only meet the requirements of smooth passage of particles through the mesh of the screen, but also meet the conditions for processing silver particles, so that the conductive particles can pass through the mesh smoothly and be densely deposited on the substrate to form a full conductive pattern. Summary of the Invention

[0008] The present invention aims to provide a slurry grinding device for silicon wafer production. The device can grind the slurry multiple times to ensure uniform particle size. The ground conductive particles can pass smoothly through the mesh, improving the film-forming properties of the slurry. Furthermore, the slurry can adhere better to the silicon wafer, promoting the horizontal growth of silver particles. The silver particles are in closer contact, effectively forming a conductive network. This significantly improves conductivity and increases the yield of silicon wafers.

[0009] To achieve the above objectives, embodiments of the present invention provide slurry grinding equipment for silicon wafer production, comprising a grinding equipment body, the grinding equipment body comprising a grinding mechanism, a slurry regrinding mechanism, a preliminary grinding mechanism, grinding balls, and a discharge pipe. The grinding mechanism comprises a discharge port and a grinding cone. The discharge port is provided with a scraper drive mechanism, the scraper drive mechanism comprising a scraper, a filter plate, and a second drive motor. The scraper is fixedly connected to a side end surface of the discharge port. The slurry regrinding mechanism is located on a side end surface of the scraper. The slurry regrinding mechanism comprises a storage box, an extraction pump, and a third regrinding slurry delivery pipe. The preliminary grinding mechanism is located on the upper end surface of the grinding mechanism. A pair of opposing end surfaces of the preliminary grinding mechanism are each provided with a feeding mechanism. A pair of opposing end surfaces of the preliminary grinding mechanism are each provided with a cavity. The feeding mechanism comprises a sealing door, a first feeding delivery pipe, and a pair of second feeding delivery pipes. The top end surface of the preliminary grinding mechanism is provided with a pair of feed ports. The grinding balls; the internal end surface of the preliminary grinding mechanism is provided with grinding balls, the preliminary grinding mechanism is provided with a grinding groove matching the grinding balls, the grinding balls include a grinding ball housing, a bubble pump, multiple nozzles, and a motor shaft, the upper end surface of the motor shaft is connected to a first drive motor, the ultra-fine force U-shaped ball conveying ring sprays ultra-fine force U-shaped balls into the grinding groove, the feed port is connected to the grinding groove. The feed pipe is provided between the bottom end surface of the preliminary grinding mechanism and the grinding mechanism, and the feed pipe is connected to the grinding groove.

[0010] In one or more embodiments of the present invention, the formula of the ultrafine reinforced U-shaped ball is 10-30% dissolved resin, 5-15% terpineol-ethyl cellulose system, 25-50% silver powder, 20-35% nitrocellulose, 20-40% copper ball, 1-10% polyvinyl alcohol, and 0.5-2% calcium carbonate.

[0011] In one or more embodiments of the present invention, the grinding ball also includes a base plate, which is located at the lower end surface of the inner wall of the grinding ball shell, and the bubble pump is located at the upper end surface of the base plate. The upper end surface of the bubble pump is connected to the third feed delivery pipe, and the third feed delivery pipe is connected to the first feed delivery pipe, and the first feed delivery pipe passes through a pair of cavities.

[0012] In one or more embodiments of the present invention, a solenoid valve is provided between the first feeding and conveying pipe and a pair of second feeding and conveying pipes, and the cavity stores a raw liquid having the same formula as that of the U-shaped ball.

[0013] In one or more embodiments of the present invention, a pair of ultra-fine force U-shaped ball delivery tubes are connected to the other end face of the bubble pump, and the pair of ultra-fine force U-shaped ball delivery tubes are both connected to an ultra-fine force U-shaped ball delivery ring. A plurality of nozzles are provided on the ultra-fine force U-shaped ball delivery ring, and the outer end face of the grinding ball shell is provided with a limiting hole matching the plurality of nozzles, and the nozzles are located in the limiting holes.

[0014] In one or more embodiments of the present invention, a grinding ball connecting column is provided on the upper end face of the grinding ball shell, a second connecting plate is fixedly connected to the grinding ball connecting column, the top end face of the second connecting plate is connected to the first connecting plate, and the upper end face of the first connecting plate is fixedly connected to the motor shaft.

[0015] In one or more embodiments of the present invention, the scraper abuts the filter plate, one end face of the scraper is fixedly connected to a limit plate, the limit plate is connected to a screw rod, and the other end face of the screw rod is connected to a second drive motor, and the second drive motor controls the rotation of the screw rod to drive the limit plate to move.

[0016] In one or more embodiments of the present invention, the upper end face of the storage box is fixedly connected to the third regrinding slurry delivery pipe, the upper end face of the third regrinding slurry delivery pipe is fixedly connected to the second regrinding slurry delivery pipe, one side end face of the second regrinding slurry delivery pipe is connected to the extraction pump, one side end face of the extraction pump is connected to the first regrinding slurry delivery pipe, and the other side end face of the first regrinding slurry delivery pipe is connected to one of the feed ports.

[0017] In one or more embodiments of the present invention, a groove is provided on the storage box, and the groove matches one end surface of the discharge port.

[0018] In one or more embodiments of the present invention, the preliminary grinding mechanism is provided with a liquid level sensor in the containing cavity.

[0019] Compared with the prior art, the slurry polishing equipment for silicon wafer production according to the embodiment of the present invention has the following benefits when polishing the slurry for silicon wafer production:

[0020] 1) The grinding equipment grinds the slurry multiple times to ensure that the slurry particles are of uniform size;

[0021] 2) The ground conductive particles can pass through the mesh smoothly, improving the film-forming performance of the slurry. At the same time, the slurry can better adhere to the silicon wafer, promoting the horizontal growth of silver particles, and the silver particles are in closer contact, which can effectively form a conductive network.

[0022] 3) The electrical conductivity is significantly improved and the qualified rate of silicon wafers is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The structure of the slurry grinding equipment for silicon wafer production according to one embodiment of the present invention is shown in FIG. Figure 1 ;

[0024] Figure 2 yes Figure 1 Schematic diagram of the structure at A;

[0025] Figure 3 The structure of the slurry grinding equipment for silicon wafer production according to one embodiment of the present invention is shown in FIG. Figure 2 ;

[0026] Figure 4 yes Figure 3 Schematic diagram of the structure at B;

[0027] Figure 5 Schematic diagram of the use of a slurry polishing device for silicon wafer production according to one embodiment of the present invention.

[0028] Figure 6 yes Figure 5 Schematic diagram of the structure at C;

[0029] Figure 7 is a first cross-sectional schematic diagram of a slurry polishing apparatus for silicon wafer production according to one embodiment of the present invention;

[0030] Figure 8 is a second cross-sectional view of a slurry polishing apparatus for silicon wafer production according to an embodiment of the present invention;

[0031] Figure 9 yes Figure 8 Schematic diagram of the structure at D.

[0032] Figure 10 is a cross-sectional view of the grinding ball;

[0033] Description of main reference numerals:

[0034] 1-grinding equipment body, 2-grinding mechanism, 201-feeding port, 2011-first chute, 202-grinding Kun, 3-preliminary grinding mechanism, 301-chamber, 3011-first feeding pipe, 3012-second feeding pipe, 4-solenoid valve, 5-first drive motor, 6-slurry regrinding mechanism, 601-extraction pump, 602-first regrinding slurry delivery pipe, 603-second regrinding slurry delivery pipe, 7-feeding mechanism, 8-scraper drive mechanism, 801-scraper, 8011-limiting plate, 8012-limiting plate, 802-filter plate, 803-storage box, 8031- Triple grinding slurry delivery pipe, 8032-groove, 8033-base, 804-second drive motor, 805-screw, 9-feeding port, 10-grinding ball, 1000-grinding ball shell, 1001-bubble pump, 1002-grinding ball connecting column, 1003-ultra-fine force U-shaped ball delivery ring, 10031-nozzle, 1004-ultra-fine force U-shaped ball delivery pipe, 1005-third feeding delivery pipe, 1006-motor shaft, 10061-first connecting plate, 10062-second connecting plate, 1007-grinding groove, 1008-limiting hole, 1009-bottom plate, 11-discharge pipe. DETAILED DESCRIPTION

[0035] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0036] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0037] like Figures 1 to 10 As shown, the slurry grinding equipment for silicon wafer production according to the preferred embodiment of the present invention includes a grinding equipment body 1, and the grinding equipment body 1 includes a grinding mechanism 2, a slurry re-grinding mechanism 6, a preliminary grinding mechanism 3, grinding balls 10 and a discharge pipe 11.

[0038] A pair of feed ports 9 are provided on the top end surface of the preliminary grinding mechanism 3 , so that the slurry to be ground can be transported into the preliminary grinding mechanism 3 through the feed ports 9 .

[0039] The preliminary grinding mechanism 3 is located on the upper end face of the grinding mechanism 2. The preliminary grinding mechanism 3 realizes the initial grinding of the slurry, and the grinding mechanism 2 realizes the secondary grinding of the slurry to ensure that the particle size of the slurry meets the qualified requirements. The particle size is preferably controlled at 0.2-10um.

[0040] like Figures 1 to 6As shown, the grinding mechanism 2 includes a feed port 201 and a grinding wheel 202. A scraper drive mechanism 8 is provided on the feed port 201. The scraper drive mechanism 8 includes a scraper 801, a filter plate 802 and a second drive motor 804. The scraper 801 is fixedly connected to one side end face of the feed port 201, so that the scraper drive mechanism 8 can filter the slurry after being ground by the grinding mechanism 2, and after filtering out impurities and unqualified particles, it is transported to the preliminary grinding mechanism 3 for further grinding.

[0041] Furthermore, a scraper 801 is connected to the end surface of the material discharge port 201 , and one end surface of the scraper 801 is fixedly connected to the grinding mechanism 2 .

[0042] The scraper 801 is provided with a plurality of filter holes, the size of which matches the size of the qualified slurry particles. Only qualified slurry can pass through the filter holes, thereby filtering the slurry discharged through the discharge port 201 .

[0043] The scraper 801 abuts the filter plate 802, and the scraper 801 is located on the upper end face of the filter plate 802. One end face of the scraper 801 is fixedly connected to the limit plate 8011, and the limit plate 8011 is located on the inner end face of the grinding mechanism 2, that is, the limit plate 8011 is located on the inner end face where the discharge port 201 contacts the grinding mechanism 2.

[0044] A first sliding groove 2011 is provided on the upper end surface of the discharge port 201 , and the limiting plate 8011 passes through the first sliding groove 2011 , so that the first sliding groove 2011 drives the scraper 801 to slide on the filter plate 802 .

[0045] The limiting plate 8011 is connected to a screw rod 805, and the other end face of the screw rod 805 is connected to a second drive motor 804. The second drive motor 804 controls the rotation of the screw rod 805 to drive the limiting plate 8011. Specifically, the second drive motor 804 is activated to control the rotation of the screw rod 805, thereby driving the limiting plate 8011 to move on the screw rod 805, and in turn driving the scraper 801 to move, controlling the scraper 801 to scrape away particles and impurities remaining on the filter plate 802.

[0046] The filter plate 802 is located on a side wall end surface close to the screw rod 805 and is fixedly connected to a limit plate 8012 for limiting the position of the limit plate 8011 .

[0047] The slurry regrinding mechanism 6 is located on one side end face of the filter plate 802. The slurry regrinding mechanism 6 includes a storage box 803, an extraction pump 601 and a third regrinding slurry delivery pipe 8031. The slurry regrinding mechanism 6 is used to collect impurities and unqualified slurry particles scraped off the filter plate 802 and deliver them to the feed port 9 for re-grinding until the slurry is qualified.

[0048] The upper end face of the storage box 803 is fixedly connected to a third regrinding slurry delivery pipe 8031, which is located on the end face of the filter plate 802 away from the scraper 801. The third regrinding slurry delivery pipe 8031 ​​is used to store scraped impurities and unqualified slurry particles.

[0049] The storage box 803 is provided with a groove 8032 which matches the end face of one side of the discharge port 201 , so that the scraped impurities and unqualified slurry particles fall into the storage box 803 in the groove 8032 under the action of the scraper 801 .

[0050] Preferably, an impurity filter plate is provided on the inner end face of the storage box 803 to filter large particles of impurities to the bottom end face of the storage box 803, and unqualified slurry particles are located on the upper end face of the impurity filter plate. The third re-grinding slurry delivery pipe 8031 ​​is located on the upper end face of the impurity filter plate.

[0051] The upper end face of the third regrinding slurry delivery pipe 8031 ​​is fixedly connected to the second regrinding slurry delivery pipe 603. One end face of the second regrinding slurry delivery pipe 603 is connected to the extraction pump 601. One end face of the extraction pump 601 is connected to the first regrinding slurry delivery pipe 602. The other end face of the first regrinding slurry delivery pipe 602 is connected to one of the feed ports 9. By activating the extraction pump 601, the second and third regrinding slurry delivery pipes 603 and 8031 ​​are controlled to transport unqualified slurry particles in the storage box 803, and then transported to the feed port 9 through the first regrinding slurry delivery pipe 602 for regrinding.

[0052] The bottom of the storage box 803 is in contact with a base 8033 , and the base 8033 is fixedly connected to one end surface of the grinding mechanism 2 for supporting the storage box 803 .

[0053] Specifically, when the slurry to be ground enters through the feed port 9 and is ground by the grinding mechanism 2 and the preliminary grinding mechanism 3, it enters the discharge port 201 for discharge. The filter plate 802 on the discharge port 201 filters impurities and unqualified slurry, and the qualified slurry enters the next process.

[0054] At the same time, the second drive motor 804 is started to drive the scraper 801 to scrape off the residual impurities and unqualified slurry on the filter plate 802, and move it to the upper end face of the filter plate 802 located in the storage box 803. The residual impurities and unqualified slurry enter the storage box 803 through the groove 8032 for storage.

[0055] The storage box 803 separates impurities and unqualified slurry, and the third re-grinding slurry delivery pipe 8031 ​​delivers the unqualified slurry located above the impurity filter plate to the feed port 9 through the extraction pump 601 for re-grinding until the slurry is qualified.

[0056] like Figures 7 to 10 As shown, the inner end surface of the preliminary grinding mechanism 3 is provided with a grinding ball 10 , a grinding groove 1007 matching the grinding ball 10 is opened in the preliminary grinding mechanism 3 , and the feed port 9 is connected to the grinding groove 1007 .

[0057] The grinding ball 10 includes a grinding ball shell 1000, a bubble pump 1001, multiple nozzles 10031 and a motor shaft 1006. The upper end face of the motor shaft 1006 is connected to a first drive motor 5, which drives the grinding ball 10 to rotate in the grinding groove 1007 of the preliminary grinding mechanism 3 through the first drive motor 5, thereby performing preliminary grinding on the slurry located in the grinding groove 1007.

[0058] The grinding time of the bubble pump 1001 is set to 20-30 minutes, and the grinding time of the grinding mechanism 2 is set to 40-60 minutes.

[0059] The upper end face of the grinding ball shell 1000 is provided with a grinding ball connecting column 1002, and the second connecting plate 10062 is fixedly connected to the grinding ball connecting column 1002. The top end face of the second connecting plate 10062 is connected to the first connecting plate 10061, and the second connecting plate 10062 and the first connecting plate 10061 are fixed with bolts.

[0060] The upper end surface of the first connecting plate 10061 is fixedly connected to the motor shaft 1006, and the top end surface of the motor shaft 1006 is fixedly connected to the first driving motor 5. When the first driving motor 5 is started, it drives the grinding ball shell 1000 to rotate, thereby grinding the slurry located in the grinding groove 1007.

[0061] The material of the grinding ball shell 1000 is the same as that of the grinding ball 202 .

[0062] A pair of opposite end faces of the preliminary grinding mechanism 3 are both provided with a feeding mechanism 7 , and a pair of opposite end faces of the preliminary grinding mechanism 3 are both provided with a cavity 301 , in which the stock liquid is stored, so that the stock liquid is supplied to the bubble pump 1001 through the feeding mechanism 7 .

[0063] The feeding mechanism 7 includes a sealing door, a first feeding and conveying pipe 3011 and a pair of second feeding and conveying pipes 3012. The sealing door is used to open and close the chamber 301, so as to facilitate replenishing the raw liquid into the chamber 301.

[0064] The first feeding and conveying pipe 3011 passes through a pair of cavities 301 , and a pair of opposite end surfaces of the first feeding and conveying pipe 3011 are fixedly connected to the second feeding and conveying pipe 3012 .

[0065] The grinding ball 10 also includes a base plate 1009, which is located at the lower end face of the inner wall of the grinding ball shell 1000. The bubble pump 1001 is located at the upper end face of the base plate 1009. The upper end face of the bubble pump 1001 is connected to the third feeding and conveying pipe 1005, and the third feeding and conveying pipe 1005 is connected to the first feeding and conveying pipe 3011. After the bubble pump 1001 absorbs the original liquid in the cavity 301 through the third feeding and conveying pipe 1005, the first feeding and conveying pipe 3011 and the second feeding and conveying pipe 3012, the ultra-fine afterburner U-shaped ball is sprayed through multiple nozzles 10031.

[0066] Furthermore, a pair of ultra-fine force U-shaped ball delivery tubes 1004 are connected to the other end face of the bubble pump 1001, and both of the pair of ultra-fine force U-shaped ball delivery tubes 1004 are connected to the ultra-fine force U-shaped ball delivery ring 1003, so that the raw liquid adsorbed by the third feeding delivery tube 1005 is delivered to the ultra-fine force U-shaped ball delivery ring 1003 through the ultra-fine force U-shaped ball delivery tube 1004.

[0067] The ultra-fine force U-shaped ball conveying ring 1003 is fixedly connected to the upper end face of the inner wall of the grinding ball shell 1000. The ultra-fine force U-shaped ball conveying ring 1003 matches the inner wall end face of the grinding ball shell 1000. A conveying pipe is provided in the ultra-fine force U-shaped ball conveying ring 1003.

[0068] Multiple nozzles 10031 are set on the ultra-fine force-added U-shaped ball conveying ring 1003, and the outer end surface of the grinding ball shell 1000 is opened with limiting holes 1008 matching the multiple nozzles 10031. The nozzles 10031 are located in the limiting holes 1008, so that the nozzles 10031 can spray the ultra-fine force-added U-shaped balls into the grinding groove 1007 in the preliminary grinding mechanism 3 through the limiting holes 1008.

[0069] The nozzle 10031 does not protrude from the outer end surface of the limiting hole 1008, so that the nozzle 10031 does not affect the rotation of the grinding ball shell 1000 to grind the slurry.

[0070] The ultra-fine force-added U-shaped ball conveying ring 1003 ejects ultra-fine force-added U-shaped balls into the grinding tank 1007. The ultra-fine force-added U-shaped balls explode when they come into contact with the slurry, thereby causing the slurry in the grinding tank 1007 to explode, thereby causing the slurry to shake in the grinding tank 1007, thereby ensuring a uniform concentration of the slurry.

[0071] At the same time, when the ultra-fine force-added U-shaped ball breaks, the grinding slurry rotates in the grinding ball shell 1000 to generate heat, which promotes the mixing of the original liquid and the slurry inside the ultra-fine force-added U-shaped ball, improves the film-forming performance of the slurry, and at the same time, the slurry can better adhere to the silicon wafer, promote the horizontal growth of silver particles, and the silver particles are in closer contact, which can effectively form a conductive network.

[0072] The formula of ultra-fine reinforced U-shaped ball is 10-30% dissolved resin, 5-15% terpineol-ethyl cellulose system, 25-50% silver powder, 20-35% nitrocellulose, 20-40% copper ball, 1-10% polyvinyl alcohol and 0.5-2% calcium carbonate.

[0073] Preferably, the formula of the ultrafine reinforced U-shaped ball is 12% dissolved resin, 7.1% terpineol-ethyl cellulose system, 36% silver powder, 21% nitrocellulose, 20% copper ball, 3.1% polyvinyl alcohol and 0.8% calcium carbonate.

[0074] Furthermore, the stock liquid has the same formula as that of the U-shaped ball. After the bubble pump 1001 absorbs the stock liquid in the cavity 301, a bursting membrane is formed on its surface. After the bursting membrane ruptures, the stock liquid in the membrane further explodes and reacts with the slurry.

[0075] A feed pipe 11 is provided between the bottom end face of the primary grinding mechanism 3 and the grinding mechanism 2. This pipe is located on the upper end face of the grinding ring 202, on the grinding ring 202 closest to the sidewall end face of the grinding mechanism 2. This pipe 11 is connected to the grinding trough 1007. After the primary grinding mechanism 3 is completed by the grinding balls 10, the slurry enters the feed pipe 11 through the grinding trough 1007 and is then transported to the grinding ring 202 for secondary grinding. The resulting slurry has uniform particle size, ranging from 0.2 to 10 μm.

[0076] The structure and operating principle of the grinding mechanism 2 are the same as those of the three-roller grinding machine in the prior art.

[0077] An electromagnetic valve 4 is provided between the first feeding and conveying pipe 3011 and a pair of second feeding and conveying pipes 3012. When liquid is supplied, only one of the cavities 301 is opened for liquid supply. If the original liquid in one of the cavities 301 is insufficient, the corresponding electromagnetic valve 4 is closed, and the electromagnetic valve 4 in the other cavity 301 is opened to start supplying liquid to the bubble pump 1001.

[0078] The preliminary grinding mechanism 3 is located in the cavity 301 and is provided with a liquid level sensor to monitor the liquid level in the cavity 301. When the liquid level in the cavity 301 is insufficient, an early warning is issued in time and the corresponding solenoid valve 4 is closed.

[0079] When using, Figure 1As shown, when it is necessary to grind the slurry, the slurry is first transported to a pair of feed ports 9, and the slurry enters the grinding tank 1007. At this time, the first drive motor 5 is started, driving the grinding ball shell 1000 to rotate and grind the slurry in the grinding tank 1007. At the same time, the bubble pump 1001 in the grinding ball 10 is started, and multiple ultra-fine force-added U-shaped balls are sprayed out through multiple nozzles 10031 to promote the operation of the slurry and achieve a more uniform concentration, while improving the adhesion, conductivity and film-forming properties of the slurry.

[0080] like Figure 5 As shown, after the grinding ball 10 is ground, it enters the grinding ring 202 of the grinding mechanism 2 through the discharge pipe 11 for secondary grinding. After the secondary grinding, it enters the discharge port 201 for discharge. The filter plate 802 on the discharge port 201 filters impurities and unqualified slurry, and the qualified slurry enters the next process.

[0081] At the same time, the second drive motor 804 is started to drive the scraper 801 to scrape off the residual impurities and unqualified slurry on the filter plate 802, and move the residual impurities and unqualified slurry on the filter plate 802 to the storage box 803 through the groove 8032 for storage.

[0082] The storage box 803 separates impurities and unqualified slurry, and the third re-grinding slurry delivery pipe 8031 ​​delivers the unqualified slurry located above the impurity filter plate to the feed port 9 through the extraction pump 601 for re-grinding until the slurry grinding particle size meets the requirements.

[0083] The foregoing descriptions of specific exemplary embodiments of the present invention are for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many variations and modifications are possible in light of the foregoing teachings. The exemplary embodiments have been selected and described for the purpose of explaining the specific principles of the invention and their practical application, thereby enabling those skilled in the art to realize and utilize a variety of exemplary embodiments of the invention and various options and modifications. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. Slurry polishing equipment for silicon wafer production, characterized in that: The invention comprises a grinding device body, wherein the grinding device body comprises: The grinding mechanism includes a feed opening and a grinding cone. The feed opening is provided with a scraper drive mechanism, which includes a scraper, a filter plate and a second drive motor. The scraper is fixedly connected to one end surface of the feed opening. The slurry regrinding mechanism is located on one end surface of the scraper, and the slurry regrinding mechanism includes a storage box, an extraction pump and a third regrinding slurry delivery pipe; A preliminary grinding mechanism, the preliminary grinding mechanism is located on the upper end surface of the grinding mechanism, a pair of opposite end surfaces of the preliminary grinding mechanism are each provided with a feeding mechanism, a pair of opposite end surfaces of the preliminary grinding mechanism are each provided with a cavity, the feeding mechanism includes a sealing door, a first feeding conveying pipe and a pair of second feeding conveying pipes, and a top end surface of the preliminary grinding mechanism is provided with a pair of feeding ports; Grinding balls; Grinding balls are provided on the inner end surface of the preliminary grinding mechanism, and a grinding groove matching the grinding balls is opened in the preliminary grinding mechanism. The grinding balls include a grinding ball housing, a bubble pump, multiple nozzles and a motor shaft. The upper end surface of the motor shaft is connected to a first drive motor, and an ultra-fine force U-shaped ball conveying ring sprays ultra-fine force U-shaped balls into the grinding groove. The feed port is connected to the grinding groove; A feed pipe is provided between the bottom end surface of the preliminary grinding mechanism and the grinding mechanism, and the feed pipe is connected to the grinding tank; The formula of the ultrafine force-added U-shaped ball is 10-30% dissolved resin, 5-15% terpineol-ethyl cellulose system, 25-50% silver powder, 20-35% nitrocellulose, 20-40% copper ball, 1-10% polyvinyl alcohol and 0.5-2% calcium carbonate.

2. The slurry polishing equipment for silicon wafer production according to claim 1, wherein: The grinding ball also includes a base plate, which is located at the lower end surface of the inner wall of the grinding ball shell. The bubble pump is located at the upper end surface of the base plate. The upper end surface of the bubble pump is connected to the third feed delivery pipe, and the third feed delivery pipe is connected to the first feed delivery pipe. The first feed delivery pipe runs through a pair of cavities.

3. The slurry polishing equipment for silicon wafer production according to claim 2, wherein: A solenoid valve is provided between the first feeding and conveying pipe and a pair of second feeding and conveying pipes. The cavity stores a stock liquid having the same formula as that of the U-shaped ball.

4. The slurry polishing equipment for silicon wafer production according to claim 1, wherein: The other end face of the bubble pump is connected to a pair of ultra-fine force U-shaped ball delivery tubes, and the pair of ultra-fine force U-shaped ball delivery tubes are both connected to an ultra-fine force U-shaped ball delivery ring. A plurality of nozzles are provided on the ultra-fine force U-shaped ball delivery ring. The outer end face of the grinding ball shell is provided with limiting holes matching the plurality of nozzles, and the nozzles are located in the limiting holes.

5. The slurry polishing equipment for silicon wafer production according to claim 1, wherein: The upper end surface of the grinding ball shell is provided with a grinding ball connecting column, the grinding ball connecting column is fixedly connected to the second connecting plate, the top end surface of the second connecting plate is connected to the first connecting plate, and the upper end surface of the first connecting plate is fixedly connected to the motor shaft.

6. The slurry polishing equipment for silicon wafer production according to claim 1, wherein: The scraper abuts the filter plate, and one end face of the scraper is fixedly connected to a limit plate, the limit plate is connected to a screw rod, and the other end face of the screw rod is connected to a second drive motor, and the second drive motor controls the screw rod to rotate and drive the limit plate to move.

7. The slurry polishing equipment for silicon wafer production according to claim 6, wherein: The upper end face of the storage box is fixedly connected to the third regrinding slurry delivery pipe, the upper end face of the third regrinding slurry delivery pipe is fixedly connected to the second regrinding slurry delivery pipe, one end face of the second regrinding slurry delivery pipe is connected to the extraction pump, one end face of the extraction pump is connected to the first regrinding slurry delivery pipe, and the other end face of the first regrinding slurry delivery pipe is connected to one of the feed ports.

8. The slurry polishing equipment for silicon wafer production according to claim 1 or 7, wherein: The storage box is provided with a groove, and the groove matches with one side end surface of the discharge port.

9. The slurry polishing equipment for silicon wafer production according to claim 1, wherein: The preliminary grinding mechanism is located in the cavity and is provided with a liquid level sensor.

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