Display panel and display device

Abstract

The present application provides a display panel and a display device, wherein the display panel includes a driving substrate, a pixel definition layer, sub-pixels, and a conductive isolation structure. The pixel definition layer is disposed on the driving substrate, and the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the sub-pixels are disposed in the pixel accommodating area; the conductive isolation structure is disposed on the pixel definition layer and surrounds the upper surface of the pixel accommodating area; the conductive isolation structure includes a main structure and a top structure located on the upper surface of the main structure and shielding the main structure; the pixel definition layer is an inorganic insulating layer. Different from the prior art, the pixel definition layer of the display panel in the present application is an inorganic insulating layer, and the film thickness of the inorganic insulating material is relatively low, so that the thickness of the display panel is reduced, and the display panel's resistance to external impact is further increased, thereby reducing the probability of display abnormalities caused by the poor resistance of the display panel to external impact.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In the manufacturing process of organic light-emitting diode (OLED) display panels, the deposition of the light-emitting layer is a critical and expensive process. Traditional manufacturing often uses a vacuum evaporator combined with a fine metal mask (FMM) to deposit the light-emitting layer. However, the fine metal mask in the traditional manufacturing method is expensive, and the actual utilization rate of the expensive light-emitting material deposited to form the light-emitting layer is low, resulting in a large amount of material waste, which increases the manufacturing cost of the display panel.

[0003] The existing new OLED structure represented by the conductive isolation structure can achieve the de-fine metal mask during the manufacturing process, which directly brings the benefit of reduced manufacturing costs. However, the existing display panel including the conductive isolation structure and the pixel definition layer has poor resistance to external impact, and the display panel may have display abnormalities. Summary of the invention

[0004] The present application provides a display panel and a display device, which mainly solve the technical problem that the display panel has poor resistance to external impact, causing abnormal display of the display panel.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is to provide a display panel, including:

[0006] Driver substrate;

[0007] A pixel definition layer, disposed on the driving substrate, the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area;

[0008] A sub-pixel is disposed in the pixel accommodating area;

[0009] A conductive isolation structure is disposed on the pixel definition layer and surrounds the upper surface of the pixel accommodating area; the conductive isolation structure comprises a main structure and a top structure located on the upper surface of the main structure and shielding the main structure;

[0010] The pixel definition layer is an inorganic insulating layer.

[0011] In a specific embodiment, the pixel definition layer has at least one opening on a side away from the driving substrate;

[0012] At least a portion of the main structure is disposed in the opening, so that the conductive isolation structure is in contact with the pixel definition layer more firmly.

[0013] In a specific embodiment, the opening is a groove and / or a through hole.

[0014] In a specific embodiment, the opening is a through hole, and continuous through holes are arranged between adjacent pixel definition layers; and / or,

[0015] The openings are a plurality of through holes, and the plurality of through holes are spaced apart between adjacent pixel definition layers.

[0016] In a specific embodiment, the pixel definition layer is a single-layer structure composed of an inorganic insulating material; or

[0017] The pixel definition layer is a single-layer structure composed of two or more inorganic insulating materials; or

[0018] The pixel definition layer is a multilayer structure composed of two or more inorganic insulating materials.

[0019] In a specific embodiment, the pixel definition layer includes SiN, SiO2 or other inorganic insulating materials; and / or,

[0020] The thickness of the pixel definition layer is 0.2 micrometers to 0.3 micrometers; and / or,

[0021] The line width of the pixel definition layer is less than 2 microns; and / or,

[0022] The angle between the side wall of the pixel definition layer and the driving substrate is less than 30 degrees.

[0023] In a specific implementation, the display panel further includes:

[0024] An organic insulating layer, disposed between the driving substrate and the pixel definition layer;

[0025] Wherein, the pixel definition layer covers the upper surface of the organic insulating layer; the organic insulating layer is used to increase the contact area between the pixel definition layer and the driving substrate.

[0026] In a specific embodiment, the sub-pixel includes an anode, a light-emitting layer and a cathode arranged in a stacked manner;

[0027] Both ends of the anode are at least partially wrapped by the pixel definition layer; the light-emitting layer is arranged on the side of the anode away from the driving substrate; the cathode is arranged on the side of the light-emitting layer away from the driving substrate, and is in contact with and conductive with the main structure.

[0028] In a specific implementation, the display panel further includes:

[0029] An encapsulation layer is disposed on a side of the cathode away from the driving substrate, wherein the encapsulation layer is below at least a portion of the conductive isolation structure and extends along a side wall of the conductive isolation structure.

[0030] In order to solve the above technical problem, another technical solution adopted by the present application is to provide a display device, wherein the display panel includes any of the above-mentioned display panels.

[0031] The present application provides a display panel and a display device, wherein the display panel includes a driving substrate, a pixel definition layer, sub-pixels, and a conductive isolation structure. The pixel definition layer is disposed on the driving substrate, and the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the sub-pixels are disposed in the pixel accommodating area; the conductive isolation structure is disposed on the pixel definition layer and surrounds the upper surface of the pixel accommodating area; the conductive isolation structure includes a main structure and a top structure located on the upper surface of the main structure and shielding the main structure; the pixel definition layer is an inorganic insulating layer. Different from the prior art, the pixel definition layer of the display panel in the present application is an inorganic insulating layer, and the film thickness of the inorganic insulating material is relatively low, so that the thickness of the display panel is reduced, and the display panel's resistance to external impact is further increased, thereby reducing the probability of display abnormalities caused by the poor resistance of the display panel to external impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the structure of a display panel provided in the first embodiment of the present application;

[0034] Figure 2 This is a schematic diagram of the structure when the pixel definition layer is multi-layer in the first embodiment of the present application;

[0035] Figure 3 A schematic diagram of the structure of a display panel provided in the second embodiment of the present application;

[0036] Figure 4 A schematic diagram of the structure of a display panel provided in the third embodiment of the present application;

[0037] Figure 5 This is a schematic diagram of the structure when the pixel definition layer is multi-layer in the third embodiment of the present application;

[0038] Figure 6 A schematic diagram of a top view of the structure of a driving substrate and a pixel definition layer provided in a second embodiment of the present application;

[0039] Figure 7 A schematic diagram of a top view of the structure of a driving substrate and a pixel definition layer provided in the present application;

[0040] Figure 8 A schematic diagram of the structure of a display panel provided in a fourth embodiment of the present application;

[0041] Fig. 9 A partial structural schematic diagram of a display panel provided in the fourth embodiment of the present application.

[0042] Description of Figure Numbers:

[0043] 10-driving substrate; 20-pixel definition layer; 21-opening; 21a-groove; 21b-through hole; 30-sub-pixel; 31-anode; 32-light-emitting layer; 33-cathode; 40-conductive isolation structure; 41-main structure; 42-top structure; 50-encapsulation layer; 60-organic insulating layer; 100-display panel; X-pixel accommodating area; Y-angle; Z-line width. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0046] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0047] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0048] In the preparation process of the display panel of the organic light-emitting diode (OLED), the more critical and expensive process is the deposition of the luminescent material used to form the luminescent layer. The traditional manufacturing method often uses a vacuum evaporator and a fine metal mask (Fine Metal Mask, FMM) to deposit the luminescent material. The disadvantages of this traditional manufacturing method are very obvious: first, the vacuum evaporator is expensive, there are few suppliers, and domestic production is currently difficult to achieve; second, FMM is a consumable core component, a set of masks can only be adapted to one model of display products, and it is currently impossible to mass-produce domestically and it is difficult to purchase high-end FMM; third, the actual utilization rate of expensive luminescent materials in this process is low, resulting in a large amount of material waste.

[0049] The new OLED structure represented by the conductive isolation structure in the prior art can realize the de-fine metal mask during the manufacturing process, so that the manufacturing cost is reduced. However, because the existing pixel definition layer is an organic insulating film, the use of the organic insulating film is not only costly, but also because the film layer is thick when the organic insulating layer is made, it will cause the thickness of the display panel to be too high, and further cause the display panel to have poor resistance to external impact. Therefore, if the conductive isolation structure of the display panel is subjected to external force impact during the process production, it is easy to deform or even break, and then produce abnormal phenomena such as abnormal line connection and displacement of the evaporation position of the light-emitting layer; at the same time, when the pixel definition layer is an organic insulating film, the slope angle is relatively slow, and the conductive isolation structure deposited on it needs to be placed on a flat interface. The relatively slow slope angle is bound to occupy a wider pixel spacing, which is not conducive to the increase of the pixel opening and the improvement of the resolution of the display panel. On the other hand, if the conductive isolation structure is deposited at the slope angle position of the pixel definition layer, it is easy to separate from the pixel definition layer, thereby causing abnormal display of the display panel.

[0050] The present application provides a display panel and a display device. The display panel includes a driving substrate; a pixel definition layer disposed on the driving substrate, the pixel definition layer protruding from the driving substrate to form a pixel accommodating area; sub-pixels disposed in the pixel accommodating area; a conductive isolation structure disposed on the pixel definition layer and surrounding the upper surface of the pixel accommodating area; the conductive isolation structure includes a main structure and a top structure located on the upper surface of the main structure and shielding the main structure; wherein the pixel definition layer is an inorganic insulating layer. Different from the prior art, the pixel definition layer of the display panel provided in the present application is an inorganic insulating layer, and the film thickness of the inorganic insulating layer is lower than the film thickness of the organic insulating film, thereby reducing the thickness of the display panel, further increasing the resistance of the display panel to external impact, and reducing the probability of display abnormality caused by the poor resistance of the display panel to external impact. The material cost of the inorganic insulating layer is low, saving the manufacturing cost of the display panel. In addition, the slope angle of the pixel definition layer in the display panel of the present application is increased, which also reduces the possibility of separation between the conductive isolation structure and the pixel definition layer.

[0051] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0052] See also Figure 1 , Figure 1A schematic diagram of the structure of a display panel provided in the first embodiment of the present application. The present application provides a display panel 100, which includes a driving substrate 10, a pixel definition layer 20, a sub-pixel 30 and a conductive isolation structure 40. The driving substrate 10 is used to drive the sub-pixel 30 to emit light. The pixel definition layer 20 is disposed on the driving substrate 10. The pixel definition layer 20 protrudes from the driving substrate 10 to form a pixel accommodating area X. The sub-pixel 30 is disposed in the pixel accommodating area X. The conductive isolation structure 40 is disposed on the pixel definition layer 20 and surrounds the upper surface of the pixel accommodating area X; the conductive isolation structure 40 includes a main structure 41 and a top structure 42 located on the upper surface of the main structure 41 and shielding the main structure 41.

[0053] The sub-pixel 30 includes a stacked anode 31, a light-emitting layer 32 and a cathode 33. Both ends of the anode 31 are at least partially wrapped by the pixel definition layer 20. The light-emitting layer 32 is arranged on the side of the anode 31 away from the driving substrate 10. The cathode 33 is arranged on the side of the light-emitting layer 32 away from the driving substrate 10, and is in contact with and conductive with the main structure 41. The anode 31 and the cathode 33 are used to control the light-emitting layer 32 of the sub-pixel 30 to emit light. The material of the anode 31 includes but is not limited to aluminum, silver and its oxide, indium tin oxide, and a stack of metal and indium tin oxide. The material of the cathode 33 includes but is not limited to metal materials such as aluminum, gold, silver, and aluminum-magnesium alloy.

[0054] There are multiple sub-pixels 30, each of which corresponds to a pixel of one color. There are multiple pixel accommodating areas X, wherein a single pixel accommodating area X is provided with at least one sub-pixel 30. The present application does not limit the arrangement of the sub-pixels 30. The present application mainly uses two adjacent sub-pixels 30 as an example for explanation. In this embodiment, one pixel accommodating area X accommodates one sub-pixel 30.

[0055] The conductive isolation structure 40 is used to isolate the sub-pixels 30. Specifically, the conductive isolation structure 40 separates the light-emitting layers 32 of each sub-pixel 30 and separates the cathodes 33 of sub-pixels 30 of different colors to avoid crosstalk between pixels. At the same time, the cathode 33 of each sub-pixel 30 is connected to the main structure 41 of the conductive isolation structure 40, so that the cathodes 33 of each sub-pixel 30 are connected through the main structure 41.

[0056] The top structure 42 is located on the upper surface of the main structure 41 and covers the main structure 41. It can be understood that the top structure 42 is in contact with the main structure 41, and the orthographic projection of the top structure 42 on the driving substrate 10 completely covers the orthographic projection of the main structure 41 on the driving substrate 10. When depositing the light-emitting layer 32 and the cathode 33, the evaporation angle can be changed by the top structure 42 so that the cathode 33 covers the light-emitting layer 32, which is conducive to the contact and conduction between the cathode 33 and the main structure 41. The top structure 42 includes SiO2, SiN x , SiNO. The top structure 42 may also be other insulating materials. x is a non-zero natural number. It should be noted that the upper surface of the present application refers to the surface away from the side of the drive substrate 10.

[0057] Specifically, the pixel definition layer 20 is an inorganic insulating layer. It is understandable that the pixel definition layer 20 can be a single-layer structure composed of one inorganic insulating material or a single-layer structure composed of two or more inorganic insulating materials; the pixel definition layer 20 can also be a multi-layer structure composed of two or more inorganic insulating materials. Figure 2 , Figure 2 It should be understood that the pixel definition layer 20, whether it is multi-layer, single-layer or a mixture of multiple inorganic insulating materials, is designed to facilitate the product structure of different display panels 100.

[0058] Specifically, the pixel definition layer 20 includes SiN, SiO2 or other inorganic insulating materials. Compared with the price of organic insulating materials used in the pixel definition layer 20 in the prior art, the inorganic insulating materials used in the present application are of suitable price; at the same time, the production cost and time of the pixel definition layer 20 using inorganic insulating materials are much less than that of organic insulating materials used in the prior art. The pixel definition layer 20 provided in the embodiment of the present application has a tighter coating on the anode 31, good water vapor isolation, and better insulation, while greatly reducing the probability of failure caused by water vapor erosion causing corrosion of the bottom layer of the display panel 100.

[0059] Specifically, the thickness of the pixel definition layer 20 is 0.2 microns to 0.3 microns. It should be understood that the pixel definition layer 20 has a total thickness range of 0.2 microns to 0.3 microns, whether it is a single-layer structure or a multi-layer structure. For example, the thickness of the pixel definition layer 20 can be 0.2 microns, 0.22 microns, 0.24 microns, 0.26 microns, 0.28 microns, and 0.3 microns. In the prior art, the pixel definition layer 20 is an organic insulating film and the thickness of the organic insulating film is 2 microns to 3 microns. Compared with the prior art, the pixel definition layer 20 provided in this embodiment is an inorganic insulating layer, which can reduce the thickness of the pixel definition layer 20 finally manufactured; thereby reducing the thickness of the display panel 100, further increasing the external impact resistance of the display panel 100, and reducing the probability of display abnormality caused by poor external impact resistance of the display panel 100. Due to the reduction in the thickness of the display panel 100, the content of the encapsulation material filled in the pixel accommodating area X will also be reduced, further reducing the production cost of the display panel 100.

[0060] Furthermore, since the pixel definition layer 20 is made of inorganic insulating material, the cross-section of the pixel definition layer 20 away from the driving substrate 10 is smoother, making it difficult for the pixel definition layer 20 and the conductive isolation structure 40 to fall off; since the pixel definition layer 20 is made of inorganic insulating material, the angle Y between the side wall of the pixel definition layer 20 and the driving substrate 10 can be adjusted in a wider range and can be controlled, and the side wall of the pixel definition layer 20 is inclined relative to the driving substrate 10.

[0061] Since the pixel definition layer 20 is made of inorganic insulating material with a higher degree of refinement, the line width Z of the pixel definition layer 20 is less than 2 microns (see Figure 6 ), so that the angle Y between the side wall of the pixel definition layer 20 and the driving substrate 10 can be adjusted.

[0062] Specifically, in the embodiment of the present application, the angle Y between the side wall of the pixel definition layer 20 and the driving substrate 10 is less than 30 degrees. The angle Y between the side wall of the pixel definition layer 20 and the driving substrate 10 is less than 30 degrees, so that the lateral space occupied by the pixel definition layer 20 is reduced, and the aperture ratio and resolution of the display panel 100 are further improved to promote the further development of the display effect of the display panel 100. At the same time, the angle Y is less than 30 degrees, which makes the cross-section of the pixel definition layer 20 away from the driving substrate 10 more flat, reducing the possibility of the conductive isolation structure 40 tilting and the possibility of separation from the pixel definition layer 20. It can also be understood that in the direction perpendicular to the driving substrate 10, the longitudinal section of the side wall of the pixel definition layer 20 is trapezoidal, and the cross-sectional area of ​​the side wall of the pixel definition layer 20 gradually decreases in the direction close to the top structure 42.

[0063] The display panel 100 further includes an encapsulation layer 50. The encapsulation layer 50 is disposed on a side of the cathode 33 away from the driving substrate 10, wherein the encapsulation layer 50 is below at least a portion of the conductive isolation structure 40 and extends along the sidewall of the conductive isolation structure 40. The encapsulation layer 50 is used to provide anti-etching protection for the sub-pixel 30 during the process of preparing the display panel 100. The encapsulation layer 50 includes a non-conductive inorganic material. Specifically, the encapsulation layer 50 includes an inorganic material containing silicon, such as SiN x Quasi-inorganic material, x is a non-zero natural number.

[0064] See also Figure 3 , Figure 3 This is a schematic diagram of the structure of the display panel provided in the second embodiment of the present application. The specific structure of the display panel 100 provided in the second embodiment is basically the same as that in the first embodiment, except that the pixel definition layer 20 in this embodiment has at least one opening 21 on the side away from the drive substrate 10. This embodiment is mainly described by taking the example that the pixel definition layer 20 on the side of each conductive isolation structure 40 close to the drive substrate 10 has an opening 21. Among them, at least a part of the main structure 41 is arranged in the opening 21, so that the contact between the conductive isolation structure 40 and the pixel definition layer 20 is more stable.

[0065] Specifically, in this embodiment Figure 3 The opening 21 is a groove 21a. That is, during the preparation and deposition process, a portion of the main structure 41 falls into the groove 21a, and a portion protrudes from the pixel definition layer 20, so that the contact area between the main structure 41 and the pixel definition layer 20 is increased, making the contact between the conductive isolation structure 40 and the pixel definition layer 20 more stable.

[0066] It is understandable that the opening 21 in the present application may be a groove 21a or a through hole 21b. Figure 4 and Figure 5 , Figure 4 A schematic diagram of the structure of a display panel provided in the third embodiment of the present application. Figure 5 This is a schematic diagram of the structure when the pixel definition layer is multi-layered in the third embodiment of the present application. The specific structure of the display panel 100 provided in the third embodiment is basically the same as that in the second embodiment, except that the opening 21 in this embodiment is a through hole 21b. Among them, at least part of the main structure 41 is arranged in the through hole 21b, so that the contact between the conductive isolation structure 40 and the pixel definition layer 20 is more stable. That is, during the preparation and deposition process of the main structure 41, a part falls into the through hole 21b, and a part protrudes from the pixel definition layer 20, so that the contact area between the main structure 41 and the pixel definition layer 20 is increased, so that the contact between the conductive isolation structure 40 and the pixel definition layer 20 is more stable.

[0067] In this embodiment Figure 4The opening 21 is a through hole 21b. Figure 6 , Figure 6 The schematic diagram of the top view structure of the driving substrate and the pixel definition layer provided in the second embodiment of the present application. The opening 21 is a continuously arranged through hole 21b, and a continuous through hole 21b is arranged between adjacent pixel definition layers 20. The continuous through holes 21b space the adjacent pixel definition layers 20 and also separate the anodes 31 from each other. Among them, the line width Z of the pixel definition layer 20 is less than 2 microns. Because the pixel definition layer 20 adopts inorganic insulating materials, the degree of refinement is higher. In other embodiments, the opening 21 is also a plurality of through holes 21b, and a plurality of through holes 21b are spaced between adjacent pixel definition layers 20, and the remaining part of the pixel definition layer 20 (excluding the part of the through hole 21b) is connected, see Figure 7 , Figure 7 The top view of the driving substrate and the pixel definition layer provided in the present application is a schematic diagram. The pixel definition layer 20 can be designed to completely cover the edges of both ends of the anode 31 in the top view, for example Figure 6 The pixel definition layer 20 is formed with strip-shaped through holes 21b; for example Figure 7 The pixel definition layer 20 is provided with hole-shaped through holes 21b arranged at intervals. The design of the pixel definition layer 20 has no specific shape requirement in the top view, and only needs to cover the edges of both ends of the anode 31; the opening 21 may also be Figure 6 and Figure 7 The combination of different opening 21 modes, the cross section of the opening 21 can be triangular, circular or other shapes, and the present application does not limit this.

[0068] It can be understood that, like the above embodiment, the pixel definition layer 20 in this embodiment can be a single-layer structure composed of one inorganic insulating material or a single-layer structure composed of two or more inorganic insulating materials; the pixel definition layer 20 can also be a multi-layer structure composed of two or more inorganic insulating materials. Figure 5 It should be understood that the pixel definition layer 20 , whether it is composed of multiple layers, a single layer, or a mixture of multiple inorganic insulating materials, is for the purpose of conveniently adapting to the structure of different display panels 100 .

[0069] Furthermore, the placement of the conductive isolation structure 40 above the pixel definition layer 20 is not limited by the position of the opening 21 of the pixel definition layer 20 , and only needs to be able to separate the sub-pixels 30 of two different colors.

[0070] See also Figure 8 and Fig. 9 , Figure 8 A schematic structural diagram of a display panel provided in the fourth embodiment of the present application. Fig. 9A schematic diagram of a partial structure of a display panel provided in the fourth embodiment of the present application. The specific structure of the display panel 100 provided in the fourth embodiment is basically the same as that in the above-mentioned embodiment, except that the display panel 100 provided in this embodiment further includes an organic insulating layer 60. This embodiment is further described mainly by taking the structure that is basically the same as that of the first embodiment as an example. Among them, the organic insulating layer 60 is arranged between the driving substrate 10 and the pixel definition layer 20. The pixel definition layer 20 covers the upper surface of the organic insulating layer 60, and the organic insulating layer 60 is used to increase the contact area between the pixel definition layer 20 and the driving substrate 10, and reduce the risk of the conductive isolation structure 40 being tilted and separated from the pixel definition layer 20.

[0071] The present application also provides a display device, which includes the above-mentioned display panel 100. The display panel 100 of the present application is an OLED display panel 100.

[0072] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0073] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, comprising: Driver substrate; A pixel definition layer, disposed on the driving substrate, the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; A conductive isolation structure, disposed on the pixel definition layer and surrounding the upper surface of the pixel accommodating area; The conductive isolation structure comprises a main body structure and a top structure located on the upper surface of the main body structure and shielding the main body structure; A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, a light-emitting layer and a cathode which are stacked; the light-emitting layer is arranged on a side of the anode away from the driving substrate; the cathode is arranged on a side of the light-emitting layer away from the driving substrate, and is in contact with and conductive to the main structure; Characterized in that the pixel definition layer is an inorganic insulating layer; The pixel definition layer is a multilayer structure composed of two or more inorganic insulating materials; the thickness of the pixel definition layer is 0.2 micrometer to 0.3 micrometer; The pixel definition layer has at least one opening on a side away from the driving substrate; at least a portion of the main structure is disposed in the opening, so that the conductive isolation structure is in more stable contact with the pixel definition layer; The display panel further includes: an organic insulating layer, disposed between the drive substrate and the pixel definition layer; wherein the pixel definition layer covers the upper surface of the organic insulating layer; and the organic insulating layer is used to increase the contact area between the pixel definition layer and the drive substrate.

2. The display panel according to claim 1, characterized in that: The opening is a groove and / or a through hole.

3. The display panel according to claim 2, characterized in that: The opening is a through hole, and continuous through holes are arranged between adjacent pixel definition layers; and / or, The openings are a plurality of through holes, and the plurality of through holes are spaced apart between adjacent pixel definition layers.

4. The display panel according to claim 1, characterized in that: The pixel definition layer includes SiN, SiO2 or other inorganic insulating materials; and / or, The line width of the pixel definition layer is less than 2 microns; and / or, The angle between the side wall of the pixel definition layer and the driving substrate is less than 30 degrees.

5. The display panel according to claim 1, characterized in that: Both ends of the anode are at least partially wrapped by the pixel definition layer.

6. The display panel according to claim 5, characterized in that: The display panel further includes: An encapsulation layer is disposed on a side of the cathode away from the driving substrate, wherein the encapsulation layer is below at least a portion of the conductive isolation structure and extends along a side wall of the conductive isolation structure.

7. A display device, characterized in that: The display panel includes the display panel according to any one of claims 1 to 6.

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