Touchpad assembly

Abstract

A touchpad assembly includes a cover plate and a three-dimensional sensing element. The three-dimensional sensing element is stacked with the cover plate and includes a first sensing layer and a second sensing layer. The first sensing layer is arranged to extend along a first direction and has a first resistivity. The first resistivity is equal to or less than about 0.5 ohm / sq. The first sensing layer serves as a part of a first touch electrode and a second touch electrode. The second sensing layer is arranged to extend along a second direction and has a second resistivity. The second resistivity is greater than about 0.5 ohm / sq and equal to or less than about 5 ohm / sq. The second sensing layer serves as another part of the second touch electrode and a pressure sensing electrode. Thus, the thinness of the touchpad assembly can be achieved, and the manufacturing cost and the manufacturing procedure of the product can be reduced.

Description

Technical Field

[0001] This disclosure relates to a touchpad assembly. Background Technology

[0002] The current development trend of touchpad components is from simple touch functionality to the integration of touch and force sensing. Currently, touch sensors and force sensors are manufactured separately. One conventional touchpad component uses a combination of a touch sensor and a separate strain gauge, but this has the disadvantage of being thicker and having a complicated strain gauge bonding process. Another conventional touchpad component uses a combination of a touch sensor and a capacitive force sensor (such as Chinese patent application publication number CN113748403A), but this also has the problem of being thicker and having difficulty meeting flatness requirements during assembly, resulting in poor overall signal uniformity.

[0003] Therefore, how to propose a touchpad component that can solve the above problems is one of the issues that the industry is currently eager to address by investing research and development resources. Summary of the Invention

[0004] In view of this, one objective of this disclosure is to provide a touchpad assembly that can solve the above-mentioned problems.

[0005] To achieve the above objectives, according to one embodiment of this disclosure, a touchpad assembly includes a cover plate and a three-dimensional sensing element. The three-dimensional sensing element is stacked with the cover plate and includes a first sensing layer and a second sensing layer. The first sensing layer extends along a first direction and has a first resistivity. The first resistivity is equal to or less than about 0.5 ohms / sq. The first sensing layer serves as part of a first touch electrode and a second touch electrode. The second sensing layer extends along a second direction and has a second resistivity. The second resistivity is greater than about 0.5 ohms / sq and equal to or less than about 5 ohms / sq. The second sensing layer serves as another part of a second touch electrode and a pressure sensing electrode.

[0006] In one or more embodiments disclosed herein, the touchpad assembly further includes a substrate. A first sensing layer and a second sensing layer are laminated on one side of the substrate.

[0007] In one or more embodiments disclosed herein, a bridging structure is formed at the overlap of the first sensing layer and the second sensing layer.

[0008] In one or more embodiments disclosed herein, the second sensing layer further includes a strain gauge pattern.

[0009] In one or more embodiments disclosed herein, the material of the first sensing layer comprises copper or a combination of molybdenum and aluminum.

[0010] In one or more embodiments disclosed herein, the material of the first sensing layer comprises a copper-nickel alloy. Copper constitutes more than about 95% of the first sensing layer.

[0011] In one or more embodiments disclosed herein, the second sensing layer comprises a high-conductivity material and a low-conductivity material. The high-conductivity material accounts for approximately 50% or more of the second sensing layer.

[0012] In one or more embodiments disclosed herein, the high conductivity material is copper. The low conductivity material is nickel. The copper to nickel ratio is from about 1.0 to about 5.0.

[0013] In one or more embodiments disclosed herein, at least one of the first sensing layer and the second sensing layer is a metal mesh.

[0014] In one or more embodiments disclosed herein, the linewidth of the metal mesh is from about 3 micrometers to about 50 micrometers.

[0015] In one or more embodiments disclosed herein, the second resistivity increases as the force applied to the second sensing layer increases.

[0016] To achieve the above objectives, according to another embodiment of this disclosure, a touchpad assembly includes a cover plate and a three-dimensional sensing element. The three-dimensional sensing element is stacked with the cover plate and includes a first sensing layer and a second sensing layer. The first sensing layer extends along a first direction and has a first resistivity. The first resistivity is equal to or less than about 0.5 ohms / sq. The first sensing layer serves as a first touch electrode. The second sensing layer extends along a second direction and has a second resistivity. The second resistivity is greater than about 0.5 ohms / sq and equal to or less than about 5 ohms / sq. The second sensing layer serves as a second touch electrode and a pressure sensing electrode.

[0017] In one or more embodiments disclosed herein, the touchpad assembly further includes a substrate. A first sensing layer and a second sensing layer are respectively laminated on opposite sides of the substrate.

[0018] In summary, in the touchpad assembly disclosed herein, by using one of the two sensing layers of the three-dimensional sensing element as both a touch electrode and a pressure sensing electrode, the touchpad assembly can be made thinner, and the manufacturing cost and manufacturing process can be reduced.

[0019] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description

[0020] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:

[0021] Figure 1 A perspective view of an electronic device according to an embodiment of this disclosure is provided;

[0022] Figure 2 A cross-sectional schematic diagram of a touchpad assembly according to an embodiment of the present disclosure is provided.

[0023] Figure 3 To illustrate the force-voltage curve of the second sensing layer according to an embodiment of this disclosure;

[0024] Figure 4 A partial cross-sectional schematic diagram of a three-dimensional sensing element according to an embodiment of the present disclosure is provided.

[0025] Figure 5 To illustrate a partial front view of a three-dimensional sensing element according to another embodiment of this disclosure;

[0026] Figure 6 A cross-sectional schematic diagram of a touchpad assembly according to another embodiment of this disclosure is shown.

[0027] [Symbol Explanation]

[0028] 100: Electronic devices

[0029] 110: Host

[0030] 120: Monitor

[0031] 130, 330: Touchpad assembly

[0032] 130a, 330a: Three-dimensional sensing element

[0033] 131,331: First sensing layer

[0034] 131a: Pattern of the first touch electrode

[0035] 131b: Pattern of the second touch electrode

[0036] 131c: Insulating layer

[0037] 131c1: Opening

[0038] 132,332: Second sensing layer

[0039] 132a: Bridge structure

[0040] 132b: Strain gauge pattern

[0041] 133: Substrate

[0042] 134: Cover plate

[0043] 135: Connector Layer

[0044] A1: First direction

[0045] A2: Second direction Detailed Implementation

[0046] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity in the drawings, some conventional structures and elements will be shown in a simple schematic manner.

[0047] Please refer to Figure 1 This is a perspective view illustrating an electronic device 100 according to an embodiment of the present invention. Figure 1 As shown, in this embodiment, the electronic device 100 includes a host 110, a display 120, and a touchpad assembly 130. The touchpad assembly 130 is disposed within the host 110 and exposed through an opening in the housing of the host 110. The touchpad assembly 130 is an input device disposed in the host 110, but the present invention is not limited thereto. In practical applications, the touchpad assembly 130 can also be an electronic product that uses a touchpad as an input or operation interface (e.g., a personal digital assistant, a keyboard including a touchpad, etc.). In other words, the concept of the touchpad assembly 130 of the present invention can be applied to any electronic product that uses a touchpad as an input or operation interface. The structure, function, and connection and operation relationship between some of the components included in the touchpad assembly 130 will be described in detail below.

[0048] Please refer to Figure 2 . Figure 2 A cross-sectional schematic diagram of a touchpad assembly 130 according to an embodiment of this disclosure is shown. Figure 2 As shown, in this embodiment, the touchpad assembly 130 includes a cover plate 134, a three-dimensional sensing element 130a, a substrate 133, and a connecting layer 135. The three-dimensional sensing element 130a is disposed on one side of the substrate 133. The cover plate 134 is disposed on the side of the three-dimensional sensing element 130a away from the substrate 133 and is connected to the three-dimensional sensing element 130a via the connecting layer 135. The three-dimensional sensing element 130a includes a first sensing layer 131, a second sensing layer 132, and an insulating layer 131c. The insulating layer 131c is disposed between the first sensing layer 131 and the second sensing layer 132 to insulate the first sensing layer 131 from the second sensing layer 132. The first sensing layer 131 is oriented along a first direction A1 (see [reference needed]). Figure 4 or Figure 5The first sensing layer 131 extends and has a first resistivity. The first resistivity is equal to or less than about 0.5 ohm / sq. The first sensing layer 131 serves as part of both the first and second touch electrodes. The second sensing layer 132 extends along the second direction A2 (see...). Figure 4 or Figure 5 The second sensing layer 132 is extended and has a second resistivity. The second resistivity is greater than approximately 0.5 ohms / sq and equal to or less than approximately 5 ohms / sq. It should be noted that the second resistivity of the second sensing layer 132 can change with the force applied to it. If the second resistivity is less than approximately 0.5 ohms / sq, impedance cannot be exhibited. If the second resistivity is greater than approximately 5 ohms / sq, touch functionality cannot be achieved.

[0049] For details, please refer to Figure 3 This is a power-voltage curve diagram illustrating the second sensing layer 132 according to an embodiment of this disclosure. Figure 3 As shown, in this embodiment, the voltage value measured on the second sensing layer 132 increases as the force applied to the second sensing layer 132 increases. Therefore, it can be deduced that the second resistivity of the second sensing layer 132 increases as the force applied to the second sensing layer 132 increases. Thus, the magnitude of the force applied to the second sensing layer 132 can be determined by measuring the voltage value of the second sensing layer 132.

[0050] With the aforementioned structural configuration, the second sensing layer 132 of the three-dimensional sensing element 130a can simultaneously serve as one of the touch electrodes and one of the pressure sensing electrodes, thereby enabling the touchpad assembly 130 to be thinner and reducing the manufacturing cost and manufacturing process of the product.

[0051] In some embodiments, the substrate 133 is a circuit board or a thin film substrate, but this disclosure is not limited thereto.

[0052] In some embodiments, the cover plate 134 is made of glass or plastic. In some embodiments, the plastic comprises polyester film (Mylar), but this disclosure is not limited thereto. Furthermore, since the cover plate 134 is disposed on... Figure 1 The touchpad area can be made of an opaque material.

[0053] In some embodiments, the bonding layer 135 is a pressure-sensitive adhesive (PSA), which is an adhesive that can adhere to the surface of an object when light pressure is applied, but this disclosure is not limited thereto.

[0054] In some embodiments, the material of the first sensing layer 131 comprises copper or a combination of molybdenum and aluminum (e.g., molybdenum-aluminum-molybdenum), but this disclosure is not limited thereto.

[0055] In some embodiments, the material of the first sensing layer 131 comprises a copper-nickel alloy. The proportion (e.g., weight percentage) of copper in the first sensing layer 131 is greater than about 95%, thereby making the first resistivity of the first sensing layer 131 equal to or less than about 0.5 ohm / sq.

[0056] In some embodiments, the second sensing layer 132 comprises a high-conductivity material and a low-conductivity material. The high-conductivity material accounts for a proportion (e.g., weight percentage) of the second sensing layer 132 equal to or greater than about 50%, and preferably 60%.

[0057] In some embodiments, the second sensing layer 132 comprises a high-conductivity material of copper. The second sensing layer 132 comprises a low-conductivity material of nickel. The ratio of copper to nickel (e.g., weight percentage) is from about 1.0 to about 5.0, preferably between 1.5 and 4.0, so that the second resistivity of the second sensing layer 132 is greater than about 0.5 ohm / sq and equal to or less than about 5 ohm / sq.

[0058] In some embodiments, at least one of the first sensing layer 131 and the second sensing layer 132 is a metal mesh. Therefore, the three-dimensional sensing element 130a of this embodiment not only has better anti-palm accidental touch performance, but also supports active styluses using any protocol.

[0059] Please refer to Figure 4 as well as Figure 5 . Figure 4 A partial cross-sectional schematic diagram is provided to illustrate a three-dimensional sensing element 130a according to an embodiment of the present disclosure. Figure 5 A partial front view of a three-dimensional sensing element 130a according to another embodiment of this disclosure is shown. Figure 4 and Figure 5As shown, in this embodiment, the first sensing layer 131 includes a plurality of first touch electrode patterns 131a and a plurality of second touch electrode patterns 131b. The first touch electrode patterns 131a extend along a first direction A1 and are arranged at intervals. In other words, the first touch electrode patterns 131a can be considered as first axial electrodes. The second touch electrode patterns 131b are arranged in a matrix along the first direction A1 and the second direction A2. The second sensing layer 132 includes a plurality of bridging structures 132a and a plurality of strain gauge patterns 132b. Each bridging structure 132a spans the lower first touch electrode pattern 131a to connect two adjacent second touch electrode patterns 131b arranged in the second direction A2. In other words, the bridging structure 132a of the second touch electrode patterns 131b sequentially connected in the same straight line can be considered as second axial electrodes. In addition, the strain gauge patterns 132b are located in other empty positions of the second sensing layer 132 besides the bridging structures 132a. The strain gauge patterns 132b are configured to sense strain to achieve force sensing. It should be noted that each bridging structure 132a has two ends that pass through the insulating layer 131c through the opening 131c1 of the insulating layer 131c so that the two second touch electrode patterns 131b can be electrically connected. The bridging structure 132a and the multiple strain gauge patterns 132b are electrodes of the same layer, which is a solid metal layer non-metal mesh. This is because the touch panel assembly 130 of this case is located in the non-screen display area, so there is no need to consider the light transmittance.

[0060] In some embodiments, the strain gauge patterns 132b of the second sensing layer 132 can be arranged in a rectangular pattern of four and wound around a wire to sense different strains in the first direction A1 and the second direction A2, thereby achieving force sensing. Furthermore, through the aforementioned arrangement and connection method, the four strain gauge patterns 132b can achieve a balance of temperature changes, thereby eliminating the influence of temperature while minimizing interference with the touch signal.

[0061] Please refer to Figure 6 This is a cross-sectional schematic diagram illustrating a touchpad assembly 330 according to another embodiment of this disclosure. Figure 6 As shown, in this embodiment, the touchpad assembly 330 includes a cover plate 134, a three-dimensional sensing element 330a, a substrate 133, and a connecting layer 135, wherein the cover plate 134, the substrate 133, and the connecting layer 135 are the same as or similar to... Figure 2 The embodiments shown are therefore described in detail above, and will not be repeated here. Compared to Figure 2In the embodiment shown, the first sensing layer 331 and the second sensing layer 332 of the three-dimensional sensing element 330a are respectively stacked on opposite sides of the substrate 133. Specifically, the first sensing layer 331 is disposed on the side of the substrate 133 away from the cover plate 134. The second sensing layer 332 is disposed on the side of the substrate 133 facing the cover plate 134 and is connected to the cover plate 134 via a connecting layer 135. The first sensing layer 331 includes a plurality of first axial electrodes spaced apart from each other. The second sensing layer 332 includes a plurality of second axial electrodes spaced apart from each other. The first sensing layer 331 and the second sensing layer 332 are electrically insulated from each other by the substrate 133. The aforementioned "first axis" and "second axis" extend, for example, along a first direction A1 and a second direction A2, respectively. In other words, the first axial electrodes are conductive lines extending along the first direction A1 and are arranged at intervals. The second axial electrodes are conductive lines extending along the second direction A2 and are arranged at intervals. Additionally, at least one of the first sensing layer 331 and the second sensing layer 332 is a metal mesh; that is, for example, an industry-standard metal mesh integrated capacitive touch screen (OGM) is used.

[0062] From the detailed description of the specific embodiments disclosed above, it can be clearly seen that in the touch panel assembly disclosed herein, by using one of the two sensing layers of the three-dimensional sensing element as both a touch electrode and a pressure sensing electrode, the touch panel assembly can be made thinner, and the manufacturing cost of the product can be reduced and the manufacturing process can be simplified.

[0063] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope defined in the appended claims.

Claims

1. A touchpad assembly, characterized in that, Include: A cover plate; and A three-dimensional sensing element, superimposed on the cover plate, includes: A first sensing layer extends along a first direction and has a first resistivity equal to or less than 0.5 ohm / sq. The first sensing layer serves as part of a first touch electrode and a second touch electrode. A second sensing layer is provided extending along a second direction and has a second resistivity greater than 0.5 ohm / sq and equal to or less than 5 ohm / sq. The second sensing layer serves as another part of the second touch electrode and a pressure sensing electrode.

2. The touchpad assembly as claimed in claim 1, characterized in that, It further includes a substrate, wherein the first sensing layer and the second sensing layer are stacked on one side of the substrate.

3. The touchpad assembly as claimed in claim 2, characterized in that, A bridging structure is formed at the overlap of the first sensing layer and the second sensing layer.

4. The touchpad assembly as claimed in claim 3, characterized in that, The second sensing layer further includes a strain gauge pattern.

5. The touchpad assembly as claimed in claim 1, characterized in that, The material of the first sensing layer contains copper, or a combination of molybdenum and aluminum.

6. The touchpad assembly as claimed in claim 5, characterized in that, The material of the first sensing layer includes a copper-nickel alloy, and copper accounts for more than 95% of the first sensing layer.

7. The touchpad assembly as claimed in claim 1, characterized in that, The second sensing layer comprises a high conductivity material and a low conductivity material, and the high conductivity material accounts for 50% or more of the second sensing layer.

8. The touchpad assembly as claimed in claim 7, characterized in that, The high conductivity material is copper, the low conductivity material is nickel, and the ratio of copper to nickel is 1.0 to 5.

0.

9. The touchpad assembly as claimed in claim 1, characterized in that, At least one of the first sensing layer and the second sensing layer is a metal mesh.

10. The touchpad assembly as claimed in claim 9, characterized in that, The width of a single line in the metal mesh ranges from 3 micrometers to 50 micrometers.

11. The touchpad assembly as claimed in claim 1, characterized in that, The second resistivity increases as the force applied to the second sensing layer increases.

12. A touchpad assembly, characterized in that, Include: A cover plate; and A three-dimensional sensing element, superimposed on the cover plate, includes: A first sensing layer is provided extending along a first direction and has a first resistivity equal to or less than 0.5 ohm / sq, the first sensing layer serving as a first touch electrode; as well as A second sensing layer is provided extending along a second direction and has a second resistivity greater than 0.5 ohm / sq and equal to or less than 5 ohm / sq. The second sensing layer serves as a second touch electrode and a pressure sensing electrode.

13. The touchpad assembly as claimed in claim 12, characterized in that, It further includes a substrate, wherein the first sensing layer and the second sensing layer are respectively stacked on opposite sides of the substrate.

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