Component pickup mechanism and component transfer system

Abstract

This application provides a component pickup mechanism and a component transfer system. The component pickup mechanism includes a substrate, an adsorption functional layer, and an adjustment mechanism. The substrate includes a first surface located in its thickness direction and a second surface connected to the edge of the first surface, the second surface being inclined relative to the first surface. The adsorption functional layer is disposed on the first surface of the substrate. The adjustment mechanism includes an adjustment unit disposed on the first surface and a connecting line connected to the adjustment unit. The adjustment unit is electrically connected to a control mechanism via the connecting line. The adjustment unit is configured to adjust the adsorption capacity of the adsorption functional layer for the component to be transferred under the control of the control mechanism. The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends from the second surface to the first surface.

Description

Technical Field

[0001] This application relates to the field of component transfer equipment technology, and in particular to a component picking mechanism and component transfer system. Background Technology

[0002] With the development of science and technology, electronic devices are becoming increasingly complex, and the electrical components inside these devices are gradually becoming miniaturized. By reducing the size of these components, more can be integrated into a limited space, thereby improving the user experience.

[0003] Miniaturized electrical components often require transfer, but existing pickup structures are prone to failure and lack reliability. Summary of the Invention

[0004] This application provides a component pickup mechanism and a component transfer system that can achieve mass transfer.

[0005] In a first aspect, embodiments of this application provide a component pickup mechanism, which includes a substrate, an adsorption functional layer, and an adjustment mechanism. The substrate includes a first surface located in its own thickness direction and a second surface connected to the edge of the first surface, the second surface being inclined relative to the first surface.

[0006] An adsorption functional layer is disposed on a first surface of the substrate. The adjustment mechanism includes an adjustment unit disposed on the first surface and a connecting line connected to the adjustment unit. The adjustment unit is electrically connected to a control mechanism via the connecting line. The adjustment unit is configured to adjust the adsorption capacity of the adsorption functional layer for the element to be transferred under the control of the control mechanism. The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends from the second surface to the first surface.

[0007] In some embodiments, the substrate includes a support structure and a substrate disposed on the support structure, with a first surface located on a side of the substrate opposite to the support structure. A second surface is located on at least one side of the substrate in a direction parallel to the first surface.

[0008] In some embodiments, the component pickup mechanism further includes a conductive portion disposed on the side of the connecting line away from the second surface, one end of the conductive portion being connected to the connecting line and the other end being connected to the control mechanism, so as to realize signal transmission between the connecting line and the control mechanism.

[0009] In some embodiments, in a direction parallel to the first surface, the support structure extends at least partially beyond the substrate, such that at least a portion of the control mechanism is disposed on the support structure.

[0010] In some embodiments, the component pickup mechanism further includes a conductive portion and a support portion disposed on the substrate-facing side of the support structure. In a direction parallel to the first surface, the support portion is located between the substrate and the control mechanism. The conductive portion is located on the side of the control mechanism away from the support structure and is electrically connected to the control mechanism. The conductive portion extends through the side of the support portion away from the support structure to the second surface and is electrically connected to the connecting line.

[0011] In some embodiments, the connecting line includes a first portion located on a first surface, and a second portion connecting the first portion and the control mechanism. The second portion covers at least a portion of the control mechanism and extends to the second surface.

[0012] In some embodiments, the average width of the second part is greater than the average width of the first part.

[0013] In some embodiments, in a direction parallel to the first surface, the support structure includes a third surface, the second surface and the third surface are located on the same plane, and the control mechanism is configured to be disposed on the third surface.

[0014] In some embodiments, the adjustment unit is at least partially located between the adsorption functional layer and the first surface; and / or, the orthographic projection of the adjustment unit on the first surface is at least partially located outside the orthographic projection of the adsorption functional layer on the first surface, so that at least a portion of the adjustment unit is exposed relative to the adsorption functional layer.

[0015] In some embodiments, the adsorption functional layer includes a plurality of adsorption functional blocks spaced apart, with at least some adjustment units located between adjacent adsorption functional blocks; and / or,

[0016] At least some of the adjustment units can also be located between the adsorption functional block and the first surface.

[0017] In some embodiments, there are multiple second surfaces, which are disposed on different edges of the first surface, and at least some connecting lines extend to the first surface via different second surfaces.

[0018] In some embodiments, the first surface includes a first central region, a plurality of second surfaces, and a plurality of connecting lines symmetrically distributed relative to the first central region.

[0019] In some embodiments, the adjustment unit includes a first connection terminal and a second connection terminal, which are electrically connected to different connection lines respectively.

[0020] In some embodiments, at least some of the first connection ends of different adjustment units are electrically connected to the same connection line, that is, at least some of the connection lines can be connected to multiple adjustment units at the same time.

[0021] Secondly, embodiments of this application provide a component transfer system, which includes a donor substrate, a target substrate, a component pickup mechanism, a transfer mechanism, and a control mechanism. The donor substrate has a component to be transferred disposed on it. The component pickup mechanism is the component pickup mechanism described in any of the foregoing embodiments. At least one of the donor substrate, the target substrate, and the component pickup mechanism is disposed within the transfer mechanism, which is configured to adjust the distance between the component pickup mechanism and the donor substrate and the target substrate. The control mechanism is configured to adjust the environmental conditions of the adsorption functional layer to change the adsorption capacity of the adsorption functional layer for the component to be transferred.

[0022] This application provides a component pickup mechanism and a component transfer system. By tilting the second surface relative to the first surface in a direction away from the adsorption functional layer, and extending the connecting line from the second surface into the first surface, the electrical connection between the control mechanism and the adjustment unit can be satisfied. At the same time, it can reduce the risk of physical interference between the wiring structure on the second surface of the connecting line and the corresponding transfer substrate during component pickup or release, reduce the probability of connection line damage, improve the reliability of the connecting line, and help improve the service life of the component pickup mechanism and the reliability of the transfer of the component to be transferred. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional structural schematic diagram of a component pickup mechanism provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of a component transfer system provided in an embodiment of this application;

[0026] Figure 3 This is a cross-sectional structural schematic diagram of another component pickup mechanism provided in the embodiments of this application;

[0027] Figure 4 This is a cross-sectional structural schematic diagram of another component pickup mechanism provided in the embodiments of this application;

[0028] Figure 5 This is a cross-sectional structural schematic diagram of another component pickup mechanism provided in the embodiments of this application;

[0029] Figure 6 This is a cross-sectional structural schematic diagram of another component pickup mechanism provided in the embodiments of this application;

[0030] Figure 7 This is a schematic diagram of another component pickup mechanism provided in the embodiments of this application;

[0031] Figure 8 This is a cross-sectional structural schematic diagram of another component pickup mechanism provided in the embodiments of this application;

[0032] Figure 9 This is a cross-sectional structural schematic diagram of another component pickup mechanism provided in the embodiments of this application.

[0033] Marker explanation:

[0034] 100. Component pickup mechanism; 200. Donor substrate; 300. Target substrate; 400. Transfer mechanism; 500. Leveling mechanism; 600. Control mechanism;

[0035] 10. Substrate; 11. Supporting structure; 12. Substrate;

[0036] 20. Adsorption functional layer; 21. Adsorption functional block;

[0037] 30. Adjustment mechanism; 31. Adjustment unit; 32. Connecting line; 321. First part; 322. Second part;

[0038] 40. Conducting part;

[0039] 50. Support section;

[0040] J. Component to be transferred;

[0041] A. First Central Area;

[0042] D1, First connection terminal; D2, Second connection terminal;

[0043] M1, First side; M2, Second side; M3, Third side;

[0044] X, first direction; Y, thickness direction. Detailed Implementation

[0045] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0047] With the advancement of technology, the complexity of electrical equipment is gradually increasing. Taking MicroLED display technology as an example, MicroLED display devices are an advanced display technology based on micro-LEDs (micro-light-emitting diodes). It refers to the mass transfer of micro-LEDs as light-emitting elements onto a circuit board to form a matrix of self-emissive pixels with ultra-small pitch. By precisely controlling the brightness of each light-emitting element, high brightness, high contrast, and high resolution image display can be achieved.

[0048] In MicroLED displays, each pixel is addressable and individually driven to light up, making it a miniaturized version of outdoor LED displays, reducing pixel spacing from millimeters to micrometers. Compared to existing display technologies, MicroLED displays offer advantages such as high brightness, low power consumption, ultra-high resolution, and color saturation. They also possess numerous advantages, including transparency, flexibility, stretchability, and deep integration with microsensors, thus breaking through traditional display application scenarios. Therefore, MicroLED is considered a revolutionary display technology for the future.

[0049] In the fabrication process of MicroLED display devices, microLEDs need to be transferred. During the transfer process, a picking mechanism is usually needed to pick up and release the microLEDs. In this process, the picking mechanism is prone to physical interference with the corresponding transfer substrate, which can cause some of its own structure to malfunction and affect the reliability of the transfer.

[0050] In view of this, firstly, please refer to Figure 1 This application provides a component pickup mechanism 100, which includes a substrate 10, an adsorption functional layer 20 and an adjustment mechanism 30. The substrate 10 includes a first surface M1 located in its own thickness direction Y and a second surface M2 connected to the edge of the first surface M1. The second surface M2 is inclined relative to the first surface M1.

[0051] An adsorption functional layer 20 is disposed on the first surface M1 of the substrate 10. The adjustment mechanism 30 includes an adjustment unit 31 disposed on the first surface M1 and a connecting line 32 connected to the adjustment unit 31. The adjustment unit 31 is electrically connected to the control mechanism 600 via the connecting line 32. The adjustment unit 31 is configured to adjust the adsorption capacity of the adsorption functional layer 20 for the transfer element J under the control of the control mechanism 600. The second surface M2 is inclined away from the adsorption functional layer 20 relative to the first surface M1, and the connecting line 32 extends from the second surface M2 to the first surface M1.

[0052] Combination Figure 2 It can be seen that the component pickup mechanism 100 provided in this application embodiment is applicable to a component transfer system. The component pickup mechanism 100 is used to pick up and release the component J to be transferred to meet the transfer needs of the component J. The component J to be transferred includes, but is not limited to, light-emitting elements and driving control elements. For ease of description, the following embodiments of this application will use the component J to be transferred as a light-emitting element as an example, wherein the light-emitting element includes, but is not limited to, the micro LED in the MicroLED display device.

[0053] The component pickup mechanism 100 includes a substrate 10, which mainly serves as a support. The substrate 10 may include various film layer structures stacked together, which is not limited in this embodiment. The substrate 10 includes a first surface M1 and a second surface M2. The first surface M1 is located on one side in the thickness direction Y of the substrate 10, and the second surface M2 is connected to the edge of the first surface M1 and is inclined relative to the first surface M1. The specific shape and size of the first surface M1 and the second surface M2 are not limited in this embodiment. Optionally, the first surface M1 may be square, that is, the first surface M1 has four straight edges. Based on this, the number of second surfaces M2 can be one or more. When there are multiple second surfaces M2, the multiple second surfaces M2 can be connected to different straight edges of the first surface M1, and the inclination angles of the different second surfaces M2 relative to the first surface M1 can be the same or different.

[0054] Both the adsorption functional layer 20 and the adjustment mechanism 30 are located on the first surface M1 side of the substrate 10. The adsorption functional layer 20 has at least two states. In one state, the adsorption functional layer 20 has a large adsorption strength for the element J to be transferred, so that the element J to be transferred can be picked up by the adsorption functional layer 20. In the other state, the adsorption functional layer 20 has no adsorption capacity for the element J to be transferred, or the adsorption functional layer 20 has only a small adsorption capacity for the element J to be transferred, so that the element J to be transferred can detach from the adsorption functional layer 20 under the influence of factors such as gravity.

[0055] The adjustment mechanism 30 is used to adjust the adsorption capacity of the adsorption functional layer 20 for the transfer element J. Specifically, the adjustment mechanism 30 includes an adjustment unit 31, which, under the control of the control mechanism 600, can change the environmental conditions of the adsorption functional layer 20 to alter its adsorption capacity. These environmental conditions include the electric field environment, magnetic field environment, optical environment, and temperature environment of the adsorption functional layer 20.

[0056] Specifically, when the adsorption functional layer 20 includes an adhesively adjustable temperature-sensitive material, a programmable heater array can be disposed on the substrate 10. The heaters are microresistors with micron-level dimensions and resistivity. When the control mechanism 600 inputs a level signal to the heater array, at least some of the heaters are activated, heating the temperature-sensitive material on the adsorption functional layer 20, causing a change in its surface adhesion, thereby meeting the needs of picking up or releasing the element J to be transferred.

[0057] Alternatively, when the adsorption functional layer 20 includes a magnetic material with adjustable magnetic force, a programmable magnetic drive array can be disposed on the substrate 10. The magnetic drive array has coils with micron-sized coils. When the control mechanism 600 inputs a level signal to the magnetic drive array, at least some of the magnetic drive units are activated, magnetizing the magnetic material on the adsorption functional layer 20, causing a change in its surface adsorption capacity, thereby meeting the needs of picking up or releasing the element J to be transferred.

[0058] It should be noted that the relative positional relationship between the adjustment unit 31 and the adsorption functional layer 20 is not limited in this embodiment. Optionally, the adjustment unit 31 may be located between the adsorption functional layer 20 and the substrate 10, or the adsorption functional layer 20 may have a corresponding groove structure in which the adjustment unit 31 is at least partially embedded; or the adsorption functional layer 20 may have a corresponding through-hole structure in which the adjustment unit 31 is at least partially located within the through-hole structure and exposed relative to the adsorption functional layer 20 through the through-hole structure.

[0059] The connecting line 32 is used to electrically connect the control mechanism 600 and the adjustment unit 31. The control mechanism 600 can control the adjustment unit 31 through the connecting line 32. Furthermore, the control mechanism 600 is not located on the first surface M1, while the adjustment unit 31 is located on the first surface M1. To meet the electrical connection requirements of the connecting line 32, the connecting line 32 needs to extend from the second surface M2 to the first surface M1 to achieve connection with the adjustment unit 31. Furthermore, the wiring structure of the connecting line 32 located on the second surface M2 can also extend to the outside to achieve electrical connection with the control mechanism 600. Alternatively, the control mechanism 600 can also achieve electrical connection with the wiring structure of the connecting line 32 located on the second surface M2 through other external wiring. Based on this, if the second surface M2 is coplanar with the first surface M1, or if the second surface M2 is inclined relative to the first surface M1 towards the adsorption functional layer 20... During the process of picking up or releasing the component J to be transferred by the component pickup mechanism 100, the distance between the component pickup mechanism 100 and the corresponding transfer substrate is relatively short. Due to the presence of the adsorption functional layer 20, the trace structure on the first surface M1 of the connection line 32 can reduce the risk of physical interference with the corresponding transfer substrate. However, since the adsorption functional layer 20 is not provided on the second surface M2, the trace structure on the second surface M2 of the connection line 32 will be exposed, which can easily lead to the risk of physical interference with the corresponding transfer substrate.

[0060] In view of this, in this embodiment, the second surface M2 is inclined relative to the first surface M1 in a direction away from the adsorption functional layer 20, and the connecting line 32 extends from the second surface M2 into the first surface M1. This can not only meet the electrical connection requirements between the control mechanism 600 and the adjustment unit 31, but also reduce the risk of physical interference between the wiring structure on the second surface M2 and the corresponding transfer substrate during the component picking or releasing process, reduce the probability of damage to the connecting line 32, improve the reliability of the connecting line 32, and help improve the service life of the component picking mechanism 100 and the transfer reliability of the component J to be transferred.

[0061] It should be noted that the routing method of the connecting line 32 on the first surface M1 and the second surface M2 is not limited in this embodiment. Wherein, if the component pickup mechanism 100 includes multiple adjustment units 31, the number of connecting lines 32 can also be multiple, with each of the multiple connecting lines 32 correspondingly connected to one of the multiple adjustment units 31.

[0062] Furthermore, the fabrication and formation process of the component pickup mechanism 100 are not limited in this embodiment. Optionally, a programmable driver array is first fabricated on the substrate 12 using microfabrication technology, i.e., an adjustment unit 31 is formed. Then, one side of the substrate 12 is switched using a dicing device to form an inclined surface at a certain angle, i.e., a second surface M2 is formed. Subsequently, a continuous conductive film is formed on a portion of the first surface M1 and the second surface M2 of the substrate 12 using thin film deposition technology. Then, the continuous conductive film is divided into different conductive bonding areas using laser cutting technology, i.e., connecting lines 32 are formed. Subsequently, an adsorption functional layer 20 is formed on the substrate 12, and finally, the electrical connection between the connecting lines 32 and the control mechanism 600 is realized using external leads or aerosol printing technology.

[0063] In some embodiments, such as Figure 1 and Figure 2 As shown, the substrate 10 includes a support structure 11 and a substrate 12 disposed on the support structure 11. A first surface M1 is located on the side of the substrate 12 opposite to the support structure 11. A second surface M2 is located on at least one side of the substrate 12 in a direction parallel to the first surface M1.

[0064] The support structure 11 and the substrate 12 are stacked, both serving a supporting and load-bearing function, and the support structure 11 also serves to fix the substrate 12. Optionally, the support structure 11 can be a rigid structure, and the substrate 12 can be a flexible structure. The embodiments of this application do not limit the shape and size relationship between the support structure 11 and the substrate 12. Optionally, in at least one direction parallel to the first surface M1, the support structure 11 can be flush with the substrate 12, or the support structure 11 can extend beyond the substrate 12.

[0065] The first surface M1 is the surface of the substrate 12 facing away from the support structure 11. The adsorption functional layer 20 is disposed on the first surface M1, that is, the adsorption functional layer 20 is located on the side of the substrate 12 facing away from the support structure 11. A second surface M2 is located on at least one side of the substrate 12 in a direction parallel to the first surface M1. The number of second surfaces M2 can be one or more. When there is only one second surface M2, it is located on one side of the first surface M1 only along one direction parallel to the first surface M1. When there are multiple second surfaces M2, they can be located on different sides of the first surface M1 along different directions parallel to the first surface M1.

[0066] Furthermore, when there are multiple second surfaces M2, multiple connecting lines 32 can be distributed on different second surfaces M2, that is, at least some different connecting lines 32 extend to the first surface M1 via different second surfaces M2, thereby reducing the risk of excessive wiring density on a single second surface M2 and reducing the difficulty of wiring layout of connecting lines 32 on the second surface M2, which has strong practicality.

[0067] In some embodiments, please refer to Figure 3 The component pickup mechanism 100 also includes a conductive part 40 disposed on the side of the connecting line 32 away from the second surface M2. One end of the conductive part 40 is connected to the connecting line 32 and the other end is connected to the control mechanism 600 to realize signal transmission between the connecting line 32 and the control mechanism 600.

[0068] Considering that the connecting line 32 is at least partially located on the first surface M1 and the second surface M2, while the control mechanism 600 is not located on either the first surface M1 or the second surface M2, in order to improve the flexibility of the component pickup mechanism 100, this embodiment of the application separates the connecting line 32 from the control mechanism 600, that is, the connecting line 32 does not directly contact or connect with the control mechanism 600. This allows for free adjustment of the specific position of the component pickup mechanism 100 without considering the position of the control mechanism 600, thereby improving the flexibility of the component pickup mechanism 100. Furthermore, this also reduces the risk of damage to the connecting line 32 due to stress caused by relative movement between the component pickup mechanism 100 and the control mechanism 600, thus improving the reliability and service life of the component pickup mechanism 100.

[0069] In addition to this, to achieve electrical connection between the connecting line 32 and the control mechanism 600, this embodiment of the application further provides a conductive part 40, which is located on the side of the connecting line 32 away from the second surface M2. Exemplarily, the conductive part has two opposing ends, one end of which is in contact with the wiring structure on the second surface M2 of the connecting line 32, and the other end is in contact with the control mechanism 600 outside the component pickup mechanism 100.

[0070] The conductive part 40 can meet the electrical connection requirements between the connecting line 32 and the control mechanism 600. Even if the conductive part 40 is damaged due to external forces or other factors, since the conductive part 40 does not contact the substrate 12, replacing the conductive part 40 is less difficult and less costly than replacing the connecting line 32, thereby helping to reduce the maintenance difficulty and cost of the component picking mechanism 100.

[0071] In some embodiments, please refer to Figure 4In a direction parallel to the first surface M1, the support structure 11 extends at least partially beyond the substrate 12, such that at least a portion of the control mechanism 600 is disposed on the support structure 11. Exemplarily, the first direction X is a direction parallel to the first surface M1, in which the support structure 11 extends beyond the substrate 12.

[0072] In this embodiment, the support structure 11 not only supports the substrate 12, but also supports the control mechanism 600. Furthermore, the presence of the support structure 11 can fix the relative positions of the substrate 12 and the control mechanism 600, thereby reducing the risk of relative displacement between the two during component transfer and improving the reliability of the component transfer process.

[0073] It should be noted that the control mechanism 600 and the substrate 12 may be located on the same side of the support structure 11 in the thickness direction Y, or they may be located on different sides of the support structure 11 in the thickness direction Y. This application embodiment does not limit this.

[0074] In some embodiments, the component pickup mechanism 100 further includes a conductive portion 40 and a support portion 50 disposed on the side of the support structure 11 facing the substrate 12. In a direction parallel to the first surface M1, the support portion 50 is located between the substrate 12 and the control mechanism 600. The conductive portion 40 is located on the side of the control mechanism 600 opposite to the support structure 11 and is electrically connected to the control mechanism 600. The conductive portion 40 extends through the side of the support portion 50 opposite to the support structure 11 to the second surface M2 and is electrically connected to the connecting line 32.

[0075] As can be seen from the foregoing and the accompanying drawings, the second surface M2 intersects with the first direction X, and the control mechanism 600 is located on one side of the substrate 12 along the first direction X. In this case, if the electrical connection between the connecting line 32 and the control mechanism 600 is achieved by means of the conductive part 40, the conductive part 40 needs to extend from the second surface M2 to the surface of the support structure 11 facing the control mechanism 600. However, due to the gap between the substrate 12 and the control structure in the first direction X, the conductive part 40 may be at risk of damage at the junction of the second surface M2 and the surface of the support structure 11.

[0076] Therefore, in this embodiment, a support portion 50 is added to the support structure 11. The support portion 50 is located between the substrate 12 and the control mechanism 600, and can fill at least part of the gap formed by the substrate 12 and the control mechanism 600. Furthermore, the conductive portion 40 located on the second surface M2 can extend from the surface of the support structure 11 into the control mechanism 600 via the support portion 50, thereby achieving contact connection between the conductive portion 40 and the control mechanism 600, and satisfying the need for electrical connection between the connecting line 32 and the control mechanism 600.

[0077] It should be noted that the material composition and formation method of the support portion 50 are not limited in the embodiments of this application. Optionally, the support portion 50 can be filled between the control mechanism 600 and the substrate 12 using an insulating material such as a polymer. Then, conductive ink is printed on the side of the connecting line 32 away from the second surface M2 using aerosol printing technology, and extended through the support portion 50 to the control mechanism 600, thereby realizing the fabrication of the conductive portion 40.

[0078] In some embodiments, please refer to Figure 5 The connecting line 32 includes a first portion 321 located on the first surface M1, and a second portion 322 connecting the first portion 321 and the control mechanism 600. The second portion 322 covers at least a portion of the control mechanism 600 and extends to the second surface M2.

[0079] The connecting line 32 includes a first portion 321 and a second portion 322. The first portion 321 is located on a first surface M1, and the second portion 322 is partially located on a second surface M2. The first portion 321 and the second portion 322 can be formed separately in different processes. Optionally, the second portion 322 can be partially located on the first surface M1 to achieve connection with the first portion 321. The first portion 321 and the second portion 322 can be made of the same material or different materials; this embodiment does not impose any limitations on this.

[0080] Optionally, the materials in the first portion 321 and the second portion 322 include, but are not limited to, metals (gold, silver, copper, aluminum, etc.), semiconductors (such as ITO, etc.), conductive polymers (such as PEDOT, etc.), conductive two-dimensional materials, composite conductive materials, etc. The thickness of the first portion 321 and the second portion 322 is not limited in this embodiment. Optionally, the thickness of at least one of the first portion 321 and the second portion 322 is less than 10 μm.

[0081] In this embodiment, the first portion 321 and the second portion 322 of the connecting line 32 are formed in different processes, thereby reducing the difficulty of fabricating the connecting line 32 on the first surface M1 and the second surface M2. Meanwhile, the second portion 322 needs to be connected to the control mechanism 600 to transmit the corresponding electrical signal to the first portion 321.

[0082] Furthermore, to reduce the difficulty of extending the second part 322 and improve its reliability, in some optional embodiments, a support portion 50 is provided on the support structure 11, and the second part 322 can extend from the second surface M2 to the control mechanism 600 by means of the support portion 50 to achieve a connection with the control mechanism 600. Of course, in other embodiments, the support portion 50 may not be provided, that is, the second part 322 extends directly from the second surface M2 to the control mechanism 600.

[0083] In some embodiments, please refer to Figure 5 and Figure 7 The average width of the second part 322 is greater than the average width of the first part 321. The thickness of the second part 322 can be the same or different at different locations. Similarly, the thickness of the first part 321 can be the same or different at different locations.

[0084] As can be seen from the foregoing, the first portion 321 on the first surface M1 is protected by the adsorption functional layer 20, while the second portion 322 on the second surface M2 is not protected by the adsorption functional layer 20. Therefore, to reduce the risk of damage to the second portion 322 due to external forces or other factors, this embodiment sets the average width of the second portion 322 to be greater than the average width of the first portion 321. This reduces the risk of damage to the second portion 322 during the release or pickup of the component J by the component pickup mechanism 100, thereby improving the structural reliability of the second portion 322.

[0085] In some embodiments, please refer to Figure 6 In the direction parallel to the first surface M1, the support structure 11 includes a third surface M3, the second surface M2 and the third surface M3 are located on the same plane, and the control mechanism 600 is configured to be disposed on the third surface M3.

[0086] In this embodiment, the third surface M3 on the support structure 11 and the second surface on the substrate 12 are located on the same plane, and the control mechanism 600 can be located on the third surface M3. Based on this, the second portion 322 located on the second surface M2 can easily extend to the third surface M3 and achieve a connection with the control mechanism 600. This design allows for easy electrical connection between the connecting line 32 and the control mechanism 600 without adding an additional support portion 50.

[0087] In some embodiments, such as Figure 5 As shown, the adjustment unit 31 is at least partially located between the adsorption functional layer 20 and the first surface M1.

[0088] In this embodiment, the adjustment unit 31 is sandwiched between the adsorption functional layer 20 and the substrate 12, taking the ability of the adjustment unit 31 to change the ambient temperature of the adsorption functional layer 20 as an example. Under the control of the electrical signal of the control mechanism 600, the adjustment unit 31 can generate a certain amount of heat. The generated heat can be transferred to the surface of the adsorption functional layer 20 facing the first surface M1, and then transferred from that surface to the side of the adsorption functional layer 20 away from the first surface M1, thereby increasing the temperature of at least some structures in the adsorption functional layer 20. Under the effect of the change in temperature conditions, the adsorption capacity of at least some structures in the adsorption functional layer 20 changes, thereby realizing the adsorption or release of the element J to be transferred.

[0089] Of course, in other embodiments, please refer to Figure 8 The adjustment unit 31 is at least partially located outside the orthographic projection of the adsorption functional layer 20 on the first surface M1, so that at least a portion of the adjustment unit 31 is exposed relative to the adsorption functional layer 20. Further optionally, the adsorption functional layer 20 may have a through-hole structure extending through the adsorption functional layer 20 along its thickness direction Y, with the adjustment unit 31 partially located within the through-hole structure, thus exposing it relative to the adsorption functional layer 20.

[0090] In some embodiments, such as Figure 8 As shown, the adsorption functional layer 20 includes a plurality of adsorption functional blocks 21 spaced apart, and at least some of the adjustment units 31 are located between adjacent adsorption functional blocks 21.

[0091] The adsorption functional layer 20 includes multiple adsorption functional blocks 21. The number of adsorption functional blocks 21 is not limited in this embodiment. The number of adsorption functional blocks 21 can be greater than the number of adjustment units 31, or it can be less than or equal to the number of adjustment units 31. Furthermore, the multiple adsorption functional blocks 21 can be arranged at intervals along a single direction, or they can be arranged at intervals along multiple different directions.

[0092] At least a portion of the adjustment unit 31 is located between adjacent adsorption functional blocks 21, so that the adjustment unit 31 can be exposed relative to the adsorption functional layer 20. Based on this, the adjustment unit 31 can change the environmental conditions corresponding to the surrounding adjacent adsorption functional blocks 21 under the control of the control mechanism 600, thereby changing the adsorption capacity corresponding to the adsorption functional block 21 and realizing the adsorption or release of the element to be transferred J.

[0093] Alternatively, in some embodiments, at least some of the adjustment units 31 may be disposed between the adsorption functional block 21 and the first surface M1. In this way, the adjustment unit 31 can also change the environmental conditions of the corresponding adsorption functional block 21, thereby changing the adsorption capacity of the adsorption functional block 21. Further optionally, there are multiple adjustment units 31, with some adjustment units 31 located between adjacent adsorption functional blocks 21 and some adjustment units 31 located between the adsorption functional block 21 and the first surface M1.

[0094] In some embodiments, please refer to Figure 9 There are multiple second surfaces M2, which are located on different edges of the first surface M1. At least some of the connecting lines 32 extend to the first surface M1 via different second surfaces M2.

[0095] In this embodiment, there are multiple second surfaces M2, and each second surface M2 can be arranged with a wiring structure. Based on this, by setting at least some of the connecting lines 32 on different second surfaces M2, the wiring density on a single second surface M2 is reduced, the risk of physical interference and signal crosstalk of the connecting lines 32 on the second surface M2 is reduced, and the reliability is improved.

[0096] It should be noted that the embodiments of this application do not limit the shape and size of different second surfaces M2, their specific arrangement position relative to the first surface M1, and their tilt angle. In some embodiments, the first surface M1 includes a first central region A, and a plurality of second surfaces M2 and a plurality of connecting lines 32 are symmetrically distributed relative to the first central region A.

[0097] The first central region A is the geometric center region corresponding to the first surface M1. Multiple second surfaces M2 and multiple connecting lines 32 can be symmetrically arranged relative to the first central region A. For example, there are two second surfaces M2, symmetrically distributed on both sides of the first central region A along the first direction X; or there are four second surfaces M2, arranged symmetrically around the first central region A in pairs.

[0098] In this embodiment, by setting the second surface M2 and the connecting line 32 symmetrically relative to the first central region A, the manufacturing difficulty of the second surface M2 and the routing difficulty of the connecting line 32 on the second surface M2 can be reduced, thereby reducing the manufacturing difficulty and cost of the component picking mechanism 100, which has strong practicality.

[0099] In some embodiments, such as Figure 7 As shown, the adjustment unit 31 includes a first connection terminal D1 and a second connection terminal D2, which are electrically connected to different connection lines 32 respectively.

[0100] Each adjustment unit 31 has two electrical connection ports, each used to connect to a different connection line 32. Therefore, for a single adjustment unit 31 to operate, the control mechanism 600 needs to control at least two connection lines 32 to apply electrical signals to the adjustment unit 31. Accordingly, the control mechanism 600 can selectively control some connection lines 32 to transmit corresponding electrical signals while others do not, thus enabling some adjustment units 31 to operate and others to remain inactive. This allows for selective modification of the adsorption capacity in some or all areas of the adsorption functional layer 20 according to actual conditions, thereby improving the flexibility of the element pickup mechanism 100 in the process of picking up or releasing the element J to be transferred.

[0101] Furthermore, in some optional embodiments, at least some of the first ends of the adjustment units 31 are electrically connected to the same connecting line 32, that is, at least some of the connecting lines 32 can be connected to multiple adjustment units 31 at the same time.

[0102] This design helps to reduce the number of connecting lines 32, thereby reducing the wiring density and wiring difficulty of connecting lines 32 on the first surface M1 and the second surface M2. Furthermore, due to the reduction in the number of connecting lines 32, the control accuracy of the control mechanism 600 between different connecting lines 32 and the corresponding programming difficulty can also be reduced, thus making it highly practical.

[0103] Secondly, such as Figure 2 As shown, this application provides a component transfer system, which includes a donor substrate 200, a target substrate 300, a component pickup mechanism 100, a transfer mechanism 400, and a control mechanism 600. A component J to be transferred is disposed on the donor substrate 200. The component pickup mechanism 100 is the component pickup mechanism 100 described in any of the preceding embodiments. At least one of the donor substrate 200, the target substrate 300, and the component pickup mechanism 100 is disposed on the transfer mechanism 400, which is configured to adjust the distance between the component pickup mechanism 100 and the donor substrate 200 and the target substrate 300. The control mechanism 600 is configured to adjust the environmental conditions of the adsorption functional layer 20 to change the adsorption capacity of the adsorption functional layer 20 for the component J to be transferred.

[0104] The component transfer system is used to transfer the component J to be transferred from the donor substrate 200 to the target substrate 300. Optionally, the donor substrate 200 can be the growth substrate of the component J to be transferred, and the target substrate 300 can be a part of the structure in the display module including the array substrate. That is, the component transfer system can transfer the component J to be transferred from the growth substrate to the target substrate 300 to form a corresponding display device.

[0105] The component pickup mechanism 100 is used to pick up and release the component J to be transferred. The component pickup mechanism 100 includes a substrate 10 and an adsorption functional layer 20 located on one side of the substrate 10. The substrate 10 mainly plays the role of support and bearing, and the adsorption functional layer 20 can play the function of picking up or releasing the component J to be transferred.

[0106] The transfer mechanism 400 is used to transfer at least one of the donor substrate 200, the target substrate 300, and the component pickup mechanism 100. Optionally, the control mechanism 600 can control both the operation of the transfer mechanism 400 and the environmental conditions of the adsorption functional layer 20. Specifically, optionally, the transfer mechanism 400 can control only the movement of the component pickup mechanism 100, while the donor substrate 200 and the target substrate 300 remain in a fixed position. In this case, under the control of the control mechanism 600, the transfer mechanism 400 can move the component pickup mechanism 100 closer to the donor substrate 200, and then the control mechanism 600 can adjust the environmental conditions of the adsorption functional layer 20 to change the state of the adsorption functional layer 20 so that it can pick up the component J to be transferred from the donor substrate 200. Then, the transfer mechanism 400 controls the component pickup mechanism 100 to move away from the donor substrate 200 and closer to the target substrate 300. Then, the control mechanism 600 controls and adjusts the environmental conditions of the adsorption functional layer 20 to change the state of the adsorption functional layer 20 so that it can no longer adsorb the element J to be transferred. Under the action of gravity and other factors, the element J to be transferred falls into the target substrate 300, completing the element transfer process.

[0107] Alternatively, in some alternative embodiments, the transfer mechanism 400 can simultaneously control the movement of both the donor substrate 200 and the target substrate 300, while the component pickup mechanism 100 remains in a fixed position. In this case, under the control of the control mechanism 600, the transfer mechanism 400 can move the donor substrate 200 closer to the component pickup mechanism 100. Then, the control mechanism 600 adjusts the environmental conditions of the adsorption functional layer 20 to change its state so that it can pick up the component J to be transferred from the donor substrate 200. Then, the transfer mechanism 400 controls the donor substrate 200 to move away from the component pickup mechanism 100 and controls the target substrate 300 to move closer to the component pickup mechanism 100. Afterward, the control mechanism 600 controls and adjusts the environmental conditions of the adsorption functional layer 20 to change its state so that it can no longer adsorb the component J to be transferred. Under the influence of gravity and other factors, the component J falls into the target substrate 300, completing the component transfer process.

[0108] Of course, in some alternative embodiments, the transfer mechanism 400 can also control the component picking mechanism 100, the donor substrate 200 and the target substrate 300 at the same time. This application does not limit this.

[0109] Furthermore, the component transfer system may also include a leveling mechanism 500, which can detect the flatness relationship between at least two of the donor substrate 200, the target substrate 300, and the component pickup mechanism 100. Taking the donor substrate 200 and the component pickup mechanism 100 as examples, the leveling mechanism 500 can detect the tilt angle of the donor substrate 200 toward the surface of the component pickup mechanism 100 relative to the surface of the component pickup mechanism 100 toward the surface of the donor substrate 200, and then adjust both according to the tilt angle. This ensures that during the process of the component pickup mechanism 100 picking up the component J to be transferred from the donor substrate 200, the surface of the component pickup mechanism 100 toward the donor substrate 200 is parallel to the surface of the donor substrate 200 toward the surface of the component pickup mechanism 100, thereby improving the picking accuracy of the component pickup mechanism 100 for the component J to be transferred and realizing the mass picking of the component J to be transferred.

[0110] Similarly, the leveling mechanism 500 can also detect the tilt angle of the target substrate 300 toward the surface of the component pickup mechanism 100 relative to the tilt angle of the component pickup mechanism 100 toward the surface of the target substrate 300, and then adjust both according to the tilt angle. This ensures that during the process of the component pickup mechanism 100 releasing the component to be transferred J, the surface of the component pickup mechanism 100 toward the target substrate 300 is parallel to the surface of the target substrate 300 toward the surface of the component pickup mechanism 100, thereby improving the release accuracy of the component pickup mechanism 100 for the component to be transferred J and achieving a large-scale release of the component to be transferred J.

[0111] In summary, in this embodiment, the component transfer system integrates a component pickup mechanism 100 and a moving mechanism. Based on this, the control mechanism 600 can control the adsorption capacity of the adsorption functional layer 20 in the component pickup mechanism 100, and can also control the relative position of the component pickup mechanism 100 relative to the donor substrate 200 and the target substrate 300 using the moving mechanism. This achieves centralized control of the entire component transfer process, facilitating intelligent coordination of the transfer process and improving its efficiency. Furthermore, the leveling mechanism 500 improves the accuracy of component transfer, enabling efficient and precise mass transfer of the components J to be transferred.

[0112] Furthermore, it should be noted that the component transfer system provided in this application embodiment has the beneficial effects of the component pickup mechanism 100 in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the component pickup mechanism 100. This application embodiment does not limit this aspect.

[0113] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0114] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A component pickup mechanism, characterized in that, include: The substrate includes a first surface located in its own thickness direction and a second surface connected to the edge of the first surface, the second surface being inclined relative to the first surface; An adsorption functional layer is disposed on the first surface of the substrate; An adjustment mechanism is provided, comprising an adjustment unit disposed on the first surface and a connecting line connected to the adjustment unit. The adjustment unit is electrically connected to a control mechanism via the connecting line. The adjustment unit is configured to adjust the adsorption capacity of the adsorption functional layer to the element to be transferred under the control of the control mechanism. The adjustment unit is at least partially located between the adsorption functional layer and the first surface. The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends from the second surface to the first surface.

2. The component pickup mechanism according to claim 1, characterized in that, The substrate includes a support structure and a substrate disposed on the support structure, wherein the first surface is located on the side of the substrate opposite to the support structure; In a direction parallel to the first surface, the second surface is located on at least one side of the substrate.

3. The component pickup mechanism according to claim 2, characterized in that, It also includes a conductive part disposed on the side of the connecting line away from the second surface, one end of the conductive part being connected to the connecting line and the other end being connected to the control mechanism, so as to realize signal transmission between the connecting line and the control mechanism.

4. The component pickup mechanism according to claim 2, characterized in that, In a direction parallel to the first surface, the support structure extends at least partially beyond the substrate, such that at least a portion of the control mechanism is disposed on the support structure.

5. The component pickup mechanism according to claim 4, characterized in that, It also includes a conductive part and a support part disposed on the side of the support structure facing the substrate. In a direction parallel to the first surface, the support part is located between the substrate and the control mechanism. The conductive part is located on the side of the control mechanism away from the support structure and is electrically connected to the control mechanism. The conductive part extends from the side of the support part away from the support structure to the second surface and is electrically connected to the connecting line.

6. The component pickup mechanism according to claim 2, characterized in that, The connecting line includes a first portion located on the first surface, and a second portion connecting the first portion and the control mechanism; The second part covers at least a portion of the control mechanism and extends to the second surface.

7. The component pickup mechanism according to claim 6, characterized in that, The average width of the second part is greater than the average width of the first part.

8. The component pickup mechanism according to claim 2, characterized in that, In a direction parallel to the first surface, the support structure includes a third surface, and the second surface and the third surface are located in the same plane; The control mechanism is configured to be located on the third surface.

9. The component pickup mechanism according to claim 1, characterized in that, The orthographic projection of the adjustment unit on the first surface is at least partially located outside the orthographic projection of the adsorption functional layer on the first surface, so that at least a portion of the adjustment unit is exposed relative to the adsorption functional layer.

10. The component pickup mechanism according to claim 9, characterized in that, The adsorption functional layer includes a plurality of adsorption functional blocks spaced apart, and at least some of the adjustment units are disposed between adjacent adsorption functional blocks; and / or At least a portion of the adjustment unit is disposed between the adsorption functional block and the first surface.

11. The component pickup mechanism according to claim 1, characterized in that, There are multiple second surfaces, which are located on different edges of the first surface; At least a portion of the connecting lines extend to the first surface via different second surfaces.

12. The component pickup mechanism according to claim 11, characterized in that, The first surface includes a first central region, and a plurality of second surfaces and a plurality of connecting lines are symmetrically distributed relative to the first central region.

13. The component pickup mechanism according to claim 1, characterized in that, The adjustment unit includes a first connection terminal and a second connection terminal, which are electrically connected to different connection lines respectively.

14. The component pickup mechanism according to claim 13, characterized in that, At least some of the first connection terminals of the different adjustment units are electrically connected to the same connection line.

15. A component transfer system, characterized in that, include: A donor substrate and a target substrate, wherein the donor substrate is provided with an element to be transferred; A component pickup mechanism, as described in any one of claims 1 to 14; A transfer mechanism is provided in which at least one of the donor substrate, the target substrate, and the component pickup mechanism is disposed, and the transfer mechanism is configured to adjust the distance between the component pickup mechanism and the donor substrate and the target substrate. A control mechanism configured to adjust the environmental conditions of the adsorption functional layer to change the adsorption capacity of the adsorption functional layer for the element to be transferred.

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