Cooling module for circuit module with multiple chipsets

Abstract

The present disclosure provides a cooling module for a circuit module having a plurality of chipsets. Example embodiments relate to a cooling module, a circuit assembly having one or more circuit modules and a cooling module, and a method of forming a cooling module. The cooling module includes a first cooling component and a second cooling component disposed on the first cooling component. The first cooling component includes a plurality of microchannel blocks thermally coupled to the plurality of chipsets of the circuit module. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits fluidly coupled to the inlet port and the outlet port. Each distribution conduit is disposed on and directs coolant from the inlet port to the outlet port through one or more microchannel blocks of the plurality of microchannel blocks to absorb waste heat transferred from at least one chipset of the plurality of chipsets to the one or more microchannel blocks.

Description

Background Technology

[0001] Electronic devices such as computers and network equipment may include circuit modules, such as multi-chip modules with a substrate, on which one or more chips (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a power supply chip, a memory chip, etc.) are mounted. The chips and / or the substrate may generate waste heat during their operation. To minimize the adverse effects of this waste heat on the circuit module, the electronic device may include a thermal management system to remove waste heat from the chips of the circuit module. Attached Figure Description

[0002] Various examples will be described below with reference to the accompanying figures.

[0003] Figure 1 A block diagram of a cooling module disposed on a circuit module according to an exemplary embodiment of the present disclosure is shown.

[0004] Figure 2A The illustration shows a top perspective view of a first cooling component of a cooling module according to an exemplary embodiment of the present disclosure.

[0005] Figure 2B The illustration shows an example embodiment according to the present disclosure. Figure 2A A bottom-view perspective view of the second cooling component of the cooling module.

[0006] Figure 2C The illustration shows an example embodiment according to the present disclosure. Figure 2A Top perspective view of the second cooling component of the cooling module.

[0007] Figure 2D The illustration shows an example embodiment according to the present disclosure. Figure 2A The cover of the cooling module.

[0008] Figure 3 A perspective view of a circuit module according to an exemplary embodiment of the present disclosure is shown.

[0009] Figure 4 The illustration shows a perspective view of a circuit assembly according to an exemplary embodiment of the present disclosure, the circuit assembly including a circuit disposed in a manner that allows for... Figure 3 On the circuit module Figures 2A to 2D The cooling module.

[0010] Figure 5A The illustration shows a perspective view of a portion of a microchannel block according to an exemplary embodiment of the present disclosure.

[0011] Figure 5B A perspective view of a portion of another microchannel block according to an exemplary embodiment of the present disclosure is illustrated.

[0012] Figure 5C The illustration shows a perspective view of a portion of yet another microchannel block according to an exemplary embodiment of the present disclosure.

[0013] Figure 6A The illustration shows an example embodiment according to the present disclosure. Figure 4 A schematic diagram of the circuit assembly shows the flow of coolant along the upper surface of the second cooling component.

[0014] Figure 6B The illustration shows an example embodiment according to the present disclosure. Figure 4 A schematic diagram of the circuit assembly shows the flow of coolant in multiple flow paths defined between the upper surface of the first cooling component and the lower surface of the second cooling component.

[0015] Figure 7A A schematic diagram of a circuit assembly according to another exemplary embodiment of the present disclosure is shown, illustrating the flow of coolant along the upper surface of a second cooling component of a cooling module.

[0016] Figure 7B The illustration shows another exemplary embodiment according to this disclosure. Figure 7A A schematic diagram of the circuit assembly shows the flow of coolant in a flow path defined between the upper surface of the first cooling component and the lower surface of the second cooling component.

[0017] Figure 8 The illustration shows a flowchart depicting a method for forming a cooling module according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0018] The following detailed description refers to the accompanying drawings. For illustrative purposes, please refer to... Figures 1 to 8 The components illustrated herein represent certain examples. However, the functions of the illustrated components may overlap, and they may exist in fewer or more elements and components. Furthermore, the disclosed examples can be implemented in various environments and are not limited to the examples shown. Further, in conjunction with... Figure 8 The described sequence of operations is illustrative and not intended to be limiting. Where possible, the same reference numerals are used in the drawings and in the following description to refer to the same or similar parts. However, it should be clearly understood that the drawings are for illustrative and descriptive purposes only. Although several examples are described in this document, modifications, improvements, and other implementations are possible. Therefore, the following detailed description does not limit the disclosed examples. Rather, the proper scope of the disclosed examples is defined by the appended claims.

[0019] As used herein, a “circuit module” refers to an electronic module having a substrate and multiple chipsets mounted on the substrate. As used herein, a “circuit assembly” refers to an electronic circuit having a printed circuit board, one or more circuit modules, and one or more electronic components. The one or more electronic components may include, but are not limited to, capacitors, resistors, etc. The one or more circuit modules and the one or more electronic components may be removably coupled to the printed circuit board via a solder array. The term “cold plate” as used in the art sometimes has different meanings, some more general and others more specific. As used herein, a “cold plate” refers to a device that receives heat from a solid via conduction (contact) and dissipates that heat into a liquid coolant circuit. As used herein, a “coolant” refers to a fluid (e.g., water) used to cool a cooling component (e.g., a cold plate) by absorbing waste heat from a heat source (such as a circuit module or a cooling component thermally coupled to a circuit module). The coolant may be liquid or gaseous or a combination thereof. As used herein, “fluidly coupled” means that two or more components are coupled in a suitable manner such that a fluid or at least a portion of a fluid can be transferred or flow directly or indirectly from one component to another. As used in this article, "removably coupled" means that a component can be removably connected to another component.

[0020] Furthermore, as used herein, “thermally coupled” two objects means providing a heat conduction path between the objects that allows waste heat to be conducted between them. Two objects can be considered thermally coupled if any of the following are true: (1) the two objects are in contact with each other (direct contact or contact via a thermal interface material), (2) both objects are thermally coupled to a heat-conducting medium (e.g., heat pipes, radiators, etc.) (or thermally coupled to a chain of heat-conducting media that are thermally coupled together), or (3) the heat transfer coefficient between the two objects is 5 W·m. -2 ·K -1 Or greater. An object, device, or component (which may include multiple different objects thermally coupled and may include multiple different materials) is “thermally conductive” between two thermal interfaces if any of the following is true: (1) the heat transfer coefficient between the thermal interfaces is greater than 5 W·m at any temperature between 0°C and 100°C. -2 ·K -1 Or greater, (2) the object is a continuous material, and at any temperature between 0°C and 100°C, the thermal conductivity (usually expressed as k, λ, or κ) between the two interfaces is greater than 1 W·m -1 ·K -1 Between or greater than 1 W·m -1 ·K -1 (3) The object is a heat pipe, vapor chamber, copper body, or aluminum body. Its thermal conductivity is greater than 1 W·m between 0°C and 100°C. -1 ·K -1Examples of materials include almost all metals and their alloys (e.g., copper, aluminum, gold, etc.), and some plastics (e.g., TECACOMP). TC compounds, CoolPoly D-series thermally conductive plastics and many other materials.

[0021] Electronic devices such as computers (e.g., servers, storage devices, etc.) and network devices (wireless access points, routers, switches, etc.) may include one or more circuit components. Each circuit component may include one or more circuit modules, and each circuit module may include a substrate and multiple chipsets disposed on the substrate. Each of the multiple chipsets may include a first chip and multiple second chips, which are partially disposed around the first chip. The first chip may include, but is not limited to, a CPU, GPU, etc. Each of the multiple second chips may include, but is not limited to, a power chip, memory chip, etc. During operation of the circuit component, one or more chips in each chipset of the circuit module may generate waste heat. This waste heat is undesirable because it may negatively affect the operation of the circuit component. For example, waste heat may cause physical damage to the one or more chips, reduce the performance, reliability, or expected lifespan of the circuit module, and in some cases, waste heat may even cause the circuit component to fail.

[0022] To minimize the adverse effects of waste heat in a circuit module with multiple chipsets, a cover typically placed over the chipsets can be removed. Generally, the cover provides physical protection for the chipsets below. Removing the cover allows waste heat from each of the chipsets to dissipate into the surrounding environment, reducing the thermal resistance of each chipset by several degrees Celsius, by eliminating the physical barrier between the chipsets and their environment. However, handling such bare (i.e., uncovered) chipsets is unstable and can lead to damaged chips, such as cracked chips, if the chips are improperly handled during manufacturing at the factory and / or at the deployment location after manufacturing.

[0023] To overcome this waste heat problem in circuit modules without requiring bare chipsets, some electronic devices include a thermal management system with a cold plate and a coolant distribution unit (CDU). The cold plate can be positioned (i.e., cover) the bare chipsets, creating a thermal interface between the cold plate and the chipsets to conduct waste heat from them. The CDU can direct a coolant flow (e.g., water) to the cold plate to dissipate waste heat from the cold plate into the coolant flow. For example, the CDU can direct coolant to the cold plate at its inlet port, and the cold plate can then direct the coolant through a single-pass internal chamber and to an outlet port to dissipate waste heat from the chips. However, due to the high surface contact area in the single-pass internal chamber of the cold plate, the coolant directed through it may have a low velocity. Therefore, the cold plate may have a reduced heat transfer coefficient between the coolant and each chip.

[0024] To address this issue associated with low heat transfer coefficients, cold plates may be required to direct coolant into single-pass internal chambers at high volumetric flow rates. Specifically, the CDU may need to supply coolant to the cold plate at a high volumetric flow rate. However, some CDUs may only be able to supply coolant to a small number of electronic devices, such as 32, at the required volumetric flow rate. Therefore, the thermal management system may need to utilize multiple CDUs to meet the volumetric flow rate requirements of multiple electronic devices (e.g., 256 or more) in the data center. Consequently, when the thermal management system requires multiple CDUs to deliver coolant to multiple electronic devices at high volumetric flow rates, the capital expenditure and / or operating costs of the data center can increase significantly.

[0025] Furthermore, the coolant supplied to the cold plate may need to have a thermal margin to allow the coolant to efficiently absorb waste heat from multiple chips via the cold plate. As used herein, the term "thermal margin" can refer to the temperature difference between the case temperature of each chip and the temperature of the coolant in thermal contact with the corresponding chip. Further, as used herein, "case temperature" can refer to the highest temperature that each chip can reach while operating to perform one or more workloads. If the circuit module is performing a graphics-intensive workload, the GPU chip may have a different case temperature compared to other chips, such as memory chips, which may have less intensive workloads compared to the GPU chip performing the graphics-intensive workload. Therefore, in some examples, the coolant supplied from the CDU may have sufficient thermal margin (e.g., about 4 degrees Celsius or higher) when flowing in thermal contact with one or more upstream chips among the multiple chips. Thus, the coolant can efficiently absorb waste heat from one or more upstream chips among the multiple chips, i.e., produce partially heated coolant. As used herein, "upstream chip" can refer to a chip located near the cold plate inlet port. For example, when a first chip and a second chip are positioned in the flow path of coolant supplied to a cold plate (e.g., via the inlet port of the cold plate), such that the coolant flows through (i.e., thermally couples) the first chip in thermal contact with the second chip before flowing through the second chip in thermal contact, the first chip can be interpreted as “upstream” of the second chip. However, partially heated coolant may not have sufficient thermal margin because it flows through one or more downstream chips in thermal contact. As used herein, “downstream chip” can refer to a chip positioned near the outlet port of the cold plate. For example, when a first chip and a second chip are positioned in the flow path of coolant supplied to a cold plate, such that the coolant flows through and then thermally contacts the first chip after it has flowed through and thermally contacts the second chip, the first chip can be interpreted as “downstream” of the second chip. Therefore, partially heated coolant cannot efficiently absorb waste heat from one or more downstream chips. Consequently, the cold plate may not be able to dissipate waste heat from the multiple chips sufficiently or uniformly.

[0026] According to various aspects of this disclosure, a cooling module for a circuit module is provided that alleviates one or more of the challenges mentioned above in removing heat from the circuit module. The cooling module may be disposed on the circuit module for thermal management of multiple chipsets of the circuit module. In some examples, the multiple chipsets may include a first chipset and a second chipset. Each of the first and second chipsets may include a first chip and a plurality of second chips disposed partially around the first chip. In one or more examples, the cooling module includes a first cooling component and a second cooling component. The first cooling component includes a plurality of microchannel blocks formed on an upper surface of the first cooling component. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits formed on a lower surface of the second cooling component. Each distribution conduit is fluidly coupled to the inlet port and the outlet port. The first cooling component is disposed on the circuit module such that the plurality of microchannel blocks are thermally coupled to the plurality of chipsets. Further, the second cooling component is disposed on the first cooling component such that each distribution conduit is disposed on one or more microchannel blocks and defines a flow path between the first and second cooling components. In this example, each distribution conduit can guide a portion of the coolant (e.g., water) from the inlet port to the outlet port via the corresponding flow path through one or more microchannel blocks.

[0027] During operation of the electronic device, the coolant flow received from the CDU can be divided into multiple portions within the cooling module, and each portion of the coolant can be directed toward a corresponding distribution conduit among the multiple distribution conduits. In this example, each distribution conduit can guide that portion of the coolant along a corresponding flow path. In one or more examples, each portion of the coolant flowing along the corresponding flow path can pass through the one or more microchannel blocks to absorb waste heat transferred from one or more chips of at least one chipset to the one or more microchannel blocks. Specifically, each distribution conduit can guide a portion of the coolant through one or more microchannel blocks thermally coupled to at least a portion of a first chip (e.g., a GPU or CPU) to absorb waste heat from the first chip and create a partially heated sub-portion of coolant. When a portion of the coolant received from the CDU is first guided through one or more microchannel blocks thermally coupled to that portion of the first chip having a high casing temperature, this portion of the coolant can have sufficient thermal margin to absorb waste heat from the first chip. Each distribution conduit can further guide a partially heated sub-portion of coolant through one or more microchannel blocks thermally coupled to one or more second chips (e.g., one or more memory chips) to absorb waste heat from said one or more second chips and generate a heated sub-portion of coolant. Because the partially heated sub-portion of coolant is guided through one or more microchannel blocks thermally coupled to one or more second chips with low case temperatures, it still retains sufficient thermal margin to subsequently absorb waste heat from said one or more second chips. Therefore, the cooling module can effectively and uniformly dissipate waste heat from all chips in the circuit module.

[0028] In some examples, the plurality of distribution conduits may be arranged along at least two columns (e.g., a first column and a second column). Further, each column may include at least two distribution conduits, for example, a first column having a first distribution conduit and a second distribution conduit. In some examples, the flow path defined by each distribution conduit in the first and second columns may have a serpentine profile. For example, the first flow path defined by the first distribution conduit may have an S-shaped profile, and the second flow path defined by the second distribution conduit may have an inverted S-shaped profile. In some examples, the first flow path with an S-shaped profile and the second flow path with an inverted S-shaped profile may have a common head section. Because this portion of the coolant is first guided to the common head section, this portion of the coolant can be guided at a high flow rate through one or more microchannel blocks thermally coupled to the first chip. Therefore, the heat transfer coefficient between such one or more microchannel blocks and this portion of the coolant can be increased. Thus, the coolant can absorb a sufficient amount of waste heat from the first chip (e.g., a GPU or CPU, both of which are high-power chips) and generate a partially heated sub-portion of coolant. Because the partially heated coolant leaving the common head section is divided into multiple sub-sections, the flow rate of each sub-section of the partially heated coolant decreases as it passes through one or more microchannel blocks thermally coupled to one or more second chips (e.g., one or more memory chips, which are low-power chips). Therefore, the heat transfer coefficient between these one or more microchannel blocks and each sub-section of the partially heated coolant may be reduced. Since the one or more second chips generate less waste heat than the first chip, their case temperature may be lower compared to the case temperature of the first chip. Therefore, each sub-section of the partially heated coolant may still be able to absorb waste heat from the one or more second chips and still meet case temperature requirements. Furthermore, because each distribution conduit has a serpentine flow path, the coolant can flow at high speeds at low volumetric flow rates and has a high heat transfer coefficient between the cooling module and the coolant. Because the cooling module operates at a low volumetric flow rate, a smaller number of CDUs can handle the coolant requirements of multiple electronic devices in a data center environment. In some examples, the volumetric flow rate may be approximately 0.12 gallons per minute.

[0029] In some examples, each microchannel block may include multiple elongated fins to form multiple microchannels. In such examples, at least one of the height, thickness, or spacing between the elongated fins of at least one microchannel block can be varied to adjust the heat transfer rate between the chipset and the coolant via the at least one microchannel block. For example, the elongated fins of a microchannel block thermally coupled to a first chip may have a first height, and the elongated fins of a microchannel block thermally coupled to one or more second chips may have a second height. The second height may be greater than the first height. In such examples, the portion of coolant flowing through the elongated fins of the microchannel block thermally coupled to the first chip may have a relatively small surface contact area compared to the elongated fins of the microchannel block thermally coupled to the one or more second chips. Therefore, this portion of coolant can flow through the microchannel block thermally coupled to the first chip at a high velocity and with a greater heat transfer coefficient. Similarly, the plurality of elongated fins of the microchannel block having a greater thickness or a smaller spacing between the elongated fins can provide a smaller surface contact area and a greater heat transfer coefficient for that portion of the coolant flowing through the microchannel block. Therefore, at least one microchannel block having such a variation in at least one of height, thickness, or spacing between the elongated fins can allow coolant to flow through the at least one microchannel block at a high velocity and with a greater heat transfer coefficient. In some examples, the height of each of the plurality of elongated fins can range from about 1.5 mm to about 6 mm. The thickness of each of the plurality of elongated fins can range from about 0.1 mm to about 1 mm. The spacing between the plurality of elongated fins can be from about 0.12 mm to about 2 mm. In some examples, the coolant can be a mixture of water and propylene glycol, a dielectric fluid, or treated water.

[0030] Therefore, this disclosure describes an example embodiment of a cooling module for a circuit module, and a method of forming such a cooling module. The cooling module includes a first cooling component and a second cooling component. The first cooling component may be disposed on the circuit module, and the second cooling component may be disposed on the first cooling component to form a cooling module for the circuit module. In this example, the cooling module and the circuit module may jointly form a circuit assembly of an electronic device. The first cooling component includes a plurality of microchannel blocks thermally coupled to a plurality of chipsets of the circuit module. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits fluidly coupled to the inlet port and the outlet port. In this example, each of the plurality of distribution conduits is disposed on one or more of the plurality of microchannel blocks and guides a coolant flow from the inlet port to the outlet port through the one or more microchannel blocks to absorb waste heat transferred from at least one of the plurality of chipsets to the one or more microchannel blocks.

[0031] Refer to the attached diagram. Figure 1 A block diagram depicts a cooling module 100 disposed on a circuit module 150. The cooling module 100 includes a first cooling component 102 and a second cooling component 104 disposed on the first cooling component 102. In one or more examples, the first cooling component 102 and the second cooling component 104 may serve as a cold plate. The circuit module 150 includes a plurality of chipsets 156 having a first chipset 156A and a second chipset 156B.

[0032] The first cooling component 102 includes a plurality of microchannel blocks 110 formed on its upper surface. When the first cooling component 102 is disposed on the circuit module 150, the plurality of microchannel blocks 110 can be thermally coupled to the plurality of chipsets 156. The second cooling component 104 includes an inlet port 128 and an outlet port 130, the inlet port being formed on one sidewall and the outlet port being formed on another sidewall. The second cooling component 104 also includes a plurality of distribution conduits 132, which can be disposed on one or more of the plurality of microchannel blocks 110. The second cooling component 104 also includes a first channel 134 and a second channel 136, the first channel being connected to the inlet port 128 and the inlet of the plurality of distribution conduits 132, and the second channel being connected to the outlet port 130 and the outlet of the plurality of distribution conduits 132. In some examples, each of the plurality of distribution conduits 132 can guide a coolant flow from an inlet port 128 through the one or more microchannel blocks 110 to an outlet port 130 to absorb waste heat transferred from at least one of the plurality of chipsets 156 to the one or more microchannel blocks 110, thereby dissipating waste heat from the at least one of the plurality of chipsets 156.

[0033] Figure 2A A top perspective view of a first cooling component 202 of a cooling module 200 is depicted. The first cooling component 202 may be a configuration of the first cooling component 102 described above. Therefore, the various components of the first cooling component 202 may be similar to those of the first cooling component 102 described above. The above description of the components of the first cooling component 102 applies to similar components of the first cooling component 202, and therefore, for clarity, repeated descriptions are omitted below. Although the first cooling component 202 may be a configuration of the first cooling component 102, the first cooling component 102 is not limited to that configuration.

[0034] exist Figure 2AIn the example, the first cooling component 202 is a heat-conducting component. For example, the first cooling component 202 can be formed using a heat-conducting material (such as copper, aluminum, or an alloy). The first cooling component 202 can be a rectangular or square component. The shape of the first cooling component 202 can depend on the shape of the circuit module 300 (e.g., Figure 3 (As shown in the diagram). In some examples, the first cooling component 202 may have a shape complementary to the shape of the circuit module 300. The first cooling component 202 has an upper surface 206, a lower surface 208, and a plurality of microchannel blocks 210 spaced apart from each other and formed on the upper surface 206. For example, the plurality of microchannel blocks 210 includes a first group of microchannel blocks 210A and a second group of microchannel blocks 210B, the first group of microchannel blocks and the second group of microchannel blocks being arranged along multiple columns 212. In some examples, the first group of microchannel blocks 210A is arranged along a first column 212A, and the second group of microchannel blocks 210B is arranged along a second column 212B. Figure 2A In the example, the first group of microchannel blocks 210A has five first microchannel blocks, such as 210A1, 210A2, 210A3, 210A4, and 210A5. Similarly, the second group of microchannel blocks 210B includes five additional second microchannel blocks, such as 210B1, 210B2, 210B3, 210B4, and 210B5.

[0035] In one or more examples, each microchannel block in the first set of microchannel blocks 210A includes a plurality of elongated fins 214 to form a plurality of microchannels 215. The plurality of elongated fins 214 are formed on the upper surface 206 of the first cooling component 202. The plurality of microchannels 215 allow coolant 260 (such as...) to pass through. Figures 2B to 2C (As shown) flows from one end of the corresponding microchannel block 210 to the other. The plurality of elongated fins 214 of one or more microchannel blocks 210 will be discussed in more detail below.

[0036] Figure 2B A bottom perspective view of the second cooling component 204 of the cooling module 200 is depicted. Figure 2C A top perspective view of the second cooling component 204 of the cooling module 200 is depicted. In the following description, for ease of explanation, it is also described... Figures 2B to 2C The second cooling component 204 can be a configuration of the second cooling component 104 described above. Therefore, the various components of the second cooling component 204 can be similar to those of the second cooling component 104 described above. The above description of the components of the second cooling component 104 applies to similar components of the second cooling component 204, and therefore, for clarity, repeated descriptions are omitted below. Although the second cooling component 204 can be a configuration of the second cooling component 104, the second cooling component 104 is not limited to that configuration.

[0037] exist Figure 2B and Figure 2C In the examples, the second cooling component 204 is a heat-conducting component. For example, the second cooling component 204 can be formed using a heat-conducting material (such as copper, aluminum, or an alloy). In one or more examples, the first cooling component 202 and the second cooling component 204 can serve as cold plates. The second cooling component 204 can be a rectangular or square component. The shape of the second cooling component 204 can depend on the shape of the first cooling component 202. (Reference) Figures 2B to 2C The second cooling component 204 has an upper surface 216, a lower surface 218, a first sidewall 220, a second sidewall 222, a third sidewall 224, a fourth sidewall 226, an inlet port 228, an outlet port 230, a plurality of distribution conduits 232, a first channel 234, a second channel 236, a plurality of first holes 238 and a plurality of second holes 240.

[0038] refer to Figure 2C An inlet port 228 is formed on a first sidewall 220, and an outlet port 230 is formed on a second sidewall 222. For example, the inlet port 228 protrudes through the first sidewall 220 and connects to a first channel 234. Similarly, the outlet port 230 protrudes through the second sidewall 222 and connects to a second channel 236. The plurality of first holes 238 includes two first holes, such as first hole 238A and another first hole 238B, which are positioned adjacent to each other in the central region of the second cooling component 204. Each of the plurality of first holes 238 protrudes between the upper surface 216 and the lower surface 218 of the second cooling component 204. The plurality of second holes 240 includes four second holes, such as second hole 240A, another second hole 240B, yet another second hole 240C, and yet another second hole 240D, wherein each of these four holes is positioned near one of the four corners of the second cooling component 204.

[0039] refer to Figure 2BThe plurality of distribution conduits 232 are formed on the lower surface 218 of the second cooling component 204. For example, the lower surface 218 of the second cooling component 204 may be machined to form the plurality of distribution conduits 232. In one or more examples, machining of the lower surface 218 may result in the formation of a plurality of first partition walls 242, which are spaced apart from each other to define the plurality of distribution conduits 232. In one or more examples, the plurality of distribution conduits 232 includes a first set of distribution conduits 232A and a second set of distribution conduits 232B, which are arranged along multiple columns 212. For example, the first set of distribution conduits 232A is arranged along the first column 212A, and the second set of distribution conduits 232B is arranged along the second column 212B. In other words, the plurality of dispensing conduits 232 includes a first dispensing conduit 232A1, a second dispensing conduit 232A2, a third dispensing conduit 232B1, and a fourth dispensing conduit 232B2. The first dispensing conduit 232A1 and the second dispensing conduit 232A2 are arranged along a first column 212A, and the third dispensing conduit 232B1 and the fourth dispensing conduit 232B2 are arranged along a second column 212B. Further, the first dispensing conduit 232A1 and the second dispensing conduit 232A2 have a first common head segment 233, and the third dispensing conduit 232B1 and the fourth dispensing conduit 232B2 have a second common head segment 235. In this example, the first common head segment 233 is connected to a first orifice 238A, and the second common head segment 235 is connected to another first orifice 238B. Further, the first dispensing conduit 232A1 is connected to a second orifice 240A, and the second dispensing conduit 232A2 is connected to another second orifice 240B among the plurality of second orifices 240. Similarly, the third dispensing conduit 232B1 is connected to yet another second port 240C, and the fourth dispensing conduit 232B2 is connected to yet another second port 240D.

[0040] refer to Figure 2CA first channel 234 and a second channel 236 are formed on the upper surface 216 of the second cooling component 204. As discussed herein, the upper surface 216 of the second cooling component 204 may be machined to form the first channel 234 and the second channel 236. In some examples, machining of the upper surface 216 may result in the formation of a plurality of second partition walls 244 and a plurality of third partition walls 246 to correspondingly define the plurality of first channels 234 and the plurality of second channels 236. In some examples, the plurality of second partition walls 244 further divide the first channel 234 into a first branch 234A and a second branch 234B of the first channel 234. As discussed herein, the first channel 234 is connected to an inlet port 228. Further, the first branch 234A of the first channel 234 is connected to a first hole 238A, and the second branch 234B of the first channel 234 is connected to another first hole 238B. Similarly, the plurality of third partition walls 246 first divide the second passage 236 into a first branch 236A and a second branch 236B. The plurality of third partition walls 246 further divide the first branch 236A of the second passage 236 into a first sub-branch 236A1 and a second sub-branch 236A2. Similarly, the plurality of third partition walls 246 further divide the second branch 236B of the second passage 236 into a third sub-branch 236B1 and a fourth sub-branch 236B2.

[0041] Return to reference Figure 2B The first aperture 238A has a first width "W1", and another first aperture 238B has a second width "W2". In some examples, the second width "W2" is greater than the first width "W1", thereby allowing a maximum flow rate of coolant 260 to enter the second distribution conduit 232B to dissipate a greater amount of heat from one or more chips in the second chip group 206B (as shown in Figure 2) located in the second column 212B. In some other examples, the first width "W1" and the second width "W2" are substantially equal. In some other examples, the first width "W1" may be greater than the second width "W2".

[0042] refer to Figures 2B to 2C Each of the plurality of dispensing conduits 232 is fluidly coupled to an inlet port 228 and an outlet port 230. For example, a first dispensing conduit 232A1 is fluidly coupled to an inlet port 228 and an outlet port 230 via i) a first branch 234A of a first channel 234, ii) a first orifice 238A, iii) a second orifice 240A, and iv) a first sub-branch 236A1 and a second sub-branch 236A2 of a second channel 236. As discussed herein, a second dispensing conduit 232B, a third dispensing conduit 232C, and a fourth dispensing conduit 232D are also connected to an inlet port 228 and an outlet port 230.

[0043] Figure 2D A cover 248 of the cooling module 200 is depicted. The cover 248 is a heat-conducting component. For example, the cover 248 can be formed using a heat-conducting material such as copper, aluminum, or an alloy. The cover 248 can be a rectangular or square component. The shape of the cover 248 can depend on the shape of the second cooling component 204. In some examples, the cover 248 has a first wall 250, a second wall 252, a third wall 254, and a fourth wall 256. In this example, the cover 248 can be disposed on the upper surface 216 such that the first wall 250, the second wall 252, the third wall 254, and the fourth wall 256 respectively contact the first sidewall 220, the second sidewall 222, the third sidewall 224, and the fourth sidewall 226 of the second cooling component 204 and press-fit with the second cooling component 204. In this example, the cover 248 covers the first channel 234 and the second channel 236 and prevents coolant 260 from leaking from the upper surface 216 of the second cooling component 204. It may be noted that at least one of the second cooling component 204 or the cover 248 may include a plurality of sealing components (not shown) to prevent leakage of coolant 260.

[0044] Figure 3 A perspective view of circuit module 300 is depicted. Circuit module 300 can be used as a multi-chip module of circuit component 400 (such as...). Figure 4 (As shown in the diagram). In some examples, circuit module 300 includes a substrate 302, a grid array 304, multiple chipsets 306, and multiple flanges 308. Circuit module 300 can be a configuration of circuit module 150 described above. Therefore, the various components of circuit module 300 can be similar to the components of circuit module 150 described above. The above description of the components of circuit module 150 applies to similar components of circuit module 300, and therefore, for clarity, repeated descriptions are omitted below. Although circuit module 300 can be a configuration of circuit module 150, circuit module 150 is not limited to the configuration of circuit module 300.

[0045] In some examples, substrate 302 can be a rectangular or square component. The shape of substrate 302 can depend on the shape of the first cooling component 202 (e.g., Figure 2A (As shown in the diagram). The substrate 302 may include a plurality of conductive traces (not shown) to electrically interconnect the plurality of chipsets 306. The grid array 304 may be positioned on the lower surface 310 of the substrate 302 to allow the circuit module 300 to be removably coupled (e.g., soldered) to the printed circuit board 450 of the circuit assembly 400 (as shown in the diagram). Figure 4(As shown in the diagram). In some examples, the printed circuit board 450 of the circuit assembly 400 may additionally include other electronic components, such as capacitors, inductors, resistors, etc. The plurality of flanges 308 are disposed on the upper surface 312 of the substrate 302 and coupled to the periphery (not marked) of the substrate 302. When mounted on the circuit module 300, the plurality of flanges 308 can support the cooling module 200 (e.g., Figures 2A to 2D (As shown in the diagram). Furthermore, the plurality of flanges 308 may provide a circuit module 300 to mechanically connect the components of the cooling module 200 and the circuit module 300 to the circuit assembly 400.

[0046] In some examples, the plurality of chipsets 306 are positioned adjacent to each other and are attached to the upper surface 312 of the substrate 302 by suitable fastening mechanisms (such as solder joints). Each of the plurality of chipsets 306 may include a plurality of chips, such as, but not limited to, CPUs, GPUs, power chips, memory chips, etc.

[0047] exist Figure 3 In one example, the plurality of chipsets 306 includes a first chipset 306A and a second chipset 306B, arranged along multiple columns 212. For example, the first chipset 306A is arranged along the first column 212A, and the second chipset 306B is arranged along the second column 212B. The first chipset 306A includes a first chip 306A1 and a plurality of second chips 306A2. In this example, the first chip 306A1 is positioned at the center of the first column 212A, and the plurality of second chips 306A2 are positioned partially around the first chip 306A1. Figure 3 In the example, the plurality of second chips 306A2 includes one second chip 306A. 21 Another second chip, 306A 22 Another second chip, 306A 23 And there's another second chip, the 306A. 24 .

[0048] As discussed herein, the second chipset 306B includes a first chip 306B1 and a plurality of second chips 306B2. In this example, the first chip 306B1 is positioned at the center of the second column 212B, and the plurality of second chips 306B2 are positioned partially around the first chip 306B1. Figure 3 In the example, the plurality of second chips 306B2 includes one second chip 306B. 21 Another second chip, 306B 22 Another second chip, 306B 23 And there's also a second chip, 306B. 24 .

[0049] In one example, the first chip 306A1 is a GPU, the first chip 306B1 is a CPU, and each of the plurality of second chips 306A2, 306B2 is a memory chip. Furthermore, although... Figure 3 The circuit module 300 is shown to include three types of chips arranged in a particular manner, but the scope of this disclosure does not limit the number or type of chips or the manner in which the chips are shown to be arranged on the substrate 302.

[0050] Figure 4 A perspective view of circuit assembly 400 is depicted, the circuit assembly including... Figures 2A to 2D The cooling module 200 is set in Figure 3 The circuit module 300 is mounted on the circuit assembly 400. The circuit assembly 400 is configured to provide mechanical protection to the circuit module 300, dissipate waste heat from the circuit module 300, and distribute electrical energy to enable the circuit module 300 to operate to perform one or more workloads. In one or more examples, the circuit assembly 400 may be housed within the chassis (not shown) of an electronic device, such as, but not limited to, a computer (e.g., a server, storage device, etc.), a network device (wireless access point, router, switch, etc.), etc. The circuit module 300 may be removably coupled to a printed circuit board 450 (e.g., the motherboard of the circuit assembly 400) via a grid array 304 of the circuit module 300, and a cooling module 200 may be mounted on the circuit module 300. It may be noted herein that, for ease of illustration, the cover 248 of the cooling module 200 (e.g., Figure 2D (as shown) in Figure 4 Not shown in the example. Circuit assembly 400 may also include electronic components, such as, but not limited to, resistors, capacitors, etc. (not shown).

[0051] In some examples, the first cooling component 202 is disposed on the circuit module 300, such that the lower surface 208 of the first cooling component 202 (e.g., Figure 2A The first cooling component 202 (marked in the middle) is positioned on the plurality of chipsets 306, and the periphery of the first cooling component 202 rests on the plurality of flanges 308 of the circuit module 300. Furthermore, the first cooling component 202 is disposed on the circuit module 300 such that the upper surface 206 of the first cooling component 202 (as shown in the middle) is formed on the plurality of flanges 308 of the circuit module 300. Figure 2A The plurality of microchannel blocks 210 on the circuit module 300 are thermally coupled to the plurality of chipsets 306 of the circuit module 300 via the lower surface 208.

[0052] Furthermore, a second cooling component 204 is disposed on the first cooling component 202 such that each dispensing conduit 232 is disposed on one or more microchannel blocks 210, and a plurality of flow paths 402 (e.g., a plurality of serpentine flow paths) are defined between the first cooling component 202 and the second cooling component 204. In other words, each of the plurality of first dispensing conduits 232A and second dispensing conduits 232B correspondingly defines a serpentine flow path 402, which is vertically aligned over a portion of the first chips 306A1, 306B1 and one or more of the plurality of second chips 306A2, 306B2. In some examples, the first dispensing conduit 232A1 has a first flow path 402A1, the second dispensing conduit 232A2 has a second flow path 402A2, the third dispensing conduit 232B1 has a third flow path 402B1, and the fourth dispensing conduit 232B2 has a fourth flow path 402B2. In one or more examples, each of the plurality of flow paths 402 includes the one or more microchannel blocks 210. In one or more examples, when the second cooling component 204 is disposed on the first cooling component 202, each dispensing conduit 232 may be press-fitted onto the one or more microchannel blocks 210 such that there is no gap between the corresponding dispensing conduit 232 and each microchannel block in the one or more microchannel blocks 210. Therefore, when the coolant 260 (e.g. Figure 2B As shown, when flowing along the corresponding serpentine flow path 402, the coolant can be guided through the plurality of microchannels 215 in each of the one or more microchannel blocks 210 (as shown). Figure 2A (As shown in the diagram). In some examples, each of the plurality of microchannels 215 has a linear flow path. The coolant 260 flowing through the plurality of microchannels 215 in each of the one or more microchannel blocks 210 can absorb a portion of the waste heat transferred from the portion of the first chips 206A1, 206B1 and one or more of the plurality of second chips 206A2, 206B2 to the one or more microchannel blocks 210. It will be noted here that the flow of coolant 260 in the cooling module 200 and the dissipation of waste heat from the circuit module 300 will be discussed in more detail below.

[0053] Figure 5A A perspective view depicts a portion of a microchannel block, such as microchannel block 210A1 of the first cooling component 202 (e.g., Figure 2A (As shown elsewhere). In some examples, the microchannel block 210A1 has a plurality of elongated fins 214A1, which are arranged to be spaced apart from each other to define a plurality of microchannels 215A1 between them. Figure 5AIn the example, the thickness of each of the plurality of elongated fins 214A1 in the microchannel block 210A1 is "T1". In some examples, the thickness "T1" is greater than that of some other microchannel blocks (e.g., microchannel block 210A3 in the plurality of microchannel blocks 210, such as...). Figure 2A Each elongated fin shown in the diagram has a large thickness (approximately 0.5 times greater). The greater thickness of these elongated fins 214A1 provides a smaller surface contact area for the coolant flowing through the microchannel block and results in a larger heat transfer coefficient. Therefore, the microchannel block 210A with multiple elongated fins 214A of varying thicknesses can regulate the heat transfer rate between the one or more chipsets 306 and the coolant 260.

[0054] Figure 5B A perspective view depicting a portion of another microchannel block (e.g., microchannel block 210B1 of the first cooling component 202) is shown. In some examples, microchannel block 210B1 has a plurality of elongated fins 214B1 arranged spaced apart from each other to define a plurality of microchannels 215B1 between them. Figure 5B In the example, each of the plurality of elongated fins 214B1 in the microchannel block 210B1 has a spacing “S1” between it and the adjacent elongated fin 214B1. In some examples, the spacing “S1” is smaller than (may be about 0.5 times) some other microchannel blocks (e.g., microchannel block 210B3 in the plurality of microchannel blocks 210, such as...). Figure 2A The spacing between the elongated fins shown in the diagram. The plurality of elongated fins 214B1 with a smaller spacing can provide a smaller surface contact area for the coolant to flow through the microchannel block and have a larger heat transfer coefficient. Therefore, the microchannel block 210B with a varying spacing between the plurality of elongated fins 214B can adjust the heat transfer rate between the one or more chipsets 306 and the coolant 260.

[0055] Figure 5C A perspective view depicting a portion of yet another microchannel block (e.g., microchannel block 210A2 of the first cooling component 202). In some examples, microchannel block 210A2 has a plurality of elongated fins 214A2 arranged spaced apart from each other to define a plurality of microchannels 215A2 between them. Figure 5C In the example, each of the plurality of elongated fins 214A2 in microchannel block 210A3 has a height “H1”. In some examples, the height “H1” is less than (may be about 0.5 times greater than) certain other microchannel blocks (e.g., microchannel block 210A3 in the plurality of microchannel blocks 210, such as...). Figure 2AThe height of the elongated fins shown in the diagram. These multiple elongated fins 214A2 with a smaller height can provide a smaller surface contact area for the coolant flowing through the microchannel block and have a larger heat transfer coefficient. Therefore, the microchannel block 210A with multiple elongated fins 214A of different heights can adjust the heat transfer rate between the one or more chipsets 306 and the coolant 260.

[0056] refer to Figures 5A to 5C Because at least one of the height, thickness, or spacing between the elongated fins of at least one microchannel block thermally coupled to a first chip having a high casing temperature is varied, the heat transfer rate between the first chip and the coolant can be adjusted (e.g., increased). For example, if the plurality of elongated fins 214A1 of microchannel block 210A1 has a significantly greater thickness, or if the plurality of elongated fins 214B1 of microchannel block 210B1 has a significantly smaller spacing between the elongated fins, a smaller surface contact area can be provided for the coolant to flow through the at least one microchannel block. Therefore, at least one microchannel block having such a variation in at least one of height, thickness, or spacing between the elongated fins can allow the coolant to flow through the at least one microchannel block at a high velocity and have a greater heat transfer coefficient. In some examples, the height of each of the plurality of elongated fins can range from about 1.5 mm to about 6 mm. The thickness of each of the plurality of elongated fins can range from about 0.1 mm to about 1 mm. The spacing between the fins in the plurality of elongated fins can be from about 0.15 mm to about 2 mm. In some examples, the coolant can be a mixture of water and propylene glycol, a dielectric fluid, or treated water.

[0057] Figure 6A Depicting Figure 4 A schematic diagram of the circuit assembly 400 shows the flow of coolant 260 along the upper surface 216 of the second cooling component 204. Figure 6B Depicting Figure 4 A schematic diagram of the circuit assembly 400 shows the flow of coolant 260 in multiple flow paths 402 defined between the upper surface 206 of the first cooling component 202 and the lower surface 218 of the second cooling component 204 of the cooling module 200. In the following description, for ease of explanation, [further details are needed]. Figures 6A to 6B Further, see reference. Figures 2A to 2D and Figures 3 to 4 Described Figures 6A to 6B Therefore, for the sake of brevity, the cooling module 200 and the circuit module 300 will not be described further. It may be noted that, for ease of explanation, the cover 248 of the cooling module 200 (e.g., Figure 2D (as shown) in Figures 6A to 6B The example is not shown.

[0058] During operation of the circuit assembly 400, the plurality of chipsets 306 may generate waste heat. As will be understood, such waste heat generated by the plurality of chipsets 306 is undesirable and, if not effectively managed, may negatively impact the operation of the circuit module 300. Therefore, in some examples, the proposed cooling module 200 may establish a sufficient thermal interface with the circuit module 300 to enable efficient transfer of waste heat from the first chips 306A1, 306B1 and the plurality of second chips 306A2, 306B2 to the coolant 260 via the first cooling component 202 and the second cooling component 204, respectively.

[0059] In some examples, a CDU (not shown) in a data center environment can supply coolant 260 to a cooling module 200 via an inlet manifold (not shown) connected to the inlet port 228 of a second cooling component 204. Reference Figure 6A The second cooling component 204 guides the coolant 260 into the first channel 234 via the inlet port 228. The first channel 234 divides the coolant 260 into a first portion 260A and a second portion 260B via the plurality of second partition walls 244 (e.g., ...). Figure 2C (As shown in the image). Reference Figures 6A to 6B The first channel 234 can guide a first portion 260A of coolant through a first hole 238A into a flow path 402A defined along a first column 212A, and guide a second portion 260B of coolant through another first hole 238B into a flow path 402B defined along a second column 212B.

[0060] refer to Figure 6B In the first column 212A of the cooling module 200, the first portion 260A of the coolant is along the first common head section 233 of the first flow path 402A1 and the second flow path 402A2 (e.g., Figure 2B (as shown in the diagram) flows. In this example, the first portion 260A of the coolant is initially guided through multiple microchannels 215A1 of the microchannel block 210A1 (as shown in the diagram). Figure 5A As shown in the diagram, when the first portion 260A of the coolant flows through the plurality of microchannels 215A1, the first portion of the coolant absorbs waste heat from a portion of the first chip 306A1. The first portion 260A of the coolant is separated by the plurality of first partition walls 242 (as shown in the diagram). Figure 2B (As shown) is further divided into a first sub-part 260A1 of the coolant and a second sub-part 260A2 of the coolant.

[0061] The first sub-portion 260A1 of coolant is guided through the remainder of the first flow path 402A1. The first sub-portion 260A1 of coolant flowing along the remainder of the first flow path 402A1 is then guided through the microchannel block 210A2 (e.g., ...). Figure 2A Multiple microchannels (unlabeled) are shown in the diagram, and then flow through microchannel block 210A3 (as shown in the diagram). Figure 2A Multiple microchannels (as shown in the diagram). For example, a first sub-portion 260A1 of coolant first flows through the multiple microchannels of microchannel block 210A2 and absorbs waste heat from another portion of the first chip 306A1 to generate a partially heated first sub-portion 260A3 of coolant. Subsequently, the partially heated first sub-portion 260A3 of coolant flows through the multiple microchannels of microchannel block 210A3 and absorbs waste heat from the second chip 306A1. 21 and 306A 22 The waste heat (as shown in Figure 2) generates the first sub-section 260A4 of the heated coolant.

[0062] The second sub-portion 260A2 of coolant is guided through the remainder of the second flow path 402A2. The second sub-portion 260A2 of coolant flowing along the remainder of the second flow path 402A2 is then guided through the microchannel block 210A4 (e.g., Figure 2A Multiple microchannels (unlabeled) are shown in the diagram, and then flow through microchannel block 210A5 (as shown in the diagram). Figure 2A Multiple microchannels (not labeled) are shown in the diagram. For example, a second sub-portion 260A2 of coolant first flows through the multiple microchannels of microchannel block 210A4 and absorbs waste heat from another portion of the first chip 306A1 to generate a partially heated second sub-portion 260A5 of coolant. Subsequently, the partially heated second sub-portion 260A5 of coolant flows through the multiple microchannels of microchannel block 210A5, absorbing waste heat from the second chip 306A1. 23 and 306A 24 (As shown in Figure 2) waste heat, to generate a second sub-part 260A6 of heated coolant.

[0063] refer to Figure 6B In the second column 212B of the cooling module 200, the second portion 260B of the coolant is along the second common head section 235 of the third flow path 402B1 and the fourth flow path 402B2 (e.g., Figure 2B (as shown in the diagram) flows. In this example, the second portion 260B of the coolant is guided through multiple microchannels 215B1 of the microchannel block 210B1 (as shown in the diagram). Figure 5BAs shown in the diagram, when the second portion 260B of the coolant flows through the plurality of microchannels 215B1, the second portion of the coolant absorbs waste heat from a portion of the first chip 306B1. Later, the second portion 260B of the coolant is then separated by the plurality of first partition walls 242 (as shown in the diagram). Figure 2B (As shown) it is divided into a third sub-part 260B1 and a fourth sub-part 260B2 of the coolant.

[0064] The third sub-portion 260B1 of the coolant is guided through the remainder of the third flow path 402B1. The third sub-portion 260B1 of the coolant flowing along the remainder of the third flow path 402B1 is then guided through the microchannel block 210B2 (e.g., ...). Figure 2A Multiple microchannels (unlabeled) are shown in the diagram, and then flow through microchannel block 210B3 (as shown in the diagram). Figure 2A Multiple microchannels (as shown in the diagram). For example, a third sub-portion 260B1 of coolant first flows through the multiple microchannels of microchannel block 210B2 and absorbs waste heat from another portion of the first chip 306B1 to generate a partially heated third sub-portion 260B3 of coolant. Subsequently, the partially heated third sub-portion 260B3 of coolant flows through the multiple microchannels of microchannel block 210B3 and absorbs waste heat from the second chip 306B... 21 and 306B 22 (As shown in Figure 2) waste heat to generate the third sub-section 260B4 of heated coolant.

[0065] The fourth sub-portion 260B2 of coolant is directed through the remainder of the fourth flow path 402B2 defined by the fourth distribution conduit 232B2. The fourth sub-portion 260B2 of coolant flowing along the remainder of the fourth flow path 402B2 is directed through the microchannel block 210B4 (e.g., Figure 2A Multiple microchannels (unlabeled) are shown in the diagram, and then flow through microchannel block 210B5 (as shown in the diagram). Figure 2A Multiple microchannels (as shown in the diagram). For example, a second sub-portion 260B1 of coolant first flows through the multiple microchannels of microchannel block 210B4 and absorbs waste heat from another portion of the first chip 306B1 to generate a partially heated fourth sub-portion 260B5 of coolant. Subsequently, the partially heated fourth sub-portion 260B5 of coolant flows through the multiple microchannels of microchannel block 210B5 and absorbs waste heat from the second chip 306B1. 23 and 306B 24 (like Figure 3The waste heat (as shown in the diagram) is used to generate a fourth sub-portion 260B6 of heated coolant. Thus, according to some examples of this disclosure, each dispensing conduit 232 guides coolant 260 through the one or more microchannel blocks 210 to: i) absorb waste heat from a portion of the first chip, and ii) subsequently absorb waste heat from the one or more second chips.

[0066] Return to reference Figure 6A A first sub-portion 260A4 of heated coolant flows from a first distribution conduit 232A1 into a first sub-branch 236A1 of the second channel 236 in the first cooling component 202 via a second hole 240A. Further, a second sub-portion 260A6 of heated coolant flows from a second distribution conduit 232A2 into a second sub-branch 236A2 of the second channel 236 in the first cooling component 202 via another second hole 240B. Similarly, a third sub-portion 260B4 of heated coolant flows from a third distribution conduit 232B1 into a third sub-branch 236B1 of the second channel 236 in the first cooling component 202 via another second hole 240C. Further, a fourth sub-portion 260B6 of heated coolant flows from a fourth distribution conduit 232B2 into a fourth sub-branch 236B2 of the second channel 236 in the first cooling component 202 via another second hole 240D.

[0067] The first sub-section 260A4 of the heated coolant and the second sub-section 260A6 of the heated coolant are connected via the plurality of third partition walls 246 (e.g., Figure 2C (As shown) they merge along the first branch 236A of the second channel 236 in the first cooling component 202 to form a first portion 260A7 of heated coolant. Similarly, the third and fourth sub-portions 260B4 and 260B6 of heated coolant merge along the second branch 236B of the second channel 236 in the first cooling component 202 via the plurality of third partition walls 246 to form a second portion 260B8 of heated coolant. Further, the first portion 260A7 and the second portion 260B8 of heated coolant merge together along the second channel 236 to form heated coolant 260C. In this example, heated coolant 260C is discharged from the cooling module 200 to the CDU via an outlet manifold (not shown), which is connected to the outlet port 230 of the second cooling component 204.

[0068] Since each distribution conduit 232 guides a portion of the coolant 260 through one or more microchannel blocks 210 thermally coupled to the first chips 306A1, 306B1 (correspondingly GPU and / or CPU) with high casing temperatures, this portion of the coolant 260 can have sufficient thermal margin to absorb waste heat from the first chips 306A1, 306B1, and generate partially heated sub-portions 260A3, 260A5, 260B3, 260B5 of the coolant. Furthermore, since each distribution conduit 232 guides partially heated coolant sub-portions 260A3, 260A5, 260B3, 260B5 through the one or more microchannel blocks 210 thermally coupled to one or more second chips 306A2, 306B2 with low casing temperatures, the partially heated coolant sub-portions 260A3, 260A5, 260B3, 260B5 can still have sufficient thermal margin to subsequently absorb waste heat from the one or more second chips 306A2, 306B2 and generate heated coolant 260C. Therefore, the cooling module 200 can sufficiently and uniformly dissipate waste heat from all chipsets 306 in the circuit module 300.

[0069] Furthermore, since each distribution conduit 232 correspondingly defines a serpentine flow path 402 between the first cooling component 202 and the second cooling component 204, the coolant 260 can flow at a high velocity at a low volumetric flow rate and has a high heat transfer coefficient between the cooling module 200 and the coolant 260. In addition, because the cooling module 200 operates at a low volumetric flow rate, a smaller number of CDUs can meet the coolant requirements of multiple circuit components 400 in several electronic devices located in a data center environment. In some examples, the volumetric flow rate may be approximately 0.12 gallons per minute. In some examples, the cooling module 200 can reduce the temperature of the multiple chipsets 306 by approximately 2.9 degrees Celsius to 11.7 degrees Celsius.

[0070] Figure 7A A schematic diagram of the circuit assembly 700 is depicted, showing the flow of coolant 560 along the upper surface of the second cooling component 504 of the cooling module 500. Figure 7B Depicting Figure 7A A schematic diagram of the circuit assembly 700 shows the flow of coolant 560 along a flow path 702 defined between the upper surface of the first cooling component 502 and the lower surface of the second cooling component 504 of the cooling module 500. In the following description, for ease of illustration, [further details are provided]. Figures 7A to 7B .

[0071] This article can be noted that, Figures 7A to 7B The circuit component 700 is basically similar to Figures 6A to 6BCircuit assembly 400. For example, circuit assembly 700 includes a cooling module 500, which is substantially similar to... Figures 2A to 2D and Figures 6A to 6B The cooling module 200 differs in that, for example, the inlet port 228, outlet port 530, first channel 534, second channel 236, plurality of first holes 238, and plurality of second holes 240 of the cooling module 500 are interchanged accordingly. Furthermore, the circuit assembly 700 includes a circuit module (not labeled) that is similar to... Figure 3 and Figures 6A to 6B Circuit module 300.

[0072] Therefore, as discussed in the example in Figure 2, Figures 7A to 7B The circuit module (not shown) may include multiple chipsets, including a first chipset and a second chipset. The first chipset may be arranged along a first column, and the second chipset may be arranged along a second column. In one or more examples, the first chipset may include a first chip (e.g., a GPU) and multiple second chips (e.g., memory chips) partially surrounding the first chip. Similarly, the second chipset may include another first chip (e.g., a CPU) and multiple other second chips (e.g., memory chips) partially surrounding that other first chip. It may be noted herein that, for ease of illustration, Figures 7A to 7B No circuit modules are shown in the illustration, and such an example should not be construed as a limitation of this disclosure.

[0073] Cooling module 500 includes a first cooling component 502 and a second cooling component 504. In one or more examples, the first cooling component 502 and the second cooling component 504 can serve as cold plates. The first cooling component 502 includes a plurality of microchannel blocks 510 thermally coupled to a plurality of chipsets. The second cooling component 504 includes an inlet port 528, an outlet port 530, and a plurality of distribution conduits 532 fluidly coupled to the inlet port 528 and the outlet port 530. The plurality of distribution conduits 532 includes a first set of distribution conduits 532A and a second set of distribution conduits 532B. Figure 7AIn one example, the first set of distribution conduits 532A includes a first distribution conduit 532A1 and a second distribution conduit 532A2. The second set of distribution conduits 532B includes a third distribution conduit 532B1 and a fourth distribution conduit 532B2. In some examples, the second cooling component 504 also includes a plurality of first holes 538, a plurality of second holes 540, a first channel 534, and a second channel 536. In this example, an inlet port 528 is connected to the plurality of first holes 538 via a first channel 534, and an outlet port 530 is connected to the plurality of second holes 540 via a second channel 536.

[0074] The second cooling component 504 is disposed on the first cooling component 502, such that each of the plurality of distribution conduits 532 is disposed on one or more of the plurality of microchannel blocks 510. Figure 7A In the example, each of the plurality of dispensing conduits 532 is fluidly connected to an inlet port 528 and an outlet port 530 via at least one of the plurality of first holes 538, at least one of the plurality of second holes 540, a first channel 534, and a second channel 536. It may be noted herein that, for ease of illustration, in Figures 7A to 7B The cover of the cooling module 500 is not shown in the example.

[0075] During operation of the circuit assembly 700, the plurality of chipsets may generate waste heat. As will be understood, such waste heat generated by the plurality of chipsets is undesirable and, if not effectively managed, may negatively impact the operation of the circuit module. Therefore, in some examples, the proposed cooling module 500 may establish a sufficient thermal interface with the circuit module to enable efficient transfer of waste heat from the first chip, another first chip, the plurality of second chips, and the plurality of other second chips to the coolant 560 via the first cooling component 502 and the second cooling component 504, respectively.

[0076] In some examples, a CDU (not shown) in a data center environment can supply coolant 560 to a cooling module 500 via an inlet manifold (not shown) connected to an inlet port 528 of a second cooling component 504. The second cooling component 504 guides the coolant 560 into a first channel 534 via the inlet port 528. The first channel 534 divides the coolant 560 into a first portion 560A and a second portion 560B. The first channel 534 further divides the first portion 560A into a first sub-portion 560A1 and a second sub-portion 560A2. Further, the first channel 534 divides the second portion 560B into a third sub-portion 560B1 and a fourth sub-portion 560B2. Subsequently, the first channel 534 guides a first sub-portion 560A1 of the coolant into a first flow path 702A1 via a first hole 538A and another first hole 538B, and guides a second sub-portion 560A2 of the coolant into a second flow path 702A2 defined along the first column 212A. Further, the first channel 534 guides a third sub-portion 560B1 of the coolant into a third flow path 702B1 via other first holes 538C and 538D, and guides a fourth sub-portion 560B2 of the coolant into a fourth flow path 702B2 defined along the second column 212B.

[0077] Now for reference Figure 7B In the first column 212A of the cooling module 500, a first sub-portion 560A1 of coolant flows along a first flow path 702A1 defined by a first distribution conduit 532A1, which is vertically aligned over the one or more second chips and a portion of the first chip. In some examples, the first sub-portion 560A1 of coolant is guided through a microchannel block 510A1 located above the one or more second chips. As the first sub-portion 560A1 of coolant passes through the microchannel block 510A1, it absorbs waste heat from the one or more second chips to produce a partially heated first sub-portion 560A3 of coolant. Further, the partially heated first sub-portion 560A3 of coolant flows through a microchannel block 510A2 located above a portion of the first chip and absorbs waste heat from that portion of the first chip. The partially heated first sub-portion 560A3 of the coolant further flows through a microchannel block 510AB located above another portion of the first chip in a first common head section 533 of the first distribution conduit 532A1 and the second distribution conduit 532A2. As the partially heated first sub-portion 560A3 flows through the microchannel block 510AB, it absorbs waste heat from this other portion of the first chip to generate a heated first sub-portion 560A4 of the coolant.

[0078] A second sub-portion 560A2 of coolant flows along a second flow path 702A2 defined by a second dispensing conduit 532A2, which is vertically aligned over the one or more second chips and another portion of the first chip. In this example, the second sub-portion 560A2 of coolant is guided through a microchannel block 510B1 located over the one or more second chips. As the second sub-portion 560A2 of coolant flows through the microchannel block 510B1, it absorbs waste heat from the one or more second chips to produce a partially heated second sub-portion 560A5 of coolant. Further, the partially heated second sub-portion 560A5 of coolant flows through the microchannel block 510B2 located over another portion of the first chip and absorbs waste heat from that other portion of the first chip. The partially heated second sub-portion 560A5 of coolant further flows through a corresponding first common head segment 533 of the first dispensing conduit 532A1 and the second dispensing conduit 532A2 over the microchannel block 510AB located over yet another portion of the first chip. When the second sub-section 560A5 of the partially heated coolant flows through the microchannel block 510AB, it absorbs waste heat from another part of the first chip to generate the second sub-section 560A6 of the heated coolant.

[0079] Now for reference Figure 7B In the second column 212B of the cooling module 500, a third sub-portion 560B1 of coolant flows along a third flow path 702B1 defined by a third distribution conduit 532B1, which is vertically aligned over one or more other second chips and a portion of another first chip. In some examples, the third sub-portion 560B1 of coolant is guided through a microchannel block 510C1 located above the one or more other second chips. As the third sub-portion 560B1 of coolant flows through the microchannel block 510C1, it absorbs waste heat from the one or more other second chips to produce a partially heated first sub-portion 560B3 of coolant. Further, the partially heated first sub-portion 560B3 of coolant passes through a microchannel block 510C2 located above a portion of another first chip and absorbs waste heat from that portion of the other first chip. Subsequently, the partially heated first sub-portion 560B3 of the coolant flows through the microchannel block 510CD, which is located above another portion of the other first chip, in the second common head section 535 of the third distribution conduit 532B1 and the fourth distribution conduit 532B2. As the partially heated first sub-portion 560B3 passes through the microchannel block 510CD, it absorbs waste heat from the other portion of the other first chip to generate a heated third sub-portion 560B4 of the coolant.

[0080] A fourth sub-portion 560B2 of coolant flows along a fourth flow path 702B2 defined by a fourth distribution conduit 532B2, which is vertically aligned over the other portion of the one or more other second chips and the other first chip. In this example, the fourth sub-portion 560B2 of coolant is guided through a microchannel block 510D1 located over the one or more other second chips. As the fourth sub-portion 560B2 of coolant flows through the microchannel block 510D1, it absorbs waste heat from the one or more other second chips to produce a partially heated second sub-portion 560B5 of coolant. Further, the partially heated second sub-portion 560B5 of coolant flows through the microchannel block 510D2 located on the other portion of the other first chip and absorbs waste heat from that other portion of the other first chip. Subsequently, a second sub-portion 560B5 of partially heated coolant flows through a microchannel block 510CD located above the other portion of another first chip in a second common head segment 535 of the first distribution conduit 532B1 and the second distribution conduit 532B2. As the second sub-portion 560B5 of partially heated coolant flows through the microchannel block 510CD, it absorbs waste heat from the other portion of the other first chip to produce a fourth sub-portion 560B6 of heated coolant. Thus, according to some examples of this disclosure, each distribution conduit 532 guides coolant 560 through the one or more microchannel blocks 510 to: i) absorb waste heat from one or more second chips and subsequently absorb waste heat from a portion of the first chip.

[0081] Return to reference Figure 7A The first sub-portion 560A4 of heated coolant from the first distribution conduit 532A1 and the second sub-portion 560A6 of heated coolant from the second distribution conduit 532A2, together as the first combined sub-portion 560A7 of heated coolant, flow together into the first branch 536A of the second channel 536 via a second hole 540A. Similarly, the third sub-portion 560B4 of heated coolant from the third distribution conduit 532B1 and the fourth sub-portion 560B6 of heated coolant from the fourth distribution conduit 532B2, together as the second combined sub-portion 560B7 of heated coolant, flow together into the second branch 536B of the second channel 536 via another second hole 540B.

[0082] The first combined sub-portion 560A7 and the second combined sub-portion 560B7 of the heated coolant are further combined in the second channel 536 to form the heated coolant 560C. In this example, the heated coolant 560C is discharged from the cooling module 500 to the CDU via an outlet manifold (not shown), which is connected to the outlet port 530 of the second cooling component 504.

[0083] Figure 8 This is a flowchart describing a method 800 for forming a cooling module for circuit modules used in circuit components. It should be noted that, for example, method 800 is combined with... Figures 2A to 2D , Figures 3 to 4 and Figures 6A to 6B The description is as follows. Method 800 begins at box 802 and continues to box 804.

[0084] At block 804, method 800 includes forming a plurality of microchannel blocks on the upper surface of a first cooling component of a cooling module. In some examples, each of the plurality of microchannel blocks is formed using a machining process such as skiving. For example, the upper surface of the first cooling component is spun to form a plurality of elongated fins (e.g., cut fins) for each of the plurality of microchannel blocks. In some examples, the plurality of elongated fins of each microchannel block are arranged spaced apart from each other to form a plurality of microchannels. In one or more examples, the first cooling component is formed as arranged in two columns, such as a first column and a second column. In such examples, the plurality of microchannel blocks arranged along the first column can be classified as a first group of microchannel blocks, and the plurality of microchannel blocks arranged along the second column can be classified as a second group of microchannel blocks. In some examples, at least one of the height of the plurality of elongated fins of at least one microchannel block, the thickness of the plurality of elongated fins, or the spacing between the fins of the plurality of elongated fins is varied to adjust the heat transfer rate between at least one of a plurality of chipsets and the coolant via the at least one microchannel block. In some examples, the thickness of each elongated fin of at least one microchannel block can range from about 0.1 mm to about 1 mm. Similarly, the height of each elongated fin of at least one microchannel block can range from about 1.5 mm to about 6 mm. The spacing between the fins of at least one microchannel block can range from about 0.12 mm to about 2 mm. Method 800 continues to block 806.

[0085] At block 806, method 800 includes forming an inlet port on a first sidewall of a second cooling component of the cooling module and an outlet port on a second sidewall of the second cooling component. In some examples, the first and second sidewalls may be opposite sidewalls of the second cooling component. The first and second sidewalls of the second cooling component may be milled to form the inlet and outlet ports. Method 800 continues to block 808.

[0086] At block 808, method 800 includes forming a plurality of distribution conduits on the lower surface of a second cooling component and fluidly coupling each of the plurality of distribution conduits to an inlet port and an outlet port. The method 800 of forming the plurality of distribution conduits includes machining (e.g., milling or drilling) or molding the lower surface of the second cooling component to form a plurality of first partition walls, the plurality of first partition walls being spaced apart from each other to define the plurality of distribution conduits. In some examples, the plurality of distribution conduits are formed in two columns, for example, a first column and a second column. For example, the plurality of distribution conduits includes a first set of distribution conduits and a second set of distribution conduits arranged along two columns. The first set of distribution conduits is arranged along the first column, and the second set of distribution conduits is arranged along the second column. In other words, the plurality of distribution conduits includes a first distribution conduit and a second distribution conduit, as well as a third distribution conduit and a fourth distribution conduit, the first and second distribution conduits arranged along the first column, and the third and fourth distribution conduits arranged along the second column. The first and second distribution conduits may have a first common head section, and the third and fourth distribution conduits may have a second common head section.

[0087] In some examples, fluidly coupling each distribution conduit formed on the lower surface to an inlet port and an outlet port formed on a first sidewall and a second sidewall includes establishing a connection between a first hole among a plurality of first holes, a second hole among a plurality of second holes, a first channel, and a second channel. In some examples, each of the plurality of first holes and the plurality of second holes extends between the lower and upper surfaces of the second cooling component. Furthermore, a first channel and a second channel are formed on the upper surface of the second cooling component. In this example, one of the inlet ports or outlet ports is connected to the plurality of first holes via a first channel, and the other of the inlet ports or outlet ports is connected to the plurality of second holes via a second channel.

[0088] In one or more examples, the second cooling component is formed by machining processes such as milling, drilling, or molding to form the plurality of first holes, the plurality of second holes, the first channel, and the second channel. In some examples, the upper surface of the second cooling component may be machined to form a plurality of second partition walls and a plurality of third partition walls to correspondingly define the plurality of first channels and the second channel. In some examples, the plurality of first holes includes two first holes, for example, one first hole and another first hole, which are positioned adjacent to each other in a central region of the second cooling component. The plurality of second holes includes four second holes, for example, one second hole, another second hole, and yet another second hole, wherein each of these four holes is positioned near one of the four corners of the second cooling component. Method 800 continues to block 810.

[0089] At block 810, method 800 includes disposing a second cooling component on a first cooling component to form a cooling module, such that each of the plurality of distribution conduits is disposed on one or more of the plurality of microchannel blocks. In some examples, the second cooling component is disposed on the first cooling component such that each distribution conduit is thermally coupled to one or more microchannel blocks and defines a flow path for coolant flow between the first and second cooling components. In one or more examples, the one or more microchannel blocks are positioned within the flow path defined by each distribution conduit. For example, the first flow path defined by the first distribution conduit has an "S-shaped" profile, and the second flow path defined by the second distribution conduit has an "inverted S-shaped" profile. Similarly, the third flow path defined by the third distribution conduit has an "inverted S-shaped" profile, and the fourth flow path defined by the fourth distribution conduit has an "S-shaped" profile. In this example, each distribution conduit guides a coolant flow from an inlet port to an outlet port along the flow path, wherein the coolant passes through the one or more microchannel blocks to absorb waste heat transferred from at least one of the plurality of chipsets to the one or more microchannel blocks. In some examples, the plurality of chipsets includes a first chip, another first chip, a plurality of second chips, and a plurality of other second chips. In some examples, the first chip may include a CPU, the other first chip may include a GPU chip, and the plurality of second chips may include memory chips. Method 800 ends at box 812.

[0090] In the foregoing description, numerous details have been set forth to provide an understanding of the subject matter disclosed herein. However, embodiments may be practiced without some or all of these details. Other embodiments may include modifications, combinations, and variations of the details discussed above. The appended claims are intended to cover such modifications and variations.

Claims

1. A cooling module for a circuit module, the cooling module comprising: A first cooling component, comprising a plurality of microchannel blocks thermally coupled to a plurality of chipsets of the circuit module, wherein each microchannel block includes a plurality of elongated fins defining a plurality of microchannels; and A second cooling component is disposed on the first cooling component. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits fluidly coupled to the inlet port and the outlet port. Each of the plurality of distribution conduits is disposed on one or more microchannel blocks of the plurality of microchannel blocks and guides coolant from the inlet port through the plurality of microchannels of the one or more microchannel blocks to the outlet port to absorb waste heat transferred from at least one of the plurality of chipsets to the one or more microchannel blocks. The plurality of distribution conduits includes a first group of distribution conduits and a second group of distribution conduits, the first group of distribution conduits being arranged along a first column and the second group of distribution conduits being arranged along a second column, wherein each of the first group of distribution conduits and the second group of distribution conduits defines a serpentine flow path aligned over a portion of a corresponding chip group in the plurality of chipsets.

2. The cooling module as described in claim 1, wherein, The plurality of distribution conduits are formed on the lower surface of the second cooling component, and the plurality of microchannel blocks are formed on the upper surface of the first cooling component.

3. The cooling module as described in claim 1, wherein, The second cooling component further includes a plurality of first holes, a plurality of second holes, a first channel, and a second channel, wherein one of the inlet port or the outlet port is connected to the plurality of first holes via the first channel, and the other of the inlet port or the outlet port is connected to the plurality of second holes via the second channel, and wherein each dispensing conduit is fluidly coupled to the inlet port and the outlet port via at least one first hole, at least one second hole, the first channel, and the second channel.

4. The cooling module as described in claim 1, wherein, The plurality of chipsets includes a first chipset arranged along the first column and a second chipset arranged along the second column, wherein each of the first chipset and the second chipset includes a first chip and a plurality of second chips.

5. The cooling module as described in claim 4, wherein, The plurality of microchannel blocks include a first group of microchannel blocks and a second group of microchannel blocks, the first group of microchannel blocks being arranged along the first column and the second group of microchannel blocks being arranged along the second column, wherein each of the plurality of microchannels defined in each microchannel block has a linear flow path.

6. The cooling module as described in claim 4, wherein, Each distribution conduit guides the coolant through the one or more microchannel blocks to: i) absorb waste heat from the portion of the first chip and subsequently absorb waste heat from the one or more second chips, or ii) absorb waste heat from the one or more second chips and subsequently absorb waste heat from the portion of the first chip.

7. The cooling module as described in claim 1, wherein, The heat transfer rate between the at least one chip assembly and the coolant via the at least one microchannel block is adjusted by changing at least one of the height of the plurality of elongated fins, the thickness of the plurality of elongated fins, or the spacing between the fins in the plurality of elongated fins.

8. The cooling module as claimed in claim 1, wherein, The coolant is a mixture of water and propylene glycol, a dielectric fluid, or treated water, wherein the cooling module reduces the temperature of the plurality of chipsets by 2.9 degrees Celsius to 11.7 degrees Celsius, and wherein the volumetric flow rate of the coolant between the inlet port and the outlet port of the cooling module is 0.12 gallons per minute.

9. A circuit assembly, the circuit assembly comprising: A circuit module, the circuit module including a substrate and multiple chip groups, the multiple chip groups being disposed on the substrate; as well as Cooling module, the cooling module comprising: A first cooling component, comprising a plurality of microchannel blocks thermally coupled to the plurality of chipsets, wherein each microchannel block includes a plurality of elongated fins defining a plurality of microchannels; and A second cooling component is disposed on the first cooling component. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits fluidly coupled to the inlet port and the outlet port. Each of the plurality of distribution conduits is disposed on one or more microchannel blocks of the plurality of microchannel blocks and guides coolant from the inlet port through the plurality of microchannels of the one or more microchannel blocks to the outlet port to absorb waste heat transferred from at least one of the plurality of chipsets to the one or more microchannel blocks. The plurality of distribution conduits includes a first group of distribution conduits and a second group of distribution conduits, the first group of distribution conduits being arranged along a first column and the second group of distribution conduits being arranged along a second column, wherein each of the first group of distribution conduits and the second group of distribution conduits defines a serpentine flow path aligned over a portion of a corresponding chip group in the plurality of chipsets.

10. The circuit assembly of claim 9, wherein, The plurality of distribution conduits are formed on the lower surface of the second cooling component, and the plurality of microchannel blocks are formed on the upper surface of the first cooling component.

11. The circuit assembly of claim 9, wherein, The second cooling component further includes a plurality of first holes, a plurality of second holes, a first channel, and a second channel, wherein one of the inlet port or the outlet port is connected to the plurality of first holes via the first channel, and the other of the inlet port or the outlet port is connected to the plurality of second holes via the second channel, and wherein each dispensing conduit is fluidly coupled to the inlet port and the outlet port via at least one first hole, at least one second hole, the first channel, and the second channel.

12. The circuit assembly of claim 9, wherein, The plurality of chipsets includes a first chipset arranged along the first column and a second chipset arranged along the second column, wherein each of the first chipset and the second chipset includes a first chip and a plurality of second chips.

13. The circuit assembly of claim 12, wherein, The plurality of microchannel blocks include a first group of microchannel blocks and a second group of microchannel blocks, the first group of microchannel blocks being arranged along the first column and the second group of microchannel blocks being arranged along the second column, wherein each of the plurality of microchannels defined in each microchannel block has a linear flow path, and wherein each dispensing conduit guides the coolant through the one or more microchannel blocks to: i) absorb waste heat from the portion of the first chip and subsequently absorb waste heat from the one or more second chips, or ii) absorb waste heat from the one or more second chips and subsequently absorb waste heat from the portion of the first chip.

14. The circuit assembly of claim 9, wherein, The heat transfer rate between the at least one chipset and the coolant via the at least one microchannel block is adjusted by changing at least one of the height of the plurality of elongated fins, the thickness of the plurality of elongated fins, or the spacing between the fins of the plurality of elongated fins, wherein the coolant is a mixture of water and propylene glycol, a dielectric fluid, or treated water, wherein the cooling module reduces the temperature of the plurality of chipsets by 2.9 degrees Celsius to 11.7 degrees Celsius, and wherein the volumetric flow rate of the coolant between the inlet port and the outlet port of the cooling module is 0.12 gallons per minute.

15. An electronic device comprising the circuit assembly of claim 9, further comprising a printed circuit board, wherein, The circuit module is removably coupled to the printed circuit board.

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