Embedded component circuit board and method of manufacturing the same

Abstract

The present application provides a circuit board with embedded components and enhanced heat dissipation capacity, comprising at least two stacked heat dissipation substrates, a bonding layer between two adjacent heat dissipation substrates, an insulating layer covering the surface of the outermost heat dissipation substrate, and a plurality of heat dissipation columns embedded in the insulating layer. Each heat dissipation substrate comprises a heat dissipation insulating layer, a first circuit layer, a second circuit layer, a conductive structure, an embedded structure, and a plurality of heat dissipation columns. The embedded structure includes an electronic component electrically connected to the conductive structure, a conductive material connected to the conductive structure, and an insulating and heat-conductive material connecting the electronic component and the heat dissipation insulating layer. The first circuit layer includes a plurality of heat dissipation pads, and each heat dissipation column is connected to the heat dissipation pad. The present application also provides a manufacturing method for a circuit board with embedded components.

Description

Technical Field

[0001] This invention relates to a circuit board, and more particularly to a circuit board with embedded components. Background Technology

[0002] With current technological advancements, circuit boards can integrate multiple densely distributed electronic components, and embedded component technology allows electronic components to be placed within recesses on the circuit board. However, due to the small contact area between the circuit board pads and the electronic components, precise alignment and electrical connection are difficult. Furthermore, electronic components are typically encapsulated in molding materials, which generally have low thermal conductivity. This causes heat generated by the electronic components to accumulate in the recesses, potentially reducing the lifespan of the components. Summary of the Invention

[0003] Therefore, the present invention provides an embedded component circuit board and its manufacturing method to increase the heat dissipation efficiency of the circuit board and reduce the installation difficulty of electronic components.

[0004] This invention provides an embedded component circuit board, comprising at least two heat-dissipating insulating layers stacked on top of each other; a first circuit layer disposed on one surface of each heat-dissipating insulating layer, the first circuit layer further comprising multiple heat-dissipating pads; a second circuit layer disposed on the other surface of each corresponding heat-dissipating insulating layer relative to each first circuit layer; multiple conductive structures located within the heat-dissipating insulating layers and connecting the first circuit layer and the second circuit layer; and multiple embedded structures disposed within the heat-dissipating insulating layers. Each embedded structure comprises multiple electronic components; multiple conductive materials located between the conductive structures and the electronic components, electrically connecting the electronic components and the conductive structures; multiple insulating and thermally conductive materials located between the heat-dissipating insulating layers and the electronic components, and in direct contact with the heat-dissipating insulating layers and the electronic components; and multiple sealing materials covering the electronic components. The embedded component circuit board further comprises at least one bonding layer, each of which is disposed between two adjacent layers in the heat-dissipating insulating layers; two insulating layers disposed on the outermost two layers of the first circuit layer; and multiple heat-dissipating pillars disposed in the insulating layers, wherein each heat-dissipating pillar is connected to each of the heat-dissipating pads. The insulating layers do not cover the surface of the heat-dissipating pillars away from the heat-dissipating pads.

[0005] In at least one embodiment of the present invention, each of the above-described heat dissipation insulating layers has an opening, and an embedded structure is located in the opening, and one surface of the conductive structure is flush with the sidewall of the opening.

[0006] In at least one embodiment of the present invention, each of the above-mentioned insulating and thermally conductive materials is located between two adjacent conductive materials.

[0007] In at least one embodiment of the present invention, the thickness of each of the above electronic components is not greater than the total thickness of a heat dissipation insulating layer and a second circuit layer.

[0008] This invention also provides a method for manufacturing an embedded component circuit board, comprising forming at least two heat-dissipating substrates. The step of forming each heat-dissipating substrate includes forming a first circuit layer and a second circuit layer on a heat-dissipating insulating layer, wherein the heat-dissipating insulating layer is sandwiched between the first circuit layer and the second circuit layer, and the first circuit layer further includes a plurality of heat-dissipating pads; forming a plurality of conductive holes within the heat-dissipating insulating layer, wherein the conductive holes electrically connect the first circuit layer and the second circuit layer; removing a portion of the heat-dissipating insulating layer, a portion of the first circuit layer, a portion of the second circuit layer, and a portion of each conductive hole to form an opening, wherein the opening has sidewalls, and the remaining portion of each conductive hole forms a conductive structure exposed on the sidewalls; forming an insulating layer on the first circuit layer, wherein the insulating layer covers the opening; after forming the insulating layer, placing a plurality of electronic components within the opening and electrically connecting each electronic component to the conductive structure; and after placing the electronic components, filling the opening with a sealing material. After forming each heat-dissipating substrate, the at least two heat-dissipating substrates are stacked and joined; and after stacking and joining the heat-dissipating substrates, a plurality of heat-dissipating pillars are formed within the insulating layer of the heat-dissipating substrates, wherein each heat-dissipating pillar is connected to the heat-dissipating pad.

[0009] In at least one embodiment of the present invention, the method of manufacturing the embedded component circuit board further includes disposing of a plurality of insulating and thermally conductive materials in the opening, each of the insulating and thermally conductive materials being located between two of the conductive structures and directly contacting the sidewall. Furthermore, after the electronic components are disposed, the electronic components are connected to the sidewall via the insulating and thermally conductive materials.

[0010] In at least one embodiment of the present invention, the step of electrically connecting each electronic component to the conductive structure includes disposing a plurality of conductive materials on the plurality of conductive structures respectively; and after disposing the electronic component, electrically connecting the electronic component to the conductive materials.

[0011] In at least one embodiment of the present invention, the step of forming a plurality of heat dissipation pillars includes forming a plurality of openings within the insulating layer of a plurality of heat dissipation substrates; and performing blind hole plating within the openings.

[0012] In at least one embodiment of the present invention, the step of forming a first circuit layer and a second circuit layer on a heat-dissipating insulating layer includes providing a substrate comprising two metal layers and a heat-dissipating insulating layer sandwiched between the metal layers; and patterning the two metal layers to form the first circuit layer and the second circuit layer.

[0013] This invention utilizes insulating and thermally conductive materials and a heat-dissipating insulating layer to increase the lateral heat dissipation efficiency of the circuit board, and utilizes heat dissipation pads and heat dissipation pillars connected to the heat-dissipating insulating layer to increase the longitudinal heat dissipation efficiency of the circuit board. This allows the heat generated by electronic components to dissipate to the external environment more quickly, reducing the heat accumulation on the electronic components and thus helping to improve their lifespan. Furthermore, the conductive structure penetrating the heat-dissipating insulating layer increases the contact area for electrical connections with electronic components, thereby reducing the difficulty of installing the electronic components. Attached Figure Description

[0014] The nature of the invention can be understood from the following detailed description and accompanying drawings. It should be noted that many features are not drawn to industry-standard scale. In fact, for clarity of discussion, the dimensions of various features may be arbitrarily increased or decreased.

[0015] Figures 1A to 1E A cross-sectional view illustrating a method for manufacturing an embedded component circuit board according to at least one embodiment of the present invention is shown.

[0016] Figures 2A to 2C The illustration continues from Figure 1E The top view of the subsequent embedded component circuit board manufacturing method.

[0017] Figure 3 Draw Figure 2C A cross-sectional view drawn along section 3-3 in the diagram.

[0018] Figure 4 and Figure 5 The illustration continues from Figure 3 The following is a cross-sectional view of the manufacturing method of the embedded component circuit board. Detailed Implementation

[0019] The present invention will be described in detail with reference to the following embodiments. It should be noted that the following description of the embodiments of the present invention is for illustrative purposes only and is not intended to disclose all embodiments exhaustively or to limit the specific embodiments of the invention. For example, the phrase "a first feature is formed on a second feature" in the description includes various implementations, covering both situations where the first and second features are in direct contact, and situations where an additional feature is formed between the first and second features so that they are not in direct contact. Furthermore, the same element symbols used in the drawings and specification will, as far as possible, represent the same or similar elements.

[0020] Spatially relative terms, such as "lower," "below," "below," "above," and "above," are used here to simply describe the relationship between an element or feature as shown in the figure and another element or feature. These spatially relative terms cover not only the orientation depicted in the figure but also different orientations when using or operating the device. Furthermore, when the element is rotatable (rotating 90 degrees or other angles), the spatially relative descriptive terms used here can also be interpreted accordingly.

[0021] Furthermore, when using terms such as "approximately" or "about" to describe numbers or ranges, the term is intended to encompass numbers within a reasonable range and must take into account the natural differences that would be understood by one of skill in the art during the manufacturing process. A range of numbers encompasses a reasonable range including the described number; for example, within + / - 10% of the described number is based on known manufacturing tolerances that relate to the characteristics of the manufacturing feature. For instance, a material layer with a thickness of "approximately 5 nanometers" could cover a size range from 4.25 nanometers to 5.75 nanometers, where a manufacturing tolerance of + / - 15% for depositing the material layer is known to one of skill in the art. Furthermore, this disclosure may repeat reference numerals and / or designations in various examples. This repetition is for simplicity and clarity and is not intended to indicate any relationship between the various embodiments and / or configurations discussed herein.

[0022] This invention discloses a method for manufacturing a circuit board with embedded components, the method comprising, for example, Figures 1A to 1E The steps are shown below. (See reference.) Figure 1A The process begins by providing a substrate 10, which includes a heat-dissipating insulating layer 100 and a double metal layer 101, with the heat-dissipating insulating layer 100 sandwiched between the double metal layers 101. The heat-dissipating insulating layer 100 has high thermal conductivity and may contain, for example, graphene, a carbon nanotube mixture, a graphitized and carbonized polyimide heat dissipation film, or similar materials. The material of the double metal layer 101 may include copper.

[0023] In this embodiment, these metal layers 101 may be metal foils (e.g., copper foil) and are respectively attached to opposite sides of the heat dissipation insulating layer 100. In other embodiments, the double metal layers 101 may be formed directly on the heat dissipation insulating layer 100 using a coating process (e.g., chemical vapor deposition, physical vapor deposition, electroplating, and / or chemical electroplating).

[0024] Next, as Figure 1BAs shown, a plurality of conductive holes 104 are formed in the heat-dissipating insulating layer 100, and each conductive hole 104 is electrically connected to the double metal layer 101. The conductive hole 104 is essentially a conductive post, and its shape can be, for example, a cuboid or a cylinder, and it has an upper end 103 and a lower end 105, wherein the upper end 103 and the lower end 105 are respectively connected to the double metal layer 101. The difference between the cross-sectional diameter R1 of the upper end 103 and the cross-sectional diameter R2 of the lower end 105 does not exceed approximately 10%. For example, the difference between the cross-sectional diameter R1 of the upper end 103 and the cross-sectional diameter R2 of the lower end 105 can be approximately 5%. Furthermore, the material of the conductive hole 104 includes metals, such as copper.

[0025] Next, as Figure 1C As shown in the steps, at least one of the double metal layers 101 is patterned to form a first circuit layer 102 and a second circuit layer 106. In this embodiment, the patterning is performed by a photolithography etching process to form the first circuit layer 102 and the second circuit layer 106. Regardless of whether it is patterned, multiple portions in the first circuit layer 102 can be regarded as multiple heat dissipation pads 102p. Each heat dissipation pad 102p is aligned with the side of the first circuit layer 102 away from the heat dissipation insulating layer 100.

[0026] It is worth mentioning that, in other embodiments, a second circuit layer 106 can be formed directly on one side of the heat-dissipating insulating layer 100 using printed conductive paste, an additive method, or a semi-additive method, and a patterned first circuit layer 102 can be formed on the other side of the heat-dissipating insulating layer 100 (e.g., ...). Figure 1C (As shown). In other words, the method of forming the second circuit layer 106 is not limited to, for example... Figures 1A to 1C The steps revealed.

[0027] Please refer to Figure 1D As shown in the steps, an opening 110 is then formed. The opening 110 extends from the second wiring layer 106 through the heat-dissipating insulating layer 100 to the first wiring layer 102. The opening 110 has sidewalls 111. During the formation of the opening 110, a portion of each conductive via 104 is removed, and the remaining conductive vias 104 form a conductive structure 114. One side of the conductive structure 114 is flush with a portion of the opening sidewall 111, exposed in the opening 110. Furthermore, the method of forming the opening 110 may include routing.

[0028] The next step is as follows Figure 1E As shown, an insulating layer 112 is formed on the first circuit layer 102, wherein the insulating layer 112 completely covers the opening 110. The insulating layer 112 may be adhesive. Alternatively, the insulating layer 112 may also be a structure including a bonding layer and a dielectric layer, wherein the aforementioned bonding layer is, for example, an adhesive material.

[0029] After the insulating layer 112 is formed, a series of steps are performed as shown in the diagram. Figures 2A to 2C The steps in the process involve placing the electronic component 206 into the opening 110. Figures 2A to 2C It is a top view, and Figures 2A to 2C This drawing is based on the view from the second line layer 106. For clarity, Figures 2A to 2C For simplification, only the conductive structure 114 connected to the opening 110 is shown, and the labeling and drawing of the second circuit layer 106 are omitted.

[0030] Please refer to Figure 2A After the opening 110 is formed in the heat-dissipating insulating layer 100, an insulating thermally conductive material 202 is disposed between two adjacent conductive structures 114 exposed on the sidewall 111, and the insulating thermally conductive material 202 is in direct contact with the sidewall 111. The insulating thermally conductive material 202 may include thermally conductive adhesive or a material with a high thermal conductivity coefficient.

[0031] Then, as Figure 2B As shown in the top view of some embodiments of the present invention, a conductive material 204 is disposed on the conductive structure 114 exposed on the sidewall 111. The conductive material 204 may include conductive paste, conductive adhesive, or similar materials. In this embodiment, the insulating and thermally conductive material 202 and the conductive material 204 may be in direct contact, but in other embodiments, the insulating and thermally conductive material 202 and the conductive material 204 may not be in direct contact, and the insulating and thermally conductive material 202 and the conductive material 204 may be separated from each other.

[0032] Please refer to Figure 2C and Figure 3 ,in Figure 3 Draw Figure 2C The cross-sectional view is drawn along line 3-3. After the conductive material 204 is applied, the electronic component 206 is placed in the opening 110, and the conductive material 204 electrically connects the electronic component 206 and the conductive structure 114. Next, the opening 110 is filled with a sealing material 208, thereby fixing the electronic component 206 in the opening 110, wherein the sealing material 208 fills the space between the electronic components 206 and covers the electronic components 206. Thus, the heat dissipation substrate 30 is formed.

[0033] Subsequently, reference Figure 4 As shown, two heat dissipation substrates 30 are stacked and bonded to form a multilayer circuit structure 40, wherein the two heat dissipation substrates 30 are stacked back to back, that is, the insulating layers 112 of the two heat dissipation substrates 30 are respectively located on the outermost layer of the multilayer circuit structure 40. In addition, the two heat dissipation substrates 30 are connected by a bonding layer 400 to form the multilayer circuit structure 40.

[0034] The number of heat dissipation substrates 30 is not limited to two, and the number of bonding layers 400 is not limited to one. For example, in other embodiments, the number of heat dissipation substrates 30 may be three or more, and the number of bonding layers 400 may be two or more, wherein other components may be included between two adjacent heat dissipation substrates 30. For example, a circuit layer may be formed between two adjacent heat dissipation substrates 30. Therefore, Figure 4 The multilayer circuit structure 40 shown does not limit the number of both the heat dissipation substrate 30 and the bonding layer 400.

[0035] Please see Figure 5 After forming the multilayer circuit structure 40, multiple heat dissipation pillars 504 are further formed in the insulating layer 112, thereby forming a structure as shown in the figure. Figure 5 The embedded component circuit board 50 is shown. The step of forming a plurality of heat sink pillars 504 includes forming a plurality of openings (not shown) within an insulating layer 112. These openings are connected to a heat sink 102p. Next, a heat-dissipating material is deposited in these openings (not shown) by deposition, and the heat sink pillars 504 are connected to the heat sink 102p, wherein this deposition may be blind via plating.

[0036] The present invention also provides an embedded component circuit board 50, which includes a plurality of heat-dissipating insulating layers 100, a plurality of second circuit layers 106, a plurality of first circuit layers 102, a plurality of bonding layers 400, two insulating layers 112, and a plurality of heat dissipation pillars 504. Each heat-dissipating insulating layer 100 has a first surface 501 and a second surface 502, each second circuit layer 106 is located on the first surface 501, and each first circuit layer 102 is located on the second surface 502. On the other hand, each bonding layer 400 is disposed between two adjacent heat-dissipating insulating layers 100 and is connected to the two heat-dissipating insulating layers 100 by means of two second circuit layers 106. In other words, the second circuit layers 106 located on two adjacent heat-dissipating insulating layers 100 are arranged face-to-face with each other across the bonding layers 400.

[0037] Each heat-dissipating insulating layer 100 includes an embedded structure 300. Each embedded structure 300 contains multiple thermally conductive materials 202 (not shown). Figure 5 The embedded structure 300 comprises multiple conductive materials 204, multiple electronic components 206, and multiple sealing materials 208. Since the embedded structure 300 is installed within the opening 110, the sidewall 511 of the embedded structure 300 and the sidewall 111 of the opening 110 (shown in...) Figure 1D , Figure 1E , Figures 2A to 2C They came into contact with each other.

[0038] In the embedded structure 300, the thermally conductive material 202 (illustrated in...) Figures 2A to 2CThe conductive material 204 is located between the sidewall 511 and the electronic component 206, and is in direct contact with both the sidewall 511 and the electronic component 206, to facilitate the transfer of heat generated by the electronic component 206 to the heat dissipation insulating layer 100. On the other hand, the conductive material 204 is connected to the conductive structure 114 and is located between the conductive structure 114 and the electronic component 206. Figure 1D It can be seen that one side of the conductive structure 114 is flush with a portion of the opening sidewall 111, and one side of the conductive structure 114 is exposed in the opening 110. Therefore, the conductive material 204 can electrically connect the electronic component 206 and the conductive structure 114. In addition, the thermally conductive material 202 is located between two adjacent conductive materials 204.

[0039] Sealing material 208 is distributed within the embedded structure 300 and fills the space between electronic components 206 to separate the electronic components 206 from the bonding layer 400. In other embodiments, sealing material 208 may not separate the electronic components 206 from the bonding layer 400.

[0040] The heat-dissipating insulating layer 100 has a thickness T1, and the second circuit layer 106 has a thickness T2. The thickness T3 of the electronic component 206 is not greater than the sum of the thickness T1 of the heat-dissipating insulating layer 100 and the thickness T2 of the second circuit layer 106, i.e., thickness T3 ≤ thickness T1 + thickness T2. Alternatively, in other embodiments, the thickness T3 of the electronic component 206 may be less than the thickness T1 of the heat-dissipating insulating layer 100.

[0041] like Figure 5 As shown, two insulating layers 112 are located on the two first circuit layers 102, forming the outermost two layers of the multilayer circuit structure 40. Multiple heat dissipation pillars 504 are distributed within the two insulating layers 112, each of which includes a top surface 521, a bottom surface 522, and a side surface 523. The bottom surface 522 of each heat dissipation pillar 504 is connected to the first circuit layer 102. It should be noted that the insulating layer 112 only covers the side surface 523 of the heat dissipation pillar 504, not the top surface 521, allowing the top surface 521 to be exposed to the external environment. Therefore, the heat dissipation pillars 504 can transfer heat energy from the heat-dissipating insulating layer 100 and dissipate heat energy to the external environment from the top surface 521.

[0042] In summary, the embedded component circuit board 50 may include multiple stacked heat-dissipating insulating layers 100; multiple first circuit layers 102, each first circuit layer being disposed on one side of each heat-dissipating insulating layer 100, and each first circuit layer 102 including multiple heat dissipation pads 102p; multiple second circuit layers 106, each second circuit layer 106 being disposed on the other side of the heat-dissipating insulating layer 100 relative to each first circuit layer 102; multiple conductive structures 114 located within the heat-dissipating insulating layer 100, the two ends of which are respectively connected to a first circuit layer 102 and a second circuit layer 106; at least one embedded structure 300 disposed within the heat-dissipating insulating layer 100; at least one bonding layer 400 disposed between two adjacent heat-dissipating insulating layers 100; two insulating layers 112 disposed on the two outermost first circuit layers 102; and multiple heat dissipation pillars 504 located in the insulating layer 112 and connected to the heat dissipation pads 102p. Each embedded structure 300 includes multiple insulating and thermally conductive materials 202, multiple conductive materials 204, multiple electronic components 206, and multiple sealing materials 208 covering the electronic components 206. The conductive materials 204 electrically connect the electronic components 206 and the conductive structure 114, and the insulating and thermally conductive materials 202 are located between the electronic components 206 and the heat dissipation insulating layer 100. The insulating layer 112 does not cover the top surface 521 of the heat dissipation pillar 504 away from the heat dissipation pad 102p. The embedded structure is located in the opening 110, and one surface of the conductive structure 114 is flush with the sidewall 111 of the opening 110. Each insulating and thermally conductive material 202 is located between two adjacent conductive materials 204. Furthermore, the thickness T3 of each electronic component 206 is no greater than the thickness T1 of the heat dissipation insulating layer 100 plus the thickness T2 of a second circuit layer 106.

[0043] Accordingly, the design of the embedded structure 300 allows the heat generated by the electronic component 206 to be directly transferred to the heat dissipation insulation layer 100 via the thermally conductive material 202. Simultaneously, the placement of the heat dissipation pillars 504 provides a path for the heat dissipation insulation layer 100 to transfer heat outwards, reducing the impact of the insulation layer 112 blocking heat transfer and thus improving the efficiency of heat dissipation, which in turn helps to improve the lifespan of the electronic component. Furthermore, the embedded structure 300 incorporates a conductive material 204, which electrically connects the conductive structure 114 and the electronic component 206. This design increases the contact area between each pair (between the electronic component 206 and the conductive material 204, and between the conductive structure 114 and the conductive material 204), further improving the accuracy of the electrical connection.

[0044] Although the embodiments of the present invention have been disclosed above, they are not intended to limit the embodiments of the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the embodiments of the present invention. Therefore, the scope of protection of the embodiments of the present invention shall be determined by the appended claims.

[0045] [Symbol Explanation]

[0046] 10:Substrate

[0047] 100: Heat dissipation insulation layer

[0048] 101: Metal layer

[0049] 102: First Line Layer

[0050] 102p: Thermal pad

[0051] 103: Top

[0052] 105: Lower end

[0053] 104: Conductive hole

[0054] 106: Second Line Layer

[0055] 110: Opening

[0056] 111,511: Sidewall

[0057] 112: Insulation layer

[0058] 114: Conductive Structure

[0059] 202: Insulating and thermally conductive materials

[0060] 204: Conductive materials

[0061] 206: Electronic Components

[0062] 208: Sealing material

[0063] 30: Heat dissipation substrate

[0064] 300: Embedded structure

[0065] 40: Multilayer circuit structure

[0066] 400: Bonding layer

[0067] 50: Embedded component circuit board

[0068] 501: First Page

[0069] 502: Second page

[0070] 504: Heat sink

[0071] 521: Top surface

[0072] 522: Bottom surface

[0073] 523: Side surface

[0074] R1, R2: Diameter

[0075] T1, T2, T3: Thickness.

Claims

1. A circuit board with embedded components, characterized in that, Include: Multiple heat dissipation insulation layers are stacked on top of each other; Multiple first circuit layers are respectively disposed on one side of the heat dissipation insulating layer; Multiple second circuit layers are disposed on the other side of the heat dissipation insulation layer, relative to the first circuit layer, wherein one of the first circuit layers and one of the second circuit layers are respectively located on opposite sides of each of the heat dissipation insulation layers, and wherein the first circuit layer includes multiple heat dissipation pads. Multiple conductive structures are located within the heat dissipation insulating layer and connect the second circuit layer to the first circuit layer; Multiple embedded structures are respectively disposed within the heat dissipation insulation layer, each of the embedded structures comprising: Multiple electronic components; Multiple conductive materials are located between the conductive structure and the electronic component, and electrically connect the electronic component and the conductive structure; Multiple insulating and thermally conductive materials are located between the heat dissipation insulating layer and the electronic components, and are in direct contact with the heat dissipation insulating layer and the electronic components; Multiple sealing materials are used to encapsulate the electronic components; At least one bonding layer, wherein each of the bonding layers is disposed between two adjacent layers in the heat-dissipating insulating layer; Two insulating layers are respectively disposed on the outermost two layers of the first circuit layer; as well as Multiple heat dissipation pillars are disposed in the insulating layer and connected to the heat dissipation pad.

2. The embedded component circuit board according to claim 1, characterized in that, The insulating layer does not cover the surface of the heat dissipation column away from the heat dissipation pad.

3. The embedded component circuit board according to claim 1, characterized in that, Each of the heat-dissipating insulating layers has an opening, and the embedded structure is located in the opening, wherein the surface of the conductive structure is flush with the sidewall of the opening.

4. The embedded component circuit board according to claim 1, characterized in that, Each of the insulating and thermally conductive materials is located between two adjacent conductive materials.

5. The embedded component circuit board according to claim 1, characterized in that, The thickness of each of the electronic components is no greater than the total thickness of one of the heat dissipation insulating layers and one of the second circuit layers.

6. A method for manufacturing a circuit board with embedded components, characterized in that, Include: Forming a plurality of heat dissipation substrates, wherein the step of forming each of the heat dissipation substrates includes: A first circuit layer and a second circuit layer are formed on a heat-dissipating insulating layer, wherein the heat-dissipating insulating layer is sandwiched between the first circuit layer and the second circuit layer, and wherein the first circuit layer includes a plurality of heat dissipation pads. Multiple conductive holes are formed within the heat dissipation insulating layer, wherein the conductive holes electrically connect the first circuit layer and the second circuit layer; A portion of the heat-dissipating insulating layer, a portion of the first circuit layer, a portion of the second circuit layer, and a portion of each of the conductive holes are removed to form an opening, wherein the opening has a sidewall, and the remaining portion of each of the conductive holes forms a conductive structure exposed to the sidewall. An insulating layer is formed on the first circuit layer, wherein the insulating layer covers the opening; After the insulating layer is formed, a plurality of electronic components are disposed within the opening, and each of the electronic components is electrically connected to the conductive structure; as well as After the electronic components are installed, the opening is filled with sealing material; The heat dissipation substrates are stacked and joined together; as well as After the heat dissipation substrate is stacked and joined, a plurality of heat dissipation pillars are formed within the insulating layer of the heat dissipation substrate, wherein each of the heat dissipation pillars is connected to the heat dissipation pad.

7. The method according to claim 6, characterized in that, It also includes a plurality of insulating and thermally conductive materials disposed in the opening, wherein each of the insulating and thermally conductive materials is located between two of the conductive structures and in direct contact with the sidewall.

8. The method according to claim 7, characterized in that, After the electronic components are installed, they are allowed to directly contact the insulating and thermally conductive material.

9. The method according to claim 6, characterized in that, The step of electrically connecting each of the electronic components to the conductive structure includes: Multiple conductive materials are respectively disposed on the conductive structure; and After the electronic component is installed, the electronic component is connected to the conductive material.

10. The method according to claim 6, characterized in that, The step of forming multiple heat dissipation columns includes: A plurality of openings are formed within the insulating layer of the plurality of heat dissipation substrates; and Blind hole electroplating is performed inside the opening.

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