Method for manufacturing an alloyed resistive element

Abstract

A method for manufacturing an alloy resistive element is performed using a roll-to-roll process. The method sequentially includes a resistor forming step of pulling a metal substrate wound on a roller to form multiple resistor bodies; a sealing step of covering the resistor bodies with insulating material; a descaling step of removing excess adhesive residue; a cutting step of cutting along the periphery of the resistor bodies; and an end electrode forming step of forming end electrodes on the exposed sides of the resistor bodies. This method utilizes a roll-to-roll process, reducing the need for personnel on the production line and thus lowering labor costs.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a resistive element, and more particularly to a method for manufacturing an alloy resistive element using a roll-to-roll method. Background Technology

[0002] Resistors are widely used in various electronic products as passive components. The manufacturing process of resistors generally includes multiple processing steps such as resistor stamping, resistance value adjustment, insulation encapsulation, division, and terminal electrode setting. The overall process is quite complicated. In addition to the need for operators to operate each processing step, additional manpower is required for the process of transferring the semi-finished components between different processes. Therefore, the labor cost of manufacturing resistors is also high. Summary of the Invention

[0003] The purpose of this invention is to provide a method for manufacturing alloy resistor elements to reduce labor costs.

[0004] The method for manufacturing the alloy resistor element of the present invention is performed using a roll-to-roll process, including resistor forming steps, encapsulation steps, adhesive removal steps, cutting steps, and terminal electrode forming steps.

[0005] The resistor forming step involves pulling a strip of metal substrate wound on a roller along its length into a first working area. Within this first working area, multiple first hollow areas are formed on the metal substrate, spaced apart from each other along the length direction. Also within this first working area, multiple second hollow areas are formed between any two adjacent first hollow areas and spaced apart from each other along the width direction of the metal substrate. Multiple resistor bodies, defined by the first and second hollow areas, are then formed on the metal substrate to obtain a first semi-finished product. Each first hollow area extends along the width direction into a strip, with a length less than the width of the metal substrate. Each second hollow area extends along the length direction but is not connected to adjacent first hollow areas.

[0006] The encapsulation step involves rolling the first semi-finished product along its length into the second working area, and then molding insulating material into an encapsulation body covering both sides of the resistor body within the second working area to obtain the second semi-finished product.

[0007] The adhesive removal step involves rolling the second semi-finished product along its length into the third working area, and removing excess residual adhesive from the second semi-finished product by sandblasting within the third working area to obtain the third semi-finished product.

[0008] The cutting step involves rolling the third semi-finished product along its length into the fourth working area, and cutting it from the periphery of the resistor body, exposing two sides of the resistor body to the outside, thus forming multiple independent resistor semi-finished products.

[0009] The terminal electrode forming step involves forming two terminal electrodes on the exposed side of each resistor body using conductive material, thereby producing multiple resistor elements.

[0010] Preferably, the method for manufacturing the alloy resistor element of the present invention further includes a marking step performed between the adhesive removal step and the cutting step, wherein the third semi-finished product is rolled and pulled into the marking working area along the length direction, and at least one marking pattern is formed on at least one side of the package body at the position located on the resistor body by printing or laser method to obtain the marked third semi-finished product, and the cutting step is to cut the marked third semi-finished product.

[0011] Preferably, in the method for manufacturing the alloy resistive element of the present invention, the semi-finished product obtained by at least one of the steps is first independently wound onto a roller before proceeding to the next step, and then pulled to the next step for use.

[0012] Preferably, in the method for manufacturing the alloy resistor element of the present invention, in the resistor forming step, the resistor bodies of the first semi-finished product are arranged at an even number of intervals along the width direction, and each resistor body is connected to an adjacent resistor body along the width direction.

[0013] The beneficial effects of the present invention are that by performing the manufacturing method in a roll-to-roll process, the process of transferring the semi-finished product to different work areas between different steps can be simplified, thereby reducing the number of operators and lowering labor costs. Attached Figure Description

[0014] Figure 1 This is a cross-sectional schematic diagram illustrating the resistive element obtained by the method for manufacturing the alloy resistive element of the present invention.

[0015] Figure 2 This is a flowchart illustrating an embodiment of the method for manufacturing the alloy resistive element of the present invention;

[0016] Figure 3 This is a diagram, for illustrative purposes only. Figure 2 The manufacturing method described herein is performed using a roll-to-roll continuous process;

[0017] Figure 4 It is a flowchart, for assistance. Figure 2The resistive forming step, value correction step, encapsulation step, and adhesive removal step of the manufacturing method are described.

[0018] Figure 5 This is a flowchart, continuing... Figure 4 Explain the marking steps, cutting steps, and terminal electrode formation steps of the fabrication method described above;

[0019] Figure 6 This is a schematic diagram illustrating the first semi-finished product obtained in the resistor forming step. Detailed Implementation

[0020] Before the invention is described in detail, it should be noted that similar elements are represented by the same numbers in the following description. Furthermore, it should be noted that the accompanying drawings are only for illustrating the structural and / or positional relationships between elements and are not related to the actual dimensions of each element.

[0021] See Figure 1 and Figure 2 and Figure 3 The method for manufacturing alloy resistive elements of the present invention is used to obtain such... Figure 1 The resistor element 2 shown includes a resistor body 21, an encapsulating layer 22 covering the resistor body 21 and exposing two opposing sides 211 therein, two terminal electrodes 24 respectively formed on the exposed sides 211 of the resistor body 21 and extending to a portion of the surface of the encapsulating layer 22, and a marking pattern 23 formed on the encapsulating layer 22. It should be noted that... Figure 1 The resistor element 21 shown is for illustrative purposes only. Its structural form (such as the shape of the resistor body 21, the thickness and shape of the terminal electrode 24, the film structure, or the setting position of the marking pattern 23) may vary according to actual needs and is not limited thereto.

[0022] It should be noted that the manufacturing process of the alloy resistive element described in this embodiment is as follows: Figure 3 As shown, in practice, the semi-finished product obtained through at least one of the steps is independently wound onto a roller for later use before entering the next step, and then pulled into the next process for use. By pre-winding it onto the roller for later use, it can be pulled into the work area of ​​the next step at a predetermined time, without being limited by the process time of different steps, making the process schedule and personnel allocation more flexible. However, in other embodiments, a roll-to-roll continuous process can also be performed, thus simplifying the process of transferring the semi-finished product to different work areas (e.g., different process machines) between different steps, thereby reducing the number of workers required on the production line.

[0023] Specifically, the embodiment of the method for manufacturing the alloy resistor element includes a resistor forming step 31, an encapsulation step 32, a glue removal step 33, a marking step 34, a cutting step 35, and a terminal electrode forming step 36.

[0024] See also Figure 4 and Figure 6 The resistor forming step 31 involves pulling a metal substrate 4, wound on a roller and formed into a long strip, along its length direction X to enter a first working area 61. Within the first working area 61, multiple first hollow areas 41 are formed on the metal substrate 4, spaced apart from each other along the length direction X. Multiple second hollow areas 42 are also formed between any two adjacent first hollow areas 41 and spaced apart from each other along the width direction Y of the metal substrate 4. Multiple resistor bodies 21, defined by the first hollow areas 41 and the second hollow areas 42, are then formed on the metal substrate 4 to obtain a resistor body 21. Figure 6 The first semi-finished product 100 shown is provided, and the resistor body 21 is arranged at several intervals along the width direction Y. The metal substrate 4 can be selected from nickel-copper alloy, nickel-chromium alloy, manganese-copper alloy, or iron-chromium-aluminum alloy, but is not limited thereto.

[0025] In this embodiment, the first hollow area 41 and the second hollow area 42 are formed on the metal substrate 4 by punching. Each second hollow area 42 extends along the length direction X and is not connected to the adjacent first hollow area 41. Each first hollow area 41 extends into a strip along the width direction Y, and the length of the first hollow area 41 is less than the width of the metal substrate 4. This gives the first semi-finished product 100 two support strips 43 extending along the length direction and located on both sides of the periphery of the first semi-finished product 100, which support the resistor body 21 and provide space for the machine clamping. Preferably, the resistor body 21 is arranged at an even number of intervals along the width direction Y, which helps the metal substrate 4 maintain balance during the punching process and prevents it from tilting.

[0026] In some embodiments, the resistance value of the first semi-finished product 100 may be adjusted after the resistance forming step 31 as needed. This can be done by removing a portion of the structure on each resistor body 21 using laser, grinding, cutting, or other methods that can be used to change the thickness of the metal substrate 4, so that the resistor body 21 has a specific resistance value.

[0027] The encapsulation step 32 involves continuing to roll and pull the first semi-finished product 100 along the length direction X into the second working area 62, and forming an encapsulation body 5 covering the opposite sides of the resistor body 21 by molding insulating material in the second working area 62 to obtain the second semi-finished product 200.

[0028] In some embodiments, a molding hole (not shown) penetrating through the first semi-finished product 100 can be formed at the center of the first semi-finished product 100. Therefore, during the molding process, the insulating material can flow through the molding hole and the first cutout area 41 and the second cutout area 42 to the other side of the first semi-finished product 100 to uniformly surround and cover the resistor body 21, reducing the gap between the resistor body 21 and the package 5.

[0029] The adhesive removal step 33 involves rolling the second semi-finished product 200 along the length direction X into the third working area 63, and removing excess adhesive residue from the second semi-finished product 200 by sandblasting or laser in the third working area 63 to obtain a third semi-finished product 300. This can improve the problem of adhesive overflow or sticking caused by excess adhesive residue in subsequent processes.

[0030] See Figure 2 , Figure 3 and Figure 5 The marking step 34 involves continuing to roll and pull the third semi-finished product 300 along the length direction X into the marking working area 64, and forming a marking pattern 23 on at least one side of the package 5 at a position corresponding to the resistor body 21 by printing or laser method. In this embodiment, it is taken as an example that multiple marking patterns 23 are formed on one side of the package 5, and each resistor body 21 is aligned to form one marking pattern 23, but it is not limited to this.

[0031] In other embodiments, the shape, distribution position, and quantity of the marking patterns 23 may vary as needed. For example, marking patterns 23 may be formed on opposite sides of the package 5, or multiple marking patterns 23 may be formed on each resistor body 21, without being limited to the foregoing examples. In some embodiments, the marking step 34 may be omitted as needed.

[0032] The cutting step 35 involves continuing to pull the marked third semi-finished product 300 along the length direction X into the fourth working area 65, and cutting it from the periphery of the resistor body 21 to remove the connection between each resistor body 21 and an adjacent resistor body 21 or support bar 43 (see...). Figure 6(As shown in the dashed box), two sides 211 of the resistor body 21 are exposed to the outside, forming multiple independent resistor semi-finished products 400. In this embodiment, the cutting step 35 is along the... Figure 6 The dashed frame shown is used as a cutting line to cut the package 5 so that after removing part of the structure, the encapsulating layer 22 is formed covering the corresponding resistor body 21, and two of the opposite sides 211 of the resistor body 21 are exposed to the outside.

[0033] The terminal electrode forming step 36 involves forming a plurality of terminal electrodes 24 located on the two opposite sides 211 exposed on each resistor body 21 using conductive material, to obtain a plurality of... Figure 1 The resistive element 2 is shown. The terminal electrode 24 can be formed by electroplating, surface deposition, or conductive layer bonding, depending on the manufacturing process requirements, and the terminal electrode 24 can be as follows: Figure 1 The diagram shows a single film layer structure, but it can also be composed of multiple stacked film layers as needed, and is not limited to the example shown in the figures. In this embodiment, two terminal electrodes 24 are formed, respectively located on the two opposite sides 211 exposed on each resistor body 21 and extending to a portion of the surface of the resistor body 21. In some embodiments, four terminal electrodes 24 may also be formed on the two exposed sides 211 of each resistor body 21.

[0034] In summary, the method for manufacturing resistive elements of the present invention allows for the winding of semi-finished products obtained in at least one step onto a roller for later use, and then winding them again for use in the next step at a predetermined time, thereby making the arrangement of process time and personnel more flexible. In addition, the continuous roll-to-roll process can be implemented, which simplifies the process of transferring the semi-finished products to different work areas between different steps, thereby reducing the number of workers and lowering labor costs. Therefore, the purpose of the present invention can indeed be achieved.

Claims

1. A method for manufacturing an alloy resistive element, characterized by a roll-to-roll process: Include: In the resistor forming step, a metal substrate wound on a roller and forming a long strip is pulled out along the length direction of the metal substrate and enters a first working area. In the first working area, multiple first hollow areas are formed on the metal substrate at intervals along the length direction, and multiple second hollow areas are formed between any two adjacent first hollow areas and at intervals along the width direction of the metal substrate. Multiple resistor bodies defined by the first hollow areas and the second hollow areas are formed on the metal substrate to obtain a first semi-finished product. Each first hollow area extends along the width direction into a long strip and its length is less than the width of the metal substrate. Each second hollow area extends along the length direction and is not connected to an adjacent first hollow area. In the encapsulation step, the first semi-finished product is rolled and pulled into the second working area along the length direction, and the insulating material is molded into an encapsulation body covering the opposite sides of the resistor body in the second working area to obtain the second semi-finished product. In the adhesive removal step, the second semi-finished product is rolled and pulled into the third working area along the length direction, and the excess residual adhesive on the second semi-finished product is removed by sandblasting in the third working area to obtain the third semi-finished product. In the cutting step, the third semi-finished product is rolled and pulled into the fourth working area along the length direction, and cut from the periphery of the resistor body, exposing two sides of the resistor body to the outside, thus forming multiple independent resistor semi-finished products; and The terminal electrode forming step involves forming multiple terminal electrodes with conductive material on the exposed side of each resistor body to produce multiple resistive elements.

2. The method for manufacturing the alloy resistive element according to claim 1, characterized in that: It also includes a marking step performed between the adhesive removal step and the cutting step, wherein the third semi-finished product is rolled and pulled along the length direction into a marking work area, and at least one marking pattern is formed on at least one side of the package at the position located on the resistor body by printing or laser method, thereby obtaining the marked third semi-finished product, and the cutting step is to cut the marked third semi-finished product.

3. The method for manufacturing the alloy resistive element according to any one of claims 1 to 2, characterized in that: The semi-finished product obtained through at least one of the steps is independently wound onto a roller before proceeding to the next step and then pulled to the next step for use.

4. The method for manufacturing an alloy resistive element according to claim 1, characterized in that: In the resistor forming step, the resistor bodies of the first semi-finished product are arranged at an even number of intervals along the width direction, and each resistor body is connected to an adjacent resistor body along the width direction.

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