A method and device for analyzing the size of tire composite rubber semi-components

Abstract

The invention discloses a method and device for analyzing the size of a tire composite rubber half-component. The method comprises: obtaining a half-component sample of a tire composite rubber half-component, and obtaining a three-dimensional profile of the half-component sample by a three-dimensional laser scanner; obtaining a two-dimensional profile map of the half-component sample based on the three-dimensional profile, obtaining a support plate of the half-component sample based on the two-dimensional profile map, and embedding the half-component sample in the support plate; scanning the half-component sample to obtain a two-dimensional image of the half-component sample; adjusting the pixels and image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image; determining the cross-sectional area of ​​each material at the location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional profile map, and obtaining the size information of the cross section of the half-component by accurately identifying the boundaries of each rubber material of the half-component, thereby realizing automatic recognition of the interface size information of the tire composite rubber half-component and improving its recognition accuracy.

Description

Technical Field

[0001] The present application relates to the field of tire technology, and more specifically, to a method and device for analyzing the dimensions of a half-component of a tire composite rubber material. Background Art

[0002] The current radial tire structure semi-component materials are mostly composed of one or several rubber compounds. The tire rubber semi-components composed of multiple rubber compounds help to improve the tire's wet performance, handling, comfort and wear resistance. Composite crown rubber components are widely used in tire components. It is very important to strengthen the size control of composite crown semi-components and measure the area of ​​each area of ​​the crown composite semi-components.

[0003] In the prior art, an eyepiece is generally used to measure the area size of the rubber area of ​​a cross-section of a tire composite rubber half-component. The steps are to intercept the composite rubber half-component material, obtain the inner and outer contours of the half-component material according to the half-component shape, or find the composite crown material rubber interface based on the designed mouth plate contour, use an eyepiece to measure the thickness of each rubber, record the data, and draw a rubber material thickness distribution map for calculating the rubber area. However, this method relies on manual labor and the accuracy of the eyepiece, resulting in large errors in measuring the size information of the tire composite rubber half-component.

[0004] Therefore, how to provide a method and device for analyzing the dimensions of a tire compound rubber half-component and improve the measurement accuracy of the dimensions of the tire compound rubber half-component is a technical problem that needs to be solved at present. Summary of the invention

[0005] The present invention provides a tire composite rubber half-component size analysis method and device, which are used to solve the technical problem of low measurement accuracy of tire composite rubber half-component size in the prior art. The method comprises:

[0006] Obtaining a half-component sample of a tire compound rubber half-component, and obtaining a three-dimensional profile of the half-component sample by a three-dimensional laser scanner;

[0007] Acquire a two-dimensional contour map of the half-component sample based on the three-dimensional contour, acquire a support plate of the half-component sample based on the two-dimensional contour map, and embed the half-component sample in the support plate;

[0008] Scanning the half-component sample to obtain a two-dimensional image of the half-component sample;

[0009] Adjusting the pixels and the image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image;

[0010] The cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample are determined based on the boundary and the two-dimensional contour map.

[0011] In some specific embodiments, a half-component sample of a tire composite rubber half-component is obtained, and a three-dimensional profile of the half-component sample is obtained by a three-dimensional laser scanner, specifically:

[0012] Placing the tire composite rubber half-component in a low-temperature environment, and cutting the half-component sample with a cutter, wherein the sample height of the half-component sample is 4±0.2 mm;

[0013] The three-dimensional laser scanner is used to perform a three-dimensional scan on the half-component sample with a resolution of no more than 0.5 mm to obtain the three-dimensional contour.

[0014] In some specific embodiments, obtaining a two-dimensional contour map of the half-component sample based on the three-dimensional contour, and obtaining a support plate of the half-component sample based on the two-dimensional contour map are specifically as follows:

[0015] Positioning the three-dimensional outline in a spatial rectangular coordinate system, and aligning a Z axis of the spatial rectangular coordinate system with a central axis of the three-dimensional outline;

[0016] Make an intersection line with the three-dimensional contour through the YZ plane, and use the intersection line as the two-dimensional contour map;

[0017] The support plate is obtained by processing according to the two-dimensional contour drawing.

[0018] In some specific embodiments, scanning the half-component sample to obtain a two-dimensional image of the half-component sample is specifically as follows:

[0019] Embedding the half-component sample in the support plate so that the half-component sample is placed vertically;

[0020] Scanning the semi-component sample by an industrial camera with a magnification higher than 40 times to obtain the two-dimensional image;

[0021] The two-dimensional image is output in JPG format.

[0022] In some specific embodiments, determining the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map further includes:

[0023] Determine the area where each material is located according to the boundary, and determine the thickness of each material area according to the area where each material is located;

[0024] Determining the height of the half-component sample according to the thickness of each material area;

[0025] Determining left and right boundaries of each material region based on the two-dimensional contour map;

[0026] The cross-sectional area of ​​each material region and the cross-sectional area of ​​the half-component sample are determined according to the left and right boundaries of each material region and the thickness of each material region.

[0027] Accordingly, the present invention also proposes a tire composite rubber half-component size analysis device, the device comprising:

[0028] A first acquisition module is used to acquire a half-component sample of a tire composite rubber half-component and acquire a three-dimensional profile of the half-component sample by a three-dimensional laser scanner;

[0029] A second acquisition module is used to acquire a two-dimensional contour map of the semi-component sample based on the three-dimensional contour, acquire a support plate of the semi-component sample based on the two-dimensional contour map, and embed the semi-component sample in the support plate;

[0030] A third acquisition module is used to scan the half-component sample to acquire a two-dimensional image of the half-component sample;

[0031] An adjustment module, used for adjusting the pixels and the image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image;

[0032] A size determination module is used to determine the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map.

[0033] In some specific embodiments, the first acquisition module is specifically used for:

[0034] Placing the tire composite rubber half-component in a low-temperature environment, and cutting the half-component sample with a cutter, wherein the sample height of the half-component sample is 4±0.2 mm;

[0035] The three-dimensional laser scanner is used to perform a three-dimensional scan on the half-component sample with a resolution of no more than 0.5 mm to obtain the three-dimensional contour.

[0036] In some specific embodiments, the second acquisition module is further used for:

[0037] Positioning the three-dimensional outline in a spatial rectangular coordinate system, and aligning a Z axis of the spatial rectangular coordinate system with a central axis of the three-dimensional outline;

[0038] Make an intersection line with the three-dimensional contour through the YZ plane, and use the intersection line as the two-dimensional contour map;

[0039] The support plate is obtained by processing according to the two-dimensional contour drawing.

[0040] In some specific embodiments, the third acquisition module is specifically used for:

[0041] Embedding the half-component sample in the support plate so that the half-component sample is placed vertically;

[0042] Scanning the semi-component sample by an industrial camera with a magnification higher than 40 times to obtain the two-dimensional image;

[0043] The two-dimensional image is output in JPG format.

[0044] In some specific embodiments, the size determination module is specifically used to:

[0045] Determine the area where each material is located according to the boundary, and determine the thickness of each material area according to the area where each material is located;

[0046] Determining the height of the half-component sample according to the thickness of each material area;

[0047] Determining left and right boundaries of each material region based on the two-dimensional contour map;

[0048] The cross-sectional area of ​​each material region and the cross-sectional area of ​​the half-component sample are determined according to the left and right boundaries of each material region and the thickness of each material region.

[0049] By applying the above technical scheme, a method for analyzing the size of a half-component of a tire composite rubber material is proposed, the method comprising: obtaining a half-component sample of a half-component of a tire composite rubber material, and obtaining a three-dimensional contour of the half-component sample by a three-dimensional laser scanner; obtaining a two-dimensional contour map of the half-component sample based on the three-dimensional contour, obtaining a support plate of the half-component sample based on the two-dimensional contour map, and embedding the half-component sample in the support plate; scanning the half-component sample to obtain a two-dimensional image of the half-component sample; adjusting the pixels and image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image; determining the cross-sectional area of ​​each material at the location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map, and obtaining the size information of the cross section of the half-component by accurately identifying the boundaries of each rubber material of the half-component, thereby realizing automatic recognition of the interface size information of the tire composite rubber material half-component and improving its recognition accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0051] Figure 1 A schematic flow chart of a method for analyzing the dimensions of a tire composite rubber half-component provided in an embodiment of the present invention is shown;

[0052] Figure 2 A schematic structural diagram of a tire composite rubber half-component size analysis device provided in an embodiment of the present invention is shown;

[0053] Figure 3 A schematic diagram of a two-dimensional image proposed in an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0055] like Figure 1 As shown, the present application proposes a method for analyzing the size of a tire composite rubber half-component, the method comprising the following steps:

[0056] Step S101, obtaining a half-component sample of a tire composite rubber half-component, and obtaining a three-dimensional profile of the half-component sample by a three-dimensional laser scanner.

[0057] In this embodiment, a half-component sample of a tire compound rubber half-component is obtained, and size information is analyzed using the half-component sample. After the half-component sample is obtained, a three-dimensional profile of the half-component sample is obtained by a three-dimensional laser scanner.

[0058] In order to obtain the three-dimensional profile of the half-component sample, in some embodiments of the present application, a half-component sample of a tire composite rubber half-component is obtained, and the three-dimensional profile of the half-component sample is obtained by a three-dimensional laser scanner, specifically:

[0059] Placing the tire composite rubber half-component in a low-temperature environment, and cutting the half-component sample with a cutter, wherein the sample height of the half-component sample is 4±0.2 mm;

[0060] The three-dimensional laser scanner is used to perform a three-dimensional scan on the half-component sample with a resolution of no more than 0.5 mm to obtain the three-dimensional contour.

[0061] In the present embodiment, a half-component of the tire composite rubber is cut by a special cutter to obtain a composite rubber half-component sample. The specific method is as follows: first, the rubber is placed in a low-temperature environment, and a special cutter is used to cut the rubber half-component. The obtained sample height is 4±0.2 mm. After obtaining the half-component sample, the half-component sample is three-dimensionally scanned by a three-dimensional laser scanner to obtain its corresponding three-dimensional contour. In order to ensure the scanning accuracy, the resolution of the three-dimensional laser scanner is not greater than 0.5 mm.

[0062] Step S102, obtaining a two-dimensional contour map of the semi-component sample based on the three-dimensional contour, obtaining a support plate of the semi-component sample based on the two-dimensional contour map, and embedding the semi-component sample in the support plate.

[0063] In this embodiment, the three-dimensional contour is further processed to obtain a two-dimensional contour map of the half-component sample, so as to facilitate the determination of the cross-sectional dimension information of the half-component sample. At the same time, another function of the two-dimensional contour map in this scheme is to be used to make a support plate for the half-component sample. The support plate is mainly used to support the half-component sample, so as to facilitate the analysis and image acquisition of the half-component sample.

[0064] In order to obtain a two-dimensional contour map of the half-component sample, in some embodiments of the present application, the two-dimensional contour map of the half-component sample is obtained based on the three-dimensional contour, and the support plate of the half-component sample is obtained based on the two-dimensional contour map.

[0065] In this embodiment, the three-dimensional contour is positioned in the spatial rectangular coordinate system as a reference system, and the Z axis of the spatial rectangular coordinate system is aligned with the central axis of the three-dimensional contour, and the YZ plane is used as the intersection line with the composite rubber component contour model. The intersection line is the two-dimensional contour image of the tire composite rubber component contour, and the support plate is processed according to the two-dimensional contour image for two-dimensional scanning of the support rubber component.

[0066] Step S103: Scan the half-component sample to obtain a two-dimensional image of the half-component sample.

[0067] In this embodiment, an image acquisition device, such as an industrial camera, is used to photograph and scan the half-component sample to obtain a two-dimensional image of the half-component sample.

[0068] In order to obtain a two-dimensional image of a half-component sample, in some embodiments of the present application, the half-component sample is scanned to obtain a two-dimensional image of the half-component sample, specifically:

[0069] Embedding the half-component sample in the support plate so that the half-component sample is placed vertically;

[0070] Scanning the semi-component sample by an industrial camera with a magnification higher than 40 times to obtain the two-dimensional image;

[0071] The two-dimensional image is output in JPG format.

[0072] In this embodiment, an industrial camera is used as an example to collect a micro-image of a half-component sample, the half-component sample is embedded in the support plate produced in the above steps, and the half-component sample is placed vertically. An industrial camera with a magnification higher than 40 is used to scan the half-component sample to obtain the two-dimensional image, and the image is output in JPG format.

[0073] Step S104, adjusting the pixels and the image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image.

[0074] In this embodiment, the pixels and image threshold of the two-dimensional image are adjusted to clearly show the boundaries of each rubber material of the composite rubber half-component. The premise of image adjustment is that the tire rubber material has different internal structure reflection levels due to different formula types. The pixels and threshold can be adjusted according to the type of tire rubber material. The format after adjustment is still JPG format, and the rubber material image has high clarity. The adjusted image is as follows Figure 3 As shown, each material boundary can be cleaned and obtained.

[0075] Step S105 , determining the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map.

[0076] In order to obtain the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample, in some embodiments of the present application, determining the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map further includes:

[0077] Determine the area where each material is located according to the boundary, and determine the thickness of each material area according to the area where each material is located;

[0078] Determining the height of the half-component sample according to the thickness of each material area;

[0079] Determining left and right boundaries of each material region based on the two-dimensional contour map;

[0080] The cross-sectional area of ​​each material region and the cross-sectional area of ​​the half-component sample are determined according to the left and right boundaries of each material region and the thickness of each material region.

[0081] In this embodiment, the JPG image in step S104 is imported into CAD in proportion, and the proportion of the composite rubber component image is 1:1. Then, the spline curve function in CAD is used to depict the rubber boundary according to the rubber area boundary, and then the thickness of each material area is determined. The height of the entire sample is determined by the thickness of each material area. At the same time, the left and right boundaries of the sample can be determined according to the two-dimensional contour map. The cross-sectional area of ​​each material area and the cross-sectional area of ​​the entire sample are determined based on the above information.

[0082] Optionally, in this solution, high-magnification optical scanning can also be used for automatic mapping: using the machine's automated mapping function, after the image is scanned, the composite rubber boundary area is automatically selected, the size of the composite rubber part to be measured is measured, and the measurement template is automatically imported to improve the automation of the size measurement of the half-part.

[0083] By applying the above technical scheme, a method for analyzing the size of a half-component of a tire composite rubber material is proposed, the method comprising: obtaining a half-component sample of a half-component of a tire composite rubber material, and obtaining a three-dimensional contour of the half-component sample by a three-dimensional laser scanner; obtaining a two-dimensional contour map of the half-component sample based on the three-dimensional contour, obtaining a support plate of the half-component sample based on the two-dimensional contour map, and embedding the half-component sample in the support plate; scanning the half-component sample to obtain a two-dimensional image of the half-component sample; adjusting the pixels and image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image; determining the cross-sectional area of ​​each material at the location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map, and obtaining the size information of the cross section of the half-component by accurately identifying the boundaries of each rubber material of the half-component, thereby realizing automatic recognition of the interface size information of the tire composite rubber material half-component and improving its recognition accuracy.

[0084] The present application also provides a tire composite rubber half-component size analysis device, such as Figure 2 As shown, the device includes:

[0085] A first acquisition module 10 is used to acquire a half-component sample of a tire composite rubber half-component and acquire a three-dimensional profile of the half-component sample by a three-dimensional laser scanner;

[0086] A second acquisition module 20 is used to acquire a two-dimensional contour map of the semi-component sample based on the three-dimensional contour, acquire a support plate of the semi-component sample based on the two-dimensional contour map, and embed the semi-component sample in the support plate;

[0087] A third acquisition module 30 is used to scan the half-component sample to acquire a two-dimensional image of the half-component sample;

[0088] An adjustment module 40, configured to adjust the pixels and the image threshold of the two-dimensional image, and obtain the boundaries of each material of the half-component sample according to the adjusted two-dimensional image;

[0089] The size determination module 50 is used to determine the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map.

[0090] In a specific application scenario of the present application, the first acquisition module is specifically used to:

[0091] Placing the tire composite rubber half-component in a low-temperature environment, and cutting the half-component sample with a cutter, wherein the sample height of the half-component sample is 4±0.2 mm;

[0092] The three-dimensional laser scanner is used to perform a three-dimensional scan on the half-component sample with a resolution of no more than 0.5 mm to obtain the three-dimensional contour.

[0093] In a specific application scenario of the present application, the second acquisition module is also used to:

[0094] Positioning the three-dimensional outline in a spatial rectangular coordinate system, and aligning a Z axis of the spatial rectangular coordinate system with a central axis of the three-dimensional outline;

[0095] Make an intersection line with the three-dimensional contour through the YZ plane, and use the intersection line as the two-dimensional contour map;

[0096] The support plate is obtained by processing according to the two-dimensional contour drawing.

[0097] In the specific application scenario of the present application, the third acquisition module is specifically used for:

[0098] Embedding the half-component sample in the support plate so that the half-component sample is placed vertically;

[0099] Scanning the semi-component sample by an industrial camera with a magnification higher than 40 times to obtain the two-dimensional image;

[0100] The two-dimensional image is output in JPG format.

[0101] In the specific application scenario of the present application, the size determination module is specifically used for:

[0102] Determine the area where each material is located according to the boundary, and determine the thickness of each material area according to the area where each material is located;

[0103] Determining the height of the half-component sample according to the thickness of each material area;

[0104] Determining left and right boundaries of each material region based on the two-dimensional contour map;

[0105] The cross-sectional area of ​​each material region and the cross-sectional area of ​​the half-component sample are determined according to the left and right boundaries of each material region and the thickness of each material region.

[0106] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features, and in the description of the present invention, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0107] In the present invention, unless otherwise clearly specified and limited, the terms "enter", "connect", "connection", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0108] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0109] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention without departing from the principles and intent of the present invention.

Claims

1. A method for analyzing the dimensions of a tire compound semi-component, characterized in that: The method comprises: Obtaining a half-component sample of a tire compound rubber half-component, and obtaining a three-dimensional profile of the half-component sample by a three-dimensional laser scanner; Acquire a two-dimensional contour map of the half-component sample based on the three-dimensional contour, acquire a support plate of the half-component sample based on the two-dimensional contour map, and embed the half-component sample in the support plate; Scanning the half-component sample to obtain a two-dimensional image of the half-component sample; Adjusting the pixels and the image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image; Determining the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map; A half-component sample of a tire compound rubber half-component is obtained, and a three-dimensional profile of the half-component sample is obtained by a three-dimensional laser scanner, specifically: Placing the tire composite rubber half-component in a low-temperature environment, and cutting the half-component sample with a cutter, wherein the sample height of the half-component sample is 4±0.2 mm; Performing a three-dimensional scan on the half-component sample using the three-dimensional laser scanner with a resolution of no more than 0.5 mm to obtain the three-dimensional profile; Scanning the half-component sample to obtain a two-dimensional image of the half-component sample is specifically as follows: Embedding the half-component sample in the support plate so that the half-component sample is placed vertically; Scanning the semi-component sample by an industrial camera with a magnification higher than 40 times to obtain the two-dimensional image; The two-dimensional image is output in JPG format.

2. The method according to claim 1, characterized in that: The two-dimensional contour map of the half-component sample is obtained based on the three-dimensional contour, and the support plate of the half-component sample is obtained based on the two-dimensional contour map, specifically: Positioning the three-dimensional outline in a spatial rectangular coordinate system, and aligning a Z axis of the spatial rectangular coordinate system with a central axis of the three-dimensional outline; Make an intersection line with the three-dimensional contour through the YZ plane, and use the intersection line as the two-dimensional contour map; The support plate is obtained by processing according to the two-dimensional contour drawing.

3. The method according to claim 1, characterized in that Determining the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map also includes: Determine the area where each material is located according to the boundary, and determine the thickness of each material area according to the area where each material is located; Determining the height of the half-component sample according to the thickness of each material area; Determining left and right boundaries of each material region based on the two-dimensional contour map; The cross-sectional area of ​​each material region and the cross-sectional area of ​​the half-component sample are determined according to the left and right boundaries of each material region and the thickness of each material region.

4. A tire compound rubber semi-component size analysis device, characterized in that: The device comprises: A first acquisition module is used to acquire a half-component sample of a tire composite rubber half-component and acquire a three-dimensional profile of the half-component sample by a three-dimensional laser scanner; A second acquisition module is used to acquire a two-dimensional contour map of the semi-component sample based on the three-dimensional contour, acquire a support plate of the semi-component sample based on the two-dimensional contour map, and embed the semi-component sample in the support plate; A third acquisition module is used to scan the half-component sample to acquire a two-dimensional image of the half-component sample; An adjustment module, used for adjusting the pixels and the image threshold of the two-dimensional image, and obtaining the boundaries of each material of the half-component sample according to the adjusted two-dimensional image; A size determination module, for determining the cross-sectional area of ​​each material location and the cross-sectional size of the half-component sample based on the boundary and the two-dimensional contour map; The first acquisition module is specifically used for: Placing the tire composite rubber half-component in a low-temperature environment, and cutting the half-component sample with a cutter, wherein the sample height of the half-component sample is 4±0.2 mm; Performing a three-dimensional scan on the half-component sample using the three-dimensional laser scanner with a resolution of no more than 0.5 mm to obtain the three-dimensional profile; The third acquisition module is specifically used for: Embedding the half-component sample in the support plate so that the half-component sample is placed vertically; Scanning the semi-component sample by an industrial camera with a magnification higher than 40 times to obtain the two-dimensional image; The two-dimensional image is output in JPG format.

5. The device according to claim 4, characterized in that The second acquisition module is also used for: Positioning the three-dimensional outline in a spatial rectangular coordinate system, and aligning a Z axis of the spatial rectangular coordinate system with a central axis of the three-dimensional outline; Make an intersection line with the three-dimensional contour through the YZ plane, and use the intersection line as the two-dimensional contour map; The support plate is obtained by processing according to the two-dimensional contour drawing.

6. The device according to claim 4, characterized in that The size determination module is specifically used for: Determine the area where each material is located according to the boundary, and determine the thickness of each material area according to the area where each material is located; Determining the height of the half-component sample according to the thickness of each material area; Determining left and right boundaries of each material region based on the two-dimensional contour map; The cross-sectional area of ​​each material region and the cross-sectional area of ​​the half-component sample are determined according to the left and right boundaries of each material region and the thickness of each material region.

Images