Display panel and method for manufacturing the same

Abstract

The present application provides a display panel and a preparation method thereof, wherein the display panel includes a driving substrate, a pixel definition layer, a sub-pixel, a cathode protection layer, a suspension structure and an auxiliary electrode. The sub-pixel includes an anode, an organic light-emitting layer and a cathode. The cathode protection layer is arranged on the surface of the cathode facing away from the organic light-emitting layer; the cathode protection layer covers part of the surface of the cathode; the suspension structure includes a conductive structure and an insulating structure arranged in layers; the edge of the insulating structure protrudes from the edge of the conductive structure to form an eaves structure, and the eaves structure and the side of the conductive structure and the pixel definition layer are surrounded to form a recessed area; the auxiliary electrode is arranged in the recessed area, and the auxiliary electrode is respectively arranged in contact with the conductive structure and the cathode; the cathode and the conductive structure are electrically connected through the auxiliary electrode; the auxiliary electrode covers part of the surface of the cathode that is not covered by the cathode protection layer. The display panel can effectively improve the voltage drop problem and enhance the display effect.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] In the preparation process of OLED (Organic Light-Emitting Diode, OLED) organic light-emitting devices, maskless deposition and photolithography (photo lithography) patterned pixel methods can greatly increase the effective light-emitting area (aperture ratio) of active matrix OLED, which is conducive to greatly increasing pixel density. In order to achieve high resolution and colorization of passive matrix OLED, a cathode isolation column structure is introduced, that is, no metal template is used in the preparation of the device, but before evaporating the organic film and the metal cathode, an insulating partition is made on the substrate, and finally the different pixels of the device are separated to realize the pixel array arrangement. This cathode isolation column structure is also called an overhang structure.

[0003] However, in practical applications, the contact area between the pixel cathode and the conductive structure of the overhang structure is usually small, which easily causes voltage drop problems. In addition, the overhang structure can also have an adverse effect on packaging reliability. Summary of the invention

[0004] The display panel and the preparation method thereof provided in the present application are intended to solve the voltage drop problem caused by the overhanging structure in the display panel.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a display panel, comprising:

[0006] Driver substrate;

[0007] A pixel definition layer is disposed on a side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area;

[0008] A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are stacked in sequence from close to the driving substrate to away from the driving substrate;

[0009] A cathode protection layer is disposed on a surface of the cathode facing away from the organic light-emitting layer; the cathode protection layer covers a portion of the surface of the cathode;

[0010] The overhang structure is arranged on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area; the overhang structure includes a conductive structure and an insulating structure which are sequentially stacked from close to the pixel definition layer to away from the pixel definition layer; the edge of the insulating structure protrudes from the edge of the conductive structure to form an eaves structure, and the eaves structure, the side surface of the conductive structure and the pixel definition layer are surrounded to form a recessed area;

[0011] An auxiliary electrode is arranged in the recessed area, and the auxiliary electrode is respectively arranged in contact with the conductive structure and the cathode; the cathode and the conductive structure are electrically connected through the auxiliary electrode; the auxiliary electrode covers a portion of the cathode surface that is not covered by the cathode protection layer.

[0012] In a specific embodiment, the anode is disposed on a surface of the driving substrate facing the pixel definition layer; and the pixel definition layer covers a portion of the anode;

[0013] The organic light-emitting layer is disposed on a surface of the anode that is away from the driving substrate; and the organic light-emitting layer covers a portion of the pixel definition layer;

[0014] The cathode is arranged on a surface of the organic light-emitting layer facing away from the anode; the cathode completely covers the organic light-emitting layer and at least partially covers the pixel definition layer; and the circumferential edge of the cathode is exposed through the circumferential edge of the cathode protection layer.

[0015] In a specific embodiment, the cathode extends into the recessed area and covers a portion of the bottom surface of the recessed area; the auxiliary electrode only covers the portion of the cathode located in the recessed area and the bottom surface of the recessed area not covered by the cathode.

[0016] In a specific embodiment, the cathode extends into the recessed area and completely covers the bottom surface of the recessed area; the auxiliary electrode only covers the portion of the cathode located in the recessed area.

[0017] In a specific embodiment, the material of the cathode protection layer is a metal-phobic organic molecular material;

[0018] The material of the auxiliary electrode is one or more of metal silver, metal magnesium and metal ytterbium; and the material of the auxiliary electrode is the same as that of the cathode.

[0019] In a specific embodiment, the auxiliary electrode fills the recessed area.

[0020] In a specific embodiment, it also includes:

[0021] An etching protection layer, disposed on a side of the cathode protection layer away from the cathode, and covering the cathode protection layer, the auxiliary electrode and at least a portion of the overhanging structure;

[0022] A first encapsulation layer, covering a side of the etching protection layer away from the driving substrate;

[0023] The second packaging layer is coated on a side of the first packaging layer away from the driving substrate.

[0024] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a method for preparing a display panel, comprising:

[0025] A preform is provided; the preform comprises a driving substrate, a pixel definition layer, an anode and an overhang structure; wherein the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area; and the overhang structure has a concave area on one side close to the pixel accommodating area;

[0026] Sequentially depositing an organic light-emitting material and a metal material by evaporation on a side of the anode away from the drive substrate to form an organic light-emitting layer and a cathode;

[0027] Depositing a metal-phobic organic molecular material on a portion of the surface of the cathode away from the organic light-emitting layer by evaporation to form a cathode protection layer;

[0028] A metal material is deposited on the surface of the cathode that is not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode; and the auxiliary electrode is respectively in contact with the conductive structure and the cathode.

[0029] In a specific embodiment, the step of sequentially evaporating and depositing an organic light-emitting material and a metal material on a side of the anode away from the drive substrate to form an organic light-emitting layer and a cathode comprises:

[0030] Adjusting the evaporation angle so that the cathode completely covers the edge of the organic light-emitting layer;

[0031] The step of evaporating and depositing a metal-phobic organic molecular material on a portion of the surface of the cathode away from the organic light-emitting layer to form a cathode protection layer comprises:

[0032] The evaporation angle is adjusted so that the metal-phobic organic molecular material is deposited only on the surface of the cathode located in the pixel accommodating area.

[0033] In a specific embodiment, the step of depositing a metal material on the surface of the cathode that is not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode comprises:

[0034] A metal material is deposited in the recessed area by vertical evaporation or sputtering to fill the recessed area to form the auxiliary electrode.

[0035] After the step of depositing a metal material on the surface of the cathode that is not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode, the method further includes:

[0036] Depositing an inorganic material on a surface of the cathode protection layer facing away from the organic light-emitting layer and on a surface of the auxiliary electrode to form an etching protection layer; and overlapping the etching protection layer with the overhanging structure;

[0037] An organic material and an inorganic material are sequentially deposited on a side of the etching protection layer away from the cathode to form a first encapsulation layer and a second encapsulation layer.

[0038] Beneficial effects of the embodiments of the present application: Different from the prior art, the present application provides a display panel and a method for preparing the same, the display panel comprising a driving substrate, a pixel definition layer, a sub-pixel, a cathode protection layer, a suspension structure and an auxiliary electrode. The pixel definition layer is arranged on one side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodation area; the sub-pixel is arranged in the pixel accommodation area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are stacked in sequence from close to the driving substrate to away from the driving substrate. The cathode protection layer is arranged on the side surface of the cathode away from the organic light-emitting layer; the cathode protection layer covers part of the surface of the cathode; the suspension structure is arranged on the side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodation area; the suspension structure comprises a conductive structure and an insulating structure which are stacked in sequence from close to the pixel definition layer to away from the pixel definition layer; the edge of the insulating structure protrudes from the edge of the conductive structure to form an eaves structure, and the eaves structure and the side of the conductive structure and the pixel definition layer are surrounded to form a recessed area; the auxiliary electrode is arranged in the recessed area, and the auxiliary electrode is respectively arranged in contact with the conductive structure and the cathode; the cathode and the conductive structure are electrically connected through the auxiliary electrode; the auxiliary electrode covers part of the surface of the cathode not covered by the cathode protection layer. By arranging an auxiliary electrode in the recessed area of ​​the overhanging structure, the cathode and the conductive structure can be electrically connected through the auxiliary electrode, which is equivalent to increasing the contact area between the cathode and the conductive structure, effectively improving the voltage drop problem, and effectively improving the display effect of the display panel; in addition, by arranging a cathode protection layer on part of the surface of the cathode, the auxiliary electrode can be prevented from contacting the part of the cathode located in the pixel accommodating area, which affects the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1a A schematic diagram of the structure of a display panel provided in the first embodiment of the present application;

[0040] Figure 1b for Figure 1aThe structure schematic diagram of the display panel without the auxiliary electrode is shown;

[0041] Figure 2 A schematic diagram of the structure of a display panel without auxiliary electrodes provided in the second embodiment of the present application;

[0042] Figure 3 A flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0043] Figure 4 A schematic diagram of the structure of a prefabricated component provided in one embodiment of the present application;

[0044] Figure 5 For Figure 4 A schematic diagram of a structure in which an organic light-emitting layer and a cathode are arranged on the structure shown;

[0045] Figure 6 For Figure 5 A schematic diagram of a structure in which a cathode protection layer is provided on the structure shown;

[0046] Figure 7 For Figure 6 A schematic diagram of a structure in which an auxiliary electrode is arranged on the structure shown;

[0047] Figure 8 for Figure 7 Schematic diagram of the structure after encapsulation.

[0048] Description of Figure Numbers:

[0049] 1-driving substrate; 2-pixel definition layer; 3-sub-pixel; 4-cathode protection layer; 5-overhang structure; 6-auxiliary electrode; 7-etching protection layer; 8-first encapsulation layer; 9-second encapsulation layer; 10-preform; 31-anode; 32-organic light-emitting layer; 33-cathode; 51-conductive structure; 52-insulating structure; 53-recessed area; 521-eaves structure. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0051] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0052] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0053] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0054] See also Figure 1a , Figure 1a A schematic diagram of the structure of a display panel provided in the first embodiment of the present application; Figure 1b for Figure 1a The embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel; the display panel may include a driving substrate 1, a pixel definition layer 2, a sub-pixel 3, a cathode protection layer 4, an overhang structure 5 and an auxiliary electrode 6.

[0055] The driving substrate 1 may include a driving circuit layer for driving the sub-pixels 3 to emit light; the pixel definition layer 2 is disposed on one side surface of the driving substrate 1. The pixel definition layer 2 protrudes from the driving substrate 1 and defines a plurality of pixel accommodation areas for accommodating the sub-pixels 3.

[0056] The sub-pixel 3 is arranged in the pixel accommodating area, and the sub-pixel 3 includes an anode 31, an organic light-emitting layer 32 and a cathode 33 which are stacked in sequence from close to the driving substrate 1 to away from the driving substrate 1; wherein the anode 31 is connected to the anode 31 power line, and the cathode 33 is connected to the cathode 33 power line, so that the organic light-emitting layer 32 is conductive and emits light.

[0057] The cathode protection layer 4 is disposed on the surface of the cathode 33 facing away from the organic light-emitting layer 32 ; and the cathode protection layer 4 only covers a portion of the surface of the cathode 33 , so that the cathode 33 can be electrically connected to the common cathode 33 through the portion not covered by the cathode protection layer 4 .

[0058] The overhang structure 5 is disposed on a surface of the pixel definition layer 2 facing away from the driving substrate 1, and the overhang structure 5 protrudes and is disposed around the pixel accommodating area, and is used to separate sub-pixels 3 of different colors to avoid pixel crosstalk. Specifically, the overhang structure 5 includes a conductive structure 51 and an insulating structure 52 that are stacked in sequence from close to the pixel definition layer 2 to away from the pixel definition layer 2.

[0059] The conductive structure 51 is disposed on the side of the overhang structure 5 close to the pixel definition layer 2 and on the surface of the pixel definition layer 2 facing the overhang structure 5; the conductive structure 51 can be used as a common cathode 33 to be connected to the cathodes 33 of different sub-pixels 3. The insulating structure 52 is disposed on the surface of the conductive structure 51 away from the pixel definition layer 2 to separate the sub-pixels 3 of different colors. Figure 1b Furthermore, the edges of both sides of the insulating structure 52 protrude from the conductive structure 51 to form an eaves structure 521, so that when the organic light-emitting layer 32 and the cathode 33 are deposited by evaporation, the evaporation angle can be changed by the eaves structure 521 so that the cathode 33 covers the organic light-emitting layer 32; and when the cathode protection layer 4 is evaporated, the evaporation angle can also be changed so that the cathode protection layer 4 only covers part of the surface of the cathode 33. The eaves structure 521 and the side surface of the conductive structure 51 and the side surface of the pixel definition layer 2 facing away from the driving substrate 1 are surrounded to form a recessed area 53.

[0060] The auxiliary electrode 6 is disposed in the recessed area 53 and is respectively disposed in contact with the conductive structure 51 and the cathode 33, so that the cathode 33 and the conductive structure 51 are electrically connected through the auxiliary electrode 6. Specifically, the auxiliary electrode 6 covers the surface of the cathode 33 that is not covered by the cathode protection layer 4.

[0061] In this way, by setting an auxiliary electrode 6 in the recessed area 53 of the overhang structure 5, the cathode 33 and the conductive structure 51 can be electrically connected through the auxiliary electrode 6, which is equivalent to increasing the contact area between the cathode 33 and the conductive structure 51, effectively improving the voltage drop problem, and effectively improving the display effect of the display panel; in addition, by setting a cathode protection layer 4 on a part of the surface of the cathode 33, it is possible to avoid the auxiliary electrode 6 from contacting the part of the cathode 33 located in the pixel accommodating area, which affects the display effect.

[0062] Continue reading Figure 1a In a specific embodiment, the anode 31 is disposed on a surface of the driving substrate 1 facing the pixel definition layer 2, is located in the pixel accommodation area, and is etched into a preset pattern. The pixel definition layer 2 is disposed between the anodes 31 of adjacent sub-pixels 3 to space the anodes 31 between the sub-pixels 3 to prevent the anodes 31 of adjacent sub-pixels 3 from being mutually conductive and affecting the display effect of the display panel. Specifically, the height of the pixel definition layer 2 along the stacking direction Z may also be greater than the height of the anode 31 along the stacking direction Z to further ensure that the anodes 31 of the sub-pixels 3 cannot be conductive; preferably, both sides of the pixel definition layer 2 may also cover part of the anode 31.

[0063] The organic light-emitting layer 32 is disposed on the surface of the anode 31 on the side away from the driving substrate 1. In a specific embodiment, the organic light-emitting layer 32 can be deposited on the display panel by evaporation; the organic light-emitting layer 32 covers the anode 31 and covers part of the first pixel definition layer 2 to completely cover the anode 31, so as to prevent the cathode 33 subsequently evaporated from contacting and conducting with the anode 31, thereby affecting the display effect. Of course, the organic light-emitting layer 32 can also cover part of the pixel definition layer 2 to completely cover the anode 31.

[0064] The cathode 33 is disposed on the surface of the organic light-emitting layer 32 facing away from the anode 31. The cathode 33 completely covers the organic light-emitting layer 32 and at least partially covers the pixel definition layer 2, so as to separate the organic light-emitting layer 32 from the auxiliary electrode 6. Specifically, the circumferential edge of the cathode 33 is exposed through the circumferential edge of the cathode protection layer 4; that is, the cathode protection layer 4 is not disposed on the circumferential edge surface of the cathode 33, so that the auxiliary electrode 6 can be electrically connected by contacting the circumferential edge of the cathode 33.

[0065] like Figure 1bAs shown, in a specific embodiment, the cathode 33 may extend from the surface of the organic light-emitting layer 32 to the recessed area 53, and cover a portion of the bottom surface of the recessed area 53 close to the organic light-emitting layer 32, so as to increase the contact area between the cathode 33 and the auxiliary electrode 6, thereby improving the voltage drop problem. Specifically, the auxiliary electrode 6 only covers the portion of the surface of the cathode 33 located in the recessed area 53, and the bottom surface of the recessed area 53 not covered by the cathode 33; the cathode 33 only contacts the auxiliary electrode 6 to achieve electrical connection between the cathode 33 and the conductive structure 51. At the same time, the auxiliary electrode 6 will not cover the surface of the cathode protection layer 4 on the side away from the cathode 33, so as to avoid affecting the display effect of the sub-pixel 3.

[0066] See also Figure 2 , Figure 2 A schematic diagram of the structure of the display panel provided in the second embodiment of the present application without the auxiliary electrode; the display panel provided in the second embodiment of the present application has a specific structure similar to that of the display panel provided in the first embodiment of the present application, except that, in the display panel provided in the second embodiment, the cathode 33 can extend into the recessed area 53 and completely cover the bottom surface of the recessed area 53, so as to further increase the contact area between the cathode 33 and the auxiliary electrode 6, and further improve the voltage drop problem. Specifically, the auxiliary electrode 6 only covers the portion of the cathode 33 located in the recessed area 53, and the portion of the cathode 33 located in the recessed area 53 is in contact with the conductive structure 51 on the side away from the organic light-emitting layer 32. In this way, the cathode 33 can be electrically connected to the conductive structure 51 either through the auxiliary electrode 6 or by directly contacting the conductive structure 51; the stability of the connection of the cathode 33 is effectively enhanced.

[0067] Furthermore, if Figure 1a As shown, the auxiliary electrode 6 can fill the internal space of the recessed area 53 to avoid the situation where the gap in the recessed area 53 affects the packaging reliability. In a specific embodiment, the auxiliary electrode 6 fills the space in the recessed area 53 that is not filled by the cathode 33. Preferably, the side of the auxiliary electrode 6 away from the conductive structure 51 is flush with the side of the insulating structure 52, so that the auxiliary electrode 6 fills the internal space of the recessed area 53 while not entering the pixel accommodating area, thereby avoiding affecting the display effect of the sub-pixel 3.

[0068] In a specific embodiment, the material of the cathode protection layer 4 may be a metal-phobic organic molecular material. It is understood that the metal-phobic organic molecular material is an organic material whose surface does not adhere to metal; when the metal material is evaporated to form the auxiliary electrode 6, the metal material can be effectively prevented from being deposited on the surface of the cathode protection layer 4 to form a metal layer. Preferably, the cathode protection layer 4 may be a metal-phobic organic molecular material that does not adhere to metal silver, metal magnesium and metal ytterbium.

[0069] The material of the auxiliary electrode 6 is one or more of metal silver, metal magnesium and metal ytterbium, so as to avoid the metal material being deposited on the surface of the cathode protection layer 4 to form a metal layer. Specifically, the material of the auxiliary electrode 6 can be the same as that of the cathode 33, so as to avoid the situation where materials with different resistances affect the voltage drop.

[0070] like Figure 1a As shown, in a specific embodiment, the display panel may further include an etching protection layer 7, a first encapsulation layer 8, and a second encapsulation layer 9. The etching protection layer 7 is used to perform anti-etching protection on each film layer in the sub-pixel 3 in the process of preparing sub-pixels 3 of other colors of the display panel, so as to prevent the prepared sub-pixel 3 from being damaged in the subsequent preparation process. Specifically, the etching protection layer 7 is arranged on the side of the cathode protection layer 4 away from the cathode 33, and covers the cathode protection layer 4, the auxiliary electrode 6 and a part of the insulating structure 52; so as to perform anti-etching protection on the cathode protection layer 4 and the auxiliary electrode 6. The etching protection layer 7 may include a non-conductive inorganic material; specifically, the etching protection layer 7 may include a silicon-containing inorganic material, such as a SiNx inorganic material.

[0071] After all sub-pixels 3 are prepared, a first encapsulation layer 8 and a second encapsulation layer 9 may be provided on the display panel to encapsulate the display panel as a whole. Specifically, the first encapsulation layer 8 is coated on the side of the etching protection layer 7 away from the driving substrate 1; the second encapsulation layer 9 is coated on the side of the first encapsulation layer 8 away from the driving substrate 1. The first encapsulation layer 8 may be an organic encapsulation layer, and the second encapsulation layer 9 may be an inorganic encapsulation layer.

[0072] The present application provides a display panel, which includes a driving substrate 1, a pixel definition layer 2, a sub-pixel 3, a cathode protection layer 4, a suspension structure 5 and an auxiliary electrode 6. The pixel definition layer 2 is arranged on a side surface of the driving substrate 1; the pixel definition layer 2 protrudes from the driving substrate 1 to form a pixel accommodating area; the sub-pixel 3 is arranged in the pixel accommodating area; the sub-pixel 3 includes an anode 31, an organic light-emitting layer 32 and a cathode 33 which are stacked in sequence from close to the driving substrate 1 to away from the driving substrate 1. The cathode protection layer 4 is arranged on the surface of the cathode 33 on the side away from the organic light-emitting layer 32; the cathode protection layer 4 covers a part of the surface of the cathode 33; the overhang structure 5 is arranged on the side of the pixel definition layer 2 away from the driving substrate 1 and surrounds the pixel accommodating area; the overhang structure 5 includes a conductive structure 51 and an insulating structure 52 which are stacked in sequence from close to the pixel definition layer 2 to away from the pixel definition layer 2; the edge of the insulating structure 52 protrudes from the edge of the conductive structure 51 to form an eaves structure 521, and the eaves structure 521 and the side of the conductive structure 51 and the pixel definition layer 2 are surrounded to form a recessed area 53; the auxiliary electrode 6 is arranged in the recessed area 53, and the auxiliary electrode 6 is respectively arranged in contact with the conductive structure 51 and the cathode 33; the cathode 33 and the conductive structure 51 are electrically connected through the auxiliary electrode 6; the auxiliary electrode 6 covers a part of the surface of the cathode 33 not covered by the cathode protection layer 4. By setting an auxiliary electrode 6 in the recessed area 53 of the overhang structure 5, the cathode 33 and the conductive structure 51 can be electrically connected through the auxiliary electrode 6, which is equivalent to increasing the contact area between the cathode 33 and the conductive structure 51, effectively improving the voltage drop problem, and effectively improving the display effect of the display panel; in addition, by setting a cathode protection layer 4 on a part of the surface of the cathode 33, it is possible to avoid the auxiliary electrode 6 from contacting the part of the cathode 33 located in the pixel accommodating area, which affects the display effect.

[0073] See also Figure 3 , Figure 3 A flow chart of a method for preparing a display panel provided in one embodiment of the present application; Figure 4 A schematic diagram of the structure of a prefabricated component provided in one embodiment of the present application; Figure 5 For Figure 4 A schematic diagram of a structure in which an organic light-emitting layer and a cathode are arranged on the structure shown; Figure 6 For Figure 5 A schematic diagram of a structure in which a cathode protection layer is provided on the structure shown; Figure 7 For Figure 6 The present application also provides a method for preparing a display panel, which is used to prepare the display panel involved in any of the above embodiments, and the steps of the method specifically include:

[0074] Step S1: providing a preform; the preform comprises a driving substrate, a pixel definition layer, an anode and an overhang structure; wherein the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area; and the overhang structure has a recessed area on one side close to the pixel accommodating area.

[0075] Specifically, Figure 4 As shown, a metal material is deposited on the driving substrate 1 and etched into a preset pattern to form an anode 31, and then a pixel definition layer is arranged on the surface of the driving substrate 1 not covered by the anode 31. Then, a suspension structure 5 is arranged on the surface of the pixel definition layer 2 on the side away from the driving substrate 1, and the suspension structure 5 is protruded and arranged around the pixel accommodating area; the suspension structure 5 includes a conductive structure 51 and an insulating structure 52 which are sequentially stacked in a direction from close to the pixel definition layer 2 to away from the pixel definition layer 2. Among them, the conductive structure 51 is arranged on the side of the suspension structure 5 close to the pixel definition layer 2, and is located on the surface of the pixel definition layer 2 facing the suspension structure 5; the insulating structure 52 is arranged on the side of the conductive structure 51 away from the pixel definition layer 2. The edges of the two sides of the insulating structure 52 protrude from the conductive structure 51 to form an eaves structure 521, and the eaves structure 521 and the side of the conductive structure 51 and the side of the pixel definition layer 2 away from the driving substrate 1 are surrounded to form a recessed area 53.

[0076] Step S2: sequentially evaporating and depositing an organic light-emitting material and a metal material on a side of the anode away from the driving substrate to form an organic light-emitting layer and a cathode;

[0077] like Figure 5 As shown, in a specific embodiment, the organic light-emitting layer 32 can be deposited on the display panel by evaporation and completely covers the anode 31; the cathode 33 can also be deposited on the surface of the organic light-emitting layer 32 by evaporation; the anode 31, the organic light-emitting layer 32 and the cathode 33 together constitute a sub-pixel 3.

[0078] In the specific implementation process, step S2 may also include:

[0079] Step S21: adjusting the evaporation angle so that the cathode completely covers the edge of the organic light-emitting layer.

[0080] Specifically, during the evaporation process, the evaporation angle can be changed so that the cathode 33 completely covers the organic light-emitting layer 32 and at least partially covers the pixel definition layer 2, so as to separate the organic light-emitting layer 32 from the auxiliary electrode 6. Preferably, the cathode 33 is extended into the recessed area 53 by changing the evaporation angle.

[0081] Step S3: depositing a metal-phobic organic molecular material on a portion of the surface of the cathode away from the organic light-emitting layer by evaporation to form a cathode protection layer.

[0082] For details, see Figure 6A cathode protection layer 4 is formed at least on the surface of the cathode 33 located in the pixel accommodating area, so that when the auxiliary electrode 6 is subsequently formed, the metal material will not be deposited in the pixel accommodating area.

[0083] In the specific implementation process, step S3 specifically includes:

[0084] Step S31: adjusting the evaporation angle so that the metallophobic organic molecular material is deposited only on the surface of the cathode located in the pixel accommodating area.

[0085] Specifically, by adjusting the evaporation angle, the metal-phobic organic molecular material molecules are deposited only on the partial surface of the cathode 33 located in the pixel accommodating area to form the cathode protection layer 4, so that the circumferential edge of the cathode 33 is exposed. Specifically, the side of the cathode protection layer 4 close to the overhang structure 5 is tangent to the side of the insulating structure 52, and the partial surface of the cathode 33 located in the recessed area 53 is not covered with the cathode protection layer 4, so that the cathode 33 is electrically connected to the conductive structure 51 through the partial cathode 33.

[0086] Step S4: depositing metal material on the surface of the cathode not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode; and making the auxiliary electrode contact the conductive structure and the cathode respectively.

[0087] For details, see Figure 7 , metal material is deposited on the circumferential edge of the cathode 33 to form an auxiliary electrode 6 that connects the conductive structure 51 and the cathode 33; it can be understood that due to the presence of the cathode protection layer 4 having the property of non-stick metal material, the metal material will only be deposited in the recessed area 53 not covered by the cathode protection layer 4.

[0088] In the specific implementation process, step S4 specifically includes:

[0089] Step S41: depositing a metal material in the recessed area by vertical evaporation or sputtering to fill the recessed area to form an auxiliary electrode.

[0090] Specifically, the metal material is deposited at a high rate to fill the space in the recessed area 53 , thereby preventing the gap in the recessed area 53 from affecting the packaging reliability.

[0091] In a specific implementation process, after step S4, the following may be included: depositing an inorganic material on a surface of the cathode protection layer facing away from the organic light-emitting layer and on a surface of the auxiliary electrode to form an etching protection layer; and overlapping the etching protection layer with the overhanging structure.

[0092] Specifically, Figure 8 As shown, Figure 8 for Figure 7The structure shown is a schematic diagram of the structure after packaging; the etching protection layer 7 covers the cathode protection layer 4, the side of the auxiliary electrode 6 away from the conductive structure 51 and part of the surface of the insulating structure 52, and overlaps the surface of the insulating structure 52 to protect the internal film structure.

[0093] In a specific implementation process, after the step of forming the etching protection layer 7, the following step may also be included: depositing an organic material and an inorganic material in sequence on a side of the etching protection layer away from the cathode to form a first encapsulation layer and a second encapsulation layer.

[0094] Specifically, an organic material is deposited on the surface of the etching protection layer 7 facing away from the driving substrate 1 and the surface not covered by the insulating structure 52 to form a first encapsulation layer 8, and the surface of the first encapsulation layer 8 facing away from the driving substrate 1 is flattened; then an inorganic material is deposited on the surface of the first encapsulation layer 8 facing away from the driving substrate 1 to form a second encapsulation layer, so as to form a Figure 7 The display panel shown.

[0095] The present application provides a method for preparing a display panel, by providing a preform; the preform includes a driving substrate 1, a pixel definition layer 2, an anode 31 and a suspension structure 5; wherein the pixel definition layer 2 protrudes from the driving substrate 1 to form a pixel accommodation area; the anode 31 is arranged in the pixel accommodation area; the suspension structure 5 has a recessed area 53 on the side close to the pixel accommodation area; then, an organic light-emitting material and a metal material are sequentially deposited on the side of the anode 31 away from the driving substrate 1 to form an organic light-emitting layer 32 and a cathode 33; then, a metal-phobic organic molecular material is deposited on a part of the surface of the cathode 33 away from the organic light-emitting layer 32 to form a cathode protection layer 4; then, a metal material is deposited on a part of the surface of the cathode 33 not covered by the cathode protection layer 4 and in the recessed area 53 to form an auxiliary electrode 6; and the auxiliary electrode 6 is contacted with the conductive structure 51 and the cathode 33 respectively. In this way, by forming the cathode protection layer 4, the sub-pixels 3 in the pixel accommodation area will not be affected in the subsequent formation of the auxiliary electrode 6, thereby ensuring its display effect.

[0096] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: include: Driver substrate; A pixel definition layer is disposed on a surface of one side of the driving substrate; The pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are sequentially stacked in a direction from close to the driving substrate to away from the driving substrate; A cathode protection layer is arranged on a surface of the cathode facing away from the organic light-emitting layer; the cathode protection layer covers a portion of the surface of the cathode; the material of the cathode protection layer is a metal-phobic organic molecular material; The overhang structure is arranged on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area; the overhang structure includes a conductive structure and an insulating structure which are sequentially stacked from close to the pixel definition layer to away from the pixel definition layer; the edge of the insulating structure protrudes from the edge of the conductive structure to form an eaves structure, and the eaves structure, the side surface of the conductive structure and the pixel definition layer are surrounded to form a recessed area; An auxiliary electrode is arranged in the recessed area, and the auxiliary electrode is respectively arranged in contact with the conductive structure and the cathode; the cathode and the conductive structure are electrically connected through the auxiliary electrode; the auxiliary electrode covers a portion of the cathode surface that is not covered by the cathode protection layer.

2. The display panel according to claim 1, characterized in that: The anode is disposed on a surface of the driving substrate facing the pixel definition layer; and the pixel definition layer covers a portion of the anode; The organic light-emitting layer is disposed on a surface of the anode that is away from the driving substrate; and the organic light-emitting layer covers a portion of the pixel definition layer; The cathode is arranged on a surface of the organic light-emitting layer facing away from the anode; the cathode completely covers the organic light-emitting layer and at least partially covers the pixel definition layer; and the circumferential edge of the cathode is exposed through the circumferential edge of the cathode protection layer.

3. The display panel according to claim 2, characterized in that: The cathode extends into the recessed area and covers a portion of the bottom surface of the recessed area; the auxiliary electrode only covers the portion of the cathode located in the recessed area and the bottom surface of the recessed area not covered by the cathode.

4. The display panel according to claim 2, characterized in that: The cathode extends into the recessed area and completely covers the bottom surface of the recessed area; the auxiliary electrode only covers the portion of the cathode located in the recessed area.

5. The display panel according to any one of claims 1 to 4, characterized in that: The material of the auxiliary electrode is one or more of metal silver, metal magnesium and metal ytterbium; and the material of the auxiliary electrode is the same as that of the cathode.

6. The display panel according to claim 5, characterized in that: The auxiliary electrode fills the recessed area.

7. The display panel according to claim 6, characterized in that: Also includes: An etching protection layer, disposed on a side of the cathode protection layer away from the cathode, and covering the cathode protection layer, the auxiliary electrode and at least a portion of the overhanging structure; A first encapsulation layer, covering a side of the etching protection layer away from the driving substrate; The second packaging layer is coated on a side of the first packaging layer away from the driving substrate.

8. A method for preparing a display panel, characterized in that: include: Provide prefabricated parts; The preform comprises a driving substrate, a pixel definition layer, an anode and an overhanging structure; wherein the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area; and the overhanging structure has a concave area on one side close to the pixel accommodating area; Sequentially depositing an organic light-emitting material and a metal material by evaporation on a side of the anode away from the drive substrate to form an organic light-emitting layer and a cathode; Depositing a metal-phobic organic molecular material on a portion of the surface of the cathode away from the organic light-emitting layer by evaporation to form a cathode protection layer; A metal material is deposited on the surface of the cathode that is not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode; and the auxiliary electrode is respectively in contact with the conductive structure and the cathode.

9. The preparation method according to claim 8, characterized in that: The step of sequentially evaporating and depositing an organic light-emitting material and a metal material on a side of the anode away from the drive substrate to form an organic light-emitting layer and a cathode comprises: Adjusting the evaporation angle so that the cathode completely covers the edge of the organic light-emitting layer; The step of evaporating and depositing a metal-phobic organic molecular material on a portion of the surface of the cathode away from the organic light-emitting layer to form a cathode protection layer comprises: The evaporation angle is adjusted so that the metal-phobic organic molecular material is deposited only on the surface of the cathode located in the pixel accommodating area.

10. The preparation method according to claim 8, characterized in that: The step of depositing a metal material on the surface of the cathode that is not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode comprises: Depositing a metal material in the recessed area by vertical evaporation or sputtering to fill the recessed area to form the auxiliary electrode; After the step of depositing a metal material on the surface of the cathode that is not covered by the cathode protection layer and in the recessed area to form an auxiliary electrode, the method further includes: Depositing an inorganic material on a surface of the cathode protection layer facing away from the organic light-emitting layer and on a surface of the auxiliary electrode to form an etching protection layer; and overlapping the etching protection layer with the overhanging structure; An organic material and an inorganic material are sequentially deposited on a side of the etching protection layer away from the cathode to form a first encapsulation layer and a second encapsulation layer.

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