A semiconductor material handling system

Abstract

The application provides a semiconductor material conveying system, which comprises a first main track and a second main track arranged in parallel with each other, and a first sub-track and a second sub-track arranged between the first main track and the second main track and connecting the first main track and the second main track; a wafer storage rack arranged close to a connecting end of the first sub-track and the second main track, and an access port of the wafer storage rack corresponding to a position of a first access point corresponding to the wafer storage rack on the first sub-track; and a three-pronged branch track arranged between the first sub-track and the second sub-track, and two branch tracks of the three-pronged branch track connected to two sides of the first access point respectively. The semiconductor material conveying system can improve wafer transmission efficiency and clean room space utilization.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a semiconductor material handling system. Background Technology

[0002] In the highly developed and costly semiconductor manufacturing industry, AMHS (Automated Handling System) has become the best alternative to manual handling of wafer cassettes and is widely used in all wafer fabs.

[0003] In the entire AMHS system, stockers, as important devices that store wafers and connect to wafer dicing machines, are extensively deployed in cleanrooms. The arrangement of the tracks and the location of the wafer storage racks, especially the location of the load ports on the wafer storage racks, will have a significant impact on the transmission speed of the AMHS system. At the same time, improper arrangement of wafer storage racks will result in a waste of cleanroom space.

[0004] Therefore, studying how to rationally design the track layout of wafer storage racks and the location of their entry and exit ports is an important topic for maximizing the utilization of cleanroom area and improving AMHS transportation efficiency. Summary of the Invention

[0005] This application provides a semiconductor material handling system that can improve wafer transport efficiency and cleanroom space utilization.

[0006] One aspect of this application provides a semiconductor material handling system, comprising: a first main track and a second main track arranged parallel to each other, and a first sub-track and a second sub-track located between and connecting the first main track and the second main track; a wafer storage rack located near the connection end of the first sub-track and the second main track, wherein the inlet and outlet ports of the wafer storage rack correspond to the positions of the first inlet and outlet points on the first sub-track corresponding to the wafer storage rack; and a three-pronged branch track located between the first sub-track and the second sub-track, wherein two of the branch tracks of the three-pronged branch track are respectively connected to the two sides of the first inlet and outlet points.

[0007] In some embodiments of this application, the system further includes: a plurality of production devices disposed between the first main track and the wafer storage rack, the plurality of production devices being connected to the first sub-track.

[0008] In some embodiments of this application, the plurality of production equipment is provided with a plurality of inlet and outlet ports, which are located below the second inlet and outlet points on the first sub-track corresponding to the plurality of production equipment.

[0009] In some embodiments of this application, the connection point between the first branch track and the first secondary track of the tri-branch track is located between the first entry / exit point and the second entry / exit point.

[0010] In some embodiments of this application, the in / out port of the wafer storage rack is located below the first in / out point.

[0011] In some embodiments of this application, the distance between the wafer storage rack and the second master track is 0.5 to 0.8 meters.

[0012] In some embodiments of this application, the cleanroom space utilization rate between the first main track and the second main track is greater than or equal to 70%.

[0013] In some embodiments of this application, the system further includes: a third sub-track, disposed between the first sub-track and the second sub-track, connecting the first sub-track and the triangular branch track.

[0014] In some embodiments of this application, the connection point between the third secondary track and the triangular branch track is located on the first branch track of the triangular branch track.

[0015] In some embodiments of this application, the system further includes a fourth sub-track, which is located near the first main track and connects the first sub-track and the second sub-track.

[0016] This application provides a semiconductor material handling system that can improve wafer transport efficiency and cleanroom space utilization. Attached Figure Description

[0017] The following accompanying drawings describe in detail the exemplary embodiments disclosed in this application. The same reference numerals denote similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting and exemplary, and the drawings are for illustrative purposes only and are not intended to limit the scope of this application. Other embodiments may similarly fulfill the inventive intent of this application. It should be understood that the drawings are not drawn to scale.

[0018] in:

[0019] Figure 1 This is a schematic diagram of a semiconductor material handling system;

[0020] Figure 2 This is a schematic diagram of the structure of a semiconductor material handling system according to an embodiment of this application. Detailed Implementation

[0021] The following description provides specific application scenarios and requirements for this application, intended to enable those skilled in the art to make and use the content of this application. Various partial modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this application. Therefore, this application is not limited to the embodiments shown, but rather to the widest scope consistent with the claims.

[0022] The technical solution of the present invention will be described in detail below with reference to the embodiments and accompanying drawings.

[0023] Figure 1 This is a schematic diagram of a semiconductor material handling system.

[0024] refer to Figure 1 As shown, the semiconductor material handling system includes: a first main track 140 and a second main track 120 arranged parallel to each other, and a first sub-track 110 and a second sub-track 130 located between and connecting the first main track 140 and the second main track 120; a wafer storage rack 150 located near the connection end of the first sub-track 110 and the second main track 120, and the inlet / outlet port 151 of the wafer storage rack 150 is located below the first inlet / outlet point on the second main track 120 corresponding to the wafer storage rack 150; and a plurality of production equipment 160 connected to the first sub-track 110.

[0025] refer to Figure 1 As shown, because the inlet / outlet port 151 of the wafer storage rack 150 is located below the first inlet / outlet point corresponding to the wafer storage rack 150 on the second main track 120, when wafers are transferred between the inlet / outlet port 151 and the second main track 120, they will occupy the second main track 120, which may lead to wafer accumulation on the second main track 120 and affect wafer transfer efficiency. Furthermore, the arrangement of the inlet / outlet port 151 results in a large distance between the wafer storage rack 150 and the second main track 120, wasting some cleanroom space, reducing the number of production devices 160 that can be accommodated, and reducing the cleanroom space utilization rate between the first main track 140 and the second main track 120, resulting in a cleanroom space utilization rate of only 60% between the first main track 140 and the second main track 120.

[0026] To address the aforementioned issues, this application provides a semiconductor material handling system that moves the inlet and outlet ports of the wafer storage rack from the long side to the short side, and adds a three-pronged branch track between the first and second sub-tracks to share the wafer transport load of the first sub-track, thereby improving wafer transport efficiency and cleanroom space utilization.

[0027] Figure 2 This is a schematic diagram of the structure of a semiconductor material handling system according to an embodiment of this application.

[0028] Embodiments of this application provide a semiconductor material handling system, with reference to... Figure 2 As shown, it includes: a first main track 240 and a second main track 220 arranged parallel to each other, and a first sub-track 210 and a second sub-track 230 located between and connecting the first main track 240 and the second main track 220; a wafer storage rack 250, near the connection end where the first sub-track 210 and the second main track 220 are connected, and the inlet / outlet port 251 of the wafer storage rack 250 corresponds to the position of the first inlet / outlet point on the first sub-track 210 corresponding to the wafer storage rack 250; a three-pronged branch track 270, disposed between the first sub-track 210 and the second sub-track 230, wherein two of the branch tracks of the three-pronged branch track 270 (e.g., the first branch track 271 and the second branch track 272) are respectively connected to both sides of the first inlet / outlet point.

[0029] and Figure 1 Compared to the structure of the semiconductor material handling system shown, the technical solution of this application (refer to...) Figure 2 The inlet / outlet port 251 of the wafer storage rack 250 is moved from the long side to the short side, so the distance between the wafer storage rack 250 and the second main track 220 can be smaller. This increases the area between the first main track 240 and the wafer storage rack 250, allowing more production equipment to be placed and increasing the cleanroom space utilization between the first main track 240 and the second main track 220. In addition, the three-pronged branch track 270 can alleviate the transportation pressure on the first auxiliary track 210. When the first inlet / outlet point is in operation, the wafer can also be transported through the three-pronged branch track 270, improving transportation efficiency.

[0030] refer to Figure 2 As shown, the first main track 240, the second main track 220, the first auxiliary track 210, and the second auxiliary track 230 are used for transporting wafers. The cleanroom space between the first main track 240 and the second main track 220 is used to house the production equipment 260 and the wafer storage rack 250. The utilization rate of the cleanroom space between the first main track 240 and the second main track 220 is greater than or equal to 70%, compared to... Figure 1 The structure shown greatly improves space utilization, allowing for the installation of a larger number of production equipment 260.

[0031] Continue to refer to Figure 2As shown, the wafer storage rack 250 is located near the connection end where the first sub-track 210 and the second main track 220 are connected, and the inlet / outlet port 251 of the wafer storage rack 250 corresponds to the position of the first inlet / outlet point on the first sub-track 210 corresponding to the wafer storage rack 250.

[0032] Specifically, the in / out port 251 of the wafer storage rack 250 is located below the first in / out point corresponding to the wafer storage rack 250 on the first sub-track 210. The wafer storage rack 250 and the first sub-track 210 transfer wafers through the in / out port 251.

[0033] The wafer storage rack 250 is used to store wafers. The wafers are handled by a robotic arm on the wafer storage rack 250.

[0034] Continue to refer to Figure 2 As shown, the semiconductor material handling system further includes: a plurality of production devices 260 disposed in a cleanroom space between the first main track 240 and the wafer storage rack 250, wherein the plurality of production devices 260 are connected to the first secondary track 210. Specifically, the plurality of production devices 260 are provided with a plurality of inlet / outlet ports 261, which are located below the second inlet / outlet points on the first secondary track 210 corresponding to the plurality of production devices 260.

[0035] In the technical solution of this application, with Figure 1 Compared to the structure of the semiconductor material handling system shown, more production equipment can be installed with the same production equipment size.

[0036] Continue to refer to Figure 2 As shown, the tri-branch track 270 is disposed between the first sub-track 210 and the second sub-track 230, and two of the branch tracks of the tri-branch track 270 (e.g., the first branch track 271 and the second branch track 272) are respectively connected to the two sides of the first entry / exit point.

[0037] The triangular branch track 270 can alleviate the transportation pressure on the first sub-track 210. When the first inlet / outlet point on the first sub-track 210 corresponding to the wafer storage rack 250 is in working condition (that is, when wafers are being transferred between the inlet / outlet port 251 of the wafer storage rack 250 and the first sub-track 210), other wafers on the first sub-track 210 can also be transported through the triangular branch track 270, thereby improving transportation efficiency.

[0038] refer to Figure 2As shown, the connection point between the first branch track 271 of the three-way branch track 270 and the first secondary track 210 is located between the first entry / exit point and the second entry / exit point; the second branch track 272 of the three-way branch track 270 can be connected to the first secondary track 210 or to the second main track 220; the third branch track 273 of the three-way branch track 270 is connected to the second secondary track 230.

[0039] Continue to refer to Figure 2 As shown, in some embodiments of this application, the semiconductor material handling system further includes a third sub-track 280, disposed between the first sub-track 210 and the second sub-track 230, connecting the first sub-track 210 and the triangular branch track 270. Specifically, the connection point between the third sub-track 280 and the triangular branch track 270 may be located on the first branch track 271 of the triangular branch track 270.

[0040] In some embodiments of this application, the connection point between the third sub-track 280 and the first sub-track 210 is located on the first sub-track 210 between several second entry / exit points corresponding to several production devices 260.

[0041] The third sub-track 280 can also be used to alleviate the transport pressure on the first sub-track 210. When some of the production equipment 260 occupies the first sub-track 210 for wafer transport, other wafers can still be transported via the third sub-track 280.

[0042] Continue to refer to Figure 2 As shown, in some embodiments of this application, the semiconductor material handling system further includes: a fourth sub-track 290, which is close to the first main track 240 and connected to the first sub-track 210 and the second sub-track 230.

[0043] In one specific embodiment, with Figure 1 Compared to the structure in the previous application, the technical solution of this application can accommodate a larger number of production devices 260, from Figure 1 The four production machines in the middle were increased to Figure 2 Five production equipment in the middle.

[0044] The following describes in detail the space utilization rate of the production area in this application's technical solution using the dimensional relationships of various parts in a semiconductor material handling system according to a specific embodiment.

[0045] refer to Figure 2 As shown, the distance a between the first main track 240 and the second main track 220 is 22m.

[0046] Continue to refer to Figure 2 As shown, the width b of the wafer storage rack 250 is 1500mm; the distance c between the wafer storage rack 250 and the second main track 220 is 0.6m.

[0047] Continue to refer to Figure 2 As shown, the width d of the production equipment 260 is 2.8m; the minimum distance e between the production equipment 260 and the wafer storage rack 250 is 1m.

[0048] Continue to refer to Figure 2 As shown, the distance f between adjacent production equipment 260 is 900mm.

[0049] Continue to refer to Figure 2 As shown, the minimum distance g between the plurality of production equipment 260 and the first main track 240 is 0.2 meters.

[0050] This application provides a semiconductor material handling system that can improve wafer transport efficiency and cleanroom space utilization.

[0051] In summary, after reading this application, those skilled in the art will understand that the foregoing application content is presented by way of example only and is not restrictive. Although not explicitly stated herein, those skilled in the art will understand that this application is intended to encompass various reasonable changes, improvements, and modifications to the embodiments. These changes, improvements, and modifications are all within the spirit and scope of the exemplary embodiments of this application.

[0052] It should be understood that the term "and / or" as used in this embodiment includes any or all combinations of one or more of the associated listed items. It should be understood that when an element is referred to as "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be an intermediate element.

[0053] It should also be understood that the terms “comprising,” “including,” “including,” or “comprise”, when used in this application, indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0054] It should also be understood that although the terms first, second, third, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Therefore, without departing from the teachings of this application, a first element in some embodiments may be referred to as a second element in other embodiments. The same reference numerals or the same reference signs denote the same elements throughout the specification.

[0055] Furthermore, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes are foreseeable due to factors such as manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. Thus, the regions shown in the figures are substantially schematic, and their shapes are not intended to illustrate the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

Claims

1. A semiconductor material handling system, characterized in that, include: A first main track and a second main track arranged in parallel to each other, and a first sub-track and a second sub-track located between the first main track and the second main track and connecting the first main track and the second main track; The wafer storage rack is located near the connection end where the first sub-track connects to the second main track, and the inlet and outlet ports of the wafer storage rack correspond to the positions of the first inlet and outlet points on the first sub-track that correspond to the wafer storage rack. A three-pronged track is positioned between the first and second secondary tracks, with two of its branches connected to the two sides of the first entry / exit point, respectively.

2. The semiconductor material handling system as described in claim 1, characterized in that, Also includes: Several production devices are arranged between the first main track and the wafer storage rack, and the several production devices are connected to the first sub-track.

3. The semiconductor material handling system as described in claim 2, characterized in that, The plurality of production equipment is provided with a plurality of inlet and outlet ports, which are located below the second inlet and outlet points corresponding to the plurality of production equipment on the first sub-track.

4. The semiconductor material handling system as described in claim 3, characterized in that, The connection point between the first branch track and the first secondary track of the three-way branch track is located between the first entry / exit point and the second entry / exit point.

5. The semiconductor material handling system as described in claim 1, characterized in that, The in / out port of the wafer storage rack is located below the first in / out point.

6. The semiconductor material handling system as described in claim 1, characterized in that, The distance between the wafer storage rack and the second main track is 0.5 to 0.8 meters.

7. The semiconductor material handling system as claimed in claim 1, characterized in that, The cleanroom space utilization rate between the first main track and the second main track is greater than or equal to 70%.

8. The semiconductor material handling system as described in claim 1, characterized in that, It also includes: a third sub-track, disposed between the first sub-track and the second sub-track, connecting the first sub-track and the three-pronged branch track.

9. The semiconductor material handling system as described in claim 8, characterized in that, The connection point between the third sub-track and the triangular branch track is located on the first branch track of the triangular branch track.

10. The semiconductor material handling system as claimed in claim 1, characterized in that, Also includes: The fourth sub-track is located close to the first main track and connects the first sub-track and the second sub-track.

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