Transplanting module

Abstract

The application discloses a transplanting module, which comprises a carrier platform, a needle mechanism, a 3D vision camera and a moving mechanism. The top surface of the carrier platform is provided with an annular groove, a zero-point calibration column and a plurality of vacuum suction holes. The plurality of vacuum suction holes are located in the area surrounded by the annular groove. The vacuum suction holes are connected with an air source. A sealing ring protruding from the top surface of the carrier platform is arranged in the annular groove. The outer side of the annular groove is provided with a plurality of spring sheet assemblies for preventing the sealing ring from coming out of the annular groove. The needle mechanism is subjected to zero-point calibration before needle work. The 3D vision camera scans and calculates the PCB after the PCB is fed, and converts a plurality of height deviation values into the protruding height of the voice coil motor driving the needle corresponding to each point of the pad area of the PCB. The high vacuum adsorption force is used to make the PCB closely adhere to the top surface of the carrier platform, so that the swing of the PCB during the needle die bonding process is avoided, the phenomena of too high and too low protruding height of the needle are avoided, the die leakage and the crushed wafer are avoided, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of acupuncture crystal solidification equipment technology, in particular to a transplanting module. Background Art

[0002] Mini-LED-PCB boards are required in the needle-punch die bonding equipment, which performs needle-punch die bonding on the Mini-LED-PCB boards.

[0003] Typically, after a Mini-LED-PCB board is manufactured, its flatness is controlled to be ≤0.3mm, and the thickness tolerance is ±0.1mm, which meets the standard. However, due to the existence of poor flatness and thickness tolerance, the Mini-LED-PCB board may be partially warped, resulting in nonlinear dynamic changes in the height of the pad area of ​​the Mini-LED-PCB board. That is, the heights of the bonding points at different positions in the pad area are inconsistent, which leads to leakage and damage to the chip grains during the needle-piercing bonding process, affecting the yield of the finished product; and the warping problem of the Mini-LED-PCB board leads to vacuum leakage when the Mini-LED-PCB board is vacuum-adsorbed on the carrier platform, which in turn causes the Mini-LED-PCB board to be unable to adhere to the top surface of the carrier platform, affecting the subsequent needle-piercing bonding of the Mini-LED-PCB board. Therefore, how to improve the warping problem of the Mini-LED-PCB board is a key research direction in the industry.

[0004] Therefore, it is necessary to design a new technical solution to solve the above problems. Summary of the Invention

[0005] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a transplanting module, which is provided with sealing rings on the periphery of a number of vacuum suction holes. The setting of the sealing rings improves the airtightness between the PCB board and the carrier platform, eliminates the vacuum leakage problem, and can utilize the high vacuum adsorption force to make the PCB board close to the top surface of the carrier platform, thereby preventing the PCB board from swinging during the needle puncture bonding process, thereby improving the impact of the warping problem of the PCB board on the needle puncture bonding. The needle puncture mechanism performs zero point calibration and the 3D vision camera performs scanning and calculation, so that the protruding height of the ejector pin matches the height of each point in the pad area of ​​the PCB board, and the protruding height of the ejector pin will not be too high or too low, resulting in leakage and crushing of the wafer, thereby improving the product yield.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A transplanting module, comprising:

[0008] The carrier platform has an annular groove, a zero-point calibration column, and a plurality of vacuum suction holes on its top surface. The plurality of vacuum suction holes are located in the area enclosed by the annular groove. The vacuum suction holes are connected to an air source. A sealing ring protruding from the top surface of the carrier platform is provided in the annular groove. A plurality of spring elements are provided on the outside of the annular groove to prevent the sealing ring from falling out of the annular groove. When the PCB board is placed on the top surface of the carrier platform, the bottom surface of the PCB board contacts the sealing ring. Subsequently, the vacuum suction holes begin to draw vacuum, and the negative pressure sucks the PCB board to compress the sealing ring until the PCB board contacts the top surface of the carrier platform.

[0009] The needling mechanism is located above the carrier platform and includes a voice coil motor and a needling assembly. The needling mechanism undergoes zero-point calibration before needling. The zero-point calibration includes the following steps: first, aligning the ejector pin of the needling assembly with the zero-point calibration post; second, the voice coil motor extends the ejector pin of the needling assembly until it contacts the top surface of the zero-point calibration post. At this point, the extended height of the ejector pin of the needling assembly is defined as the zero point;

[0010] 3D vision camera, the 3D vision camera is located above the carrier platform. The 3D vision camera scans and calculates the PCB board after the PCB board is loaded. The scanning calculation includes the following steps: first, aligning the vision of the 3D vision camera with the pad area of ​​the PCB board and the top surface of the zero-point calibration post. Second, the 3D vision camera simultaneously scans the pad area of ​​the PCB board and the top surface of the zero-point calibration post. After obtaining the scanning data, several height deviation values ​​between each point of the pad area of ​​the PCB board and the top surface of the zero-point calibration post are calculated, and the several height deviation values ​​are converted into the protruding height of the voice coil motor driving the top pin corresponding to each point of the pad area of ​​the PCB board;

[0011] The moving mechanism is used to drive the carrier platform to move back and forth between the bottom of the acupuncture mechanism and the bottom of the 3D vision camera.

[0012] As a preferred solution, multiple mounting grooves connected to the annular groove are provided on the side of the annular groove. The spring assembly includes a fixed spring and a locking screw. One end of the fixed spring facing the annular groove presses against the sealing ring, and the other end of the annular groove is fixed to the mounting groove by the locking screw.

[0013] As a preferred solution, a toothed portion is provided on one end of the fixing spring piece facing the annular groove.

[0014] As a preferred solution, the bottom of the zero-point calibration column is fixed to the carrier platform, and the top surface of the zero-point calibration column is ground.

[0015] As a preferred solution, the moving mechanism comprises an X-axis moving assembly and a Y-axis moving assembly arranged on the X-axis moving assembly, and the carrier platform is arranged on the Y-axis moving assembly. In the first step of zero-point calibration, the X-axis moving assembly and the Y-axis moving assembly jointly drive the zero-point calibration column on the carrier platform to move below the top needle of the needle assembly. In the first step of scanning calculation, the X-axis moving assembly and the Y-axis moving assembly jointly drive the carrier platform to move below the 3D visual camera.

[0016] As a preferred solution, the X-axis moving assembly comprises a first support plate and a first driving device for driving the first support plate to move along the X-axis, and the Y-axis moving assembly is arranged on the first support plate. The Y-axis moving assembly comprises a second support plate and a second driving device for driving the second support plate to move along the Y-axis, and the carrier platform is arranged on the second support plate.

[0017] The present application has obvious advantages and beneficial effects compared with the prior art. Specifically, from the above technical solution, it can be known that:

[0018] The main point is that the sealing ring is arranged on the outer periphery of the plurality of vacuum air suction holes. The sealing ring improves the air tightness between the PCB and the carrier platform, eliminates the problem of vacuum leakage, and utilizes the high adsorption force of the vacuum to make the PCB tightly adhere to the top surface of the carrier platform, thereby avoiding the swing of the PCB during the needle piercing and die bonding process, improving the influence of the warping problem of the PCB on the needle piercing and die bonding, and matching the extension height of the top needle with the height of each point of the pad area of the PCB through zero-point calibration of the needle mechanism and scanning calculation of the 3D visual camera, so that the extension height of the top needle is not too high or too low, and the problems of missing die and crushing wafer are avoided, thereby improving the product yield.

[0019] To more clearly illustrate the structural features and effects of the present application, the present application will be described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a perspective view of the carrier platform of the preferred embodiment of the present application;

[0021] Figure 2 is a perspective view of the shell assembly of the preferred embodiment of the present application;

[0022] Figure 3 is a schematic view of the contact between the PCB and the sealing ring of the preferred embodiment of the present application;

[0023] Figure 4 is a perspective view of the needle mechanism of the preferred embodiment of the present application;

[0024] Figure 5 is a perspective view of the 3D visual camera of the preferred embodiment of the present application.

[0025] Description of the accompanying drawings:

[0026] 10. Carrier platform 11. Annular groove

[0027] 12. Zero point calibration column 13. Vacuum suction hole

[0028] 14. Air source 15. Sealing ring

[0029] 20. Acupuncture mechanism 21. Voice coil motor

[0030] 22. Acupuncture assembly 221. Ejector pin

[0031] 30. 3D vision camera 40. Mobile mechanism

[0032] 41. X-axis moving assembly 411. First support plate

[0033] 42. Y-axis moving assembly 421. Second support plate

[0034] 50. Shrapnel assembly 51. Fixed shrapnel

[0035] 511, toothed portion 52, locking screw

[0036] 60. PCB board 61. Pad area. DETAILED DESCRIPTION

[0037] First of all, it should be noted that in the description of the present invention, the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0038] Please refer to Figures 1 to 5 As shown, it shows the specific structure of a preferred embodiment of the present invention, including a carrier platform 10, a needling mechanism 20, a 3D vision camera 30 and a moving mechanism 40.

[0039] See Figure 1 As shown, the top surface of the carrier platform 10 is provided with an annular groove 11, a zero point calibration column 12 and a plurality of vacuum suction holes 13. The plurality of vacuum suction holes 13 are located in the area enclosed by the annular groove 11. The vacuum suction holes 13 are connected to an air source 14. The air source 14 is arranged on the side of the carrier platform 10. The plurality of vacuum suction holes 13 are arranged in multiple rows and columns. The multiple vacuum suction holes 13 on each column are connected to an air source 14 through an air duct, so that the adsorption force of each vacuum suction hole 13 is the same.

[0040] The annular groove 11 is provided with a sealing ring 15 protruding from the top surface of the carrier platform 10. The outer side of the annular groove 11 is provided with a plurality of spring elements 50 for preventing the sealing ring 15 from falling out of the annular groove 11. Figure 3 As shown, when the PCB board 60 is placed on the top surface of the carrier platform 10, the bottom surface of the PCB board 60 contacts the sealing ring 15, and then the vacuum suction hole 13 starts to draw a vacuum, and the negative pressure sucks the PCB board 60 to compress the sealing ring 15 until the PCB board 60 contacts the top surface of the carrier platform 10;

[0041] Specifically, see Figure 2 As shown, a plurality of mounting grooves 16 connected to the annular groove 11 are provided on the side of the annular groove 11, and the spring assembly 50 includes a fixed spring 51 and a locking screw 52. One end of the fixed spring 51 facing the annular groove 11 presses against the sealing ring 15, and the other end of the annular groove 11 is fixed to the mounting groove 16 by the locking screw 52. The fixed spring 51 can prevent the sealing ring 15 from being brought out when the PCB board 60 is removed from the carrier platform 10. Preferably, a toothed portion 511 is provided on the end of the fixed spring 51 facing the annular groove 11, and the toothed portion 511 can be embedded in the sealing ring 15, so that the sealing ring 15 is more firmly fixed in the annular groove 11; in this embodiment, the annular groove 11 and the sealing ring 15 are both square.

[0042] The bottom of the zero point calibration column 12 is fixed to the carrier platform 10, and the top surface of the zero point calibration column 12 is polished; specifically, the bottom of the zero point calibration column 12 is tightly inserted into the carrier platform 10, and the top surface of the zero point calibration column 12 is flush with the pad area 61 of the PCB board 60.

[0043] See Figure 4 As shown, the puncture mechanism 20 is located above the carrier platform 10. The puncture mechanism 20 includes a voice coil motor 21 and a puncture assembly 22. The puncture mechanism 20 performs zero-point calibration before the puncture operation. The zero-point calibration includes the following steps: a first step, aligning the ejector pin 221 of the puncture assembly 22 with the zero-point calibration column 12; a second step, the voice coil motor 21 extends the ejector pin 221 of the puncture assembly 22 until it contacts the top surface of the zero-point calibration column 12. At this time, the extended height of the ejector pin 221 of the puncture assembly 22 is defined as the zero point.

[0044] See Figure 5As shown, the 3D vision camera 30 is located above the carrier platform 10. The 3D vision camera 30 scans and calculates the PCB board 60 after the PCB board 60 is loaded. The scanning calculation includes the following steps: a first step, aligning the vision of the 3D vision camera 30 with the pad area 61 of the PCB board 60 and the top surface of the zero point calibration column 12; a second step, the 3D vision camera 30 simultaneously scans the pad area 61 of the PCB board 60 and the top surface of the zero point calibration column 12, and after obtaining the scanning data, calculates a number of height deviation values ​​between each point of the pad area 61 of the PCB board 60 and the top surface of the zero point calibration column 12, and converts the several height deviation values ​​into the protruding height of each point of the pad area 61 of the PCB board 60 driven by the voice coil motor 21, thereby preventing the protruding height of the ejector 221 from being too high or too low, resulting in leakage and crushing of the wafer.

[0045] See Figure 5 As shown, the moving mechanism 40 is used to drive the carrier platform 10 to and from the bottom of the acupuncture mechanism 20 and the bottom of the 3D vision camera 30. The moving mechanism 40 includes an X-axis moving component 41 and a Y-axis moving component 42 provided on the X-axis moving component 41. The carrier platform 10 is provided on the Y-axis moving component 42. In the first step of the zero point calibration, the X-axis moving component 41 and the Y-axis moving component 42 together drive the zero point calibration column 12 on the carrier platform 10 to move to the bottom of the ejector pin 221 of the acupuncture component 22. In the first step of the scanning calculation, the X-axis moving component 41 and the Y-axis moving component 42 together drive the carrier platform 10 to move to the bottom of the 3D vision camera 30.

[0046] Specifically, the X-axial moving assembly 41 includes a first support plate 411 and a first driving device (not shown in the figure) that drives the first support plate 411 to move along the X-axial direction, the Y-axial moving assembly 42 is arranged on the first support plate 411, the Y-axial moving assembly 42 includes a second support plate 421 and a second driving device (not shown in the figure) that drives the second support plate 421 to move along the Y-axial direction, and the carrier platform 10 is arranged on the second support plate 421.

[0047] The design emphasis of the present invention is:

[0048] The main point is that sealing rings are arranged on the periphery of several vacuum suction holes. The setting of the sealing rings improves the airtightness between the PCB board and the carrier platform, eliminates the vacuum leakage problem, and can use the high vacuum adsorption force to make the PCB board close to the top surface of the carrier platform, avoiding the PCB board from swinging during the needle puncture bonding process, thereby improving the impact of the PCB board's warping problem on the needle puncture bonding. The needle puncture mechanism performs zero point calibration and the 3D vision camera performs scanning and calculation, so that the protruding height of the ejector pin matches the height of each point in the pad area of ​​the PCB board, and the protruding height of the ejector pin will not be too high or too low, resulting in leakage and crushing of the wafer, thereby improving the product yield.

[0049] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A transplanting module, characterized in that: include: A carrier platform, wherein the top surface of the carrier platform is provided with an annular groove, a zero-point calibration column and a plurality of vacuum suction holes, the plurality of vacuum suction holes are located in the area enclosed by the annular groove, the vacuum suction holes are connected to an air source, a sealing ring protruding from the top surface of the carrier platform is provided in the annular groove, and a plurality of spring elements for preventing the sealing ring from falling out of the annular groove are provided on the outside of the annular groove; when a PCB board is placed on the top surface of the carrier platform, the bottom surface of the PCB board contacts the sealing ring, and then the vacuum suction holes start to draw a vacuum, and the negative pressure sucks the PCB board to compress the sealing ring until the PCB board contacts the top surface of the carrier platform; A needling mechanism is located above the carrier platform and includes a voice coil motor and a needling assembly. The needling mechanism performs a zero-point calibration before needling. The zero-point calibration includes the following steps: first, aligning the ejector pin of the needling assembly with the zero-point calibration post; second, the voice coil motor extends the ejector pin of the needling assembly until it contacts the top surface of the zero-point calibration post. At this point, the extended height of the ejector pin of the needling assembly is defined as the zero point; A 3D vision camera is located above the carrier platform. The 3D vision camera scans and calculates the PCB board after the PCB board is loaded. The scanning and calculation includes the following steps: a first step, aligning the vision of the 3D vision camera with the pad area of ​​the PCB board and the top surface of the zero-point calibration post. A second step, the 3D vision camera simultaneously scans the pad area of ​​the PCB board and the top surface of the zero-point calibration post. After obtaining the scanning data, several height deviation values ​​between each point of the pad area of ​​the PCB board and the top surface of the zero-point calibration post are calculated, and the several height deviation values ​​are converted into the extension height of each point of the pad area of ​​the PCB board driven by the voice coil motor to drive the top needle; A moving mechanism is used to drive the carrier platform to move back and forth between the bottom of the acupuncture mechanism and the bottom of the 3D vision camera.

2. A transplanting module according to claim 1, characterized in that: A plurality of mounting grooves connected to the annular groove are provided on the side of the annular groove. The spring assembly includes a fixed spring and a locking screw. One end of the fixed spring facing the annular groove presses against the sealing ring, and the other end of the annular groove is fixed to the mounting groove by the locking screw.

3. A transplanting module according to claim 2, characterized in that: One end of the fixing elastic piece facing the annular groove is provided with a toothed portion.

4. The transplanting module according to claim 1, characterized in that: The bottom of the zero-point calibration column is fixed on the carrier platform, and the top surface of the zero-point calibration column is ground.

5. The transplanting module according to claim 1, characterized in that: The moving mechanism includes an X-axial moving component and a Y-axial moving component arranged on the X-axial moving component. The carrier platform is arranged on the Y-axial moving component. In the first step of the zero point calibration, the X-axial moving component and the Y-axial moving component jointly drive the zero point calibration column on the carrier platform to move below the ejector pin of the acupuncture component. In the first step of the scanning calculation, the X-axial moving component and the Y-axial moving component jointly drive the carrier platform to move below the 3D vision camera.

6. The transplanting module according to claim 5, characterized in that: The X-axial moving assembly includes a first support plate and a first driving device that drives the first support plate to move along the X-axial direction. The Y-axial moving assembly is arranged on the first support plate. The Y-axial moving assembly includes a second support plate and a second driving device that drives the second support plate to move along the Y-axial direction. The carrier platform is arranged on the second support plate.

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