An automatic adhesive application method and apparatus for circuit boards

Abstract

This invention discloses an automatic adhesive application method for circuit boards (PCBs) and an automatic tape application device using this method. The automatic adhesive application method includes three steps: step one: conveying the PCB and preparing the tape; step two: supplying and applying the tape; and step three: conveying the PCB and cutting the tape. The constraint cutting mechanisms on both sides of the PCB can move relative to or away from each other to change the distance between them. The mutually movable constraint cutting mechanisms are suitable for PCBs of different sizes. The tape provided by the supply system is constrained by the constraint cutting mechanisms, causing the tape to bend and wrap around both sides of the PCB. Finally, the constraint cutting mechanisms automatically cut the tape. Furthermore, the constraint cutting mechanisms can also be used to attach the ends of the tape together, facilitating direct application of the tape ends to new PCBs to be adhesived, thereby replacing frequent manual tape application and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board processing technology, and in particular to an automatic adhesive application method and apparatus for printed circuit boards. Background Technology

[0002] In PCB manufacturing, before the immersion nickel-gold plating and resin via filling processes, an automatic tape applicator is typically used to apply tape to the circuit board to protect it. However, during solder mask printing, the edges of the board need to be manually moved, so different widths of tape are left unprinted to facilitate subsequent operations. Therefore, the automatic tape applicator needs to switch between different widths of tape and different sizes of circuit boards.

[0003] However, currently, switching between different widths of tape is generally done manually by cutting and applying the tape. When there are many circuit boards, this requires frequent manual cutting and application, which greatly affects production efficiency. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes an automatic adhesive application method for circuit boards, which can automatically cut and apply adhesive tape when changing circuit boards of different sizes.

[0005] The present invention also proposes an automatic tape applicator that utilizes the above-mentioned automatic tape applicator method for circuit boards.

[0006] According to a first aspect of the present invention, an automatic adhesive application method for circuit boards includes:

[0007] Step 1: Circuit board conveying and tape preparation. Place the circuit board on the conveyor roller and convey it to the working area of ​​the automatic tape applicator. Install the tape roll in the supply system of the automatic tape applicator. The tape roll is arranged on both sides of the circuit board along the axial direction of the conveyor roller.

[0008] Step 2: Tape supply and tape application. The tape is output from the supply system and passes through the tensioning mechanism and the constraint shearing mechanism in sequence. The tape is then conveyed to the working area of ​​the automatic tape applicator. The constraint shearing mechanism constrains and bends the tape inward and applies it to the upper and lower sides of the circuit board. The tensioning mechanism and the constraint shearing mechanism are arranged on both sides of the circuit board along the axial direction of the conveying roller.

[0009] Step 3: Circuit board conveying and tape cutting. The automatic tape applicator conveys the circuit board. After the circuit board is tapered, the constraint cutting mechanism automatically cuts the tape, and the automatic tape applicator outputs the circuit board.

[0010] The constraint shearing mechanisms on both sides of the circuit board can move relative to or away from each other to change the distance between them.

[0011] The automatic adhesive application method for circuit boards according to embodiments of the present invention has at least the following advantages: the mutually close constraint cutting mechanisms are applicable to circuit boards of different sizes. The adhesive tape provided by the supply system is constrained by the constraint cutting mechanisms, causing the tape to bend and wrap around both sides of the circuit board. Finally, the constraint cutting mechanisms automatically cut the tape. Furthermore, the constraint cutting mechanisms can also be used to attach the ends of the tape together, facilitating direct application of the tape ends to new circuit boards to be adhesiveped, thereby replacing frequent manual application and improving production efficiency.

[0012] According to some embodiments of the present invention, a fourth step is also included: compacting the tape. A plurality of pressure rollers are provided in the working area of ​​the automatic tape applicator. The pressure rollers are respectively located on the upper and lower sides of the circuit board and the tape. The tape and the circuit board are simultaneously passed through the gap between the pressure rollers.

[0013] According to some embodiments of the present invention, step five is included before step four: secondary binding of the tape. A rotatable binding wheel is also provided in the working area of ​​the automatic tape applicator. The axis of the binding wheel is vertically arranged. A constraint groove is provided on the periphery of the binding wheel. The tape and the circuit board can be passed through the constraint groove. The constraint groove provides secondary binding of the tape.

[0014] According to some embodiments of the present invention, the constraint shearing mechanism is provided with a mounting block, a constraint component, and a shearing component. The constraint component and the shearing component are disposed on the mounting block. The constraint component is disposed upstream of the shearing component. The constraint component is used to bend the tape, and the shearing component is used to cut the tape.

[0015] According to some embodiments of the present invention, the constraint assembly includes two guide blocks, which are arranged at intervals in a vertical direction. Each guide block is provided with an inclined surface that extends along the conveying direction of the circuit board, and there is a gap between the two guide blocks.

[0016] According to some embodiments of the present invention, the inclination angle of the inclined plane is in the range of 35°-65°.

[0017] According to some embodiments of the present invention, the shearing assembly includes a shearing block and a shearing seat. The shearing seat is fixedly disposed on the mounting base, and the shearing block is movably disposed above the shearing block. A cutter is disposed on the side of the shearing block facing the shearing seat, and a clearance groove is disposed on the side of the shearing seat facing the shearing block. The clearance groove is used to avoid the cutter. Both the shearing block and the shearing seat are provided with platforms, and the platforms are respectively on the same side of the cutter and the clearance groove.

[0018] According to some embodiments of the present invention, the shearing assembly further includes a driving mechanism that drives the shearing block to move up and down.

[0019] According to some embodiments of the present invention, the tensioning mechanisms on both sides of the circuit board can move relative to or away from each other to change the distance between them.

[0020] According to a second aspect of the present invention, the automatic tape applicator employs the automatic tape applicator method for circuit boards described in any of the embodiments of the first aspect.

[0021] The automatic tape applicator according to embodiments of the present invention has at least the following beneficial effects: The automatic tape applicator, using the described method, can replace the original complex operations of manual cutting and manual tape application, thereby improving the flow of the entire production process and thus increasing production efficiency. Furthermore, it is applicable to circuit boards of different sizes, improving product applicability.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the constraint shearing mechanism according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the restraint wheel according to an embodiment of the present invention.

[0026] Figure label:

[0027] Constraint shearing mechanism 10; mounting block 11; constraint assembly 12; guide block 121; shearing assembly 13; shearing block 131; shearing seat 132;

[0028] Restraint wheel 20; restraint groove 21. Detailed Implementation

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0031] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0032] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0033] According to a first aspect of the present invention, an automatic adhesive application method for circuit boards includes:

[0034] Step 1: Circuit board conveying and tape preparation. Place the circuit board on the conveyor roller and convey it to the working area of ​​the automatic tape applicator. Install the tape roll in the supply system of the automatic tape applicator. The tape roll is set on both sides of the circuit board along the axial direction of the conveyor roller.

[0035] Step 2: Tape supply and tape application. The tape is output from the supply system and passes through the tensioning mechanism and the constraint shearing mechanism 10 in sequence. The tape is then conveyed to the working area of ​​the automatic tape applicator. The constraint shearing mechanism 10 constrains and bends the tape inward and applies it to the upper and lower sides of the circuit board. The tensioning mechanism and the constraint shearing mechanism 10 are set on both sides of the circuit board along the axial direction of the conveyor roller.

[0036] Step 3: Circuit board conveying and tape cutting. The automatic tape applicator conveys the circuit board. After the circuit board is tapered, the constraint cutting mechanism 10 automatically cuts the tape, and the automatic tape applicator outputs the circuit board.

[0037] Among them, the constraint shearing mechanisms 10 on both sides of the circuit board can move relative to each other or away from each other to change the distance between them.

[0038] Specifically, the operator places the circuit board on the conveyor rollers, which transport the circuit board to the working area of ​​the automatic tape applicator. Simultaneously, tape rolls are installed on the automatic tape applicator's supply system, positioned on both sides of the circuit board. The tape is output from the supply system, passing through a tensioning mechanism for tensioning and a constraint-bending mechanism 10 for bending, ultimately covering both sides of the circuit board, achieving automatic tape application. The continuous transport of the circuit board and the synchronous transport of the tape ensure uninterrupted tape application and edge wrapping. Once the tape application is complete, the constraint-bending mechanism 10 automatically cuts the tape from both ends of the circuit board. It is important to note that the constraint-bending mechanisms 10 on both sides of the circuit board can move relative to or away from each other to change the distance between them, thus adapting to circuit boards of different sizes.

[0039] The mutually close-fitting constraint-cutting mechanism 10 is applicable to circuit boards of different sizes. The tape provided by the supply system is constrained by the constraint-cutting mechanism 10, causing the tape to bend and wrap around both sides of the circuit board. Finally, the constraint-cutting mechanism 10 automatically cuts the tape. In addition, the constraint-cutting mechanism 10 can also be used to stick the ends of the tape together, making it easier to directly stick the ends of the tape to the new circuit board to be glued, thereby replacing frequent manual glue application and improving production efficiency.

[0040] In some embodiments of the present invention, the automatic tape application method further includes a fourth step: compacting the tape. Several pressure rollers are arranged in the working area of ​​the automatic tape application machine. The pressure rollers are located on the upper and lower sides of the circuit board and the tape, respectively, and the tape and the circuit board are simultaneously passed through the gaps between the pressure rollers. After the tape is applied to the circuit board, it can be pressed firmly onto the circuit board by the downstream pressure rollers.

[0041] In some embodiments of the present invention, the automatic tape application method includes a fifth step, a secondary binding of the tape, before step four. A rotatable binding wheel 20 is also provided in the working area of ​​the automatic tape application machine. The axis of the binding wheel 20 is vertically arranged, and a constraint groove 21 is provided on the periphery of the binding wheel 20. The tape and the circuit board can pass through the constraint groove 21, which provides secondary binding for the tape. During the conveying process by the conveyor rollers, both sides of the circuit board enter the constraint groove 21 of the binding wheel 20, so that the side ends directly abut against the bottom of the constraint groove 21, thereby pressing the tape at the side ends onto the circuit board through the bottom of the constraint groove 21.

[0042] In some embodiments of the present invention, specifically, the constraint shearing mechanism 10 is provided with a mounting block 11, a constraint component 12, and a shearing component 13. The constraint component 12 and the shearing component 13 are disposed on the mounting block 11, with the constraint component 12 positioned upstream of the shearing component 13. The constraint component 12 is used to bend the tape, and the shearing component 13 is used to cut the tape. The mounting block 11 is located between the tensioning mechanism and the restraint wheel 20. The tensioning mechanism can be a tensioning wheel, with the constraint component 12 disposed downstream of the tensioning wheel, and the shearing component 13 disposed downstream of the constraint component 12. The tape is tensioned by the tensioning wheel, which facilitates the downstream constraint component 12 in bending the tape inward, so that the tape covers and adheres to both sides of the circuit board. After the tape is adhered to the circuit board, the tape can be automatically cut by driving the shearing component 13.

[0043] Furthermore, in some embodiments of the present invention, the constraint component 12 includes two guide blocks 121, which are arranged vertically at intervals. Each guide block 121 has an inclined surface extending along the conveying direction of the circuit board, and there is a gap between the two guide blocks 121. The inclined surfaces on the upper and lower sides are inclined towards each other along the conveying direction of the tape, making the cross-section of the constraint component 12 have a "V" shape, which facilitates the tape to bend and gather inwards, forming a "U" shape with the mounting block 11, thus facilitating its wrapping around both sides of the circuit board. It is understood that a platform can also be provided at the gathering end of the inclined surface, connecting to one end of the inclined surface, thereby facilitating the stable output of the "U"-shaped tape. In some embodiments, the inclination angle of the inclined surface ranges from 35° to 65°.

[0044] In some embodiments of the present invention, the shearing assembly 13 includes a shearing block 131 and a shearing seat 132. The shearing seat 132 is fixedly mounted on the mounting base, and the shearing block 131 is movably mounted above the shearing block 131. A cutter is provided on the side of the shearing block 131 facing the shearing seat 132, and an avoidance groove is provided on the side of the shearing seat 132 facing the shearing block 131. The avoidance groove is used to avoid the cutter. Both the shearing block 131 and the shearing seat 132 are provided with platforms, and the platforms are respectively on the same side of the cutter and the avoidance groove.

[0045] The platform can be connected to the platform of the constraint component 12 on one side, facilitating smooth tape delivery. Furthermore, when the shearing block 131 moves downwards, the cutter cuts the tape and extends into the clearance groove, causing the platform on the lower end face of the shearing block 131 to adhere to the platform on the upper end face of the shearing seat 132. It is conceivable that this platform-to-platform adhesion clamps the tape tightly, with their inner sides touching, facilitating the direct clamping of the front end of the next circuit board onto the inner side of the tape when it arrives. At this point, the shearing block 131 moves upwards, and the circuit board is delivered, thus achieving automatic tape application.

[0046] If the circuit boards are of different sizes, the position of the constraint shearing mechanism 10 can be adjusted to adapt to the automatic adhesive application of circuit boards of different sizes.

[0047] In some embodiments of the present invention, the shearing assembly 13 further includes a driving mechanism that drives the shearing block 131 to move up and down. The driving mechanism can be a lead screw structure, a cylinder structure, or a compression mechanism, etc., which can cause the shearing block 131 to move up and down relative to the shearing seat 132.

[0048] In some embodiments of the present invention, it can be understood that the tensioning mechanisms on both sides of the circuit board can move relative to or away from each other to change the distance between them, thereby facilitating the tensioning of the tape.

[0049] According to a second aspect embodiment of the present invention, the automatic tape-applying device employs the automatic tape-applying method for circuit boards described in any of the first aspects. The automatic tape-applying device replaces the complex operations of manual cutting and manual tape application, thereby improving the overall flow of the production process and thus increasing production efficiency. Furthermore, it is applicable to circuit boards of different sizes, improving product applicability.

[0050] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. An automatic adhesive application method for circuit boards, characterized in that, include: Step 1: Circuit board conveying and tape preparation. Place the circuit board on the conveyor roller and convey it to the working area of ​​the automatic tape applicator. Install the tape roll in the supply system of the automatic tape applicator. The tape roll is arranged on both sides of the circuit board along the axial direction of the conveyor roller. Step 2: Tape supply and tape application. The tape is output from the supply system and passes through the tensioning mechanism and the constraint shearing mechanism in sequence. The tape is then conveyed to the working area of ​​the automatic tape applicator. The constraint shearing mechanism constrains and bends the tape inward and applies it to the upper and lower sides of the circuit board. The tensioning mechanism and the constraint shearing mechanism are arranged on both sides of the circuit board along the axial direction of the conveying roller. Step 3: Circuit board conveying and tape cutting. The automatic tape applicator conveys the circuit board. After the circuit board is tapered, the constraint cutting mechanism automatically cuts the tape. The automatic tape applicator then conveys the circuit board. The tensioning mechanism and the constraint shearing mechanism on both sides of the circuit board can move relative to each other or away from each other to change the distance between them. The constraint shearing mechanism includes a mounting block, a constraint component, and a shearing component. The constraint component and the shearing component are mounted on the mounting block. The constraint component is located upstream of the shearing component. The constraint component is used to bend the tape, and the shearing component is used to cut the tape. The constraint component includes two guide blocks, which are spaced apart in a vertical direction. Each guide block has an inclined surface that extends along the conveying direction of the circuit board. There is a gap between the two guide blocks. The shearing assembly includes a shearing block and a shearing seat. The shearing seat is fixedly mounted on the mounting block, and the shearing block is movably mounted above the shearing block. A cutter is provided on the side of the shearing block facing the shearing seat, and a clearance groove is provided on the side of the shearing seat facing the shearing block. The clearance groove is used to avoid the cutter. Both the shearing block and the shearing seat are provided with platforms, and the platforms are respectively on the same side of the cutter and the clearance groove.

2. The automatic adhesive application method for circuit boards according to claim 1, characterized in that, The process also includes step four, compaction of the tape. Several pressure rollers are provided in the working area of ​​the automatic tape applicator. The pressure rollers are located on the upper and lower sides of the circuit board and the tape, respectively. The tape and the circuit board are simultaneously passed through the gap between the pressure rollers.

3. The automatic adhesive application method for circuit boards according to claim 2, characterized in that, Before step four, there is also step five, which involves secondary binding of the tape. The working area of ​​the automatic tape applicator is also equipped with a rotatable binding wheel. The axis of the binding wheel is vertically set, and a constraint groove is provided on the periphery of the binding wheel. The tape and the circuit board can be passed through the constraint groove, and the constraint groove provides secondary binding for the tape.

4. The automatic adhesive application method for circuit boards according to claim 1, characterized in that, The inclination angle of the inclined plane ranges from 35° to 65°.

5. The automatic adhesive application method for circuit boards according to claim 1, characterized in that, The shearing assembly also includes a driving mechanism that drives the shearing block to move up and down.

6. An automatic tape applicator, characterized in that, The automatic adhesive application method for circuit boards according to any one of claims 1 to 5 is used.

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