A non-resonant elliptical vibration cutting device and cutting method thereof

Abstract

The present invention discloses a non-resonant elliptical vibration cutting device and a cutting method thereof, wherein a secondary amplifying mechanism comprises a compliant guiding structure and a first rectangular piezoelectric stack installed on the inner side of the compliant guiding structure; a cross-shaped connecting structure is located on one side of the two compliant guiding mechanisms along a direction perpendicular to the arrangement of the two mounting frames, the top and bottom of the mounting portion are respectively connected to vertically extending first connecting portions, the two first connecting portions are respectively connected to the corresponding compliant guiding mechanisms, the mounting portion is connected to the corresponding mounting frames on both sides along the horizontal direction by first rounded flexible hinges, the two compliant guiding mechanisms are located on the side opposite to the cross-shaped connecting structure and are provided with a tool fixing frame, the two ends of the tool fixing frame are respectively connected to each compliant guiding structure, the mounting portion is connected to a second rectangular piezoelectric stack located between the two compliant guiding mechanisms on one side close to the tool fixing frame, and then cooperates with a lathe to process the complex graded structure surface on the outer circle and end face of the workpiece.

Description

Technical Field

[0001] The invention relates to the technical field of ultra-precision cutting, and in particular to a non-resonant elliptical vibration cutting device and a cutting method thereof. Background Art

[0002] With the rapid development of production and technology, hard and brittle semiconductor materials such as silicon carbide, gallium arsenide, and single crystal silicon have been widely used in key fields such as optics, electronics, instrumentation, national defense, and aerospace in recent years due to their excellent optoelectronic properties. However, due to the high hardness and low fracture toughness of hard and brittle materials, the tool wear is serious during the traditional processing, resulting in reduced surface quality. Therefore, seeking an efficient and reliable mechanical processing method to improve the processing accuracy of complex hierarchical structures of difficult-to-process materials is a research hotspot and focus.

[0003] Vibration-assisted cutting is created based on this need. Piezoelectric ceramics / transducers are usually used to convert high-frequency electrical signals into high-frequency mechanical vibration signals. A certain frequency amplitude is applied to the machining tool or workpiece to achieve periodic changes in the relative position of the tool and the workpiece. It can not only reduce cutting force, but also improve machining surface quality, extend tool life and effectively suppress regenerative chatter. Compared with the ironing characteristics of the tool back face during one-dimensional vibration cutting, the tool life extension effect is not significant, and the three-dimensional vibration cutting device has a complex structural design, aggravated motion coupling between axes, and great control difficulty. Therefore, elliptical vibration cutting is still the most widely used.

[0004] According to the different vibration types, elliptical vibration cutting devices can be divided into two types: resonant and non-resonant. The resonant elliptical vibration cutting device uses a piezoelectric transducer as the excitation source, and the maximum cutting frequency can reach 60kHz, but the processing frequency cannot be adjusted. At the same time, coupling is easily generated between the vibration modes of each order, which makes it difficult to control. The non-resonant elliptical vibration cutting device has gradually attracted the attention of researchers. It uses a piezoelectric-driven flexible hinge to optimize the tool trajectory by adjusting the shape, size and distribution of the flexible hinge. However, the elliptical plane of the motion trajectory of the traditional non-resonant elliptical vibration cutting tool is fixed, which has certain limitations in the processing of complex hierarchical structure surfaces. In addition, the devices currently developed still have disadvantages such as poor stability, short service life, small stroke, and low vibration frequency. Summary of the invention

[0005] The purpose of the present invention is to provide a non-resonant elliptical vibration cutting device and a cutting method thereof to solve the problems existing in the above-mentioned prior art, to achieve large-stroke, high-frequency elliptical vibration cutting based on three piezoelectric drives, and to cooperate with a lathe to process the complex hierarchical structure surface of the outer circle and end face of the workpiece, so as to meet the urgent needs of diamond cutting of complex hierarchical structure surfaces of difficult-to-process materials and obtain excellent cutting performance.

[0006] To achieve the above object, the present invention provides the following solution: The present invention provides a non-resonant elliptical vibration cutting device, comprising two mounting frames spaced apart in the horizontal direction, a primary guide mechanism located between the two mounting frames, and secondary amplifying mechanisms arranged in pairs, the two secondary amplifying mechanisms spaced apart in the vertical direction, and the primary guide mechanism located between the two secondary amplifying mechanisms;

[0007] The secondary amplification mechanism comprises a compliant guide structure and a first rectangular piezoelectric stack mounted inside the compliant guide structure, and rectangular guide hinges are connected between the two sides of the compliant guide structure and the corresponding mounting frames respectively;

[0008] The primary guiding mechanism includes a cross-shaped connecting structure, which is located on one side of the two flexible guiding mechanisms along a direction perpendicular to the arrangement of the two mounting frames. The cross-shaped connecting structure includes a mounting portion located between the two flexible guiding mechanisms, and the top and bottom of the mounting portion are respectively connected with vertically extending first connecting portions, and the two first connecting portions are respectively connected to the corresponding flexible guiding mechanisms. The mounting portion is connected to the corresponding mounting frames with first rounded flexible hinges on both sides along the horizontal direction. The two flexible guiding mechanisms are provided with a tool fixing frame on the side opposite to the cross-shaped connecting structure, and the two ends of the tool fixing frame are respectively connected to each of the flexible guiding structures. The side of the mounting portion close to the tool fixing frame is connected with a second rectangular piezoelectric stack located between the two flexible guiding mechanisms.

[0009] Preferably, the first rounded-corner flexible hinge is a double-layer rounded-corner flexible hinge, each layer of the rounded-corner flexible hinge extends vertically, and each layer of the rounded-corner flexible hinge is spaced apart in a direction perpendicular to the arrangement of the two mounting racks.

[0010] Preferably, a groove is provided on the side of the mounting portion close to the tool fixing frame, and the second rectangular piezoelectric stack is embedded in the groove, and a pressure plate is provided on the side of the second rectangular piezoelectric stack close to the tool fixing frame, and the pressure plate is pressed against the second rectangular piezoelectric stack, and its two ends are detachably connected to the mounting frame.

[0011] Preferably, the mounting frame is provided with positioning grooves at positions corresponding to the positions connected to the pressing plates, the two ends of the pressing plates are respectively embedded and installed in the positioning grooves, and fastening screws are connected between the bottoms of the positioning grooves and the pressing plates.

[0012] Preferably, the mounting portion is detachably plugged with a pre-tightening screw, and the pre-tightening screw presses against an end of the second rectangular piezoelectric stack away from the tool fixing frame.

[0013] Preferably, the compliant guiding structure is an annular structure, and a coaxial bridge-type flexible hinge is connected to the inner side of the compliant guiding structure, and the first rectangular piezoelectric stack is located on the inner side of the bridge-type flexible hinge.

[0014] Preferably, the inner side of the bridge-type flexible hinge is connected with ball screws in pairs, and the two ball screws are symmetrically arranged along the arrangement direction of the two mounting frames and respectively abut against two sides of the first rectangular piezoelectric stack.

[0015] Preferably, a second rounded flexible hinge is connected between the two ends of the tool fixing frame and each of the flexible guiding structures.

[0016] Preferably, the mounting frame is fastened to the tool slide of the machine tool by means of mounting screws.

[0017] A cutting method of a non-resonant elliptical vibration cutting device is also provided, comprising the following steps:

[0018] S1, installing the second rectangular piezoelectric stack in the groove of the mounting portion, using a pressing plate to be fixedly connected to the mounting frame, abutting against one end of the second rectangular piezoelectric stack, and reversely pre-tightening by a pre-tightening screw, abutting against the other end of the second rectangular piezoelectric stack;

[0019] S2, placing two groups of first rectangular piezoelectric stacks in each bridge-type flexible hinge respectively, and pre-tightening them through ball screws at both ends, fastening the mounting frame to the machine tool slide through mounting screws, and selecting the required diamond tool to be fixedly mounted on the tool fixing frame;

[0020] S3, a low-frequency sinusoidal alternating signal is introduced into the second rectangular piezoelectric stack to realize a low-frequency simple harmonic reciprocating motion of the diamond tool in the cutting direction (Y direction); at the same time, a high-frequency sinusoidal alternating signal close to the system resonance frequency is introduced into the two first rectangular piezoelectric stacks respectively, and an elliptical motion with adjustable amplitude is formed in the cutting plane (YZ plane) through the second rounded flexible hinge on the tool fixing frame;

[0021] S4. According to the requirements of the graded microstructure surface morphology, different machine tool processing parameters are matched with the servo motion trajectory of the diamond tool to achieve macro-micro graded structure surface processing of the outer cylindrical surface and end face of the difficult-to-process material.

[0022] Compared with the prior art, the present invention has achieved the following technical effects:

[0023] In the present application, a low-frequency sinusoidal alternating signal is input into the second rectangular piezoelectric stack, and since the connecting parts of the cross-shaped connecting structure are respectively connected to the corresponding flexible guiding mechanisms, after the low-frequency sinusoidal alternating signal is input into the second rectangular piezoelectric stack, the connecting parts of the cross-shaped connecting structure and the flexible guiding mechanism are driven to vibrate, thereby realizing the low-frequency simple harmonic reciprocating motion of the diamond tool in the cutting direction (Y direction); at the same time, high-frequency sinusoidal alternating signals close to the system resonance frequency are respectively input into the two first rectangular piezoelectric stacks, and an elliptical motion with adjustable amplitude is formed in the cutting plane (YZ plane) through the second rounded flexible hinge on the tool fixing frame, so as to cooperate with the lathe to process the complex graded structure surface on the outer circle and end face of the workpiece. The entire device adopts a large-stroke, high-frequency non-resonant elliptical vibration cutting device optimized and designed based on the principle of three piezoelectric drives in a serial-parallel hybrid manner. It can not only solve the technical limitations of small stroke, low vibration frequency and single tool motion trajectory in the existing elliptical vibration cutting process, but also realize ultra-precision processing of complex hierarchical structure surfaces of difficult-to-process materials, providing technical guarantee for the high-precision surface quality of optical semiconductor devices in key fields such as national defense, aerospace, and optoelectronic information. In addition, the present invention has a compact structure, can be used with a variety of machine tools to achieve customized surface processing, is easy to operate, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 It is an axonometric diagram of the overall structure of the present invention;

[0026] Figure 2 It is a top view of the overall structure of the present invention;

[0027] Figure 3 It is a D-direction view of the overall structure of the present invention;

[0028] Figure 4 It is a front view of the overall structure of the present invention;

[0029] Figure 5 It is a cross-sectional view along the AA direction of the present invention;

[0030] Figure 6 It is a cross-sectional view along the BB direction of the present invention;

[0031] Figure 7 It is a cross-sectional view along the CC direction of the present invention;

[0032] Figure 8This is a timing diagram of the motion trajectory of a tool for machining a graded microstructure surface according to the present invention.

[0033] In the figure: 1. secondary amplification mechanism; 2. mounting screw; 3. tightening screw; 4. tool fixing frame; 5. mounting frame; 6. pre-tightening screw; 7. primary guide mechanism; 8. pressure plate; 9. positioning groove; 10. rectangular guide hinge; 11. bridge-type flexible hinge; 12. first rectangular piezoelectric stack; 13. ball head screw; 14. flexible guide structure; 41. second rounded flexible hinge; 71. cross-shaped connection structure; 72. first rounded flexible hinge; 73. second rectangular piezoelectric stack. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] The purpose of the present invention is to provide a non-resonant elliptical vibration cutting device and a cutting method thereof to solve the problems existing in the above-mentioned prior art, to achieve large-stroke, high-frequency elliptical vibration cutting based on three piezoelectric drives, and to cooperate with a lathe to process the complex hierarchical structure surface of the outer circle and end face of the workpiece, so as to meet the urgent needs of diamond cutting of complex hierarchical structure surfaces of difficult-to-process materials and obtain excellent cutting performance.

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] like Figures 1 to 8 As shown, this embodiment provides a non-resonant elliptical vibration cutting device, including two mounting frames 5 spaced apart in the horizontal direction, primary guide mechanisms 7 located between the two mounting frames 5, and secondary amplifying mechanisms 1 arranged in pairs, preferably the mounting frames 5 are fastened to the tool slide of the machine tool by mounting screws 2, the two secondary amplifying mechanisms 1 are spaced apart in the vertical direction, and the primary guide mechanism 7 is located between the two secondary amplifying mechanisms 1;

[0038] The secondary amplifier mechanism 1 is a symmetrical structure as a whole, and includes a flexible guide structure 14 and a first rectangular piezoelectric stack 12 installed inside the flexible guide structure 14. Rectangular guide hinges 10 are connected between the two sides of the flexible guide mechanism and the corresponding mounting frames 5 respectively.

[0039] The primary guide mechanism 7 is a symmetrical structure as a whole, which includes a cross-shaped connection structure 71, which is located on one side of the two flexible guide mechanisms along a direction perpendicular to the arrangement of the two mounting frames 5. The cross-shaped connection structure includes a mounting portion located between the two flexible guide mechanisms, and the top and bottom of the mounting portion are respectively connected to vertically extending first connecting portions, and the two first connecting portions are respectively connected to the corresponding flexible guide mechanisms. The mounting portion is connected to the corresponding mounting frames 5 on both sides along the horizontal direction by first rounded flexible hinges 72. The two flexible guide mechanisms are located on the side opposite to the cross-shaped connection structure 71 and are provided with a tool fixing frame 4. The two ends of the tool fixing frame 4 are respectively connected to each flexible guide structure 14. The mounting portion is close to the tool fixing frame 4. The side is connected to the second rectangular piezoelectric stack 73 located between the two flexible guide mechanisms. The preferred tool can select different types of diamond tools according to the actual processing technology and be installed and fixed on the tool fixing frame 4.

[0040] The secondary amplifying mechanism 1, the tool fixing frame 4, the primary guiding mechanism 7 and the mounting frame 5 are integrated and fastened to the machine tool tool slide by the mounting screws 2. Then, two secondary amplifying mechanisms 1 and the primary guiding mechanism 7 located therebetween are arranged, and the tool fixing frame 4 is connected to the two secondary amplifying mechanisms 1, so that two sets of secondary amplifying mechanisms 1 are connected in parallel with the tool fixing frame 4 to form an elliptical processing trajectory in a plane perpendicular to the feed direction, and two sets of secondary amplifying mechanisms 1 are connected in parallel with the primary guiding mechanism 7 in series to form a "sandwich" sandwich structure, so as to realize the coupling of the low-frequency simple harmonic vibration of the tool and the elliptical processing trajectory in the cutting direction.

[0041] Furthermore, the present application inputs a low-frequency sinusoidal alternating signal to the second rectangular piezoelectric stack 73, and since the connecting parts of the cross-shaped connecting structure 71 are respectively connected to the corresponding flexible guiding mechanisms, after the low-frequency sinusoidal alternating signal is input to the second rectangular piezoelectric stack 73, the connecting parts of the cross-shaped connecting structure 71 and the flexible guiding mechanism are driven to vibrate, thereby realizing the low-frequency simple harmonic reciprocating motion of the diamond tool in the cutting direction (Y direction); at the same time, high-frequency sinusoidal alternating signals close to the system resonance frequency are respectively input to the two first rectangular piezoelectric stacks 12, and an elliptical motion with adjustable amplitude is formed in the cutting plane (YZ plane) through the second rounded flexible hinge 41 on the tool fixing frame 4, so as to cooperate with the lathe to process the complex graded structure surface on the outer circle and end face of the workpiece. As described above, the large-stroke, high-frequency non-resonant elliptical vibration cutting device disclosed in the present invention, which is optimized and designed based on the three-piezoelectric drive principle by using a series-parallel hybrid method, can not only solve the shortcomings of small stroke, low vibration frequency and single tool motion trajectory in the existing elliptical vibration cutting process, but also realize ultra-precision processing of the complex graded structure surface of difficult-to-process materials. It provides technical guarantee for the high-precision surface quality of optical semiconductor devices in key fields such as national defense, aerospace, and optoelectronic information. In addition, the present invention has a compact structure, can cooperate with a variety of machine tools and equipment to realize customized surface processing, is easy to operate, and has strong practicality.

[0042] Moreover, the first rounded corner flexible hinge 72 is a double-layer rounded corner flexible hinge, which can effectively improve the rigidity of the cutting device in the feed direction (X direction). Each layer of the rounded corner flexible hinge extends vertically, and each layer of the rounded corner flexible hinge is spaced apart in a direction perpendicular to the arrangement of the two mounting frames 5.

[0043] Among them, a groove is provided on the side of the mounting portion close to the tool fixing frame 4, and the second rectangular piezoelectric stack 73 is embedded in the groove, and a pressure plate 8 is provided on the side of the second rectangular piezoelectric stack 73 close to the tool fixing frame 4, and the pressure plate 8 is pressed against the second rectangular piezoelectric stack 73, and its two ends are respectively detachably connected to the mounting frame 5.

[0044] Furthermore, a fastening screw 3 is connected between the pressure plate 8 and the corresponding mounting frame 5. As a preferred embodiment, a positioning groove 9 is provided at the position of the mounting frame 5 corresponding to the connection position of the pressure plate 8. The two ends of the pressure plate 8 are respectively engaged with the positioning grooves 9 of each mounting frame 5. The fastening screw 3 is connected between the bottom of the positioning groove 9 and the pressure plate 8 to fix the pressure plate 8.

[0045] Preferably, the mounting portion is detachably plugged with a pre-tightening screw 6 , which presses against an end of the second rectangular piezoelectric stack 73 away from the tool fixing frame 4 to achieve pre-tightening and fixing of the second rectangular piezoelectric stack 73 .

[0046] As a preferred embodiment of the present invention, the flexible guiding structure 14 is annular, and a coaxial bridge-type flexible hinge 11 is connected to the inner side of the flexible guiding structure 14. The bridge-type flexible hinge 11 and the flexible guiding structure 14 are integrated into one piece, and then connected and fixed to the mounting frame 5 via a rectangular guiding hinge 10. The first rectangular piezoelectric stack 12 is located on the inner side of the bridge-type flexible hinge 11, so as to achieve the purpose of amplifying the output displacement of the first rectangular piezoelectric stack 12.

[0047] Furthermore, the inner side of the bridge-type flexible hinge 11 is connected in pairs with ball head screws 13, which are symmetrically arranged along the arrangement direction of the two mounting frames 5 and respectively abut against the two sides of the first rectangular piezoelectric stack 12 to ensure that the first rectangular piezoelectric stack 12 is in line contact with the ball head screws 13 to eliminate the adverse shear force caused by the cutting reaction force.

[0048] Furthermore, a second rounded flexible hinge 41 is connected between the two ends of the tool fixing frame 4 and each flexible guide structure 14 .

[0049] A cutting method using a non-resonant elliptical vibration cutting device is also provided, which is specifically applied to the cutting of complex graded microstructured surfaces of hard and brittle semiconductor materials such as silicon carbide, gallium arsenide, and single crystal silicon, and includes the following steps:

[0050] S1, install the second rectangular piezoelectric stack 73 in the groove of the mounting portion, use the pressing plate 8 to fix it on the mounting frame 5, abut against one end of the second rectangular piezoelectric stack 73, and reversely pre-tighten it through the pre-tightening screw 6, abut against the other end of the second rectangular piezoelectric stack 73;

[0051] S2, placing two groups of first rectangular piezoelectric stacks 12 in each bridge-type flexible hinge 11, and pre-tightening them through ball screws at both ends, fastening the mounting frame 5 to the machine tool slide through the mounting screws 2, and selecting the required diamond tool to be fixedly installed on the tool fixing frame 4;

[0052] S3, a low-frequency sinusoidal alternating signal is introduced into the second rectangular piezoelectric stack 73 to realize a low-frequency simple harmonic reciprocating motion of the diamond tool in the cutting direction (Y direction); at the same time, a high-frequency sinusoidal alternating signal close to the system resonance frequency is introduced into the two first rectangular piezoelectric stacks 12 respectively, and an elliptical motion with adjustable amplitude is formed in the cutting plane (YZ plane) through the second rounded flexible hinge 41 on the tool fixing frame 4;

[0053] S4. According to the requirements of graded microstructure surface morphology, different machine tool processing parameters and diamond tool servo motion trajectories are matched at the same time to achieve macro-micro graded structure surface processing of the outer cylindrical surface and end face of difficult-to-process materials.

[0054] Adaptive changes made according to actual needs are all within the protection scope of the present invention.

[0055] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numerals in the claims should not be regarded as limiting the claims involved.

[0056] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A non-resonant elliptical vibration cutting device, characterized in that: It comprises two installation racks spaced apart in the horizontal direction, primary guide mechanisms located between the two installation racks, and secondary amplifying mechanisms arranged in pairs, the two secondary amplifying mechanisms spaced apart in the vertical direction, and the primary guide mechanism located between the two secondary amplifying mechanisms; The secondary amplification mechanism comprises a compliant guide mechanism and a first rectangular piezoelectric stack mounted inside the compliant guide mechanism, and rectangular guide hinges are connected between the two sides of the compliant guide mechanism and the corresponding mounting frames respectively; The primary guiding mechanism includes a cross-shaped connecting structure, which is located on one side of the two flexible guiding mechanisms along a direction perpendicular to the arrangement of the two mounting frames. The cross-shaped connecting structure includes a mounting portion located between the two flexible guiding mechanisms, and the top and bottom of the mounting portion are respectively connected with vertically extending first connecting portions, and the two first connecting portions are respectively connected to the corresponding flexible guiding mechanisms. The mounting portion is connected to the corresponding mounting frames with first rounded flexible hinges on both sides along the horizontal direction. The two flexible guiding mechanisms are provided with a tool fixing frame on the side opposite to the cross-shaped connecting structure, and the two ends of the tool fixing frame are respectively connected to each of the flexible guiding mechanisms. The side of the mounting portion close to the tool fixing frame is connected with a second rectangular piezoelectric stack located between the two flexible guiding mechanisms.

2. The non-resonant elliptical vibration cutting device according to claim 1, characterized in that: The first rounded-corner flexible hinge is a double-layer rounded-corner flexible hinge, each layer of the rounded-corner flexible hinge extends vertically, and each layer of the rounded-corner flexible hinge is spaced apart and distributed in a direction perpendicular to the arrangement of the two mounting racks.

3. The non-resonant elliptical vibration cutting device according to claim 1 or 2, characterized in that: A groove is provided on the side of the mounting portion close to the tool fixing frame, and the second rectangular piezoelectric stack is embedded in the groove. A pressure plate is provided on the side of the second rectangular piezoelectric stack close to the tool fixing frame, and the pressure plate is pressed against the second rectangular piezoelectric stack, and its two ends are detachably connected to the mounting frame.

4. The non-resonant elliptical vibration cutting device according to claim 3, characterized in that: The mounting frame is provided with positioning grooves at positions corresponding to the positions connected to the pressing plates, and the two ends of the pressing plates are respectively embedded and installed in the positioning grooves, and fastening screws are connected between the groove bottoms of the positioning grooves and the pressing plates.

5. The non-resonant elliptical vibration cutting device according to claim 4, characterized in that: The mounting portion is detachably plugged with a pre-tightening screw, and the pre-tightening screw presses against an end of the second rectangular piezoelectric stack away from the tool fixing frame.

6. The non-resonant elliptical vibration cutting device according to claim 5, characterized in that: The compliant guide mechanism is an annular structure, and a coaxial bridge-type flexible hinge is connected to the inner side of the compliant guide mechanism, and the first rectangular piezoelectric stack is located on the inner side of the bridge-type flexible hinge.

7. The non-resonant elliptical vibration cutting device according to claim 6, characterized in that: The inner side of the bridge-type flexible hinge is connected with ball screws in pairs. The two ball screws are symmetrically arranged along the arrangement direction of the two mounting frames and respectively abut against two sides of the first rectangular piezoelectric stack.

8. The non-resonant elliptical vibration cutting device according to claim 7, characterized in that: The two ends of the tool fixing frame are respectively connected to the flexible guide mechanisms with second rounded flexible hinges.

9. The non-resonant elliptical vibration cutting device according to claim 8, characterized in that: The mounting frame is fastened to the tool slide of the machine tool by means of mounting screws.

10. A cutting method using the non-resonant elliptical vibration cutting device according to claim 9, characterized in that: The steps include: S1, installing the second rectangular piezoelectric stack in the groove of the mounting portion, using a pressing plate to be fixedly connected to the mounting frame, abutting against one end of the second rectangular piezoelectric stack, and reversely pre-tightening through a pre-tightening screw, abutting against the other end of the second rectangular piezoelectric stack; S2, placing two groups of first rectangular piezoelectric stacks in each bridge-type flexible hinge respectively, and pre-tightening them through ball screws at both ends, fastening the mounting frame to the machine tool slide through mounting screws, and selecting the required diamond tool to be fixedly mounted on the tool fixing frame; S3, a low-frequency sinusoidal alternating signal is introduced into the second rectangular piezoelectric stack to realize a low-frequency simple harmonic reciprocating motion in the cutting direction of the diamond tool; at the same time, a high-frequency sinusoidal alternating signal close to the system resonance frequency is introduced into the two first rectangular piezoelectric stacks respectively, and an elliptical motion with adjustable amplitude is formed in the cutting plane through the second rounded flexible hinge on the tool fixing frame; S4. According to the requirements of the graded microstructure surface morphology, different machine tool processing parameters are matched with the servo motion trajectory of the diamond tool to achieve macro-micro graded structure surface processing of the outer cylindrical surface and end face of the difficult-to-process material.

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