Low dielectric constant material and display device thereof

Abstract

The application relates to the field of photoelectric material application science and technology, and discloses a low-dielectric-constant material which contains 25-50 parts by weight of fluorine-containing acrylate monomers, 1-5 parts by weight of polysilsesquioxane, 1-5 parts by weight of a photoinitiator and other functional auxiliaries. The fluorine-containing acrylate and the polysilsesquioxane have a synergistic effect, so that the dielectric constant of the material is significantly reduced; meanwhile, the material has excellent comprehensive properties such as viscosity, light transmittance, dielectric constant, flexibility, hardness and flatness; the production cost is low; the preparation process is mild; and the material is a medium material with excellent comprehensive properties.

Description

Technical Field

[0001] This invention belongs to the field of optoelectronic materials application technology, specifically relating to a low dielectric constant material and its application in display devices. Background Technology

[0002] Intelligentization has become one of the hottest topics in global technological development, with countries and technology companies alike vying to gain a competitive edge in this rapidly evolving field. Flexible displays, chips, sensors, and other optoelectronic components, characterized by high performance, lightweight design, miniaturization, and integration, are essential elements of intelligentization. Achieving these high-performance, lightweight, miniaturized, and integrated characteristics relies on electronic packaging materials. Among these, dielectric materials play a crucial role in electronic packaging, such as protecting circuits, providing insulation, buffering heat, and preventing signal distortion. Therefore, dielectrics are required to have high insulation resistance, low dielectric constant, dense film layers, and good elasticity and hardness, among other properties. Dielectric materials are divided into two types: organic and inorganic. The former mainly consists of polymers, while the latter includes SiO2, Si3N4, and glass. Barix encapsulation technology, which combines organic and inorganic thin films, or single inorganic fillers or organic thin films, often has deficiencies in one or more aspects of important properties such as viscosity, transparency, dielectric constant, hardness, and flexibility. These deficiencies can severely affect the performance of the resulting optoelectronic devices. Poor adhesion properties of dielectric materials can also lead to breakage between the dielectric film and the substrate, significantly impacting subsequent processes. Therefore, continuous innovation and performance improvement of electronic packaging materials have always been a challenging and urgent problem to be solved in the optoelectronic industry. Summary of the Invention

[0003] The purpose of this invention is to provide a dielectric material with excellent comprehensive properties, including suitable viscosity, high light transmittance, low dielectric constant, and good flexibility.

[0004] According to one aspect of the present invention, a low dielectric constant material is provided, comprising: 25-50 parts by weight of fluorinated acrylate monomer, 1-5 parts by weight of polysilsesquioxane, 1-5 parts by weight of photoinitiator and other functional additives.

[0005] As a preferred technical solution, the functional additive is one or more of the following: 1-10 parts by weight of crosslinking agent, 5-20 parts by weight of viscosity modifier, 50-70 parts by weight of dispersant, 25-50 parts by weight of solubilizer, 0.01-0.5 parts by weight of surfactant, 0.01-0.5 parts by weight of leveling agent, 0.01-0.5 parts by weight of defoamer, and 0.01-0.5 parts by weight of adhesion promoter.

[0006] As a preferred technical solution, the fluorinated acrylate monomer can be represented by the following general formula I:

[0007] General Formula I

[0008]

[0009] Wherein, Ar1 is a C1-C8 alkane group with some or all hydrogen atoms replaced by fluorine atoms, a C1-C6 ether group with some or all hydrogen atoms replaced by fluorine atoms, and a C6-C ether group with some or all hydrogen atoms replaced by fluorine atoms. 15 Aromatic groups;

[0010] Ar2 is a C1-C4 alkane group;

[0011] a is a natural number between 1 and 4.

[0012] As a preferred technical solution, the Ar1 is selected from groups represented by the following general formula:

[0013]

[0014]

[0015] Each X in the above groups is independently H or F, and at least one X is F; * indicates a substitution site.

[0016] As a preferred technical solution, the Ar1 is selected from groups represented by the following general formula:

[0017]

[0018]

[0019] As a preferred technical solution, the polysilsesquioxane uses the general formula (R-SiO) 3 / 2 )n represents; where R is selected from hydrogen, hydroxyl, unsubstituted or fluorine-substituted C. 1-8 alkane group, C 1-4 alkoxy, C 3-8 olefin group, C 3-8 unsaturated ester group, C 6-15 The aromatic group; n is the degree of polymerization.

[0020] As a preferred technical solution, n is a natural number between 3 and 12.

[0021] As a preferred technical solution, the polysilsesquioxane includes, but is not limited to: hydrogen silsesquioxane, methyl silsesquioxane, propyl silsesquioxane, isooctyl silsesquioxane, trifluoropropyl silsesquioxane, vinyl silsesquioxane, phenyl silsesquioxane, acryloyloxypropyl silsesquioxane, and methacryloyloxypropyl silsesquioxane.

[0022] As a preferred technical solution, the photoinitiator is a free radical photoinitiator.

[0023] The free radical photoinitiators include, but are not limited to: benzoin photoinitiators, ketone photoinitiators, phosphine oxide photoinitiators, and peroxide photoinitiators. Examples of benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzoin dimethyl ether, and benzoin diethyl ether. Ketone compounds include: diphenyl ketone, 4-phenylbenzophenone, p-chlorobenzophenone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-2-methyl-1-[4-(tert-butyl)phenyl]-1-propanone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-(4-hydroxyethoxy)phenyl-1-propanone, polymer [2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone], bifunctional α-hydroxy ketone, 4,4'-bis(diethylamino)benzophenone, 2,2-dimethoxyacetophenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 2-isopropylthioxanthraphenone. Examples of phosphine oxide compounds include: (2,4,6-trimethylbenzoyl)diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and ethyl (2,4,6-trimethylbenzoyl)phenylphosphonate; examples of peroxide compounds include: tert-butyl peroxide, dicumyl peroxide, and dibenzoyl peroxide; examples of oxime ester compounds include: commercially available OXE-1 type photoinitiators, commercially available OXE-2 type photoinitiators, and commercially available OXE-2 type photoinitiators, etc.

[0024] As a preferred technical solution, the crosslinking agent is a multifunctional acrylate crosslinking agent.

[0025] As a preferred technical solution, the crosslinking agent is an acrylate crosslinking agent containing 2-6 (meth)acryloyloxy functional groups.

[0026] As a preferred technical solution, the crosslinking agent includes, but is not limited to: bisphenol A diacrylate, bisphenol A dimethacrylate, 2-(1-methylethylidene) bis(4,1-phenyleneoxy-2,1-ethylenedimethyl) acrylate, 4,4'-biphenyl diacrylate, 4,4'-biphenyl diisobutylene acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, 9,9-bis[4-(2-hydroxy-3-acryloyloxypropoxy)phenyl]fluorene, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, ethoxylated glycerol triacrylate, propoxylated glycerol triacrylate, tri(2-hydroxyethyl)isocyanurate triacrylate, pentaerythritol tetraacrylate, di(trimethylolpropane) tetraacrylate, polydipentaerythritol pentaacrylate, and polydipentaerythritol hexaacrylate.

[0027] As a preferred technical solution, the viscosity modifier is an unsubstituted C-type polymer, or a C-type polymer substituted with or unsubstituted with oxygen atoms, hydroxyl groups, or alkoxy groups. 1-15 Acrylic fatty esters.

[0028] As a preferred technical solution, the viscosity modifier includes, but is not limited to, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, isooctyl acrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, 1,4-butanediol diacrylate, hydroxyethyl acrylate, hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, tetrahydrofuran acrylate, hydroxyethyl acrylate, lauryl acrylate, 1-ethylcyclohexyl methacrylate, and 2-cyclohexyl methacrylate.

[0029] As a preferred technical solution, the dispersant is a solvent.

[0030] As a preferred technical solution, the dispersant is selected from one or a mixture of ester solvents, ether solvents, ketone solvents, or the like.

[0031] As a preferred technical solution, ester solvents include, but are not limited to: ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, ethylene glycol diacetate, 1,3-butanediol diacetate, 1,6-hexanol diacetate, and cyclohexanol acetate. Ether solvents include, but are not limited to: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether; ketone solvents include, but are not limited to: acetone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketone.

[0032] As a preferred technical solution, the solubilizer is an alcohol solvent.

[0033] As a preferred technical solution, the alcohol solvent includes, but is not limited to, one or a mixture of ethanol, isopropanol, propylene glycol, ethylene glycol isobutyl ether, and polyethylene glycol.

[0034] As a preferred technical solution, the alcohol solvents include, but are not limited to: ethanol, isopropanol, propylene glycol, ethylene glycol isobutyl ether, and polyethylene glycol PEG series, wherein the polyethylene glycol PEG series includes, but is not limited to: PEG200, PEG300, PEG400, PEG600, PEG800, and PEG1000.

[0035] As a preferred technical solution, the surfactant includes, but is not limited to, commercially available BYK-300, BYK301, BYK302, BYK333, BYK352, BYK358N, BYK361N, etc.

[0036] As a preferred technical solution, the defoamer includes, but is not limited to, commercially available BYK051, BYK052, and BYK066N.

[0037] As a preferred technical solution, the adhesion promoter is a silane compound.

[0038] As a preferred technical solution, the silane compounds include, but are not limited to, one or more of the following: bis[3-(triethoxysilyl)propyl]amine, 3-(isobutenoyloxy)propyltrimethoxysilane, and (3-mercaptopropyl)trimethoxysilane.

[0039] According to one aspect of the present invention, the present invention provides a method for preparing the above-mentioned low dielectric constant material, comprising the following steps:

[0040] 25-50 parts by weight of fluorinated acrylate monomer, 1-5 parts by weight of polysilsesquioxane, 1-5 parts by weight of photoinitiator and other functional additives are successively added to a reaction vessel and stirred at 25℃-60℃ for 4-8 hours to form a homogeneous and transparent solution, thereby preparing the low dielectric constant material.

[0041] As a preferred technical solution, the low dielectric constant material is prepared by coating, spraying, spin coating, injection, scraping, brushing, nanoimprinting, inkjet printing, screen printing or pad printing and then curing with ultraviolet light.

[0042] According to one aspect of the present invention, a display device is also provided, comprising: a substrate, an organic light-emitting device located on the substrate, and an encapsulation layer formed on the organic light-emitting device and the substrate, characterized in that the encapsulation layer contains the aforementioned low dielectric constant material.

[0043] As a preferred technical solution, the encapsulation layer comprises one or more inorganic layers and one or more organic layers stacked alternately, wherein at least one of the organic layers contains the aforementioned low dielectric constant material.

[0044] As a preferred technical solution, the encapsulation layer comprises one to two alternately stacked inorganic layers and one to two organic layers. The inorganic layers have a thickness of 0.5 μm to 1.5 μm and are made of one or more of SiNx and SiONx in alternating layers. The organic layers have a thickness of 4 μm to 30 μm, and at least one of the organic layers contains the aforementioned low dielectric constant material. The other organic layers are made of one or more of epoxy resin, acrylic resin, unsaturated polyester, polyimide resin, phenolic resin, polycarbonate, polystyrene, and hexamethyldisiloxane polymer.

[0045] The low dielectric constant material provided by this invention uses fluorinated acrylate as monomer and polysilsesquioxane with a large molar volume as main components. The binding effect of fluorine atoms on electrons significantly reduces the overall polarizability of the material. Fluorinated acrylates impart photocurable properties to the material. When combined with polysilsesquioxanes, which significantly reduce the porosity of the material, the low polarizability of the fluorinated acrylates effectively fills the gaps in the polysilsesquioxanes. With the addition of functional additives such as crosslinking agents, viscosity modifiers, solubilizers, leveling agents, and adhesion promoters, the low dielectric constant material provided by this invention not only exhibits a significant decrease in dielectric constant but also possesses excellent comprehensive properties such as viscosity, light transmittance, dielectric constant, flexibility, hardness, and flatness. It can be prepared using low-temperature processes such as coating, spraying, spin coating, injection molding, blade coating, brush coating, nanoimprinting, inkjet printing, screen printing, or pad printing. This avoids the problems associated with using polysilsesquioxanes alone, such as low dielectric constant but high activation energy, difficult preparation processes, and poor flatness due to large air gaps on the film surface. It also avoids the problem of excessively high dielectric constant when using fluorinated materials alone. It is a low-cost, mild-processing, and high-performance dielectric material with excellent overall performance, showing promising application prospects in flexible displays, chips, sensors, and other optoelectronic components. Detailed Implementation

[0046] It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the invention. Unless otherwise specified, specific conditions in the embodiments are performed under conventional conditions or conditions recommended by the manufacturer. Reagents or instruments used, unless otherwise specified, are all commercially available conventional products.

[0047] Example 1

[0048] 40 parts by weight of 2-(perfluorobutyl)ethyl methacrylate, 3 parts by weight of octapropyl cage-type silsesquioxane, 5 parts by weight of photoinitiator (2,4,6-trimethylbenzoyl)phenylphosphonate ethyl ester, 5 parts by weight of crosslinking agent tris(2-hydroxyethyl)isocyanurate triacrylate, 10 parts by weight of viscosity modifier hydroxyethyl acrylate, 0.05 parts by weight of commercially available surfactant BYK333, 20 parts by weight of PEG200 and 20 parts by weight of PEG400 as solubilizers are successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thereby preparing the low dielectric constant material.

[0049] The viscosity at 25℃ was measured to be 16.79 cps using an LV-SSR rotary viscometer. The surface tension at 25℃ was measured to be 21.1 dyne / cm using an automatic surface tension meter (BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 99.39% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be 1H using an LX-C hardness tester. The dielectric constant was measured to be 2.6 using an LCR meter and impedance analyzer.

[0050] Example 2

[0051] 40 parts by weight of 2-(perfluorobutyl)ethyl methacrylate, 3 parts by weight of trifluoropropyl silsesquioxane (CAS: 851814-19-2), 5 parts by weight of photoinitiator (2,4,6-trimethylbenzoyl)phenylphosphonate, 5 parts by weight of crosslinking agent tris(2-hydroxyethyl)isocyanurate triacrylate, 10 parts by weight of viscosity modifier hydroxyethyl acrylate, 0.05 parts by weight of commercially available surfactant BYK333, 20 parts by weight of PEG200, and 20 parts by weight of PEG400 as solubilizers are successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thereby preparing the low dielectric constant material.

[0052] The viscosity at 25℃ was measured to be 16.14 cps using an LV-SSR rotary viscometer. The surface tension at 25℃ was measured to be 20.3 dyne / cm using an automatic surface tension meter (BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 99.50% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be 1H using an LX-C hardness tester. The dielectric constant was measured to be 2.5 using an LCR meter and impedance analyzer.

[0053] Example 3

[0054] 30 parts by weight of 1,6-bis(acryloyloxy)-2,2,3,3,4,4,5,5-octafluorohexane, 5 parts by weight of alkenyl silsesquioxane (CAS: 69655-76-1), 2.5 parts by weight of photoinitiator polymer [2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]acetone], 10 parts by weight of crosslinking agent pentaerythritol tetraacrylate, 5 parts by weight of viscosity modifier tetrahydrofuran acrylate, 0.1 parts by weight of commercially available surfactant BYK358N, 0.1 parts by weight of commercially available defoamer BYK051, 12.5 parts by weight of ethylene glycol isobutyl ether, and 12.5 parts by weight of PEG300 as solubilizers were successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thus preparing the low dielectric constant material.

[0055] The viscosity at 25℃ was measured to be 19.61 cps using an LV-SSR rotary viscometer. The surface tension at 25℃ was measured to be 23.0 dyne / cm using an automatic surface tension meter (BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 98.97% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be 1H using an LX-C hardness tester. The dielectric constant was measured to be 2.6 using an LCR meter and impedance analyzer.

[0056] Example 4

[0057] 30 parts by weight of hexafluorobisphenol A diacrylate, 5 parts by weight of ladder-structured hydrogen silsesquioxane, 2.5 parts by weight of photoinitiator benzoin dimethyl ether, 10 parts by weight of crosslinking agent 2-(1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethylenedimethyl) ester, 5 parts by weight of viscosity modifier lauryl acrylate, 0.1 parts by weight of commercially available surfactant BYK358N, 0.1 parts by weight of adhesion promoter 3-(isobutenoyloxy)propyltrimethoxysilane, 12.5 parts by weight of isopropanol, and 12.5 parts by weight of PEG400 as solubilizers are successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thus preparing the low dielectric constant material.

[0058] The viscosity at 25℃ was measured to be 18.22 cps using an LV-SSR rotary viscometer. The surface tension at 25℃ was measured to be 28.7 dyne / cm using an automatic surface tension meter (BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 99.15% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be 1H using an LX-C hardness tester. The dielectric constant was measured to be 2.7 using an LCR meter and impedance analyzer.

[0059] Example 5

[0060] 50 parts by weight of octafluoropentyl acrylate, 2.5 parts by weight of methacryloyloxypropyl silsesquioxane (CAS: 160185-24-0), 5 parts by weight of photoinitiator benzoyl peroxide, 2 parts by weight of crosslinking agent di(trimethylolpropane)tetraacrylate, 5 parts by weight of viscosity modifier methyl methacrylate, 0.05 parts by weight of commercially available defoamer (model BYK052), 0.05 parts by weight of adhesion promoter bis[3-(triethoxysilyl)propyl]amine, and 35 parts by weight of PEG400 as solubilizers were successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thus preparing the low dielectric constant material.

[0061] The viscosity at 25℃ was measured to be 20.83 cps using a rotational viscometer (model LV-SSR). The surface tension at 25℃ was measured to be 21.5 dyne / cm using an automatic surface tension meter (model BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 98.83% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be 1H using an LX-C hardness tester. The dielectric constant was measured to be 2.6 using an LCR meter and impedance analyzer.

[0062] Example 6

[0063] 50 parts by weight of octafluoropentyl acrylate, 2.5 parts by weight of trifluoropropyl silsesquioxane (CAS: 851814-19-2), 5 parts by weight of photoinitiator benzoyl peroxide, 2 parts by weight of crosslinking agent di(trimethylolpropane)tetraacrylate, 5 parts by weight of viscosity modifier methyl methacrylate, 0.05 parts by weight of commercially available defoamer (model BYK052), 0.05 parts by weight of adhesion promoter bis[3-(triethoxysilyl)propyl]amine, and 35 parts by weight of PEG400 as solubilizers were successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thus preparing the low dielectric constant material.

[0064] The viscosity at 25℃ was measured to be 19.40 cps using an LV-SSR rotary viscometer. The surface tension at 25℃ was measured to be 19.6 dyne / cm using an automatic surface tension meter (BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 99.06% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be 1H using an LX-C hardness tester. The dielectric constant was measured to be 2.5 using an LCR meter and impedance analyzer.

[0065] Comparative Example 1

[0066] 40 parts by weight of 2-(perfluorobutyl)ethyl methacrylate, 5 parts by weight of photoinitiator (2,4,6-trimethylbenzoyl)phenylphosphonate ethyl ester, 5 parts by weight of crosslinking agent tris(2-hydroxyethyl) isocyanurate triacrylate, 10 parts by weight of viscosity modifier hydroxyethyl acrylate, 0.05 parts by weight of commercially available surfactant BYK333, 20 parts by weight of PEG200 and 20 parts by weight of PEG400 as solubilizers are successively added to a reaction vessel and stirred at 25°C for 8 hours to form a homogeneous and transparent solution, thereby preparing the low dielectric constant material.

[0067] The viscosity at 25℃ was measured to be 10.14 cps using a rotational viscometer (model LV-SSR). The surface tension at 25℃ was measured to be 16.5 dyne / cm using an automatic surface tension meter (model BZY-101). The transmittance of a 5μm thick film formed after UV curing was measured to be 98.11% using a UV-5500 UV-Vis spectrophotometer. The hardness of a 5μm thick film formed after UV curing was measured to be less than 1H using an LX-C hardness tester. The dielectric constant was measured to be 3.8 using an LCR meter and impedance analyzer.

[0068] It can be seen that the low dielectric constant material provided by this invention significantly reduces the overall polarizability and porosity of the material due to the electron-binding effect of fluorinated acrylate and the large molar volume of polysilsesquioxane. In particular, the fluorinated acrylate and fluorinated polysilsesquioxane significantly reduce the dielectric constant of the material. At the same time, it has excellent comprehensive properties such as viscosity, light transmittance, dielectric constant, flexibility, hardness, and flatness. It is a dielectric material with low production cost, mild preparation process, and excellent comprehensive performance.

[0069] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combining the various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. A low dielectric constant material, characterized by, It comprises: 25-50 parts by weight of fluorinated acrylate monomer, 1-5 parts by weight of polysilsesquioxane, 1-5 parts by weight of photoinitiator and functional additives; wherein the polysilsesquioxane is of the general formula (R-SiO2). 3 / 2 )n represents; where R is selected from hydrogen, hydroxyl, unsubstituted or fluorine atom C. 1-8 alkane group, C 1-4 alkoxy, C 3-8 olefin group, C 3-8 unsaturated ester group, C 6-15 An aromatic group; n is the degree of polymerization; The functional additives include 1-10 parts by weight of a crosslinking agent and 5-20 parts by weight of a viscosity modifier; The functional additives also include one or more of the following: 50-70 parts by weight of dispersant, 25-50 parts by weight of solubilizer, 0.01-0.5 parts by weight of surfactant, 0.01-0.5 parts by weight of leveling agent, 0.01-0.5 parts by weight of defoamer, or 0.01-0.5 parts by weight of adhesion promoter; The crosslinking agent is a multifunctional acrylate crosslinking agent; The viscosity modifier is an unsubstituted or substituted C 3-15 fatty ester of acrylic acid; The dispersant is selected from one or a mixture of ester solvents, ether solvents, ketone solvents; The solubilizer is an alcohol-based solvent; The adhesion promoter is selected from one or more of bis[3-(triethoxysilyl)propyl]amine, 3-(isobutenoyloxy)propyltrimethoxysilane, and (3-mercaptopropyl)trimethoxysilane.

2. The low dielectric constant material of claim 1 wherein, The fluorinated acrylate monomer is represented by the following general formula I: General Formula I Wherein, Ar1 is a C1-C8 alkane group with some or all hydrogen atoms replaced by fluorine atoms, a C1-C6 ether group with some or all hydrogen atoms replaced by fluorine atoms, and a C6-C ether group with some or all hydrogen atoms replaced by fluorine atoms. 15 Aromatic groups; Ar2 is a C1-C4 alkane group; a can be 1, 2, 3, or 4.

3. The low dielectric constant material of claim 2 wherein, The Ar1 is selected from groups represented by the following general formula: 、 、 ； Each X in each group is independently either H or F, and at least one X is F; * indicates a substitution site.

4. The low dielectric constant material of claim 1 wherein, The polysilsesquioxane is selected from hydrogen silsesquioxane, methyl silsesquioxane, propyl silsesquioxane, isooctyl silsesquioxane, trifluoropropyl silsesquioxane, vinyl silsesquioxane, phenyl silsesquioxane, acryloyloxypropyl silsesquioxane, and methacryloyloxypropyl silsesquioxane.

5. The low dielectric constant material of claim 1 wherein, The photoinitiator is a free radical photoinitiator.

6. A display device comprising: A substrate, an organic light-emitting device located on the substrate, and an encapsulation layer encapsulating the organic light-emitting device and the substrate, characterized in that the material of the encapsulation layer contains a material obtained by photocuring the low dielectric constant material according to any one of claims 1-5.

7. The display device according to claim 6, wherein The encapsulation layer comprises alternating stacked inorganic and organic layers, wherein the number of alternating inorganic layers and the number of alternating organic layers are each at least one, and at least one organic layer contains a material obtained by photocuring the low dielectric constant material according to any one of claims 1-5.

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