Supporting mechanism and display module

Abstract

The application discloses a supporting mechanism and a display module. The supporting mechanism comprises a bending area and a non-bending area located at least on one side of the bending area. The supporting mechanism comprises a supporting plate, a conductive layer and conductive particles. The supporting plate is located in the bending area and the non-bending area. The supporting plate comprises a first surface and a second surface arranged oppositely. The conductive layer is located on the first surface of the supporting plate and in the non-bending area. At least part of the at least one opening in the first surface of the supporting plate is located in the bending area. The opening is filled with the conductive particles. The conductive particles are electrically connected with the conductive layer. In this way, the application can reduce electrostatic interference, thereby improving the display effect of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a support mechanism and display module. Background Technology

[0002] Currently, display panels inevitably suffer from the hazards of electrostatic electric fields (ESD) and electrostatic currents during production and transportation. The failure manifestations of ESD hazards are mainly divided into two types: sudden failure and latent failure. The applicant of this application discovered that latent failure caused by ESD may lead to problems such as dead pixels and brightness loss in display panels, affecting the product quality of the display panels. Summary of the Invention

[0003] The main technical problem this application addresses is to provide a support mechanism and display module that can reduce electrostatic interference, thereby improving the display effect of the display module.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a support mechanism, including a bending area and a non-bending area located at least on one side of the bending area, the support mechanism comprising: a support plate located in the bending area and the non-bending area, the support plate including a first surface and a second surface disposed opposite to each other; a conductive layer located on one side of the first surface of the support plate and located in the non-bending area; wherein, the first surface of the support plate is provided with at least one opening, at least a portion of the at least one opening is located in the bending area, the opening is filled with conductive particles, and the conductive particles are electrically connected to the conductive layer.

[0005] Wherein, a portion of the at least one opening is located in the non-bending region, the orthographic projection of the conductive layer on the support plate overlaps with the opening located in the non-bending region, and the opening located in the non-bending region and the opening located in the bending region are connected by a groove, the groove being filled with the conductive particles, and the conductive particles in the groove being electrically connected to the conductive particles in the opening; preferably, the orthographic projection of the conductive layer on the support plate covers the opening located in the non-bending region.

[0006] The depth of the groove is less than the depth of the opening; preferably, the depth of the groove ranges from 100 nanometers to 1 micrometer.

[0007] The support mechanism further includes an antistatic layer disposed on one side of the first surface of the support plate and at least in the bending area, connecting the support plate and the conductive layer, and the conductive particles in the opening are electrically connected to the conductive layer via the antistatic layer.

[0008] The antistatic layer is made of conductive nanoparticles; preferably, the conductive nanoparticles include at least one of metal nanoparticles and carbon nanotubes.

[0009] Wherein, the antistatic layer extends from the first surface of the support plate, through the side of the conductive layer, to the surface of the conductive layer opposite to the support plate; preferably, the orthographic projection of the antistatic layer on the support plate covers the orthographic projection of the conductive layer on the support plate; preferably, the orthographic projection of the antistatic layer on the support plate covers the support plate.

[0010] Wherein, the at least one opening is evenly distributed on the support plate; preferably, the at least one opening is arranged in an array; preferably, the opening is a blind hole, or the opening is a through hole penetrating the support plate; preferably, the opening is a circular opening; preferably, the radius of the opening is in the range of 1 to 10 micrometers.

[0011] The conductive particles include at least one of metal and carbon nanotubes.

[0012] The support plate is in contact with the conductive layer; preferably, the material of the support plate includes carbon fiber; preferably, the conductive layer includes copper foil; preferably, the non-bending area is located on both sides of the bending area.

[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a display module, including a support mechanism as described in any of the above claims and a display panel, wherein the display panel is located on one side of the second surface of the support plate and is supported by the support plate.

[0014] The beneficial effects of this application are as follows: Unlike the prior art, the bending area of ​​the support plate in this application is provided with an opening, and conductive particles are filled in the opening. The conductive particles are electrically connected to the conductive layer located on the first surface of the support plate. Thus, the static electricity accumulated in the bending area of ​​the support plate can be transferred to the conductive layer through the conductive particles in the opening and finally discharged through the conductive layer. This can prevent static electricity from accumulating in the bending area of ​​the support plate and ultimately reduce the display abnormality of the display module caused by static electricity accumulation. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0016] Figure 1 This is a schematic diagram of one embodiment of the supporting structure of this application;

[0017] Figure 2 This is a schematic diagram of the structure of one embodiment of the support plate of this application;

[0018] Figure 3 This is a schematic diagram of another embodiment of the supporting structure of this application;

[0019] Figure 4 This is a schematic diagram of another embodiment of the supporting structure of this application;

[0020] Figure 5 This is a schematic diagram of another embodiment of the supporting structure of this application;

[0021] Figure 6 This is a schematic diagram of another embodiment of the supporting structure of this application;

[0022] Figure 7 This is a schematic diagram of one embodiment of the display module of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0024] See Figure 1 The support mechanism 100 includes a bending area 11 and a non-bending area 12 located at least on one side of the bending area 11. The non-bending area 12 may be located on only one side of the bending area 11 or on both sides of the bending area 11. The support mechanism 100 includes a support plate 1, a conductive layer 2, and conductive particles 3.

[0025] The support plate 1 is located in the bending area 11 and the non-bending area 12. The support plate 1 includes a first surface 1a and a second surface 1b arranged opposite to each other. Specifically, the support plate 1 plays a major supporting role in the support mechanism 100. When the support mechanism 100 supports the display panel, the support plate 1 is used to provide support for the display panel, which is specifically a flexible display panel.

[0026] The conductive layer 2 is located on one side of the first surface 1a of the support plate 1, and is located in the non-bending area 12. Specifically, the conductive layer 2 is disposed in the non-bending area 12 to discharge static electricity. The fact that the conductive layer 2 is disposed in the non-bending area 12 and not in the bending area 11 can avoid the poor bending performance of the conductive layer 2 from affecting the bending performance of the entire support mechanism 100.

[0027] The support plate 1 has at least one opening 13 on its first surface 1a. At least a portion of the opening 13 is located in the bending area 11. The opening 13 is filled with conductive particles 3, which are electrically connected to the conductive layer 2. Specifically, all openings 13 may be located in the bending area 11, or only some openings 13 may be located in the bending area 11. The openings 13 are filled with conductive particles 3, which are electrically connected to the conductive layer 2. Through the conductive particles 3 in the openings 13, static electricity in the bending area 11 of the support plate 1 can be transferred to the conductive layer 2 and ultimately discharged through the conductive layer 2. This prevents static electricity from accumulating in the bending area 11 of the support plate 1, thus mitigating display abnormalities caused by static electricity accumulation when the support mechanism 100 supports the display panel.

[0028] See Figure 1 and Figure 2 In one embodiment, at least one portion of the opening 13 is located in the non-bending region 12. Specifically, a portion of one opening 13 may be located in the non-bending region 12 and another portion in the bending region 11. Alternatively, a number of openings 13 may be located in the bending region 11, while the remaining openings 13 may be located in the non-bending region 12.

[0029] Meanwhile, the orthographic projection of the conductive layer 2 on the support plate 1 overlaps with the opening 13 located in the non-bending area 12, and the opening 13 located in the non-bending area 12 and the opening 13 located in the bending area 11 are connected by the groove 14. The groove 14 is filled with conductive particles 3, and the conductive particles 3 in the groove 14 are electrically connected to the conductive particles 3 in the opening 13. Specifically, the conductive particles 3 in the opening 13 of the non-bending area 12 are electrically connected to the conductive layer 2. At the same time, because the conductive particles 3 in the opening 13 of the bending area 11 and the conductive particles 3 in the opening 13 of the non-bending area 12 are electrically connected through the conductive particles 3 in the groove 14, it is possible to electrically connect the conductive particles 3 in the opening 13 of the bending area 11 to the conductive layer 2. At this time, when the static electricity on the bending area 11 of the support plate 1 is released, the static electricity is transferred through the conductive particles 3 in the opening 13 of the bending area 11 and the conductive particles 3 in the groove 14 to the conductive particles 3 in the opening 13 of the non-bending area 12, and finally to the conductive layer 2.

[0030] Furthermore, in one embodiment, the orthographic projection of the conductive layer 2 onto the support plate 1 covers the opening 13 located in the non-bending area 12. Specifically, this arrangement can increase the contact area between the conductive particles 3 and the conductive layer 2, thereby improving the antistatic effect.

[0031] Of course, in other embodiments, the orthographic projection of the conductive layer 2 on the support plate 1 may only cover the portion of the opening 13 located in the non-bending area 12.

[0032] In one embodiment, the depth of the groove 14 is less than the depth of the opening 13. This arrangement facilitates the fabrication of the groove 14 while saving material for the conductive particles 3 filling the groove 14. Further, the depth of the groove 14 ranges from 100 nanometers to 1 micrometer. For example, the depth of the groove 14 can be 100 nanometers, 300 nanometers, 500 nanometers, 700 nanometers, or 1 micrometer.

[0033] In other embodiments, the depth of the groove 14 may be greater than or equal to the depth of the opening 13. This application does not limit the depth of the groove 14.

[0034] See Figure 3 In one embodiment, the support mechanism 100 further includes an antistatic layer 4. The antistatic layer 4 is disposed on one side of the first surface 1a of the support plate 1 and is located at least in the bending area 11, connecting the support plate 1 and the conductive layer 2, and the conductive particles 3 in the opening 13 are electrically connected to the conductive layer 2 through the antistatic layer 4.

[0035] Specifically, the antistatic layer 4 is at least partially located in the bending area 11. Within the bending area 11, the antistatic layer 4 is electrically connected to the conductive particles 3 in the opening 13, and at the same time, the antistatic layer 4 is electrically connected to the conductive layer 2, thus achieving the electrical connection between the conductive particles 3 and the conductive layer 2. At this time, the static electricity accumulated in the bending area 11 of the support plate 1 passes through the conductive particles 3 and the antistatic layer 4 in sequence to reach the conductive layer 2, and is finally discharged through the conductive layer 2.

[0036] In one embodiment, the material of the antistatic layer 4 includes conductive nanoparticles. In another embodiment, the conductive nanoparticles include at least one of a metal and carbon nanotubes, and the material of the antistatic layer 4 includes one or more of metal nanoparticles and carbon nanotubes. For example, the material of the antistatic layer 4 may include at least one conductive metal selected from silver, gold, zinc, copper, and aluminum. During preparation, the antistatic layer 4 can be formed by spraying.

[0037] In other embodiments, the antistatic layer 4 may also be made of other conductive materials, such as conductive organic materials, or conductive oxides including zinc oxide, indium tin oxide, copper oxide, iron oxide, etc. This application does not limit the material of the antistatic layer 4.

[0038] In one embodiment, see Figure 4 and Figure 5 The antistatic layer 4 extends from the first surface 1a of the support plate 1, through the side of the conductive layer 2, to the surface of the conductive layer 2 facing away from the support plate 1. Specifically, this arrangement ensures the contact area between the antistatic layer 4 and the conductive layer 2, thus ensuring the electrical connection between them. Of course, in other embodiments, the antistatic layer 4 may not extend to the surface of the conductive layer 2 facing away from the support plate 1 (e.g., ...). Figure 3As shown in the figure, in short, as long as the antistatic layer 4 is connected to both the support plate 1 and the conductive layer 2, it is sufficient.

[0039] In one application scenario, refer to Figure 1 and Figure 5 The orthographic projection of the antistatic layer 4 on the support plate 1 covers the orthographic projection of the conductive layer 2 on the support plate 1. In other words, the antistatic layer 4 completely covers the conductive layer 2 located on the support plate 1.

[0040] In one application scenario, refer to Figure 5 The orthographic projection of the antistatic layer 4 onto the support plate 1 covers the support plate 1. In other words, the antistatic layer 4 completely covers the support plate 1, which can further ensure the static electricity discharge effect.

[0041] Of course, in other application scenarios, the orthographic projection of the antistatic layer 4 on the support plate 1 can only cover part of the orthographic projection of the conductive layer 2 on the support plate 1, or the orthographic projection of the antistatic layer 4 on the support plate 1 can only cover part of the support plate 1.

[0042] In one embodiment, see Figure 2 At least one opening 13 is evenly distributed on the support plate 1. Specifically, when the support plate 1 has one opening 13, the opening 13 is located at the center of the bending area 11 of the support plate 1. When there are two or more openings 13, the spacing between the openings 13 is equal. On the one hand, this can ensure the static electricity discharge effect, and on the other hand, it can prevent the openings 13 from being too concentrated and affecting the strength of the support plate 1.

[0043] In one embodiment, see Figure 2 At least one opening 13 is arranged in an array, that is, multiple openings 13 on the support plate 1 are arranged in multiple rows and columns.

[0044] Of course, in other embodiments, the openings 13 on the support plate 1 may also be non-uniformly distributed. This application does not limit the distribution of the openings 13.

[0045] See Figure 6 In one embodiment, the opening 13 is a blind hole, or, see [reference] Figure 1 In another embodiment, the opening 13 is a through hole that penetrates the support plate 1. That is, the depth of the opening 13 can be the thickness of the support plate 1 or less than the thickness of the support plate 1. This application does not limit the depth of the opening 13.

[0046] In one embodiment, the opening 13 is a circular opening 13. Of course, in other embodiments, the opening 13 can also be a square, a triangle or other shapes. This application does not limit the shape of the opening 13.

[0047] In one embodiment, the radius of the opening 13 ranges from 1 to 10 micrometers, for example. The radius of the opening 13 can be 1 micrometer, 2.5 micrometers, 5 micrometers, 7.5 micrometers, or 10 micrometers, etc.

[0048] In one embodiment, the conductive particles 3 include at least one of a metal and carbon nanotubes. That is, the conductive particles 3 can be made of a metal, carbon nanotubes, or a mixture of metal and carbon nanotubes. This application does not limit the material of the conductive particles 3.

[0049] In other embodiments, the conductive particles 3 may also be conductive metal oxides.

[0050] In one embodiment, the support plate 1 is in contact with the conductive layer 2, which allows static electricity accumulated in the non-bending area 12 of the support plate 1 to be discharged through the conductive layer 2. In other embodiments, the support plate 1 and the conductive layer 2 may also be in a non-contact connection; for example, a conductive film layer may be added between the support plate 1 and the conductive layer 2.

[0051] In an application scenario, such as Figure 1 , Figure 3 as well as Figure 4 As shown, the orthographic projection of conductive layer 2 onto the support plate covers the entire non-bending area, ensuring the elimination of static electricity accumulated in the entire non-bending area. Of course, in other application scenarios, such as... Figure 5 As shown, the orthographic projection of conductive layer 2 onto the support plate can also cover only the non-bending area.

[0052] In one embodiment, the material of the support plate 1 includes carbon fiber, a novel fiber material with a carbon content of over 95%, characterized by high strength and high modulus. Its stiffness is 7-10 times that of steel, and its density is one-quarter that of steel. It is a microcrystalline graphite material obtained by carbonization and graphitization of organic fibers such as sheet-like graphite microcrystals stacked along the fiber axis. Carbon fiber is "flexible on the outside but rigid on the inside," lighter than aluminum but stronger than steel, and possesses corrosion resistance and high modulus. It not only has the inherent properties of carbon materials but also combines the softness and processability of textile fibers, making it a new generation of reinforcing fibers.

[0053] In one embodiment, the conductive layer 2 includes copper foil, which has good conductivity and high mechanical strength. Specifically, the copper foil is distributed in segments on one side of the support plate 1, mainly located in the non-bending area 12.

[0054] In one embodiment, see Figure 1 The non-bending area 12 is located on both sides of the bending area 11. In practical applications, the two-fold design of the non-bending area 12 on both sides of the bending area 11 makes it convenient for users to use.

[0055] See Figure 7 This application also provides a display module 200 including a support mechanism 100 as described in any of the above embodiments and a display panel 210, wherein the display panel 210 is located on one side of the second surface 1b of the support plate 1 and is supported by the support plate 1.

[0056] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A support mechanism, characterized in that, The support mechanism includes a bending area and a non-bending area located at least on one side of the bending area. A support plate is located in the bending area and the non-bending area, and the support plate includes a first surface and a second surface disposed opposite to each other. A conductive layer is located on one side of the first surface of the support plate and in the non-bending area; The first surface of the support plate has at least one opening, at least a portion of which is located in the bending region. The opening is filled with conductive particles, which are electrically connected to the conductive layer. A portion of the opening is located in the non-bending region. The orthographic projection of the conductive layer on the support plate overlaps with the opening in the non-bending region. The opening in the non-bending region and the opening in the bending region are connected by a groove filled with the conductive particles. The conductive particles in the groove are electrically connected to the conductive particles in the opening.

2. The support mechanism according to claim 1, characterized in that, The orthographic projection of the conductive layer on the support plate covers the opening located in the non-bending area.

3. The support mechanism according to claim 2, characterized in that, The depth of the groove is less than the depth of the opening.

4. The support mechanism according to claim 3, characterized in that, The depth of the groove ranges from 100 nanometers to 1 micrometer.

5. The support mechanism according to claim 1, characterized in that, The support mechanism also includes: An antistatic layer is disposed on one side of the first surface of the support plate and at least in the bending area, connecting the support plate and the conductive layer, and the conductive particles in the opening are electrically connected to the conductive layer through the antistatic layer.

6. The support mechanism according to claim 5, characterized in that, The antistatic layer is made of conductive nanoparticles.

7. The support mechanism according to claim 6, characterized in that, The conductive nanoparticles include at least one of metal nanoparticles and carbon nanotubes.

8. The support mechanism according to claim 5, characterized in that, The antistatic layer extends from the first surface of the support plate, through the side of the conductive layer, to the surface of the conductive layer opposite to the support plate.

9. The support mechanism according to claim 8, characterized in that, The orthographic projection of the antistatic layer on the support plate covers the orthographic projection of the conductive layer on the support plate.

10. The support mechanism according to claim 8, characterized in that, The antistatic layer is projected onto the support plate and covers the support plate.

11. The support mechanism according to claim 1, characterized in that, The at least one opening is evenly distributed on the support plate.

12. The support mechanism according to claim 11, characterized in that, The at least one opening is arranged in an array.

13. The support mechanism according to claim 11, characterized in that, The opening is either a blind hole or a through hole penetrating the support plate.

14. The support mechanism according to claim 11, characterized in that, The opening is a circular opening.

15. The support mechanism according to claim 11, characterized in that, The radius of the opening ranges from 1 to 10 micrometers.

16. The support mechanism according to claim 1, characterized in that, The conductive particles include at least one of metal and carbon nanotubes.

17. The support mechanism according to claim 1, characterized in that, The support plate is in contact with the conductive layer.

18. The support mechanism according to claim 17, characterized in that, The material of the support plate includes carbon fiber.

19. The support mechanism according to claim 17, characterized in that, The conductive layer includes copper foil.

20. The support mechanism according to claim 17, characterized in that, The non-bending area is located on both sides of the bending area.

21. A display module, characterized in that, It includes a display panel and a support mechanism as described in any one of claims 1 to 20, wherein the display panel is located on one side of the second surface of the support plate and is supported by the support plate.

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