A large-size circuit board up / down drilling alignment method

Abstract

The application discloses a large-size circuit board up / down drilling alignment method, which comprises the following steps: according to an up / down program, CCD alignment holes and correction holes are designed, and inner layer patterns of the circuit board are processed; after the inner layer patterns of the circuit board are processed, the circuit board is laminated, and the CCD alignment holes of the up / down program are drilled; the correction holes are drilled after the CCD alignment holes are grabbed; after the correction holes are punched, all holes of the circuit board are drilled through the up / down program of a drilling machine; and outer layer pattern transfer processing and solder mask follow-up processing of the circuit board are carried out, so that the problem that actual holes and designed holes do not match during up / down drilling of the large-size circuit board is solved.

Description

TECHNICAL FIELD

[0001] The application relates to a large-size circuit board up / down drilling alignment method and belongs to the technical field of PCB manufacturing. BACKGROUND

[0002] With the demand for expansion of switches and supercomputers, circuit boards develop in the direction of large size, and existing drilling machines cannot drill all the holes in the board at one time, so the up / down method is needed, but in actual manufacturing, the actual hole position at the up / down intersection does not match the designed hole position, resulting in the problem of hole breakage of the circuit board after outer layer pattern transfer. SUMMARY

[0003] The application aims to overcome the defects in the prior art and provide a large-size circuit board up / down drilling alignment method to solve the problem of mismatch between the actual hole position and the designed hole position when a large-size circuit board is up / down drilled.

[0004] To achieve the above-mentioned purpose, the technical scheme adopted by the application is as follows:

[0005] The application provides a large-size circuit board up / down drilling alignment method, which comprises the following steps:

[0006] The inner layer pattern of the circuit board is processed according to the up / down program designed CCD alignment hole and correction hole;

[0007] The circuit board after inner layer pattern processing is pressed to drill the CCD alignment hole of the up / down program;

[0008] The correction hole is drilled after the CCD alignment hole is drilled, and all the holes of the circuit board are drilled through the up / down program of the drilling machine;

[0009] The outer layer pattern transfer processing and the subsequent processing of the solder mask are performed on the circuit board.

[0010] Further, the processing of the inner layer pattern of the circuit board comprises: designing the CCD alignment hole and the correction hole on the inner layer pattern, and the distance between the farthest outer auxiliary edge of the board and the upper edge or the lower edge of the CCD alignment hole does not exceed the CCD moving range of the drilling machine.

[0011] Further, drilling all the holes of the circuit board through the up / down program of the drilling machine comprises:

[0012] If the unimportant hole position in the circuit board is above the center line of the circuit board, the up program only contains the unimportant hole position, the coverage area is set as a small area program, and the remaining program is the down program, which is set as a large area program.

[0013] If the unimportant hole position in the circuit board is below the center line of the circuit board, the down program only contains the unimportant hole position, the coverage area is set as a small area program, and the remaining program is the up program, which is set as a large area program.

[0014] Further, the large area program working range exceeds half of the circuit board area, and does not exceed the working table range of the drilling machine; and the small area program working range does not exceed half of the circuit board area.

[0015] Further, all the holes of the circuit board include the inboard holes and the outboard auxiliary four corner holes.

[0016] Further, the distance between the up hole in the down program and the lower edge of the outboard auxiliary edge does not exceed the working table range of the drilling machine; and the distance between the down hole in the up program and the upper edge of the outboard auxiliary edge does not exceed the working table range of the drilling machine.

[0017] Further, the outer layer pattern transfer processing of the circuit board includes that the up program drills two outer layer exposure alignment holes above the outboard auxiliary edge, and the down program drills two outer layer exposure alignment holes below the outboard auxiliary edge.

[0018] Compared with the prior art, the present application has the following beneficial effects:

[0019] The present application takes the circuit board center as the center origin of the up / down drilling program, and sets two programs as a large one and a small one, wherein the CCD program head and the correction hole of the small program are kept coincident with the large program, so that the hole positions drilled by the two programs are the same, and the problem of non-matching hole positions at the up / down drilling interface is solved.

[0020] The large size circuit board up / down drilling alignment method provided by the present application can include all the hole positions in the important area in the circuit board into a single program, and maximally guarantees the hole positions; and the program area size can be flexibly adjusted according to the area size of the important hole positions in the circuit board, effectively solves the alignment problem between the up and the down, and improves the existing fixed and rigid mode. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a large size circuit board up / down drilling alignment method flow chart provided by the embodiment of the present application;

[0022] Figure 2 is a printed circuit board structure schematic diagram provided by the embodiment of the present application;

[0023] Figure 3 is a printed circuit board structure schematic diagram after four up / down programs are punched out by the CCD alignment hole provided by the embodiment of the present application;

[0024] Figure 4is a up program schematic diagram provided by the embodiment of the present application;

[0025] Figure 5 is a down program schematic diagram provided by the embodiment of the present application;

[0026] Figure 6 is a up & down program schematic diagram provided by the embodiment of the present application. DETAILED DESCRIPTION

[0027] The present application is further described below in conjunction with the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and cannot be used to limit the protection scope of the present application.

[0028] As Figure 1 shown, it is a up / down drilling alignment method flow chart of large-size circuit board of the present application, Figure 2 is a printed circuit board structure schematic diagram provided by the embodiment of the present application.

[0029] Specifically includes the following steps:

[0030] Step 1. Design the corresponding data of up / down according to the data of the circuit board;

[0031] Step 2. Inner layer processing procedure;

[0032] Step 3. Normal pressing processing procedure;

[0033] Step 4. Use X-ray machine, drill four CCD holes corresponding to the inner layer pad pattern of the board edge according to the target shooting method;

[0034] Step 5. Use up / down method when drilling, grab the CCD alignment hole, and after confirming the expansion and contraction through the correction hole, drill the inner hole of the board and the four corner holes of the auxiliary edge outside the board (the data outside the board);

[0035] Step 6. Electroplating processing procedure;

[0036] Step 7. Outer layer pattern transfer processing procedure;

[0037] Step 8. Solder mask and subsequent procedures.

[0038] Referring to Figures 2-6 shown, the present application provides a up / down drilling alignment method of large-size circuit board, taking the non-important hole position above the auxiliary edge outside the board as an example, the specific implementation process of the above steps is as follows:

[0039] The data design in step 1 specifically includes:

[0040] 1a. With the center point of the board as the center, design four circular pads on the inner layer board outside data within the range of the drilling machine CCD capture, which are used as the CCD alignment holes for the up / down program when drilling, wherein the upper two circular pads are within the CCD movement range of the drilling machine table from the lower edge of the board outside auxiliary edge, and the lower two circular pads are within the CCD movement range of the drilling machine table from the upper edge of the board outside auxiliary edge.

[0041] 1b. Increase the inner layer data at the four corners of the board within the up / down program range, which are used as the correction holes for the up / down program when drilling; note that the upper two correction holes in the down program are within the worktable size of the drilling machine table from the lower edge of the board outside auxiliary edge, and the lower two correction holes in the up program are within the worktable size of the drilling machine table from the upper edge of the board outside auxiliary edge.

[0042] In step 4, use the X-ray machine table to drill the four holes corresponding to the inner layer pad pattern at the board edge according to the target hitting mode, that is, the CCD alignment holes for drilling.

[0043] In step 5, use the drilling machine with a CCD lens, and the up / down program is based on the four holes drilled in step 4 corresponding to the inner layer pad pattern at the board edge as the alignment holes, so that the up / down program hole position and the shrinkage are consistent; through the inner layer pad data at the four corners of the board within the up / down program range as the correction holes, confirm that there is no error, and then drill all the holes in the board.

[0044] In the implementation process, if the unimportant hole position in the circuit board is above the center line of the circuit board, the up program only contains the unimportant hole position, the coverage area is relatively small, and it is set as a small area program, and the remaining program is the down program, which is set as a large area program; if the unimportant hole position in the circuit board is below the center line of the circuit board, the down program only contains the unimportant hole position, the coverage area is relatively small, and it is set as a small area program, and the remaining program is the up program, which is set as a large area program.

[0045] The up program drills two outer layer pattern exposure alignment holes above the board outside auxiliary edge, and the down program drills two outer layer exposure alignment holes below the board outside auxiliary edge.

[0046] In step 7, the exposure alignment holes need to use the up / down program in step 5 to drill four alignment holes above and below the board outside auxiliary edge, so that the drilling program and the outer layer exposure data shrinkage value are consistent, and the matching degree of the pattern and the hole is guaranteed.

[0047] The application provides a new up / down drilling system and method, taking the center of the plate as the center origin of the up / down drilling program, and setting two programs as a large one and a small one, so that the CCD program head of the small program and the correction hole keep coinciding with the large program, thereby ensuring that the holes drilled by the two programs are as same as the holes drilled by the large program, and effectively solving the problem that the outer pattern holes are damaged due to the mismatch of the holes at the joint after the large-size up / down drilling.

[0048] The above only describes the preferred embodiments of the present application, and in the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. For those skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as within the scope of protection of the present application.

Claims

1. A method for aligning up / down drilling holes on a large-size circuit board, comprising the following steps: Based on the up / down program, design the CCD alignment holes and correction holes, and process the inner layer pattern of the circuit board; The circuit board with the inner layer pattern is laminated, and the CCD alignment holes for the up / down process are drilled. After drilling the alignment holes for the CCD, drill all the holes on the circuit board using the up / down program of the drilling machine, including: If an unimportant hole is located above the center line of the circuit board, the up program only includes the unimportant hole, and the coverage area is set to a small area program. The remaining program is the down program, which is set to a large area program. If an unimportant hole is located below the center line of the circuit board, the down program only includes the unimportant hole, and the coverage area is set to a small area program. The remaining program is the up program, which is set to a large area program. Processing of outer layer pattern transfer on circuit boards and subsequent solder mask processing.

2. The method for aligning up / down drilling holes in a large-size circuit board according to claim 1, characterized in that, Processing the inner layer pattern of the circuit board includes: designing CCD alignment holes and correction holes in the inner layer pattern, wherein the distance between the CCD alignment holes and the outer auxiliary edge of the board that is furthest from the top or bottom edge does not exceed the CCD movement range of the drilling machine.

3. The method for aligning up / down drilling holes in a large-size circuit board according to claim 1, characterized in that, The working range of the large-area program exceeds half the area of ​​the circuit board but does not exceed the working surface of the drilling machine; the working range of the small-area program does not exceed half the area of ​​the circuit board.

4. The method for aligning up / down drilling holes in a large-size circuit board according to claim 1, characterized in that, All holes on the circuit board include internal holes and four corner holes on the outer auxiliary edges.

5. The method for aligning up / down drilling holes on a large-size circuit board according to claim 1, characterized in that, In the down program, the distance between the upper calibration hole and the lower edge of the outer auxiliary edge of the plate shall not exceed the working surface of the drilling machine; in the up program, the distance between the lower calibration hole and the upper edge of the outer auxiliary edge of the plate shall not exceed the working surface of the drilling machine.

6. The method for aligning up / down drilling holes on a large-size circuit board according to claim 1, characterized in that, The outer layer pattern transfer process of the circuit board includes: the UP program drills two outer layer exposure matching holes above the auxiliary edge of the outer board, and the down program drills two outer layer exposure matching holes below the auxiliary edge of the outer board.

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