A wafer-level aging test device

Abstract

The present invention provides a wafer-level aging test device, which relates to the technical field of wafer aging test. A wafer-level aging test fixture is arranged below a top plate assembly and is connected to the top plate assembly. The wafer-level aging test fixture includes a cover plate assembly and a lower sealing cover. The lower sealing cover is connected to the cover plate assembly to form a test cavity for placing wafers. The lifting mechanism is arranged to extend and retract up and down in a controlled manner. The lifting mechanism is movably abutted against the wafer-level aging test fixture to drive the lower sealing assembly to move upward and connect to the cover plate assembly to form a test cavity. The floating mechanism is arranged to float when the cover plate assembly is squeezed by the lower sealing cover, thereby avoiding deformation of the cover plate assembly. The present invention arranges a floating mechanism to float when the cover plate assembly is squeezed by the lower sealing cover, thereby avoiding deformation of the cover plate assembly under pressure, improving the stability of the contact between the test probe and the wafer, and thus improving the accuracy of the wafer-level aging test.

Description

Technical Field

[0001] The invention relates to the technical field of wafer-level aging testing, and in particular to a wafer-level aging testing device. Background Art

[0002] In the field of wafer-level aging test, it is necessary to place the wafer in a sealed test chamber for high-pressure and high-temperature tests. In the prior art, the PCB board is generally directly connected to the lower sealing cover to form a sealed test chamber, and then the lower sealing cover is subjected to high-pressure and high-temperature tests. The technical solution for high-temperature and high-pressure tests on the wafer in the lower sealing cover is generally to drive the PCB board and the lower sealing cover to descend to a position that cooperates with the heating device, so as to perform a high-temperature test on the lower sealing cover. This solution does not cause the PCB board to be over-pressed. However, due to the large area of ​​the 8-inch wafer during the wafer-level aging test, it is easy to curl and deform under high-temperature and high-pressure environments, which affects the wafer-level aging test results. Therefore, a better fixing method is needed, such as separating the PCB board and the lower sealing cover, and fixing them by upper and lower pressing, which can press the wafer and avoid curling and deformation of the wafer, but this is not done in the prior art. In this way, if the PCB board is over-pressed during the pressing process, it will be deformed, and the test probe will be in virtual contact or poor contact with the wafer, which will cause test errors. Summary of the invention

[0003] An object of the present invention is to provide a wafer-level aging test device for improving the accuracy of wafer aging test.

[0004] A further object of the present invention is to optimize the structure of a wafer-level aging test device.

[0005] In particular, the present invention provides a wafer-level aging test device, comprising:

[0006] A mounting bracket includes a top plate assembly and a bottom plate assembly, wherein the top plate assembly and the bottom plate assembly are connected by pillars;

[0007] A wafer-level aging test fixture is arranged below the top plate assembly and connected to the top plate assembly. The wafer-level aging test fixture comprises a cover plate assembly and a lower sealing assembly. The lower sealing assembly comprises a lower sealing cover. The lower sealing cover is connected to the cover plate assembly to form a test cavity for placing wafers. The cover plate assembly has a test needle holder.

[0008] A lifting mechanism is installed on the bottom plate assembly, the lifting mechanism is configured to be controllably extended and retracted up and down, and the lifting mechanism is movably abutted against the wafer-level aging test fixture to drive the lower sealing assembly to move upward and connect with the cover plate assembly to form the test chamber;

[0009] A floating mechanism is arranged at the top plate assembly, and the floating mechanism is arranged to float when the cover plate assembly is squeezed by the lower sealing cover, so as to avoid deformation of the cover plate assembly.

[0010] Optionally, the top plate assembly comprises an upper cover plate and a lower cover plate, the lower cover plate has a limiting groove, and the floating mechanism comprises:

[0011] A floating plate, arranged on the top of the cover plate assembly and located at the limiting groove, the floating plate protruding from the bottom of the lower cover plate;

[0012] The telescopic assembly is connected to the upper cover plate, and the bottom is connected to or abuts against the floating plate, so that when the floating plate is squeezed by the cover plate assembly, the floating plate is compressed to move upward.

[0013] Optionally, the cover assembly includes a first PCB board and the test needle holder installed below the first PCB board;

[0014] The floating plate is circular and is arranged opposite to the test needle seat.

[0015] Optionally, a size of the floating plate is larger than a size of the test needle seat and smaller than a size of the lower sealing cover.

[0016] Optionally, at least one first mounting groove is provided at the bottom of the upper cover plate, at least one second mounting groove is provided at the top of the floating plate, each second mounting groove corresponds to one first mounting groove, and the telescopic assembly includes:

[0017] At least one elastic member, each of the elastic members is correspondingly arranged in one of the first mounting groove and the second mounting groove.

[0018] Optionally, there are a plurality of elastic members, and the plurality of elastic members are evenly arranged on the top of the floating plate.

[0019] Optionally, the mounting bracket further includes:

[0020] A pair of slide grooves are connected to the lower cover plate, any one of the slide grooves extends in the horizontal direction, and two ends of the cover plate assembly are respectively slidably connected to the corresponding slide grooves.

[0021] Optionally, the wafer-level aging test fixture further includes a heat sink and a heating device, the heat sink and the heating device are located in the test cavity, and the lifting mechanism includes:

[0022] The electrical component comprises a second PCB board, wherein the top of the second PCB board has a pad position for supplying power to the heating device and the heat sink so as to perform a wafer-level aging test on the wafer.

[0023] Optionally, the lifting mechanism further includes:

[0024] A lifting assembly, wherein the electrical assembly is arranged at the free end of the lifting assembly, and the lifting assembly is used to drive the electrical assembly to move upward so that the pad position cooperates with the lower sealing cover and drives the lower sealing cover to move upward until it is connected with the cover plate assembly to form the test cavity.

[0025] Optionally, the lifting assembly includes:

[0026] A plurality of turbine worm components, respectively connected to the electrical components;

[0027] The motor is connected to the plurality of worm gear assemblies to drive the plurality of worm gear assemblies to drive the electrical assembly to move up and down.

[0028] According to the solution of the present invention, a floating mechanism is provided at the top plate assembly of the mounting bracket, and the floating mechanism is configured to float when the cover plate assembly is squeezed by the lower sealing cover, thereby avoiding compression deformation of the cover plate assembly and ensuring that the test probe on the cover plate assembly contacts the wafer, thereby improving the contact stability and thus improving the accuracy of the wafer-level aging test.

[0029] Furthermore, in the process of lifting and lowering of the lifting mechanism, the present invention utilizes the Pad on the top of the second PCB board of the electrical component to cooperate with the lower sealing cover to power the heating device and the heat sink, thereby realizing high-voltage and high-temperature testing of the wafer. This is equivalent to the lifting mechanism realizing the lifting to press the wafer, and providing the lower sealing cover with testing conditions for the wafer, thereby optimizing the structure of the wafer-level aging test device.

[0030] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0032] Figure 1 is a schematic structural diagram of a wafer-level aging test device according to an embodiment of the present invention;

[0033] Figure 2 yes Figure 1 A schematic cross-sectional view of a floating mechanism and a top plate assembly in the wafer aging test equipment shown;

[0034] Figure 3 yes Figure 2A schematic enlarged view of part A;

[0035] Figure 4 yes Figure 1 A schematic structural diagram of a lower cover plate in the wafer-level aging test device shown;

[0036] Figure 5 yes Figure 1 A schematic installation diagram of a floating plate and a lower cover plate in the wafer-level aging test device shown;

[0037] Figure 6 yes Figure 1 A schematic structural diagram of an upper cover plate in the wafer-level aging test device shown;

[0038] Figure 7 yes Figure 1 The schematic structural diagram of the lifting mechanism in the wafer-level aging test device is shown.

[0039] Reference numerals:

[0040] 100-wafer level aging test device, 10-mounting bracket, 20-cover assembly, 30-lower sealing cover, 40-lifting mechanism, 50-camera device, 60-floating mechanism, 70-slide, 11-top plate assembly, 12-bottom plate assembly, 13-pillar, 41-electrical assembly, 42-lifting assembly, 111-lower cover, 112-upper cover, 113-first mounting groove, 114-limiting groove, 21-test needle holder, 22-first PCB board, 61-floating plate, 63-telescopic assembly, 631-elastic member, 632-connecting rod, 62-second mounting groove, 411-second PCB board, 412-pad position, 421-motor, 422-turbine worm assembly. DETAILED DESCRIPTION

[0041] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0042] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0044] Unless otherwise clearly defined and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0045] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0046] Figure 1 is a schematic structural diagram of a wafer-level aging test device 100 according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic cross-sectional view of the floating mechanism 60 and the top plate assembly 11 in the wafer-level aging test device 100 is shown. Figure 3 yes Figure 2 A schematic enlarged view of part A in the figure. Figure 4 yes Figure 1 FIG. 1 is a schematic structural diagram of the lower cover plate 111 in the wafer-level aging test device 100. Figures 1 to 4As shown, in this embodiment, the wafer-level aging test device 100 includes a mounting bracket 10, a wafer-level aging test fixture, a lifting mechanism 40 and a floating mechanism 60, wherein the mounting bracket 10 includes a top plate assembly 11 and a bottom plate assembly 12, and the top plate assembly 11 and the bottom plate assembly 12 are connected by a pillar 13. The wafer-level aging test fixture is arranged below the top plate assembly 11 and connected to the top plate assembly 11. The wafer-level aging test fixture includes a cover plate assembly 20 and a lower sealing assembly. The lower sealing assembly includes a lower sealing cover 30. The lower sealing cover 30 is connected to the cover plate assembly 20 to form a test cavity for placing wafers. The cover plate assembly 20 has a test needle seat 21. The lifting mechanism 40 is installed on the bottom plate assembly 12 and is located below the lower sealing cover 30. The lifting mechanism 40 is configured to be controlled to extend and retract up and down. The lifting mechanism 40 is in active contact with the wafer-level aging test fixture to drive the lower sealing assembly to move upward and connect with the cover plate assembly 20 to form a test cavity. The floating mechanism 60 is disposed at the top plate assembly 11 . The floating mechanism 60 is configured to float when the cover plate assembly 20 is squeezed by the lower sealing cover 30 , thereby preventing the cover plate assembly 20 from being deformed.

[0047] This embodiment sets a floating mechanism 60 at the top plate assembly 11 of the mounting bracket 10. The floating mechanism 60 is configured to float when the cover plate assembly 20 is squeezed by the lower sealing cover 30, thereby avoiding compression and deformation of the cover plate assembly 20. It can ensure that the test probe on the cover plate assembly 20 contacts the wafer, improve the contact stability, and thus improve the accuracy of the wafer-level aging test.

[0048] In this embodiment, the top plate assembly 11 includes an upper cover plate 112 and a lower cover plate 111, the lower cover plate 111 has a limiting groove 114, and the floating mechanism 60 includes a floating plate 61 and a telescopic assembly 63, wherein the floating plate 61 is arranged on the top of the cover plate assembly 20 and is located at the limiting groove 114, and the floating plate 61 protrudes from the bottom of the lower cover plate 111. The telescopic assembly 63 is connected to the upper cover plate 112, and the bottom is connected or abutted to the floating plate 61, so that when the floating plate 61 is squeezed by the cover plate assembly 20, it is compressed to make the floating plate 61 move upward, thereby preventing the cover plate assembly 20 from being deformed by pressure and affecting the aging test of the wafer.

[0049] In this embodiment, the cover assembly 20 includes a first PCB board 22 and a test needle holder 21 installed below the first PCB board 22. This embodiment is mainly to prevent the first PCB board 22 from being deformed by pressure, because the first PCB board 22 is connected to the test needle holder 21, and the test needle holder 21 is provided with a plurality of test probes, so the deformation of the first PCB board 22 is avoided, and the movement of the test probes can be avoided to cause poor contact. In addition, the floating mechanism 60 provided in this embodiment can also prevent the test probes from being damaged due to excessive force, thereby increasing the service life of the test probes.

[0050] See also Figure 3 The floating plate 61 is connected to the lower cover plate 111 and has a gap with the upper cover plate 112. When the floating plate 61 is subjected to a large pressure, the floating plate 61 can move in this gap. That is to say, this gap is the moving stroke of the floating plate 61. The moving stroke of the floating plate 61 can be designed according to design requirements.

[0051] In this embodiment, the floating plate 61 is circular and arranged opposite to the test needle holder 21. Because the lower sealing cover 30 needs to seal the test needle holder 21 inside the lower sealing cover 30 when it moves upward to contact the cover assembly 20, it is mainly in contact with the periphery of the test needle holder 21, and the force of the cover assembly 20 is mainly near the test needle holder 21. Therefore, in this embodiment, the floating plate 61 is arranged opposite to the test needle holder 21, so as to better prevent the first PCB board 22 from being squeezed and deformed.

[0052] In a preferred embodiment, the size of the floating plate 61 is larger than the size of the test needle holder 21 and smaller than the size of the lower sealing cover 30. In other embodiments, the size of the floating plate 61 can also be set according to specific design requirements, for example, set to be larger than the size of the lower sealing cover 30.

[0053] Figure 5 yes Figure 1 The schematic installation diagram of the floating plate 61 and the lower cover plate 111 in the wafer-level aging test device 100 is shown in FIG. Figure 6 yes Figure 1 FIG. 1 is a schematic structural diagram of the upper cover plate 112 in the wafer-level aging test device 100. Figure 5 and Figure 6 As shown, and see Figure 3 In this embodiment, at least one first mounting groove 113 is provided at the bottom of the upper cover plate 112, at least one second mounting groove 62 is provided at the top of the floating plate 61, each second mounting groove 62 corresponds to a first mounting groove 113, and the telescopic assembly 63 includes at least one elastic member 631, and each elastic member 631 is correspondingly arranged in a first mounting groove 113 and a second mounting groove 62. Here, each elastic member 631 is inserted into a connecting rod 632, and the connecting rod 632 is connected to the upper cover plate 112.

[0054] In a preferred embodiment, the number of elastic members 631 is multiple, and the multiple elastic members 631 are evenly arranged on the top of the floating plate 61. It can be understood that the number of the first mounting grooves 113 and the second mounting grooves 62 are both multiple, and the multiple first mounting grooves 113 are evenly arranged at positions corresponding to the floating plate 61, and the multiple second mounting grooves 62 are evenly arranged on the floating plate 61, so that the first PCB board 22 of the cover assembly 20 is evenly stressed, and local deformation of the first PCB board 22 is avoided.

[0055] In this embodiment, the mounting bracket 10 further includes a pair of slide grooves 70, which are connected to the lower cover plate 111, and any one of the slide grooves 70 extends in the horizontal direction, and both ends of the cover plate assembly 20 are respectively slidably connected to the corresponding slide grooves 70. It can be understood that the cover plate assembly 20 can be taken out from the top plate assembly 11, and the corresponding cover plate assembly 20 can be replaced for different types of wafers, which facilitates the replacement of the cover plate assembly 20, improves the convenience of wafer-level aging testing, and also facilitates the replacement of the test needle disk on the cover plate assembly 20.

[0056] In this embodiment, the wafer-level aging test device 100 further includes a camera device 50 mounted on the mounting bracket 10 for detecting whether the first PCB board 22 is connected to form a test cavity when the lower sealing cover 30 abuts against the cover assembly 20 .

[0057] Figure 7 yes Figure 1 The schematic structural diagram of the powered ventilation device in the wafer-level aging test device is shown in FIG. Figure 7 As shown, and see Figure 1 In this embodiment, the wafer-level aging test fixture also includes a heat sink and a heating device, which are located in the test chamber. The lifting mechanism 40 includes an electrical component 41, and the electrical component 41 includes a second PCB board 411. The top of the second PCB board 411 has a Pad position 412 for powering the heat sink and the heating device to perform a wafer-level aging test on the wafer.

[0058] In this embodiment, the lifting mechanism 40 also includes a lifting assembly 42 connected to the electrical assembly 41. The electrical assembly 41 is arranged at the free end of the lifting assembly 42. The lifting assembly 42 is used to drive the electrical assembly 41 to move upward so that the Pad position 412 cooperates with the lower sealing cover 30 and drives the lower sealing cover 30 to move upward until it is abutted and connected with the cover assembly 20 to form a test cavity.

[0059] In this embodiment, during the lifting process of the lifting mechanism 40, the Pad on the top of the second PCB board 411 of the electrical component 41 cooperates with the lower sealing cover 30 to power the heating device and the heat sink, thereby realizing high-voltage and high-temperature testing of the wafer. This is equivalent to the lifting mechanism 40 achieving both rising to press the wafer and providing testing conditions for the wafer in the lower sealing cover 30, thereby optimizing the structure of the wafer-level aging test device 100.

[0060] In this embodiment, the lifting assembly 42 includes a plurality of worm gear assemblies 422 and a motor 421. The plurality of worm gear assemblies 422 are respectively connected to the electrical assembly 41, and the motor 421 is connected to the plurality of worm gear assemblies 422 to drive the plurality of worm gear assemblies 422 to drive the electrical assembly 41 to move up and down. In other embodiments, the lifting assembly 42 may also use other components, such as a cylinder.

[0061] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A wafer-level aging test device, characterized in that: include: A mounting bracket includes a top plate assembly and a bottom plate assembly, wherein the top plate assembly and the bottom plate assembly are connected by pillars; A wafer-level aging test fixture is arranged below the top plate assembly and connected to the top plate assembly. The wafer-level aging test fixture includes a cover plate assembly and a lower sealing assembly. The lower sealing assembly includes a lower sealing cover. The lower sealing cover is connected to the cover plate assembly to form a test cavity for placing wafers. The cover plate assembly has a test needle holder and a first PCB board. The test needle holder is installed below the first PCB board. A lifting mechanism is installed on the bottom plate assembly, the lifting mechanism is configured to be controllably extended and retracted up and down, and the lifting mechanism is movably abutted against the wafer-level aging test fixture to drive the lower sealing assembly to move upward and connect with the cover plate assembly to form the test chamber; A floating mechanism is arranged at the top plate assembly, and the floating mechanism is arranged to float when the cover plate assembly is squeezed by the lower sealing cover, so as to avoid deformation of the first PCB board; The wafer-level aging test fixture further includes a heat sink and a heating device, wherein the heat sink and the heating device are located in the test cavity, and the lifting mechanism includes: The electrical component comprises a second PCB board, wherein the top of the second PCB board has a pad position for supplying power to the heating device and the heat sink so as to perform a wafer-level aging test on the wafer.

2. The wafer-level aging test device according to claim 1, characterized in that: The top plate assembly comprises an upper cover plate and a lower cover plate, the lower cover plate has a limiting groove, and the floating mechanism comprises: A floating plate, arranged on the top of the cover plate assembly and located at the limiting groove, the floating plate protruding from the bottom of the lower cover plate; The telescopic assembly is connected to the upper cover plate, and the bottom is connected to or abuts against the floating plate, so that when the floating plate is squeezed by the cover plate assembly, the floating plate is compressed to move upward.

3. The wafer-level aging test device according to claim 2, characterized in that: The floating plate is circular and is arranged opposite to the test needle seat.

4. The wafer-level aging test device according to claim 3, characterized in that: The size of the floating plate is larger than that of the test needle seat and smaller than that of the lower sealing cover.

5. The wafer-level aging test device according to claim 4, characterized in that: The bottom of the upper cover plate is provided with at least one first mounting groove, the top of the floating plate is provided with at least one second mounting groove, each of the second mounting grooves corresponds to one of the first mounting grooves, and the telescopic assembly includes: At least one elastic member, each of the elastic members is correspondingly arranged in one of the first mounting groove and the second mounting groove.

6. The wafer-level aging test device according to claim 5, characterized in that: There are multiple elastic members, and the multiple elastic members are evenly arranged on the top of the floating plate.

7. The wafer-level aging test device according to claim 6, characterized in that: The mounting bracket also includes: A pair of slide grooves are connected to the lower cover plate, any one of the slide grooves extends in the horizontal direction, and two ends of the cover plate assembly are respectively slidably connected to the corresponding slide grooves.

8. The wafer-level aging test device according to claim 7, characterized in that: The lifting mechanism also includes: A lifting assembly, wherein the electrical assembly is arranged at the free end of the lifting assembly, and the lifting assembly is used to drive the electrical assembly to move upward so that the pad position cooperates with the lower sealing cover and drives the lower sealing cover to move upward until it is connected with the cover plate assembly to form the test cavity.

9. The wafer-level aging test device according to claim 8, characterized in that: The lifting assembly comprises: A plurality of turbine worm components, respectively connected to the electrical components; The motor is connected to the plurality of worm gear assemblies to drive the plurality of worm gear assemblies to drive the electrical assembly to move up and down.

Images