Preparation Method of Photovoltaic Backsheet and Photovoltaic Backsheet

Abstract

This application relates to a preparation method of a photovoltaic backsheet and a photovoltaic backsheet. The preparation method of the photovoltaic backsheet includes: mixing an organosilane polymer and a curing agent evenly according to a preset ratio to form a polymer ceramic slurry; coating the polymer ceramic slurry on a backsheet body. The photovoltaic backsheet is prepared by the above preparation method of the photovoltaic backsheet. In the above preparation method of the photovoltaic backsheet, the organosilane polymer and the curing agent are mixed evenly according to a preset ratio, and after being mixed evenly, a polymer ceramic slurry can be formed. The polymer ceramic slurry is sealed under vacuum. The polymer ceramic slurry prepared by mixing has a high flash point. The polymer ceramic slurry is coated on the backsheet body of the photovoltaic backsheet, so as to form a ceramic film on the surface of the backsheet body. The ceramic film has a high flash point, which improves the heat resistance of the photovoltaic backsheet. When self-heating spots, circuit short circuits or external fire sources occur, problems such as melting and dripping of the photovoltaic backsheet are reduced.

Description

Technical Field

[0001] This application relates to the technical field of solar cells, and particularly to a method for preparing a photovoltaic backsheet and a photovoltaic backsheet. Background Art

[0002] Photovoltaic backsheets (solar cell backsheets) are widely used in photovoltaic (solar cell) modules. Located on the back of solar cells, they play a role in protecting and supporting the cell wafers, and have reliable insulation, water resistance, and aging resistance. In related technologies, single-glass modules are usually selected for photovoltaic backsheets. Single-glass modules are widely used in household and industrial and commercial distributed applications, mostly concentrated in urban areas and industrial intensive areas. Once self-heating spots, circuit short circuits, or external fire sources occur, there is a risk of module combustion. Once a fire breaks out, the organic backsheet of the module's back encapsulation material is extremely likely to melt and drip, further causing the fire to spread. Summary of the Invention

[0003] Based on this, in view of the problem of the heat resistance of photovoltaic backsheets, it is necessary to provide a method for preparing a photovoltaic backsheet and a photovoltaic backsheet.

[0004] A method for preparing a photovoltaic backsheet, the method for preparing the photovoltaic backsheet includes:

[0005] Mix an organosilane polymer and a curing agent in a preset ratio and mix them evenly to form a polymer ceramic slurry;

[0006] Vacuum seal the polymer ceramic slurry.

[0007] In the above method for preparing a photovoltaic backsheet, the organosilane polymer and the curing agent are mixed in a preset ratio. After being mixed evenly, a polymer ceramic slurry can be formed. The polymer ceramic slurry is vacuum sealed. The mixed polymer ceramic slurry has a high flash point. Coating the polymer ceramic slurry on the backsheet body of the photovoltaic backsheet can form a ceramic film on the surface of the backsheet body. The ceramic film has a high flash point, which improves the heat resistance of the photovoltaic backsheet. When self-heating spots, circuit short circuits, or external fire sources occur, it reduces problems such as melting and dripping of the photovoltaic backsheet.

[0008] In one embodiment, when mixing the organosilane polymer and the curing agent:

[0009] Place the organosilane polymer in an inert gas and stir;

[0010] Under the protection of the inert gas, add the curing agent to the organosilane polymer;

[0011] Continue to stir until the curing agent is completely dissolved in the organosilane polymer.

[0012] In one embodiment, the organosilane polymer is selected from one of polysilazane, polysiloxane or polycarbosilane.

[0013] In one embodiment, the curing agent is selected as an ultraviolet curing agent.

[0014] In one embodiment, the organosilane polymer material and the ultraviolet curing agent are mixed in a ratio of 1 wt% - 10 wt%.

[0015] In one embodiment, the curing agent is selected as a thermal curing agent.

[0016] In one embodiment, the organosilane polymer material and the thermal curing agent are mixed in a ratio of 2 wt% - 5 wt%.

[0017] In one embodiment, when the organosilane polymer and the curing agent are mixed evenly in a preset ratio to form a polymer ceramic slurry, the temperature of the organosilane polymer is maintained between 70 - 85 °C.

[0018] In one embodiment, after using the ultraviolet curing agent in the curing agent to prepare the polymer ceramic slurry, the following steps are included:

[0019] The backplane body coated with the polymer ceramic slurry is placed in an ultraviolet curing box for curing, and the curing time can be selected as 2 - 10 min.

[0020] In one embodiment, after using the thermal curing agent in the curing agent to prepare the polymer ceramic slurry, the following steps are included:

[0021] The backplane body coated with the polymer ceramic slurry is placed in a baking oven for thermal curing, the curing temperature is 150 - 200 °C, and the curing time is 120 - 240 min.

[0022] This application also provides a photovoltaic backplane, and the photovoltaic backplane is prepared by the preparation method of the photovoltaic backplane described in any one of the above.

[0023] For the above photovoltaic backplane, the photovoltaic backplane is prepared by the preparation method of the photovoltaic backplane, that is, the photovoltaic backplane includes a backplane body and a ceramic film provided on the backplane body. The ignition point of the ceramic film is high, which improves the heat resistance of the photovoltaic backplane. When self - heating spots, circuit short - circuits or external fire sources occur, problems such as melting and dripping of the photovoltaic backplane are reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a working flow chart of the preparation method of the photovoltaic backplane provided by this application.

[0025] Figure 2 Structural schematic diagram of the photovoltaic backplane provided by this application.

[0026] Figure 3 X-ray diffraction pattern of the ceramic film after high-temperature sintering provided by this application.

[0027] Figure 4 TGA weight loss curve of the ceramic film provided by this application.

[0028] In the figure:

[0029] 100, ceramic film;

[0030] 200, backplane body. Detailed implementation manners

[0031] To make the above objects, features, and advantages of this application more obvious and understandable, the following will describe the detailed implementation manners of this application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of this application. Therefore, this application is not limited by the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] In addition, if terms such as "first" and "second" appear, these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0034] In this application, unless otherwise clearly defined and limited, if terms such as "installed", "connected", "linked", "fixed", etc. appear, these terms shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] In this application, unless otherwise clearly defined and limited, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0036] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0037] Solar power generation (i.e., photovoltaic power generation), as an important part of meeting green and environmentally friendly renewable energy, has been widely accepted in the global energy market, and the installed capacity of photovoltaic modules for global photovoltaic power generation has been expanding rapidly with an annual increment of more than 100 GW.

[0038] Photovoltaic backsheets (solar cell backsheets) are widely used in photovoltaic (solar cell) modules, located on the back of solar cells, playing a role in protecting and supporting the cell wafers, and having reliable insulation, water resistance, and aging resistance. Mainstream photovoltaic modules usually consist of high-transparency glass, front encapsulant film, crystalline silicon cell strings, back encapsulant film, and back encapsulation materials. If the back encapsulation materials use glass, it is a double-glass module; if they use organic backsheets, it is a single-glass module. Single-glass modules are widely used in household and industrial and commercial distributed systems, mostly concentrated in urban areas and industrial-intensive areas. Once there are self-heating spots, circuit short circuits, or external fire sources, there is a risk of module combustion. Once a fire occurs, the organic backsheets of the back encapsulation materials of the modules are extremely prone to problems such as melting and dripping, further causing the spread of the fire.

[0039] To this end, in view of the problem that the photovoltaic backplane is prone to melting and dripping when encountering fire, which leads to the expansion of the fire, the present invention coats the outer surface of the photovoltaic backplane with a polymer ceramic slurry. This type of coating can utilize the high-temperature curing and sintering characteristics of polymer ceramics (PDC). In the case of high temperature when encountering fire, instead of melting and dripping, it undergoes a sintering reaction to form a dense polymer ceramic film (PDCf), effectively absorbing heat and blocking the further impact of organic molten droplets on the environment.

[0040] Furthermore, the present application provides a preparation method for a photovoltaic backplane, as Figure 1 and Figure 2 shown, the preparation method of the photovoltaic backplane includes:

[0041] Select an organosilane polymer and a curing agent;

[0042] Mix the organosilane polymer and the curing agent evenly according to a preset ratio to form a polymer ceramic slurry;

[0043] Coat the polymer ceramic slurry on the backplane body.

[0044] In the above preparation method of the photovoltaic backplane, the organosilane polymer and the curing agent are mixed according to a preset ratio. After being mixed evenly, a polymer ceramic slurry can be formed, and the polymer ceramic slurry is sealed under vacuum. The mixed polymer ceramic slurry has a high flash point. The polymer ceramic slurry is coated on the backplane body 200 of the photovoltaic backplane, so as to form a ceramic film 100 on the surface of the backplane body 200. The ceramic film 100 has a high flash point, which also improves the heat resistance of the photovoltaic backplane. When self-heating spots, circuit short circuits or external fire sources occur, problems such as melting and dripping of the photovoltaic backplane are reduced.

[0045] Specifically, when mixing the organosilane polymer and the curing agent in the preparation method of the photovoltaic backplane of the present application:

[0046] Place the organosilane polymer in an inert gas and stir;

[0047] Under the protection of the inert gas, add the curing agent to the organosilane polymer;

[0048] Continue to stir until the curing agent is completely dissolved in the organosilane polymer.

[0049] Select an inert gas. First, place the organosilane polymer in the inert gas and stir it evenly. Then, under the protection of the inert gas, continue to add the curing agent and stir again until the organosilane polymer and the curing agent are evenly mixed, and then the polymer ceramic slurry can be prepared. The polymer ceramic slurry is stored under vacuum. When coating is required, the polymer ceramic slurry is coated on the body of the photovoltaic backplane. The mixing and stirring of the organosilane polymer and the curing agent are carried out under the protection of the inert gas because the inert gas will not react with the materials and will not affect the composition of multiple materials in the mixture. Therefore, it can effectively protect the integrity of the mixed polymer ceramic slurry.

[0050] More specifically, the inert gas can be selected from helium, neon, argon, krypton, xenon, and radon, and any one of them can be chosen.

[0051] Further, when the organosilane polymer and the curing agent are mixed evenly in a preset ratio to form the polymer ceramic slurry, the temperature of the organosilane polymer is maintained between 70 - 85 °C. By limiting the temperature of the organosilane polymer when it is mixed with the curing agent, that is, by limiting the temperature during production and preparation, the prepared polymer ceramic slurry can meet the operation requirements.

[0052] It should be noted that the organosilane polymer and the curing agent used in this application do not need to be specially made and are conventional commercial products. The polymer ceramic slurry can use the organosilane polymer and the curing agent as needed.

[0053] Further, the organosilane polymer is selected from one of polysilazane (SiCN), polysiloxane (SiCO), or polycarbosilane (SiC). The organosilane polymer refers to an organosilicon polymer whose molecular structure contains silicon elements and organic functional groups are connected to the silicon atoms. In actual production operations, there are many types of organosilane polymers. Just select a suitable organosilane polymer according to production costs, production efficiency, production environment, etc. For example, one of polysilazane (SiCN), polysiloxane (SiCO), or polycarbosilane (SiC) can be selected.

[0054] It should be noted that because the chemical structural formula of the material is not unique, the expressions in the parentheses of polysilazane (SiCN), polysiloxane (SiCO), or polycarbosilane (SiC) are common abbreviations of materials in this field and are not the relevant chemical structural formulas of the materials. The common chemical formula structure of polysilazane is (SiN)x, the common chemical formula structure of polysiloxane is (R2SiO)x, and the common chemical formula structure of polycarbosilane is SiC(SiH3)2n.

[0055] In some embodiments, the curing agent is selected as an ultraviolet (UV) curing agent. The UV curing agent is also known as UV curing and ultraviolet curing agent. Curing refers to the process in which a substance transforms from a low-molecular weight to a high-molecular weight. The UV curing agent is added to the organosilane polymer, and the UV curing agent and the organosilane polymer are mixed in a preset ratio. After being stirred evenly, the polymer ceramic slurry can be prepared.

[0056] Specifically, the UV curing agent can be an acylphosphine oxide initiator (Irgacure 819), a benzoin-based initiator (benzoin dimethyl ether), etc.

[0057] More specifically, the organosilane polymer material and the UV curing agent are mixed in a ratio of 1 wt% - 10 wt%. By limiting the mixing ratio of the organosilane polymer material and the UV curing agent, the polymer ceramic slurry that meets the preset requirements can be prepared after being evenly mixed.

[0058] In summary, the working process of preparing the polymer ceramic slurry from the organosilane polymer and the UV curing agent includes:

[0059] Add the organosilane polymer to a vacuum reactor. The organosilane polymer can be polysilazane (SiCN), polysiloxane (SiCO), polycarbosilane (SiC), etc.; place the organosilane polymer in an inert gas (such as nitrogen, argon, etc.) and stir. Under gas protection, add the UV curing agent to the organosilane polymer. The UV curing agent can be an acylphosphine oxide initiator (Irgacure 819), a benzoin-based initiator (benzoin dimethyl ether), etc. The mixing ratio of the organosilane polymer and the UV curing agent is 1 wt% - 10 wt%; fully mix the organosilane polymer and the UV curing agent under nitrogen protection until the UV curing agent is completely dissolved in the organosilane polymer. During the entire stirring, adding, and dissolving process, keep the temperature of the organosilane polymer in the container between 70 - 85 °C. Finally, evacuate and seal the prepared polymer ceramic slurry for future use.

[0060] In some embodiments, the curing agent is selected as a thermal curing agent. A thermal curing agent refers to a substance that can initiate a polymerization reaction at a certain temperature. The thermal curing agent is added to the organosilane polymer, and the thermal curing agent and the organosilane polymer are mixed in a preset ratio. After being stirred evenly, the polymer ceramic slurry can be prepared.

[0061] Specifically, dicumyl peroxide (DP) can be selected as the thermal curing agent.

[0062] It should be noted that since the chemical structural formula of the material is not unique, the expression in the parentheses of dicumyl peroxide (DP) is a common abbreviation of the material in this field and is not the relevant chemical structural formula of the material. The common chemical formula structure of dicumyl peroxide is C18 H 22 O₂。

[0063] Specifically, the organosilane polymer material and the thermal curing agent are mixed in a ratio of 2 wt% - 5 wt%. By limiting the mixing ratio of the organosilane polymer material and the thermal curing agent, a polymer ceramic slurry meeting the preset requirements can be prepared after uniform mixing.

[0064] In summary, the working process of preparing the polymer ceramic slurry from the organosilane polymer and the thermal curing agent includes:

[0065] Add the organosilane polymer into a vacuum reactor. The organosilane polymer can be polysilazane (SiCN), polysiloxane (SiCO), polycarbosilane (SiC), etc.; place the organosilane polymer in an inert atmosphere (such as nitrogen, argon, etc.) and stir it, and add the thermal curing agent to the organosilane polymer under gas protection. The thermal curing agent is preferably dicumyl peroxide (DP), and the addition ratio is 2 wt% - 5 wt%; fully mix the organosilane polymer and the thermal curing agent under nitrogen protection until the thermal curing agent is completely dissolved in the organosilane polymer. During the entire stirring, adding, and dissolving process, keep the temperature of the precursor in the container between 70°C and 85°C, and vacuum-seal the prepared polymer ceramic slurry for later use.

[0066] Furthermore, after preparing the polymer ceramic slurry by using the ultraviolet curing agent in the curing agent, the following steps are included:

[0067] Place the backplane body 200 coated with the polymer ceramic slurry in an ultraviolet curing box for curing, and the curing time can be selected as 2 - 10 min.

[0068] As mentioned in the above text, the polymer ceramic slurry is prepared from the organosilane polymer and the ultraviolet curing agent, and the specific process will not be elaborated here. After the polymer ceramic slurry is prepared, coat the polymer ceramic slurry on the outer layer of the backplane body 200, then put the backplane body 200 coated with the polymer ceramic slurry into the ultraviolet curing box, adjust the temperature of the ultraviolet curing box, and then cure for 2 - 10 min, so as to form the ceramic film 100 on the backplane body 200.

[0069] Furthermore, after preparing the polymer ceramic slurry by using the thermal curing agent in the curing agent, the following steps are included:

[0070] Place the backplane body 200 coated with the polymer ceramic slurry in a baking oven for thermal curing. The curing temperature is 150 - 200°C, and the curing time is 120 - 240 min.

[0071] As mentioned in the above text, a polymer ceramic slurry is prepared from a silicone polymer and a thermal curing agent, and the specific process will not be elaborated here. After the polymer ceramic slurry is prepared, it is coated on the outer layer of the backplane body 200, and then the backplane body 200 coated with the polymer ceramic slurry is placed in a drying oven. The temperature of the drying oven is adjusted to be within the range of 150°C - 200°C, and then it is cured for 120 - 240 minutes, thereby forming a ceramic film 100 on the backplane body 200.

[0072] Further, when preparing the backplane body 200, the following steps are included:

[0073] Coat an adhesive resin slurry on the inner layer of a polyester film (PET) substrate by a roll coating method, and perform drying treatment in a drying oven;

[0074] Coat a weather-resistant resin coating on the outer layer of the substrate by a roll coating method, and perform drying treatment in a drying oven.

[0075] When preparing the backplane body 200, use the inner layer of the polyester film (PET) substrate as the intermediate layer of the backplane body 200. Coat an adhesive resin slurry on one side of the backplane body 200 to form an inner coating of the backplane body 200, and coat a weather-resistant resin coating on the other side of the polyester film (PET) substrate to form an outer layer of the backplane body 200.

[0076] It should be noted that the polymer ceramic slurry is coated on the outer layer of the backplane body 200 and undergoes a curing process to form the ceramic film 100.

[0077] Further, the mechanical properties of the ceramic film 100 obtained by the preparation method of the photovoltaic backplane are as follows in the table:

[0078]

[0079] In summary, the present application designs a ceramic film, which is combined with a traditional photovoltaic backplane to form a photovoltaic backplane with flame retardant properties. The ceramic film is made of a polymer ceramic slurry formed by mixing a silicone polymer and a curing agent. After coating and curing, an organic polymer layer is formed on the outer layer of the backplane body. The organic polymer adheres to the outer layer of the backplane body (i.e., the air side of the backplane body) in the form of a transparent coating at room temperature. When exposed to high temperature, a sintering reaction occurs, and the outer layer of the backplane body transforms from the organic polymer to ceramic, forming a dense ceramic film. The ceramic film has no crystallization and no melt at 1300°C, and can effectively prevent the spread of fire caused by the melting of organic matter during the combustion of the component.

[0080] The present application also provides a photovoltaic backplane, as Figure 1 and Figure 2 shown, the photovoltaic backplane is prepared by the preparation method of the photovoltaic backplane according to any one of the above.

[0081] The above-mentioned photovoltaic backsheet is prepared by the preparation method of the photovoltaic backsheet, that is, the photovoltaic backsheet includes a backsheet body 200 and a ceramic film 100 disposed on the backsheet body 200. The ceramic film 100 has a high ignition point, which improves the heat resistance of the photovoltaic backsheet. When self-heating spots, circuit short circuits or external fire sources occur, problems such as melting and dripping of the photovoltaic backsheet are reduced.

[0082] Furthermore, the thermal properties of the ceramic film 100 are as Figure 3 shown, and the TGA weight loss curve is as Figure 4 shown.

[0083] It can be seen from Figure 3 that when the temperature rises from 1000° to 1500°, the ceramic film 100 remains stable. It can be seen from Figure 4 that when the temperature rises to 1600°, the mass of the ceramic film 100 begins to decrease. That is to say, the ceramic film 100 prepared by the preparation method of the photovoltaic backsheet of the present application can withstand a high temperature of 1600°, and there is no mass loss within 1600°, so it will not burn the backsheet body 200.

[0084] Moreover, according to the X-ray diffraction pattern ( Figure 3 ), the ceramic film 100 has no crystallization and no melting peak under sintering at 1500°C. According to the TGA weight loss curve ( Figure 4 ), the ceramic film 100 has no obvious mass attenuation before 1600°C, and the weight loss at 2000°C is <30%.

[0085] Through the above performance analysis, it shows that the photovoltaic backsheet made of the outer layer of the ceramic film 100 can maintain an amorphous structure and extremely small weight loss at extreme temperatures, thus fully avoiding self-melting. At the same time, it can also protect the molten droplets generated by the melting of other materials, thus causing risks such as fires. The photovoltaic backsheet prepared by the present application forms a ceramic film at high temperature, absorbs a large amount of heat, and has no molten droplets, so it will not cause the spread of the fire.

[0086] The technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as these technical feature combinations do not conflict, they should be considered as the scope recorded in this specification.

[0087] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patented application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A preparation method of a photovoltaic backplane, characterized in that, The preparation method of the photovoltaic backsheet includes: Coating an adhesive resin slurry on the inner layer of a polyester film (PET) substrate by a roll coating method and drying it through a drying tunnel; Coating a weather-resistant resin coating on the outer layer of the substrate by a roll coating method and drying it through a drying tunnel to prepare a backsheet body; Mixing an organosilane polymer and a curing agent evenly in a preset ratio to form a polymer ceramic slurry; Coating the polymer ceramic slurry on the backsheet body and subjecting it to a curing treatment to form a ceramic film.

2. The manufacturing method of the photovoltaic backplane according to claim 1, characterized in that, When mixing the organosilane polymer and the curing agent: Placing the organosilane polymer in an inert gas for stirring; adding the curing agent to the organosilane polymer under the protection of the inert gas; Continuing to stir until the curing agent is completely dissolved in the organosilane polymer.

3. The preparation method of the photovoltaic backplane according to claim 1, characterized in that, The organosilane polymer is selected from one of polysilazane, polysiloxane or polysilcarbosilane.

4. The manufacturing method of the photovoltaic backplane according to claim 1, characterized in that, The curing agent is selected as an ultraviolet curing agent.

5. The manufacturing method of the photovoltaic backplane according to claim 4, characterized in that, Mixing the organosilane polymer material and the ultraviolet curing agent in a ratio of 1wt%-10wt%.

6. The preparation method of the photovoltaic backplane according to claim 1, wherein, The curing agent is selected as a thermal curing agent.

7. The method for preparing a photovoltaic backsheet according to claim 6, characterized in that, Mixing the organosilane polymer material and the thermal curing agent in a ratio of 2wt%-5wt%.

8. The preparation method of the photovoltaic backplane according to claim 1, characterized in that, When mixing the organosilane polymer and the curing agent evenly in a preset ratio to form a polymer ceramic slurry, keeping the temperature of the organosilane polymer between 70 - 85°C.

9. The preparation method of the photovoltaic backplane according to claim 1, characterized in that, After using the ultraviolet curing agent in the curing agent to prepare the polymer ceramic slurry, it includes the following steps: Placing the backsheet body coated with the polymer ceramic slurry in an ultraviolet curing box for curing, and the curing time can be selected as 2 - 10 min.

10. The preparation method of the photovoltaic backplane according to claim 1, characterized in that, After using the thermal curing agent in the curing agent to prepare the polymer ceramic slurry, it includes the following steps: Placing the backsheet body coated with the polymer ceramic slurry in a drying tunnel for thermal curing, with a curing temperature of 150 - 200°C and a curing time of 120 - 240 min.

11. A photovoltaic backsheet, characterized in that, The photovoltaic backsheet is prepared by the preparation method of the photovoltaic backsheet according to any one of claims 1 - 10.

Images