Full attach method for liquid glue

Abstract

This invention belongs to the field of screen bonding technology and discloses a full bonding method using liquid adhesive. The full bonding method using liquid adhesive includes the following steps: placing a lower substrate horizontally; applying liquid adhesive to the left side of the lower substrate; aligning the upper substrate and the lower substrate horizontally, such that the right side of the upper substrate is aligned with the left side of the lower substrate in the front-back direction, while simultaneously ensuring that the projection of the right side of the upper substrate in the vertical direction falls within the liquid adhesive application area; moving the upper substrate downwards, so that a portion of the upper substrate is immersed in the liquid adhesive, while the lower surface of the upper substrate is spaced apart from the upper surface of the lower substrate; moving the upper substrate to the right until the right side of the upper substrate coincides with the right side of the lower substrate; moving the upper substrate downwards until the vertical distance between the upper and lower substrates is a preset adhesive layer thickness. This method is suitable for bonding substrates with very thin adhesive layers, results in minimal adhesive overflow, minimal liquid adhesive waste, and good bonding quality.

Description

Technical Field

[0001] This invention relates to the field of screen bonding technology, and more particularly to a full bonding method using liquid adhesive. Background Technology

[0002] During the screen manufacturing process, it is often necessary to bond two substrates together. To ensure a good display effect, liquid adhesive is generally used to bond the two substrates together, achieving full lamination of the screen.

[0003] Existing full-lamination methods for liquid adhesives sometimes use a dammed adhesive frame to intercept the liquid adhesive before bonding the two substrates. However, this method is not suitable for bonding substrates with very thin adhesive layers. Other existing full-lamination methods directly apply liquid adhesive to the lower substrate, spreading it in a herringbone or star-shaped pattern in the central area before aligning and bonding the upper and lower substrates. However, this method results in significant adhesive overflow, leading to substantial waste. Furthermore, air can easily enter the upper and lower substrates during the application of the liquid adhesive, resulting in air bubbles between the two substrates after bonding and poor bonding quality.

[0004] Therefore, there is an urgent need for a new full-lamination method for liquid adhesives to solve the problems of unsuitability for bonding substrates with very thin adhesive layers, excessive adhesive overflow, large waste of liquid adhesive, and poor bonding quality. Summary of the Invention

[0005] The purpose of this invention is to provide a full bonding method for liquid adhesive, which is suitable for bonding substrates with very thin adhesive layers, with less adhesive overflow, less liquid adhesive waste, and good bonding quality.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Full bonding methods for liquid adhesives include:

[0008] Step S100: Place the lower substrate horizontally;

[0009] Step S200: Apply liquid adhesive to the left side of the lower substrate;

[0010] Step S300: Align the upper substrate and the lower substrate in the horizontal direction, so that the right side of the upper substrate and the left side of the lower substrate are aligned in the front-to-back direction, and the projection of the right side of the upper substrate in the vertical direction is located in the coating area of ​​the liquid adhesive.

[0011] Step S400: Move the upper substrate downward so that a portion of the upper substrate is immersed in the liquid adhesive, while the lower surface of the upper substrate and the upper surface of the lower substrate are spaced apart.

[0012] Step S500: Move the upper substrate to the right until the right side of the upper substrate coincides with the right side of the lower substrate;

[0013] Step S600: Move the upper substrate downwards until the distance between the upper substrate and the lower substrate in the vertical direction is the preset adhesive layer thickness;

[0014] Step S700: Cure the liquid adhesive.

[0015] As a preferred embodiment, in step S200, the application path of the liquid adhesive is a straight line.

[0016] As a preferred embodiment, in step S200, the liquid adhesive is spaced apart from the left side, the front side, and the rear side of the lower substrate.

[0017] As a preferred embodiment, the edge of the liquid adhesive is spaced apart from the left side, the front side, and the rear side of the lower substrate by a distance L, where L is 0.2 mm to 1 mm.

[0018] As a preferred embodiment, in step S200, the theoretical coating amount of the liquid adhesive is calculated based on the preset adhesive layer thickness and the bonding area of ​​the upper substrate and the lower substrate.

[0019] As a preferred embodiment, the actual coating amount of the liquid adhesive is greater than the theoretical coating amount of the liquid adhesive.

[0020] As a preferred embodiment, in step S400, the lower surface of the upper substrate and the upper surface of the lower substrate are spaced apart by a distance h, and the height of the liquid adhesive is H, where h is (1 / 3)H to (2 / 3)H.

[0021] As a preferred embodiment, in step S400, the distance between the lower surface of the upper substrate and the upper surface of the lower substrate is greater than the preset adhesive layer thickness.

[0022] As a preferred embodiment, in step S500, when the upper substrate is moved to the right, the upper substrate is kept horizontal.

[0023] As a preferred embodiment, in step S500, the speed at which the upper substrate is moved to the right is 3 mm / s to 50 mm / s.

[0024] Beneficial effects:

[0025] This invention provides a bonding method for liquid adhesive. The method involves first applying liquid adhesive to the left side of a lower substrate, then aligning an upper substrate with the lower substrate so that the right side of the upper substrate is projected vertically onto the area where the liquid adhesive is applied. Next, the upper substrate is lowered, partially immersing itself in the liquid adhesive. Then, the upper substrate is moved to the right until the upper and lower substrates are fully bonded. Because this method first immerses the portion of the upper substrate near its right side in the liquid adhesive before bonding the upper and lower substrates, air bubbles are less likely to form between them, resulting in better bonding quality. Furthermore, the movement of the upper substrate spreads the liquid adhesive between the upper and lower substrates, allowing for a very small adhesive layer. This makes the method suitable for bonding substrates with very thin adhesive layers. Additionally, this method allows for more uniform application of the liquid adhesive, reducing adhesive overflow and waste. Attached Figure Description

[0026] Figure 1 This is a flowchart of a bonding method for liquid adhesive provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of applying liquid adhesive to the left side of the lower substrate according to an embodiment of the present invention;

[0028] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0029] Figure 4 This is a schematic diagram of the initial state of the upper and lower substrates being bonded together according to an embodiment of the present invention;

[0030] Figure 5 yes Figure 4 Front view of the middle section structure;

[0031] Figure 6 This is a schematic diagram of the bonding process between the upper substrate and the lower substrate provided in an embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of the final state of bonding between the upper and lower substrates provided in an embodiment of the present invention.

[0033] In the picture:

[0034] 10. Lower substrate; 20. Liquid adhesive; 30. Upper substrate. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0036] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0039] like Figure 1 As shown, this embodiment provides a full bonding method for liquid adhesive, the method comprising:

[0040] Step S100: Place the lower substrate 10 horizontally;

[0041] Step S200: Apply liquid adhesive 20 to the left side of the lower substrate 10;

[0042] Step S300: Align the upper substrate 30 and the lower substrate 10 in the horizontal direction, so that the right side of the upper substrate 30 and the left side of the lower substrate 10 are aligned in the front-to-back direction, and at the same time, the projection of the right side of the upper substrate 30 in the vertical direction is located in the coating area of ​​the liquid adhesive 20.

[0043] Step S400: Move the upper substrate 30 downward so that part of the upper substrate 30 is immersed in the liquid adhesive 20, while the lower surface of the upper substrate 30 is spaced apart from the upper surface of the lower substrate 10.

[0044] Step S500: Move the upper substrate 30 to the right until the right side of the upper substrate 30 coincides with the right side of the lower substrate 10.

[0045] Step S600: Move the upper substrate 30 downward until the distance between the upper substrate 30 and the lower substrate 10 in the vertical direction is the preset adhesive layer thickness.

[0046] Step S700: Cure the liquid adhesive 20.

[0047] Because this method first immerses the portion of the upper substrate 30 near its right side in the liquid adhesive 20 before bonding the upper substrate 30 and the lower substrate 10, air bubbles are less likely to form between the upper substrate 30 and the lower substrate 10, resulting in good bonding quality. Furthermore, this method spreads the liquid adhesive 20 between the upper substrate 30 and the lower substrate 10 through the movement of the upper substrate 30, allowing the liquid adhesive 20 to be spread to a very small height. Therefore, this method is suitable for bonding substrates with very thin adhesive layers. In addition, this method allows for a more uniform spread of the liquid adhesive 20, thereby reducing adhesive overflow and waste.

[0048] like Figure 2 As shown, in step S200, the coating path of the liquid adhesive 20 is a straight line, thereby ensuring that in step S500, the upper substrate 30 will better push and spread the liquid adhesive 20.

[0049] like Figure 2 and Figure 3 As shown, in step S200, the liquid adhesive 20 is spaced apart from the left side, front side, and rear side of the lower substrate 10. In step S600, during the downward pressing of the upper substrate 30, the liquid adhesive 20 flows to the side of the lower substrate 10. Therefore, the spaced-apart arrangement of the liquid adhesive 20 from each side of the lower substrate 10 can prevent excessive overflow of the liquid adhesive 20.

[0050] like Figure 3As shown, the edge of the liquid adhesive 20 is spaced apart from the left side, the front side, and the rear side of the lower substrate 10 by a distance L, which is 0.2mm to 1mm. This distance ensures that the liquid adhesive 20 fills the bonding surface of the lower substrate 10 and the upper substrate 30 in step S600, while also preventing excessive overflow of the liquid adhesive 20.

[0051] like Figure 2 As shown, in step S200, the theoretical coating amount of liquid adhesive 20 is calculated based on the preset adhesive layer thickness and the bonding area of ​​the upper substrate 30 and the lower substrate 10. The theoretical coating amount of liquid adhesive 20 can be easily calculated by multiplying the preset adhesive layer thickness by the bonding area.

[0052] In addition, the actual coating amount of liquid adhesive 20 is greater than the theoretical coating amount of liquid adhesive 20, thereby ensuring that liquid adhesive 20 can eventually cover the bonding surfaces of the upper substrate 30 and the lower substrate 10, thus ensuring the bonding effect of the upper substrate 30 and the lower substrate 10.

[0053] like Figure 4 and Figure 5 As shown, in step S400, the lower surface of the upper substrate 30 is spaced apart from the upper surface of the lower substrate 10 by a distance h, the height of the liquid adhesive 20 is H, and h is (1 / 3)H to (2 / 3)H. This range of h can ensure that the upper substrate 30 can spread the liquid adhesive 20 and also prevent air from entering, so as not to generate bonding defects such as bubbles.

[0054] like Figure 5 As shown, in step S400, the distance between the lower surface of the upper substrate 30 and the upper surface of the lower substrate 10 is greater than the preset adhesive layer thickness, thereby ensuring that the distance between the upper substrate 30 and the lower substrate 10 is sufficient to meet the preset adhesive layer thickness simply by pressing down the upper substrate 30, thus avoiding bonding failure.

[0055] like Figure 6 and Figure 7 As shown, in step S500, when the upper substrate 30 is moved to the right, the upper substrate 30 is kept horizontal, thereby ensuring that the height of the liquid adhesive 20 remains constant, so that there is no gap between the upper substrate 30 and the liquid adhesive 20, and air will not enter, thereby avoiding defects such as bubbles.

[0056] like Figure 6 and Figure 7 As shown, in step S500, the speed at which the upper substrate 30 is moved to the right is 3 mm / s to 50 mm / s. A moving speed within this range ensures that the liquid adhesive 20 is evenly spread, resulting in a better bonding effect between the upper substrate 30 and the lower substrate 10. Preferably, the moving speed is 3 mm / s to 10 mm / s.

[0057] In step S700, the liquid adhesive 20 can be cured by heating or curing lamp irradiation. Since the curing method is existing technology, it will not be described in detail here.

[0058] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for full bonding of liquid adhesive, characterized in that, include: Step S100: Place the lower substrate (10) horizontally; Step S200: Apply liquid adhesive (20) to the left side of the lower substrate (10); Step S300: Align the upper substrate (30) and the lower substrate (10) in the horizontal direction, so that the right side of the upper substrate (30) and the left side of the lower substrate (10) are aligned in the front-back direction, and the projection of the right side of the upper substrate (30) in the vertical direction is located in the coating area of ​​the liquid adhesive (20). Step S400: Move the upper substrate (30) downward so that a portion of the upper substrate (30) is immersed in the liquid adhesive (20), while the lower surface of the upper substrate (30) is spaced apart from the upper surface of the lower substrate (10). Step S500: Move the upper substrate (30) to the right until the right side of the upper substrate (30) coincides with the right side of the lower substrate (10); Step S600: Move the upper substrate (30) downward until the distance between the upper substrate (30) and the lower substrate (10) in the vertical direction is the preset adhesive layer thickness; Step S700: Cure the liquid adhesive (20); In step S200, the coating path of the liquid adhesive (20) is a straight line; In step S200, the liquid adhesive (20) is spaced apart from the left side, the front side, and the rear side of the lower substrate (10).

2. The full bonding method for liquid adhesive according to claim 1, characterized in that, The edge of the liquid adhesive (20) is spaced apart from the left side, the front side, and the rear side of the lower substrate (10) by a distance L, where L is 0.2 mm to 1 mm.

3. The full bonding method for liquid adhesive according to claim 1, characterized in that, In step S200, the theoretical coating amount of the liquid adhesive (20) is calculated based on the preset adhesive layer thickness and the bonding area of ​​the upper substrate (30) and the lower substrate (10).

4. The full bonding method for liquid adhesive according to claim 3, characterized in that, The actual coating amount of the liquid adhesive (20) is greater than the theoretical coating amount of the liquid adhesive (20).

5. The full bonding method for liquid adhesive according to claim 1, characterized in that, In step S400, the lower surface of the upper substrate (30) is spaced apart from the upper surface of the lower substrate (10) by a distance h, and the height of the liquid adhesive (20) is H, where h is (1 / 3)H to (2 / 3)H.

6. The full bonding method for liquid adhesive according to claim 1, characterized in that, In step S400, the distance between the lower surface of the upper substrate (30) and the upper surface of the lower substrate (10) is greater than the preset adhesive layer thickness.

7. The full bonding method for liquid adhesive according to claim 1, characterized in that, In step S500, when the upper substrate (30) is moved to the right, the upper substrate (30) is kept horizontal.

8. The full bonding method for liquid adhesive according to claim 1, characterized in that, In step S500, the speed at which the upper substrate (30) is moved to the right is 3 mm / s to 50 mm / s.

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