Display panel and display device

Abstract

The present application is applicable to the field of display technology, and provides a display panel and a display device. The display panel includes a first substrate, a second substrate and a packaging adhesive layer. The first substrate includes a display area and a frame area. A plurality of pixels are arranged in the display area, and an electrode circuit is arranged in the frame area. The packaging adhesive layer is arranged in the frame area and is located between the electrode circuit and the second substrate. An optical structure is arranged on the second substrate, which can reflect or refract the light inside and / or outside the packaging adhesive layer to the contact interface between the packaging adhesive layer and the second substrate. The present application arranges an optical structure on the second substrate, so that the part of the light that originally cannot directly reach the packaging adhesive powder can change the propagation direction, reach the contact interface between the packaging adhesive powder and the second substrate, and be utilized, thereby increasing the laser energy at the upper end of the packaging adhesive powder, improving the bonding strength between the upper end of the packaging adhesive layer and the lower surface of the second substrate, and ensuring a good packaging effect between the packaging adhesive layer and the second substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) displays have obvious advantages in display, such as all-solid-state structure, high brightness, full viewing angle, fast response speed, low blue light, wide operating temperature range, and flexible display. They are currently mainly used in small-size applications such as mobile phones, watches, and tablets.

[0003] The basic structure of OLED is that a layer of organic electroluminescent material is arranged between two pieces of glass. The usual packaging method is to use glass glue (frit) to package around the organic electroluminescent material (ie, the frame area).

[0004] The old problems still exist. Organic materials are afraid of water and oxygen, and encapsulation is still the top priority. In order to meet the needs of narrow borders, the electrode lines of existing OLEDs are mostly placed in the border area and below the Frit glue.

[0005] During laser sintering, the upper and lower contact surfaces of the glass powder are made of different materials (for example, glass on the top and metal on the bottom). Under the same laser energy, on the metal side, the metal surface has a strong reflective ability, while the upper glass has no reflective function to the laser. The adhesion between the glass glue and the upper glass is much smaller than the adhesion between the glass glue and the metal, resulting in poor packaging between the glass glue and the upper glass. Summary of the invention

[0006] The purpose of the embodiments of the present application is to provide a display panel and a display device, aiming to solve the technical problem of poor adhesion between the encapsulation glue and the upper glass in the existing OLED.

[0007] The embodiment of the present application is implemented as follows: a display panel includes:

[0008] The first substrate comprises a display area and a frame area, wherein a plurality of pixels are arranged in the display area, and an electrode circuit connected to each of the pixels is arranged in the frame area;

[0009] A second substrate, which is a light-transmitting substrate, is disposed opposite to and spaced from the first substrate; and

[0010] A packaging adhesive layer, disposed in the frame area and between the electrode circuit and the second substrate;

[0011] The second substrate is provided with an optical structure, and the optical structure can reflect or refract the light inside and / or outside the packaging glue layer to the contact interface between the packaging glue layer and the second substrate.

[0012] In one embodiment, the optical structure includes a first reflective layer, a groove is formed on the side of the second substrate facing the packaging layer, the first reflective layer is disposed on at least one inner side wall of the groove, and the packaging layer is connected to the bottom wall of the groove.

[0013] In one embodiment, the inner side wall of the groove is a concave wall or a plane wall, and the first reflective layer is a metal layer.

[0014] In one embodiment, the optical structure includes a first reflective layer, a first bump is provided on a side of the second substrate facing the encapsulation layer, the first bump is located on the inner side and / or the outer side of the encapsulation layer, the first reflective layer is provided on the first bump, and has a second reflective surface for reflecting light;

[0015] Alternatively, the optical structure includes a first bump, which is arranged on a side of the second substrate facing the packaging glue layer and is located on the inner side and / or outer side of the packaging glue layer; the first bump has a second reflection surface for reflecting light.

[0016] In one embodiment, the material of the first convex block is the same as that of the second substrate; and the second reflective surface is a plane or a concave surface.

[0017] In one embodiment, the optical structure includes a second bump, which is a light-transmitting bump, disposed on the side of the second substrate facing away from the packaging layer and located on the inner and / or outer side of the packaging layer, and the second bump has a light incident slope for refracting light.

[0018] In one embodiment, the light incident inclined surface is an inner concave surface, and the material of the second protrusion is the same as that of the second substrate.

[0019] In one embodiment, the electrode circuit includes a light-transmitting layer provided on the first substrate and a conductive layer provided on the light-transmitting layer, and the electrode circuit is provided with a plurality of hollow regions at least penetrating the conductive layer along the thickness direction; the light-transmitting layer is a light-transmitting insulating material layer.

[0020] In one embodiment, a plurality of high light transmittance regions and low light transmittance regions are provided on a surface of the second substrate facing away from the first substrate, and the low light transmittance regions correspond to non-hollow regions between the hollow regions.

[0021] Another object of the embodiments of the present application is to provide a display device, which includes the display panel described in the above embodiments.

[0022] The display panel and display device provided in the embodiments of the present application have the following beneficial effects:

[0023] In the display panel, the optical structure is arranged so that the light inside and / or outside the encapsulation glue layer (or encapsulation glue powder), that is, the part of the light that originally cannot directly reach the encapsulation glue powder, can change the propagation direction, reach the contact interface between the encapsulation glue powder and the second substrate, and be utilized. Therefore, the laser energy at the upper end of the encapsulation glue powder is increased, and the bonding strength between the upper end of the encapsulation glue layer and the lower surface of the second substrate can be improved, ensuring a good encapsulation effect between the encapsulation glue layer and the second substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is a schematic diagram of the structure of the display panel provided in the first embodiment of the present application and a schematic diagram of the laser route during laser sintering;

[0026] Figure 2 yes Figure 1 Step S1 of manufacturing a groove on a second substrate in a display panel;

[0027] Figure 3 yes Figure 1 Step S2 of manufacturing a groove on the second substrate of the display panel;

[0028] Figure 4 yes Figure 1 Step S3 of manufacturing a groove on the second substrate of the display panel;

[0029] Figure 5 is a schematic diagram of the structure of a display panel provided in the second embodiment of the present application and a schematic diagram of the laser route during laser sintering;

[0030] Figure 6 yes Figure 5 Step T1 of manufacturing a first bump on a second substrate in a display panel;

[0031] Figure 7 yes Figure 5 Step T2 of manufacturing a first bump on a second substrate in a display panel;

[0032] Figure 8 is a schematic diagram of the structure of a display panel provided in the third embodiment of the present application and a schematic diagram of the laser route during laser sintering;

[0033] Fig. 9 is a schematic structural diagram of a display panel provided in a fourth embodiment of the present application;

[0034] Fig.10 yes Fig. 9 Schematic diagram of the laser route of the display panel during laser sintering;

[0035] Fig.11 is a schematic structural diagram of a display panel provided in a fifth embodiment of the present application;

[0036] Fig.12 yes Fig.11 Schematic diagram of the laser route of the display panel during laser sintering;

[0037] Fig.13 It is a schematic diagram of the structure of a display device provided in the sixth embodiment of the present application.

[0038] The meanings of the marks in the figure are:

[0039] 100-display panel;

[0040] 1-first substrate, 11-display area, 12-frame area;

[0041] 2-second substrate, 21-high light transmittance area, 22-low light transmittance area, 23-light blocking layer, 24-groove, 241-first inner side wall, 242-second inner side wall;

[0042] 251 - first reflection layer, 2510 - first reflection surface, 2518 - deposition material;

[0043] 253 - first convex block, 2531 - second reflective layer, 2530 - second reflective surface;

[0044] 255-the second bump, 2550-the light incident bevel;

[0045] 3-Encapsulation glue layer;

[0046] 4-electrode circuit, 41-hollow area, 42-non-hollow area, 43-conductive layer, 44-light-transmitting layer;

[0047] 200-display device, 91-power supply, 92-control module. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0049] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly or indirectly fixed or disposed on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of this patent. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0050] In order to illustrate the technical solution described in this application, a detailed description is given below in conjunction with specific drawings and embodiments.

[0051] First embodiment

[0052] First, see Figure 1 As shown, the first embodiment of the present application provides a display panel 100, which includes a first substrate 1 and a second substrate 2 that are arranged opposite to each other and at an interval. The first substrate 1 and the second substrate 2 are both divided into a display area 11 and a frame area 12. The frame area 12 is located around the display area 11. A plurality of pixels (not shown) are arranged in the display area 11. The frame area 12 is provided with an electrode circuit 4 connected to each pixel; it also includes a packaging glue layer 3, which is arranged in the frame area 12 and is located between the electrode circuit 4 and the second substrate 2, and is used to package the electrode circuit 4 and the second substrate 2 as a whole, that is, to package the first substrate 1 and the second substrate 2 as a whole.

[0053] Here, for the convenience of description and understanding below, two directions of "up" and "down" are defined, the second substrate 2 is located at the top, and the first substrate 1 is located at the bottom. In addition, two directions of "inside" and "outside" are defined, and the display area 11 is located inside the frame area 12.

[0054] In this embodiment, the display panel 100 also includes an optical structure arranged on the second substrate 2 and located on the inner and / or outer side of the encapsulation layer 3, and the optical structure can reflect or refract light located on the inner and / or outer side of the encapsulation layer 3 to the contact interface between the encapsulation layer 3 and the second substrate 2, that is, between the upper end of the encapsulation layer 3 and the second substrate 2.

[0055] The display panel 100 provided in this embodiment, during packaging, a non-molten packaging glue powder (for example, glass powder) is sandwiched between the electrode circuit 4 and the second substrate 2, and a laser is used to irradiate the packaging glue powder from above the second substrate 2. The first part of the laser is transmitted from the second substrate 2 (the second substrate 2 is a light-transmitting substrate) and reaches the upper end of the packaging glue powder; the second part continues to reach the electrode circuit 4 (the electrode circuit 4 is non-light-transmitting) downward, and is reflected back to the lower end of the packaging glue powder; and the third part of the laser, that is, the laser located inside and / or outside the packaging glue powder, cannot reach the first substrate 1 downward, but is reflected or refracted by the optical structure and reaches the upper end of the packaging glue powder, see Figure 1 As shown ( Figure 1 The straight arrow in the figure indicates the laser).

[0056] The laser energy causes the packaging glue powder to melt and bond with the electrode circuit 4 and the second substrate 2 . After cooling and solidification, a packaging glue layer 3 is obtained.

[0057] The optical structure is set so that the light inside and / or outside the encapsulation glue layer 3 (or encapsulation glue powder), that is, the part of the light that originally cannot directly reach the encapsulation glue powder, can change the propagation direction, reach the contact interface between the encapsulation glue powder and the second substrate 2, and be used. Therefore, the laser energy at the upper end of the encapsulation glue powder is increased, and the bonding strength between the upper end of the encapsulation glue layer 3 and the lower surface of the second substrate 2 can be improved, ensuring a good encapsulation effect between the encapsulation glue layer 3 and the second substrate 2.

[0058] The second substrate 2 is a light-transmitting substrate, specifically a glass substrate. Of course, as required, the second substrate 2 can also be a light-transmitting substrate made of other materials and capable of withstanding the high temperature of laser sintering.

[0059] The first substrate 1 may be a light-transmitting substrate, such as a glass substrate, or a non-light-transmitting substrate, such as a metal oxide substrate.

[0060] In this specific embodiment, the optical structure is a reflective structure.

[0061] Specifically, see Figure 1 As shown, a groove 24 is formed on the lower side of the second substrate 2, and the encapsulation glue layer 3 is partially disposed in the groove 24. The bottom wall of the groove 24 is used to contact and bond with the upper end of the encapsulation glue layer 3. The groove 24 is large inside and small outside, so that the inner side wall of at least one side of the groove 24 is inclined in a direction gradually away from the encapsulation glue layer 3 from bottom to top, and a first reflection layer 251 is disposed on the inner side wall, and the surface of the first reflection layer 251 serves as a first reflection surface 2510 for reflecting light.

[0062] Furthermore, the inclined inner sidewall of the groove 24 causes the bottom wall of the groove 24 to be substantially lengthened, which increases the contact area between the packaging adhesive layer 3 and the second substrate 2 and further improves the bonding strength between the two.

[0063] In one embodiment, the groove 24 has a first inner wall 241 away from the display area 11 and a second inner wall 242 close to the display area 11. Only the first inner wall 241 may be inclined and a first reflective layer 251 may be provided, or only the second inner wall 242 may be inclined and a first reflective layer 251 may be provided, or both the first inner wall 241 and the second inner wall 242 may be inclined and a first reflective layer 251 may be provided.

[0064] The first reflective layer 251 may be made of a material that can be stably attached to the inner wall of the groove 24 and has good light reflectivity. For example, the first reflective layer 251 may be a metal layer, such as an aluminum layer, a copper layer, a titanium layer, etc.; or the first reflective layer 251 may be a non-metal layer, such as an inorganic non-metal material layer, such as a ceramic layer, etc.

[0065] The inner side wall of the groove 24 may be an inner concave wall, and accordingly, the first reflective surface 2510 may be a concave surface, which has a gathering effect on light. Alternatively, the inner side wall of the groove 24 may be an outer convex wall, and accordingly, the first reflective surface 2510 may be a convex surface, which has a diverging effect on light. Alternatively, the inner side wall of the groove 24 may be a plane, and accordingly, the first reflective surface 2510 may be a plane.

[0066] In practical applications, the inner side wall of the groove 24 can be selected as needed. Furthermore, when the groove 24 has two first reflection surfaces 2510, the shapes of the two first reflection surfaces 2510 can be the same (referring to mirror symmetry here) or different.

[0067] The inner side wall of the groove 24 and the first reflective surface 2510 may be selected as a concave surface or a flat surface, which can simultaneously ensure laser reflection and utilization efficiency and comply with the process.

[0068] The first reflective layer 251 can be formed by physical vapor deposition, chemical vapor deposition, spraying, etc.

[0069] Please refer to Figures 2 to 4 As shown, the specific steps for making the groove 24 and the reflective layer of the metal material can be referred to as follows:

[0070] Step S1, such as Figure 2As shown, the lower surface of the second substrate 2 is etched to form a groove 24. In this step S1, gas etching can be specifically used to remove part of the material on the surface of the second substrate 2 by ion bombardment and chemical reaction under a plasma system. By controlling the direction and intensity of the ion beam, a groove 24 of a desired shape can be obtained. Alternatively, in this step S1, the groove 24 can be specifically formed by mechanical processing.

[0071] Step S2, such as Figure 3 As shown, a layer of material is deposited in the groove 24 to obtain a deposited material 2518 located on the bottom wall and the inner side wall of the groove 24 .

[0072] Therefore, step S3, such as Figure 4 As shown, the deposited material 2518 on the bottom wall of the groove 24 is etched to obtain a light-transmissive bottom wall and a first reflective layer 251 on the inner side wall. Specifically, the first reflective layer 251 is a metal material, and wet etching can be used in step S3.

[0073] Second embodiment

[0074] Compared with the first embodiment, this embodiment is a deformed reflection structure.

[0075] See also Figure 5 As shown, a first bump 253 is disposed on the lower surface of the second substrate 2 . The first bump 253 is located on the inner side and / or the outer side of the packaging glue layer 3 . The first bump 253 has a second reflection surface 2530 for reflecting light.

[0076] Optionally, the first bump 253 may be formed only on the inner side of the encapsulation glue layer 3 ; or, the first bump 253 may be formed only on the outer side of the encapsulation glue layer 3 ; or, the first bump 253 may be formed on both the outer side and the inner side of the encapsulation glue layer 3 .

[0077] In one embodiment, the second reflective surface 2530 may be disposed on a side surface of the first bump 253 facing the encapsulation glue layer 3. In this way, the laser light is reflected when it reaches the side surface of the first bump 253 after transmitting through the second substrate 2, and does not enter the first bump 253. At this time, the first bump 253 may be made of an overall opaque material, such as a metal material, or the first bump 253 may be a translucent material, and the second reflective surface 2530 is formed by the surface of the second reflective layer 2531 attached to the surface thereof.

[0078] In another embodiment, the second reflective surface 2530 may be disposed on a side surface of the first bump 253 that is away from the packaging glue layer 3. Figure 5In this case, the first protrusion 253 is made of a light-transmitting material, and the second reflective surface 2530 is formed by the surface of the second reflective layer 2531 attached to the surface thereof. Figure 5 As shown, the third portion of the laser light transmits through the second substrate 2 and then continues to transmit into the first bump 253 , and then is reflected by the second reflective surface 2530 . Finally, the laser light transmits out from the first bump 253 and enters the packaging glue powder.

[0079] Optionally, the material of the first bump 253 is the same as the material of the second substrate 2 .

[0080] The second reflective surface 2530 may be a concave surface, which has a gathering effect on light. Alternatively, the second reflective surface 2530 may be a convex surface, which has a diverging effect on light. Alternatively, the second reflective surface 2530 may be a flat surface.

[0081] In practical applications, the shape of the second reflective surface 2530 can be selected as needed. Furthermore, when the lower surface of the second substrate 2 has two first bumps 253 , the shapes of the two second reflective surfaces 2530 can be the same (referring to mirror symmetry here) or different.

[0082] Optionally, the second reflective surface 2530 can be a concave surface or a flat surface, which can simultaneously ensure laser reflection and utilization efficiency and comply with the process.

[0083] Please refer to Figure 6 and Figure 7 As shown, the manufacturing method of the first convex block 253 and the second reflective surface 2530 thereof can be referred to as follows:

[0084] like Figure 6 As shown, in step T1, two first bumps 253 are formed on the lower surface of the second substrate 2. Specifically, in step T1, the first bumps 253 can be formed by physical vapor deposition, chemical vapor deposition, mechanical cutting, etc.

[0085] When the first bump 253 is made of a light-transmitting material, Figure 7 As shown, the method further includes step T2, forming a second reflective layer 2531 on the first bump 253 to obtain a second reflective surface 2530. Specifically, in step T2, the second reflective layer 2531 may be formed by physical vapor deposition, chemical vapor deposition or coating.

[0086] Third embodiment

[0087] Compared with the first embodiment and the second embodiment, this embodiment is a deformed optical structure, which is a refractive structure.

[0088] See also Figure 8As shown, a second bump 255 is disposed on the upper surface of the second substrate 2 . The second bump 255 is a light-transmitting bump located inside and / or outside the packaging glue layer 3 . The second bump 255 has a light incident inclined surface 2550 for refracting light.

[0089] Specifically, the incident light bevel 2550 of the second bump 255 gradually approaches the packaging glue layer 3 from top to bottom. Thus, when the laser is irradiated from above the incident light bevel 2550, the laser enters the second bump 255 through refraction of the incident light bevel 2550 and changes direction to propagate until it reaches the interface between the packaging glue powder and the second substrate 2.

[0090] The light incident bevel 2550 may be a concave surface, which has a gathering effect on the light. Alternatively, the light incident bevel 2550 may be a convex surface, which has a diverging effect on the light. Alternatively, the light incident bevel 2550 may be a flat surface.

[0091] In practical applications, the shape of the light incident inclined surface 2550 can be selected as needed. Furthermore, when the lower surface of the second substrate 2 has two second bumps 255 , the shapes of the two light incident inclined surfaces 2550 can be the same (here, mirror symmetry) or different.

[0092] Among them, optionally, the light incident slope 2550 can be selected as a concave surface or a flat surface, which can simultaneously ensure laser reflection and utilization efficiency and comply with the process.

[0093] In this embodiment, the second bump 255 may also be formed by physical vapor deposition, chemical vapor deposition, mechanical cutting, etc.

[0094] Fourth embodiment

[0095] In actual manufacturing process, based on the electrical connection relationship between the electrode circuit 4 and the pixel, and in order to optimize the process and reduce the steps, the electrode circuit 4 in the frame area 12 is formed in the same layer and with the same material as the pattern in the display area 11 .

[0096] At present, the material of the electrode circuit 4 is usually a composite layer of multiple metals. For example, the electrode circuit 4 is in the same layer as the source and drain, and is a composite material of multiple materials such as aluminum (Al), molybdenum (Mo), copper (Cu), and titanium (Ti) to take into account both low resistance and anti-oxidation functions. The problem that this brings is that due to the different thermal expansion coefficients of different metal materials, different metal material layers will expand to different degrees during laser sintering. For example, Al has a lower resistivity, but its expansion when heated will also be more obvious. After sintering and cooling, the surface of aluminum will produce sharp protrusions or hillocks (Hillock), which will in turn cause hillocks to form on the surface of the electrode circuit 4, which further leads to poor adhesion between the glass glue layer and the electrode circuit 4, and the material layers of the electrode circuit 4 themselves are also prone to poor contact.

[0097] Therefore, in the related art, in order to reduce the hillock phenomenon on the surface of the electrode circuit 4 and to ensure the contact between the glass glue layer and the electrode circuit 4 and the conductivity of the electrode circuit 4 itself, the laser energy used for sintering is usually reduced to ensure that the temperature during the laser sintering process is maintained at a level that does not cause the hillock phenomenon.

[0098] The reduction of laser energy will inevitably lead to the limitation of the bonding strength between the packaging glue layer 3 and the second substrate 2 .

[0099] like Fig. 9 and Fig.10 As shown, on the basis of the first to third embodiments described above (the first embodiment is taken as an example in the figure), a plurality of hollow areas 41 are provided on the electrode line 4. The reserved portions between the hollow areas 41 and the hollow areas 41 are connected to each other as non-hollow areas 42 and used for conducting electricity; the surface of the non-hollow area 42 facing the second substrate 2, that is, the upper surface thereof, is a reflective surface.

[0100] The display panel 100 provided in this embodiment, during packaging, a non-molten packaging glue powder is sandwiched between the electrode circuit 4 and the second substrate 2, and a laser is used to irradiate the packaging glue powder from above the second substrate 2. The first part of the laser is transmitted from the second substrate 2 (the second substrate 2 is a light-transmitting substrate) and reaches the upper end of the packaging glue powder, and the second part of the laser continues downward to reach the electrode circuit 4. The reflective surface of the non-hollow area 42 reflects a part of the laser upward back to the lower end of the packaging glue powder, and the hollow area 41 allows the laser to continue downward to reach the second substrate 2. See Fig.10 As shown; the path of the third part of the laser can be found in the first to third embodiments and will not be described in detail.

[0101] In this embodiment, a plurality of hollow areas 41 are provided on the electrode circuit 4. The provision of the hollow areas 41 actually divides the electrode circuit 4, so that the width of the electrode circuit 4 is smaller. Thus, in the process of laser sintering to form the encapsulation adhesive layer 3, the laser energy irradiated on the electrode circuit 4 as a whole is reduced, and the heat dissipation of the electrode circuit 4 can be improved, which can avoid or alleviate the hillock phenomenon occurring at high temperature in one of the metal layers of the electrode circuit 4 (especially the metal layer with a large thermal expansion coefficient), thereby ensuring the contact area between the encapsulation adhesive layer 3 and the electrode circuit 4, and the conductive performance of the electrode circuit 4 itself; on this basis, it is allowed to use a laser with a larger energy for irradiation, which is conducive to improving the adhesion between the encapsulation adhesive layer 3 and the second substrate 2, and finally, ensuring the encapsulation effect on the upper and lower sides of the encapsulation adhesive layer 3, and ensuring the good encapsulation effect of the display panel 100.

[0102] In this embodiment, the electrode circuit 4 includes multiple metal layers made of different materials.

[0103] For example, the electrode line 4 is a composite material layer of multiple materials including aluminum (Al), molybdenum (Mo), and titanium (Ti).

[0104] In a specific embodiment, the electrode circuit 4 is a Ti / Al composite layer, or a Ti / Al / Ti composite layer, or a Mo / Al composite layer, or a Mo / Al / Mo composite layer. Among them, Al has a lower resistivity but a larger thermal expansion coefficient, and Mo and Ti are more stable and have strong anti-oxidation ability, and they are respectively used as protective metal layers (not shown).

[0105] In other embodiments, the electrode line 4 may be a composite layer of other materials, for example, Al is replaced by other materials with lower resistivity, and Mo and Ti are replaced by other relatively stable materials.

[0106] In one embodiment, Figure 1 and Figure 2 As shown, the electrode circuit 4 includes a conductive layer 43 and a light-transmitting layer 44 located below the conductive layer 43. Among them, the light-transmitting layer 44 is a light-transmitting insulating material, and the conductive layer 43 is a non-light-transmitting conductive material. In other words, the aforementioned "multi-layer material with different metal layers" serves as the conductive layer 43, and plays the role of electrically connecting each pixel. The arrangement of the light-transmitting insulating material here is mainly to be formed at the same time and in the same layer as the light-transmitting structural layer (such as the gate insulating layer) in the display area 11, that is, no mask is required when forming the light-transmitting structural layer in the display area 11. In addition, the light-transmitting structural layer is arranged here, which can also isolate the second substrate 2 and the conductive layer 43, reduce the thermal impact on the conductive layer 43 caused by the second substrate 2 heating up after absorbing part of the laser, and further alleviate the hillock phenomenon of the conductive layer 43.

[0107] The hollow area 41 penetrates the conductive layer 43 along the thickness direction, but does not penetrate the light-transmitting layer 44; or, the hollow area 41 penetrates the conductive layer 43 and the light-transmitting layer 44 along the thickness direction. Whether the light-transmitting layer 44 penetrates or not penetrates, it does not affect the laser reaching the first substrate 1 after irradiating downwards.

[0108] The light-transmitting layer 44 may be a silicon nitride (SiNx) layer, or a silicon oxide (SiOx) layer, or a composite layer of the two.

[0109] Of course, depending on the specific implementation, in other optional embodiments, the light-transmitting layer 44 may also be omitted.

[0110] The width of the electrode line 4 is not specifically limited. Generally, the wider the electrode line 4 is, the smaller the resistance is. Therefore, the width of the electrode line 4 should be set in consideration of its good conductivity.

[0111] The hollow area 41 can be formed by etching. Specifically, the pixels in the display area 11 include a conductive structure layer of the same layer and the same material as the conductive layer 43. Taking the source and drain as an example, the patterned conductive structure layer and the conductive layer 43 are formed simultaneously in one photolithography process.

[0112] Alternatively, the hollow area 41 may be formed by post-processing, such as mechanical punching or laser punching.

[0113] The side length of the hollow area 41 is greater than or equal to 10 micrometers. Optionally, the side length of the hollow area 41 is greater than or equal to 20 micrometers.

[0114] The shape of the hollow area 41 is not limited, for example, it can be a rectangle, or a circle, an ellipse or other circular shapes, or other regular or irregular shapes. In general, the shape of the hollow area 41 is selected to facilitate implementation in combination with the actual process and to take into account the good conductivity of the conductive layer 43.

[0115] On the electrode circuit 4, the setting of the sum of the areas of the hollow areas 41 should take into account the good conductivity of the conductive layer 43. Since the setting of the hollow area 41 will increase the resistance of the conductive layer 43, it should not be too large. In one embodiment, assuming that the sum of the areas of the hollow areas 41 is A and the area of ​​the electrode circuit 4 is B, then A / B≤0.5, optionally, A / B≤0.4, further optionally, A / B≤0.3, and further, A / B≤0.2.

[0116] like Figure 1 As shown, the outer side of the encapsulation layer 3 is flush with the outer side of the electrode circuit 4, or the outer side of the encapsulation layer 3 is located outside the electrode circuit 4, that is, the encapsulation layer 3 covers the outer side of the electrode circuit 4. The inner side of the electrode circuit 4 extends into the display area 11 and is electrically connected to each pixel.

[0117] Fifth embodiment

[0118] See also Fig.11 and Fig.12 As shown, based on the fourth embodiment, a plurality of high light transmittance areas 21 and low light transmittance areas 22 are provided on the upper surface of the second substrate 2 , the low light transmittance areas 22 correspond to the non-hollow areas 42 , and the high light transmittance areas 21 correspond to the hollow areas 41 .

[0119] In this embodiment, the transmittance of the low light transmittance area 22 is lower than that of the high light transmittance area 21, and is used to further filter a portion of the laser energy and reduce the laser irradiated to the non-hollow area 42. The purpose of this arrangement is to further increase the energy of the laser used above the second substrate 2, and to improve the bonding force between the second substrate 2 and the encapsulation adhesive layer 3 without aggravating the hillock problem of the conductive layer 43.

[0120] In one embodiment, the projection of the low light transmittance area 22 along the up-down direction coincides with the non-hollow area 42 (the size and shape are exactly the same), or the projection of the low light transmittance area 22 along the up-down direction can completely cover the non-hollow area 42, and partially cover the hollow area 41. Of course, limited by the actual manufacturing process, in actual applications, the projection of the low light transmittance area 22 and any edge of the non-hollow area 42 can be spaced a certain distance from each other.

[0121] In an optional embodiment, the low light transmittance area 22 can be integrally formed on the upper surface of the second substrate 2, that is, the high light transmittance area 21 and the low light transmittance area 22 can be directly obtained by processing the upper surface of the second substrate 2, such as through frosting, acid etching, etc., so that some relatively blurred and low light transmittance areas are formed on the upper surface of the second substrate 2, and these areas serve as the low light transmittance area 22.

[0122] In an optional embodiment, the low light-transmittance area 22 may be formed by an additional light-blocking layer 23 formed on the upper surface of the second substrate 2. Specifically, for example, spraying / printing, spraying liquid or printing a specific pattern on the surface of the second substrate 2 to obtain a thinner covering layer; or, pasting, pasting a film layer with a light-proof effect on the surface of the second substrate 2.

[0123] The high light-transmittance region 21 may be the upper surface of the second substrate 2 , that is, the portion of the upper surface of the second substrate 2 that is not processed in any way may serve as the high light-transmittance region 21 .

[0124] Sixth embodiment

[0125] like Fig.13As shown, this embodiment provides a display device 200, including the display panel 100 described in any of the above embodiments. In addition, the display device 200 may also include a power supply 91 and a control module 92 that are electrically connected to each other, and the control module 92 is further connected to each electrode circuit 4 to control the voltage on each electrode circuit 4, thereby controlling the opening and closing of each pixel.

[0126] The display device 200 provided in this embodiment has the same technical effects as the display panel 100 described in the above embodiments, and will not be described in detail.

[0127] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: The first substrate comprises a display area and a frame area, wherein a plurality of pixels are arranged in the display area, and an electrode circuit connected to each of the pixels is arranged in the frame area; The second substrate is a light-transmitting substrate, which is opposite to and spaced from the first substrate; as well as A packaging adhesive layer, disposed in the frame area and between the electrode circuit and the second substrate; Wherein, an optical structure is provided on the second substrate, and the optical structure can reflect or refract the light inside and / or outside the packaging glue layer to the contact interface between the packaging glue layer and the second substrate; The electrode circuit includes a light-transmitting layer arranged on the first substrate and a conductive layer arranged on the light-transmitting layer. The electrode circuit is provided with a plurality of hollow areas at least penetrating the conductive layer in the thickness direction. The light-transmitting layer is a light-transmitting insulating material layer.

2. The display panel according to claim 1, wherein: The optical structure includes a first reflective layer. A groove is formed on the side of the second substrate facing the packaging adhesive layer. The first reflective layer is disposed on at least one inner side wall of the groove. The packaging adhesive layer is connected to the bottom wall of the groove.

3. The display panel according to claim 2, wherein: The inner side wall of the groove is a concave wall or a plane wall, and the first reflective layer is a metal layer.

4. The display panel according to claim 1, wherein: The optical structure includes a first reflective layer, a first bump is provided on a side of the second substrate facing the packaging glue layer, the first bump is located on the inner side and / or the outer side of the packaging glue layer, the first reflective layer is provided on the first bump, and has a second reflective surface for reflecting light; Alternatively, the optical structure includes a first bump, which is arranged on a side of the second substrate facing the packaging glue layer and is located on the inner side and / or outer side of the packaging glue layer; the first bump has a second reflection surface for reflecting light.

5. The display panel according to claim 4, wherein: The material of the first convex block is the same as that of the second substrate; the second reflective surface is a plane or a concave surface.

6. The display panel according to claim 1, wherein: The optical structure includes a second bump, which is a light-transmitting bump and is disposed on a side of the second substrate away from the packaging glue layer and located on the inner side and / or outer side of the packaging glue layer. The second bump has a light incident slope for refracting light.

7. The display panel according to claim 6, wherein: The light incident inclined surface is an inner concave surface, and the material of the second protrusion is the same as that of the second substrate.

8. The display panel according to claim 1, wherein: A plurality of high light transmittance regions and low light transmittance regions are disposed on a surface of the second substrate facing away from the first substrate, and the low light transmittance regions correspond to non-hollow regions between the hollow regions.

9. A display device, characterized in that The invention comprises the display panel as claimed in any one of claims 1 to 8.

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