Solder point failure early warning method, device, computer equipment and storage medium

Abstract

The present application relates to a solder joint fault warning method, device, computer equipment and storage medium. The method comprises: continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested; based on the signal recognition model, identifying multiple target radio frequency signals monitored at the solder joints, and obtaining radio frequency signal information corresponding to the solder joints; and performing fault warning processing on the solder joints according to the radio frequency signal information corresponding to the solder joints. The method can be used to warn and accurately locate solder joint faults of components.

Description

Technical Field

[0001] The present application relates to the field of microelectronic reliability technology, and in particular to a solder joint failure early warning method, device, computer equipment and storage medium. Background Art

[0002] In order to test the reliability of the solder joints of components packaged in column grid arrays in a mechanical environment, mechanical stresses such as vibration stress and impact stress are often applied to the solder joints, and the quality of the solder joints in the mechanical environment is tested. By processing and analyzing the test data, it can effectively guide manufacturers to optimize product design and assembly processes and improve product reliability.

[0003] However, existing reliability testing equipment and methods only collect data from some test points of components and are unable to monitor and warn of solder joint failures of components during the test process. Summary of the invention

[0004] Based on this, it is necessary to provide a solder joint failure warning method, device, computer equipment and storage medium that can warn of solder joint failure conditions of components in response to the above technical problems.

[0005] In a first aspect, the present application provides a solder joint failure early warning method, comprising:

[0006] Continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested;

[0007] Based on the signal recognition model, multiple target radio frequency signals monitored at the welding point are identified to obtain radio frequency signal information corresponding to the welding point;

[0008] According to the radio frequency signal information corresponding to the welding point, fault warning processing is performed on the welding point.

[0009] In one embodiment, the radio frequency signal information includes signal energy change; accordingly, the fault warning processing of the solder joint according to the radio frequency signal information corresponding to the solder joint includes:

[0010] If the signal energy change corresponding to the solder joint has a sudden change value, the solder joint is regarded as a faulty solder joint;

[0011] According to the position information of the faulty solder joint, an early warning is issued for the faulty solder joint.

[0012] In one embodiment, according to the position information of the faulty solder joint, a fault warning is performed on the faulty solder joint, including:

[0013] According to the position information of the faulty solder joint, an image of the faulty solder joint is collected to obtain a fault image including the faulty solder joint;

[0014] Output fault warning information including the position information of the faulty solder joint and the fault image.

[0015] In one embodiment, the method further comprises:

[0016] Acquire a waveform image; wherein the waveform image includes waveform information of multiple target radio frequency signals corresponding to the faulty solder joint;

[0017] The signal recognition model is modified according to the waveform image and the fault image of the faulty solder joint.

[0018] In one embodiment, obtaining a waveform image includes:

[0019] Displaying waveform information of multiple target radio frequency signals corresponding to the faulty solder joints by using an oscilloscope device;

[0020] The waveform information displayed by the oscilloscope device is collected to obtain a waveform image.

[0021] In one embodiment, based on a signal recognition model, multiple target radio frequency signals monitored at the welding point are identified to obtain radio frequency signal information corresponding to the welding point, including:

[0022] filtering and correcting a plurality of target radio frequency signals detected at the welding point;

[0023] The processed multiple target radio frequency signals are input into a signal recognition model to obtain radio frequency signal information corresponding to the welding point.

[0024] In one embodiment, the component to be tested is a component located in a mechanical testing environment.

[0025] In a second aspect, the present application also provides a welding point failure early warning device, comprising:

[0026] A signal detection module, used to continuously input the original radio frequency signal to the component to be tested and monitor the solder joints of the component to be tested;

[0027] An information acquisition module, used to identify multiple target radio frequency signals monitored at the welding point based on a signal recognition model, and obtain radio frequency signal information corresponding to the welding point;

[0028] The fault warning module is used to perform fault warning processing on the welding point according to the radio frequency signal information corresponding to the welding point.

[0029] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0030] Continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested;

[0031] Based on the signal recognition model, multiple target radio frequency signals monitored at the welding point are identified to obtain radio frequency signal information corresponding to the welding point;

[0032] According to the radio frequency signal information corresponding to the welding point, fault warning processing is performed on the welding point.

[0033] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the following steps are implemented:

[0034] Continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested;

[0035] Based on the signal recognition model, multiple target radio frequency signals monitored at the welding point are identified to obtain radio frequency signal information corresponding to the welding point;

[0036] According to the radio frequency signal information corresponding to the welding point, fault warning processing is performed on the welding point.

[0037] In a fifth aspect, the present application further provides a computer program product, including a computer program, which implements the following steps when executed by a processor:

[0038] Continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested;

[0039] Based on the signal recognition model, multiple target radio frequency signals monitored at the welding point are identified to obtain radio frequency signal information corresponding to the welding point;

[0040] According to the radio frequency signal information corresponding to the welding point, fault warning processing is performed on the welding point.

[0041] The above-mentioned solder joint fault warning method, device, computer equipment and storage medium continuously input the original RF signal to the component to be tested, and monitor the solder joint of the component to be tested; introduce a signal recognition model to identify multiple target RF signals monitored at the solder joint to obtain the RF signal information corresponding to the solder joint; further, according to the RF signal information corresponding to the solder joint, perform fault warning processing on the solder joint. Since the target RF signal at the solder joint can reflect the reliability of the solder joint, this scheme realizes the collection of reliability data at the solder joint of the component to be tested by monitoring multiple target RF signals at the solder joint of the component to be tested. Furthermore, when the solder joint of the component to be tested fails, it will cause the change of the target RF signal corresponding to the solder joint, and the scheme reflects this change by introducing RF signal information; therefore, this scheme can accurately identify and warn the faulty solder joint of the component to be tested through RF signal information. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] FIG1 is an application environment diagram of a solder joint failure early warning method in one embodiment;

[0044] FIG2 is a schematic diagram of a flow chart of a solder joint failure early warning method in one embodiment;

[0045] FIG3 is a schematic diagram of a process of providing early warning for a faulty welding point in one embodiment;

[0046] FIG4 is a schematic diagram of a process of providing early warning for a faulty welding point in another embodiment;

[0047] FIG5 is a schematic diagram of a process of modifying a signal recognition model in one embodiment;

[0048] FIG6 is a schematic diagram of a process for determining radio frequency signal information in one embodiment;

[0049] FIG7 is a schematic diagram of a flow chart of a welding point failure early warning method in another embodiment;

[0050] FIG8 is a structural block diagram of a welding point failure early warning device in one embodiment;

[0051] FIG9 is a structural block diagram of a welding point failure early warning device in one embodiment;

[0052] FIG. 10 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0054] The solder joint fault warning method provided in the embodiment of the present application can be applied in the application environment as shown in FIG1. ​​The component 101 to be tested is in a mechanical environment. In the embodiment of the present application, the component to be tested can be a component packaged by a column grid array, and the mechanical environment is an environment for reliability testing of the component packaged by the column grid array. Among them, the component 101 to be tested communicates with the monitoring device 102 through a cable. Among them, the monitoring device 102 can be a terminal with powerful computing power and signal processing capabilities, especially a terminal integrated with an early warning device and an RF signal generator. Optionally, the RF signal generator integrated in the monitoring device 102 continuously inputs the original RF signal to the component 101 to be tested, and monitors the solder joints of the component to be tested; based on the signal recognition model, multiple target RF signals monitored at the solder joints are identified to obtain the RF signal information corresponding to the solder joints; further, the monitoring terminal 102 performs fault early warning processing on the solder joints through the early warning device according to the RF signal information corresponding to the solder joints.

[0055] In one embodiment, as shown in FIG. 2 , a welding point fault early warning method is provided, which is described by taking the method applied to the monitoring device 102 in FIG. 1 as an example, and specifically includes the following steps:

[0056] S201, continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested.

[0057] The components to be tested are components for reliability testing; in the embodiment of the present application, the components to be tested are components that are packaged in a column grid array and are located in a mechanical environment. The original RF signal is a RF signal that has not been propagated after being transmitted.

[0058] Optionally, a radio frequency signal of a fixed frequency may be generated by a radio frequency signal generator and continuously input into the component to be tested as an original radio frequency signal, and the solder joints of the component to be tested may be continuously monitored.

[0059] S202, based on the signal recognition model, multiple target radio frequency signals monitored at the welding point are recognized to obtain radio frequency signal information corresponding to the welding point.

[0060] The signal recognition model is a model that can recognize radio frequency signals. The target radio frequency signal is the radio frequency signal transmitted from the original signal to the welding point. The radio frequency signal information is information that can describe the characteristics of the target radio frequency signal. For example, the radio frequency signal information can be the energy value, attenuation value, etc. of multiple target radio frequency signals, or the change of energy value, attenuation value, etc. of multiple target radio frequency signals.

[0061] Optionally, since the process of inputting the original RF signal to the component to be tested is continuous, multiple target RF signals can also be monitored at the solder joints of the components; further, the multiple target RF signals monitored at the solder joints are input into the signal recognition model, and the multiple target RF signals are identified through the preset algorithm in the signal recognition model, so as to obtain the RF signal information corresponding to the solder joints.

[0062] Exemplarily, if the RF signal information is the energy value of multiple target RF signals, for each RF signal, the signal recognition model needs to digitally process the target RF signal to obtain a discrete signal, and calculate the energy value based on the amplitude of each discrete signal, and take the sum of the energy values ​​of all discrete signals as the energy value of the target RF signal.

[0063] S203, performing fault warning processing on the welding point according to the radio frequency signal information corresponding to the welding point.

[0064] Optionally, when a solder joint of a component fails, it will cause a change in the resistance in the monitoring circuit, which will in turn cause a change in the target RF signal; therefore, based on the RF signal information corresponding to the solder joint, it is possible to analyze whether the solder joint has failed, and the time when the solder joint failed can be determined; further, the failed solder joint is regarded as a failed solder joint, and the failed solder joint and the time when the failure occurred are transmitted to the early warning device to provide a fault warning for the solder joint.

[0065] It should be noted that in the embodiment of the present application, by monitoring multiple target RF signals at the solder joints, the reliability data of the solder joints during the entire reliability test process can be analyzed, thereby achieving the effect of full process monitoring and data collection during the reliability test process.

[0066] In the above solder joint fault warning method, the original RF signal is continuously input to the component to be tested, and the solder joint of the component to be tested is monitored; a signal recognition model is introduced to identify multiple target RF signals monitored at the solder joint to obtain the RF signal information corresponding to the solder joint; further, the solder joint is subjected to fault warning processing according to the RF signal information corresponding to the solder joint. Since the target RF signal at the solder joint can reflect the reliability of the solder joint, this scheme realizes the collection of reliability data at the solder joint of the component to be tested by monitoring multiple target RF signals at the solder joint of the component to be tested. Furthermore, when the solder joint of the component to be tested fails, it will cause the change of the target RF signal corresponding to the solder joint, and the scheme reflects this change by introducing RF signal information; therefore, this scheme can accurately identify and warn the faulty solder joint of the component to be tested through RF signal information.

[0067] Optionally, when a solder joint of a component fails, it will cause a change in the resistance value in the monitoring circuit, which will in turn cause a change in the energy of the target RF signal. Therefore, in an embodiment of the present application, it is possible to determine whether a solder joint of a component fails by monitoring the energy of the target RF signal. Therefore, in one embodiment, the RF signal information includes the change in signal energy, as shown in FIG3 , which provides a method for early warning of a faulty solder joint, specifically comprising the following steps:

[0068] S301: If the signal energy change corresponding to the solder joint has a sudden change value, the solder joint is regarded as a faulty solder joint.

[0069] The signal energy change is the change of the energy of the target radio frequency signal over time. The mutation value is a value that changes sharply. The faulty solder joint is a faulty solder joint, for example, a cracked solder joint can be a faulty solder joint.

[0070] Optionally, if a solder joint fails, it will cause a sudden change in the target RF signal energy. Therefore, if the signal energy corresponding to the solder joint changes to a sudden value, that is, the target RF signal energy changes suddenly, it means that the solder joint fails; at this time, the solder joint can be regarded as a failed solder joint.

[0071] S302, issuing an early warning for the faulty solder joint according to the position information of the faulty solder joint.

[0072] The position information of the faulty solder joint is information characterizing the position of the faulty solder joint in the component. In the embodiment of the present application, the position information may be coordinates.

[0073] Optionally, fault warning information with the location information of the faulty welding spot may be sent to the warning device, so that the warning device displays the fault warning information for viewing by the staff.

[0074] In this embodiment, by analyzing the change in signal energy, the faulty solder joint can be accurately identified; further, based on the position information of the faulty solder joint, the accurate positioning of the faulty solder joint is achieved.

[0075] Optionally, in order to facilitate the staff to more accurately locate the position of the faulty solder joint after the early warning, and to more intuitively understand the specific situation of the faulty solder joint, therefore, based on the above embodiment, in one embodiment, as shown in FIG. 4, another fault early warning method is provided, which specifically includes the following steps:

[0076] S401, collecting images of the faulty solder joints according to the position information of the faulty solder joints, and obtaining a fault image including the faulty solder joints.

[0077] Optionally, after obtaining the position information of the faulty solder joint, the acquisition device may be controlled to acquire an image of the position of the faulty solder joint, so as to acquire a fault image including the faulty solder joint from the acquisition device. Exemplarily, the image of the position of the faulty solder joint may be acquired by a high-speed X-ray camera.

[0078] S402, outputting fault warning information including position information of the faulty solder joint and a fault image.

[0079] Optionally, the position information of the faulty solder joint and the fault image collected for the faulty solder joint may be combined into fault warning information, and the fault warning information may be sent to a warning device or a terminal for staff to view.

[0080] In this embodiment, by collecting images of the faulty solder joints according to the position information of the faulty solder joints, and outputting the collected fault images together with the position information of the faulty solder joints, accurate identification and positioning of the faulty solder joints are achieved.

[0081] Optionally, in order to ensure the accuracy of the signal recognition model, it is necessary to dynamically correct the signal recognition model during the early warning process. Therefore, based on the embodiment, in one embodiment, as shown in FIG5 , a method for correcting the signal recognition model is provided, which specifically includes the following steps:

[0082] S501, acquiring a waveform image.

[0083] The waveform image includes waveform information of multiple target radio frequency signals corresponding to the faulty solder joints.

[0084] Optionally, a logic analyzer may be used to measure multiple monitored target RF signals and output waveforms of the multiple target RF signals; further, an image of the waveform output by the logic analyzer may be captured to obtain a waveform image.

[0085] In order to obtain the waveform image more conveniently and ensure the integrity and accuracy of the waveform image, the waveform information of multiple target RF signals corresponding to the faulty solder joint can be displayed through an oscilloscope device; the waveform information displayed by the oscilloscope device can be collected to obtain the waveform image. Specifically, the multiple target RF signals corresponding to the faulty solder joint can be transmitted to the oscilloscope device through an external oscilloscope device, so that the oscilloscope device displays the waveform information of the target RF signal; further, the waveform information displayed by the oscilloscope device can be photographed and collected through a camera to obtain the waveform image.

[0086] S502, modifying the signal recognition model according to the waveform image and the fault image of the faulty solder joint.

[0087] Optionally, after acquiring the waveform image, the waveform information in the waveform image and the fault image can be fitted and analyzed to obtain the data of the faulty solder joint during the entire test process. The time when the faulty solder joint failed, the fault state and other information are identified based on the fitting analysis results to obtain the error of the signal recognition model, and the signal recognition model is corrected based on the error.

[0088] In this embodiment, by obtaining a waveform image containing waveform information of multiple target RF signals corresponding to a faulty solder joint, and correcting the signal recognition model based on the waveform image and the fault image, the accuracy of the signal recognition model is improved, thereby ensuring the accuracy of faulty solder joint identification.

[0089] Optionally, since the detected target RF signal may contain noise, the target RF signal may be preprocessed to ensure the stability of the target RF signal. In one embodiment, as shown in FIG6 , a method for determining RF signal information is provided, which specifically includes the following steps:

[0090] S601, filtering and correcting multiple target radio frequency signals detected at the welding point.

[0091] Optionally, for each target RF signal, a filter can be used to perform frequency selection and remove spurious components of the target RF signal, thereby improving the quality and accuracy of the target RF signal; further, a digital filter can be used to perform real-time adjustment and optimization of the target RF signal to ensure the stability of the target RF signal.

[0092] S602, inputting the processed multiple target radio frequency signals into a signal recognition model to obtain radio frequency signal information corresponding to the welding point.

[0093] Optionally, the processed multiple target RF signals may be input into a signal recognition model, and the multiple target RF signals may be recognized by a preset algorithm in the signal recognition model to obtain RF signal information corresponding to the welding point.

[0094] In this embodiment, by filtering and correcting the multiple target radio frequency signals monitored by the welding points, the accuracy and stability of the target radio frequency signals are ensured, thereby ensuring the accuracy of the determined radio frequency signal information.

[0095] FIG7 is a flow chart of a solder joint failure early warning method in another embodiment. Based on the above embodiment, this embodiment provides an optional example of a solder joint failure early warning method. In conjunction with FIG7 , the specific implementation process is as follows:

[0096] S701, continuously inputting original radio frequency signals to the components to be tested, and monitoring solder joints of the components to be tested.

[0097] Among them, the components to be tested are components located in a mechanical testing environment.

[0098] S702, filtering and correcting the multiple target radio frequency signals detected at the welding point.

[0099] S703, inputting the processed multiple target radio frequency signals into a signal recognition model to obtain radio frequency signal information corresponding to the welding point.

[0100] The radio frequency signal information includes the change of signal energy.

[0101] S704: If the signal energy change in the radio frequency signal information corresponding to the soldering point has a sudden change value, the soldering point is regarded as a faulty soldering point.

[0102] S705, collecting images of the faulty solder joints according to the position information of the faulty solder joints, and obtaining a fault image including the faulty solder joints.

[0103] S706, outputting fault warning information including location information of the faulty solder joint and the fault image.

[0104] Optionally, the waveform information of multiple target RF signals corresponding to the faulty solder joints can be displayed by an oscilloscope device; the waveform information displayed by the oscilloscope device can be collected to obtain a waveform image; and the signal recognition model can be corrected according to the waveform image and the fault image of the faulty solder joint.

[0105] The specific process of the above S701-S706 can refer to the description of the above method embodiment, and its implementation principle and technical effect are similar, which will not be repeated here.

[0106] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0107] Based on the same inventive concept, the embodiment of the present application also provides a solder joint fault warning device for implementing the solder joint fault warning method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more solder joint fault warning device embodiments provided below can refer to the limitations of the solder joint fault warning method above, and will not be repeated here.

[0108] In one embodiment, as shown in FIG8 , a welding point fault warning device 80 is provided, comprising: a signal detection module 10, an information acquisition module 20 and a fault warning module 30, wherein:

[0109] The signal detection module 10 is used to continuously input the original radio frequency signal to the component to be tested and monitor the solder joints of the component to be tested.

[0110] The information acquisition module 20 is used to identify multiple target radio frequency signals monitored at the welding point based on the signal recognition model, and obtain radio frequency signal information corresponding to the welding point.

[0111] The fault warning module 30 is used to perform fault warning processing on the welding point according to the radio frequency signal information corresponding to the welding point.

[0112] The above-mentioned solder joint fault warning device continuously inputs the original RF signal to the component to be tested, and monitors the solder joints of the component to be tested; introduces a signal recognition model to identify multiple target RF signals monitored at the solder joints, and obtains the RF signal information corresponding to the solder joints; further, according to the RF signal information corresponding to the solder joints, the solder joints are subjected to fault warning processing. Since the target RF signal at the solder joint can reflect the reliability of the solder joint, this scheme realizes the collection of reliability data at the solder joints of the component to be tested by monitoring multiple target RF signals at the solder joints of the component to be tested. Furthermore, since when the solder joint of the component to be tested fails, it will cause the change of the target RF signal corresponding to the solder joint, and the scheme reflects this change by introducing RF signal information; therefore, this scheme can accurately identify and warn the faulty solder joints of the component to be tested through RF signal information.

[0113] In one embodiment, the radio frequency signal information includes signal energy change. Based on FIG. 8 , as shown in FIG. 9 , the fault warning module 30 includes:

[0114] The welding point determination unit 31 is used to determine the welding point as a faulty welding point if the signal energy change corresponding to the welding point has a sudden change value.

[0115] The fault warning unit 32 is used to warn the faulty soldering point according to the position information of the faulty soldering point.

[0116] In one embodiment, the fault warning unit 32 is specifically used for:

[0117] According to the position information of the faulty solder joint, the image of the faulty solder joint is collected to obtain a fault image containing the faulty solder joint; and fault warning information containing the position information of the faulty solder joint and the fault image is output.

[0118] In one embodiment, the welding point failure warning device 80 further includes:

[0119] The image acquisition unit is used to acquire a waveform image; wherein the waveform image includes waveform information of multiple target radio frequency signals corresponding to the faulty solder joint.

[0120] The model correction unit is used to correct the signal recognition model according to the waveform image and the fault image of the faulty solder joint.

[0121] In one embodiment, the image acquisition unit is specifically used for:

[0122] The waveform information of multiple target radio frequency signals corresponding to the faulty solder joints is displayed by an oscilloscope device; the waveform information displayed by the oscilloscope device is collected to obtain a waveform image.

[0123] In one embodiment, the information acquisition module 20 is specifically used for:

[0124] The multiple target radio frequency signals monitored at the welding point are filtered and corrected; the processed multiple target radio frequency signals are input into the signal recognition model to obtain the radio frequency signal information corresponding to the welding point.

[0125] In one embodiment, the component to be tested is a component located in a mechanical testing environment.

[0126] Each module in the above-mentioned solder joint fault warning device can be implemented in whole or in part by software, hardware and their combination. Each module can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each module above.

[0127] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be shown in FIG10. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected via a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be implemented through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a solder joint fault early warning method is implemented.

[0128] Those skilled in the art will understand that the structure shown in FIG. 10 is merely a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0129] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0130] Continuously input the original RF signal to the components to be tested, and monitor the solder joints of the components to be tested;

[0131] Based on the signal recognition model, multiple target RF signals monitored at the solder joints are identified to obtain the RF signal information corresponding to the solder joints;

[0132] According to the RF signal information corresponding to the soldering point, fault warning processing is performed on the soldering point.

[0133] In one embodiment, the radio frequency signal information includes signal energy change conditions, and when the processor executes the computer program to perform fault warning processing on the welding point according to the radio frequency signal information corresponding to the welding point, the following steps are also implemented:

[0134] If the signal energy change corresponding to the solder joint has a mutation value, the solder joint is regarded as a faulty solder joint; and according to the position information of the faulty solder joint, an early warning is issued for the faulty solder joint.

[0135] In one embodiment, when the processor executes the computer program to provide a fault warning for the faulty solder joint according to the position information of the faulty solder joint, the processor further implements the following steps:

[0136] According to the position information of the faulty solder joint, the image of the faulty solder joint is collected to obtain a fault image containing the faulty solder joint; and fault warning information containing the position information of the faulty solder joint and the fault image is output.

[0137] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0138] A waveform image is obtained; wherein the waveform image contains waveform information of multiple target radio frequency signals corresponding to the faulty solder joint; and the signal recognition model is corrected according to the waveform image and the fault image of the faulty solder joint.

[0139] In one embodiment, when the processor executes the computer program to obtain the waveform image, the processor also implements the following steps:

[0140] The waveform information of multiple target radio frequency signals corresponding to the faulty solder joints is displayed by an oscilloscope device; the waveform information displayed by the oscilloscope device is collected to obtain a waveform image.

[0141] In one embodiment, when the processor executes the computer program to identify multiple target radio frequency signals monitored at the welding point based on the signal recognition model and obtains radio frequency signal information corresponding to the welding point, the following steps are also implemented:

[0142] The multiple target radio frequency signals monitored at the welding point are filtered and corrected; the processed multiple target radio frequency signals are input into the signal recognition model to obtain the radio frequency signal information corresponding to the welding point.

[0143] In one embodiment, the component to be tested is a component located in a mechanical testing environment.

[0144] In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0145] Continuously input the original RF signal to the components to be tested, and monitor the solder joints of the components to be tested;

[0146] Based on the signal recognition model, multiple target RF signals monitored at the solder joints are identified to obtain the RF signal information corresponding to the solder joints;

[0147] According to the RF signal information corresponding to the soldering point, fault warning processing is performed on the soldering point.

[0148] In one embodiment, the radio frequency signal information includes signal energy change. When the computer program performs fault warning processing on the welding point according to the radio frequency signal information corresponding to the welding point and is executed by the processor, the following steps are also implemented:

[0149] If the signal energy change corresponding to the solder joint has a mutation value, the solder joint is regarded as a faulty solder joint; and according to the position information of the faulty solder joint, an early warning is issued for the faulty solder joint.

[0150] In one embodiment, when the computer program performs a fault warning for the faulty solder joint according to the position information of the faulty solder joint and is executed by the processor, the following steps are also implemented:

[0151] According to the position information of the faulty solder joint, the image of the faulty solder joint is collected to obtain a fault image containing the faulty solder joint; and fault warning information containing the position information of the faulty solder joint and the fault image is output.

[0152] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0153] A waveform image is obtained; wherein the waveform image contains waveform information of multiple target radio frequency signals corresponding to the faulty solder joint; and the signal recognition model is corrected according to the waveform image and the fault image of the faulty solder joint.

[0154] In one embodiment, when the computer program for acquiring the waveform image is executed by the processor, the following steps are also implemented:

[0155] The waveform information of multiple target radio frequency signals corresponding to the faulty solder joints is displayed by an oscilloscope device; the waveform information displayed by the oscilloscope device is collected to obtain a waveform image.

[0156] In one embodiment, the computer program identifies multiple target radio frequency signals detected at the welding point based on the signal recognition model, and when the radio frequency signal information corresponding to the welding point is obtained and executed by the processor, the following steps are also implemented:

[0157] The multiple target radio frequency signals monitored at the welding point are filtered and corrected; the processed multiple target radio frequency signals are input into the signal recognition model to obtain the radio frequency signal information corresponding to the welding point.

[0158] In one embodiment, the component to be tested is a component located in a mechanical testing environment.

[0159] In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the following steps:

[0160] Continuously input the original RF signal to the components to be tested, and monitor the solder joints of the components to be tested;

[0161] Based on the signal recognition model, multiple target RF signals monitored at the solder joints are identified to obtain the RF signal information corresponding to the solder joints;

[0162] According to the RF signal information corresponding to the soldering point, fault warning processing is performed on the soldering point.

[0163] In one embodiment, the radio frequency signal information includes signal energy change. When the computer program performs fault warning processing on the solder joint according to the radio frequency signal information corresponding to the solder joint and is executed by the processor, the following steps are also implemented:

[0164] If the signal energy change corresponding to the solder joint has a mutation value, the solder joint is regarded as a faulty solder joint; and according to the position information of the faulty solder joint, an early warning is issued for the faulty solder joint.

[0165] In one embodiment, when the computer program performs a fault warning for the faulty solder joint according to the position information of the faulty solder joint and is executed by the processor, the following steps are also implemented:

[0166] According to the position information of the faulty solder joint, the image of the faulty solder joint is collected to obtain a fault image containing the faulty solder joint; and fault warning information containing the position information of the faulty solder joint and the fault image is output.

[0167] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0168] A waveform image is obtained; wherein the waveform image contains waveform information of multiple target radio frequency signals corresponding to the faulty solder joint; and the signal recognition model is corrected according to the waveform image and the fault image of the faulty solder joint.

[0169] In one embodiment, when the computer program for acquiring the waveform image is executed by the processor, the following steps are also implemented:

[0170] The waveform information of multiple target radio frequency signals corresponding to the faulty solder joints is displayed by an oscilloscope device; the waveform information displayed by the oscilloscope device is collected to obtain a waveform image.

[0171] In one embodiment, the computer program identifies multiple target radio frequency signals detected at the welding point based on the signal recognition model, and when the radio frequency signal information corresponding to the welding point is obtained and executed by the processor, the following steps are also implemented:

[0172] The multiple target radio frequency signals monitored at the welding point are filtered and corrected; the processed multiple target radio frequency signals are input into the signal recognition model to obtain the radio frequency signal information corresponding to the welding point.

[0173] In one embodiment, the component to be tested is a component located in a mechanical testing environment.

[0174] It should be noted that the data involved in this application (including but not limited to data used for analysis, storage, display, etc.) are all information and data fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0175] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0176] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0177] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A solder joint failure early warning method, characterized in that: The method comprises: Continuously inputting original radio frequency signals to the components to be tested, and monitoring the solder joints of the components to be tested; Based on the signal recognition model, multiple target radio frequency signals monitored at the welding point are identified to obtain radio frequency signal information corresponding to the welding point; When it is determined that the solder joint is a faulty solder joint according to the radio frequency signal information corresponding to the solder joint, an image of the faulty solder joint is captured according to the position information of the faulty solder joint to obtain a fault image including the faulty solder joint; Performing fault warning processing on the faulty solder joint according to the position information and the fault image of the faulty solder joint; Wherein, after the fault warning is performed on the faulty welding point, the method further comprises: Acquire a waveform image; wherein the waveform image includes waveform information of multiple target radio frequency signals corresponding to the faulty solder joint; Performing fitting processing on the waveform image and the fault image to obtain a recognition error of the signal recognition model; The signal recognition model is modified according to the recognition error.

2. The method according to claim 1, characterized in that The radio frequency signal information includes signal energy change; Correspondingly, determining that the solder joint is a faulty solder joint according to the radio frequency signal information corresponding to the solder joint includes: If the signal energy change corresponding to the solder joint has a sudden change value, the solder joint is determined to be a faulty solder joint.

3. The method according to claim 1, characterized in that The performing fault warning processing on the faulty solder joint according to the position information and the fault image of the faulty solder joint comprises: Output fault warning information including the position information of the faulty solder joint and the fault image.

4. The method according to claim 1, characterized in that: The step of acquiring a waveform image comprises: Displaying waveform information of multiple target radio frequency signals corresponding to the faulty solder joints by using an oscilloscope device; The waveform information displayed by the oscilloscope device is collected to obtain a waveform image.

5. The method according to claim 1, characterized in that The method of identifying multiple target radio frequency signals monitored at the welding point based on the signal recognition model to obtain radio frequency signal information corresponding to the welding point includes: filtering and correcting a plurality of target radio frequency signals detected at the welding point; The processed multiple target radio frequency signals are input into a signal recognition model to obtain radio frequency signal information corresponding to the welding point.

6. The method according to any one of claims 1 to 5, characterized in that The components to be tested are components located in a mechanical testing environment.

7. A welding point failure early warning device, characterized in that: The device comprises: A signal detection module, used to continuously input the original radio frequency signal to the component to be tested and monitor the solder joints of the component to be tested; An information acquisition module, used to identify multiple target radio frequency signals monitored at the welding point based on a signal recognition model, and obtain radio frequency signal information corresponding to the welding point; An image acquisition module, configured to, when the solder joint is determined to be a faulty solder joint according to the radio frequency signal information corresponding to the solder joint, collect an image of the faulty solder joint according to the position information of the faulty solder joint to obtain a fault image including the faulty solder joint; A fault warning module, used for performing fault warning processing on the faulty soldering point according to the position information and the fault image of the faulty soldering point; A waveform acquisition module, used to acquire a waveform image; wherein the waveform image includes waveform information of multiple target radio frequency signals corresponding to the faulty solder joint; An error determination module, used for performing fitting processing on the waveform image and the fault image to obtain a recognition error of the signal recognition model; The model correction module is used to correct the signal recognition model according to the recognition error.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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