A lower electrode surface fabrication process

Abstract

The application discloses a lower electrode surface manufacturing process, which comprises the following steps: manufacturing a base material on the surface of a lower electrode, wherein the base material is provided with a cooling water channel and a helium gas channel; manufacturing a coating layer on the surface of the base material by adopting a plasma melting method; performing finishing processing on the coating layer, wherein the finishing tool body is as follows: the surface of the coating layer is integrally ground, then the middle region of the coating layer is ground downward, so that a raised protruding part is formed on the edge region of the coating layer; the protruding part and the region in the inside of the protruding part are shielded by using heat-resistant glue; the surface of the lower electrode is sandblasted to increase the roughness of the surface of the lower electrode; and a rough layer is manufactured on the middle region of the coating layer by adopting the plasma melting method. The lower electrode surface manufacturing process designed by the scheme can effectively increase the surface roughness of the lower electrode, increase the space between the glass and the surface of the lower electrode, and thus improve the circulation of the cooling gas.

Description

Technical Field

[0001] This invention relates to the field of manufacturing technology for the lower electrode of a display panel, and specifically to a manufacturing process for the surface of the lower electrode. Background Technology

[0002] In the fabrication of LCD display panels, the required microstructures are formed on glass using a dry etching process. During dry etching, a lower electrode is used to hold the glass in place. Since the glass temperature often rises during dry etching, helium channels are incorporated into the lower electrode. During dry etching, helium flows between the surface of the lower electrode and the back of the glass to increase heat conduction and prevent the glass temperature from rising further. Simultaneously, the surface of the lower electrode needs a certain degree of roughness to ensure sufficient space between the lower electrode and the glass for adequate helium flow. However, traditional lower electrode surface fabrication processes achieve a roughness of 2-5 micrometers, resulting in a small gap between the lower electrode surface and the back of the glass, which hinders the flow of cooling gas.

[0003] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0004] To overcome the above-mentioned shortcomings, the present invention aims to provide a manufacturing process for the lower electrode surface, thereby effectively solving the above-mentioned technical problems.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a process for fabricating the surface of a lower electrode, which includes the following steps:

[0006] Step 1: Fabricate a substrate on the surface of the lower electrode, wherein cooling water channels and helium flow channels are formed on the substrate;

[0007] Step 2: Apply a coating to the substrate surface using plasma spraying;

[0008] Step 3: Perform finishing on the coating. The finishing process is as follows: first, grind the entire surface of the coating, and then grind downwards in the middle area of ​​the coating to form raised protrusions at the edge of the coating.

[0009] Step 4: Cover the protrusion and the area inside the protrusion with heat-resistant adhesive;

[0010] Step 5: Sandblast the surface of the lower electrode to increase its roughness;

[0011] Step 6: Use plasma spraying to create a rough layer in the middle area of ​​the coating.

[0012] Furthermore, in step 2 above, the coating includes a lower dielectric layer, an electrode layer, and an upper dielectric layer.

[0013] Furthermore, the thickness of the lower dielectric layer is 300-500 micrometers, the thickness of the electrode layer is 50 micrometers, and the thickness of the upper dielectric layer is 500 micrometers; at the same time, the upper and lower dielectric layers are made of the same material, aluminum oxide; the electrode layer is made of tungsten or molybdenum.

[0014] Furthermore, in step 3 above, the coating is ground to make the surface roughness of the coating 1 micrometer; when grinding downwards in the middle area of ​​the coating, the height of the protrusion formed in the edge area of ​​the coating is 30~100 micrometers.

[0015] Furthermore, in step 4 above, the area inside the protrusion that is covered with heat-resistant adhesive is specifically the area 5 to 10 millimeters away from the inner wall of the protrusion. This area will become a groove after the rough layer is made in step 6.

[0016] Furthermore, in step 5 above, after sandblasting the surface of the lower electrode, the surface roughness of the lower electrode is specifically 3 micrometers or more.

[0017] Furthermore, in step 5 above, the sandblasting pressure is 0.3~0.8MPa, and the sandblasting material is 60#~100# white fused alumina.

[0018] Furthermore, in step 6 above, the rough layer material is alumina or yttrium oxide powder, and the average particle size of the alumina or yttrium oxide powder is 60-80 micrometers, and the roughness of the resulting coating is above 6 micrometers.

[0019] Furthermore, in step 6 above, during plasma spraying, the distance between the spray gun and the lower electrode surface is 150 mm, and the gases used to form the plasma are argon and hydrogen, with a gas flow rate of 10:1.

[0020] The beneficial effects of the present invention are as follows: The manufacturing process of the lower electrode surface designed in this invention can effectively improve the surface roughness of the lower electrode, thereby increasing the contact between the glass and the lower electrode surface, so that there can be a gap between the two to accommodate cooling gas, thereby improving the flow of cooling gas, maintaining the uniformity of cooling effect, and solving the problem of uneven temperature difference in different parts of the glass substrate. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the substrate surface fabrication process according to an embodiment of the present invention.

[0022] In the diagram: 1. Protrusion; 2. Rough layer; 3. Groove. Detailed Implementation

[0023] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0024] Please see Figure 1 It should be noted that in the description of this invention, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component must be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0025] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] See appendix Figure 1 As shown, an embodiment of the present invention provides a process for fabricating the surface of a lower electrode, which includes the following steps:

[0027] Step 1: Fabricate a substrate on the surface of the lower electrode, wherein cooling water channels and helium flow channels are formed on the substrate.

[0028] Step 2: A coating is formed on the substrate surface using plasma spraying. The coating includes a lower dielectric layer, an electrode layer, and an upper dielectric layer. The thickness of the lower dielectric layer is 500 micrometers, the thickness of the electrode layer is 50 micrometers, and the thickness of the upper dielectric layer is 500 micrometers. The upper and lower dielectric layers are made of the same material, namely alumina or other ceramics, and the electrode layer is made of a chemically stable metal such as tungsten or molybdenum.

[0029] Step 3: Perform finishing on the coating. The finishing process is as follows: First, grind the entire surface of the coating to make the surface roughness of the coating 1 micrometer; then grind downward in the middle area of ​​the coating to form a raised part 1 at the edge of the coating, with a height of 100 micrometers.

[0030] Step 4: Cover the protrusion 1 and the area inside the protrusion 1 with heat-resistant adhesive; the covered area inside the protrusion 1 is specifically the area 5-10 mm away from the inner wall of the protrusion 1, and this area will become the groove 3 after the rough layer 2 in step 6 is made.

[0031] Step 5: Sandblast the surface of the lower electrode to increase the surface roughness of the lower electrode to about 3 micrometers. During sandblasting, the sandblasting pressure is 0.3~0.8MPa, and the sandblasting material is 60#~100# white corundum.

[0032] Step 6: A rough layer 2 is formed in the middle region of the coating by plasma spraying. The material used for plasma spraying is alumina or yttrium oxide powder, and the average particle size of the alumina or yttrium oxide powder is 60-80 micrometers. The roughness of the resulting coating is above 6 micrometers. During spraying, the distance between the spray gun and the lower electrode surface is about 150 mm. The gas used to form the plasma is argon and hydrogen, and the gas flow rate is about 10:1.

[0033] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A lower electrode surface fabrication process, characterized by: It comprises the following steps: Step 1: make a base material on the surface of the lower electrode, which is provided with cooling water channels and helium flow channels; Step 2: make a coating on the surface of the base material by plasma spraying; Step 3: finish the coating, the finishing tool body is as follows: grind the surface of the coating as a whole, then grind the middle region of the coating downward, so that the edge region of the coating forms a raised protrusion; Step 4: shield the protrusion and the region inside the protrusion with heat-resistant glue; Step 5: sand blast the surface of the lower electrode to increase the roughness of the surface of the lower electrode; Step 6: make a rough layer in the middle region of the coating by plasma spraying.

2. The lower electrode surface fabrication process of claim 1, wherein: In the above step 2, the coating comprises a lower dielectric layer, an electrode layer and an upper dielectric layer.

3. The lower electrode surface fabrication process of claim 2, wherein: The thickness of the lower dielectric layer is 300-500 microns, the thickness of the electrode layer is 50 microns, and the thickness of the upper dielectric layer is 300-500 microns; at the same time, the upper dielectric and the lower dielectric have the same material, both of which are aluminum oxide; the material of the electrode layer is tungsten or molybdenum.

4. The lower electrode surface fabrication process of claim 1, wherein: In the above step 3, the coating is ground, so that the roughness of the surface of the coating after grinding is 1 micron; when the middle region of the coating is ground downward, the height of the protrusion formed in the edge region of the coating is 30-100 microns.

5. The lower electrode surface fabrication process of claim 1, wherein: In the above step 4, the region inside the protrusion shielded with heat-resistant glue is specifically a region 5-10 mm away from the inner wall surface of the protrusion, which will become a groove after the rough layer is made in step 6.

6. The lower electrode surface fabrication process of claim 1, wherein: In the above step 5, after the surface of the lower electrode is sand blasted, the surface roughness of the lower electrode is specifically 3 microns or more.

7. The lower electrode surface fabrication process of claim 1, wherein: In the above step 5, the pressure of sand blasting is 0.3-0.8 MPa, and the sand blasting material is 60#-100# white corundum.

8. The lower electrode surface fabrication process of claim 1, wherein: In the above step 6, the material of the rough layer is aluminum oxide or yttrium oxide powder, and the average particle size of the aluminum oxide or yttrium oxide powder is 60-80 microns, and the roughness of the formed coating is 6 microns or more.

9. The lower electrode surface fabrication process of claim 1, wherein: In the above step 6, when plasma spraying is performed, the distance between the spraying gun and the surface of the lower electrode is 150 mm, the gas for forming plasma is argon and hydrogen, and the gas flow rate is 10:1.

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