A chip sorting device and its working method

Abstract

The present invention belongs to the field of detection technology, and particularly relates to a chip sorting device and its working method, including: an expansion device adapted to expand a wafer structure; a detection device arranged above the expansion device and adapted to detect the wafer structure after expansion; a moving device with the expansion device arranged thereon and adapted to drive the expansion device to move; a thimble device arranged below the expansion device and adapted to lift the chips on the wafer structure, and the thimble device is adapted to keep the thin film at other positions on the wafer structure when lifting the chips. It realizes keeping a certain distance between the chips formed on the cut silicon wafer, facilitating the detection and removal of the chips, and avoiding the deformation of the thin film at other positions and the re-adhesion of other chips during the process of removing the chips.

Description

Technical Field

[0001] The present invention belongs to the field of detection technology, and particularly relates to a chip sorting device and a working method thereof. Background Art

[0002] Chips are formed by cutting silicon wafers. It is difficult to visually detect whether the cut chips are qualified because the cut marks on the silicon wafers are attached together; when removing the cut chips from the film, the chips need to be lifted from the back of the film, and at this time, the film will deform, resulting in the chips that were originally expanded during the detection process sticking together again, and as more and more chips are removed, more and more positions on the film are deformed, making it difficult to keep the film sucked.

[0003] Therefore, based on the above technical problems, it is necessary to design a new chip sorting device and a working method thereof. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip sorting device and a working method thereof.

[0005] To solve the above technical problems, the present invention provides a chip sorting device, including:

[0006] An expansion device, which is suitable for expanding the wafer structure;

[0007] A detection device, which is arranged above the expansion device and is suitable for detecting the wafer structure after the wafer structure is expanded;

[0008] A moving device, on which the expansion device is arranged, and the moving device is suitable for driving the expansion device to move;

[0009] A thimble device, which is arranged below the expansion device and is suitable for lifting the chips on the wafer structure, and the thimble device is suitable for keeping the film at other positions on the wafer structure when lifting the chips.

[0010] Further, the wafer structure includes: a steel sheet, a film, and a silicon wafer;

[0011] A through hole is formed in the steel sheet;

[0012] The film is arranged in the through hole;

[0013] The silicon wafer is pasted on the surface of the film, and the silicon wafer is cut to form chips.

[0014] Further, the thimble device includes: a support column;

[0015] A plurality of needle grooves are formed on the top surface of the support column, and thimbles are suitable for being inserted into the needle grooves.

[0016] Furthermore, a plurality of grooves are formed on the top surface of the support column, and air holes are formed on the bottom surface of the grooves;

[0017] The air holes are arranged more densely at positions on the bottom surface of the groove that are farther away from the center of the support column.

[0018] Furthermore, the air holes are adapted to suck air;

[0019] The needle grooves are adapted to suck or discharge air;

[0020] A thimble is inserted into the needle groove to fit the chip. The film is sucked by sucking air through the needle grooves in the area surrounded by the thimbles and the needle grooves outside the periphery of the thimbles. Air is discharged from the needle grooves where the thimbles are inserted to lift the thimbles, and the lifted thimbles lift the corresponding chips on the film.

[0021] Furthermore, the expansion device includes: a fixed sleeve, a lifting sleeve, a lifting cylinder and a limiting ring;

[0022] The fixed sleeve is arranged on the moving device;

[0023] The lifting sleeve is sleeved inside the fixed sleeve;

[0024] The lifting cylinder is arranged on the outer wall of the fixed sleeve, and the lifting cylinder is connected to the lifting sleeve;

[0025] The limiting ring is arranged above the lifting sleeve;

[0026] The wafer structure is placed between the top surface of the lifting sleeve and the bottom surface of the limiting ring;

[0027] The lifting sleeve is arranged around the support column.

[0028] Furthermore, the top surface of the lifting sleeve is aligned with the steel sheet of the wafer structure.

[0029] Furthermore, the top surface of the lifting sleeve is aligned with the film of the wafer structure.

[0030] Furthermore, the moving device includes: a first moving mechanism and a second moving mechanism;

[0031] The second moving mechanism is arranged on the first moving mechanism;

[0032] The fixed sleeve is arranged on the second moving mechanism;

[0033] The moving direction of the first moving mechanism is perpendicular to the moving direction of the second moving mechanism.

[0034] Furthermore, the first moving mechanism includes: a first slide rail, a first slider and a first motor;

[0035] The first slider is arranged on the first slide rail;

[0036] The first slider is slidably connected to the first slide rail;

[0037] The first motor is connected to the first slider;

[0038] The second moving mechanism is arranged on the first slider.

[0039] Further, the second moving mechanism includes: a second slide rail, a second slider and a second motor;

[0040] The second slide rail is arranged on the first slider;

[0041] The second slide rail is perpendicular to the first slide rail;

[0042] The second slider is slidably arranged on the second slide rail;

[0043] The second motor is arranged on the first slider;

[0044] The second motor is connected to the second slider;

[0045] The fixed sleeve is arranged on the second slider;

[0046] The lifting sleeve is arranged through the second slider.

[0047] On the other hand, the present invention also provides a working method adopted by the above chip sorting device, including:

[0048] Expanding the wafer structure through an expanding device;

[0049] Detecting the wafer structure through a detecting device after the wafer structure is expanded;

[0050] Driving the expanding device to move through a moving device;

[0051] Pushing up the chips on the wafer structure through a thimble device, and the thimble device keeps the thin film at other positions on the wafer structure when pushing up the chips.

[0052] The beneficial effects of the present invention are as follows. The present invention includes an expansion device adapted to expand a wafer structure, a detection device disposed above the expansion device and adapted to detect the wafer structure after expansion, a moving device on which the expansion device is disposed and adapted to drive the expansion device to move, and a thimble device disposed below the expansion device and adapted to lift the chips on the wafer structure, and the thimble device is adapted to keep the thin film at other positions on the wafer structure when lifting the chips. This realizes keeping a certain distance between the chips formed on the cut silicon wafer, facilitating the detection and removal of the chips, and avoiding the deformation of the thin film at other positions and the re-bonding of other chips during the removal of the chips.

[0053] Other features and advantages of the present invention will be described in the following description, and some of them will become obvious from the description or be understood by implementing the present invention. The objectives and other advantages of the present invention are achieved and obtained by the structures specifically pointed out in the description and the drawings.

[0054] To make the above objectives, features, and advantages of the present invention more obvious and understandable, the following specifically provides preferred embodiments and, in conjunction with the accompanying drawings, details are described as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0056] Figure 1 It is a schematic structural diagram of a chip sorting device of the present invention;

[0057] Figure 2 It is a schematic structural diagram of the wafer structure of the present invention;

[0058] Figure 3 It is a schematic structural diagram of the thimble device of the present invention;

[0059] Figure 4 It is of the present invention Figure 3 The enlarged schematic diagram of part A;

[0060] Figure 5 It is a schematic structural diagram of the expansion device of the present invention;

[0061] Figure 6 It is a schematic structural diagram of the moving device of the present invention.

[0062] In the figure:

[0063] 1 Expanding device, 11 Fixed sleeve, 12 Lifting sleeve, 13 Lifting cylinder, 14 Limit ring;

[0064] 2 Moving device, 21 First slide rail, 22 First slider, 23 First motor, 24 Second slide rail, 25 Second slider, 26 Second motor;

[0065] 3 Thimble device, 31 Support column, 32 Needle groove, 33 Thimble, 34 Groove, 35 Air hole, 36 Air port;

[0066] 4 Wafer structure, 41 Steel sheet, 42 Thin film, 43 Silicon wafer. Specific implementation mode

[0067] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0068] Embodiment 1, as Figures 1 to 6 shown, Embodiment 1 of the present invention provides a chip sorting device, including: an expanding device 1, the expanding device 1 being adapted to expand the wafer structure 4; a detecting device, the detecting device being arranged above the expanding device 1, the detecting device being adapted to detect the wafer structure 4 after the wafer structure 4 is expanded; a moving device 2, the expanding device 1 being arranged on the moving device 2, the moving device 2 being adapted to drive the expanding device 1 to move; a thimble device 3, the thimble device 3 being arranged below the expanding device 1, the thimble device 3 being adapted to lift the chips on the wafer structure 4, and the thimble device 3 being adapted to keep the thin film 42 at other positions on the wafer structure 4 when lifting the chips; realizing that a certain distance is maintained between the chips formed on the cut silicon wafer 43, facilitating the detection and removal of the chips, and avoiding the deformation of the thin film 42 at other positions and the re-bonding of other chips together during the process of removing the chips.

[0069] In this embodiment, the detecting device may be a high-definition camera or the like to capture images of the chips and determine whether the chips are qualified through image recognition.

[0070] In this embodiment, the wafer structure 4 includes: a steel sheet 41, a thin film 42, and a silicon wafer 43; a through hole is formed in the steel sheet 41; the thin film 42 is disposed in the through hole; the silicon wafer 43 is adhered to the surface of the thin film 42, and the silicon wafer 43 is cut to form chips; cutting is performed on the silicon wafer 43 to form individual chips, and the cut chips are closely attached to each other, making it difficult to detect the side walls of the chips.

[0071] In this embodiment, the ejector pin device 3 includes: a support column 31; a plurality of pin grooves 32 are formed on the top surface of the support column 31, and ejector pins 33 are adapted to be inserted into the pin grooves 32; a plurality of grooves 34 are formed on the top surface of the support column 31, and air holes 35 are formed on the bottom surface of the grooves 34; the air holes 35 are arranged more densely at positions on the bottom surface of the grooves 34 that are farther away from the center of the support column 31; the air holes 35 are adapted to suck air; the pin grooves 32 are adapted to suck or discharge air; the pin grooves 32 form circles on the top surface of the support column 31, and the grooves 34 are located between two adjacent columns of pin grooves 32 along the radial direction of the circle; the suction or discharge of air in the pin grooves 32 can be controlled independently. For example, a one-way valve can be provided in the pin grooves 32; an air port 36 is formed on the side wall of the support column 31, and multiple air ports 36 can be provided to meet different air discharge or suction requirements. The air port 36 can be communicated with the pin grooves 32 and the air holes 35 through an air passage; an ejector pin 33 is inserted into the pin groove 32 to adapt to the chip. The film 42 is sucked by the pin grooves 32 in the area surrounded by the ejector pins 33 and the pin grooves 32 outside the ejector pins 33. Air is discharged from the pin grooves 32 into which the ejector pins 33 are inserted to lift the ejector pins 33, and the lifted ejector pins 33 lift the corresponding chips on the film 42; according to the shape and size of the chip, the ejector pins 33 are inserted into the corresponding pin grooves 32. The air discharge position of the pin grooves 32 can be on the bottom surface of the pin grooves 32, which is convenient for blowing air out through the air discharge position to lift the ejector pins 33 after the ejector pins 33 are inserted into the pin grooves 32, so that the ejector pins 33 can rise to lift the chip from the back of the film 42, facilitating the removal of the chip from the film 42; the traditional method of lifting the film 42 will cause the film 42 to pull other positions of the film 42 when lifted, causing the originally separated chips to gather again, resulting in possible secondary damage when the chips are lifted and removed subsequently, and it is difficult to accurately detect during subsequent inspections; when it is necessary to lift the chip, the corresponding chip is moved to the pin groove 32 at the center position of the top surface of the support column 31. The film 42 is sucked by the pin grooves 32. At this time, the pin grooves 32 around the ejector pins 33 suck air simultaneously to suck the film 42 around the chip. At this time, air is discharged from the pin grooves 32 corresponding to the ejector pins 33 to lift the ejector pins 33, so that the film 42 corresponding to the chip is lifted. When the film 42 is lifted, since the other surrounding films 42 are sucked, the other films 42 hardly deform, avoiding the chips corresponding to the other film 42 positions from being gathered again due to the deformation of the film 42. The suction force in the pin grooves 32 farther away from the ejector pins 33 is smaller because the film 42 farther away from the ejector pins 33 receives less force when the ejector pins 33 lift the film 42;As more chips are removed, it indicates that more positions on the film 42 are lifted and deformed by the ejector pins 33. When subsequent chips are removed, the film 42 at other positions may be difficult to hold due to deformation. At this time, by sucking air through the air holes 35 in the groove 34, the deformed part of the film 42 at other positions can be sucked into the groove 34, facilitating the suction of the film 42 by the suction in the needle groove 32. The fewer air holes 35 near the center of the top surface of the support post 31, the lower the suction force received by the film 42 corresponding to the chip position, facilitating the ejector pin 33 to lift the film 42; when the film 42 corresponding to the chip is initially lifted, the air holes 35 also suck air to assist in holding the film 42.

[0072] In this embodiment, the expansion device 1 includes: a fixed sleeve 11, a lifting sleeve 12, a lifting cylinder 13, and a limit ring 14; the fixed sleeve 11 is arranged on the moving device 2; the lifting sleeve 12 is inserted into the fixed sleeve 11; the lifting cylinder 13 is arranged on the outer wall of the fixed sleeve 11, and the lifting cylinder 13 is connected to the lifting sleeve 12; the limit ring 14 is arranged above the lifting sleeve 12; the wafer structure 4 is placed between the top surface of the lifting sleeve 12 and the bottom surface of the limit ring 14; the lifting sleeve 12 surrounds the support post 31; the lifting cylinder 13 can drive the lifting sleeve 12 to lift and lower. When the lifting sleeve 12 rises, the wafer structure 4 can be squeezed, causing the film 42 to undergo a slight deformation, separating the originally adhered chips, facilitating the precise detection of the chips; the fixed sleeve 11 can guide the lifting sleeve 12 during the lifting and lowering of the lifting sleeve 12 to prevent the lifting sleeve 12 from shifting; the limit ring 14 can press the wafer structure 4 to prevent the wafer structure 4 from being lifted too much.

[0073] In this embodiment, the top surface of the lifting sleeve 12 is aligned with the steel sheet 41 of the wafer structure 4; in one case, the lifting sleeve 12 contacts the steel sheet 41 during the lifting process, causing a slight deformation of the steel sheet 41. Since the deformation of the steel sheet 41 will pull the film 42, the film 42 will undergo a slight deformation, separating the originally adhered chips.

[0074] In this embodiment, the top surface of the lifting sleeve 12 is aligned with the film 42 of the wafer structure 4; in another case, the lifting sleeve 12 contacts the film 42 during the lifting process, causing a slight deformation of the film 42, separating the originally adhered chips.

[0075] In this embodiment, the mobile device 2 includes: a first moving mechanism and a second moving mechanism; the second moving mechanism is disposed on the first moving mechanism; the fixed sleeve 11 is disposed on the second moving mechanism; the moving direction of the first moving mechanism is perpendicular to the moving direction of the second moving mechanism; the first moving mechanism and the second moving mechanism can drive the expansion device 1 to move, so that the chips are aligned with the thimble device 3 one by one, and the qualified chips are lifted by the thimble device 3, facilitating the removal of the chips.

[0076] In this embodiment, the first moving mechanism includes: a first slide rail 21, a first slider 22, and a first motor 23; the first slider 22 is disposed on the first slide rail 21; the first slider 22 is slidably connected to the first slide rail 21; the first motor 23 is connected to the first slider 22; the second moving mechanism is disposed on the first slider 22; the first slide rail 21 can limit the movement of the first slider 22, and the first motor 23 can drive the movement of the first slider 22; the first motor 23 and the second motor 26 can be a lead screw motor or the like.

[0077] In this embodiment, the second moving mechanism includes: a second slide rail 24, a second slider 25, and a second motor 26; the second slide rail 24 is disposed on the first slider 22; the second slide rail 24 is perpendicular to the first slide rail 21; the second slider 25 is slidably disposed on the second slide rail 24; the second motor 26 is disposed on the first slider 22; the second motor 26 is connected to the second slider 25; the fixed sleeve 11 is disposed on the second slider 25; the lifting sleeve 12 passes through the second slider 25; the second slide rail 24 can limit the movement of the second slider 25, and the second motor 26 can drive the movement of the second slider 25; by the first slider 22 moving on the first slide rail 21 and the second slider 25 moving on the second slide rail 24, the expansion device 1 can move on a plane, and the chips on the expansion device 1 can be aligned with the thimble device 3 one by one.

[0078] Embodiment 2, on the basis of Embodiment 1, Embodiment 2 further provides a working method adopted by the chip sorting device in Embodiment 1, including: expanding the wafer structure 4 by the expansion device 1; detecting the wafer structure 4 by the detection device after the wafer structure 4 is expanded; driving the expansion device 1 to move by the mobile device 2; lifting the chips on the wafer structure 4 by the thimble device 3, and the thimble device 3 keeps the thin film 42 at other positions on the wafer structure 4 when lifting the chips; the specific working method has been described in detail in Embodiment 1 and will not be elaborated here.

[0079] In summary, the present invention includes an expansion device 1 adapted to expand the wafer structure 4; a detection device disposed above the expansion device 1 and adapted to detect the wafer structure 4 after expansion; a moving device 2 on which the expansion device 1 is disposed and adapted to drive the expansion device 1 to move; and a thimble device 3 disposed below the expansion device 1 and adapted to lift the chips on the wafer structure 4, and the thimble device 3 is adapted to keep the thin film 42 at other positions on the wafer structure 4 when lifting the chips. This achieves a certain distance between the chips formed on the cut silicon wafer 43, facilitating the detection and removal of the chips, and avoiding deformation of the thin film 42 at other positions and re - adhesion of other chips during the removal of the chips.

[0080] Each device (components without specific structure description) selected in this application is a general standard component or a component known to those skilled in the art, and its structure and principle can be known to those skilled in the art through technical manuals or obtained through conventional experimental methods.

[0081] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0082] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0083] In several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some communication interfaces. The indirect coupling or communication connection of the devices or units can be in an electrical, mechanical, or other form.

[0084] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0085] In addition, in each embodiment of the present invention, the functional units can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0086] Taking the above ideal embodiments of the present invention as an inspiration, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A chip sorting device, characterized in that, Comprising: An expansion device adapted to expand a wafer structure; A detection device disposed above the expansion device and adapted to detect the wafer structure after the wafer structure is expanded; A moving device with the expansion device disposed thereon, the moving device adapted to drive the expansion device to move; A thimble device disposed below the expansion device, the thimble device adapted to lift the chips on the wafer structure, and the thimble device adapted to hold the thin film at other positions on the wafer structure when lifting the chips; The wafer structure includes: a steel sheet, a thin film, and a silicon wafer; Through holes are formed in the steel sheet; The thin film is disposed in the through holes; The silicon wafer is adhered to the surface of the thin film, and the silicon wafer is cut to form chips; The thimble device includes: support columns; A plurality of needle grooves are formed in the top surface of the support column, and thimbles are adapted to be inserted into the needle grooves; A plurality of grooves are formed in the top surface of the support column, and air holes are formed in the bottom surface of the grooves; The air holes are arranged more densely at positions on the bottom surface of the grooves that are farther away from the center of the support column; The air holes are adapted to suck air; The needle grooves are adapted to suck air or discharge air; Thimbles are inserted into the needle grooves to fit the chips. The thin film is sucked by the needle grooves in the area surrounded by the thimbles and the needle grooves outside the thimbles. Air is discharged from the needle grooves into which the thimbles are inserted to lift the thimbles, and the lifted thimbles lift the corresponding chips on the thin film; The expansion device includes: a fixed sleeve, a lifting sleeve, a lifting cylinder, and a limiting ring; The fixed sleeve is disposed on the moving device; The lifting sleeve is inserted into the fixed sleeve; The lifting cylinder is disposed on the outer wall of the fixed sleeve, and the lifting cylinder is connected to the lifting sleeve; The limiting ring is disposed above the lifting sleeve; The wafer structure is placed between the top surface of the lifting sleeve and the bottom surface of the limiting ring; The lifting sleeve surrounds the support column; The top surface of the lifting sleeve is aligned with the steel sheet of the wafer structure.

2. The chip sorting device according to claim 1, wherein: The top surface of the lifting sleeve is aligned with the thin film of the wafer structure.

3. The chip sorting device according to claim 2, wherein: The moving device includes: a first moving mechanism and a second moving mechanism; The second moving mechanism is disposed on the first moving mechanism; The fixed sleeve is disposed on the second moving mechanism; The moving direction of the first moving mechanism is perpendicular to the moving direction of the second moving mechanism.

4. The chip sorting device according to claim 3, wherein: The first moving mechanism includes: a first slide rail, a first slider, and a first motor; The first slider is disposed on the first slide rail; The first slider is slidably connected to the first slide rail; The first motor is connected to the first slider; The second moving mechanism is disposed on the first slider.

5. The chip sorting device according to claim 4, wherein: The second moving mechanism includes: a second slide rail, a second slider, and a second motor; The second slide rail is disposed on the first slider; The second slide rail is perpendicular to the first slide rail; The second slider is slidably disposed on the second slide rail; The second motor is disposed on the first slider; The second motor is connected to the second slider; The fixed sleeve is disposed on the second slider; The lifting sleeve is disposed through the second slider.

6. A working method adopted by the chip sorting device according to claim 1, characterized in that, Comprising: Expanding the wafer structure through an expansion device; Detecting the wafer structure through a detection device after the wafer structure is expanded; Driving the expansion device to move through a moving device; Pushing up the chip on the wafer structure through a thimble device, and the thimble device maintaining the thin film at other positions on the wafer structure when pushing up the chip.

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