Dual color temperature LED and manufacturing method thereof

Abstract

The present application discloses a dual-color temperature LED and a manufacturing method thereof, which relates to the technical field of LEDs, and includes a single cup bracket, a light-emitting chip, a first fluorescent layer, a second fluorescent layer, and a third fluorescent layer. The single cup bracket has four pins, and two of the pins are respectively arranged on the opposite side walls of the single cup bracket, and the pins extend from the side walls of the single cup bracket to the bottom wall to form a foot-wrapping structure; the light-emitting chip includes a first chip and a second chip, both of which are mounted on the single cup bracket, and the light-emitting chip is connected to the pins; the first fluorescent layer is formed on the upper surface of the first chip; the second fluorescent layer is formed on the upper surface of the second chip; the third fluorescent layer is formed on the outer side of the first fluorescent layer and the second fluorescent layer. The foot-wrapping structure enhances the connection strength between the pin and the bracket and improves the stability of the overall structure. After mixing light through the three layers of fluorescent layers, the LED can obtain a richer light mixing effect.

Description

Technical Field

[0001] The present application relates to the technical field of LEDs, and in particular to a dual-color temperature LED and a manufacturing method thereof. Background Art

[0002] Dual-color-temperature LED is an LED with two different color temperatures. It has the advantages of adjustable color temperature and brightness, as well as energy saving and environmental protection. Different lamp cups of dual-color-temperature LED light different phosphors to achieve different color temperatures, thereby achieving different effects to meet different scene requirements. When in use, you can select two color temperatures separately, or you can light them up at the same time to form mixed light to meet different color tone needs.

[0003] Invention patent publication number CN113394203A discloses a dual-color temperature light source packaging structure and a manufacturing method thereof, wherein the dual-color temperature light source packaging structure includes a substrate, a positive electrode pad, a negative electrode pad, a first chip, a second chip, a first fluorescent glue layer, a first transparent glue layer and a second fluorescent glue layer. The positive electrode pad and the negative electrode pad are arranged on the substrate, the first chip and the second chip are arranged on the substrate, the positive electrode and the negative electrode of the first chip are respectively connected to the positive electrode pad and the negative electrode pad, the positive electrode and the negative electrode of the second chip are respectively connected to the positive electrode pad and the negative electrode pad, the first fluorescent glue layer covers the first chip, the first transparent glue layer covers the second chip, and the second fluorescent glue layer covers the first fluorescent glue layer, the first transparent glue layer and the surface of the substrate, wherein the color temperature of the first color light excited by the first chip is lower than the color temperature of the second color light excited by the second chip. The first transparent glue layer covers the second chip so that the second chip can only emit the original color, resulting in a reduction in the range of color mixing of the dual-color temperature LED and poor applicability. Summary of the invention

[0004] In order to solve the problem of a small color mixing range of a dual-color temperature LED, the present application provides a dual-color temperature LED and a manufacturing method thereof.

[0005] In the first aspect, the present application provides a dual color temperature LED using the following technical solution:

[0006] A dual color temperature LED comprises:

[0007] A single cup holder, having four pins, two of which are arranged on opposite side walls of the single cup holder, and the pins extend from the side walls of the single cup holder to the bottom wall to form a foot-wrapping structure;

[0008] A light-emitting chip, the light-emitting chip comprising a first chip and a second chip, both of which are mounted on the single-bowl cup bracket, and the light-emitting chip is connected to the pin;

[0009] a first fluorescent layer formed on the upper surface of the first chip;

[0010] a second fluorescent layer formed on the upper surface of the second chip;

[0011] The third fluorescent layer is formed outside the first fluorescent layer and the second fluorescent layer.

[0012] By adopting the above technical solution, the pins extend from the side wall of the bracket to the bottom wall to form a pin-wrapped structure. This structure enhances the connection strength between the pins and the bracket and improves the stability of the overall structure. By forming a fluorescent layer above the two chips, the light-emitting colors of the two chips can be controlled by the fluorescent layer, and after light mixing through the third fluorescent layer, a richer light mixing effect can be obtained.

[0013] Optionally, the first chip and the second chip are distributed in a centrally symmetrical manner.

[0014] By adopting the above technical solution, the light emitted by the two chips can be evenly mixed in the third fluorescent layer through the central symmetric distribution, which is beneficial to improving the uniformity of color mixing of the LED.

[0015] Optional, dual color temperature LED also includes:

[0016] The crystal bonding adhesive layer surrounds the first chip and the second chip respectively, and is used to fix the first chip and the second chip on the single bowl cup bracket.

[0017] By adopting the above technical solution, by using a solid crystal adhesive layer to fix the first chip and the second chip, the fixing effect of the chip can be improved and the chip can be protected, which is beneficial to maintaining the stability of the LED during movement and collision.

[0018] Optional, dual color temperature LED also includes:

[0019] Filling glue layer, filling between the solid crystal glue layers.

[0020] By adopting the above technical solution, by filling the filling glue layer between the bonding glue layers, it is possible to provide support for the third fluorescent layer while strengthening the fixation of the first chip and the second chip.

[0021] Optionally, the positive electrode of the first chip is connected to the negative electrode of the second chip, and the negative electrode of the first chip is connected to the positive electrode of the second chip to form a non-polar circuit.

[0022] By adopting the above technical solution and forming a polarity-free circuit, polarity-free control can be achieved, so that both light-emitting chips can be stably controlled, thereby protecting the circuit and improving energy efficiency.

[0023] Optionally, it also includes a light-mixing layer, which covers the upper surfaces of the first fluorescent layer and the second fluorescent layer, and the light-mixing layer is covered by the third fluorescent layer. The light-mixing layer includes a light-transmitting glue and a first reflective film, the light-transmitting glue is formed on the surface of the first fluorescent layer and the second fluorescent layer, the first reflective film has a light-transmitting hole, and the first reflective film covers the surface of the light-transmitting glue.

[0024] By adopting the above technical scheme, the light mixing layer is arranged on the upper layer of the first fluorescent layer and the second fluorescent layer and the lower layer of the third fluorescent layer, so that the two different colors of light are preliminarily mixed in the light mixing layer, the light in the light-transmitting glue can propagate freely, and the first reflective film can reflect the light. The light mixing layer covers the first fluorescent layer and the second fluorescent layer, so that after the light is emitted from the first fluorescent layer and the second fluorescent layer, it propagates in the light-transmitting glue, and is reflected and diverged and mixed between the first reflective film and the second reflective film. The first reflective film is provided with a light-transmitting hole, and the light in the light mixing layer can be emitted from the light-transmitting hole and enter the third fluorescent layer. The light emitted by the first chip and the second chip is preliminarily mixed by the light mixing layer, so that the color of the light passing through the light-transmitting hole is close, and then the color of the LED light passing through the third fluorescent layer is more uniform, which is conducive to improving the uniformity of the mixed color LED light emission.

[0025] Optionally, the light mixing layer further includes a second reflective film, and the second reflective film covers surfaces of the filling adhesive layer and the die-bonding adhesive layer.

[0026] By adopting the above technical solution, due to the mixing of light in the light-transmitting glue, part of the light will be emitted to the filling glue layer and the solid crystal glue layer under the action of multiple refractions. Therefore, by covering the filling glue layer and the solid crystal glue layer with a second reflective film, the light can be reflected by the second reflective film and emitted to the outside, thereby enhancing the brightness of the LED.

[0027] Optionally, the light-transmitting glues are distributed at intervals to partially expose the first fluorescent layer and the second fluorescent layer.

[0028] By adopting the above technical solution, light-transmitting glue is arranged at intervals, so that part of the first fluorescent layer and the second fluorescent layer can be exposed in the interval between the light-mixing layers, so that part of the light can directly enter the third fluorescent layer for color mixing without passing through the light-mixing layer. On the one hand, the light-mixing performance of the third fluorescent layer can be fully utilized, and on the other hand, the brightness of the LED light can be increased, so that the LED has better luminous performance.

[0029] Optionally, the shape of the light-transmitting glue includes a light mixing strip, a first light scattering strip and a second light scattering strip, the light mixing strip partially covers the first fluorescent layer and the second fluorescent layer, the first light scattering strip partially covers the first fluorescent layer, and the second light scattering strip partially covers the second fluorescent layer.

[0030] By adopting the above technical solution, in the light-transmitting glue arranged at intervals, the part that can cover the first fluorescent layer and the second fluorescent layer at the same time is the light-mixing strip, and the part that can only cover one of the first fluorescent layer or the second fluorescent layer is the light-scattering strip. The light emitted by the light-transmitting holes in the light-mixing strip is the light after mixing, while the light emitted by the light-scattering strip is the light emitted by a single chip. However, the light-transmitting holes of the light-scattering strip can disperse the light-emitting position of a single light, so that light of a single color can be emitted from different positions, thereby making the light intensity of the LED more uniform and avoiding the occurrence of light and dark distribution.

[0031] Optionally, the first light scattering strip extends from the surface of the first fluorescent layer to the vicinity of the second fluorescent layer, and the light-transmitting hole of the first light scattering strip is opened at a position close to the second fluorescent layer; the second light scattering strip extends from the surface of the second fluorescent layer to the vicinity of the first fluorescent layer, and the light-transmitting hole of the second light scattering strip is opened at a position close to the first fluorescent layer.

[0032] By adopting the above technical solution, since part of the first chip and the second chip are not covered by the light mixing layer, the light emitted by the parts of the first chip and the second chip that are far away from each other can only rely on the third fluorescent layer for light mixing. When the color difference between the first chip and the second chip is large, it is easy to cause uneven light mixing. Therefore, by extending the first light scattering strip and the second light scattering strip to the vicinity of the relative fluorescent layer respectively, and opening a light-transmitting hole at a position close to the relative fluorescent layer, the parts of the first chip and the second chip that are relatively far away can also contact the light emitted by the relative chip, thereby avoiding the use of an overly thick third fluorescent layer for light mixing, which is beneficial to reducing the volume of the LED and improving the applicability of the LED.

[0033] In a second aspect, the present application provides a method for manufacturing a dual color temperature LED using the following technical solution:

[0034] A method for manufacturing a dual color temperature LED comprises the following steps:

[0035] S1, provides a single bowl cup holder;

[0036] S2, installing a first chip and a second chip on the single bowl cup holder;

[0037] S3, forming a first fluorescent layer on the upper surface of the first chip;

[0038] S4, forming a second fluorescent layer on the upper surface of the second chip;

[0039] S5, forming a third fluorescent layer outside the first fluorescent layer and the second fluorescent layer.

[0040] By adopting the above technical solution, the bracket to the third fluorescent layer are assembled and processed in sequence, which can improve the manufacturing efficiency of the LED and effectively enhance the structural stability of the LED.

[0041] Optionally, the specific operation of step S2 is: fixing the first chip and the second chip on the single bowl cup bracket by using a bonding adhesive.

[0042] By adopting the above technical solution, the first chip and the second chip are fixed on the single bowl cup bracket by using the solid crystal glue, so that the fixing of the light-emitting chip is more concise, and

[0043] Optionally, after the first chip and the second chip are fixed by the bonding adhesive, a filling adhesive is filled between the bonding adhesives.

[0044] By adopting the above technical solution, the filling glue can improve the fixing stability of the first chip and the second chip, thereby improving the overall mechanical properties of the LED.

[0045] In summary, the present application includes at least one of the following beneficial technical effects:

[0046] 1. The pins extend from the side wall of the bracket to the bottom wall to form a pin-wrapped structure. This structure enhances the connection strength between the pins and the bracket and improves the stability of the overall structure. By forming a fluorescent layer above the two chips, the light color of the two chips can be controlled by the fluorescent layer. After the light is mixed by the third fluorescent layer, a richer light mixing effect can be obtained;

[0047] 2. By connecting the first chip and the second chip end to end to form a non-polarized circuit, non-polarized control can be achieved, so that both light-emitting chips can be stably controlled, thereby protecting the circuit and improving energy efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is a plan view of a single cup holder according to an embodiment of the present application;

[0049] Figure 2 It is a bottom schematic diagram of a single cup stand according to an embodiment of the present application;

[0050] Figure 3 is a schematic plan view of a third fluorescent layer in one embodiment of the present application;

[0051] Figure 4 It is a plan view of an embodiment of the present application;

[0052] Figure 5 is a cross-sectional schematic diagram of an embodiment of the present application;

[0053] Figure 6 is a cross-sectional schematic diagram of an embodiment of the present application;

[0054] Figure 7 is a cross-sectional schematic diagram of an embodiment of the present application;

[0055] Figure 8 is a plan view of a light mixing layer according to an embodiment of the present application;

[0056] Fig. 9 It is a flowchart of an embodiment of the present application.

[0057] Figure numerals: 10, single bowl cup holder; 11, wire; 12, pin; 20, light-emitting chip; 21, first chip; 22, second chip; 30, first fluorescent layer; 40, second fluorescent layer; 50, third fluorescent layer; 60, filling glue layer; 70, solid crystal glue layer; 80, light mixing layer; 81, light-transmitting glue; 81a, light mixing strip; 81b, first light-scattering strip; 81c, second light-scattering strip; 82, first reflective film; 82a, light-transmitting hole; 83, second reflective film. DETAILED DESCRIPTION

[0058] The present application is further described in detail below in conjunction with the accompanying drawings.

[0059] An embodiment is listed, referring to Figure 1 , Figure 2 and Figure 3 A dual color temperature LED includes a single cup bracket 10, a light emitting chip 20, a first fluorescent layer 30, a second fluorescent layer 40, a third fluorescent layer 50, a filling glue layer 60 and a solid crystal glue layer 70. The single cup bracket 10 is equipped with two light emitting chips 20, wherein the light emitting chip 20 includes a first chip 21 and a second chip 22. The first chip 21 and the second chip 22 are respectively installed on the single cup bracket 10. The two chips are connected to the pins 12 through the wires 11. The pins 12 are arranged on the outside of the single cup bracket 10. The pins 12 are bent from the side wall of the single cup bracket 10 to the bottom wall, thereby forming a foot wrapping structure, which can improve the strength of the LED and ensure the stability of the connection. The first chip 21 and the second chip 22 are centrally symmetrically distributed and arranged in the middle of the single cup bracket 10.

[0060] Reference Figure 3 and Figure 5The surface of the first chip 21 is covered with a first fluorescent layer 30, and the surface of the second chip 22 is covered with a second fluorescent layer 40. The first fluorescent layer 30 and the second fluorescent layer 40 are respectively used to change the color of the light emitted by the first chip 21 and the second chip 22, so that the LED can have a wider color mixing range. The first chip 21 and the second chip 22 are surrounded by a solid crystal glue layer 70. The solid crystal glue layer 70 is used to fix the first chip 21 and the second chip 22, and can limit the range of the first fluorescent layer 30 and the second fluorescent layer 40. The single bowl cup support 10 area outside the solid crystal glue layer 70 is filled with a filling glue layer 60. The upper surface heights of the filling glue layer 60 and the solid crystal glue layer 70 are equal. The first fluorescent layer 30, the second fluorescent layer 40, the solid crystal glue layer 70 and the filling glue layer 60 are covered with a third fluorescent layer 50. The third fluorescent layer 50 is used to mix the light emitted from the first fluorescent layer 30 and the second fluorescent layer 40, so that the LED can emit consistent and uniform light.

[0061] The implementation principle of the embodiment of the present application is: after the light is emitted from the first chip 21 and the second chip 22, it passes through the first fluorescent layer 30 and the second fluorescent layer 40 respectively to change the color of the light, and the light of different colors enters the third fluorescent layer 50. After the color change and light mixing of the third fluorescent layer 50, the light of the same color is emitted outward. Through the three layers of fluorescent layers, the LED has a wider color mixing range, thereby improving the applicability of the LED.

[0062] An embodiment is listed, referring to Figure 4 , a dual-color temperature LED has a first chip 21 and a second chip 22 installed in opposite directions, and the positive electrode of the first chip 21 is connected to the negative electrode of the second chip 22 through a wire 11, and the negative electrode of the first chip 21 is connected to the positive electrode of the second chip 22, and a non-polar circuit is formed after the wire 11 is connected to the pin 12.

[0063] The implementation principle of the embodiment of the present application is: by connecting the first chip 21 and the second chip 22 end to end, the current of the two chips is made uniform, thereby achieving stable control and ensuring uniform light emission of the LED.

[0064] An embodiment is listed, referring to Figure 6 A dual color temperature LED does not use a filling glue layer 60 but uses a third fluorescent layer 50 filled between the die-bonding glue layers 70 .

[0065] An embodiment is listed, referring to Figure 7 and Figure 8A dual color temperature LED also includes a light mixing layer 80, which is arranged on the upper side of the first fluorescent layer 30, the second fluorescent layer 40, the filling glue layer 60 and the lower side of the third fluorescent layer 50, wherein the light mixing layer includes a light-transmitting glue 81, a first reflective film 82 and a second reflective film 83, wherein the second reflective film 83 covers the filling glue layer 60 and the solid crystal glue layer 70, the light-transmitting glue 81 is formed on the surface of the second reflective film 83, the first fluorescent layer 30 and the second fluorescent layer 40, and covers the first reflective film 82 on the surface side of the light-transmitting glue 81, and the first reflective film 82 is opened with a light-transmitting hole 82a, and the light is emitted from the first fluorescent layer 30 and the second fluorescent layer 40 and then enters the light-transmitting glue 81, and is reflected by the first reflective film 82 and the second reflective film 83. The light is transmitted in the light-transmitting glue 81, and is emitted from the light-transmitting hole 82a and enters the third fluorescent layer 50.

[0066] Reference Figure 7 and Figure 8The pattern of the light-transmitting glue 81 is a stripe shape distributed at intervals. Through the stripe-shaped light-transmitting glue 81, part of the first fluorescent layer 30 and the second fluorescent layer 40 can directly contact the third fluorescent layer 50, so that part of the light enters the light-mixing layer 80, and part directly enters the third fluorescent layer 50, making full use of the light-mixing performance of the fluorescent layer 90 while improving the brightness of the LED. The shape of the light-transmitting glue 81 includes a light-mixing strip 81a, a first light-scattering strip 81b and a second light-scattering strip 81c, wherein the light-mixing strip 81a is the light-transmitting glue 81 covering the two fluorescent layers, the first light-scattering strip 81b is the light-transmitting glue 81 covering only the first fluorescent layer 30, and the second light-scattering strip 81c is the light-transmitting glue 81 covering only the second fluorescent layer 40. The light-transmitting holes 82a of the first reflective film 82 covering the surface of the light-mixing strip 81a are arranged at positions corresponding to the second reflective film 83, so as to prevent the light in the fluorescent layer from being directly emitted from the light-transmitting holes 82a and being unable to propagate in the light-mixing strip 81a. After the two different colors of light propagate in the light-mixing strip 81a, parts of the two lights can be emitted in each light-transmitting hole 82a, so that the light can be better mixed in the third fluorescent layer 50, so that the LED can emit light with more uniform color. The first light scattering strip 81b extends from the first fluorescent layer 30 to the vicinity of the second fluorescent layer 40, and the light transmission hole 82a of the first reflective film 82 covering the first light scattering strip 81b is located near the second fluorescent layer 40. The second light scattering strip 81c extends from the second fluorescent layer 40 to the vicinity of the first fluorescent layer 30, and the light transmission hole 82a of the first reflective film 82 covering the second light scattering strip 81c is located near the first fluorescent layer 30. By extending the light scattering strip to the vicinity of the opposite fluorescent layer and opening the light transmission hole 82a near the opposite fluorescent layer, The light of different colors can enter the third fluorescent layer 50 at a close position. The two colors of light can be more densely staggered and distributed through the first light scattering strip 81b and the second light scattering strip 81c. The light emitted by the fluorescent layer not covered by the light mixing layer 80 can also be fully mixed with the light of different colors after entering the third fluorescent layer 50, thereby reducing the thickness of the third fluorescent layer 50 required for uniform light emission. While making the LED structure compact, the thinner third fluorescent layer 50 can also make the LED have better brightness, thereby improving the performance of the LED.

[0067] The implementation principle of the embodiment of the present application is as follows: after the light emitted by the first chip 21 and the second chip 22 changes color through the first fluorescent layer 30 and the second fluorescent layer 40, part of the light enters the light mixing layer 80, and part directly enters the third fluorescent layer 50; part of the light of the first fluorescent layer 30 and the second fluorescent layer 40 enters the light mixing bar 81a, and enters the third fluorescent layer 50 from the light transmission hole 82a after propagating in the light mixing bar 81a; the light emitted from the light mixing bar 81a includes light of two different colors, so that after mixing in the third fluorescent layer 50, light of uniform color is formed; part of the light of the first fluorescent layer 30 enters the first light scattering bar 81b, and part of the light of the second fluorescent layer 40 enters the second light scattering bar 81c; the light scattering bar transmits the light to the vicinity of the opposite fluorescent layer, and enters the third fluorescent layer 50 through the light transmission hole 82a near the fluorescent layer, so that the light directly entering the third fluorescent layer 50 can be close to the light of different colors, so that the color can be more uniform after mixing in the third fluorescent layer.

[0068] An embodiment is listed, referring to Fig. 9 , a method for manufacturing a dual color temperature LED, comprising the following steps:

[0069] S1, provides a single bowl cup holder;

[0070] Specifically, the single-bowl cup bracket has a flat bottom surface, so that the bracket can fit closely to the bottom surface of the chip, provide stable support for the chip, and effectively disperse the impact force of the outside world on the chip to protect the chip from mechanical damage. The single-bowl cup bracket is usually made of high-temperature resistant and corrosion-resistant materials to ensure that it can withstand the influence of high temperature and chemicals during chip manufacturing and testing. The design of this bracket also takes into account the heat dissipation performance, which helps the chip maintain an appropriate temperature during operation and avoids overheating and performance degradation or damage. In addition, the single-bowl cup bracket is also easy to install and disassemble, which is convenient for replacement and maintenance during chip manufacturing and testing. By using this bracket, the efficiency and yield of chip manufacturing can be improved while reducing production costs.

[0071] S2, installing a first chip and a second chip on the single bowl cup holder;

[0072] Specifically, the first chip and the second chip can select chips of the same or different colors according to actual light mixing requirements. Each chip is independently fixed on the bracket, reducing mutual interference and vibration transmission between chips, thereby improving the stability of the entire system.

[0073] The first chip and the second chip are fixed on the single bowl cup bracket by the crystal bonding glue. After the crystal bonding glue fixes the first chip and the second chip respectively, the edge of the crystal bonding glue layer is filled with filling glue to make the fixation of the first chip and the second chip more stable.

[0074] More specifically, the first chip and the second chip have equal light emitting areas and are mounted in a centrally symmetrical manner, so that the light emitted by the two chips can fully interact in the subsequent light mixing process, thereby improving the efficiency of the LED.

[0075] S3, forming a first fluorescent layer on the upper surface of the first chip;

[0076] S4, forming a second fluorescent layer on the upper surface of the second chip;

[0077] Specifically, the upper surfaces of the first fluorescent layer and the second fluorescent layer are flush with each other, and the upper surface height of the filling glue layer is flush with the first fluorescent layer and the second fluorescent layer. The materials of the fluorescent layer can use organic fluorescent powder, rare earth fluorescent powder, sulfide fluorescent powder, aluminate fluorescent powder and carbonate fluorescent powder, etc., among which organic fluorescent powder includes fluorescent dye powder, fluorescent plastic powder, etc.; rare earth fluorescent powder contains rare earth elements, such as samarium, terbium, etc., has strong absorption and emission spectral characteristics, and is suitable for fluorescent powder of LED chips.

[0078] S5, forming a third fluorescent layer on the outer sides of the first fluorescent layer, the second fluorescent layer and the filling glue layer.

[0079] Specifically, the thickness and material used of the third fluorescent layer are determined by the color and intensity of the light emitted by the first fluorescent layer and the second fluorescent layer, so as to achieve better light mixing uniformity and sufficient brightness.

[0080] More specifically, before forming the third fluorescent layer, a second reflective film is covered on the surface of the filling glue layer and the solid crystal glue layer, and a light-transmitting glue is formed on the surface of the first fluorescent layer, the second fluorescent layer and the second reflective film, and a first reflective film with a light-transmitting hole is covered on the surface of the light-transmitting glue. After the light is emitted from the first fluorescent layer and the second fluorescent layer, it propagates in the light-transmitting glue, and is reflected, diverged and mixed between the first reflective film and the second reflective film. The mixed light can be emitted from the light-transmitting hole and enter the third fluorescent layer, so that the light of different colors passing through the light-transmitting hole is mixed, and then the color of the LED light passing through the third fluorescent layer is more uniform, which is conducive to improving the uniformity of the mixed color LED light emission.

[0081] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A dual color temperature LED, characterized in that: include: A single cup holder (10) having four pins (12), two of the pins (12) being arranged on opposite side walls of the single cup holder (10), and the pins (12) extending from the side walls of the single cup holder (10) to the bottom wall to form a foot-wrapped structure; A light-emitting chip (20), comprising a first chip (21) and a second chip (22), both of which are mounted on the single-bowl cup holder (10), and the light-emitting chip (20) is connected to the pin (12); A first fluorescent layer (30) formed on the upper surface of the first chip (21); A second fluorescent layer (40) formed on the upper surface of the second chip (22); a third fluorescent layer (50) formed outside the first fluorescent layer (30) and the second fluorescent layer (40); a light-mixing layer (80), covering the upper surfaces of the first fluorescent layer (30) and the second fluorescent layer (40), the light-mixing layer (80) being covered by the third fluorescent layer (50), the light-mixing layer (80) comprising a light-transmitting glue (81) and a first reflective film (82), the light-transmitting glue (81) being formed on the surfaces of the first fluorescent layer (30) and the second fluorescent layer (40), the first reflective film (82) having light-transmitting holes (82a), and the first reflective film (82) covering the surface of the light-transmitting glue (81); The shape of the light-transmitting glue (81) comprises a light-mixing strip (81a), a first light-scattering strip (81b) and a second light-scattering strip (81c); the light-mixing strip (81a) partially covers the first fluorescent layer (30) and the second fluorescent layer (40); the first light-scattering strip (81b) partially covers the first fluorescent layer (30); and the second light-scattering strip (81c) partially covers the second fluorescent layer (40).

2. The dual color temperature LED according to claim 1, characterized in that: The first chip (21) and the second chip (22) are distributed in a centrally symmetrical manner.

3. The dual color temperature LED according to claim 1, characterized in that: Also includes: The crystal bonding adhesive layer (70) surrounds the first chip (21) and the second chip (22) respectively, and is used to fix the first chip (21) and the second chip (22) on the single bowl cup support (10).

4. The dual color temperature LED according to claim 3, characterized in that: Also includes: A filling adhesive layer (60) is filled between the die-bonding adhesive layers (70).

5. The dual color temperature LED according to claim 1, characterized in that: The positive electrode of the first chip (21) is connected to the negative electrode of the second chip (22), and the negative electrode of the first chip (21) is connected to the positive electrode of the second chip (22), so as to form a non-polar circuit.

6. A method for manufacturing a dual-color temperature LED, used to manufacture the dual-color temperature LED according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1, provides a single bowl cup holder; S2, installing a first chip and a second chip on the single bowl cup holder; S3, forming a first fluorescent layer on the upper surface of the first chip; S4, forming a second fluorescent layer on the upper surface of the second chip; S5, forming a third fluorescent layer outside the first fluorescent layer and the second fluorescent layer.

7. The method for manufacturing a dual color temperature LED according to claim 6, characterized in that: The specific operation of step S2 is: fixing the first chip and the second chip on the single bowl cup bracket by using a bonding adhesive.

8. The method for manufacturing a dual color temperature LED according to claim 7, characterized in that: After the first chip and the second chip are fixed by the die-bonding adhesive, a filling adhesive is filled between the die-bonding adhesives.

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