Chip silicon core crystal rod processing method and processing equipment

Abstract

The present invention belongs to the field of chip processing technology, specifically, a chip silicon core crystal rod processing method and processing equipment, including an equipment body, and a drive assembly is installed in the equipment body, the drive assembly is used to drive the equipment body to operate; the equipment body includes a chuck, the chuck is symmetrically arranged on the equipment body, and the chuck is connected to the drive assembly, and a crystal rod is fixed between adjacent chucks; the driving slide rail drives a moving box to move from one end of the equipment body to the other end, during which the moving box drives a slide bar to move on one side of the crystal rod, and the slide bar contacts the surface of the crystal rod in a rotating state through a ball bearing, so that the slide bar approaches and moves away from a displacement sensor during the movement of the slide bar on the surface of the crystal rod through the ball bearing, and the purpose of detecting the installation position of the crystal rod is achieved through the data fed back by the displacement sensor and the calculation of a computer in the equipment body.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular relates to a chip silicon core crystal rod processing method and processing equipment. Background Art

[0002] A chip is a silicon wafer containing an integrated circuit. It is very small and is often a part of a computer or other electronic device. A chip is made by making a silicon core crystal rod, then processing the crystal rod to obtain a silicon wafer, and then undergoing a series of complex processes to finally obtain a chip. The crystal rods grown by the Czochralski method or the zone melting method need to be tumbled before slicing. The tumbling process shapes the surface to meet the basic diameter requirements, and determines the position of the positioning surface and its basic dimensions, that is, the size and outer diameter roughness of the silicon wafer. Therefore, the outer diameter size and roughness of the crystal rod are particularly important for chip production.

[0003] Silicon crystal rod polishing steps: Before polishing, the surface of the silicon crystal rod is cleaned to remove dust, impurities and grease; then it is subjected to multiple tumbling to make the surface of the crystal rod flat and smooth; after polishing, the silicon crystal rod is cleaned to remove the polishing material residue and then dried.

[0004] The following problems may occur in the process of rolling the crystal rod in the prior art:

[0005] Surface scratches: Surface scratches caused by improper tools or materials used during polishing, or inadequate operating techniques;

[0006] Residual oxide layer: Incomplete treatment or cleaning may result in residual oxide layer on the surface, and the higher the temperature, the faster the oxidation rate of the silicon crystal rod will be; this is because at high temperatures, the reaction rate between the silicon crystal rod and oxygen will increase, thereby promoting the oxidation reaction; therefore, in a high temperature environment, the oxidation rate of the silicon crystal rod will be accelerated;

[0007] Surface cracks: Improper control of factors such as temperature and pressure during processing may cause surface cracks;

[0008] Residual impurities: Failure to completely remove impurities may affect the quality and performance of silicon ingots. Summary of the invention

[0009] In order to make up for the deficiencies of the prior art and solve the above-mentioned technical problems, the present invention proposes a chip silicon core crystal rod processing method and processing equipment.

[0010] The technical solution adopted by the present invention to solve the technical problem is as follows: the present invention proposes a chip silicon core crystal rod processing device, including a device body, and a drive assembly is installed in the device body, and the drive assembly is used to drive the device body to operate; the device body includes:

[0011] Chucks, the chucks are symmetrically arranged on the equipment body, the chucks are connected to the drive assembly, and a crystal rod is fixed between adjacent chucks;

[0012] A driving slide rail, the driving slide rail is arranged on the equipment body, and the driving slide rail is located on one side of the chuck; a moving box is slidably connected to the driving slide rail, and the driving slide rail drives the moving box to move linearly; a grinding roller is arranged in the moving box, and the grinding roller is located near the bottom of the crystal rod; sliding rods are evenly slidably connected to both sides of the moving box, and a ball bearing is rotatably connected to the end of the sliding rod close to the crystal rod, and the ball bearing contacts the outer circle of the crystal rod; displacement sensors are evenly arranged on the top of the moving box, and the displacement sensors are connected to the ends of the sliding rods;

[0013] A cleaning roller is arranged below the moving box, and nozzles are evenly arranged on the hollow cleaning roller; a water pump is arranged on one side of the equipment body, and the water pump passes through the cleaning roller and is connected to the nozzles through a water pipe.

[0014] Preferably, an auxiliary roller is rotatably connected to the device body, and a rotating shaft is rotatably connected to the device body between the auxiliary roller and the chuck; a driving ring is provided on the outer ring of the chuck, and the driving ring is in close contact with the rotating shaft, and the rotating shaft is in close contact with the auxiliary roller; cleaning cloth blocks are evenly arranged on the auxiliary roller.

[0015] Preferably, a vacuum pump is provided on one side of the equipment body, and the vacuum pump is connected to a hollow auxiliary roller through an air pipe; vacuum holes are evenly opened on the auxiliary roller, and some of the vacuum holes are located between adjacent cleaning cloth blocks, and the other parts are blocked by the cleaning cloth blocks.

[0016] Preferably, a shield is installed on the side of the auxiliary roller away from the crystal rod, and spike rakes are evenly arranged on the shield; the spike rakes are vertically distributed, and the spike rakes at the upper and lower positions are staggered, and the ends of the spike rakes contact the cleaning cloth.

[0017] Preferably, the bottom of the baffle is a mesh structure; the auxiliary roller is evenly fixed with fixing plates, and the fixing plates are located in the cleaning cloth block; and a part of the air extraction holes are located between adjacent fixing plates.

[0018] Preferably, an inclined guide plate is provided in the baffle, and the guide plate points to the auxiliary roller; one end of the guide plate is located on the side of the cleaning roller away from the crystal rod, and the other end is located below the side of the auxiliary roller close to the crystal rod.

[0019] Preferably, an extension plate is slidably connected to the portion of the guide plate close to the auxiliary roller, and a spring is provided between the extension plate and the guide plate; a card slot is provided at one end of the guide plate close to the auxiliary roller, and a card rod is slidably connected in the card slot; a liquid storage box for storing polishing liquid is installed on the auxiliary roller, and a sealing block is slidably connected to one end of the liquid storage box located in the cleaning cloth block; a spring is provided between the sealing block and the liquid storage box, and the sealing block is hemispherical, and drainage nozzles are evenly installed on the sealing block.

[0020] Preferably, a No. 1 support plate and a No. 2 support plate are rotatably connected to the equipment body, and both the No. 1 support plate and the No. 2 support plate are arc-shaped; the No. 1 support plate is close to the cleaning roller, and the No. 1 support plate rotates around the cleaning roller; the No. 2 support plate is close to the auxiliary roller, and the No. 2 support plate rotates around the auxiliary roller; one side of the No. 1 support plate contacts the side of the guide plate away from the auxiliary roller, and one side of the No. 2 support plate contacts the baffle.

[0021] Preferably, the equipment body also includes a cutting machine, and the cutting machine is located on one side of the equipment body; a cutting assembly is provided in the cutting machine, and steel plates are evenly installed below the cutting assembly; the steel plates are symmetrically arranged up and down, and the steel plate located at the bottom is fixed in the cutting machine; a crystal seat is fixedly connected to one side of the steel plates close to each other, and adjacent steel plates are fastened by screws.

[0022] A chip silicon core crystal rod processing method, the processing method uses the above processing equipment, and the processing method is as follows:

[0023] S1: When placing the crystal ingot, the crystal ingot is suspended between adjacent chucks and fixed by the chucks; then, the chuck drives the crystal ingot to rotate, and the grinding roller performs a rolling grinding process on the crystal ingot; while the rolling grinding process is being performed, the nozzle rinses the crystal ingot, and the chuck drives the auxiliary roller to rotate through the driving ring and the rotating shaft, and the auxiliary roller circulates and wipes the surface of the crystal ingot after rolling through the cleaning cloth;

[0024] S2: During polishing, the staff will pull the card rod out of the card slot, squeeze the surface of the cleaning cloth and the sealing block at one end of the extension plate, spray the polishing liquid from the discharge nozzle, and apply the polishing liquid to the surface of the crystal rod through the cleaning cloth; then dry cleaning is performed, the water pump stops working, the cleaning cloth wipes the crystal rod and the air is exhausted through the exhaust hole to complete the drying and cleaning of the crystal rod;

[0025] S3: After the crystal rod is rolled, the crystal rod is moved to the cutting machine and placed on the crystal seat below. The upper steel plate is then rotated to drive the upper crystal seat toward the crystal rod to fix the crystal rod. The crystal rod is then sliced ​​through the cutting assembly to obtain silicon wafers.

[0026] The beneficial effects of the present invention are as follows:

[0027] 1. A chip silicon core crystal rod processing method and processing equipment of the present invention, a driving slide rail drives a moving box to move from one end of a device body to the other end. During this process, the moving box drives a slide bar to move on one side of the crystal rod. The slide bar contacts the surface of the crystal rod in a rotating state through a ball bearing, so that the slide bar approaches and moves away from a displacement sensor during the movement of the slide bar on the surface of the crystal rod through the ball bearing. The data fed back by the displacement sensor and calculated by a computer in the device body are used to detect the installation position of the crystal rod.

[0028] The present invention provides a chip silicon core crystal rod processing method and processing equipment. When the crystal rod is rolled for a long time, a water pump supplies water to the nozzle through a water pipe, and the nozzle sprays water at high speed to the contact part between the grinding roller and the crystal rod, thereby reducing the temperature generated by the rolling of this part, avoiding the re-production of an oxide layer due to high temperature, and thus improving the processing effect; and because the nozzle close to the contact part between the crystal rod and the grinding roller is inclined, while the other nozzles are conventionally vertically arranged, water flow is flushed along the contact part between the crystal rod and the grinding roller, and impurities generated during processing in this part are flushed away and the surface of the crystal rod and the grinding roller are cleaned, thereby avoiding the situation where impurities remain and scratch the surface of the crystal rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] Figure 1 is a three-dimensional diagram of the processing equipment in the present invention;

[0031] Figure 2 is an internal schematic diagram of the processing equipment in the present invention;

[0032] Figure 3 is a schematic diagram of the interior of the device body of the present invention;

[0033] Figure 4 It is a schematic diagram of a No. 1 support plate and a No. 2 support plate supporting a crystal rod in the present invention;

[0034] Figure 5 is a schematic diagram of the interior of the drive ring in the present invention;

[0035] Figure 6 yes Figure 3 A partial enlarged view of the middle A;

[0036] Figure 7 It is a three-dimensional diagram of the shield in the present invention;

[0037] Figure 8 is an internal schematic diagram of the guide plate of the present invention;

[0038] Fig. 9 It is a three-dimensional diagram of the mobile box in the present invention;

[0039] Fig.10It is a schematic diagram of the steel plate and the crystal seat fixing the crystal rod in the present invention;

[0040] Fig.11 It is a flow chart of the processing method in the present invention.

[0041] In the figure: equipment body 1, drive assembly 11, chuck 12, crystal rod 13, drive slide rail 14, mobile box 2, grinding roller 21, slide rod 22, ball 23, displacement sensor 24, cleaning roller 3, nozzle 31, water pump 32, auxiliary roller 4, rotating shaft 41, drive ring 42, cleaning cloth block 43, vacuum pump 44, vacuum hole 45, baffle 46, rake 47, fixed plate 48, guide plate 5, extension plate 51, card slot 52, card rod 53, liquid storage box 6, sealing block 61, drainage nozzle 62, No. 1 support plate 63, No. 2 support plate 64, cutting machine 7, cutting assembly 71, steel plate 72, crystal seat 73. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment 1:

[0044] In order to effectively solve the above problems, as shown in the accompanying drawings of the specification Figure 1-Figure 10 As shown, a chip silicon core ingot processing device includes a device body 1, and a drive assembly 11 is installed in the device body 1, and the drive assembly 11 is used to drive the device body 1 to operate; the drive assembly 11 is a conventional drive device in the art; the device body 1 includes:

[0045] The chuck 12 is symmetrically arranged on the equipment body 1, and the chuck 12 is connected to the driving assembly 11, and a crystal rod 13 is fixed between adjacent chucks 12; the chuck 12 is a conventional device for fixing the crystal rod 13 by clamping or fixing both ends of the crystal rod 13; the driving assembly 11 drives the crystal rod 13 to rotate through the chuck 12;

[0046] A driving slide rail 14 is provided on the equipment body 1, and the driving slide rail 14 is located on one side of the chuck 12; a moving box 2 is slidably connected to the driving slide rail 14, and the driving slide rail 14 drives the moving box 2 to move, for example, close to the crystal, away from the crystal, and reciprocating linearly on one side of the crystal; a grinding roller 21 is provided in the moving box 2, and the grinding roller 21 is located on one side of the crystal rod 13 near the bottom position; sliding rods 22 are evenly slidably connected on both sides of the moving box 2, and the sliding rods 22 are rotatably connected to the end of the crystal rod 13 23, the ball bearing 23 contacts the outer circle of the crystal rod 13; displacement sensors 24 are evenly arranged on the top of the moving box 2, and the displacement sensors 24 are connected to the end of the slide bar 22; the driving slide rail 14 is a conventional driving device; the grinding roller 21 is a conventional component used for rolling the outer circle of the crystal rod 13, and the staff can replace the grinding roller 21 when the crystal rod 13 needs to undergo rough grinding, fine grinding and polishing; the displacement sensor 24 is a conventional sensor used to detect the displacement distance of an object, and the displacement sensor 24 is connected to the driving slide rail 14;

[0047] A cleaning roller 3 is arranged below the moving box 2, and nozzles 31 are evenly arranged on the hollow cleaning roller 3, and the nozzles 31 are distributed in an annular manner on the outer ring of the cleaning roller 3; the nozzles 31 close to the moving box 2 point to the contact portion between the grinding roller 21 and the crystal rod 13, and the nozzles 31 are arranged obliquely toward the chuck 12; the nozzles 31 close to the contact portion between the crystal rod 13 and the grinding roller 21 are arranged obliquely, while the other nozzles 31 are conventionally arranged vertically; a water pump 32 is arranged on one side of the equipment body 1, and the water pump 32 is connected to the nozzles 31 through a water pipe passing through the cleaning roller 3;

[0048] Specific work flow: when placing the crystal rod 13, the mobile box 2 is placed at a position close to the chuck 12, and the crystal rod 13 is suspended between adjacent chucks 12 by hoisting. After adjusting the position, the crystal rod 13 is fixed by the chuck 12; then, the driving slide rail 14 drives the mobile box 2 to move from one end of the equipment body 1 to the other end. During this process, the mobile box 2 drives the slide bar 22 to move on one side of the crystal rod 13. The slide bar 22 contacts the surface of the crystal rod 13 in a rotating state through the ball bearing 23. Since there are still bumps such as an oxide layer on the surface of the unrolled crystal rod 13, The unevenness phenomenon causes the slide bar 22 to approach and move away from the displacement sensor 24 during the movement of the ball bearing 23 on the surface of the crystal rod 13. The data fed back by the displacement sensor 24 and the calculation by the computer in the equipment body 1 are used to detect the installation position of the crystal rod 13, thereby avoiding the deviation of the installation position of the crystal rod 13, which leads to an increase in the dimensional error of the outer circle of the crystal rod 13 and affects the chip processing. This ensures the accuracy of the installation position of the crystal rod 13 before rolling, improves the processing accuracy of the crystal rod 13, and further improves the chip processing accuracy.

[0049] During the rolling process, the direction in which the moving box 2 is close to the driving assembly 11 is the front, and the direction in which it is close to the driving assembly 11 is the rear. The moving box 2 moves forward to drive the sliding bars 22 on the front and rear sides to move. The equipment body 1 obtains the flatness of the surface of the crystal rod 13 before rolling through the displacement sensor 24 located in front of the moving box 2, and rolls the crystal rod 13 while the grinding roller 21 moves. The equipment body 1 also obtains the flatness of the surface of the crystal rod 13 after rolling through the displacement sensor 24 located behind the moving box 2. The two sets of data are compared and recorded, so that the staff can obtain the data of each rolling of the crystal rod 13 in the first time, which is more convenient for work. The operator adjusts the parameters of the equipment body 1 according to the actual rolling data of the crystal rod 13 to improve the processing convenience, thereby improving the processing efficiency, and further improving the processing efficiency of the chip; moreover, the ball 23 can also be made of polytetrafluoroethylene, which has a lower hardness than the crystal rod 13, so as to avoid scratching the crystal rod 13 after contacting the crystal rod 13, and polytetrafluoroethylene has the characteristic of self-lubrication, so that when the ball 23 rotates at the end of the slide rod 22, the addition of lubrication is reduced, so as to avoid contaminating the crystal rod 13, and at the same time, the ball 23 can rotate freely, so as to prevent the ball 23 from getting stuck and excessively rubbing a certain part, resulting in the detection accuracy being affected;

[0050] When the crystal rod 13 is rolled for a long time, the water pump 32 supplies water to the nozzle 31 through the water pipe, and the nozzle 31 sprays water at a high speed to the contact part between the grinding roller 21 and the crystal rod 13, so as to reduce the temperature generated by the rolling of the part, avoid the oxide layer being generated again due to the high temperature, and thus improve the processing effect; and because the nozzle 31 close to the contact part between the crystal rod 13 and the grinding roller 21 is inclined, and the other nozzles 31 are conventionally vertically arranged, the water flow is flushed along the contact part between the crystal rod 13 and the grinding roller 21, and the impurities generated during the processing in the part are flushed away and the surface of the crystal rod 13 and the grinding roller 21 are cleaned, so as to avoid the impurities staying and remaining and scratching the surface of the crystal rod 13; in addition, a motor for rolling can also be installed in the moving box 2, and the motor is connected to the grinding roller 21, and the rotation direction of the grinding roller 21 is opposite to that of the crystal rod 13, so that the crystal rod 13 can be rolled by the fast rotation of the grinding roller 21 when it is rotating slowly, so as to slow down the rotation speed of the crystal rod 13, and avoid the crystal rod 13 rotating too fast and causing swinging, which affects the processing accuracy.

[0051] Embodiment 2:

[0052] On the basis of the first embodiment, an auxiliary roller 4 is rotatably connected to the equipment body 1, and a rotating shaft 41 is rotatably connected to the equipment body 1 between the auxiliary roller 4 and the chuck 12; a driving ring 42 is provided on the outer ring of the chuck 12, and the driving ring 42 is in close contact with the rotating shaft 41, and the rotating shaft 41 is in close contact with the auxiliary roller 4; cleaning cloth blocks 43 are evenly arranged on the auxiliary roller 4; the outer circular surface of the auxiliary roller 4 close to the end is in contact with the rotating shaft 41, and the cleaning cloth block 43 is away from the rotating shaft 41; the cleaning cloth block 43 is a cloth conventionally used in the art for wiping and cleaning the surface of the crystal rod 13;

[0053] An air pump 44 is provided on one side of the equipment body 1, and the air pump 44 is connected to the hollow auxiliary roller 4 through an air pipe; air holes 45 are evenly opened on the auxiliary roller 4, and a part of the air holes 45 is located between adjacent cleaning cloth blocks 43, and the other part is blocked by the cleaning cloth blocks 43;

[0054] Specific working process: the chuck 12 drives the rotating shaft 41 to rotate through the driving ring 42, and the rotating shaft 41 drives the auxiliary roller 4 to rotate, so that the auxiliary roller 4 rotates in the opposite direction to the crystal rod 13, and the auxiliary roller 4 cyclically wipes the surface of the crystal rod 13 after rolling and grinding through the cleaning cloth block 43 to complete the cleaning work, so as to avoid the residual impurities on the surface of the crystal rod 13, which may cause scratches when the grinding roller 21 rolls and grinds the crystal rod 13, thereby improving the processing effect of the crystal rod 13 and ensuring the processing quality of the chip;

[0055] While the auxiliary roller 4 wipes the surface of the crystal rod 13 through the cleaning cloth 43, the vacuum pump 44 draws air into the hollow auxiliary roller 4 through the air pipe, so that the vacuum holes 45 are in a vacuum state. A portion of the vacuum holes 45 that are not blocked by the cleaning cloth 43 draw air from the crystal rod 13 when they are close to the crystal rod 13, thereby accelerating the air flow around the crystal rod 13 and cooperating with the water spraying of the cleaning roller 3 to reduce the temperature of the crystal rod 13 during the long-term rolling process, thereby improving the heat dissipation effect and preventing the oxidized surface from appearing after rolling, thereby affecting the production of chips;

[0056] When the surface of the crystal rod 13 needs to be dried, the water pump 32 stops working, and the other part of the exhaust holes 45 blocked by the cleaning cloth block 43 exhausts air to the cleaning cloth block 43 to speed up the drying of the cleaning cloth block 43, so that the cleaning cloth block 43 can wipe off the water on the crystal rod 13 as soon as possible, and cooperate with the exhaust holes 45 to exhaust air to speed up the drying of the crystal rod 13, thereby improving the processing efficiency, and then improving the processing efficiency of the chip; and, by drying the crystal rod 13 by exhausting air and wiping, the temperature change amplitude of the crystal rod 13 during the processing process can be reduced, and the performance of the crystal rod 13 can be avoided from being affected, thereby increasing the protection measures for the crystal rod 13 during the processing.

[0057] Embodiment three:

[0058] On the basis of the second embodiment, a shield 46 is installed on the side of the auxiliary roller 4 away from the crystal rod 13, and nail rakes 47 are evenly arranged on the shield 46; the nail rakes 47 are vertically distributed, and the nail rakes 47 at the upper and lower positions are staggered, and the ends of the nail rakes 47 contact the cleaning cloth block 43;

[0059] The bottom of the shield 46 is a mesh structure; the auxiliary roller 4 is evenly fixed with a fixing plate 48, and the fixing plate 48 is located in the cleaning cloth block 43; a part of the air extraction holes 45 is located between adjacent fixing plates 48, that is, the air extraction holes 45 located between adjacent cleaning cloth blocks 43 are located between two fixing plates 48;

[0060] An inclined guide plate 5 is provided in the baffle 46, and the guide plate 5 points to the auxiliary roller 4; one end of the guide plate 5 is located on the side of the cleaning roller 3 away from the crystal rod 13, and the other end is located below the side of the auxiliary roller 4 close to the crystal rod 13;

[0061] An extension plate 51 is slidably connected to the portion of the guide plate 5 close to the auxiliary roller 4, and a spring is provided between the extension plate 51 and the guide plate 5; a card slot 52 is provided at one end of the guide plate 5 close to the auxiliary roller 4, and a card rod 53 is slidably connected to the card slot 52; a liquid storage box 6 for storing polishing liquid is installed on the auxiliary roller 4, and a sealing block 61 is slidably connected to one end of the liquid storage box 6 located in the cleaning cloth block 43; a spring is provided between the sealing block 61 and the liquid storage box 6, and the sealing block 61 is hemispherical, and drainage nozzles 62 are evenly installed on the sealing block 61; the drainage nozzle 62 is a conventional two-way flow valve, and when the air pressure in the liquid storage box 6 is high, the air is exhausted to the outside through the drainage nozzle 62; when the air pressure in the liquid storage box 6 is low, the air is sucked out through the drainage nozzle 62;

[0062] Specific working process: by setting the nail rake 47, after the cleaning cloth block 43 wipes away the impurities on the surface of the crystal rod 13, the cleaning cloth block 43 carries the impurities and rotates through the nail rake 47, and some impurities pass through the gap on the nail rake 47 and fall to the bottom of the shield 46 to collect the impurities; and when the cleaning cloth block 43 rotates through the nail rake 47, the nail rake 47 combs the surface of the cleaning cloth block 43, combs and removes the impurities on the surface of the cleaning cloth block 43 until they fall to the bottom of the shield 46, thereby improving the cleanliness of the cleaning cloth block 43, thereby improving the cleanliness of the crystal rod 13, and preventing the residual impurities in the cleaning cloth block 43 from scratching the crystal rod 13; and, because the nail rake 47 is vertically distributed, and the nail rakes 47 at the upper and lower adjacent positions are staggered, the area not cleaned by the upper nail rake 47 is cleaned by the lower nail rake 47, thereby further improving the cleanliness of the cleaning cloth block 43;

[0063] By setting the shield 46, the cleaning cloth block 43 can be shielded to reduce the pollution of external dust and maintain the cleanliness of the cleaning cloth block 43; since the bottom of the shield 46 is a mesh structure, the impurities at the bottom of the shield 46 fall to the bottom of the equipment body 1 through the mesh structure of the shield 46 and are collected by the staff; by setting the fixing plate 48, when the cleaning cloth block 43 is squeezed during wiping, the cleaning cloth block 43 is supported by the fixing plate 48 and will not be deformed, while maintaining the shape of the cleaning cloth block 43, it is prevented from deforming the cleaning cloth block 43 to block or clog the air extraction holes 45 between adjacent cleaning cloth blocks 43, affecting normal processing work, thereby improving processing efficiency;

[0064] Furthermore, by providing a guide plate 5, and the guide plate 5 is located below the auxiliary roller 4, the crystal rod 13 and the cleaning roller 3, the nozzle 31 close to the guide plate 5 sprays water on the guide plate 5, and the power generated by the water spraying is used to achieve the effect of water flowing on the guide plate 5. The water flow on the guide plate 5 flushes the surface of the cleaning cloth block 43, and washes away the impurities remaining on the surface of the cleaning cloth block 43, and cooperates with the nail rake 47 to further improve the cleaning degree of the cleaning cloth block 43;

[0065] When the surface of the crystal rod 13 is polished, in order to achieve a better polishing effect, a polishing liquid is applied to the surface of the crystal rod 13; the polishing liquid can help improve the smoothness and quality of the surface of the crystal rod 13; therefore, when polishing is required, the staff will pull the clamping rod 53 out of the clamping slot 52, and the extension plate 51 will no longer be blocked and extend out of the guide plate 5 until the extension plate 51 is stretched by the spring to achieve the purpose of squeezing the surface of the cleaning cloth block 43 at one end; when the auxiliary roller 4 drives the liquid storage box 6 and the sealing block 61 to rotate and pass through the extension plate 51, the extension plate 51 squeezes the surface of the cleaning cloth block 43. The cleaning cloth block 43 is pressed to achieve the effect of squeezing the sealing block 61. The sealing block 61 is compressed and inserted into the liquid storage box 6. Since one end of the guide plate 5 is located below the side of the auxiliary roller 4 close to the crystal rod 13, the sealing block 61 is located below the liquid storage box 6 at this time. The liquid storage box 6 is in an inverted state. After the space in the liquid storage box 6 is pressurized, the polishing liquid is sprayed out through the liquid discharge nozzle 62, and the polishing liquid is applied to the surface of the crystal rod 13 through the cleaning cloth block 43, which is convenient for the staff to operate and improves the convenience, thereby improving the processing efficiency of the crystal rod 13, and then improving the processing efficiency of the chip;

[0066] In addition, the staff can also evenly open a plurality of holes on the cleaning cloth 43 to allow the sprayed polishing liquid to flow out and be better coated on the surface of the crystal rod 13 .

[0067] Embodiment 4:

[0068] On the basis of the third embodiment, the equipment body 1 is rotatably connected to a first support plate 63 and a second support plate 64, and both the first support plate 63 and the second support plate 64 are arranged in an arc shape; the first support plate 63 is close to the cleaning roller 3, and the first support plate 63 rotates around the cleaning roller 3; the second support plate 64 is close to the auxiliary roller 4, and the second support plate 64 rotates around the auxiliary roller 4; one side of the first support plate 63 contacts the side of the guide plate 5 away from the auxiliary roller 4, and one side of the second support plate 64 contacts the baffle 46;

[0069] The equipment body 1 further includes a cutting machine 7, and the cutting machine 7 is located at one side of the equipment body 1; a cutting assembly 71 is provided in the cutting machine 7, and steel plates 72 are evenly installed below the cutting assembly 71; the steel plates 72 are symmetrically arranged up and down, and the steel plate 72 located at the bottom is fixed in the cutting machine 7; a crystal seat 73 is fixedly connected to one side of the steel plates 72 close to each other, and adjacent steel plates 72 are fastened by screws;

[0070] Specific working process: when placing the crystal rod 13, the staff rotates the No. 1 support plate 63 and the No. 2 support plate 64 toward the top of the equipment body 1 until the No. 1 support plate 63 and the No. 2 support plate 64 are close to the chuck 12, and then the two are fixed. After the crystal rod 13 is placed on the No. 1 support plate 63 and the No. 2 support plate 64, the installation position of the crystal rod 13 is adjusted to avoid the crystal rod 13 swinging when suspended, which increases the difficulty of installation, thereby improving the installation effect and then improving the processing efficiency; after the crystal rod 13 is fixed, there is a gap between the crystal rod 13 and the No. 1 support plate 63 and the No. 2 support plate 64, and the staff resets the No. 1 support plate 63 and the No. 2 support plate 64; the No. 1 support plate 63 cooperates with the guide plate 5 to cover the part of the cleaning roller 3 away from the crystal rod 13, and the water sprayed from the nozzle 31 is collected by the No. 1 support plate 63 and flows on the guide plate 5, increasing the water flow rate of flushing the cleaning cloth block 43, and further improving the cleaning degree of the cleaning cloth block 43;

[0071] Furthermore, after the crystal rod 13 is rolled, the crystal rod 13 is transported to the cutting machine 7 by conventional transport equipment, and the crystal rod 13 is placed on the crystal seat 73 below, and then the upper steel plate 72 is driven by the upper crystal seat 73 to approach the crystal rod 13 by rotating the screw, so that the crystal rod 13 is fixed, and then the crystal rod 13 is sliced ​​by the cutting assembly 71 to obtain a silicon wafer; the existing crystal seat 73 of the horizontal cutting machine 7 is a non-fixed base, resulting in four supports required to fasten the crystal rod 13, and four metering is performed, and each metering takes 30 minutes. The operation is performed in a random manner, resulting in four metering operations in the prior art, which has the risk of silicon core cutting deviation, affecting the core output rate; and the cutting time of the crystal rod 13 is long, the energy consumption is high, and the work efficiency is low; the horizontal cutting machine 7 currently has three cutting modes: one is non-stick rod, four-time metering; the other is stick rod, two-time metering; the stick rod needs 4-8 hours of curing time, and one metering takes 30 minutes; and the method of fixing the rod head by non-stick rod in the present application can save time cost, reduce the silicon core cutting deviation rate, and improve the core output rate of the crystal rod 13, thereby improving the processing efficiency of the chip.

[0072] Embodiment five:

[0073] A chip silicon core crystal rod processing method, as shown in the accompanying drawings of the specification Fig.11 As shown, the processing method uses the above processing equipment, and the processing method is as follows:

[0074] S1: When placing the crystal ingot 13, the crystal ingot 13 is suspended between adjacent chucks 12 and the crystal ingot 13 is fixed by the chucks 12; then, the chucks 12 drive the crystal ingot 13 to rotate, and the grinding roller 21 performs a rolling grinding process on the crystal ingot 13; while the rolling grinding process is being performed, the nozzle 31 rinses the crystal ingot 13, and the chuck 12 drives the auxiliary roller 4 to rotate through the driving ring 42 and the rotating shaft 41, and the auxiliary roller 4 cyclically wipes the surface of the crystal ingot 13 after rolling through the cleaning cloth block 43;

[0075] S2: When performing the polishing process, the staff member pulls the clamping rod 53 out of the clamping slot 52, and one end of the extension plate 51 squeezes the surface of the cleaning cloth block 43 and the sealing block 61, and the discharge nozzle 62 sprays the polishing liquid, and the polishing liquid is applied to the surface of the crystal rod 13 through the cleaning cloth block 43; then the drying and cleaning is performed, the water pump 32 stops working, the cleaning cloth block 43 wipes the crystal rod 13 and cooperates with the exhaust hole 45 to exhaust air, and the drying and cleaning of the crystal rod 13 is completed;

[0076] S3: After the crystal rod 13 is rolled, the crystal rod 13 is transported to the cutting machine 7, and the crystal rod 13 is placed on the crystal seat 73 below. Then, the upper steel plate 72 is rotated to drive the upper crystal seat 73 toward the crystal rod 13 to fix the crystal rod 13. The crystal rod 13 is then sliced ​​by the cutting assembly 71 to obtain silicon wafers.

Claims

1. A chip silicon core ingot processing device, comprising a device body (1), wherein a drive assembly (11) is installed in the device body (1), and the drive assembly (11) is used to drive the device body (1) to operate; characterized in that: The device body (1) comprises: A chuck (12), wherein the chuck (12) is symmetrically arranged on the device body (1), and the chuck (12) is connected to the drive assembly (11), and a crystal rod (13) is fixed between adjacent chucks (12); A driving slide rail (14), wherein the driving slide rail (14) is arranged on the equipment body (1), and the driving slide rail (14) is located on one side of the chuck (12); a moving box (2) is slidably connected to the driving slide rail (14), and the driving slide rail (14) drives the moving box (2) to move linearly; a grinding roller (21) is arranged in the moving box (2), and the grinding roller (21) is located on one side of the crystal rod (13) near the bottom; sliding rods (22) are evenly slidably connected to both sides of the moving box (2), and the end of the sliding rod (22) close to the crystal rod (13) is rotatably connected to a ball (23), and the ball (23) contacts the outer circle of the crystal rod (13); a displacement sensor (24) is evenly arranged on the top of the moving box (2), and the displacement sensor (24) is connected to the end of the sliding rod (22); A cleaning roller (3), the cleaning roller (3) being arranged below the moving box (2), and the hollow cleaning roller (3) being evenly provided with nozzles (31); a water pump (32) being arranged on one side of the equipment body (1), and the water pump (32) passing through the cleaning roller (3) and connected to the nozzles (31) via a water pipe, the nozzles (31) close to the contact portion between the crystal rod (13) and the grinding roller (21) being arranged obliquely, and the remaining nozzles (31) being arranged vertically; An auxiliary roller (4) is rotatably connected to the device body (1), and a rotating shaft (41) is rotatably connected to the device body (1) between the auxiliary roller (4) and the chuck (12); a driving ring (42) is provided on the outer ring of the chuck (12), and the driving ring (42) is in close contact with the rotating shaft (41), and the rotating shaft (41) is in close contact with the auxiliary roller (4); cleaning cloth blocks (43) are evenly arranged on the auxiliary roller (4).

2. The chip silicon core crystal rod processing equipment according to claim 1, characterized in that: An air pump (44) is provided on one side of the equipment body (1), and the air pump (44) is connected to a hollow auxiliary roller (4) through an air pipe; air holes (45) are evenly provided on the auxiliary roller (4), and a part of the air holes (45) are located between adjacent cleaning cloth blocks (43), and another part is blocked by the cleaning cloth blocks (43).

3. A chip silicon core crystal rod processing equipment according to claim 2, characterized in that: A shield (46) is installed on the side of the auxiliary roller (4) away from the crystal rod (13), and spike rakes (47) are evenly arranged on the shield (46); the spike rakes (47) are vertically distributed, and the spike rakes (47) at the upper and lower positions are staggered, and the ends of the spike rakes (47) contact the cleaning cloth block (43).

4. The chip silicon core crystal rod processing equipment according to claim 3, characterized in that: The bottom of the baffle (46) is a mesh structure; a fixing plate (48) is evenly fixedly connected to the auxiliary roller (4), and the fixing plate (48) is located inside the cleaning cloth block (43); a portion of the air extraction holes (45) are located between adjacent fixing plates (48).

5. The chip silicon core crystal rod processing equipment according to claim 4, characterized in that: An inclined guide plate (5) is provided in the baffle (46), and the guide plate (5) points toward the auxiliary roller (4); one end of the guide plate (5) is located on a side of the cleaning roller (3) away from the crystal rod (13), and the other end is located below a side of the auxiliary roller (4) close to the crystal rod (13).

6. The chip silicon core crystal rod processing equipment according to claim 5, characterized in that: An extension plate (51) is slidably connected to a portion of the guide plate (5) close to the auxiliary roller (4), and a spring is provided between the extension plate (51) and the guide plate (5); a clamping groove (52) is provided at one end of the guide plate (5) close to the auxiliary roller (4), and a clamping rod (53) is slidably connected to the clamping groove (52); a liquid storage box (6) for storing polishing liquid is installed on the auxiliary roller (4), and a sealing block (61) is slidably connected to one end of the liquid storage box (6) located in the cleaning cloth block (43); a spring is provided between the sealing block (61) and the liquid storage box (6), and the sealing block (61) is hemispherical, and liquid discharge nozzles (62) are evenly installed on the sealing block (61).

7. The chip silicon core crystal rod processing equipment according to claim 1, characterized in that: The equipment body (1) is rotatably connected to a first support plate (63) and a second support plate (64), and both the first support plate (63) and the second support plate (64) are arranged in an arc shape; the first support plate (63) is close to the cleaning roller (3), and the first support plate (63) rotates around the cleaning roller (3); the second support plate (64) is close to the auxiliary roller (4), and the second support plate (64) rotates around the auxiliary roller (4); one side of the first support plate (63) contacts the side of the guide plate (5) away from the auxiliary roller (4), and one side of the second support plate (64) contacts the baffle (46).

8. The chip silicon core crystal rod processing equipment according to claim 1, characterized in that: The device body (1) further comprises a cutting machine (7), and the cutting machine (7) is located at one side of the device body (1); a cutting assembly (71) is provided in the cutting machine (7), and steel plates (72) are evenly installed below the cutting assembly (71); the steel plates (72) are symmetrically arranged up and down, and the steel plate (72) located at the bottom is fixed in the cutting machine (7); a crystal seat (73) is fixedly connected to one side of the steel plates (72) close to each other, and adjacent steel plates (72) are fastened by screws.

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