Silicon wafer cutting waste liquid treatment device and treatment method

Abstract

The present invention relates to the technical field of waste liquid treatment, and discloses a silicon wafer cutting waste liquid treatment device and treatment method, comprising: a double barrel material receiving mechanism, a water bath heating dewatering mechanism is installed inside the double barrel material receiving mechanism, and a filter clamping mechanism is also fixedly connected inside the double barrel material receiving mechanism, and the filter clamping mechanism is located above the water bath heating dewatering mechanism, a silicon powder filtering mechanism and a silicon carbide particle filtering mechanism are respectively installed inside the filter clamping mechanism, and the silicon carbide particle filtering mechanism is located above the silicon powder filtering mechanism, and an adsorption impurity removal mechanism is installed between the filter clamping mechanism and the water bath heating dewatering mechanism. The invention can perform rough separation of silicon carbide particles, silicon powder and polyethylene glycol in silicon wafer cutting waste liquid one by one, and can remove water from silicon wafer cutting waste liquid at the same time, so as to facilitate the recovery and subsequent secondary utilization of silicon carbide particles, silicon powder and polyethylene glycol, and reduce resource waste.

Description

Technical Field

[0001] The present invention relates to the technical field of waste liquid treatment, and in particular to a silicon wafer cutting waste liquid treatment device and a treatment method. Background Art

[0002] Silicon wafers are the main production materials in the semiconductor and photovoltaic fields. Silicon wafer multi-wire cutting technology is currently the most advanced silicon wafer processing technology in the world. It is different from traditional cutting methods such as saw blades and grinding wheels, and is also different from advanced laser cutting and inner circle cutting. Its principle is to use a high-speed moving steel wire to drive the cutting fluid attached to the steel wire to rub the silicon rod to achieve the cutting effect. During the whole process, the steel wire is guided by the wire roller to form a wire net on the wire roller, and the workpiece to be processed is fed by the lowering of the worktable. Compared with other technologies, silicon wafer multi-wire cutting technology has the advantages of high efficiency, high production capacity and high precision. Therefore, multi-wire cutting technology is currently the most widely used silicon wafer cutting technology, polyethylene glycol It is a high molecular polymer, non-irritating, slightly bitter, with good water solubility, and good compatibility with many organic components. Under normal conditions, polyethylene glycol is very stable, but at a temperature of 120 degrees Celsius or higher it can react with oxygen in the air. In an inert atmosphere such as nitrogen and carbon dioxide, it will not change even if it is heated to 200 to 240 degrees Celsius. When the temperature rises to 300 degrees Celsius, thermal cracking will occur. It has excellent lubricity, moisturizing, dispersibility, and adhesion. It can be used as an antistatic agent and softener, etc. It is widely used in cosmetics, pharmaceuticals, chemical fibers, rubber, plastics, papermaking, paints, electroplating, pesticides, metal processing, food processing and other industries.

[0003] In multi-wire cutting technology, the cutting fluid used is usually prepared from polyethylene glycol and silicon carbide particles in a certain proportion. During the process of cutting silicon rods, the cutting fluid will inevitably mix with the cut silicon powder to form a large amount of cutting waste liquid. The silicon carbide particles, silicon powder and polyethylene glycol contained in the cutting waste liquid can be repeatedly recycled. If it is discharged directly, it will cause a large waste of resources. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a silicon wafer cutting waste liquid treatment device and a treatment method, which solve the problems mentioned in the above background.

[0005] The present invention provides the following technical solution: a silicon wafer cutting waste liquid treatment device, comprising: a double-barrel material receiving mechanism, a water bath heating and water removal mechanism is installed inside the double-barrel material receiving mechanism, and a filter clamping mechanism is also fixedly connected inside the double-barrel material receiving mechanism, and the filter clamping mechanism is located above the water bath heating and water removal mechanism, a silicon powder filtering mechanism and a silicon carbide particle filtering mechanism are respectively installed inside the filter clamping mechanism, and the silicon carbide particle filtering mechanism is located above the silicon powder filtering mechanism, an adsorption and impurity removal mechanism is installed between the filter clamping mechanism and the water bath heating and water removal mechanism, and an opening and closing buffer mechanism is installed on the surface of the double-barrel material receiving mechanism.

[0006] Preferably, the double-barrel material receiving mechanism includes a lower receiving cylinder, a liquid level observation window, a water level observation window, an air extraction check valve, a negative pressure pipe connector, a water inlet check valve, a water inlet pipe connector and a drain solenoid valve, the liquid level observation window and the water level observation window are both fixedly mounted on the surface of the lower receiving cylinder, the air extraction check valve and the water inlet check valve are both fixedly mounted on the surface of the lower receiving cylinder, and the air extraction check valve is located on the side above the water bath heating and water removal mechanism, and the water inlet check valve is located on the side below the water bath heating and water removal mechanism, the negative pressure pipe connector is fixedly mounted on the output end of the air extraction check valve, the water inlet pipe connector is fixedly mounted on the input end of the water inlet check valve, and the drain solenoid valve is fixedly mounted on the bottom of the lower receiving cylinder.

[0007] Preferably, the double-barrel material receiving mechanism also includes an upper receiving tube, a tube cover, a first electromagnetic lock, a second electromagnetic lock and an extension block, the upper receiving tube is rotatably connected to the top of the lower receiving tube, the tube cover is rotatably connected to the top of the upper receiving tube, the first electromagnetic lock is installed between the upper receiving tube and the tube cover, the second electromagnetic lock is installed between the upper receiving tube and the lower receiving tube, and sealing gaskets are installed between the tube cover and the upper receiving tube and between the lower receiving tube and the upper receiving tube, and the extension block is integrally arranged on the surface of the bottom of the upper receiving tube.

[0008] Preferably, the water bath heating and water removal mechanism includes an electric heater, an insulation ring, an evaporating pot and a heat conductive sheet, the electric heater is fixedly installed inside the lower receiving tube, the insulation ring is fixedly connected to the inner wall of the lower receiving tube, the evaporating pot is fixedly connected to the inside of the insulation ring, and the heat conductive sheet is fixedly connected to the lower surface of the evaporating pot.

[0009] Preferably, the filter clamping mechanism comprises a mounting frame, a connecting piece and an elastic clamping block, the mounting frame is fixedly connected to the interior of the upper receiving tube, the connecting piece is fixedly connected to the interior of the mounting frame, and the elastic clamping block is integrally arranged inside the connecting piece.

[0010] Preferably, the silicon powder filtering mechanism includes a support ring, a first holding inner edge ridge and a fine filter screen, the support ring is movably mounted inside the mounting frame, the first holding inner edge ridge is integrally arranged above the support ring, and the fine filter screen is fixedly connected to the inside of the support ring.

[0011] Preferably, the silicon carbide particle filtering mechanism includes a card frame, a bayonet, a second holding inner edge ridge and a coarse filter screen, the card frame is installed inside the mounting frame, the bayonet is opened through the surface of the card frame, the second holding inner edge ridge is integrally arranged above the card frame, the coarse filter screen is fixedly connected to the inside of the card frame, and the card frame is clamped to the mounting frame through the bayonet and an elastic clamp block.

[0012] Preferably, the adsorption and impurity removal mechanism includes a funnel, a switch solenoid valve, a pick-and-place basket, a liquid leakage net, a pull-opening and an activated carbon filter element. The funnel is fixedly connected to the inside of the lower receiving cylinder, the switch solenoid valve is fixedly installed at the bottom of the funnel, the pick-and-place basket is movably installed inside the funnel, the liquid leakage net is fixedly connected to the bottom of the pick-and-place basket, the pull-opening is opened through the surface of the pick-and-place basket, and the activated carbon filter element is movably installed inside the pick-and-place basket.

[0013] Preferably, the opening and closing buffer mechanism includes a hydraulic cylinder, a sealing ring, a sealing ring, a piston column, a piston inner block, a piston sleeve, a piston sealing ring, a liquid through hole, a flow suppression ring, a flow suppression seam, an isolation piston and a compensation chamber. The hydraulic cylinder is rotatably connected to the surface of the lower receiving cylinder, the sealing ring is fixedly connected to one end of the hydraulic cylinder, the sealing ring is fixedly connected to the inner wall of the sealing ring, the piston column is rotatably connected to the bottom of the extension block, and the surface of the piston column is slidably connected to the inner wall of the sealing ring, the piston inner block is fixedly sleeved on the bottom end of the piston column, and the piston sleeve The piston is fixedly sleeved on the surface of the piston inner block, the piston sealing ring is fixedly sleeved on the surface of the piston outer sleeve, and the surface of the piston sealing ring is slidably connected to the inner wall of the hydraulic cylinder, the liquid hole is penetrated and opened on the surface of the piston inner block, the flow suppression ring is fixedly connected between the piston inner block and the piston outer sleeve, the flow suppression slit is penetrated and opened on the surface of the flow suppression ring, the isolation piston is slidably connected to the inside of the hydraulic cylinder, the compensation chamber is arranged on the side of the isolation piston away from the sealing ring, the inside of the compensation chamber is filled with nitrogen, and the space between the isolation piston and the sealing ring is filled with damping fluid.

[0014] A method for treating silicon wafer cutting waste liquid, comprising:

[0015] Step 1: Connect the negative pressure pipe connector to the external negative pressure pump, and connect the water inlet pipe connector to the external water pipe;

[0016] Step 2: Close the drain solenoid valve and the switch solenoid valve, close the second solenoid lock, unlock the first solenoid lock, open the cylinder cover, inject silicon wafer cutting waste liquid into the receiving cylinder, and then close the cylinder cover and close the first solenoid lock;

[0017] Step 3: Open the valve of the external water pipe and fill water into the receiving tube. Observe the water level through the water level observation window to ensure that the water level submerges the evaporator but leaves a cavity under the insulation ring. Then close the valve of the external water pipe and turn on the electric heater for heating.

[0018] Step 4: Start the external negative pressure pump, which generates negative pressure to continuously draw out the gas inside the lower receiving tube, thereby reducing the air pressure above the evaporator;

[0019] Step 5: Open the switch solenoid valve, and the negative pressure generated by the negative pressure pump pumps the silicon wafer cutting waste liquid to accelerate the infiltration of the silicon wafer cutting waste liquid. When the silicon wafer cutting waste liquid infiltrates, the larger silicon carbide particles in it are intercepted by the coarse filter, and then the smaller silicon powder is intercepted by the fine filter. Then the silicon wafer cutting waste liquid below passes through the activated carbon filter element. When the silicon wafer cutting waste liquid passes through the activated carbon filter element, the trace impurities in it are adsorbed, and the remaining mixed liquid mainly composed of polyethylene glycol and water falls from the funnel into the evaporator;

[0020] Step 6: Observe from the liquid level observation window to ensure that the mixed liquid fills the evaporator and then close the switch solenoid valve. The evaporator heats the mixed liquid to evaporate the water quickly. The negative pressure generated by the external negative pressure pump will reduce the air pressure on the surface of the mixed liquid, lowering the boiling point of the water in the mixed liquid. The water evaporates quickly until it is removed.

[0021] Step 7: After the water is removed, repeat steps 5 to 6 until all the waste liquid from silicon wafer cutting is separated. Then turn off the negative pressure pump and the electric heater, open the drain solenoid valve to drain the water, unlock the first electromagnetic lock to unfold the cylinder cover, take out the silicon carbide particles in the coarse filter and the silicon powder in the fine filter in turn, then close the cylinder cover and close the first electromagnetic lock;

[0022] Step 8: Unlock the second electromagnetic lock, unfold the upper receiving tube, take out the polyethylene glycol in the evaporating pot, and finally close the upper receiving tube and the second electromagnetic lock.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The invention, through the provision of a double-barrel material receiving mechanism, a water bath heating and water removal mechanism, a filtering and clamping mechanism, a silicon powder filtering mechanism, a silicon carbide particle filtering mechanism, an adsorption and impurity removal mechanism and an opening and closing buffer mechanism, can coarsely separate the silicon carbide particles, silicon powder and polyethylene glycol in the silicon wafer cutting waste liquid one by one, and can also remove the moisture in the silicon wafer cutting waste liquid, so as to facilitate the recovery and subsequent secondary utilization of the silicon carbide particles, silicon powder and polyethylene glycol, thereby reducing the waste of resources.

[0025] The invention, through the arrangement of a lower receiving cylinder, a liquid level observation window, a water level observation window, an air extraction one-way valve, a negative pressure pipe connector, a water inlet one-way valve, a water inlet pipe connector, a drain solenoid valve, an upper receiving cylinder, a cylinder cover, a first electromagnetic lock, a second electromagnetic lock and an extension block, can form a split design between the upper receiving cylinder and the lower receiving cylinder to facilitate the removal of materials.

[0026] The invention, through the provision of an electric heater, a support ring, an evaporator and a heat conducting sheet, can utilize a water bath to prevent the temperature in the evaporator from overheating. At the same time, in cooperation with a lower receiving tube and an external negative pressure pump, negative pressure can be utilized to reduce the boiling point of water in the waste liquid, thereby ensuring that the water in the waste liquid can boil and evaporate quickly without the temperature being relatively high.

[0027] The invention, through the provision of a funnel, a switch solenoid valve, a pick-and-place basket, a liquid leakage net and an activated carbon filter element, can absorb trace impurities in the liquid and ensure further purification of the polyethylene glycol.

[0028] The invention, through the provision of a hydraulic cylinder, an end ring, a sealing ring, a piston column, a piston inner block, a piston sleeve, a piston sealing ring, a liquid through hole, a flow suppression ring, a flow suppression gap, an isolating piston and a compensation chamber, can limit the extension and contraction speed between the hydraulic cylinder and the piston column through the flow suppression gap to suppress the flow of liquid, thereby avoiding pinching of the hand caused by excessive opening and closing speed of the upper receiving cylinder. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of the present invention;

[0030] Figure 2 It is a rear view of the present invention;

[0031] Figure 3 It is a cross-sectional view of the present invention;

[0032] Figure 4 It is a structural schematic diagram of the water bath heating water removal mechanism and the filter clamping mechanism of the present invention;

[0033] Figure 5 This is a schematic diagram of the water bath heating and water removal mechanism structure of the present invention;

[0034] Figure 6 This is a schematic diagram of the internal explosion structure of the adsorption and impurity removal mechanism of the present invention;

[0035] Figure 7 This is a schematic diagram of the internal explosion structure of the filter clamping mechanism of the present invention;

[0036] Figure 8 It is a side sectional view of the opening and closing buffer mechanism of the present invention;

[0037] Fig. 9 For the present invention Figure 8 Enlarged view of point A in the middle;

[0038] Fig.10 It is a schematic diagram of the internal explosion structure of the piston inner block of the present invention.

[0039] In the figure: 101, lower receiving cylinder; 102, liquid level observation window; 103, water level observation window; 104, air extraction check valve; 105, negative pressure pipe connector; 106, water inlet check valve; 107, water inlet pipe connector; 108, drainage solenoid valve; 109, upper receiving cylinder; 110, cylinder cover; 111, first electromagnetic lock; 112, second electromagnetic lock; 113, extension block; 201, electric heater; 202, insulation ring; 203, evaporation pot; 204, heat conducting sheet; 301, installation frame; 302, connecting sheet; 303, elastic block; 401, support ring; 402, The first holding inner edge ridge; 403, fine filter screen; 501, clamp frame; 502, clamp port; 503, the second holding inner edge ridge; 504, coarse filter screen; 601, funnel; 602, switch solenoid valve; 603, pick-and-place basket; 604, leakage net; 605, pull-opening; 606, activated carbon filter element; 701, hydraulic cylinder; 702, sealing ring; 703, sealing ring; 704, piston column; 705, piston inner block; 706, piston jacket; 707, piston sealing ring; 708, liquid through hole; 709, flow suppression ring; 710, flow suppression gap; 711, isolation piston; 712, compensation chamber. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-10, a silicon wafer cutting waste liquid treatment device comprises: a double-barrel material receiving mechanism, a water bath heating and dewatering mechanism is installed inside the double-barrel material receiving mechanism, and a filtering clamping mechanism is fixedly connected inside the double-barrel material receiving mechanism, and the filtering clamping mechanism is located above the water bath heating and dewatering mechanism, a silicon powder filtering mechanism and a silicon carbide particle filtering mechanism are respectively installed inside the filtering clamping mechanism, and the silicon carbide particle filtering mechanism is located above the silicon powder filtering mechanism, an adsorption and impurity removal mechanism is installed between the filtering clamping mechanism and the water bath heating and dewatering mechanism, and an opening and closing buffer mechanism is installed on the surface of the double-barrel material receiving mechanism. Through the double-barrel material receiving mechanism, the water bath heating and dewatering mechanism, the filtering clamping mechanism, the silicon powder filtering mechanism, the silicon carbide particle filtering mechanism, the adsorption and impurity removal mechanism and the opening and closing buffer mechanism, the silicon carbide particles, silicon powder and polyethylene glycol in the silicon wafer cutting waste liquid can be roughly separated one by one, and the water in the silicon wafer cutting waste liquid can be removed at the same time, so that the silicon carbide particles, silicon powder and polyethylene glycol can be recovered and subsequently reused conveniently, thereby reducing resource waste.

[0042] The double barrel material receiving mechanism includes a lower receiving barrel 101, a liquid level observation window 102, a water level observation window 103, an air extraction check valve 104, a negative pressure pipe connector 105, a water inlet check valve 106, a water inlet pipe connector 107 and a drainage solenoid valve 108. The liquid level observation window 102 and the water level observation window 103 are both fixedly mounted on the surface of the lower receiving barrel 101, the air extraction check valve 104 and the water inlet check valve 106 are both fixedly mounted on the surface of the lower receiving barrel 101, and the air extraction check valve 104 is located in the water bath. On one side above the hot dewatering mechanism, and the water inlet check valve 106 is located on the side below the water bath heating dewatering mechanism, the negative pressure pipe connector 105 is fixedly installed at the output end of the air extraction check valve 104, the water inlet pipe connector 107 is fixedly installed at the input end of the water inlet check valve 106, and the drain solenoid valve 108 is fixedly installed at the bottom of the lower receiving cylinder 101, through the liquid level observation window 102 and the water level observation window 103, the water level and liquid level can be observed from the outside, so as to stop the water inlet and close the waste liquid flow in time.

[0043] The double barrel material receiving mechanism also includes an upper receiving barrel 109, a barrel cover 110, a first electromagnetic lock 111, a second electromagnetic lock 112 and an extension block 113. The upper receiving barrel 109 is rotatably connected to the top of the lower receiving barrel 101, and the barrel cover 110 is rotatably connected to the top of the upper receiving barrel 109. The first electromagnetic lock 111 is installed between the upper receiving barrel 109 and the barrel cover 110, and the second electromagnetic lock 112 is installed between the upper receiving barrel 109 and the lower receiving barrel 101, and the barrel cover 110 and the upper receiving barrel 109 and the lower receiving barrel 101 and the upper receiving barrel 109 are both installed. Equipped with a sealing gasket, the extension block 113 is integrally arranged on the surface of the bottom of the upper receiving cylinder 109, through the lower receiving cylinder 101, liquid level observation window 102, water level observation window 103, air extraction check valve 104, negative pressure pipe connector 105, water inlet check valve 106, water inlet pipe connector 107, drain solenoid valve 108, upper receiving cylinder 109, cylinder cover 110, first electromagnetic lock 111, second electromagnetic lock 112 and extension block 113, so that a split design can be formed between the upper receiving cylinder 109 and the lower receiving cylinder 101, which is convenient for taking out materials.

[0044] Among them; the water bath heating and water removal mechanism includes an electric heater 201, an insulation ring 202, an evaporation pot 203 and a heat conductive sheet 204, the electric heater 201 is fixedly installed inside the lower receiving tube 101, the support ring 202 is fixedly connected to the inner wall of the lower receiving tube 101, the evaporation pot 203 is fixedly connected to the inside of the insulation ring 202, and the heat conductive sheet 204 is fixedly connected to the lower surface of the evaporation pot 203. Through the arrangement of the electric heater 201, the insulation ring 202, the evaporation pot 203 and the heat conductive sheet 204, the water bath can be used to avoid overheating of the temperature in the evaporation pot 203, and at the same time, in cooperation with the lower receiving tube 101 and the external negative pressure pump, the negative pressure can be used to reduce the boiling point of the water in the waste liquid, so as to ensure that the water in the waste liquid can boil and evaporate quickly when the temperature is relatively not too high.

[0045] Among them; the filtering clamping mechanism includes a mounting frame 301, a connecting piece 302 and an elastic clamping block 303, the mounting frame 301 is fixedly connected to the inside of the upper receiving tube 109, the connecting piece 302 is fixedly connected to the inside of the mounting frame 301, and the elastic clamping block 303 is integrally arranged inside the connecting piece 302 to facilitate the clamping and fixing of the clamping frame 501.

[0046] Among them; the silicon powder filtering mechanism includes a support ring 401, a first holding inner edge ridge 402 and a fine filter 403. The support ring 401 is movably installed inside the mounting frame 301, the first holding inner edge ridge 402 is integrally arranged above the support ring 401, and the fine filter 403 is fixedly connected to the inside of the support ring 401 to facilitate filtering and intercepting silicon powder with a smaller diameter.

[0047] Among them; the silicon carbide particle filtering mechanism includes a card frame 501, a bayonet 502, a second holding inner edge ridge 503 and a coarse filter screen 504, the card frame 501 is installed inside the installation frame 301, the bayonet 502 is opened through the surface of the card frame 501, the second holding inner edge ridge 503 is integrally arranged above the card frame 501, the coarse filter screen 504 is fixedly connected to the inside of the card frame 501, and the card frame 501 is connected to the installation frame 301 through the bayonet 502 and the elastic card block 303 to facilitate filtering and intercepting silicon carbide particles with larger diameters.

[0048] Among them; the adsorption and impurity removal mechanism includes a funnel 601, a switch solenoid valve 602, a pick-up and drop basket 603, a liquid leakage net 604, a pull-out 605 and an activated carbon filter element 606, the funnel 601 is fixedly connected to the inside of the lower receiving cylinder 101, the switch solenoid valve 602 is fixedly installed at the bottom of the funnel 601, the pick-up and drop basket 603 is movably installed inside the funnel 601, the liquid leakage net 604 is fixedly connected to the bottom of the pick-up and drop basket 603, the pull-out 605 runs through the surface of the pick-up and drop basket 603, the activated carbon filter element 606 is movably installed inside the pick-up and drop basket 603, and the funnel 601, the switch solenoid valve 602, the pull-out 605, and the activated carbon filter element 606 are movably installed inside the pick-up and drop basket 603. Closing solenoid valve 602, pick-and-place basket 603, liquid leakage net 604 and activated carbon filter element 606 can adsorb trace impurities in the liquid to ensure further purification of polyethylene glycol. Ethylene glycol decolorization activated carbon is an adsorbent liquid phase adsorption can remove trace impurities in industrial-grade ethylene glycol products to improve its ultraviolet transmittance. The carbon product has a pore volume with specific adsorption properties for odor compounds, and has a mesopore volume and macropore volume value that is about twice the optimal ratio of odor removal activated carbon products and contains special surface chemical properties and has a good effect on adsorbing ethylene glycol impurities. The special activated carbon has good adsorption performance.

[0049] The opening and closing buffer mechanism includes a hydraulic cylinder 701, a sealing ring 702, a sealing ring 703, a piston column 704, a piston inner block 705, a piston sleeve 706, a piston sealing ring 707, a liquid hole 708, a flow suppression ring 709, a flow suppression seam 710, an isolation piston 711 and a compensation chamber 712. The hydraulic cylinder 701 is rotatably connected to the surface of the lower receiving cylinder 101, the sealing ring 702 is fixedly connected to one end of the hydraulic cylinder 701, and the sealing ring 703 is fixedly connected to the sealing end. The inner wall of the ring 702, the piston column 704 is rotatably connected to the bottom of the extension block 113, and the surface of the piston column 704 is slidably connected to the inner wall of the sealing ring 703, the piston inner block 705 is fixedly sleeved on the bottom end of the piston column 704, the piston outer sleeve 706 is fixedly sleeved on the surface of the piston inner block 705, the piston sealing ring 707 is fixedly sleeved on the surface of the piston outer sleeve 706, and the surface of the piston sealing ring 707 is slidably connected to the inner wall of the hydraulic cylinder 701, the liquid hole 708 is penetrated and opened on the surface of the piston inner block 705, the flow suppression ring 709 is fixedly connected between the piston inner block 705 and the piston outer sleeve 706, the flow suppression seam 710 is penetrated and opened on the surface of the flow suppression ring 709, the isolation piston 711 is slidably connected to the inside of the hydraulic cylinder 701, the compensation chamber 712 is arranged on the side of the isolation piston 711 away from the sealing ring 702, and the inside of the compensation chamber 712 is filled with nitrogen, and the space between the isolation piston 711 and the sealing ring 702 is filled with damping fluid, By setting up the hydraulic cylinder 701, end ring 702, sealing ring 703, piston column 704, piston inner block 705, piston sleeve 706, piston sealing ring 707, liquid through hole 708, flow suppression ring 709, flow suppression slit 710, isolation piston 711 and compensation chamber 712, the flow suppression of liquid can be achieved through the flow suppression slit 710 to limit the extension and contraction speed between the hydraulic cylinder 701 and the piston column 704, thereby avoiding the upper supporting cylinder 109 from opening and closing too quickly and causing hand pinching.

[0050] A method for treating silicon wafer cutting waste liquid, comprising:

[0051] Step 1: Connect the negative pressure pipe connector 105 to the external negative pressure pump, and connect the water inlet pipe connector 107 to the external water pipe;

[0052] Step 2: Close the drain solenoid valve 108 and the switch solenoid valve 602, close the second solenoid lock 112, unlock the first solenoid lock 111, open the cylinder cover 110, inject silicon wafer cutting waste liquid into the upper receiving cylinder 109, and then close the cylinder cover 110 and close the first solenoid lock 111;

[0053] Step 3: Open the valve of the external water pipe to inject water into the receiving tube 101, observe the water level through the water level observation window 103, ensure that the water level submerges the evaporator 203 but leaves a cavity under the insulation ring 202, then close the valve of the external water pipe and turn on the electric heater 201 for heating;

[0054] Step 4: Start the external negative pressure pump, which generates negative pressure to continuously draw out the gas inside the lower receiving tube 101, so that the air pressure above the evaporator 203 is reduced;

[0055] Step 5: Open the switch solenoid valve 602, and the negative pressure generated by the negative pressure pump pumps the silicon wafer cutting waste liquid to accelerate the infiltration of the silicon wafer cutting waste liquid. When the silicon wafer cutting waste liquid infiltrates, the silicon carbide particles with larger diameters are intercepted by the coarse filter 504, and then the silicon powder with smaller diameters is intercepted by the fine filter 403. Then, the silicon wafer cutting waste liquid passes through the activated carbon filter element 606. When the silicon wafer cutting waste liquid passes through the activated carbon filter element 606, the trace impurities in the silicon wafer cutting waste liquid are adsorbed, and the remaining mixed liquid mainly composed of polyethylene glycol and water falls from the funnel 601 into the evaporator 203;

[0056] Step 6: Observe from the liquid level observation window 102 to ensure that the mixed liquid fills the evaporator 203 and then close the switch solenoid valve 602. The evaporator 203 heats the mixed liquid to evaporate the water quickly. The negative pressure generated by the external negative pressure pump will reduce the air pressure on the surface of the mixed liquid, so that the boiling point of the water in the mixed liquid is reduced, and the water evaporates quickly until it is removed.

[0057] Step 7: After the water is removed, repeat steps 5 to 6 until all the waste liquid from silicon wafer cutting is separated. Then, turn off the negative pressure pump and the electric heater 201, open the drain solenoid valve 108 to drain the water, unlock the first electromagnetic lock 111 to unfold the barrel cover 110, take out the silicon carbide particles in the coarse filter 504 and the silicon powder in the fine filter 403 in turn, then close the barrel cover 110 and close the first electromagnetic lock 111;

[0058] Step eight: Unlock the second electromagnetic lock 112, unfold the upper receiving tube 109, take out the polyethylene glycol in the evaporator 203, and finally close the upper receiving tube 109, close the second electromagnetic lock 112, and when unfolding and closing the upper receiving tube 109, the upper receiving tube 109 will drive the piston column 704 to expand and contract inside the hydraulic cylinder 701 through the extension block 113. At this time, the damping fluid will be squeezed through the liquid through hole 708 and the flow suppression slit 710. Since the size and number of the flow suppression slit 710 are fixed, the flow rate of the damping fluid is also limited. Therefore, the rate at which the piston column 704 expands and contracts inside the hydraulic cylinder 701 is also limited, and the opening and closing rate of the upper receiving tube 109 is limited. Therefore, the upper receiving tube 109 cannot be opened and closed too quickly, thereby avoiding the upper receiving tube 109 from pinching your hands.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cutting waste liquid treatment device, characterized in that: include: A double-barrel material receiving mechanism, wherein a water bath heating and water removal mechanism is installed inside the double-barrel material receiving mechanism, and a filter clamping mechanism is also fixedly connected inside the double-barrel material receiving mechanism, and the filter clamping mechanism is located above the water bath heating and water removal mechanism, a silicon powder filtering mechanism and a silicon carbide particle filtering mechanism are respectively installed inside the filter clamping mechanism, and the silicon carbide particle filtering mechanism is located above the silicon powder filtering mechanism, an adsorption and impurity removal mechanism is installed between the filter clamping mechanism and the water bath heating and water removal mechanism, and an opening and closing buffer mechanism is installed on the surface of the double-barrel material receiving mechanism; The double-barrel material receiving mechanism comprises a lower receiving barrel (101), a liquid level observation window (102), a water level observation window (103), an air extraction check valve (104), a negative pressure pipe connector (105), a water inlet check valve (106), a water inlet pipe connector (107) and a water discharge solenoid valve (108); the liquid level observation window (102) and the water level observation window (103) are both fixedly mounted on the surface of the lower receiving barrel (101); the air extraction check valve (104) and the water inlet check valve (106) are They are all fixedly mounted on the surface of the lower receiving tube (101), and the air extraction check valve (104) is located on the side above the water bath heating and water removal mechanism, and the water inlet check valve (106) is located on the side below the water bath heating and water removal mechanism, the negative pressure pipe connector (105) is fixedly mounted on the output end of the air extraction check valve (104), the water inlet pipe connector (107) is fixedly mounted on the input end of the water inlet check valve (106), and the water discharge solenoid valve (108) is fixedly mounted on the bottom of the lower receiving tube (101); The double-barrel material receiving mechanism further comprises an upper receiving barrel (109), a barrel cover (110), a first electromagnetic lock (111), a second electromagnetic lock (112) and an extension block (113); the upper receiving barrel (109) is rotatably connected to the top of the lower receiving barrel (101); the barrel cover (110) is rotatably connected to the top of the upper receiving barrel (109); the first electromagnetic lock (111) is installed between the upper receiving barrel (109) and the barrel cover (110); the second electromagnetic lock (112) is installed between the upper receiving barrel (109) and the lower receiving barrel (101); sealing gaskets are installed between the barrel cover (110) and the upper receiving barrel (109) and between the lower receiving barrel (101) and the upper receiving barrel (109); and the extension block (113) is integrally arranged on the surface of the bottom of the upper receiving barrel (109); The water bath heating and water removal mechanism comprises an electric heater (201), a heat insulation ring (202), an evaporation pot (203) and a heat conductive sheet (204); the electric heater (201) is fixedly mounted inside the lower receiving tube (101); the heat insulation ring (202) is fixedly connected to the inner wall of the lower receiving tube (101); the evaporation pot (203) is fixedly connected to the inside of the heat insulation ring (202); and the heat conductive sheet (204) is fixedly connected to the lower surface of the evaporation pot (203); The filter clamping mechanism comprises a mounting frame (301), a connecting piece (302) and an elastic clamping block (303); the mounting frame (301) is fixedly connected to the interior of the upper receiving cylinder (109); the connecting piece (302) is fixedly connected to the interior of the mounting frame (301); and the elastic clamping block (303) is integrally arranged inside the connecting piece (302); The silicon powder filtering mechanism comprises a support ring (401), a first holding inner edge ridge (402) and a fine filter (403); the support ring (401) is movably mounted inside the mounting frame (301); the first holding inner edge ridge (402) is integrally arranged above the support ring (401); and the fine filter (403) is fixedly connected inside the support ring (401); The silicon carbide particle filtering mechanism comprises a card frame (501), a card slot (502), a second holding inner edge ridge (503) and a coarse filter (504); the card frame (501) is installed inside the mounting frame (301); the card slot (502) is arranged through the surface of the card frame (501); the second holding inner edge ridge (503) is integrally arranged above the card frame (501); the coarse filter (504) is fixedly connected to the inside of the card frame (501); and the card frame (501) is connected to the mounting frame (301) via the card slot (502) and the elastic card block (303); The adsorption and impurity removal mechanism comprises a funnel (601), a switch solenoid valve (602), a pick-up and drop basket (603), a liquid leakage net (604), a pull-out opening (605) and an activated carbon filter element (606); the funnel (601) is fixedly connected to the interior of the lower receiving cylinder (101); the switch solenoid valve (602) is fixedly installed at the bottom of the funnel (601); the pick-up and drop basket (603) is movably installed inside the funnel (601); the liquid leakage net (604) is fixedly connected to the bottom of the pick-up and drop basket (603); the pull-out opening (605) is opened through the surface of the pick-up and drop basket (603); and the activated carbon filter element (606) is movably installed inside the pick-up and drop basket (603); The opening and closing buffer mechanism comprises a hydraulic cylinder (701), a sealing ring (702), a sealing ring (703), a piston column (704), a piston inner block (705), a piston sleeve (706), a piston sealing ring (707), a liquid through hole (708), a flow suppression ring (709), a flow suppression seam (710), an isolation piston (711) and a compensation chamber (712); the hydraulic cylinder (701) is rotatably connected to the surface of the lower receiving cylinder (101); the sealing ring (702) is fixedly connected to one end of the hydraulic cylinder (701); the sealing ring (703) is fixedly connected to the inner wall of the sealing ring (702); the piston column (704) is rotatably connected to the bottom of the extension block (113); the surface of the piston column (704) is slidably connected to the inner wall of the sealing ring (703); the piston inner block (705) is fixedly sleeved on the bottom end of the piston column (704); The piston sleeve (706) is fixedly sleeved on the surface of the piston inner block (705), the piston seal ring (707) is fixedly sleeved on the surface of the piston sleeve (706), and the surface of the piston seal ring (707) is slidably connected to the inner wall of the hydraulic cylinder (701), the liquid through hole (708) is penetrated and opened on the surface of the piston inner block (705), the flow suppression ring (709) is fixedly connected between the piston inner block (705) and the piston sleeve (706), the flow suppression slit (710) is penetrated and opened on the surface of the flow suppression ring (709), the isolation piston (711) is slidably connected inside the hydraulic cylinder (701), the compensation chamber (712) is arranged on a side of the isolation piston (711) away from the sealing ring (702), the interior of the compensation chamber (712) is filled with nitrogen, and the space between the isolation piston (711) and the sealing ring (702) is filled with damping liquid.

2. A method for treating silicon wafer cutting waste liquid based on the silicon wafer cutting waste liquid treatment device according to claim 1, characterized in that: include: Step 1: Connect the negative pressure pipe connector (105) to an external negative pressure pump, and connect the water inlet pipe connector (107) to an external water pipe; Step 2: close the drain solenoid valve (108) and the switch solenoid valve (602), close the second solenoid lock (112), unlock the first solenoid lock (111), open the cylinder cover (110), inject silicon wafer cutting waste liquid into the upper receiving cylinder (109), and then close the cylinder cover (110) and close the first solenoid lock (111); Step 3: Open the valve of the external water pipe to inject water into the lower receiving tube (101), observe the water level through the water level observation window (103), ensure that the water level submerges the evaporator (203) but leaves a cavity below the insulation ring (202), then close the valve of the external water pipe and turn on the electric heater (201) for heating; Step 4: starting the external negative pressure pump, which generates negative pressure to continuously draw out the gas inside the lower receiving cylinder (101), thereby reducing the gas pressure above the evaporator (203); Step 5: Open the switch solenoid valve (602), and the negative pressure generated by the negative pressure pump pumps the silicon wafer cutting waste liquid to accelerate the infiltration of the silicon wafer cutting waste liquid. When the silicon wafer cutting waste liquid infiltrates, the silicon carbide particles with larger diameters are intercepted by the coarse filter (504), and then the silicon powder with smaller diameters is intercepted by the fine filter (403). Then, the silicon wafer cutting waste liquid below passes through the activated carbon filter element (606). When the silicon wafer cutting waste liquid passes through the activated carbon filter element (606), the trace impurities in the silicon wafer cutting waste liquid are adsorbed, and the remaining mixed liquid mainly composed of polyethylene glycol and water falls from the funnel (601) into the evaporation pot (203); Step 6: Observe from the liquid level observation window (102) to ensure that the mixed liquid fills the evaporator (203), then close the switch solenoid valve (602), the evaporator (203) heats the mixed liquid, causing the water to evaporate quickly, and the negative pressure generated by the external negative pressure pump reduces the air pressure on the surface of the mixed liquid, causing the boiling point of the water in the mixed liquid to decrease, and the water evaporates quickly until it is removed; Step 7: After the water is removed, repeat steps 5 to 6 until all the waste liquid from silicon wafer cutting is separated, then turn off the negative pressure pump and the electric heater (201), open the drain solenoid valve (108) to drain the water, unlock the first electromagnetic lock (111), unfold the cylinder cover (110), take out the silicon carbide particles in the coarse filter (504) and the silicon powder in the fine filter (403) in turn, then close the cylinder cover (110), and close the first electromagnetic lock (111); Step 8: unlock the second electromagnetic lock (112), unfold the upper receiving cylinder (109), take out the polyethylene glycol in the evaporating pot (203), and finally close the upper receiving cylinder (109) and close the second electromagnetic lock (112).

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