A high-cleanliness semiconductor wafer automatic loading equipment

Abstract

The cam is connected to the second sliding plate by the spring, and the second sliding plate is connected to the second sliding plate by the spring.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor material processing, and in particular to an automatic loading device for semiconductor wafers with high cleanliness. Background Art

[0002] In semiconductor production, operators need to transport the wafer to the next processing station by hand or with the help of a carrying device.

[0003] Semiconductor production has strict requirements on cleanliness. Generally, the cleanliness of the wafer needs to be strictly maintained during the processing or transportation of the wafer. However, in the prior art, operators often hold the wafer to adjust the wafer position during the transportation of the wafer. This method will inevitably contaminate the wafer with dust or bacteria through manual contact, and this method is difficult to ensure the cleanliness of the wafer during processing.

[0004] In addition, there are many devices in the prior art that load wafers through automation, but most of these devices currently have complex structures and high production and operating costs. Summary of the invention

[0005] The purpose of the present invention is to address the deficiencies in the prior art and to propose a high-cleanliness semiconductor wafer automatic loading device to solve the technical problem mentioned in the background art that some of the existing wafers are easily contaminated when they are transported manually.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] The cam is secured to the chassis and has a second locking plate, the second locking plate being secured to the chassis and having a camshaft that is secured to the chassis.

[0008] Working principle:

[0009] After the wafer is processed, it is first placed on the bottom plate and abuts against the first slide plate and the second slide plate. The specific method of placing the wafer in the prior art can be to place it by suction with a suction cup or by clamping, which is more common.

[0010] Afterwards, the operator drives the first slide to slide. During the sliding process of the first slide, the rotating rod is driven to rotate through the connecting assembly. The rotating rod is wound with a pulling rope so that the pulling rope pulls the second slide, so that the second slide pushes the wafer body to slide along a sliding direction horizontally and perpendicular to the sliding direction of the first slide. At the same time, the first slide drives the second slide and the wafer body as a whole to slide along the sliding direction of the first slide, thereby realizing the sliding of the wafer body along the sliding direction of the first slide and the sliding direction of the second slide.

[0011] The beneficial effects of the present invention are:

[0012] During use of the present invention, the wafer body can be automatically transported through the arrangement of the bottom plate, the first slide plate, the second slide plate and the connecting components, thereby avoiding manual intervention in the transfer of the wafer body and ensuring the cleanliness of the wafer body during the transportation process.

[0013] In addition, the present invention can drive the second slide to slide in a direction perpendicular to the sliding direction of the first slide under the action of a series of factors such as the connecting component, simply by driving the first slide to slide, and at the same time realize the partial displacement sliding of the wafer body in two directions, thereby transporting the wafer body to a predetermined work station, achieving the purpose of transporting the wafer body in two displacement directions with a simple structure, and having a double displacement effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a front view of an embodiment of the present invention.

[0015] Explanation of the accompanying drawings: base plate 1, first slide plate 2, first mounting plate 3, second mounting plate 4, telescopic rod 5, return spring 6, second slide plate 7, rotating rod 8, pulling rope 9, rack 10, gear 11, first slide groove 12, first slider 13, motor 14, rotating shaft 15, extrusion plate 16, oil storage pot 17, first oil dripping pipe 18, second slide groove 19, second slider 20, screw 21, second oil dripping pipe 22. DETAILED DESCRIPTION

[0016] The technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0017] like Figure 1As shown, a high-cleanliness semiconductor wafer automatic loading device comprises a horizontally placed bottom plate 1, on which a first slide plate 2 is slidably provided, which is in sliding contact with the bottom plate 1 and can slide horizontally along the bottom plate 1, on which a first mounting plate 3 and a second mounting plate 4 are fixed, on which a telescopic rod 5 which can be horizontally extended and retracted and whose retracting direction is perpendicular to the sliding direction of the first slide plate 2 is fixed, on which the first mounting plate 3 is fixed, and on which a retracting rod 5 which can be horizontally extended and retracted and whose retracting direction is perpendicular to the sliding direction of the first slide plate 2 is fixed, on which a retracting rod 5 is peripherally sleeved, which is provided with a return spring 6 which can be extended and retracted along with the retracting and retracting of the retracting rod 5, and the return spring 6 is fixedly connected to the first mounting plate 3, and the retracting and retracting rod 5 is horizontally extended and retracted. The telescopic end of the retractable rod 5 is fixed with a second slide plate 7 that is slidably abutted against the first slide plate 2. A rotating rod 8 that is perpendicular to the surface of the bottom plate 1 is rotatably provided on the bottom plate 1. A pulling rope 9 is wound around the rotating rod 8. The pulling rope 9 slides through the second mounting plate 4 and is connected to the second slide plate 7. It also includes a connecting component arranged between the first slide plate 2 and the rotating rod 8. The connecting component is used to drive the rotating rod 8 to rotate as the first slide plate 2 slides, so that the rotating rod 8 is wound around the pulling rope 9, so that the pulling rope 9 drives the second slide plate 7 to slide along the telescopic direction of the telescopic rod 5.

[0018] The present invention places the wafer body on the base plate 1, and makes the wafer body abut against the first slide plate 2 and the second slide plate 7 respectively. When the operator drives the first slide plate 2 to slide on the base plate 1, the wafer body will first slide along the same sliding direction with the first slide plate 2. At the same time, under the synchronous cooperation of the connecting component, the pulling rope 9, etc., the wafer body will also slide along the direction of the second slide plate 7 with the second slide plate 7. In this way, not only the manual transfer of the wafer body is avoided, but also the simultaneous movement of the wafer body in two directions can be realized, and finally it can be transferred to the predetermined processing station, thereby achieving the dual position adjustment purpose.

[0019] like Figure 1 As shown, the connecting assembly includes a rack 10 fixed on the first slide 2 and a gear 11 fixedly mounted on the periphery of the rotating rod 8. The rack 10 is meshed with the gear 11, and the rack 10 moves simultaneously with the first slide 2. The movement of the rack 10 will drive the gear 11 to rotate, and then the gear 11 will drive the rotating rod 8 fixedly connected thereto to rotate. The rotation of the rotating rod 8 will pull the pulling rope 9, and the pulling rope 9 will drive the second slide 7 to slide. At this time, the reset spring 6 is in a pulled state. When the rack 10 moves back with the first slide 2, the reset spring 6 will pull the second slide 7, so that the second slide 7 slides and resets, thereby realizing a conveying action. The above operation is repeated for the next conveying action. This structural method is relatively simple in manufacturing and operation costs.

[0020] like Figure 1As shown, the bottom plate 1 is provided with a first slide groove 12, and a first slider 13 fixedly connected to the first slide plate 2 is slidably arranged in the first slide groove 12, and the first slide plate 2 slides on the bottom plate 1 in this way, and the structure is simple. A motor 14 is fixed on the bottom plate 1, and a rotating shaft 15 with a screw structure is arranged at the output end of the motor 14, and the rotating shaft 15 passes through the first slide plate 2 and the two are threadedly connected, and the rotating shaft 15 is driven to rotate by the motor 14, and the rotation of the rotating shaft 15 will drive the first slide plate 2 to move, and by adding the motor 14 and the rotating shaft 15, the wafer body can be automatically transported, which is more automated.

[0021] like Figure 1 As shown, it also includes a lubrication component arranged on the base plate 1, and a squeezing plate 16 is fixed on the rack 10. The squeezing plate 16 is used to squeeze the lubrication component as the rack 10 slides, so that the lubrication component drips oil into the first slide groove 12 for lubrication. The movement of the rack 10 will drive the squeezing plate 16 to squeeze the lubrication component, so that the lubrication component drips oil into the first slide groove 12 for lubrication, thereby making the first slide plate 2 slide more smoothly. Through the sliding of the first slide plate 2, the first slide groove 12 can be lubricated at the same time, which not only realizes the two-displacement transportation of the wafer body, but also can lubricate the first slide groove 12 at the same time, achieving a triple technical effect.

[0022] like Figure 1 As shown, the lubrication assembly includes an oil storage pot 17 with an oil-pushing rod and a first oil dripping pipe 18 connected to the oil storage pot 17, the oil dripping nozzle of the first oil dripping pipe 18 faces the first slide groove 12, and the oil storage pot 17 is similar to the injection booster and other structures in the prior art, which is very existing. This structure of the lubrication assembly is relatively simple, which not only saves production and use costs, but also achieves the lubrication purpose.

[0023] like Figure 1As shown, the bottom plate 1 is provided with a second slide groove 19 parallel to the first slide groove 12, and a second slider 20 is slidably provided in the second slide groove 19, and the second slider 20 is fixedly connected to the oil reservoir 17, and the oil reservoir 17 is slidably provided on the bottom plate 1. The sliding of the oil reservoir 17 is achieved by setting the second slide groove 19 and the second slider 20, so that the lubrication rhythm can be controlled. When lubrication is needed, the operator slides the oil reservoir 17 to make the rack 10 slide and drive the extrusion plate 16 to move to a stroke that can push the booster oil squeezing rod on the oil reservoir 17, so as to lubricate. When lubrication is not needed, the oil reservoir 17 is slid to a stroke that the rack 10 slides and drives the extrusion plate 16 to not move to a stroke that can push the booster oil squeezing rod on the oil reservoir 17, so that the lubrication demand can be controlled more flexibly. The second slide block 20 is threadedly connected with a screw 21 which abuts against the wall of the second slide groove 19 after being screwed in. The second slide block 20 is locked after sliding in the second slide groove 19 by rotating the screw 21, so that the position of the oil storage pot 17 in the second slide groove 19 can be more stably controlled. The first oil dripping pipe 18 is connected with a second oil dripping pipe 22, and the oil dripping nozzle of the second oil dripping pipe 22 faces the second slide groove 19. During the lubrication process, the second oil dripping pipe 22 can be provided to lubricate the second slide groove 19 at the same time, which is more efficient and practical.

[0024] Working principle:

[0025] After the wafer is processed, it is first placed on the bottom plate 1 and abuts against the first slide plate 2 and the second slide plate 7. The specific method of placing the wafer can be placed by suction cup adsorption or clamping in the prior art, which is more common.

[0026] Afterwards, the operator drives the first slide 2 to slide through the motor 14 and the rotating shaft 15. During the sliding process of the first slide 2, the rotating rod 8 is driven to rotate through the connecting assembly. Specifically, the sliding of the first slide 2 drives the rack 10 to move, the rack 10 drives the gear 11 to rotate, and the gear 11 drives the rotating rod 8 to rotate. The rotating rod 8 winds up the pulling rope 9 so that the pulling rope 9 pulls the second slide 7, so that the second slide 7 pushes the wafer body to slide along the sliding direction horizontally and perpendicular to the sliding direction of the first slide 2, and at the same time, the first slide 2 drives the second slide 7 and the wafer body as a whole to slide along the sliding direction of the first slide 2, thereby realizing the sliding of the wafer body along the sliding direction of the first slide 2 and the sliding direction of the second slide 7.

[0027] At the same time, the movement of the rack 10 will drive the squeezing plate 16 to move, and the squeezing plate 16 squeezes the booster squeezing rod of the oil storage pot 17, so that the oil body drips oil lubrication into the first slide groove 12 through the first oil drip pipe 18, and the second oil drip pipe 22 drips oil lubrication into the second slide groove 19, thereby achieving the purpose of smooth sliding.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A high-cleanliness semiconductor wafer automatic loading device, characterized in that: The invention comprises a bottom plate (1) placed horizontally, a first slide plate (2) is slidably provided on the bottom plate (1) and is in sliding contact with the bottom plate (1) and can slide horizontally along the bottom plate (1), a first mounting plate (3) and a second mounting plate (4) are fixed on the first slide plate (2), a telescopic rod (5) is fixed on the first mounting plate (3) and can be horizontally telescopic and the telescopic direction is perpendicular to the sliding direction of the first slide plate (2), a reset spring (6) is sleeved on the outer periphery of the telescopic rod (5) and can be telescopic and retracted along with the telescopic rod (5), the reset spring (6) is fixedly connected to the first mounting plate (3), and a first spring (6) is fixedly provided at the telescopic end of the telescopic rod (5) and is connected to the first mounting plate (3). The second slide plate (7) is slidably abutted against the slide plate (2), and a rotating rod (8) is rotatably provided on the bottom plate (1) and is perpendicular to the plate surface of the bottom plate (1). A pulling rope (9) is wound around the rotating rod (8), and the pulling rope (9) is connected to the second slide plate (7) after sliding through the second mounting plate (4). The second slide plate (7) also includes a connecting component arranged between the first slide plate (2) and the rotating rod (8), and the connecting component is used to drive the rotating rod (8) to rotate as the first slide plate (2) slides, so that the rotating rod (8) is wound around the pulling rope (9) so that the pulling rope (9) drives the second slide plate (7) to slide along the telescopic direction of the telescopic rod (5); The connecting assembly comprises a rack (10) fixed on the first slide plate (2) and a gear (11) fixedly sleeved on the periphery of the rotating rod (8), and the rack (10) is meshed with the gear (11); The bottom plate (1) is provided with a first sliding groove (12), and a first sliding block (13) fixedly connected to the first sliding block (2) is slidably arranged in the first sliding groove (12); A motor (14) is fixed on the bottom plate (1), and a rotating shaft (15) with a screw structure is provided at the output end of the motor (14). The rotating shaft (15) passes through the first slide plate (2) and the two are threadedly connected. It also includes a lubrication component arranged on the bottom plate (1), and a squeezing plate (16) is fixed on the rack (10), and the squeezing plate (16) is used to squeeze the lubrication component as it slides with the rack (10), thereby causing the lubrication component to drip oil into the first slide groove (12) for lubrication; The lubrication assembly comprises an oil storage pot (17) with an oil-pushing rod and a first oil dripping pipe (18) connected to the oil storage pot (17), wherein the oil dripping nozzle of the first oil dripping pipe (18) faces the first chute (12).

2. The high-cleanliness semiconductor wafer automatic loading equipment according to claim 1, characterized in that: The bottom plate (1) is provided with a second slide groove (19) parallel to the first slide groove (12), a second slider (20) is slidably arranged in the second slide groove (19), the second slider (20) is fixedly connected to the oil storage pot (17), and the oil storage pot (17) is slidably arranged on the bottom plate (1).

3. The high cleanliness semiconductor wafer automatic loading equipment according to claim 2, characterized in that: The second sliding block (20) is threadedly connected with a screw (21) which abuts against the wall of the second sliding groove (19) after being screwed in.

4. The high-cleanliness semiconductor wafer automatic loading equipment according to claim 2, characterized in that: The first oil dripping pipe (18) is connected to a second oil dripping pipe (22), and the oil dripping nozzle of the second oil dripping pipe (22) faces the second chute (19).

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