Microphone module and electronic equipment

Abstract

The present application relates to the field of terminal technology, and in particular to a microphone module and an electronic device. The microphone module includes: a circuit board, the circuit board includes a first sound pickup hole, a second sound pickup hole and a bridge channel; wherein the first sound pickup hole and the second sound pickup hole are arranged at intervals, and the bridge channel is connected to the first sound pickup hole and the second sound pickup hole; the first sound pickup hole is used to connect to the sound pickup channel of the electronic device; a microphone, the microphone is arranged on the circuit board and is connected to the second sound pickup hole; the microphone and the sound pickup channel are located on the same side of the circuit board. The microphone module and electronic device provided by the present application can reduce the overall thickness of the microphone module, and facilitate the thin and light design of the electronic device.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a microphone module and an electronic device. Background Art

[0002] In order to realize voice control and voice call functions, electronic devices often need to be equipped with a microphone module. The microphone module is generally arranged inside the electronic device and connected to the outside of the electronic device through a sound pickup channel on the housing of the electronic device.

[0003] As electronic devices are designed to be thinner and lighter, the internal space of the housing of electronic devices is getting smaller and smaller. However, the original arrangement of the microphone module requires a large internal space of the housing, which leads to a conflict between the arrangement of the microphone module and the thinner and lighter design of electronic devices, making it difficult to meet the design requirements. Summary of the invention

[0004] In order to solve the above problems, the present application provides a microphone module and an electronic device, which can reduce the overall thickness of the microphone module and facilitate the lightweight design of the electronic device.

[0005] In order to achieve the above objectives, in a first aspect, the present application provides a microphone module, comprising:

[0006] A circuit board, the circuit board comprising a first sound pickup hole, a second sound pickup hole and a bridge channel; wherein the first sound pickup hole and the second sound pickup hole are arranged at intervals, the bridge channel is connected to the first sound pickup hole and the second sound pickup hole; the first sound pickup hole is used to be connected to the sound pickup channel of the electronic device;

[0007] A microphone is arranged on the circuit board and is connected to the second sound pickup hole;

[0008] The microphone is located on the same side of the circuit board as the audio channel.

[0009] The microphone module provided in the embodiment of the present application sets the microphone and the sound pickup channel on the same side of the circuit board, and uses the bridge channel to connect the first sound pickup hole and the second sound pickup hole. This not only enables the connection between the microphone and the sound pickup channel, but more importantly, changes the original stacking arrangement of the sound pickup channel, the circuit board and the microphone to reduce the thickness of the microphone module, thereby facilitating the thin and light design of the electronic device.

[0010] In an optional embodiment, it further includes: a sealing cover, which is located on the side of the circuit board facing away from the microphone and is buckled with the circuit board; along the arrangement direction of the first sound pickup hole and the second sound pickup hole, the two ends of the sealing cover cover the first sound pickup hole and the second sound pickup hole; there is a cavity between the sealing cover and the circuit board, and the cavity is connected to the first sound pickup hole and the second sound pickup hole to form a bridge channel. In this embodiment, a cavity can be set between the circuit board and the sealing cover, and the sealing cover is used to seal the cavity to form a bridge channel, thereby facilitating the setting of the bridge channel.

[0011] In an optional embodiment, the sealing cover has a first groove opened toward the circuit board, the first sound pickup hole and the second sound pickup hole are connected to the first groove, and the first groove forms a cavity. In this embodiment, by providing the first groove on the sealing cover and using the first groove to form a cavity, the circuit board structure is avoided from being affected. In this way, the sealing cover can not only achieve a sealing effect, but also provide a cavity structure.

[0012] In an optional embodiment, a second groove is provided on the side of the circuit board facing the sealing cover; the second groove is connected to the first sound pickup hole and the second sound pickup hole; and the sealing cover is located in the second groove. In this embodiment, the second groove is provided on the circuit board, and the sealing cover is provided in the second groove, which can further reduce the space occupied by the sealing cover in the thickness direction, thereby reducing the size of the microphone module in the thickness direction, thereby facilitating the realization of a lightweight design of the electronic device.

[0013] In an optional embodiment, a third groove is provided on one side of the circuit board facing the sealing cover; the third groove is connected to the first sound pickup hole and the second sound pickup hole; the sealing cover covers the opening of the third groove; and the third groove forms a cavity. In this embodiment, by providing the third groove on the circuit board to form a cavity structure, the structural design of the sealing cover can be simplified, and the space occupied by the sealing cover in the thickness direction can be further reduced, so as to reduce the size of the microphone module in the thickness direction, thereby facilitating the realization of a lightweight design of the electronic device.

[0014] In an optional embodiment, the sealing cover has a first groove opened toward the circuit board; a third groove is provided on the side of the circuit board toward the sealing cover, the third groove is connected to the first sound pickup hole and the second sound pickup hole, and the third groove is connected to the first groove; the sealing cover covers the opening of the third groove; the first groove and the third groove together form a cavity. In this embodiment, the cavity is formed by using the first groove and the third groove at the same time, so that the overall thickness of the cavity can be distributed to the two components, thereby facilitating the thin and light design of the electronic device.

[0015] In an optional embodiment, a second groove is provided on the side of the circuit board facing the sealing cover; the second groove is connected to the third groove, and the third groove is located at the bottom surface of the second groove; the sealing cover is located in the second groove. In this embodiment, the second groove is provided on the circuit board, and the sealing cover is provided in the second groove, so that the space occupied by the sealing cover in the thickness direction can be further reduced, so as to reduce the size of the microphone module in the thickness direction, thereby facilitating the realization of a lightweight design of the electronic device.

[0016] In an optional embodiment, the sealing cover includes a cover body and a flange structure, the first groove is provided on the cover body; the flange structure is connected to the edge of the cover body, and the flange structure is sealed and connected to the circuit board. In this embodiment, the contact area between the sealing cover and the electronic device can be increased by providing the flange structure, thereby increasing the connection area between the sealing cover and the electronic device, and further improving the connection strength between the sealing cover and the electronic device.

[0017] In an optional embodiment, the sealing cover is made of metal. In this embodiment, the metal material has better structural strength and is easy to process compared to other materials.

[0018] In an optional embodiment, the microphone module further includes: a sealing component, the sealing component is arranged between the first sound pickup hole and the sound pickup channel, the sealing component is provided with a first through hole, the first through hole is connected to the first sound pickup hole and the sound pickup channel; a dustproof net is arranged between the sealing component and the first sound pickup hole, or, is arranged between the sealing component and the sound pickup channel. In this embodiment, the sealing component is arranged to achieve a sealed connection between the sound pickup channel and the first sound pickup hole. At the same time, the dustproof net is arranged in the first sound pickup hole to prevent impurities in the sound pickup channel from entering the first sound pickup hole, blocking the first sound pickup hole, the bridge channel and the second sound pickup hole, so as to protect the microphone module.

[0019] In an optional embodiment, the aperture of the first sound pickup hole is larger than the aperture of the second sound pickup hole. In this embodiment, since a dustproof net is provided corresponding to the first sound pickup hole, the dustproof net will reduce the original sound pickup area of ​​the first sound pickup hole. Therefore, the aperture of the first sound pickup hole can be increased to increase the sound pickup area of ​​the first sound pickup hole and reduce the influence of the dustproof net on sound propagation.

[0020] In order to achieve the above purpose, in a second aspect, the present application provides an electronic device, comprising a housing and a microphone module as described in the first aspect, wherein the housing is provided with a sound pickup channel; the first sound pickup hole is connected to the sound pickup channel; the microphone and the sound pickup channel are located on the same side of the circuit board. In this embodiment, the electronic device with the microphone module is easier to achieve a lightweight design to meet market demand. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 A schematic diagram of the structure of a mobile phone 01 provided in this embodiment;

[0023] Figure 2 for Figure 1 The local cross-section along the AA direction;

[0024] Figure 3 for Figure 2 A simplified schematic diagram of the structure of the microphone assembly;

[0025] Figure 4 A schematic structural diagram of a microphone module and a sound pickup channel provided in this embodiment;

[0026] Figure 5 A schematic cross-sectional structure diagram of a first microphone module and a sound pickup channel provided in this embodiment;

[0027] Figure 6 A schematic cross-sectional structure diagram of a second microphone module and a sound pickup channel provided in this embodiment;

[0028] Figure 7 A schematic cross-sectional structure diagram of a third microphone module and a sound pickup channel provided in this embodiment;

[0029] Figure 8 A schematic cross-sectional structure diagram of a fourth microphone module and a sound pickup channel provided in this embodiment;

[0030] Fig. 9 A schematic cross-sectional structure diagram of a fifth microphone module and a sound pickup channel provided in this embodiment;

[0031] Fig.10 A schematic diagram of the cross-sectional structure of a sixth microphone module and a sound pickup channel provided in this embodiment;

[0032] Fig.11 A schematic cross-sectional structure diagram of a seventh microphone module and a sound pickup channel provided in this embodiment;

[0033] Fig.12 A partial cross-sectional view of an electronic device provided in this embodiment.

[0034] Graphic marking:

[0035] 01. Mobile phone; 011. Display screen; 012. Back shell; 013. Microphone assembly; 014. Microphone device; 015. Mainboard; 016. Sealing structure; 017. Sound transmission channel; 018. Sound transmission hole; 1. Circuit board; 11. First sound pickup hole; 12. Second sound pickup hole; 13. Bridging channel; 14. Second groove; 15. Third groove; 2. Microphone; 3. Sealing assembly; 31. First through hole; 4. Dustproof net; 5. Sealing cover; 51. First end; 52. Second end; 53. First groove; 54. Cover body; 55. Flange structure; 6. Pipe fittings; 100. Microphone module; 200. Electronic device; 201. Shell; 202. Sound pickup channel. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly described below in conjunction with the drawings in the embodiments of the present application.

[0037] In electronic devices, microphone (MIC) is an important recording device. Microphone is mainly used to capture sound information such as environmental sound or user's voice, and convert the sound information into electrical signals.

[0038] It is worth noting that the above-mentioned electronic devices may include but are not limited to mobile phones, tablet computers, smart wearable devices, personal digital assistants (PDAs), augmented reality (AR) and virtual reality (VR) devices, vehicle-mounted devices and other electronic devices. The electronic devices may also be electronic products such as electric cars, household appliances, headphones, and drones. The embodiments of the present application do not impose any special restrictions on the specific form of the electronic device.

[0039] The following description will be given by taking a mobile phone as an example of the electronic device.

[0040] Figure 1 This is a structural diagram of a mobile phone 01 provided in this embodiment.

[0041] like Figure 1 As shown, the mobile phone 01 may include a display screen 011 and a rear shell 012, wherein the display screen 011 is buckled onto the rear shell 012. A microphone assembly 013 is also provided between the display screen 011 and the rear shell 012. The microphone assembly 013 in the mobile phone 01 is generally used for making calls, voice recognition, recording video or audio, and the like.

[0042] One or more microphone components 013 may be provided in the mobile phone 01. For example, two microphone components 013 may be provided in the mobile phone 01, one of which has a sound outlet located at the bottom of the mobile phone 01 as a main microphone component, and the other has a sound outlet located at the top of the mobile phone 01 as a secondary microphone component. The secondary microphone component supplements the function of the main microphone component in the mobile phone 01 and can be used for specific operations such as noise cancellation, ambient sound capture, and sound orientation to provide a better call and recording experience.

[0043] It is understandable that in other mobile phones 01, there may be one or three microphone components, etc. The specific configuration may vary according to the function and design of the mobile phone 01, and is not limited in this embodiment.

[0044] It is worth mentioning that a camera module, a battery, a mainboard, a speaker assembly and other devices are also provided between the display screen 011 and the rear shell 012, which are not listed here one by one.

[0045] To facilitate the explanation of the positions of various components in the mobile phone 01, the embodiment of the present application exemplarily establishes a three-dimensional coordinate system based on the mobile phone 01, wherein the x-axis direction is the width direction of the mobile phone 01, the y-axis direction is the length direction of the mobile phone 01, and the z-axis direction is the thickness direction of the mobile phone 01.

[0046] Figure 2 for Figure 1 Local cross-section along the AA direction.

[0047] Figure 3 for Figure 2 A simplified schematic diagram of the microphone assembly in FIG.

[0048] like Figure 2 and Figure 3 As shown, in order to realize the function of a microphone, each microphone assembly 013 may include a microphone device 014, a mainboard 015, a sealing structure 016 and a sound transmission channel 017. The mainboard 015 may be the entire circuit board of the mobile phone 01, or may be a microphone function board connected to the entire circuit board.

[0049] Considering the utilization rate of the internal space of the mobile phone 01 and the compactness of the device layout, the microphone device 014 can be arranged on the main board 015 and electrically connected to the main board 015. While transmitting the sound signal collected by the microphone device 014 to the main board 015, the microphone device 014 can also be fixedly connected to prevent the microphone device 014 from being affected by external vibration.

[0050] In order to facilitate the connection between the microphone device 014 and the sound transmission channel 017 , a sound transmission hole 018 is provided on the mainboard 015 corresponding to the microphone device 014 , and the sound transmission hole 018 is used to transmit the sound signal in the sound transmission channel 017 to the microphone device 014 .

[0051] The sealing structure 016 is disposed between the sound transmission channel 017 and the sound transmission hole 018 to achieve a sealed connection between the sound transmission channel 017 and the sound transmission hole 018, thereby preventing leakage or mixing of sound signals, thereby reducing the possibility of silence or noise.

[0052] Since the microphone device 014 is disposed between the display screen 011 and the rear housing 012, in order to facilitate the connection of the microphone device 014 with the environment where the mobile phone 01 is located to receive sound signals, the sound transmission channel 017 can be disposed on the rear housing 012. One end of the sound transmission channel 017 is connected to the environment where the mobile phone 01 is located, and the other end is used to connect to the microphone device 014.

[0053] like Figure 2 As shown, Figure 2 The dotted arrow in represents the transmission direction of the sound signal. The working process of the microphone component 013 is introduced below.

[0054] When the microphone assembly 013 is working, the sound signal outside the mobile phone 01 enters through one end of the sound transmission channel 017 and is transmitted to the sound transmission hole 018 on the mainboard 015. When the sound signal is transmitted from the sound transmission channel 017 to the sound transmission hole 018, it passes through the sealing structure 016. The setting of the sealing structure 016 can prevent the sound signal from leaking between the sound transmission channel 017 and the sound transmission hole 018, or the noise signal from being transmitted between the sound transmission channel 017 and the sound transmission hole 018, so as to achieve sealing. The sound transmission hole 018 can transmit the sound signal to the microphone device 014 to realize the collection of the sound signal.

[0055] After collecting the sound signal, the microphone device 014 can process the sound signal and transmit it to the main board 015 to facilitate the realization of the call, recording or voice recognition function.

[0056] like Figure 3 As shown, in order to realize the functional design of the microphone assembly 013, the stacking of the various structures in the microphone assembly 013 adopts a sandwich structure. That is, along the z-axis direction, the microphone device 014, the main board 015, the sealing structure 016 and the sound transmission channel 017 are stacked layer by layer. In this way, while meeting the functional requirements of the microphone assembly 013, the compact design of the microphone assembly 013 can also be realized, thereby reducing the occupation of the internal space of the mobile phone 01.

[0057] like Figure 1As shown in FIG. 1 , with the development of the lightweight design of the mobile phone 01, the thickness of the mobile phone 01 is gradually reduced. Figure 2 and Figure 3 It can be seen that the microphone assembly 013 is stacked along the z-axis, and its overall thickness is H1. The size of H1 is equal to the sum of the dimensions of the microphone device 014, the mainboard 015, the sealing structure 016, and the sound transmission channel 017 along the z-axis. The dimensions of the microphone device 014, the sealing structure 016, and the sound transmission channel 017 along the z-axis are relatively small and difficult to reduce further. At this time, the z-direction space of the mobile phone 01 occupied by H1 will hinder the thin and light design of the mobile phone 01, affecting the design and manufacturing of the mobile phone 01.

[0058] In one implementation, in order to reduce H1, the rigid mainboard 015 in the microphone assembly 013 can be replaced with a flexible printed circuit (FPC), where the FPC is a local printed circuit structure. The thickness of the FPC is less than that of the rigid mainboard 015, and the overall thickness of the microphone assembly 013 can be reduced.

[0059] However, in the above implementation, the FPC is a flexible structure and cannot support the microphone device 014. An additional structure is required to support and fix the microphone device 014.

[0060] More importantly, when the microphone device 014 is connected to the FPC, an additional connector is required to electrically connect the FPC to the entire mainboard of the mobile phone 01 to achieve signal transmission. This requires the entire mainboard and connectors of the mobile phone 01 to be redesigned and arranged, making the entire design of the mobile phone 01 more difficult and difficult to achieve.

[0061] In order to solve the above problems, the present embodiment provides a microphone module and an electronic device, wherein the microphone module can reduce the space occupied in the z-axis direction, thereby facilitating the lightweight design of the electronic device.

[0062] Figure 4 This is a simplified structural diagram of a microphone module and a sound pickup channel provided in this embodiment.

[0063] Figure 5 A schematic diagram of the cross-sectional structure of the first microphone module and sound pickup channel provided in this embodiment.

[0064] See also Figure 4 and Figure 5 In some embodiments, the microphone module 100 may include a printed circuit board (PCB) 1 and a microphone 2 .

[0065] The circuit board 1 may include a first sound pickup hole 11, a second sound pickup hole 12, and a bridge channel 13. The first sound pickup hole 11 and the second sound pickup hole 12 are arranged at intervals, and the first sound pickup hole 11 is used to connect to the sound pickup channel 202 of the electronic device. At the same time, the bridge channel 13 is connected to the first sound pickup hole 11 and the second sound pickup hole 12, so that the second sound pickup hole 12 is connected to the first sound pickup hole 11 and the sound pickup channel 202 by using the bridge channel 13.

[0066] The microphone 2 is disposed on the circuit board 1 and connected to the second sound pickup hole 12, so as to be connected to the sound pickup channel 202 via the bridge channel 13 and the first sound pickup hole 11, thereby collecting the sound signal in the sound pickup channel 202. At the same time, the microphone 2 is electrically connected to the circuit board 1 to facilitate signal transmission between the circuit board 1 and the microphone 2, and the circuit board 1 can also be used to support and fix the microphone 2.

[0067] The microphone 2 and the sound pickup channel 202 are located on the same side of the circuit board 1 .

[0068] The microphone module 100 provided in the embodiment of the present application can reduce the overall thickness of the microphone module 100 while achieving a normal sound pickup function. Since the microphone 2 and the sound pickup channel 202 have a great influence on the size of the microphone module 100, after the microphone 2 and the sound pickup channel 202 are arranged on the same side of the circuit board 1, the thicknesses of the microphone 2 and the sound pickup channel 202 will not overlap, which is convenient for reducing the overall thickness of the microphone module 100. In this way, the z-direction space occupied by the microphone module 100 in the electronic device can be reduced, which is convenient for realizing a lightweight design of the electronic device. At the same time, the microphone module 100 provided in the present embodiment, while realizing a lightweight design, has little impact on other devices in the electronic device, is easy to implement, and can reduce the difficulty of designing and manufacturing the electronic device.

[0069] It is worth noting that in an electronic device, the sound pickup channel 202 is usually arranged on the housing of the electronic device to connect the inside and the outside of the electronic device. The housing can be a middle frame or a back cover, and the arrangement of the sound pickup channel 202 is not limited in this embodiment.

[0070] Please combine Figure 4 and Figure 5 In some embodiments, the microphone module 100 may further include a sealing component 3 and a dustproof net 4.

[0071] The sealing component 3 is disposed between the first sound pickup hole 11 and the sound pickup channel 202 to achieve sealing of the connection position between the first sound pickup hole 11 and the sound pickup channel 202. The sealing component 3 is provided with a first through hole 31, so that the first sound pickup hole 11 and the sound pickup channel 202 are connected by the first through hole 31, so as to achieve normal transmission of sound signals while achieving sealing.

[0072] Optionally, the material of the sealing component 3 can be a material with deformation ability. During assembly, the sealing component 3 can be first fixed to the side of the sound pickup channel 202 facing the first sound pickup hole 11, and then the circuit board 1 is pressed and connected to the sealing component 3, and the first sound pickup hole 11 corresponds to the first through hole 31. In this way, the sealing component 3 can be deformed by the extrusion between the circuit board 1 and the sound pickup channel 202 to improve the sealing effect.

[0073] It is understandable that, during assembly, the sealing component 3 may also be first connected to the circuit board 1 and then connected to the sound pickup channel 202. In this embodiment, the assembly order of the sealing component 3 is not limited.

[0074] Exemplarily, the sealing component 3 may be a foam sealing ring. Alternatively, the sealing component 3 may also be an elastic rubber sleeve. Alternatively, the sealing component 3 may be a combination of a foam sealing ring and an elastic rubber sleeve. By utilizing the elastic deformation capability of the foam sealing ring and / or the elastic rubber sleeve, the connection position between the sound pickup channel 202 and the first sound pickup hole 11 is sealed. In this embodiment, the specific composition of the sealing component 3 is not limited.

[0075] The dustproof net 4 is arranged between the sealing component 3 and the first sound pickup hole 11, or between the sealing component 3 and the sound pickup channel 202. Since one end of the sound pickup channel 202 is connected to the environment where the electronic device is located, there will inevitably be some impurities such as dust and gravel in the environment. These impurities may enter the sound pickup channel 202, or even enter the first sound pickup hole 11, the second sound pickup hole 12 and the microphone 2, thereby blocking the transmission path of the sound signal and affecting the normal function of the microphone module 100. The provision of the dustproof net 4 can prevent impurities from entering the microphone module 100 through the sound pickup channel 202, thereby protecting the microphone module 100.

[0076] Optionally, the aperture D1 of the first sound pickup hole 11 is larger than the aperture D2 of the second sound pickup hole 12. Due to the setting of the dustproof net 4, the flow of the sound signal will be affected to a certain extent. By increasing the aperture D1 of the first sound pickup hole 11, the sound pickup area of ​​the first sound pickup hole 11 can be increased, thereby reducing the influence of the dustproof net 4, and facilitating the realization of the microphone 2 function.

[0077] When the microphone module 100 is disposed in an electronic device, the overall thickness of the microphone module 100 and the size of the sound pickup channel 202 in the z-axis direction jointly affect the size of the electronic device.

[0078] like Figure 3As shown, in the traditional structure, the overall thickness of the microphone assembly 013 in the electronic device is marked as H1, and H1 includes the sum of the dimensions of the microphone device 014, the main board 015, the sealing structure 016 and the sound transmission channel 017 along the z-axis direction.

[0079] like Figure 4 As shown, the overall thickness of the microphone module 100 provided in this embodiment in the electronic device is marked as H2, and H2 includes the sum of the dimensions of the sound pickup channel 202, the sealing component 3, the dustproof net 4, the circuit board 1 and the bridge channel 13 along the z-axis direction. Figure 4 The dimensions of the sealing assembly 3 and the dust screen 4 along the z-axis direction can be equal to Figure 3 The size of the sealing structure 016 along the z-axis direction. Then, the size difference between H2 and H1 mainly lies in the thickness of the microphone 2 and the bridge channel 13. H1 includes the thickness of the microphone device 014, while H2 does not include the thickness of the microphone 2, but includes the thickness of the bridge channel 13. However, as a structure for connecting the first sound pickup hole 11 and the second sound pickup hole 12, the bridge channel 13 only needs to form a channel cavity, and no other acoustic devices need to be additionally arranged inside. The size of the bridge channel 13 along the z-axis can be smaller than the size of the microphone 2 (or the microphone device 014) along the z-axis. At this time, the size of the bridge channel 13 along the z-axis can be much smaller than the effect of the size of the microphone 2 along the z-axis on H2, thereby reducing the space occupied in the z-axis direction in the electronic device, so as to realize the lightweight design of the electronic device.

[0080] See also Figure 5 In one implementation, the microphone module 100 may further include a sealing cover 5 .

[0081] For the convenience of description, the arrangement direction of the first sound pickup hole 11 and the second sound pickup hole 12 is defined as a first direction, and the first direction is perpendicular to the axial direction of the first sound pickup hole 11. Figure 5 In the figure, the axial direction of the first sound pickup hole 11 is the z-axis direction, and the first direction is the y-axis direction.

[0082] The sealing cover 5 is located on the side of the circuit board 1 facing away from the microphone 2, that is, along the z-axis direction, the sealing cover 5 and the microphone 2 are respectively located on the two sides of the circuit board 1. The sealing cover 5 is buckled on the circuit board 1, and the two ends of the sealing cover 5 cover the first sound pickup hole 11 and the second sound pickup hole 12 to achieve the sealing of the first sound pickup hole 11 and the second sound pickup hole 12.

[0083] Exemplarily, the two ends of the sealing cover 5 along the first direction are respectively a first end 51 and a second end 52. Along the direction of the y-axis, the first end 51 is located on the side of the first sound pickup hole 11 away from the second sound pickup hole 12 to cover the first sound pickup hole 11. Along the direction of the y-axis, the second end 52 is located on the side of the second sound pickup hole 12 away from the first sound pickup hole 11 to cover the second sound pickup hole 12 to achieve sealing of the first sound pickup hole 11 and the second sound pickup hole 12.

[0084] Furthermore, there is a cavity between the sealing cover 5 and the circuit board 1 , and the cavity is connected to the first sound pickup hole 11 and the second sound pickup hole 12 to form a bridge channel 13 to facilitate the transmission of sound signals.

[0085] like Figure 5 As shown, in one implementation, the sealing cover 5 has a first groove 53 opened toward the circuit board 1, so that the sealing cover 5 and the circuit board 1 can be used to seal the first groove 53, thereby forming a closed space. At the same time, the first groove 53 is connected to the first sound pickup hole 11 and the second sound pickup hole 12, so that the first groove 53 is used to form a cavity.

[0086] The opening of the first groove 53 toward the circuit board 1 can cover the first sound pickup hole 11 and the second sound pickup hole 12 to achieve communication between the first groove 53 and the first sound pickup hole 11 and the second sound pickup hole 12. The first sound pickup hole 11 and the second sound pickup hole 12 can pass through both sides of the circuit board 1 along the z-axis direction.

[0087] In other words, the cavity can be arranged on the sealing cover 5. In this way, not only the influence on the structure of the circuit board 1 is reduced, but also the first sound pickup hole 11 and the second sound pickup hole 12 can be connected, which is easy to realize.

[0088] Optionally, the first groove 53 may be formed by material removal or stamping, which is not limited in the present embodiment.

[0089] Exemplarily, the sealing cover 5 may include a cover body 54 and a flange structure 55, and the first groove 53 is provided on the cover body 54. The flange structure 55 is connected to the edge of the cover body 54, and the flange structure 55 is sealed and connected to the circuit board 1. The first end 51 and the second end 52 are respectively located at two ends of the flange structure 55 along the first direction. The cover body 54 can be used to form the side wall of the first groove 53, and the design of the flange structure 55 can increase the connection area between the sealing cover 5 and the circuit board 1. In this way, the connection strength and sealing performance between the sealing cover 5 and the circuit board 1 can be improved.

[0090] Optionally, the cover body 54 and the flange structure 55 may be integrally formed. The cover body 54 and the sealing cover 5 may be formed by stamping. Alternatively, the flange structure 55 may be formed by folding the edge of the cover body 54, which is not limited in this embodiment.

[0091] Alternatively, the cover body 54 and the flange structure 55 may also be formed separately, and the cover body 54 and the flange structure 55 may be connected to form the sealing cover 5 .

[0092] Optionally, the flange structure 55 can be connected to the circuit board 1 by welding, which can ensure the connection strength.

[0093] Alternatively, the flange structure 55 may also be connected to the circuit board 1 by gluing, which can facilitate the connection operation and reduce the impact on the circuit board 1 .

[0094] In some embodiments, the sealing cover 5 can be made of metal. That is, the cover body 54 and the flange structure 55 are both made of metal, which facilitates the molding and processing of the sealing cover 5. More importantly, while ensuring structural strength, the metal material can be made thinner than other materials, thereby reducing the size of the sealing cover 5 in the z-axis direction. In this way, the overall thickness of the microphone module 100 can be further reduced.

[0095] Figure 6 This is a schematic diagram of the cross-sectional structure of the second microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0096] See also Figure 6 Optionally, a second groove 14 is provided on the side of the circuit board 1 facing the sealing cover 5. The second groove 14 is connected to the first sound pickup hole 11 and the second sound pickup hole 12, that is, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate the side of the circuit board 1 facing the microphone 2 and the bottom surface of the second groove 14. The sealing cover 5 is located in the second groove 14, and the side of the sealing cover 5 facing the circuit board 1 is connected to the bottom surface of the second groove 14. By providing the second groove 14 on the circuit board 1, the sealing cover 5 can be embedded in the circuit board 1 to reduce the influence of the sealing cover 5 on the overall thickness, thereby further reducing the overall thickness.

[0097] For the sake of comparison, the sum of the dimensions of the circuit board 1, the sealing component 3, the dust screen 4 and the sound pickup channel 202 in the z-axis direction is marked as H. 21 The dimension of the sealing cover 5 with the first groove 53 along the z-axis is marked as H 221 .So, Figure 5 The total thickness of the microphone module 100 and the sound pickup channel 202 along the z-axis direction is H2=H 21 +H 221 .

[0098] Please combine Figure 5 and Figure 6 ,Will Figure 6 The depth of the second groove 14 is marked as H 23Then, when the circuit board 1 is provided with the second groove 14, H2 = H 21 +H 221 -H 23 It can be seen that the provision of the second groove 14 can further reduce the overall thickness of the microphone module 100 and the sound pickup channel 202 .

[0099] Exemplarily, the dimension of the second groove 14 along the first direction may be just equal to the dimension from the first end 51 to the second end 52 of the sealing cover 5. In this way, while accommodating the sealing cover 5, the impact on the circuit board 1 can be reduced.

[0100] Optionally, along the z-axis direction, the depth of the second groove 14 may be equal to the thickness of the flange structure 55, so that the flange structure 55 can be just embedded in the second groove 14. Alternatively, along the z-axis direction, the depth of the second groove 14 may be greater than or less than the thickness of the flange structure 55, and its specific depth may be adjusted according to the thickness of the circuit board 1 itself, which is not limited in this embodiment.

[0101] Figure 7 A schematic diagram of the cross-sectional structure of a third microphone module 100 and a sound pickup channel 202 provided in this embodiment.

[0102] like Figure 7 As shown, in another implementation, the sealing cover 5 has a first groove 53 opened toward the circuit board 1, and the circuit board 1 is provided with a third groove 15 on the side facing the sealing cover 5. In this way, the sealing cover 5 and the circuit board 1 can be used to seal the first groove 53 and the third groove 15, so as to form a closed space. The third groove 15 is connected with the first sound pickup hole 11 and the second sound pickup hole 12. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 pass through the side of the circuit board 1 facing the microphone 2 and the bottom surface of the third groove 15. The first groove 53 is connected with the third groove 15, and the sealing cover 5 covers the opening of the third groove 15. At this time, the first groove 53 and the third groove 15 together form a cavity to form a bridge channel 13.

[0103] When the volume of the cavity is constant, the first groove 53 and the third groove 15 are used to form a cavity together, so that the third groove 15 can share a part of the volume of the cavity. In this way, compared with the case where only the first groove 53 is used to form the cavity, the presence of the third groove 15 can reduce the volume of the first groove 53, thereby reducing the size of the sealing cover 5 along the z-axis direction, and further reducing the overall thickness of the microphone module 100 and the sound pickup channel 202.

[0104] Optionally, the opening of the first groove 53 toward the circuit board 1 can be exactly aligned with the opening of the third groove 15 toward the sealing cover 5. In this way, a step structure can be avoided between the first groove 53 and the third groove 15 to affect the transmission of the sound signal.

[0105] Please combine Figure 5 and Figure 7 ,Will Figure 7 The dimension of the sealing cover 5 with the first groove 53 along the z-axis is marked as H. 221’ .So, Figure 7 The total thickness of the microphone module 100 and the sound pickup channel 202 along the z-axis direction is H2=H 21 +H 221’ .

[0106] Figure 5 The volume of the cavity in is equal to the volume of the first groove 53, Figure 7 The volume of the cavity in is equal to the sum of the volume of the first groove 53 and the volume of the third groove 15. Figure 7 The volume of the cavity in Figure 5 When the cavity volume in Figure 7 The volume of the first groove 53 is less than Figure 5 The volume of the first groove 53 in the middle. Then, Figure 7 H 221’ Less than Figure 5 H 221 It can be seen that compared with Figure 5 The scheme in Figure 7 The overall thickness H2 of the microphone module 100 and the sound pickup channel 202 is further reduced.

[0107] In other words, if the overall thickness needs to be further reduced, a cavity can be formed by providing a groove structure on both the sealing cover 5 and the circuit board 1 , which can reduce the size of the sealing cover 5 along the z-axis direction, thereby facilitating a lightweight design.

[0108] It is worth noting that in Figure 5 On the basis of the solution, if the volume of the cavity needs to be increased, it can also be achieved by providing a third groove 15 to avoid increasing the size of the sealing cover 5 along the z-axis direction.

[0109] Figure 8 This is a schematic diagram of the cross-sectional structure of the fourth microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0110] like Figure 8As shown, optionally, a second groove 14 is provided on the side of the circuit board 1 facing the sealing cover 5. The second groove 14 is connected to the third groove 15, that is, the second groove 14 is connected to the first sound pickup hole 11 and the second sound pickup hole 12. And the third groove 15 is located at the groove bottom surface of the second groove 14, and the opening of the third groove 15 toward the sealing cover 5 is smaller than the opening of the second groove 14 toward the sealing cover 5. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 pass through the side of the circuit board 1 facing the microphone 2 and the groove bottom surface of the third groove 15. The sealing cover 5 is located in the second groove 14, and the side of the sealing cover 5 facing the circuit board 1 is connected to the groove bottom surface of the second groove 14. By providing the second groove 14 on the circuit board 1, the sealing cover 5 can be embedded in the circuit board 1 to reduce the influence of the sealing cover 5 on the overall thickness, thereby further reducing the overall thickness.

[0111] Please combine Figure 7 and Figure 8 ,Will Figure 8 The depth of the second groove 14 is marked as H 23 Then, when the circuit board 1 is provided with the second groove 14, H2 = H 21 +H 221’ -H 23 It can be seen that the provision of the second groove 14 can further reduce the overall thickness of the microphone module 100 and the sound pickup channel 202 .

[0112] like Figure 8 As shown, optionally, the dimension of the third groove 15 along the first direction can just cover both the first sound pickup hole 11 and the second sound pickup hole 12. In this way, the influence on the structure of the circuit board 1 can be reduced, and the strength of the circuit board 1 can be ensured.

[0113] Fig. 9 A schematic diagram of the cross-sectional structure of a fifth microphone module 100 and a sound pickup channel 202 provided in this embodiment.

[0114] like Fig. 9 As shown, in another implementation, a third groove 15 is provided on the side of the circuit board 1 facing the sealing cover 5, and the third groove 15 is connected with the first sound pickup hole 11 and the second sound pickup hole 12. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 penetrate the side of the circuit board 1 facing the microphone 2 and the bottom surface of the third groove 15. The sealing cover 5 covers the opening of the third groove 15, and at this time, the third groove 15 forms a cavity to form a bridge channel 13.

[0115] Optionally, the dimension of the third groove 15 along the first direction can just cover both the first sound pickup hole 11 and the second sound pickup hole 12. In this way, the influence on the structure of the circuit board 1 can be reduced, and the strength of the circuit board 1 can be ensured.

[0116] Optionally, when the first groove 53 is not provided on the sealing cover 5, the sealing cover 5 may be a cover plate structure. In other words, the sealing cover 5 may be a flat plate structure and cover the opening of the third groove 15, thereby closing the third groove 15 to form a cavity.

[0117] Please combine Figure 5 and Fig. 9 ,Will Fig. 9 The dimension of the sealing cover 5 without the first groove 53 along the z-axis is marked as H. 222 Since the sealing cover 5 without the first groove 53 only needs to cover the third groove 15, it does not need to reserve a thickness space for setting the first groove 53. Then, H 222 Smaller than H 221 .and Fig. 9 H2=H 21 +H 222 It can be seen that the overall thickness can be further reduced by providing the third groove 15 on the circuit board 1 .

[0118] Fig.10 A schematic diagram of the cross-sectional structure of the sixth microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0119] like Fig.10 As shown, optionally, a second groove 14 is provided on the side of the circuit board 1 facing the sealing cover 5. The second groove 14 is connected to the third groove 15, that is, the second groove 14 is connected to the first sound pickup hole 11 and the second sound pickup hole 12. And the third groove 15 is located at the groove bottom surface of the second groove 14, and the opening of the third groove 15 toward the sealing cover 5 is smaller than the opening of the second groove 14 toward the sealing cover 5. At this time, the first sound pickup hole 11 and the second sound pickup hole 12 pass through the side of the circuit board 1 facing the microphone 2 and the groove bottom surface of the third groove 15. The sealing cover 5 is located in the second groove 14, and the side of the sealing cover 5 facing the circuit board 1 is connected to the groove bottom surface of the second groove 14. By providing the second groove 14 on the circuit board 1, the sealing cover 5 can be embedded in the circuit board 1 to reduce the influence of the sealing cover 5 on the overall thickness, thereby further reducing the overall thickness.

[0120] Please combine Fig. 9 and Fig.10 ,Will Fig.10 The dimension of the sealing cover 5 without the first groove 53 along the z-axis is marked as H. 222 ,Will Fig.10 The depth of the second groove 14 is marked as H 23 Since the sealing cover 5 without the first groove 53 only needs to cover the third groove 15, it does not need to reserve a thickness space for setting the first groove 53. Then, H 222 Smaller than H 221 .and Fig. 9H2=H 21 +H 222 -H 23 It can be seen that the overall thickness can be further reduced by embedding the sealing cover 5 on the circuit board 1.

[0121] Optionally, the depth of the second groove 14 may be equal to the dimension of the sealing cover 5 along the z-axis direction, so that the sealing cover 5 can be flush with the circuit board 1, reducing the overall thickness while avoiding affecting other structures.

[0122] By the above Figures 5 to 10 It can be known that the cavity can be provided on the circuit board 1 , can also be provided on the sealing cover 5 , or can be provided on both the sealing cover 5 and the circuit board 1 .

[0123] When the cavity is disposed on the sealing cover 5 , the first sound pickup hole 11 and the second sound pickup hole 12 can be connected to each other while reducing the impact on the structure of the circuit board 1 .

[0124] When the cavity is disposed on the circuit board 1, the sealing cover 5 may be a plate structure. In this way, while the first sound pickup hole 11 and the second sound pickup hole 12 are connected, the structure of the sealing cover 5 can be further simplified, thereby further reducing the overall thickness of the microphone module 100 and the sound pickup channel 202. At the same time, the cavity is located on the circuit board 1, which can avoid the cavity occupying additional z-direction space, thereby further reducing the overall thickness.

[0125] When the cavity is provided on both the sealing cover 5 and the circuit board 1, the size of the cavity along the z-axis can be shared by both the sealing cover 5 and the circuit board 1. In this way, the impact on the structure of the circuit board 1 can be reduced, and the size of the sealing cover 5 along the z-axis can be reduced to a certain extent, so as to realize a lightweight design.

[0126] Fig.11 This is a simplified schematic diagram of the cross-sectional structure of the seventh microphone module 100 and the sound pickup channel 202 provided in this embodiment.

[0127] like Fig.11 As shown, in another implementation, the microphone module 100 may further include a pipe member 6. The pipe member 6 is located on the side of the circuit board 1 that is away from the microphone 2, that is, along the z-axis direction, the pipe member 6 and the microphone 2 are located on both sides of the circuit board 1. Both ends of the pipe member 6 are connected to the circuit board 1, and one end of the pipe member 6 is connected to the first sound pickup hole 11, and the other end of the pipe member 6 is connected to the second sound pickup hole 12. In this way, the inner cavity of the pipe member 6 can be used to form a bridge channel 13 to facilitate the transmission of sound signals.

[0128] It is understandable that when the bridge channel 13 is formed by the pipe member 6, the pipe member 6 can be a hose or a hard pipe. Its material can be plastic or metal. In this embodiment, the pipe member 6 is not limited.

[0129] It is worth noting that the bridge channel 13 is a channel that can connect the first sound pickup hole 11 and the second sound pickup hole 12, so as to transmit the sound signal in the sound pickup channel 202 to the microphone 2 located on the same side of the circuit board 1. The bridge channel 13 can be formed by the above-mentioned cavity structure, or can be formed by the pipe member 6, or can be formed by a hole structure provided in the body of the circuit board 1 to connect the first sound pickup hole 11 and the second sound pickup hole 12. In this embodiment, the specific formation method of the bridge channel 13 is not limited.

[0130] Fig.12 A partial cross-sectional view of an electronic device provided in this embodiment.

[0131] like Fig.12 As shown, this embodiment also provides an electronic device 200. The electronic device 200 includes a housing 201 and the above-mentioned microphone module 100. A sound pickup channel 202 is provided on the housing 201, the first sound pickup hole 11 is connected to the sound pickup channel 202, and the microphone 2 and the sound pickup channel 202 are located on the same side of the circuit board 1, and the bridge channel 13 is located on the side of the circuit board 1 facing away from the microphone 2. In this way, the thin and light design of the electronic device 200 can be realized by reducing the space occupied by the microphone module 100 in the z direction in the electronic device 200.

[0132] like Fig.12 As shown by the dotted arrow in FIG. 1 , when the microphone module 100 is working, the sound signal enters through the sound pickup channel 202 on the housing 201 , passes through the first sound pickup hole 11 into the bridge channel 13 , and then enters the second sound pickup hole 12 to reach the microphone 2 , thereby receiving the sound signal.

[0133] It is understandable that the microphone module 100 can be disposed on the top, bottom or back of the electronic device 200. In this embodiment, the location of the microphone module 100 in the electronic device 200 is not limited.

[0134] Optionally, a receiving groove for receiving the microphone 2 may be provided on the shell 201 corresponding to the microphone 2 to limit and protect the microphone 2 and prevent the microphone 2 from being subjected to external vibrations and causing connection failure, dislocation, etc., thereby affecting the function of the microphone 2.

[0135] It is worth noting that the housing 201 of the electronic device 200 may be a middle frame, or may be a whole including the middle frame and the back cover. In addition, the display screen of the electronic device 200 may be arranged on the side of the circuit board 1 facing the microphone 2, or may be arranged on the side of the circuit board 1 facing away from the microphone 2. The layout may be made according to actual conditions, and this embodiment does not limit this.

[0136] It should be noted that those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application. The specification and examples are only regarded as exemplary, and the true scope of the present application is indicated by the claims.

[0137] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A microphone module, characterized in that: include: A circuit board (1), the circuit board (1) comprising a first sound pickup hole (11), a second sound pickup hole (12) and a bridge channel (13); wherein the first sound pickup hole (11) and the second sound pickup hole (12) are arranged at intervals, and the bridge channel (13) is connected to the first sound pickup hole (11) and the second sound pickup hole (12); the first sound pickup hole (11) is used to be connected to a sound pickup channel (202) of an electronic device; A microphone (2), the microphone (2) being arranged on the circuit board (1) and connected to the second sound pickup hole (12); The microphone (2) and the sound pickup channel (202) are located on the same side of the circuit board (1); A sealing component (3), the sealing component (3) being arranged between the first sound pickup hole (11) and the sound pickup channel (202), the sealing component (3) being provided with a first through hole (31), the first through hole (31) being connected to the first sound pickup hole (11) and the sound pickup channel (202).

2. The microphone module according to claim 1, characterized in that: Also includes: A sealing cover (5), the sealing cover (5) being located on a side of the circuit board (1) facing away from the microphone (2) and being buckled onto the circuit board (1); Along the arrangement direction of the first sound pickup holes (11) and the second sound pickup holes (12), two ends of the sealing cover (5) cover the first sound pickup holes (11) and the second sound pickup holes (12); A cavity is provided between the sealing cover (5) and the circuit board (1), and the cavity is connected to the first sound pickup hole (11) and the second sound pickup hole (12) to form the bridge channel (13).

3. The microphone module according to claim 2, characterized in that: The sealing cover (5) has a first groove (53) opened toward the circuit board (1); the first sound pickup hole (11) and the second sound pickup hole (12) are connected to the first groove (53); and the first groove (53) forms the cavity.

4. The microphone module according to claim 3, characterized in that: A second groove (14) is provided on a side of the circuit board (1) facing the sealing cover (5); The second groove (14) is in communication with the first sound pickup hole (11) and the second sound pickup hole (12); The sealing cover (5) is located in the second groove (14).

5. The microphone module according to claim 2, characterized in that: A third groove (15) is provided on a side of the circuit board (1) facing the sealing cover (5); The third groove (15) is in communication with the first sound pickup hole (11) and the second sound pickup hole (12); The sealing cover (5) covers the opening of the third groove (15); The third groove (15) forms the cavity.

6. The microphone module according to claim 2, characterized in that: The sealing cover (5) has a first groove (53) opened toward the circuit board (1); A third groove (15) is provided on one side of the circuit board (1) facing the sealing cover (5), the third groove (15) being in communication with the first sound pickup hole (11) and the second sound pickup hole (12), and the third groove (15) being in communication with the first groove (53); The sealing cover (5) covers the opening of the third groove (15); The first groove (53) and the third groove (15) together form the cavity.

7. The microphone module according to claim 5 or 6, characterized in that: A second groove (14) is provided on a side of the circuit board (1) facing the sealing cover (5); The second groove (14) is communicated with the third groove (15), and the third groove (15) is located on the groove bottom surface of the second groove (14); The sealing cover (5) is located in the second groove (14).

8. The microphone module according to claim 3, characterized in that: The sealing cover (5) comprises a cover body (54) and a flange structure (55). The first groove (53) is arranged on the cover body (54); The flange structure (55) is connected to the edge of the cover body (54), and the flange structure (55) is sealedly connected to the circuit board (1).

9. The microphone module according to claim 2, characterized in that: The sealing cover (5) is made of metal.

10. The microphone module according to any one of claims 1-6, 8-9, characterized in that: The microphone module also includes: The dustproof net (4) is arranged between the sealing component (3) and the first sound pickup hole (11), or between the sealing component (3) and the sound pickup channel (202).

11. The microphone module according to claim 10, characterized in that: The aperture of the first sound pickup hole (11) is larger than the aperture of the second sound pickup hole (12).

12. An electronic device, characterized in that: It comprises a housing (201) and a microphone module as claimed in any one of claims 1 to 11; The housing (201) is provided with the sound pickup channel (202); The first sound pickup hole (11) is connected to the sound pickup channel (202); The microphone (2) and the sound pickup channel (202) are located on the same side of the circuit board (1).

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