Ball motor tilt processing method, device and ball motor

Abstract

The embodiment of the present application provides a tilt processing method, device and ball motor for a ball motor, the method comprising: obtaining a tilt angle curve according to a plurality of calibrated DAC values. According to the tilt angle curve, determining the compensation DAC value corresponding to each calibrated DAC value for the second moving part. According to the compensation DAC value corresponding to each calibrated DAC value, performing compensation processing on each calibrated DAC value to obtain a target DAC value corresponding to each calibrated DAC value. According to the target DAC value corresponding to each calibrated DAC value, generating a correction mapping relationship, the correction mapping relationship is used to reflect the correspondence between the DAC value of the first driver chip and the DAC value of the second driver chip. The technical solution of the present application can effectively realize the tilt correction during the movement of the carrier.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a tilt processing method and device for a ball motor and a ball motor. Background Art

[0002] As users' demand for taking photos of terminal devices continues to increase, the number of camera modules of terminal devices is also increasing. The camera module may include a lens and a voice coil motor, wherein the voice coil motor can drive the lens to move so as to achieve automatic focusing of the lens.

[0003] At present, there is a ball-type voice coil motor, also known as a ball motor, in which the ball motor uses balls to guide the carrier carrying the lens to move along the motor axis, and can be applied to large-sized camera modules. However, for a planar ball motor, the balls in the ball motor have no physical track to limit their position, so during the movement of the carrier in the ball motor, the carrier may tilt in a non-preset direction, thereby affecting the final imaging quality of the camera module. Summary of the invention

[0004] The embodiments of the present application provide a method and device for processing the tilt of a ball motor, and a ball motor, which are applied in the field of terminal technology.

[0005] In the first aspect, the embodiment of the present application proposes a method for processing the tilt of a ball bearing motor. The ball bearing motor includes a carrier for carrying a lens, the carrier includes a first moving part and a second moving part, the first moving part is equipped with at least one first coil and a first driving chip for supplying power to the first coil, and the second moving part is equipped with at least one second coil and a second driving chip for supplying power to the second coil; the method includes:

[0006] According to a plurality of calibration DAC values, a tilt angle curve is obtained, wherein the tilt angle curve is used to indicate the tilt angle corresponding to each of the calibration DAC values, wherein the tilt angle is the tilt angle between the first moving component after moving in response to the calibration DAC value and the second moving component after moving in response to the calibration DAC value;

[0007] According to the tilt angle curve, determining, for the second moving component, compensation DAC values ​​corresponding to the respective calibration DAC values;

[0008] According to the compensation DAC values ​​corresponding to the calibration DAC values, the calibration DAC values ​​are compensated to obtain the target DAC values ​​corresponding to the calibration DAC values;

[0009] A correction mapping relationship is generated according to the target DAC values ​​corresponding to the calibrated DAC values, where the correction mapping relationship is used to reflect the corresponding relationship between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0010] In this implementation, the first moving part and the second moving part are driven to move by the same calibration DAC value, and then the compensation DAC value corresponding to the calibration DAC value is determined for the second moving part according to the difference in moving distances between the first moving part and the second moving part, and then the calibration DAC value is compensated according to the compensation DAC value to determine the target DAC value corresponding to the calibration DAC value, and then a correction mapping relationship is generated according to the target DAC values ​​corresponding to each calibration DAC value, thereby indicating that during the actual movement of the first moving part and the second moving part, the DAC value of the first driver chip and the DAC value of the second driver chip are determined according to the correction mapping relationship, so that the tilt correction of the carrier during movement can be effectively achieved.

[0011] In some implementations, obtaining a tilt angle curve according to a plurality of calibrated DAC values ​​includes:

[0012] For any of the calibration DAC values, controlling the first moving component and the second moving component to move a distance corresponding to the calibration DAC value according to the calibration DAC value;

[0013] acquiring a tilt angle between a first moving component moved in response to the calibration DAC value and the first moving component moved in response to the calibration DAC value;

[0014] The tilt angle curve is generated according to the tilt angles corresponding to the respective calibrated DAC values.

[0015] In some implementations, controlling the first moving component and the second moving component to move a distance corresponding to the calibration DAC value according to the calibration DAC value includes:

[0016] According to the calibrated DAC value, generating a power supply instruction corresponding to the calibrated DAC value;

[0017] Inputting a power supply instruction corresponding to the calibrated DAC value into the first driving chip, wherein the power supply instruction is used to instruct the first driving chip to supply power to the first coil according to the calibrated DAC value, so as to control the first moving component to move a first distance corresponding to the calibrated DAC value;

[0018] A power supply instruction corresponding to the calibrated DAC value is input to the second driving chip, wherein the power supply instruction is used to instruct the second driving chip to supply power to the second coil according to the calibrated DAC value to control the second moving component to move a second distance corresponding to the calibrated DAC value.

[0019] In this implementation, by generating a power supply instruction corresponding to the calibration DAC value, and then inputting the power supply instruction to the first driver chip and the second driver chip respectively, the first movable component can be driven to move a first distance corresponding to the calibration DAC value, and the second movable component can be driven to move a second distance corresponding to the calibration DAC value, and then the tilt angle is determined for the moved first movable component and the moved second movable component, so that the tilt angle corresponding to each calibration DAC value can be accurately and effectively determined.

[0020] In some implementations, determining, for the second moving component, the compensation DAC values ​​corresponding to the respective calibration DAC values ​​according to the tilt angle curve includes:

[0021] Acquire a specific distance between a center point of an initial position of the first moving component and a center point of an initial position of the second moving component;

[0022] For any of the calibrated DAC values, determining a moving distance difference between the first moving component after moving and the second moving component after moving according to the specific distance and the inclination angle corresponding to the calibrated DAC value in the inclination angle curve;

[0023] According to the moving distance difference, a compensation DAC value corresponding to the calibration DAC value is determined for the second moving component.

[0024] In some implementations, determining, for the second moving component, a compensation DAC value corresponding to the calibration DAC value according to the moving distance difference includes:

[0025] For the second driving chip, a unit moving distance is acquired, where the unit moving distance is the distance moved by the second moving component when the DAC value of the second driving chip increases by one step;

[0026] A compensation DAC value corresponding to the calibration DAC value is determined according to the unit movement distance and the movement distance difference.

[0027] In this implementation, when determining the compensation DAC value, corresponding mathematical processing can be performed based on the specific distance between the center points of the first moving component and the second moving component in the initial state and the tilt angle corresponding to the calibration DAC value, so that the moving distance difference between the first moving component after moving and the second moving component after moving can be simply, effectively and accurately obtained. Then, based on the moving distance difference and the unit moving distance, the compensation DAC value corresponding to each calibration DAC value can be quickly and efficiently determined.

[0028] In some implementations, the method further includes:

[0029] Performing Hall calibration on a first Hall element in the first driving chip to determine a first Hall mapping relationship corresponding to the first Hall element, where the first Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the first Hall element and a moving distance of the first moving component;

[0030] A Hall calibration is performed on the second Hall element in the second driving chip to determine a second Hall mapping relationship corresponding to the second Hall element, where the second Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the second Hall element and a moving distance of the second moving component.

[0031] In some implementations, the calibrated DAC value of the first driver chip corresponds to a first voltage of the first Hall element, and the first distance is a moving distance corresponding to the first voltage in the first Hall mapping relationship;

[0032] The calibrated DAC value of the second driving chip corresponds to the second voltage of the second Hall element, and the second distance is a moving distance corresponding to the second voltage in the second Hall mapping relationship.

[0033] In this implementation, by performing Hall calibration on the first Hall element and the second Hall element respectively before the calibration process, the corresponding relationship between each calibration DAC value and the corresponding moving distance can be clarified.

[0034] In some implementations, the method further includes:

[0035] In response to an automatic focusing instruction, setting the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value;

[0036] Obtaining a target application DAC value corresponding to the first application DAC value in the correction mapping relationship;

[0037] The DAC value of the second driving chip is set to the target application DAC value to control the second moving component to move a distance corresponding to the target application DAC value.

[0038] In this implementation, the tilt correction of the carrier movement can be effectively achieved during the automatic focusing process of the ball motor.

[0039] In a second aspect, an embodiment of the present application provides a method for correcting the tilt of a ball motor. The method comprises:

[0040] In response to an automatic focusing instruction, setting the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value;

[0041] Obtaining a target application DAC value corresponding to the first application DAC value in a correction mapping relationship, wherein the correction mapping relationship is determined according to the method described in the first aspect;

[0042] The DAC value of the second driving chip is set to the target application DAC value to control the second moving component to move a distance corresponding to the target application DAC value.

[0043] In a third aspect, an embodiment of the present application provides a device for processing the tilt of a ball motor. The device includes:

[0044] A generating module, configured to obtain a tilt angle curve according to a plurality of calibration DAC values, wherein the tilt angle curve is used to indicate the tilt angle corresponding to each of the calibration DAC values, wherein the tilt angle is the tilt angle between the first moving component after moving in response to the calibration DAC value and the second moving component after moving in response to the calibration DAC value;

[0045] a determination module, configured to determine, for the second moving component, a compensation DAC value corresponding to each of the calibration DAC values ​​according to the tilt angle curve;

[0046] A processing module, configured to perform compensation processing on each of the calibration DAC values ​​according to the compensation DAC values ​​corresponding to each of the calibration DAC values, so as to obtain a target DAC value corresponding to each of the calibration DAC values;

[0047] The generating module is further used to generate a correction mapping relationship according to the target DAC values ​​corresponding to the calibrated DAC values, wherein the correction mapping relationship is used to reflect the corresponding relationship between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0048] In some implementations, the generating module is specifically used to:

[0049] For any of the calibration DAC values, controlling the first moving component and the second moving component to move a distance corresponding to the calibration DAC value according to the calibration DAC value;

[0050] acquiring a tilt angle between a first moving component moved in response to the calibration DAC value and the first moving component moved in response to the calibration DAC value;

[0051] The tilt angle curve is generated according to the tilt angles corresponding to the respective calibrated DAC values.

[0052] In some implementations, the generating module is specifically used to:

[0053] According to the calibrated DAC value, generating a power supply instruction corresponding to the calibrated DAC value;

[0054] Inputting a power supply instruction corresponding to the calibrated DAC value into the first driving chip, wherein the power supply instruction is used to instruct the first driving chip to supply power to the first coil according to the calibrated DAC value, so as to control the first moving component to move a first distance corresponding to the calibrated DAC value;

[0055] A power supply instruction corresponding to the calibrated DAC value is input to the second driving chip, wherein the power supply instruction is used to instruct the second driving chip to supply power to the second coil according to the calibrated DAC value to control the second moving component to move a second distance corresponding to the calibrated DAC value.

[0056] In some implementations, the determining module is specifically configured to:

[0057] Acquire a specific distance between a center point of an initial position of the first moving component and a center point of an initial position of the second moving component;

[0058] For any of the calibrated DAC values, determining a moving distance difference between the first moving component after moving and the second moving component after moving according to the specific distance and the inclination angle corresponding to the calibrated DAC value in the inclination angle curve;

[0059] According to the moving distance difference, a compensation DAC value corresponding to the calibration DAC value is determined for the second moving component.

[0060] In some implementations, the determining module is specifically configured to:

[0061] For the second driving chip, a unit moving distance is acquired, where the unit moving distance is the distance moved by the second moving component when the DAC value of the second driving chip increases by one step;

[0062] A compensation DAC value corresponding to the calibration DAC value is determined according to the unit movement distance and the movement distance difference.

[0063] In some implementations, the processing module is further configured to:

[0064] Performing Hall calibration on a first Hall element in the first driving chip to determine a first Hall mapping relationship corresponding to the first Hall element, where the first Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the first Hall element and a moving distance of the first moving component;

[0065] A Hall calibration is performed on the second Hall element in the second driving chip to determine a second Hall mapping relationship corresponding to the second Hall element, where the second Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the second Hall element and a moving distance of the second moving component.

[0066] In some implementations, the calibrated DAC value of the first driver chip corresponds to a first voltage of the first Hall element, and the first distance is a moving distance corresponding to the first voltage in the first Hall mapping relationship;

[0067] The calibrated DAC value of the second driving chip corresponds to the second voltage of the second Hall element, and the second distance is a moving distance corresponding to the second voltage in the second Hall mapping relationship.

[0068] In some implementations, the processing module is further configured to:

[0069] In response to an automatic focusing instruction, setting the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value;

[0070] Obtaining a target application DAC value corresponding to the first application DAC value in the correction mapping relationship;

[0071] The DAC value of the second driving chip is set to the target application DAC value to control the second moving component to move a distance corresponding to the target application DAC value.

[0072] In a fourth aspect, an embodiment of the present application provides a device for correcting the tilt of a ball motor. The device comprises:

[0073] a processing module, configured to, in response to an automatic focusing instruction, set the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value;

[0074] An acquisition module, configured to acquire a target application DAC value corresponding to the first application DAC value in a correction mapping relationship, wherein the correction mapping relationship is determined according to the method described in the first aspect;

[0075] The processing module is further configured to set the DAC value of the second driving chip to the target application DAC value, so as to control the second moving component to move a distance corresponding to the target application DAC value.

[0076] In a fifth aspect, an embodiment of the present application provides a ball motor, comprising: a carrier for carrying a lens, the carrier comprising a first moving part and a second moving part, at least one first coil and a first driving chip for supplying power to the first coil being installed on the first moving part, and at least one second coil and a second driving chip for supplying power to the second coil being installed on the second moving part.

[0077] In some implementations, the first coil is used to control the movement of the first moving part after being powered on; the second coil is used to control the movement of the second moving part after being powered on;

[0078] The first moving component and the second moving component move together as a whole to control the movement of the carrier in the first direction.

[0079] In some implementations, the first moving component and the second moving component are integrally formed; or, the first moving component and the second moving component are connected in a preset manner.

[0080] In some implementations, the carrier includes a through hole for placing the lens, and the through hole is located between the first moving component and the second moving component;

[0081] The ball motor further includes a base, and the first moving component and the second moving component are symmetrically arranged above the base.

[0082] In a sixth aspect, an embodiment of the present application provides an electronic device, including: a processor and a memory;

[0083] The memory stores computer-executable instructions;

[0084] The processor executes the computer-executable instructions stored in the memory, so that the terminal device executes the methods described in the first and second aspects above.

[0085] In a seventh aspect, an embodiment of the present application provides a terminal device, which may also be referred to as a terminal, user equipment (UE), mobile station (MS), mobile terminal (MT), etc. The terminal device may be a mobile phone, a smart TV, a wearable device, a tablet computer (Pad), a computer with wireless transceiver function, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical surgery, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, etc.

[0086] The terminal device includes: a processor and a memory; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory, so that the terminal device executes the method of the first aspect or the second aspect.

[0087] The terminal device in the present application may include the ball motor described in the fifth aspect above.

[0088] In an eighth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the method of the first aspect and the second aspect is implemented.

[0089] In a ninth aspect, an embodiment of the present application provides a computer program product, which includes a computer program. When the computer program is run, the computer executes the methods of the first and second aspects.

[0090] In a tenth aspect, an embodiment of the present application provides a chip, the chip including a processor, the processor being used to call a computer program in a memory to execute the method described in the first aspect and the second aspect.

[0091] It should be understood that the second to tenth aspects of the present application correspond to the technical solutions of the first aspect of the present application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation methods are similar and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0092] Figure 1 A schematic diagram of the carrier movement direction provided in an embodiment of the present application;

[0093] Figure 2 A schematic diagram of the tilt of the carrier movement provided in the embodiment of the present application;

[0094] Figure 3 Schematic diagram of the ball motor provided in the embodiment of the present application Figure 1 ;

[0095] Figure 4 Schematic diagram of the ball motor provided in the embodiment of the present application Figure 2 ;

[0096] Figure 5 Schematic diagram of the ball motor provided in the embodiment of the present application Figure 3 ;

[0097] Figure 6 A flow chart of a method for processing the tilt of a ball motor provided in an embodiment of the present application;

[0098] Figure 7 A schematic diagram of the tilt angle provided in the embodiment of the present application;

[0099] Figure 8 The process of the tilt processing method of the rolling motor provided in the embodiment of the present application Figure 2 ;

[0100] Fig. 9 A schematic diagram of an inclination angle curve provided in an embodiment of the present application;

[0101] Fig.10 A schematic diagram for implementing the determination of the compensation DAC value provided in an embodiment of the present application;

[0102] Fig.11 A schematic diagram of a compensation curve provided in an embodiment of the present application;

[0103] Fig.12 A flow chart of a method for correcting the tilt of a ball motor provided in an embodiment of the present application;

[0104] Fig.13 A schematic diagram of a correction mapping relationship provided in an embodiment of the present application;

[0105] Fig.14 A schematic diagram of the structure of a tilt processing device for a ball motor provided in an embodiment of the present application;

[0106] Fig.15 A schematic diagram of the structure of a tilt correction device for a ball motor provided in an embodiment of the present application;

[0107] Fig.16A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0108] In order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0109] In the embodiments of the present application, "at least one" refers to one or more, and "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0110] It should be noted that the "at..." in the embodiment of the present application can be the instant when a certain situation occurs, or a period of time after a certain situation occurs, and the embodiment of the present application does not specifically limit this. In addition, the display interface provided in the embodiment of the present application is only an example, and the display interface can also include more or less content.

[0111] In order to better understand the technical solution of the present application, the relevant technologies involved in the present application are further introduced in detail below.

[0112] As users' demand for taking photos on terminal devices continues to increase, the number of camera modules in terminal devices is also increasing. A camera module may include an image sensor, a lens, and a voice coil motor, where a voice coil motor may also be called a voice coil motor (VCM). The main principle of a voice coil motor is to use a permanent magnetic field to control the position of a spring or a mover by changing the size of the coil current in the motor, thereby driving the lens to move and achieve automatic focus of the lens.

[0113] In terms of structure, voice coil motors are mainly divided into shrapnel type, ball type and friction type. The ball type voice coil motor is also called a ball motor. The ball motor uses balls to guide the carrier that carries the lens to move along the axis of the motor and can be used in large-size camera modules.

[0114] The working principle of the ball motor is first explained below. Generally, the ball motor includes a carrier, a coil, a driving chip, a magnet, a ball, and a plane that carries the ball. Among them, the carrier is used to carry the lens, and the driving chip is used to input the driving current to the coil. This ball motor with the ball placed on a plane can also be called a planar ball motor.

[0115] When a user uses a terminal device to take a photo, the camera module turns on the auto focus (AF) function. Specifically, the driver chip of the camera module responds to the auto focus instruction and inputs a driving current to the coil inside the ball motor. Then, the coil generates a magnetic induction force through electromagnetic induction. The direction of the magnetic induction force is related to the direction of the driving current.

[0116] For example, when the driving chip inputs a driving current in a first direction to the coil, the direction of the magnetic induction force is opposite to the direction of the magnetic attraction and reset force of the magnet inside the ball motor. The magnetic induction force overcomes the magnetic attraction and reset force of the magnet and the friction between the ball and the plane inside the ball motor, thereby driving the carrier to move in a specific direction, and the movement of the carrier drives the lens to move.

[0117] When the driving chip inputs a driving current in a second direction to the coil, the second direction is opposite to the first direction, and the direction of the magnetic induction force is the same as the direction of the magnetic attraction reset force of the magnet. The magnetic induction force and the magnetic attraction reset force of the magnet together overcome the friction between the ball and the plane, thereby driving the carrier to move in a direction opposite to the above-mentioned specific direction. The movement of the carrier drives the lens to move, thereby achieving automatic focus.

[0118] Among them, the role of the ball is that on the one hand, the rolling method of the ball can reduce the friction between the carrier and the base, making it easier for the carrier to move; on the other hand, the rolling direction of the ball will also affect the moving direction of the carrier.

[0119] Based on the above introduction, it can be determined that the ball motor can affect the magnetic field by changing the coil current. Under the action of the magnetic field force, the carrier is driven to move in a specific direction. The specific movement direction of the carrier depends on the setting of the coil and the magnet. Specifically, the setting of the coil and the magnet will affect the direction of the magnetic field force, which can determine the movement direction of the carrier.

[0120] Assuming that for a planar ball motor with two-axis motion (taking Z-axis motion and X-axis motion as an example), two sets of coils and magnets can be set respectively, one set of coils and magnets is used to drive the carrier to move in the Z-axis direction, and the other set of coils and magnets is used to drive the carrier to move in the X-axis direction.

[0121] In the actual implementation process, for the two-axis motion planar ball motor, the two coordinate axis directions in which the two axes move can be selected and set according to actual needs. For example, it can be the Z-axis motion and X-axis motion described above, or it can also be the Z-axis motion and Y-axis motion described above, or it can also be the X-axis motion and Y-axis motion, and this embodiment does not limit this. And the X-axis, Y-axis, and Z-axis currently introduced can be understood as the three coordinate axes in the world coordinate system.

[0122] For example, if the two-axis motion is Z-axis motion and X-axis motion, refer to Figure 1 To understand, Figure 1 A schematic diagram of the carrier movement direction provided in an embodiment of the present application.

[0123] exist Figure 1 The figure shows a top view of the carrier 101, that is, the lens is Figure 1 The form shown is carried in a carrier, so that it moves along the Z-axis direction or along the X-axis direction driven by the carrier to realize the operation of a two-axis motion planar ball motor.

[0124] At the same time, Figure 1 The position of the balls in the ball motor is schematically given (taking 4 balls as an example), assuming that the 4 balls are distributed at the four corners corresponding to the carrier, and the balls are located under the carrier to assist the carrier in moving.

[0125] In the present application, a rolling plane is provided for the ball, and the ball can move in any direction within the rolling plane. Take the ball 102 in the upper left corner as an example, where the ball 102 moves in any direction within the rolling plane 103, and the specific moving direction depends on the specific magnetic field force direction.

[0126] However, the direction of the magnetic field line is usually not a straight line, but a curved state. At the same time, the ball in the ball motor in this application moves on a plane, and there is no physical track to limit the ball. This may cause the carrier to move under the action of the magnetic field force. Figure 1 The carrier may move in the direction indicated by the arrow A in FIG. That is, the carrier may move obliquely on the plane formed by the Z axis and the X axis.

[0127] Among them, the movement of the carrier is tilted, which will cause the lens to tilt accordingly, which will affect the final imaging quality of the camera module, thereby causing problems such as blurred corners of the image or poor lens focus.

[0128] In response to the technical problems introduced above, the present application proposes the following technical concept: by respectively setting a first coil and a second coil on both sides of the carrier, wherein the first coil and the second coil are powered independently, different currents can be set for the coils on both sides of the carrier, thereby applying different forces to the two sides of the carrier, thereby correcting the tilt that occurs during the movement of the carrier.

[0129] For example, you can refer to Figure 2 Understand the principles of the technical concept of this application, Figure 2 A tilted schematic diagram of the movement of a carrier provided in an embodiment of the present application.

[0130] like Figure 2 As shown, assuming that a first coil and a second coil are respectively arranged on both sides of the carrier, the carrier may move Figure 2 If the tilt is shown by the arrow A in FIG, the current of the first coil and the second coil can be controlled respectively, so that the magnetic field force corresponding to the side where the first coil is installed is smaller than the magnetic field force corresponding to the side where the second coil is installed, thereby correcting the tilt shown by the arrow A and ensuring that the carrier moves along the Z-axis direction as much as possible.

[0131] Combine the following Figure 3 The ball motor provided in this application is described. Figure 3 Schematic diagram of the ball motor provided in the embodiment of the present application Figure 1 .

[0132] like Figure 3 As shown, the ball motor includes a carrier for carrying the lens, and a through hole for placing the lens in the carrier. In the actual implementation process, the lens is located in the through hole in the carrier and moves along with the carrier.

[0133] Furthermore, the carrier in this embodiment includes a first movable part and a second movable part, at least one first coil and a first driving chip are installed on the first movable part, and at least one second coil and a second driving chip are installed on the second movable part, so that the first coil and the second coil are powered independently.

[0134] Specifically, the first driving chip is used to supply power to the first coil to control the movement of the first moving part; the second driving chip is used to supply power to the second coil to control the movement of the second moving part.

[0135] However, it should be noted that, although the first coil and the second coil can be powered independently to control the movement of the first movable part and the second movable part respectively, in this embodiment, the first movable part and the second movable part move together as a whole to control the movement of the carrier in the first direction. It can also be understood that the first coil and the second coil are coils that drive the carrier to move in the first direction, wherein the first direction can be any one of the Z-axis direction, X-axis direction, and Y-axis direction described above.

[0136] Among them, the first movable part and the second movable part can be integrally formed to jointly constitute a carrier; or, the first movable part and the second movable part can also be connected in a preset manner, wherein the preset manner can be, for example, welding, riveting, etc., so that the first movable part and the second movable part move together as a whole, which can also be understood as the carrier moving as a whole when moving.

[0137] Reference Figure 3 It can also be determined that the through hole in the carrier is located between the first moving part and the second moving part, wherein the ball motor also includes a base, and the first moving part and the second moving part are symmetrically arranged above the base. Exemplarily, the structures of the first moving part and the second moving part can be the same, but they are symmetrically placed above the base.

[0138] Exemplarily, the first movable part and the second movable part can be actually divided with respect to the carrier, wherein the first movable part and the second movable part together constitute the carrier. Alternatively, the first movable part and the second movable part can also be understood as virtual concepts written to describe the installation method of the coil and the movement method of the carrier, that is, in the actual implementation process, it is not necessary to specifically divide the first movable part and the second movable part in the carrier, as long as the first coil and the first driving chip described above, as well as the second coil and the second driving chip are installed on both sides of the carrier in the manner described in this embodiment. The two sides of the carrier can also be understood as the two sides obtained by dividing the carrier by the first dividing plane, wherein the first dividing plane is perpendicular to the base of the ball motor, and the first dividing plane passes through the central axis of the through hole in the carrier.

[0139] The first movable part and the second movable part in this embodiment can also be understood as dividing the carrier by the first dividing plane, the part of the carrier on one side of the first dividing plane serves as the first movable part, and the part of the carrier on the other side of the first dividing plane serves as the second movable part.

[0140] In order to better understand the way the lens is carried in the carrier, the following Figure 4 The ball motor provided in this application is further introduced. Figure 4 Schematic diagram of the ball motor provided in the embodiment of the present application Figure 2 .

[0141] like Figure 4 As shown, the ball motor includes a first moving part and a second moving part, which can be understood as Figure 4 The dashed line shown divides the carrier, so that the parts of the carrier located on both sides of the dashed line are respectively represented as a first moving part and a second moving part.

[0142] Figure 4 In the illustrated case, the first moving part and the second moving part are integrally formed. Based on the above introduction, it can be determined that in one implementation, the carrier is actually a complete whole, and the first moving part and the second moving part are just concepts introduced to illustrate this solution. Figure 4 The dotted line shown in FIG. 1 does not exist in the actual ball motor, and is drawn in the current embodiment to illustrate the first moving part and the second moving part.

[0143] Reference Figure 4 The first moving part is provided with a first coil and a first driving chip, and the second moving part is provided with a second coil and a second driving chip. The first moving part and the second moving part are symmetrically arranged above the base to form a carrier together, and the space between the first moving part and the second moving part forms a through hole of the carrier for placing the lens.

[0144] and in Figure 3 and Figure 4 The positions of the four balls are indicated in the figure, which are located at the four corners corresponding to the carrier and move on their corresponding planes.

[0145] Above Figure 3 and Figure 4 The diagrams are all implementations in which a first coil is installed at the middle position of the first moving part, and a second coil is installed at the middle position of the second moving part. In the actual implementation process, multiple first coils can be set on the first moving part, and multiple second coils can be set on the second moving part. The multiple first coils on the first moving part can be understood as being connected in series, and the first drive chip is used to supply power to the series connection of each first coil, and the multiple second coils on the second moving part can be understood as being connected in series, and the second drive chip is used to supply power to the series connection of each second coil, that is to say, as long as the power supply of the first coil and the second coil is independent.

[0146] For example, you can refer to Figure 5 Understand how to implement multiple coils on a moving part. Figure 5 Schematic diagram of the ball motor provided in the embodiment of the present application Figure 3 .

[0147] like Figure 5 As shown, first coils can be respectively arranged at both ends of the first moving part, wherein the two first coils on the first moving part are connected in series with the first driving chip, so that the first driving chip can uniformly supply power to the two first coils. Also, second coils can be respectively arranged at both ends of the second moving part, wherein the two second coils on the second moving part are connected in series with the second driving chip, so that the second driving chip can uniformly supply power to the two second coils. At the same time, the power supply of the first coil and the second coil is independent, so the differential control of the first moving part and the second moving part can be guaranteed.

[0148] It is understandable that when a larger number of coils are provided on the moving part, the plurality of coils can be distributed on the moving part, so as to better balance the force conditions of the moving control of the moving part, so as to achieve more stable and precise moving control.

[0149] Based on the contents of the above embodiments, the method provided by the present application is described in detail below. It should be noted that the present application provides a method for processing the tilt of a ball motor, which can calibrate the tilt of the ball motor before the terminal device is put into use, thereby determining the correction mapping relationship of the ball motor. And the present application also provides a method for correcting the tilt of a ball motor, in which the tilt of the ball motor can be corrected based on the correction mapping relationship.

[0150] Therefore, the implementation of these two sets of methods will be explained separately below. First, the tilt processing method of the ball motor will be explained. It can be understood that the calibration processing for the tilt of the ball motor is completed before the ball motor leaves the factory. Therefore, the executor of the tilt processing method of the ball motor can be a server, processor, chip and other processing equipment with data processing functions. It can be a processing equipment independent of the outside of the ball motor, or it can also be a processing equipment integrated inside the ball motor. This embodiment does not impose any special restrictions on this.

[0151] Combine the following Figure 6 and Figure 7 To explain, Figure 6 This is a flow chart of a method for processing the tilt of a ball motor provided in an embodiment of the present application. Figure 7 A schematic diagram of the tilt angle provided for an embodiment of the present application.

[0152] like Figure 6 As shown, the method includes:

[0153] S601. Obtain a tilt angle curve according to a plurality of calibrated DAC values, wherein the tilt angle curve is used to indicate the tilt angle corresponding to each calibrated DAC value, and the tilt angle is the tilt angle between a first moving component after moving in response to the calibrated DAC value and a second moving component after moving in response to the calibrated DAC value.

[0154] In this embodiment, a plurality of calibration DAC (Digital to Analog Convertor) values ​​may be set for the driver chip. Here, the DAC value is first briefly introduced.

[0155] The ball motor can generate different thrusts through different current values, thereby pushing the carrier to drive the lens to move different distances. In this embodiment, two driver chips are provided in the ball motor, so for any driver chip, different thrusts can be generated to the corresponding moving parts through different current values. In addition, because the circuit in the driver chip is a digital circuit, when configuring the current size of the driver chip, it can be indicated by the DAC value. Among them, the DAC value can indicate the current size of the driver chip, and there is a corresponding relationship between the current size and the moving distance of the moving part. Therefore, it can be understood that in this embodiment, there is a direct corresponding relationship between the DAC value and the moving distance of the moving part.

[0156] Assuming that the current range of the first driver chip is 0 to 10 mA, and assuming that 10 bits are used to express the DAC value, then the DAC value in the range of 0 to 1023 can be used to uniformly represent the current range of 0 to 10 mA. For example, when the DAC value is 0 code, it can be understood that the current of the first driver chip is 0 mA, and when the DAC value is 1023 code, it can be understood that the current of the first driver chip is 10 mA. And correspondingly, when the DAC value is 0 code, it indicates that the corresponding moving part does not move (it can be understood as being in the near focus position), and when the DAC value is 1023 code, it indicates that the corresponding moving part moves the farthest distance (it can be understood as being in the far focus position). Therefore, it can also be understood that the DAC value is used to indicate the motor push position, that is, how far the moving part is pushed forward.

[0157] In the actual implementation process, the current range of the driver chip and the number of bits of the DAC value used to express the current can be selected according to actual needs. For example, 12 bits can be used to express the DAC value, and then a DAC value ranging from 0 to 2047 is used to more finely and evenly express the current of 0 to 10 mA.

[0158] Exemplarily, among the multiple calibration DAC values ​​set for the driver chip, the difference between any two adjacent calibration DAC values ​​is the first step length.

[0159] For example, if the DAC value range is 0 to 1023, and the first step length is 1 code, then the multiple calibration DAC values ​​are 0 code, 1 code, 2 code, ..., 1023 code. For another example, if the first step length is 10 code, then the multiple calibration DAC values ​​are 0 code, 10 code, 20 code, ..., 1020 code, etc., where code can be understood as the expression unit corresponding to the DAC value.

[0160] In the actual implementation process, the specific selection of the first step length can be set according to actual needs. When multiple calibration DAC values ​​are determined according to the first step length, it can be understood that starting from 0code, each calibration DAC value is determined in sequence according to the first step length until a certain calibration DAC value plus the first step length is greater than 1023code, then the current calibration DAC value is the last calibration DAC value.

[0161] In the calibration process of this embodiment, the processing for each calibration DAC value is similar, so any calibration DAC value is taken as an example for description below.

[0162] Exemplarily, the first movable component can be controlled to move to a corresponding degree in response to the calibrated DAC value, and the second movable component can be controlled to move to a corresponding degree in response to the calibrated DAC value, and then the tilt angle between the moved first movable component and the moved second movable component is determined to obtain the tilt angle corresponding to the current calibrated DAC value.

[0163] In a possible implementation, the tilt angle between the first moving part after moving and the second moving part after moving can be determined by laser ranging. More specifically, the tilt angle is the angle between the line connecting the center point of the first moving part after moving and the center point of the second moving part after moving, and the straight line perpendicular to the first direction. In a possible implementation, when the connecting line and the straight line perpendicular to the first direction intersect to form two complementary angles, the acute angle therein can be understood as the tilt angle.

[0164] For example, you can refer to Figure 7 To understand the tilt angle, Figure 7As shown, it is assumed that the first moving part responds to the calibration DAC value and moves from the position indicated by 701 to the position indicated by 703 under the action of the magnetic field force corresponding to the calibration DAC value. And, it is assumed that the second moving part responds to the calibration DAC value and moves from the position indicated by 702 to the position indicated by 704 under the action of the magnetic field force corresponding to the calibration DAC value.

[0165] Reference Figure 7 , where P is the center point of the first moving part, Q is the center point of the second moving part, and the line connecting the center point P of the first moving part after moving and the center point Q of the second moving part after moving is Figure 7 Also, assuming that the first moving part and the second moving part move together to achieve the movement of the carrier in the first direction, wherein the first direction can be Figure 7 The Z-axis direction shown in FIG. 1 , then the straight line perpendicular to the first direction can be Figure 7 The angle between the line PQ connecting the center point P of the first moving part after moving and the center point Q of the second moving part after moving and the line L1 perpendicular to the first direction is Figure 7 The α shown, therefore Figure 7 The α in φ indicates the tilt angle between the first moving part after moving and the second moving part after moving.

[0166] Based on the above introduction, it can be determined that the current ideal state is that the carrier moves along the Z axis, but due to the influence of the magnetic field lines, the carrier may Figure 7 In order to correct the tilt shown by arrow A, the current strategy is to control the distance that the first moving part moves forward to be shorter than the distance that the second moving part moves forward, thereby correcting the tilt in the direction shown by arrow A.

[0167] Figure 7 What is illustrated is a situation where correction is not complete, that is, there is still a certain inclination angle between the first movable part and the second movable part. The purpose of the current correction is to make the inclination angle between the first movable part and the second movable part as small as possible, so that the first movable part after movement and the second movable part after movement are located on the same horizontal line perpendicular to the first direction as much as possible, so as to ensure the movement of the carrier in the first direction.

[0168] In this embodiment, a corresponding tilt angle is determined for each calibrated DAC value, so that a tilt angle curve can be obtained according to the tilt angles corresponding to multiple calibrated DAC values, wherein the tilt angle curve is used to indicate the tilt angles corresponding to each calibrated DAC value.

[0169] In the actual implementation process, when setting the first step length for the calibration DAC value, in order to ensure that the tilt angle is determined for each DAC value as much as possible, the first step length can be set smaller, that is, the calibration DAC value is set as detailed as possible.

[0170] S602 : Determine, for the second movable component, the compensation DAC values ​​corresponding to the respective calibration DAC values ​​according to the tilt angle curve.

[0171] After determining the tilt angle curve, since the tilt angle corresponding to each calibrated DAC value is determined, in order to correct the tilt occurring during the movement of the carrier, in this embodiment, the compensation DAC value corresponding to each calibrated DAC value can be determined for the second moving component according to the tilt angle curve, wherein the role of the compensation DAC value is to correct the tilt angle corresponding to the calibrated DAC value.

[0172] In this embodiment, the compensation DAC value needs to be determined for a certain moving component, so as to achieve tilt correction by compensating the DAC value of the moving component. For example, the second moving component can be operated to determine the compensation DAC value corresponding to each calibration DAC value.

[0173] The first movable component and the second movable component move based on the same calibrated DAC value, but due to the influence of the magnetic field, there is a certain difference in the moving distance of the first movable component and the second movable component in the first direction. In this way, the difference in the moving distance of the second movable component in the first direction is compensated by compensating the DAC value, thereby effectively correcting the tilt of the carrier.

[0174] S603 , performing compensation processing on each calibration DAC value according to the compensation DAC value corresponding to each calibration DAC value, so as to obtain a target DAC value corresponding to each calibration DAC value.

[0175] After determining the compensation DAC value corresponding to the calibration DAC value, in order to clarify the specific DAC value after compensation for the second movable component, the corresponding calibration DAC value can be compensated according to the compensation DAC value to obtain the compensated target DAC value corresponding to the calibration DAC value.

[0176] Exemplarily, the compensation processing can be carried out in the following manner: if the second moving part after moving in the first direction is closer to the front than the first moving part after moving, it means that the second moving part has moved forward a greater distance. In this case, the calibrated DAC value can be subtracted from the compensation DAC value to obtain the target DAC value, thereby compensating for the extra distance moved by the second moving compensation to correct the movement tilt.

[0177] If the second moving part after moving in the first direction is further back than the first moving part after moving, it means that the first moving part has moved forward a greater distance. In this case, the calibrated DAC value can be added to the compensation DAC value to obtain the target DAC value, thereby compensating for the distance that the second moving part has moved less to correct the movement tilt.

[0178] S604 , generating a correction mapping relationship according to the target DAC values ​​corresponding to the respective calibrated DAC values, where the correction mapping relationship is used to reflect the corresponding relationship between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0179] In this embodiment, for any calibrated DAC value, a corresponding target DAC value will be determined. Therefore, a correction mapping relationship can be generated according to the target DAC values ​​corresponding to each calibrated DAC value. The correction mapping relationship is used to reflect the correspondence between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0180] It should be understood that the target DAC value determined in this embodiment is determined for the second moving component, so the target DAC value corresponds to the DAC value of the second driver chip, and the calibration DAC value corresponds to the DAC value of the first driver chip.

[0181] Exemplarily, assuming that the DAC value ranges from 0 to 1023, if the first step length corresponding to multiple calibration DAC values ​​is 1code, it can be ensured that the corresponding target DAC value is determined for each DAC value in the range of 0 to 1023. In this case, the correction mapping relationship can be directly generated.

[0182] However, if the first step length corresponding to multiple calibration DAC values ​​is greater than 1code, it means that the corresponding target DAC values ​​are currently determined only for some DAC values ​​in the range of 0 to 1023. For example, if the first step length is 10code, it means that only DAC values ​​such as 0code, 10code, 20code, etc. have corresponding target DAC values, so the corresponding DAC values ​​such as 1code, 2code, etc. are actually not determined. In this case, for every two adjacent calibration DAC values, according to the target DAC values ​​corresponding to the two calibration DAC values, a linear mapping process can be performed on the multiple DAC values ​​contained between the two calibration DAC values, so as to determine the target DAC values ​​corresponding to each DAC value in the range of 0 to 1023. For example, for the two calibration DAC values ​​of 0code and 10code, the DAC values ​​of 1code, 2code, 3code, ..., 9code can be linearly mapped according to the target DAC value corresponding to 0code and the target DAC value corresponding to 10code, so as to determine the target DAC values ​​corresponding to each DAC value that has not been calibrated.

[0183] After the correction mapping relationship is generated, the movement of the first moving part and the second moving part can be processed according to the correction mapping relationship. For example, when the DAC value of the first driving chip is determined to be a certain specific value X, the correction mapping relationship can be read to determine the value Y corresponding to the specific value X in the correction mapping relationship, and then the value X is used as the DAC value of the first driving chip, and the value Y is used as the DAC value of the second driving chip, and then the first moving part and the second moving part are driven to move accordingly, so that the movement difference between the first moving part after movement and the second moving part after movement can be compensated, and the correction of the tilt angle is realized accordingly, so that the carrier can be effectively guaranteed to move along the first direction as much as possible.

[0184] The tilt processing method of the ball motor provided in the embodiment of the present application includes: obtaining a tilt angle curve according to a plurality of calibrated DAC values, the tilt angle curve being used to indicate the tilt angle corresponding to each calibrated DAC value, and the tilt angle being the tilt angle between the first moving part after moving in response to the calibrated DAC value and the second moving part after moving in response to the calibrated DAC value. According to the tilt angle curve, the compensation DAC value corresponding to each calibrated DAC value is determined for the second moving part. According to the compensation DAC value corresponding to each calibrated DAC value, each calibrated DAC value is compensated to obtain a target DAC value corresponding to each calibrated DAC value. According to the target DAC value corresponding to each calibrated DAC value, a correction mapping relationship is generated, and the correction mapping relationship is used to reflect the correspondence between the DAC value of the first driver chip and the DAC value of the second driver chip. The first moving part and the second moving part are driven to move by the same calibration DAC value, and then the compensation DAC value corresponding to the calibration DAC value is determined for the second moving part according to the difference in moving distances of the first moving part and the second moving part, and then the calibration DAC value is compensated according to the compensation DAC value to determine the target DAC value corresponding to the calibration DAC value, and then a correction mapping relationship is generated according to the target DAC values ​​corresponding to each calibration DAC value, so as to instruct the first moving part and the second moving part to determine the DAC value of the first driving chip and the DAC value of the second driving chip according to the correction mapping relationship during the actual movement, so as to effectively realize the tilt correction of the carrier during movement.

[0185] Based on the above introduction, the following Figure 8 to Figure 11 The tilt processing method of the rolling motor provided in the present application is further introduced in detail. Figure 8 The process of the tilt processing method of the rolling motor provided in the embodiment of the present application Figure 2 , Fig. 9 A schematic diagram of an inclination angle curve provided in an embodiment of the present application, Fig.10 A schematic diagram for implementing the determination of the compensation DAC value provided in an embodiment of the present application, Fig.11 A schematic diagram of a compensation curve provided in an embodiment of the present application.

[0186] like Figure 8 As shown, the method includes:

[0187] S801. For any calibrated DAC value, generate a power supply instruction corresponding to the calibrated DAC value according to the calibrated DAC value.

[0188] In this embodiment, the processing for each calibration DAC value is similar, so any calibration DAC value is taken as an example for description below.

[0189] For any calibrated DAC value, a power supply instruction corresponding to the calibrated DAC value may be generated, wherein the power supply instruction is used to instruct the driver chip to supply power to the corresponding coil according to the calibrated DAC value.

[0190] S802 , inputting a power supply instruction corresponding to the calibrated DAC value to the first driver chip, where the power supply instruction is used to instruct the first driver chip to supply power to the first coil according to the calibrated DAC value, so as to control the first moving component to move a first distance corresponding to the calibrated DAC value.

[0191] After generating the power supply instruction, the power supply instruction corresponding to the calibrated DAC value can be input to the first driver chip. For the first driver chip, the power supply instruction is used to instruct the first driver chip to supply power to the first coil according to the calibrated DAC value. After that, the first coil is energized to generate a corresponding magnetic field. Under the action of the magnetic field force, the first moving component is driven to move a first distance corresponding to the calibrated DAC value.

[0192] There is a certain correspondence between the calibration DAC value and the moving distance of the first moving part. For example, when the calibration DAC value is 1 code, the first moving part moves 3 microns under the action of the magnetic field force, and the moving direction of the first moving part depends on the setting of the magnet and the coil. In short, the first moving part will move under the action of the magnetic field force. The correspondence between the calibration DAC value and the moving distance of the first moving part may depend on the actual conditions of the coil, the magnet and the first moving part.

[0193] S803, inputting a power supply instruction corresponding to the calibrated DAC value to the second driving chip, the power supply instruction is used to instruct the second driving chip to supply power to the second coil according to the calibrated DAC value, so as to control the second moving component to move a second distance corresponding to the calibrated DAC value.

[0194] After generating the power supply instruction, the power supply instruction corresponding to the calibrated DAC value can also be input to the second driver chip. For the second driver chip, the power supply instruction is used to instruct the second driver chip to supply power to the second coil according to the calibrated DAC value. After that, the second coil is energized to generate a corresponding magnetic field. Under the action of the magnetic field force, the second moving component is driven to move a second distance corresponding to the calibrated DAC value.

[0195] There is also a certain correspondence between the calibration DAC value and the moving distance of the second moving part. For example, when the calibration DAC value is 1 code, the second moving part moves 4 microns under the action of the magnetic field force, and the moving direction of the second moving part depends on the setting of the magnet and the coil. In short, the second moving part will move under the action of the magnetic field force. The correspondence between the calibration DAC value and the moving distance of the second moving part may depend on the actual conditions of the coil, the magnet and the second moving part.

[0196] Because the first coil corresponding to the first moving part and the second coil corresponding to the second moving part are independent, the corresponding relationship between the calibration DAC value and the moving distance of the first moving part and the corresponding relationship between the calibration DAC value and the moving distance of the second moving part are also independent, which depends on the actual coil situation. Therefore, the first distance and the second distance introduced above are also independent of each other, and may be the same or different.

[0197] S804: Obtain a tilt angle between the first moving component after it moves in response to the calibrated DAC value and the first moving component after it moves in response to the calibrated DAC value.

[0198] After the second moving part moves in response to the power supply instruction corresponding to the calibrated DAC value, and after the first moving part moves in response to the power supply instruction corresponding to the calibrated DAC value, the tilt angle between the moved second moving part and the moved first moving part can be obtained.

[0199] The meaning of the tilt angle has been introduced in the above embodiment. When determining the tilt angle, for example, it can be measured by laser, or the tilt angle can be measured in any possible way, and this embodiment does not limit this.

[0200] S805 , obtaining a tilt angle curve according to the tilt angles corresponding to the calibrated DAC values.

[0201] After determining the tilt angles corresponding to the respective calibrated DAC values, the tilt angle curve can be obtained. Fig. 9 Understand the inclination angle curve, such as Fig. 9 As shown, the horizontal axis of the tilt angle curve is the DAC value, and the vertical axis is the tilt angle. The tilt angle curve is used to reflect the corresponding relationship between the DAC value and the tilt angle. Therefore, the tilt angle corresponding to any DAC value can be effectively determined according to the tilt angle curve.

[0202] S806: Obtain a specific distance between the center point of the initial position of the first movable component and the center point of the initial position of the second movable component.

[0203] After determining the tilt angle curve, it is necessary to determine the compensation DAC values ​​corresponding to each calibration DAC value for the second moving component. When determining the compensation DAC value, the processing logic is to determine how much more or less the current first moving component has moved in the first direction, and compensate these distance differences in the opposite direction.

[0204] Then, it is necessary to determine the difference in the moving distances of the first movable component and the second movable component in the first direction. In a possible implementation, when the first movable component and the second movable component are respectively in their corresponding initial positions (positions where no movement occurs), the distance between the center point of the initial position of the first movable component and the center point of the initial position of the second movable component can be predetermined, which is referred to as a specific distance in this embodiment.

[0205] For example, you can refer to Fig.10 To understand, Fig.10 As shown in a, the first moving part and the second moving part do not move at all, and are respectively at their corresponding initial positions. The specific distance between the center point P of the initial position of the first moving part and the center point Q of the initial position of the second moving part is Fig.10 As shown in FIG. 1 , it can be understood that the specific distance k can be predetermined and is a fixed value.

[0206] S807: Determine a moving distance difference between the moved first moving component and the moved second moving component according to the specific distance and the inclination angle corresponding to the calibrated DAC value in the inclination angle curve.

[0207] In this embodiment, for any calibrated DAC value, a corresponding tilt angle is determined. For example, the moving distance difference between the first moving component and the second moving component can be determined based on a specific distance and the tilt angle corresponding to the calibrated DAC value in the tilt angle curve.

[0208] For example, you can refer to Fig.10 To understand, assume that Fig.10 Based on the initial position shown in a, the first moving part and the second moving part are moved respectively according to the calibrated DAC value 1code. The state after the movement is as follows Fig.10 As shown in b.

[0209] Reference Fig.10 b, the inclination angle between the first moving part after moving and the second moving part after moving is Fig.10 The angle shown by α in b, and the specific distance is Fig.10 The distance shown by k in b, where k is fixed and known, is used to calculate the trigonometric function according to the specific distance and the inclination angle α, so the difference in the moving distance between the first moving part and the second moving part can be determined, that is, Fig.10 f shown in b.

[0210] Fig.10The above is only a schematic illustration of the mathematical relationship between the specific distance, the tilt angle, and the moving distance difference. In the actual implementation process, after determining the specific distance and the tilt angle, the moving distance difference can be directly obtained according to the trigonometric function relationship between the three, without the need for Fig.10 The analysis process shown.

[0211] S808 . Obtain a unit moving distance for the second driver chip, where the unit moving distance is the distance the second moving component moves when the DAC value of the second driver chip increases by one step.

[0212] It is understandable that the moving distance difference is the difference in moving distances between the first moving component after moving and the second moving component after moving in the first direction, so it is necessary to determine the compensation DAC value to correct the moving distance difference. Therefore, it is necessary to determine the corresponding relationship between the moving distance and the DAC value.

[0213] In a possible implementation, a unit moving distance may be obtained for the second driver chip, wherein the unit moving distance is the distance moved by the second moving component when the DAC value of the second driver chip increases by one step, wherein one step may be, for example, 1 code.

[0214] S809: Determine a compensation DAC value corresponding to the calibration DAC value according to the unit moving distance and the moving distance difference.

[0215] After determining the unit moving distance and the moving distance difference, the compensation DAC value corresponding to the calibration DAC value can be determined based on the unit moving distance and the moving distance difference. The compensation DAC value means how much DAC value can compensate for the difference caused by the moving distance difference.

[0216] Exemplarily, for example, the result obtained by dividing the moving distance difference by the unit moving distance can be determined as the compensation DAC value corresponding to the calibration DAC value. For example, the unit moving distance of the second driver chip is currently determined to be 3 microns, that is, for every 1 code increase in the DAC value of the second driver chip, the second moving component moves 3 microns. At the same time, assuming that the currently determined moving distance difference is 6 microns, then the compensation DAC value corresponding to the calibration DAC value can be determined to be 2 code, that is, 2 code can compensate for the 6 micron moving distance difference.

[0217] It should also be noted that S806 to S809 in this embodiment introduce the working principle of determining the compensation DAC value of the calibration DAC value. The compensation DAC value corresponding to each calibration DAC value can be determined in turn by referring to the implementation method introduced in the current step.

[0218] Or in another possible implementation, a polynomial fitting can be performed on the tilt angle curve, and then the polynomial corresponding to the fitted tilt angle is operated according to the logic described above to obtain the polynomial corresponding to the compensation value. The polynomial corresponding to the compensation value is used to express the compensation DAC value corresponding to each calibration DAC value, and the polynomial corresponding to the compensation DAC value can also be converted to Fig.11 The compensation curve shown in FIG. 1 is used to understand that in the compensation curve, the horizontal axis is the DAC value, the vertical axis is the compensation DAC value, and the tilt angle curve is used to reflect the corresponding relationship between the DAC value and the compensation DAC value. Therefore, the compensation DAC value corresponding to any DAC value can be effectively determined according to the polynomial (compensation curve) corresponding to the compensation value. This implementation method can more simply and quickly realize the realization of the compensation DAC value corresponding to each calibration DAC value.

[0219] Furthermore, the tilt angle curve can be equally divided into n segments, where n is an integer greater than or equal to 1. Then, the polynomial fitting described above is performed for each segment of the tilt angle curve, and then the above processing is performed accordingly to determine the compensation curve (or corresponding polynomial) corresponding to each segment of the tilt angle curve (or the corresponding polynomial). The advantage of segmented processing is that the polynomial corresponding to each segment of the tilt angle curve can be fitted more accurately, and in the actual implementation process, the larger the value of n, the more segments the corresponding tilt angle curve has, and the more accurate the polynomial finally fitted is, and the corresponding converted compensation curve (or the polynomial corresponding to the compensation DAC value) is also more accurate, so the accuracy of the determined compensation DAC value can be effectively improved. For example Fig. 9 The tilt angle curve shown illustrates the situation where the curve is divided into five segments.

[0220] S810 , performing compensation processing on each calibration DAC value according to the compensation DAC value corresponding to each calibration DAC value, to obtain a target DAC value corresponding to each calibration DAC value.

[0221] S811 . Generate a calibration mapping relationship according to target DAC values ​​corresponding to the respective calibration DAC values, where the calibration mapping relationship is used to reflect the correspondence between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0222] Among them, the implementation method of S810 and S811 is similar to the implementation method of the above-mentioned S603 and S604, and will not be repeated here.

[0223] In the tilt processing method of the ball motor provided in the embodiment of the present application, by generating a power supply instruction corresponding to the calibration DAC value, and then inputting the power supply instruction to the first driving chip and the second driving chip respectively, the first moving part can be driven to move the first distance corresponding to the calibration DAC value, and the second moving part can be driven to move the second distance corresponding to the calibration DAC value, and then the tilt angle is determined for the first moving part after moving and the second moving part after moving, so that the corresponding tilt angle can be accurately and effectively determined for each calibration DAC value. And when determining the compensation DAC value, the corresponding trigonometric function processing can be performed according to the specific distance between the center points of the first moving part and the second moving part in the initial state, and the tilt angle corresponding to the calibration DAC value, so that the moving distance difference between the first moving part after moving and the second moving part after moving can be simply, effectively and accurately obtained.

[0224] Based on the above embodiments, it can be determined that, for the first driver chip, there is a certain correspondence between the calibration DAC value and the moving distance of the first moving component. And for the second driver chip, there is also a certain correspondence between the calibration DAC value and the moving distance of the second moving component. This correspondence is described below.

[0225] A first Hall element is integrated in the first driver chip, wherein the Hall element can sense the magnetic field strength. Before formal calibration, for example, Hall calibration can be performed on the first Hall element in the first driver chip, wherein the Hall calibration is to determine the correspondence between the voltage value of the first Hall element and the moving position of the first moving part, thereby obtaining the first Hall mapping relationship of the first Hall element.

[0226] For example, starting from the initial position of the first moving part, the initial position is recorded as 0 microns, and then the first moving part is driven to move forward a certain distance (the moving direction depends on the influence of the magnetic field) by supplying power to the first coil, and then the voltage value of the first Hall element at this time is recorded, so as to establish a corresponding relationship between the voltage value of the first Hall element and the moving position of the first moving part. For example, when the first moving part moves forward 10 microns, the voltage value of the first Hall element is 2 V. Similar processing is performed for multiple moving distances of the first moving part, so as to obtain the first Hall mapping relationship of the first Hall element.

[0227] The calibrated DAC value of the first driver chip corresponds to the first voltage of the first Hall element, where there is a clear correspondence between voltage and current. Therefore, according to the first Hall mapping relationship, the correspondence between the calibrated DAC value and the first distance moved by the first moving part can be clearly defined. Exemplarily, for any calibrated DAC value, the first distance corresponding to the calibrated DAC value is the moving distance corresponding to the first voltage in the first Hall mapping relationship. The first voltage is the voltage of the first Hall element corresponding to the calibrated DAC value.

[0228] In addition, a second Hall element is integrated in the second driver chip. Similarly, before formal calibration, for example, Hall calibration can be performed on the second Hall element in the second driver chip, wherein the Hall calibration is to determine the correspondence between the voltage value of the second Hall element and the moving position of the second movable part, thereby obtaining the second Hall mapping relationship of the second Hall element.

[0229] For example, starting from the initial position of the second movable part, the initial position is recorded as 0 microns, and then the second movable part is driven to move forward a certain distance (the moving direction depends on the influence of the magnetic field) by supplying power to the second coil, and then the voltage value of the second Hall element at this time is recorded, so as to establish a corresponding relationship between the voltage value of the second Hall element and the moving position of the second movable part. For example, when the second movable part moves forward 10 microns, the voltage value of the second Hall element is 2 V. Similar processing is performed for multiple moving distances of the second movable part, so as to obtain the second Hall mapping relationship of the second Hall element.

[0230] The calibrated DAC value of the second driver chip corresponds to the second voltage of the second Hall element, where there is a clear correspondence between voltage and current. Therefore, according to the second Hall mapping relationship, the correspondence between the calibrated DAC value and the second distance moved by the second moving part can be clearly defined. Exemplarily, for any calibrated DAC value, the second distance corresponding to the calibrated DAC value is the moving distance corresponding to the second voltage in the second Hall mapping relationship. The second voltage is the voltage of the second Hall element corresponding to the calibrated DAC value.

[0231] Therefore, in this embodiment, by performing Hall calibration on the first Hall element and the second Hall element respectively before the calibration process, the first Hall mapping relationship corresponding to the first Hall element and the second Hall mapping relationship corresponding to the second Hall element can be determined. Then, based on the first Hall mapping relationship and the second Hall mapping relationship, the correspondence between each calibrated DAC value and the corresponding moving distance can be clarified, which can play an effective role in determining the position of the moving part and driving the moving part to move.

[0232] Furthermore, after the corresponding relationship between the calibrated DAC value and the moving distance is clearly determined, the unit moving distance of the second driving chip introduced above can be determined.

[0233] Based on the above embodiments, Fig.12 and Fig.13 In the actual application process of the ball motor, the implementation method of the tilt correction of the ball motor is described. The execution subject of the current embodiment can be, for example, a terminal device that carries the ball motor, or it can also be a processing unit such as a processor or chip in the terminal device. Any component in the terminal device that can be used to perform data processing can be used as the execution subject of this embodiment, and there is no special restriction on the specific execution subject.

[0234] Fig.12 This is a flow chart of a method for correcting the tilt of a ball motor provided in an embodiment of the present application. Fig.13 A schematic diagram of a correction mapping relationship provided in an embodiment of the present application.

[0235] like Fig.12 As shown, the method includes:

[0236] S1201 . In response to an automatic focusing instruction, set a DAC value of a first driving chip to a first application DAC value to control a first moving component to move a distance corresponding to the first application DAC value.

[0237] Based on the introduction of the above embodiments, it can be determined that the ball motor can be used for automatic focusing. Therefore, when the ball motor is required to provide the automatic focusing function, an automatic focusing instruction can be generated, and then in response to the automatic focusing instruction, the DAC value of the first driver chip in the ball motor is set to the first application DAC value. Exemplarily, the first application DAC value can be carried in the automatic focusing instruction, and the function of the automatic focusing instruction can be to instruct the first driver chip to set the DAC value to the first application DAC value.

[0238] After the first driving chip sets the DAC value to the first application DAC value, power is supplied to the first coil, thereby driving the first moving component to move a distance corresponding to the first application DAC value.

[0239] S1202: Obtain a target application DAC value corresponding to the first application DAC value in the correction mapping relationship.

[0240] And in order to achieve tilt correction in this embodiment, the DAC value of the second driver chip can be determined according to the correction mapping relationship, so that the second driver chip cooperates with the DAC value of the first driver chip to achieve tilt correction during the movement of the carrier.

[0241] Therefore, the target application DAC value corresponding to the first application DAC value can be obtained in the correction mapping relationship. It can be understood that the correction mapping relationship is used to reflect the correspondence between the DAC value of the first driver chip and the DAC value of the second driver chip. Therefore, the first application DAC value is used as the DAC value of the first driver chip, and the corresponding DAC value of the second driver chip is determined in the correction mapping relationship, thereby obtaining the corresponding target application DAC value.

[0242] For example, you can refer to Fig.13 For example, assume Fig.13 The straight line shown in is the correction mapping relationship currently introduced. Fig.13 The horizontal axis represents the DAC value of the first driver chip, and the vertical axis represents the DAC value of the second driver chip. Assuming that the first application DAC value of the current first driver chip is 1code, then from the correction mapping relationship, it can be determined that the target application DAC value corresponding to the first application DAC value is 5code, so the DAC value of the second driver chip can be determined to be 5code.

[0243] In the actual implementation process, the correction mapping relationship can be Fig.13 The straight line (or curve) shown may be in the form of a function or a table. The present embodiment does not limit the specific expression of the correction mapping relationship, which may be selected according to actual needs, as long as the correction mapping relationship can effectively reflect the corresponding relationship between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0244] S1203 , setting the DAC value of the second driving chip to the target application DAC value, so as to control the second moving component to move a distance corresponding to the target application DAC value.

[0245] Because the correction mapping relationship is obtained through the various processes introduced in the above embodiments, the DAC value of the second driver chip is set to the target application DAC value, wherein the target application DAC value and the first application DAC value correspond to each other in the correction mapping relationship. Therefore, after the second coil is energized to drive the second moving part to move the distance corresponding to the target application DAC value, it can be ensured that the difference in moving distance between the first moving part and the second moving part is compensated, thereby effectively realizing the tilt correction of the carrier movement.

[0246] The tilt processing method of the ball motor provided in the embodiment of the present application determines the first application DAC value of the first driver chip according to the autofocus instruction, then determines the target application DAC value corresponding to the first application DAC value in the correction mapping relationship, and then sets the target application DAC value to the DAC value of the second driver chip, and then drives the first moving part to move accordingly according to the first application DAC value, and drives the second moving part to move accordingly according to the target application DAC value, thereby ensuring that the difference in moving distance between the first moving part after moving and the second moving part after moving is compensated, thereby effectively correcting the tilt problem of the carrier movement.

[0247] The above has described the tilt processing method of the ball motor and the tilt correction method of the ball motor in the embodiment of the present application. The following is a description of the device for executing the above method provided by the embodiment of the present application. Those skilled in the art can understand that the method and the device can be combined and referenced with each other, and the relevant device provided by the embodiment of the present application can execute the steps in the above list sorting method.

[0248] Fig.14 This is a schematic diagram of the structure of the tilt processing device of the ball motor provided in the embodiment of the present application. Fig.14 As shown, the device 140 includes: a generating module 1401, a determining module 1402, and a processing module 1403;

[0249] A generating module 1401 is used to obtain a tilt angle curve according to a plurality of calibration DAC values, wherein the tilt angle curve is used to indicate the tilt angle corresponding to each of the calibration DAC values, and the tilt angle is the tilt angle between the first moving component after moving in response to the calibration DAC value and the second moving component after moving in response to the calibration DAC value;

[0250] A determination module 1402, configured to determine, for the second moving component, the compensation DAC values ​​corresponding to the respective calibration DAC values ​​according to the tilt angle curve;

[0251] A processing module 1403 is used to perform compensation processing on each of the calibration DAC values ​​according to the compensation DAC values ​​corresponding to each of the calibration DAC values, so as to obtain a target DAC value corresponding to each of the calibration DAC values;

[0252] The generating module 1401 is further used to generate a correction mapping relationship according to the target DAC values ​​corresponding to the calibrated DAC values, wherein the correction mapping relationship is used to reflect the corresponding relationship between the DAC value of the first driver chip and the DAC value of the second driver chip.

[0253] In some implementations, the generating module 1401 is specifically used to:

[0254] For any of the calibration DAC values, controlling the first moving component and the second moving component to move a distance corresponding to the calibration DAC value according to the calibration DAC value;

[0255] acquiring a tilt angle between a first moving component moved in response to the calibration DAC value and the first moving component moved in response to the calibration DAC value;

[0256] The tilt angle curve is generated according to the tilt angles corresponding to the respective calibrated DAC values.

[0257] In some implementations, the generating module 1401 is specifically used to:

[0258] According to the calibrated DAC value, generating a power supply instruction corresponding to the calibrated DAC value;

[0259] Inputting a power supply instruction corresponding to the calibrated DAC value into the first driving chip, wherein the power supply instruction is used to instruct the first driving chip to supply power to the first coil according to the calibrated DAC value, so as to control the first moving component to move a first distance corresponding to the calibrated DAC value;

[0260] A power supply instruction corresponding to the calibrated DAC value is input to the second driving chip, wherein the power supply instruction is used to instruct the second driving chip to supply power to the second coil according to the calibrated DAC value to control the second moving component to move a second distance corresponding to the calibrated DAC value.

[0261] In some implementations, the determining module 1402 is specifically configured to:

[0262] Acquire a specific distance between a center point of an initial position of the first moving component and a center point of an initial position of the second moving component;

[0263] For any of the calibrated DAC values, determining a moving distance difference between the first moving component after moving and the second moving component after moving according to the specific distance and the inclination angle corresponding to the calibrated DAC value in the inclination angle curve;

[0264] According to the moving distance difference, a compensation DAC value corresponding to the calibration DAC value is determined for the second moving component.

[0265] In some implementations, the determining module 1402 is specifically configured to:

[0266] For the second driving chip, a unit moving distance is acquired, where the unit moving distance is the distance moved by the second moving component when the DAC value of the second driving chip increases by one step;

[0267] A compensation DAC value corresponding to the calibration DAC value is determined according to the unit movement distance and the movement distance difference.

[0268] In some implementations, the processing module 1403 is further configured to:

[0269] Performing Hall calibration on a first Hall element in the first driving chip to determine a first Hall mapping relationship corresponding to the first Hall element, where the first Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the first Hall element and a moving distance of the first moving component;

[0270] A Hall calibration is performed on the second Hall element in the second driving chip to determine a second Hall mapping relationship corresponding to the second Hall element, where the second Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the second Hall element and a moving distance of the second moving component.

[0271] In some implementations, the calibrated DAC value of the first driver chip corresponds to a first voltage of the first Hall element, and the first distance is a moving distance corresponding to the first voltage in the first Hall mapping relationship;

[0272] The calibrated DAC value of the second driving chip corresponds to the second voltage of the second Hall element, and the second distance is a moving distance corresponding to the second voltage in the second Hall mapping relationship.

[0273] In some implementations, the processing module 1403 is further configured to:

[0274] In response to an automatic focusing instruction, setting the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value;

[0275] Obtaining a target application DAC value corresponding to the first application DAC value in the correction mapping relationship;

[0276] The DAC value of the second driving chip is set to the target application DAC value to control the second moving component to move a distance corresponding to the target application DAC value.

[0277] The device provided in this embodiment can be used to execute the technical solution of the above method embodiment. Its implementation principle and technical effect are similar and will not be described in detail in this embodiment.

[0278] Fig.15 This is a schematic diagram of the structure of the tilt correction device of the ball motor provided in the embodiment of the present application. Fig.15As shown, the device 150 includes: a processing module 1501, an acquisition module 1502;

[0279] The processing module 1501 is used for setting the DAC value of the first driving chip to a first application DAC value in response to an automatic focusing instruction, so as to control the first moving component to move a distance corresponding to the first application DAC value;

[0280] An acquisition module 1502 is used to acquire a target application DAC value corresponding to the first application DAC value in a correction mapping relationship, wherein the correction mapping relationship is determined according to the method described in the above embodiment;

[0281] The processing module 1501 is further configured to set the DAC value of the second driving chip to the target application DAC value, so as to control the second moving component to move a distance corresponding to the target application DAC value.

[0282] The device provided in this embodiment can be used to execute the technical solution of the above method embodiment. Its implementation principle and technical effect are similar and will not be described in detail in this embodiment.

[0283] The ball motor tilt processing method and the ball motor tilt correction method provided in the embodiments of the present application can be applied to electronic devices with communication functions. The electronic devices include terminal devices, and the specific device form of the terminal device can refer to the above related descriptions.

[0284] An embodiment of the present application provides an electronic device, Fig.16 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application.

[0285] like Fig.16 As shown, the electronic device 160 includes: a processor 1601 and a memory 1602; the memory 1602 stores computer-executable instructions; the processor 1601 executes the computer-executable instructions stored in the memory 1602, so that the electronic device 160 executes the above method.

[0286] When the memory 1602 is independently provided, the electronic device further includes a bus 1603 for connecting the memory 1602 and the processor 1601 .

[0287] The embodiment of the present application provides a chip. The chip includes a processor, and the processor is used to call a computer program in a memory to execute the technical solution in the above embodiment. Its implementation principle and technical effect are similar to those of the above related embodiments, and will not be repeated here.

[0288] The embodiments of the present application also provide a computer-readable storage medium. The computer-readable storage medium stores a computer program. The above method is implemented when the computer program is executed by the processor. The method described in the above embodiment can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. If implemented in software, the function can be stored as one or more instructions or codes on a computer-readable medium or transmitted on a computer-readable medium. Computer-readable media can include computer storage media and communication media, and can also include any medium that can transfer a computer program from one place to another. The storage medium can be any target medium that can be accessed by a computer.

[0289] In one possible implementation, a computer-readable medium may include RAM, ROM, compact disc read-only memory (CD-ROM) or other optical disk storage, disk storage or other magnetic storage devices, or any other medium that is intended to carry or store the required program code in the form of instructions or data structures and can be accessed by a computer. Moreover, any connection is appropriately referred to as a computer-readable medium. For example, if a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL) or wireless technology (such as infrared, radio and microwave) is used to transmit software from a website, server or other remote source, the coaxial cable, fiber optic cable, twisted pair, DSL or wireless technology such as infrared, radio and microwave are included in the definition of medium. Disks and optical disks as used herein include optical disks, laser disks, optical disks, digital versatile disks (DVD), floppy disks and Blu-ray disks, where disks usually reproduce data magnetically, while optical disks reproduce data optically using lasers. Combinations of the above should also be included in the scope of computer-readable media.

[0290] An embodiment of the present application provides a computer program product, which includes a computer program. When the computer program is executed, the computer executes the above method.

[0291] The embodiments of the present application are described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processing unit of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable device to generate a machine, so that the instructions executed by the processing unit of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0292] The above specific implementation methods further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific implementation methods of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for processing the tilt of a ball motor, characterized in that: The ball motor includes a carrier for carrying a lens, the carrier includes a first moving part and a second moving part, the first moving part is equipped with at least one first coil and a first driving chip for supplying power to the first coil, and the second moving part is equipped with at least one second coil and a second driving chip for supplying power to the second coil; The method comprises: According to a plurality of calibrated digital-to-analog converter DAC values, a tilt angle curve is obtained, wherein the tilt angle curve is used to indicate the tilt angle corresponding to each of the calibrated DAC values, wherein the tilt angle is the tilt angle between the first moving component after moving in response to the calibrated DAC value and the second moving component after moving in response to the calibrated DAC value; According to the tilt angle curve, determining, for the second moving component, compensation DAC values ​​corresponding to the respective calibration DAC values; According to the compensation DAC values ​​corresponding to the calibration DAC values, the calibration DAC values ​​are compensated to obtain the target DAC values ​​corresponding to the calibration DAC values; Generate a correction mapping relationship according to the target DAC values ​​corresponding to the calibrated DAC values, wherein the correction mapping relationship is used to reflect the corresponding relationship between the DAC value of the first driver chip and the DAC value of the second driver chip; The step of determining, for the second moving component, the compensation DAC values ​​corresponding to the respective calibration DAC values ​​according to the inclination angle curve comprises: Acquire a specific distance between a center point of an initial position of the first moving component and a center point of an initial position of the second moving component; For any of the calibrated DAC values, determining a moving distance difference between the first moving component after moving and the second moving component after moving according to the specific distance and the inclination angle corresponding to the calibrated DAC value in the inclination angle curve; According to the moving distance difference, a compensation DAC value corresponding to the calibration DAC value is determined for the second moving component.

2. The method according to claim 1, characterized in that The step of obtaining a tilt angle curve according to a plurality of calibrated DAC values ​​comprises: For any of the calibration DAC values, controlling the first moving component and the second moving component to move a distance corresponding to the calibration DAC value according to the calibration DAC value; acquiring a tilt angle between the first moving component after moving in response to the calibration DAC value and the second moving component after moving in response to the calibration DAC value; The tilt angle curve is generated according to the tilt angles corresponding to the respective calibrated DAC values.

3. The method according to claim 2, characterized in that The controlling the first moving component and the second moving component to move a distance corresponding to the calibration DAC value according to the calibration DAC value includes: According to the calibrated DAC value, generating a power supply instruction corresponding to the calibrated DAC value; Inputting a power supply instruction corresponding to the calibrated DAC value into the first driving chip, wherein the power supply instruction is used to instruct the first driving chip to supply power to the first coil according to the calibrated DAC value, so as to control the first moving component to move a first distance corresponding to the calibrated DAC value; A power supply instruction corresponding to the calibrated DAC value is input to the second driving chip, wherein the power supply instruction is used to instruct the second driving chip to supply power to the second coil according to the calibrated DAC value to control the second moving component to move a second distance corresponding to the calibrated DAC value.

4. The method according to claim 1, characterized in that: The step of determining, for the second moving component, a compensation DAC value corresponding to the calibration DAC value according to the moving distance difference comprises: For the second driving chip, a unit moving distance is obtained, where the unit moving distance is the distance moved by the second moving component when the DAC value of the second driving chip increases by one step; A compensation DAC value corresponding to the calibration DAC value is determined according to the unit movement distance and the movement distance difference.

5. The method according to any one of claims 1 to 4, characterized in that: The method further comprises: Performing Hall calibration on a first Hall element in the first driving chip to determine a first Hall mapping relationship corresponding to the first Hall element, where the first Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the first Hall element and a moving distance of the first moving component; A Hall calibration is performed on the second Hall element in the second driving chip to determine a second Hall mapping relationship corresponding to the second Hall element, where the second Hall mapping relationship is used to indicate a corresponding relationship between a voltage value of the second Hall element and a moving distance of the second moving component.

6. The method according to claim 5, characterized in that The calibrated DAC value of the first driving chip corresponds to the first voltage of the first Hall element, and the first distance is the moving distance corresponding to the first voltage in the first Hall mapping relationship; The calibrated DAC value of the second driving chip corresponds to the second voltage of the second Hall element, and the second distance is a moving distance corresponding to the second voltage in the second Hall mapping relationship.

7. The method according to any one of claims 1 to 4 and 6, characterized in that: The method further comprises: In response to an automatic focusing instruction, setting the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value; Obtaining a target application DAC value corresponding to the first application DAC value in the correction mapping relationship; The DAC value of the second driving chip is set to the target application DAC value to control the second moving component to move a distance corresponding to the target application DAC value.

8. The method according to claim 1, characterized in that The first coil is used to control the movement of the first moving part after being energized; the second coil is used to control the movement of the second moving part after being energized; The first moving component and the second moving component move together as a whole to control the movement of the carrier in the first direction.

9. The method according to claim 8, characterized in that The first moving component and the second moving component are integrally formed; or, the first moving component and the second moving component are connected in a preset manner.

10. The method according to claim 9, characterized in that The carrier comprises a through hole for placing the lens, and the through hole is located between the first moving component and the second moving component; The ball motor further includes a base, and the first moving component and the second moving component are symmetrically arranged above the base.

11. A method for correcting the tilt of a ball motor, characterized in that the ball motor includes a carrier for carrying a lens, the carrier includes a first moving part and a second moving part, the first moving part is equipped with at least one first coil and a first driving chip for supplying power to the first coil, and the second moving part is equipped with at least one second coil and a second driving chip for supplying power to the second coil; The method comprises: In response to an automatic focusing instruction, setting the DAC value of the first driving chip to a first application DAC value, so as to control the first moving component to move a distance corresponding to the first application DAC value; Obtaining a target application DAC value corresponding to the first application DAC value in a correction mapping relationship, wherein the correction mapping relationship is determined according to the method according to any one of claims 1 to 7; The DAC value of the second driving chip is set to the target application DAC value to control the second moving component to move a distance corresponding to the target application DAC value.

12. The method according to claim 11, characterized in that The first coil is used to control the movement of the first moving part after being energized; the second coil is used to control the movement of the second moving part after being energized; The first moving component and the second moving component move together as a whole to control the movement of the carrier in the first direction.

13. The method according to claim 12, characterized in that The first moving component and the second moving component are integrally formed; or, the first moving component and the second moving component are connected in a preset manner.

14. The method according to claim 12, characterized in that The carrier comprises a through hole for placing the lens, and the through hole is located between the first moving component and the second moving component; The ball motor further includes a base, and the first moving component and the second moving component are symmetrically arranged above the base.

15. An electronic device, characterized in that: include: Processor and memory; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory, so that the electronic device performs the method according to any one of claims 1 to 14.

16. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 14 is implemented.

17. A computer program product, characterized in that The method comprises a computer program, which, when being executed, enables a computer to execute the method according to any one of claims 1 to 14.

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