Display module, display panel and electronic equipment

Abstract

The embodiment of the present application provides a display module, a display panel and an electronic device, belonging to the technical field of electronic devices, wherein the display module includes a plurality of sub-pixels distributed in an array, adjacent sub-pixels are separated by a pixel definition layer, a conductive isolation column is arranged on the pixel definition layer between adjacent sub-pixels in the first direction, the first electrode layer on the sub-pixel is overlapped with the conductive isolation column, and the first electrode layer is electrically connected to a power management chip, etc., through the conductive isolation column, so as to achieve the effect of reducing the square resistance. No conductive isolation column is arranged on the pixel definition layer between at least some adjacent sub-pixels in the second direction, so as to reduce the number and area of ​​the non-transparent conductive isolation columns, thereby improving the light transmittance of the display module, ensuring the electrical connection of the sub-pixels and the condition of small square resistance, improving the problem of low light transmittance of the display module and the display panel, and ensuring the performance of optical functional devices such as ambient light sensors and screen fingerprint sensors in the cavity of the electronic device.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a display module, a display panel and an electronic equipment. Background Art

[0002] At present, mobile phones, computers and other electronic devices have become inseparable from our lives, can be seen everywhere in life, and have greatly improved people's living standards. With the rapid development of communication equipment technology, the related display panel industry has also continued to develop, and the application scope of display panels has become more and more extensive.

[0003] The display panel and housing of an electronic device usually form a cavity of the electronic device for accommodating various structural components, wherein the display panel generally includes a display module and a cover plate, and the cover plate is located above the display module to play a protective role. The display module includes a substrate and a pixel definition layer, multiple sub-pixels, an anode layer and a cathode layer located on the substrate, and multiple sub-pixels are separated by the pixel definition layer. The anode layer, sub-pixels and cathode layer are stacked in sequence, and the anode layer and the cathode layer are used to excite the sub-pixels to emit light. A conductive isolation column is provided on the side of the pixel definition layer facing away from the substrate, and the cathode layer can be overlapped on the conductive isolation column to realize the electrical connection between the cathode layer and the conductive isolation column. Through the conductive isolation column, a power management chip (powermanagement IC, referred to as PMIC) can be externally connected to excite the sub-pixels to emit light.

[0004] However, the above-mentioned display panel has low light transmittance, which affects the performance of optical functional devices in the cavity of the electronic device, such as ambient light sensors, screen fingerprint sensors, etc. Summary of the invention

[0005] The embodiments of the present application provide a display module, a display panel and an electronic device. The display module has good light transmittance, improves the problem of low light transmittance of the display panel, and ensures the performance of optical functional devices in the cavity of the electronic device.

[0006] A first aspect of an embodiment of the present application provides a display module, comprising a first electrode layer, a pixel definition layer and a plurality of sub-pixels, wherein the plurality of sub-pixels are arranged in an array, and a pixel definition layer is provided between adjacent sub-pixels, that is, the pixel definition layer is provided around the sub-pixels to separate the plurality of sub-pixels. A first electrode layer is provided on each sub-pixel, and the first electrode layer is a light-transmitting layer.

[0007] The display module also includes a conductive isolation column. In the first direction, a conductive isolation column is arranged on the pixel definition layer between adjacent sub-pixels. The first electrode layer is overlapped and electrically connected to the conductive isolation column, that is, the first electrode layer on each sub-pixel can be overlapped on the conductive isolation column on at least one side along the first direction, so that the first electrode layer on each sub-pixel can be electrically connected to a power management chip, etc. through the conductive isolation column, thereby achieving the effect of reducing square resistance.

[0008] In the second direction, no conductive isolation column is provided on the pixel definition layer between at least some adjacent sub-pixels, and at least one side of the first electrode layer on the adjacent sub-pixels in the second direction can be overlapped on part of the pixel definition layer. That is, in the second direction, there is no conductive isolation column between some adjacent sub-pixels, which reduces the number and area of ​​non-transparent conductive isolation columns, thereby improving the light transmittance of the display module, ensuring the electrical connection of the sub-pixels and the condition of small square resistance, improving the problem of low light transmittance of the display module and the display panel, and ensuring the performance of optical functional devices such as ambient light sensors and screen fingerprint sensors in the cavity of electronic equipment.

[0009] In a possible implementation, a second electrode layer is further included, and in the second direction, the second electrode layer is covered on the pixel definition layer between some adjacent sub-pixels, the second electrode layer is electrically connected to the first electrode layer, and the second electrode layer is a light-transmitting layer, so as to improve the light transmittance of the display module and facilitate improving the uniformity of the display module.

[0010] In a possible implementation manner, in the first direction, the conductive spacer disposed on the pixel definition layer between adjacent sub-pixels is a first conductive spacer.

[0011] In the second direction, a second conductive spacer is provided on the pixel definition layer between some adjacent sub-pixels, and the second conductive spacer is connected to the first conductive spacer. That is, in the second direction, a second conductive spacer can be provided between some adjacent sub-pixels, and the second conductive spacer can be electrically connected to the first electrode layer through the first conductive spacer. That is, the first electrode layer of multiple sub-pixels can be electrically connected to the power management chip, etc. through the first conductive spacer and the second conductive spacer, thereby reducing the square resistance of the display module in the second direction, which is conducive to further reducing the square resistance of the entire display module.

[0012] In a possible implementation, in the second direction, the sub-pixels located on both sides of the second conductive spacer are overlapped with the second conductive spacer, and the first electrode layer located on both sides of the second conductive spacer is overlapped on the sub-pixels. Since the second conductive spacer can be electrically connected to the first electrode layer through the first conductive spacer, in the second direction, the first electrode layer located on both sides of the second conductive spacer can be overlapped on the second conductive spacer without direct contact, which is conducive to processing, significantly reduces the difficulty of process design and production, and improves product yield.

[0013] In a possible implementation, along the second direction, the plurality of sub-pixels are grouped into N sub-pixels, and there is a second conductive spacer between two adjacent groups, where N≥2, and N is a positive integer. That is, in the second direction, there is a second conductive spacer between every two sub-pixels, so that the display module can have better light transmittance and uniformity, and has a smaller square resistance.

[0014] In a possible implementation, N satisfies: 3≤N≤10, so that the display module has good light transmittance and uniformity while ensuring that the display module has a small square resistance.

[0015] In a possible implementation, N is 3, 5, or 10, and the display module can achieve better light transmittance, uniformity, and smaller square resistance.

[0016] In a possible implementation, the plurality of sub-pixels include a plurality of first pixels, a plurality of second pixels, and a plurality of third pixels. The first pixels and the second pixels are arranged in sequence along the second direction, two adjacent first pixels and second pixels have a third pixel on one side of the first direction, and the plurality of third pixels are arranged in sequence along the second direction. The plurality of sub-pixels form a π-type RGB arrangement mode, which has good applicability and display effect.

[0017] In a possible implementation, no conductive spacer is provided on the pixel definition layer between at least some of the adjacent third pixels. The distance between two adjacent third pixels is relatively large, and in the second direction, no conductive spacer is provided on the pixel definition layer between at least some of the adjacent third pixels, which significantly increases the light-transmissive area and can further improve the light transmittance.

[0018] In a possible implementation, the plurality of sub-pixels include a plurality of first pixels, a plurality of second pixels, and a plurality of third pixels. The first pixels, the second pixels, and the third pixels are sequentially arranged along the first direction, the plurality of first pixels are sequentially arranged along the second direction, the plurality of second pixels are sequentially arranged along the second direction, and the plurality of third pixels are sequentially arranged along the second direction. The plurality of sub-pixels adopt a standard RGB arrangement mode, which has better applicability and is conducive to ensuring the display effect of the display panel.

[0019] In a possible implementation manner, the first pixel is a red light pixel, the second pixel is a green light pixel, and the third pixel is a blue light pixel.

[0020] In a possible implementation, the first electrode layer and the second electrode layer are integrally formed, which helps to simplify the forming steps of the display module and reduce the difficulty of forming.

[0021] In a possible implementation, the display module further includes a substrate, the pixel definition layer is disposed on the substrate, and the conductive isolation column is located on a surface of the pixel definition layer facing away from the substrate.

[0022] The display module also includes a third electrode layer. The third electrode layer, sub-pixels and the first electrode layer are stacked in sequence on the substrate, and the third electrode layer is overlapped on the side of the pixel definition layer facing away from the conductive isolation column to ensure that the sub-pixels can emit light under the excitation of the first electrode layer and the third electrode layer.

[0023] In one possible implementation, the conductive isolation column includes a connected column portion and a brim portion, the column portion is located between the pixel definition layer and the brim portion, and the vertical projection of the column portion on the pixel definition layer is located within the vertical projection of the brim portion on the pixel definition layer, so as to facilitate the first electrode layer to be overlapped on the column portion of the conductive isolation column.

[0024] A second aspect of an embodiment of the present application provides a display panel, comprising a cover plate and any one of the above-mentioned display modules, wherein the cover plate is disposed on the display module.

[0025] A third aspect of an embodiment of the present application provides an electronic device, including a middle frame and the above-mentioned display panel, wherein the middle frame is fixed to the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0027] Figure 2 for Figure 1 Schematic diagram of partial structural disassembly of electronic equipment;

[0028] Figure 3 A schematic cross-sectional structure diagram of a display panel provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the connection between the cathode layer of the display module and the power management chip in the related art;

[0030] Figure 5 A schematic top view of a local structure of a sub-pixel of a display module in the related art;

[0031] Figure 6 For display module in related technology Figure 5The schematic diagram of the partial structure of the cross section of the AA surface is shown in FIG.

[0032] Figure 7 A schematic top view of a local structure of a sub-pixel and a conductive isolation column in a display module provided in an embodiment of the present application;

[0033] Figure 8 A display module provided in an embodiment of the present application Figure 7 The schematic diagram of the partial structure of the cross section of the AA surface is shown in FIG.

[0034] Fig. 9 A display module provided in an embodiment of the present application Figure 7 A schematic diagram of the cross-sectional local structure of the BB surface shown in FIG.

[0035] Fig.10 A schematic top view of the local structure of sub-pixels and conductive isolation columns in another display module provided in an embodiment of the present application;

[0036] Fig.11 A schematic top view of a local structure of a sub-pixel and a conductive isolation column in another display module provided in an embodiment of the present application;

[0037] Fig.12 A schematic top view of the local structure of sub-pixels and conductive isolation columns in another display module provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 100- electronic equipment;

[0040] 110-housing;

[0041] 111-middle frame; 1111-middle plate; 1112-frame;

[0042] 112- back plate;

[0043] 120-display panel; 120a-opening;

[0044] 10-cover plate;

[0045] 20-display module;

[0046] 21-sub-pixel; 211-first pixel; 212-second pixel; 213-third pixel;

[0047] 22-conductive isolation column; 22a-column portion; 22b-brim portion; 221-first conductive isolation column; 222-second conductive isolation column;

[0048] 23- first electrode layer;

[0049] 24-pixel definition layer;

[0050] 25- a second electrode layer;

[0051] 26- a third electrode layer;

[0052] 130-circuit board;

[0053] 140-Battery. DETAILED DESCRIPTION

[0054] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0055] The embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet personal computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a touch-screen TV, a walkie-talkie, a netbook, a point of sales (POS), a personal digital assistant (PDA), a wearable device, a virtual reality device, a wireless USB flash drive, a walkman, a radio, a television, a stereo, a headset, glasses, a vehicle-mounted device, a driving recorder, a security device, and other mobile or fixed terminal devices with a display panel.

[0056] The electronic device may be a foldable electronic device, such as a foldable mobile phone. Alternatively, the electronic device may be a non-foldable electronic device, such as a candy-bar mobile phone. For a foldable electronic device, under different usage requirements, the foldable electronic device may be unfolded to an unfolded state or folded to a folded state.

[0057] In the embodiment of the present application, the electronic device is taken as a mobile phone as an example. The mobile phone may be a bar phone, or the mobile phone may be a folding phone. The following description will be made by taking the electronic device as a bar phone as an example.

[0058] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0059] See also Figure 1 As shown, the electronic device 100 may include a housing 110 and a display panel 120 , and the display panel 120 may be mounted on one side of the housing 110 .

[0060] The housing 110 of the electronic device 100 may be in the shape of a rectangular flat plate. In order to facilitate the description of the following embodiments, an xyz coordinate system is established. Specifically, Figure 1As shown in , the width direction of the housing 110 may be the x direction, the length direction of the housing 110 may be the y direction, and the thickness direction of the housing 110 may be the z direction. It is understood that the coordinate system setting of the housing 110 may be flexibly set according to actual needs, and is not specifically limited here. In some other examples, the shape of the housing 110 may also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0061] The display panel 120 is used to display information and provide an interactive interface for the user. The display panel 120 may be an organic light-emitting diode (OLED) display screen, or, in some examples, the display panel 120 may also be a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, etc. In the embodiment of the present application, the display panel 120 is described as an OLED display screen.

[0062] Among them, it should be noted that Figure 1 1 shows that the display panel 120 is provided with an opening 120a to meet the function of the front camera of the electronic device 100, and the shape of the opening 120a is circular. In some other examples, the shape of the opening 120a may also be a regular or irregular shape such as an ellipse, a semicircle, a semi-ellipse, a trapezoid, a square, etc. Alternatively, in some other examples, the display panel 120 may not have the opening 120a.

[0063] Figure 2 for Figure 1 Schematic diagram of the partial structural breakdown of the electronic device.

[0064] See also Figure 2 As shown, exemplarily, the housing 110 may include a middle frame 111 and a back plate 112, the display panel 120 and the back plate 112 may be respectively located on opposite sides of the middle frame 111 along the z direction, and the display panel 120, the middle frame 111 and the back plate 112 together form a cavity, which can be used to assemble various structural components of the electronic device 100.

[0065] The side of the back plate 112 facing away from the display panel 120 may be the appearance surface of the electronic device 100 , and the side of the display panel 120 facing away from the back plate 112 may be used as the display surface of the electronic device 100 .

[0066] In some examples, the middle frame 111 and the back plate 112 may be formed separately, and the middle frame 111 and the back plate 112 may be fixedly assembled together by welding, clamping, bonding, etc. Alternatively, the middle frame 111 and the back plate 112 may also be formed in one piece.

[0067] The electronic device 100 may also include a circuit board 130, a battery 140, a charging management module (not shown in the figure) and a power management module (not shown in the figure). The circuit board 130, the battery 140, the charging management module and the power management module may be fixed inside the above-mentioned cavity.

[0068] Exemplarily, the middle frame 111 may include a frame 1112 and a middle plate 1111 , the frame 1112 is arranged on the periphery of the middle plate 1111 , the display panel 120 and the back plate 112 may be respectively fixed to the frame 1112 , and the middle plate 1111 may be located between the display panel 120 and the back plate 112 .

[0069] It should be noted that the middle plate 1111 and the frame 1112 may also be formed in one piece, or the middle plate 1111 and the frame 1112 may also be fixed together by welding, clamping, bonding, or the like.

[0070] The circuit board 130 may be disposed on the middle plate 1111 of the middle frame 111, for example, see Figure 2 As shown, the circuit board 130 may be disposed on a surface of the middle plate 1111 facing the back plate 112 , or the circuit board 130 may also be disposed on a surface of the middle plate 1111 facing the display panel 120 .

[0071] The circuit board 130 may include a processor, which may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, a display processing unit (DPU), and / or a neural-network processing unit (NPU), etc.

[0072] The controller may be the nerve center and command center of the electronic device 100. The controller may generate an operation control signal according to the instruction operation code and the timing signal to complete the control of fetching and executing instructions. A memory may also be provided in the processor for storing instructions and data.

[0073] The processor may include one or more interfaces, which can be used to connect a charger to charge the electronic device 100. The interface can also be used to implement data transmission between the electronic device 100 and an external device, for example, it can also be used to connect headphones, projection devices, etc.

[0074] The battery 140 may also be disposed on the middle plate 1111 of the middle frame 111, for example, see Figure 2 As shown, the battery 140 may be disposed on a surface of the middle plate 1111 facing the back plate 112 , or the battery 140 may also be disposed on a surface of the middle plate 1111 facing the display panel 120 .

[0075] The charging management module is used to receive charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging examples, the charging management module can receive charging input from the wired charger through an interface. In some wireless charging embodiments, the charging management module can receive wireless charging input through a wireless charging coil of the electronic device 100. The charging management module can charge the battery 140 and can also power the electronic device 100 through the power management module.

[0076] The power management module is used to connect the battery 140, the charging management module and the processor. The power management module receives input from the battery 140 and / or the charging management module to power the processor, memory, display panel 120, camera module, etc. The power management module can also be used to monitor parameters such as the capacity of the battery 140, the number of cycles of the battery 140, and the health status of the battery 140 (leakage, impedance).

[0077] In some examples, the power management module may be disposed in a processor of the circuit board 130. In other examples, the power management module and the charging management module may also be disposed in the same device.

[0078] One or more optical functional devices may also be provided in the cavity of the electronic device 100. The optical functional devices need to rely on light passing through the display panel 120 to realize their functions. The optical functional devices may be located in the film layer of the display panel 120, or may be located below the display panel 120 (on the side facing the inside of the cavity of the electronic device).

[0079] For example, the optical functional device may be an ambient light sensor (ALS), which can detect ambient light passing through the display panel 120 , thereby sensing the light conditions of the external environment surrounding the electronic device 100 to adjust the display of the display panel 120 .

[0080] For example, if the ambient light sensor transmits the detected ambient light condition information to the processor, the processor can adjust the display brightness of the display panel 120 according to the information. On the one hand, it can reasonably control the display brightness and reduce power consumption. On the other hand, according to the ambient light intensity, etc., the display brightness of the display panel 120 can be adaptively adjusted to achieve better display effects and enhance user experience.

[0081] The optical functional device can also be a screen fingerprint sensor (fingerprint on display, referred to as FOD). The light reflected back from the finger on the display panel 120 can be transmitted to the screen fingerprint sensor through the display panel 120. The screen fingerprint sensor can detect the fingerprint based on the reflected light.

[0082] Of course, in some other examples, the optical functional device may also be other types of photosensor devices.

[0083] It should be noted that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine certain components, or separate certain components, or arrange the components differently. For example, the electronic device 100 may also include devices such as a communication module, a sensor, a microphone, a speaker, and a flash.

[0084] Figure 3 A schematic diagram of the cross-sectional structure of a display panel provided in an embodiment of the present application.

[0085] Among them, see Figure 3 As shown, the display panel 120 may include a cover plate 10 and a display module 20 . The cover plate 10 is a light-transmitting plate-shaped structure. Exemplarily, the cover plate 10 may be a transparent glass plate.

[0086] The cover plate 10 is disposed on the display module 20. For example, the cover plate 10 may cover the upper portion of the display module 20 along the thickness direction. The cover plate 10 is located on a side of the display module 20 that faces away from the cavity inside the electronic device 100. The cover plate 10 protects the display module 20. The size of the cover plate 10 may be greater than or equal to the size of the display module 20.

[0087] The cover plate 10 and the display module 20 can be fixedly assembled by bonding, for example, the display module 20 and the cover plate 10 can be bonded together by optical clear adhesive (OCA). Of course, in some other examples, the display module 20 and the cover plate 10 can also be bonded to each other by other means, for example, the display module 20 and the cover plate 10 can be hot-pressed to form the display panel 120.

[0088] Exemplarily, the display module 20 may include a substrate and a light-emitting layer and an encapsulation layer stacked on one side of the substrate. The light-emitting layer serves as the main light-emitting film layer of the display module 20 and can generate light, such as generating three primary colors of red, green and blue, that is, forming a three primary color light model (RGB color model, referred to as RGB mode), thereby constituting colors and realizing the display of the picture.

[0089] The light-emitting layer may include a plurality of sub-pixels distributed in an array, and a pixel definition layer is provided between adjacent sub-pixels to separate the sub-pixels and avoid crosstalk problems. The plurality of sub-pixels may include a plurality of red light pixels, a plurality of green light pixels, and a plurality of blue light pixels. The light-emitting layer also includes a cathode layer and an anode layer. The anode layer, the sub-pixels, and the cathode layer are stacked in sequence. Under the action of the cathode layer and the anode layer, the sub-pixels are stimulated to emit light, thereby emitting the three primary colors of red, green, and blue.

[0090] Exemplarily, the cathode layer is mostly a light-transmitting layer, and the anode layer is an opaque layer. The cathode layer can be electrically connected to a power management chip of an electronic device to input a voltage to excite the sub-pixel to emit light.

[0091] Figure 4 It is a schematic diagram of the connection between the cathode layer of the display module and the power management chip in the related art.

[0092] In some examples, the cathode layer can be a whole layer covering multiple sub-pixels, see Figure 4 As shown, the cathode layer 200 as a whole can be overlapped on the metal trace 300 located at the peripheral edge of the display module, and the metal trace 300 is connected to the power management chip 500 through the pad area 400. However, the cathode layer 200 as a whole overlaps the metal trace 300 in a conductive manner, and the square resistance of the cathode layer 200 is large and the uniformity is poor, which will form high signal areas and low signal areas, affecting the display effect.

[0093] Figure 5 It is a schematic top view of the local structure of a sub-pixel of a display module in the related art.

[0094] In some examples, metal isolation columns are also used to achieve cathode layer connection, for example, in visionox intelligent pixelization (ViP technology), see Figure 5 As shown, the light-emitting layer of the display module includes conductive metal isolation columns 600 , and there are metal isolation columns 600 between adjacent sub-pixels 700 .

[0095] For example, the first direction is the y direction in the figure, and the second direction is the x direction in the figure. The first direction can be parallel to the length direction of the substrate of the display module, and the second direction can be parallel to the width direction of the substrate. There are metal isolation columns 600 between the sub-pixels 700 arranged in sequence in the first direction, for example, see Figure 5 As shown, a metal spacer 600 is provided between the green pixel 700a and the blue pixel 700b. Metal spacers are also provided between the sub-pixels 700 arranged in sequence in the second direction, for example, a metal spacer 600 is provided between the red pixel 700c and the green pixel 700a.

[0096] Figure 6 For display module in related technology Figure 5 Schematic diagram of the cross-sectional local structure of the AA surface shown in .

[0097] A cathode layer may be disposed on each sub-pixel 700, and the cathode layer may be electrically connected to the metal isolation column 600. Figure 6 As shown, the metal isolation column 600 is disposed on the pixel definition layer 800, and the cathode layer 101 on each sub-pixel 700 can overlap on the metal isolation column 600 on both sides and be electrically connected to the metal isolation column 600. The anode layer 900 is located on the side of the sub-pixel 700 that faces away from the cathode layer 101, and the anode layer 900 can overlap on both sides on the side of the pixel definition layer 800 that faces away from the metal isolation column 600. For example, taking the green light pixel 700a and the blue light pixel 700b as an example, the metal isolation column 600 is disposed on the pixel definition layer 800 between the green light pixel 700a and the blue light pixel 700b, and the cathode layer 101 on the green light pixel 700a and the cathode layer 101 on the blue light pixel 700b can be overlapped on the metal isolation column 600 respectively, so that the cathode layer 101 is electrically connected to the metal isolation column 600, and can be electrically connected to the power management chip through the metal isolation column 600.

[0098] The metal isolation columns are used instead of the cathode layer itself to achieve electrical connection, and the square resistance is smaller. However, as the display demand increases, the number of sub-pixels per inch (PPI) is higher, the aperture ratio of the sub-pixels is also higher, and the number of metal isolation columns is large and they are not light-transmitting. In addition, due to the molding and assembly process requirements, the projections of the metal isolation columns above the pixel definition layer (on the side facing away from the substrate) and the anode layer below the pixel definition layer (on the side facing the substrate) on the pixel definition layer are basically connected together, and nearly cover the entire pixel definition layer. This results in poor transmittance of the display module, reduces the light that can pass through the display module and display panel, and affects the normal operation of optical functional devices such as ambient light sensors and screen fingerprint sensors in the chamber of the electronic device.

[0099] Based on this, the embodiment of the present application provides a display module, by setting a conductive isolation column on the pixel definition layer between adjacent sub-pixels in the first direction, the first electrode layer on the sub-pixel is overlapped and electrically connected to the conductive isolation column, at least one side of the first electrode layer on each sub-pixel is overlapped on the conductive isolation column, and the first electrode layer can be electrically connected to the power management chip through the conductive isolation column, so as to achieve the effect of reducing the square resistance. In the second direction, the conductive isolation column is not set on the pixel definition layer between at least some adjacent sub-pixels, that is, there is no conductive isolation column between at least some adjacent sub-pixels in the second direction, reducing the number and area of ​​the non-transparent conductive isolation columns, thereby improving the light transmittance of the display module, ensuring the electrical connection of the sub-pixels and the condition of small square resistance, improving the problem of low light transmittance of the display module and the display panel, and ensuring the performance of optical functional devices such as ambient light sensors and screen fingerprint sensors in the cavity of electronic equipment.

[0100] Figure 7 A schematic top view of the local structure of sub-pixels and conductive isolation columns in a display module provided in an embodiment of the present application.

[0101] See also Figure 7 As shown, the display module includes a plurality of sub-pixels 21, and the plurality of sub-pixels 21 are arranged in an array. Each sub-pixel can display one color, that is, each sub-pixel can emit light of one color.

[0102] Exemplarily, the plurality of sub-pixels 21 may include a plurality of first pixels 211, a plurality of second pixels 212, and a plurality of third pixels 213. Among them, the first pixel 211 may be a red pixel, that is, the first pixel 211 may emit red light, the second pixel 212 may be a green pixel, that is, the second pixel 212 may emit green light, and the third pixel 213 may be a blue pixel, that is, the third pixel 213 may emit blue light. The luminous brightness (grayscale) of each sub-pixel may be adjusted, for example, by color combination and superposition, a plurality of colors may be displayed, thereby realizing full-color display and display of a picture.

[0103] Of course, in some other examples, the plurality of sub-pixels 21 may also include pixels capable of emitting light of other colors.

[0104] The display module 20 may further include a substrate (not shown in the figure), which may be a rigid substrate, such as a glass substrate, a silicon substrate, etc., so that the display panel 120 may be a rigid display panel. Alternatively, the substrate may also be a flexible substrate, such as a polyethylene terephthalate substrate, a polyimide substrate, etc., so that the display panel 120 may be a flexible display panel.

[0105] The plurality of sub-pixels 21 may be arranged in an array on one surface of the substrate. For example, the plurality of sub-pixels 21 may be formed on the substrate by evaporation, for example, by vaporizing the molding material of the sub-pixels and spraying the vaporized molding material onto the substrate through a row of parallel evaporation nozzles to form a sub-pixel structure layer.

[0106] Among them, the substrate can be a rectangular plate structure, with the long side direction of the substrate as the first direction, such as the y direction shown in the figure, and the short side direction of the substrate as the second direction, such as the x direction shown in the figure. The short side direction of the substrate can be consistent with the direction in which the evaporation nozzles are arranged in parallel.

[0107] The display module also includes a first electrode layer (not shown in the figure), and each sub-pixel is covered with the first electrode layer. For example, the first electrode layer can also be disposed on the sub-pixel by evaporation. For example, the second pixel 212a is covered with the first electrode layer 23b (refer to Figure 8 As shown in FIG. 1 , the third pixel 213a is covered with a first electrode layer 23c. The first electrode layer may be the cathode layer mentioned above.

[0108] The first electrode layer is a light-transmitting layer that allows light to pass through, thereby increasing the light transmittance of the display module. The light transmittance of the first electrode layer can be set based on actual needs and material design.

[0109] The display module also includes a conductive isolation column 22, which has conductive properties. The conductive isolation column 22 can be electrically connected to the first electrode layer. The conductive isolation column 22 can be externally connected to a power management chip, etc., so that the first electrode layer is electrically connected to the power management chip, etc. through the conductive isolation column 22, thereby stimulating the sub-pixel to emit light and achieving the effect of reducing square resistance.

[0110] The molding material of the conductive spacer column 22 can be metal, for example, copper, aluminum, titanium, etc. Of course, in some other examples, the molding material of the conductive spacer column 22 can also be other metal materials, or the molding material of the conductive spacer column 22 can also be a non-metallic material that can conduct electricity.

[0111] Figure 8 A display module provided in an embodiment of the present application Figure 7 Schematic diagram of the cross-sectional local structure of the AA surface shown in .

[0112] See also Figure 8As shown, the display module further includes a pixel definition layer 24, which is also disposed on one side of the substrate (not shown in the figure). Exemplarily, the pixel definition layer 24 may have a plurality of pixel openings, and a plurality of sub-pixels may be respectively located in the plurality of pixel openings. The first electrode layer 23 is disposed on the sub-pixels, and the pixel definition layer 24 is disposed around the sub-pixels. The pixel definition layer 24 is provided between two adjacent sub-pixels. For example, the pixel definition layer 24 is provided between the adjacent second pixel 212a and the third pixel 213a, and the sub-pixels are separated by the pixel definition layer 24 to avoid crosstalk problems.

[0113] The conductive spacer column 22 is disposed on the pixel definition layer 24 , and the conductive spacer column 22 may be located on a side of the pixel definition layer 24 facing away from the substrate.

[0114] In the first direction (y direction), a conductive isolation column 22 is disposed on the pixel definition layer 24 between adjacent sub-pixels, and the first electrode layer 23 is overlapped on the conductive isolation column 22 to achieve electrical connection between the first electrode layer 23 and the conductive isolation column 22. For example, see Figure 8 As shown, in the y direction, taking the adjacent second pixel 212a and the third pixel 213a as an example, a conductive isolation column 22 is arranged on the pixel definition layer 24 between the second pixel 212a and the third pixel 213a, and the first electrode layer 23b on the second pixel 212a and the first electrode layer 23c on the third pixel 213a are respectively overlapped on the conductive isolation column 22.

[0115] Combination Figure 7 As shown, that is, in the first direction (y direction), there are conductive isolation columns 22 between adjacent sub-pixels, such as between the first pixel 211a and the third pixel 213a adjacent to each other in the y direction, and between the second pixel 212a and the third pixel 213a adjacent to each other in the y direction, and the first electrode layer on each sub-pixel is overlapped on the conductive isolation column 22.

[0116] It can be understood that there is a pixel definition layer between any two adjacent sub-pixels, that is, the pixel definition layer is arranged around each sub-pixel, and in the first direction, there is a conductive isolation column on the pixel definition layer between adjacent sub-pixels, then the first electrode layer on each sub-pixel can overlap the conductive isolation column on at least one side along the first direction, for example, see Figure 8 As shown, the first electrode layer 23b on the second pixel 212a is overlapped on two conductive isolation columns 22 on both sides along the y direction, so that the first electrode layer 23 on each sub-pixel can be electrically connected to the power management chip etc. through the conductive isolation columns 22.

[0117] It should be noted that when the first electrode layer 23 on the sub-pixel overlaps with the conductive isolation column 22 along at least one side in the first direction, the first electrode layer 23 of the sub-pixel may also overlap and cover a portion of the pixel definition layer 24 .

[0118] The conductive isolation column 22 may be in the shape of a cuboid, a cylinder, a trapezoidal cube, etc. Figure 8 As shown, in some examples, the conductive isolation column 22 may include a connected column portion 22a and a brim portion 22b, the column portion 22a may be located between the brim portion 22b and the pixel definition layer 24, and the two ends of the column portion 22a are respectively fixed to the brim portion 22b and the pixel definition layer 24.

[0119] The vertical projection of the column portion 22a on the pixel definition layer 24 can be located within the vertical projection of the brim portion 22b on the pixel definition layer 24, that is, the vertical projection of the brim portion 22b on the pixel definition layer 24 completely covers the vertical projection of the column portion 22a on the pixel definition layer 24, so that the size of the brim portion 22b is larger than the column portion 22a, which facilitates the first electrode layer 23 to be overlapped on the column portion 22a of the conductive isolation column 22.

[0120] Exemplarily, the vertical projection of the conductive spacer column 22 on the pixel definition layer 24 may be located within the pixel definition layer 24 , that is, the size of the conductive spacer column 22 is smaller than the pixel definition layer 24 , which may also facilitate the first electrode layer 23 to overlap on the conductive spacer column 22 .

[0121] Fig. 9 A display module provided in an embodiment of the present application Figure 7 A schematic diagram of the cross-sectional local structure of the BB surface is shown in FIG.

[0122] In the second direction (x direction), no conductive isolation column is disposed on the pixel definition layer between at least some adjacent sub-pixels, for example, see Fig. 9 As shown, in the x direction, taking the adjacent second pixel 212a and the first pixel 211b as an example, no conductive isolation column is set on the pixel definition layer 24 between the second pixel 212a and the first pixel 211b. For example, the pixel definition layer 24 of the second pixel 212a and the first pixel 211b can be covered with a transparent second electrode layer 25, and no conductive isolation column is set. The first electrode layer 23 on the partially adjacent sub-pixels is only overlapped on part of the pixel definition layer 24 along at least one side in the second direction. For example, one side of the first electrode layer 23b on the second pixel 212a and one side of the first electrode layer 23c on the first pixel 211b can be overlapped on part of the pixel definition layer 24, respectively.

[0123] That is, in the second direction (x direction), there is no conductive isolation column between some adjacent sub-pixels. Figure 7As shown, there may be no conductive isolation column 22 between the second pixel 212a and the first pixel 211b adjacent in the x direction and between the third pixel 213a and the third pixel 213b adjacent in the x direction, thereby reducing the number and area of ​​the opaque conductive isolation columns 22, thereby improving the transmittance of the display module, ensuring the electrical connection of the sub-pixels and a smaller square resistance, improving the problem of low light transmittance of the display module and the display panel, and ensuring the performance of optical functional devices such as ambient light sensors and screen fingerprint sensors in the cavity of the electronic device.

[0124] In the second direction, no conductive isolation column is provided on the pixel definition layer between some adjacent sub-pixels. For example, see Fig. 9 As shown, the display module may further include a second electrode layer 25 . In the x direction, the pixel definition layer 24 between some adjacent sub-pixels may be covered with the second electrode layer 25 , and the second electrode layer 25 may be electrically connected to the first electrode layer 23 .

[0125] For example Fig. 9 As shown, a second electrode layer 25 is provided on the pixel definition layer 24 between the second pixel 212a and the first pixel 211b adjacent to each other in the x direction, and one side of the first electrode layer 23b on the second pixel 212a and one side of the first electrode layer 23c on the first pixel 211b can be overlapped on parts of the pixel definition layer 24, respectively, and can be connected to the second electrode layer 25, respectively, to completely cover the pixel definition layer 24.

[0126] The second electrode layer 25 may be a light-transmitting layer to improve the light transmittance of the display module and help improve the uniformity of the display module.

[0127] Among them, the second electrode layer 25 can also be a cathode layer. The molding material of the second electrode layer 25 can be consistent with the molding material of the first electrode layer 23. The second electrode layer 25 can be integrally molded with the first electrode layer 23, that is, when the first electrode layer 23 is formed on the sub-pixel, the second electrode layer 25 can be formed together on the pixel definition layer 24 where no conductive isolation column is provided, which is conducive to simplifying the molding steps of the display module and reducing the difficulty of molding.

[0128] Of course, in some other examples, the molding material of the second electrode layer 25 may also be different from the molding material of the first electrode layer 23. The first electrode layer 23 and the second electrode layer 25 may also be formed separately.

[0129] Continue to see Fig. 9 As shown, the display module may also include a third electrode layer 26, which may be the above-mentioned positive electrode layer. The third electrode layer 26, sub-pixels and the first electrode layer 23 may be stacked in sequence on the substrate, and the sub-pixels may emit light under the excitation of the first electrode layer 23 and the third electrode layer 26.

[0130] Illustratively, the third electrode layer 26 can be overlapped on the side of the pixel definition layer 24 facing away from the conductive isolation column 22 to ensure that the third electrode layer 26 can normally excite the sub-pixel to emit light. It can be understood that the pixel definition layer 24 is arranged around the sub-pixel, and the surrounding side of the third electrode can be overlapped on the pixel definition layer 24.

[0131] The display module may further include an encapsulation layer (not shown in the figure), which may cover the first electrode layer 23 and the conductive isolation column 22 (on the side facing away from the substrate) to achieve encapsulation of the entire display module and protect the first electrode layer 23, the conductive isolation column 22 and sub-pixels located below the encapsulation layer.

[0132] It should be noted that in the second direction, no conductive isolation columns may be set on the pixel definition layer between all adjacent sub-pixels, that is, there are no conductive isolation columns between all adjacent sub-pixels in the second direction, and the conductive isolation columns are arranged in sequence on the first side, so that the display module has higher light transmittance.

[0133] Alternatively, in the second direction, no conductive isolation columns may be provided on the pixel definition layer between some adjacent sub-pixels, that is, conductive isolation columns may be provided between some adjacent sub-pixels in the second direction, and conductive isolation columns may not be provided between some adjacent sub-pixels.

[0134] In the embodiment of the present application, the following description is made by taking the case where a conductive isolation column is disposed on a pixel definition layer between some adjacent sub-pixels as an example.

[0135] For example, in the first direction, the conductive spacers between adjacent sub-pixels are first conductive spacers 221, that is, in the y direction, the first conductive spacers 221 are disposed on the pixel definition layer between adjacent sub-pixels (see Figure 7 shown).

[0136] In the second direction, a second conductive spacer is disposed on the pixel definition layer between some adjacent sub-pixels, that is, a second conductive spacer is disposed between some adjacent sub-pixels in the second direction. For example, a first conductive spacer 221 is disposed between the first pixel 211a and the third pixel 213a, and between the second pixel 212a and the third pixel 213a adjacent in the y direction (see Figure 7 As shown in FIG. 1 , a second conductive spacer column 222 may be provided between the first pixel 211a and the second pixel 212a adjacent to each other in the x direction, while no second conductive spacer column may be provided between the second pixel 212a and the first pixel 211b.

[0137] The second conductive isolation column 222 can be connected to the first conductive isolation column 221, so that the second conductive isolation column 222 can also be electrically connected to the first electrode layer, that is, the first electrode layer of multiple sub-pixels 21 can be electrically connected to a power management chip, etc. through the first conductive isolation column 221 and the second conductive isolation column 222. The setting of the second conductive isolation column 222 can reduce the square resistance of the display module in the second direction, thereby facilitating further reducing the square resistance of the entire display module.

[0138] The shape and structure of the second conductive isolation column 222 can be the same as that of the first conductive isolation column 221. For example, the first conductive isolation column 221 and the second conductive isolation column 222 can both include a column body and a brim portion, and the vertical projection of the column body on the pixel definition layer can also be located within the vertical projection of the brim portion on the pixel definition layer.

[0139] Alternatively, in some other examples, the second conductive isolation pillar 222 and the first conductive isolation pillar 221 may have different shapes and structures.

[0140] Exemplarily, when forming a display module, a third electrode layer and a pixel definition layer may be first formed on a substrate, a plurality of pixel openings arranged in an array may be formed on the pixel definition layer, and the third electrode layer may be opposite to the pixel openings. A first conductive isolation column is formed on the pixel definition layer between adjacent pixel openings in the first direction, a second conductive isolation column is formed on the pixel definition layer between some adjacent pixel openings in the second direction, and then sub-pixels and a first electrode layer are sequentially formed on the pixel openings by evaporation or the like, so that the first electrode layer overlaps with the first conductive isolation column, and a second electrode layer is formed on another portion of the pixel definition layer in the second direction where the second conductive isolation column is not provided, so that the second electrode layer is connected to the first electrode layer.

[0141] In some examples, in the second direction, there is a second conductive isolation column between some adjacent sub-pixels, and the first electrode layer on the some adjacent sub-pixels is located on both sides of the second conductive isolation column along the second direction, and at least one side of the first electrode layer on the some adjacent sub-pixels can be overlapped on the second conductive isolation column, so that the first electrode layer located on both sides of the second conductive isolation column along the second direction is overlapped on the second conductive isolation column, so that the first electrode layer can be directly electrically contacted with the second conductive isolation column and electrically connected.

[0142] It should be noted that due to the limitations of the evaporation process, when a sub-pixel layer, a first electrode layer and a second electrode layer are formed on a substrate having a pixel definition layer, a first conductive isolation column and a second conductive isolation column, based on the particularity of the arrangement of the evaporation nozzles and the existence of the second conductive isolation column, the sub-pixels on both sides of the second conductive isolation column along the second direction are more easily overlapped on the second conductive isolation column, and it is more difficult for the first electrode layer to contact and overlap on the second conductive isolation column, which increases the difficulty of process design and production.

[0143] Therefore, in some examples, when there is a second conductive isolation column between some adjacent sub-pixels in the second direction, the adjacent sub-pixels can be directly overlapped on the second conductive isolation column, and the first electrode layer on the adjacent sub-pixels can be directly contacted and overlapped on the sub-pixels. That is, the sub-pixels located on both sides of the second conductive isolation column in the second direction are overlapped with the second conductive isolation column respectively, and the first electrode layer located on both sides of the second conductive isolation column is overlapped on the sub-pixel, that is, in the second direction, the first electrode layer located on both sides of the second conductive isolation column is not directly contacted and overlapped with the second conductive isolation column, and the second conductive isolation column can be electrically connected to the first electrode layer through the first conductive isolation column. It is conducive to processing and realization, significantly reduces the difficulty of process design and production, and improves product yield.

[0144] For example, see Fig. 9 As shown, taking the case where a second conductive spacer 222 is provided between the first pixel 211a and the second pixel 212a adjacent to each other in the x direction as an example, in the x direction, the first pixel 211a and the second pixel 212a are located on both sides of the second conductive spacer 222, and the first pixel 211a and the second pixel 212a can be overlapped on the second conductive spacer 222 respectively, the first electrode layer 23a on the first pixel 211a is overlapped on the first pixel 211a, and the first electrode layer 23b on the second pixel 212a is overlapped on the second pixel 212a. That is, in the x direction, the first electrode layer 23a and the first electrode layer 23b located on both sides of the second conductive spacer 222 can be overlapped on the second conductive spacer 222 without direct contact.

[0145] It is understandable that multiple sub-pixels are arranged in an array, for example, they can be arranged in sequence along the first direction and the second direction to form an array, in the first direction, there are first conductive spacers between adjacent sub-pixels, and in the second direction, there are second conductive spacers between some adjacent sub-pixels, so that the second conductive spacers can also be arranged in sequence along the first direction and the second direction. In order to improve the uniformity of the display module and reduce the square resistance, the second conductive spacers can be arranged uniformly, for example, multiple second conductive spacers can be arranged uniformly in the second direction, and the second conductive spacers in two adjacent columns in the first direction can be arranged in a staggered manner.

[0146] In some examples, the multiple sub-pixels in the second direction may be divided into a group of N sub-pixels, and a second conductive isolation column may be provided on the pixel definition layer between two adjacent groups, that is, there is a second conductive isolation column between two adjacent groups.

[0147] Wherein, N is a positive integer, and the value range of N may be N≥2. That is, in the second direction, there is a second conductive isolation column between every two sub-pixels, so that the display module can have better light transmittance and uniformity, and has smaller sheet resistance.

[0148] Fig.10 A schematic top view of the local structure of sub-pixels and conductive isolation columns in another display module provided in an embodiment of the present application.

[0149] For example, see Fig.10 As shown, there is no second conductive isolation column between the first pixel 211c and the second pixel 212c adjacent to each other in the x direction, and the first pixel 211c and the second pixel 212c form a group; there is no second conductive isolation column between the first pixel 211d and the second pixel 212d, and the first pixel 211d and the second pixel 212d form a group, and a second conductive isolation column 222 is provided between the two groups.

[0150] Exemplarily, the value range of N may be 3≤N≤10, so that the display module has good light transmittance and uniformity while ensuring that the display module has a small square resistance.

[0151] In some examples, N can be any one of 3, 5 or 10, that is, every 3 sub-pixels form a group, and there is a second conductive isolation column between two adjacent groups (refer to Fig.12 As shown). Alternatively, every 5 sub-pixels form a group, and there is a second conductive isolation column between two adjacent groups. Alternatively, every 10 sub-pixels form a group, and there is a second conductive isolation column between two adjacent groups. The display module can achieve better light transmittance, uniformity and smaller square resistance.

[0152] Of course, in some other examples, in the second direction, a second conductive isolation column may be provided between any two adjacent sub-pixels.

[0153] In the embodiment of the present application, the arrangement of sub-pixels is not limited, and no conductive isolation column is provided between adjacent sub-pixels in the second direction. For example, the arrangement of sub-pixels may be one of the RGB primary color sub-pixel arrangements.

[0154] Fig.11 A schematic top view of the local structure of sub-pixels and conductive isolation columns in another display module provided in an embodiment of the present application.

[0155] For example, see Fig.11As shown, the arrangement of the plurality of sub-pixels 21 may adopt a π-type RGB arrangement. For example, the first pixel 211 may be a red pixel, the second pixel 212 may be a green pixel, and the third pixel 213 may be a blue pixel. The first pixel 211 and the second pixel 212 are arranged in sequence along the second direction, as shown in FIG. Fig.11 As shown, in the x direction, the first pixel 211 a , the second pixel 212 a , the first pixel 211 b , and the second pixel 212 b are arranged in sequence.

[0156] Two adjacent first pixels 211 and second pixels 212 have a third pixel 213 on one side of the first direction, and a plurality of third pixels 213 are arranged in sequence along the second direction, such as Fig.11 As shown, in the y direction, one side of the adjacent first pixel 211a and the second pixel 212a has a third pixel 213a, and one side of the adjacent first pixel 211b and the second pixel 212b has a third pixel 213b, and the third pixels 213a and 213b are arranged in sequence along the x direction.

[0157] It can be understood that in the x direction, the distance between two adjacent third pixels 213 is relatively large. In some examples, in a display module with a π-type RGB arrangement, in the x direction, the conductive isolation column may not be provided on the pixel definition layer between at least some adjacent third pixels 213, such as Fig.11 As shown, in the x direction, there is no second conductive isolation column between the adjacent third pixels 213a and 213b, and the pixel definition layer (not shown in the figure) between the third pixel 213a and the third pixel 213b can be covered with a second electrode layer (not shown in the figure), which significantly increases the light-transmitting area and can further improve the light transmittance.

[0158] In the x direction, a second conductive spacer column 222 may be provided between adjacent first pixels 211 and second pixels 212 , so that the display module has a smaller square resistance and a higher light transmittance.

[0159] Of course, in some other examples, in the x direction, the second conductive isolation column may not be disposed between at least some of the adjacent first pixels 211 and second pixels 212 (see Fig. 9 shown).

[0160] Fig.12 A schematic top view of the local structure of sub-pixels and conductive isolation columns in another display module provided in an embodiment of the present application.

[0161] For some examples, see Fig.12As shown, the arrangement of the plurality of sub-pixels 21 may also adopt a standard RGB arrangement, such as a slit-type arrangement. For example, the first pixel 211 may be a red pixel, the second pixel 212 may be a green pixel, the third pixel 213 may be a blue pixel, the first pixel 211, the second pixel 212 and the third pixel 213 are sequentially arranged along the first direction, the plurality of first pixels 211 are sequentially arranged along the second direction, the plurality of second pixels 212 are sequentially arranged along the second direction, and the plurality of third pixels 213 are sequentially arranged along the second direction.

[0162] like Fig.12 As shown in , in the y direction, the first pixel 211a, the second pixel 212a, and the third pixel 213a are arranged in sequence, the first pixel 211b, the second pixel 212b, and the third pixel 213b are arranged in sequence, and the first pixel 211c, the second pixel 212c, and the third pixel 213c are arranged in sequence.

[0163] In the x direction, the first pixel 211a, the first pixel 211b and the first pixel 211c are arranged in sequence, the second pixel 212a, the second pixel 212b and the second pixel 212c are arranged in sequence, and the third pixel 213a, the third pixel 213b and the third pixel 213c are arranged in sequence.

[0164] In the x direction, part of the space between adjacent first pixels 211, part of the space between adjacent second pixels 212, and part of the space between adjacent third pixels 213 may not be provided with the second conductive isolation column (conductive isolation column), and part of the space between adjacent third pixels 213 may be provided with the second conductive isolation column 222 to ensure better light transmittance and smaller square resistance.

[0165] Of course, in some examples, the second conductive isolation pillars may not be disposed between adjacent first pixels 211 , between adjacent second pixels 212 , and between adjacent third pixels 213 in the x direction.

[0166] In some other examples, the arrangement of the plurality of sub-pixels 21 may also be other types, for example, a Delta arrangement, a Pentile arrangement, a diamond-like arrangement, etc.

[0167] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0168] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A display module, characterized in that: include: A plurality of sub-pixels, wherein the plurality of sub-pixels are arranged in an array; A first electrode layer, each sub-pixel is provided with the first electrode layer, and the first electrode layer is a light-transmitting layer; A pixel definition layer, wherein the pixel definition layer is provided between adjacent sub-pixels; Conductive isolation columns are provided on the pixel definition layer between adjacent sub-pixels in a first direction, and the first electrode layer overlaps the conductive isolation columns; In the second direction, the conductive isolation column is not disposed on the pixel definition layer between at least some adjacent sub-pixels.

2. The display module according to claim 1, characterized in that: It also includes a second electrode layer. In the second direction, the pixel definition layer between some adjacent sub-pixels covers the second electrode layer, the second electrode layer is electrically connected to the first electrode layer, and the second electrode layer is a light-transmitting layer.

3. The display module according to claim 2, characterized in that: In the first direction, the conductive spacer disposed on the pixel definition layer between adjacent sub-pixels is a first conductive spacer; In the second direction, a second conductive spacer is disposed on the pixel definition layer between some of the adjacent sub-pixels, and the second conductive spacer is connected to the first conductive spacer.

4. The display module according to claim 3, characterized in that: In the second direction, the sub-pixels located on both sides of the second conductive isolation column are overlapped with the second conductive isolation column, and the first electrode layer located on both sides of the second conductive isolation column is overlapped on the sub-pixels.

5. The display module according to claim 3 or 4, characterized in that: Along the second direction, the plurality of sub-pixels are grouped into N sub-pixels, and there is one second conductive isolation column between two adjacent groups, where N≥2, and N is a positive integer.

6. The display module according to claim 5, characterized in that: The N satisfies: 3≤N≤10.

7. The display module according to claim 6, characterized in that: The N is 3, 5, or 10.

8. The display module according to any one of claims 1-4, 6-7, characterized in that: The plurality of sub-pixels include a plurality of first pixels, a plurality of second pixels, and a plurality of third pixels; The first pixels and the second pixels are sequentially arranged along the second direction, two adjacent first pixels and second pixels have one third pixel on one side of the first direction, and a plurality of third pixels are sequentially arranged along the second direction.

9. The display module according to claim 8, characterized in that: The conductive isolation column is not disposed on the pixel definition layer between at least some adjacent third pixels.

10. The display module according to any one of claims 3-4, 6-7, and 9, characterized in that: The plurality of sub-pixels include a plurality of first pixels, a plurality of second pixels, and a plurality of third pixels; The first pixel, the second pixel and the third pixel are arranged in sequence along the first direction, a plurality of the first pixels are arranged in sequence along the second direction, a plurality of the second pixels are arranged in sequence along the second direction, and a plurality of the third pixels are arranged in sequence along the second direction.

11. The display module according to claim 10, characterized in that: The first pixel is a red light pixel, the second pixel is a green light pixel, and the third pixel is a blue light pixel.

12. The display module according to any one of claims 2-4, 6-7, characterized in that: The first electrode layer and the second electrode layer are integrally formed.

13. The display module according to any one of claims 1-4, 6-7, 9 and 11, characterized in that: It also includes a substrate, the pixel definition layer is disposed on the substrate, and the conductive isolation column is located on a side of the pixel definition layer facing away from the substrate; The display module further includes a third electrode layer. The third electrode layer, the sub-pixels and the first electrode layer are sequentially stacked on the substrate, and the third electrode layer is overlapped on a side of the pixel definition layer facing away from the conductive isolation column.

14. The display module according to any one of claims 1-4, 6-7, 9 and 11, characterized in that: The conductive isolation column comprises a column body portion and a brim portion connected to each other; The column portion is located between the pixel definition layer and the brim portion, and a vertical projection of the column portion on the pixel definition layer is located within a vertical projection of the brim portion on the pixel definition layer.

15. A display panel, characterized in that: It comprises a cover plate and the display module according to any one of claims 1 to 14, wherein the cover plate is arranged on the display module.

16. An electronic device, characterized in that: The device comprises a middle frame and the display panel according to claim 15, wherein the middle frame is fixed to the display panel.

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