Laser cutting equipment and cutting method for semiconductor device processing

Abstract

The invention relates to the technical field of semiconductor device processing, and discloses a laser cutting device for semiconductor device processing and a cutting method thereof, comprising a positioning component, the positioning component comprising a workbench, the inner wall of the workbench is fixedly connected to a motor, and the output end of the motor is fixedly connected to a worm gear. In the process of the sliding rod moving downward, the sliding rod will drive the pressure rod to move downward and push air into the first air guide hose, the first air guide hose will pass the air into the air guide plate, the air guide plate will pass the air into the second air guide hose, the second air guide hose will pass the air into the interior of the fixed block, and the air passed into the fixed block will push the pressure plate downward. When the pressure rod moves down to a certain position, the block will compress the spring five and shrink it into the first laser generator, the pressure plate will drive the first laser generator to move downward quickly for a distance, and at this time the first laser generator will contact the joint, and then the first laser generator can be supplied with current, and at this time the first laser generator performs the cutting work.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device processing equipment, and in particular to a laser cutting device for semiconductor device processing and a cutting method thereof. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in radios, televisions and temperature measurement. For example, a diode is a device made of semiconductors. Semiconductor refers to a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. Semiconductors are processed using devices, and when processing semiconductor devices, special laser equipment is required to cut them efficiently.

[0003] When laser cutting semiconductor materials, in order to improve cutting efficiency, stack cutting can be used. However, when the number of stacks is different, the height of the laser to cut the material is also different. Therefore, if the laser power is too low during cutting, the cutting speed may be slow, resulting in low processing efficiency. If the device is in working state for a long time, the service life of the device will be reduced. If the power is too high, it may cause energy waste. In response to the above problems, the following solutions are proposed. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a laser cutting device for semiconductor device processing, including a positioning assembly, the positioning assembly includes a workbench, the inner wall of the workbench is fixedly connected to a motor, the output end of the motor is fixedly connected to a worm, and further includes:

[0005] The clamping assembly includes a rack arranged on the top of the workbench, the top of the rack is meshedly connected with a gear rod, and the outer surface of the gear rod is rotatably connected with a support plate;

[0006] The switching assembly includes a pressure rod arranged on the top of the workbench, a fixing box is slidably connected to the outer surface of the pressure rod, and an air guide hose 1 is fixedly connected to the fixing box on a side close to the rack;

[0007] The following component comprises a traction rope 2 arranged on the top of the workbench, a fixing ring is fixedly connected to the top of the traction rope 2, and a lifting plate is fixedly connected to the top of the fixing ring.

[0008] Preferably, the worm is meshingly connected to a worm wheel at the front side, a rotating plate is rotatably connected to the inner wall of the worm wheel, the outer surface of the rotating plate is rotatably connected to the inner wall of the workbench, the inner wall of the rotating plate is rotatably connected to a connecting rod, the inner wall of the connecting rod is rotatably connected to a sliding shell, the outer surface of the sliding shell is slidably connected to the inner wall of the workbench, the outer surface of the sliding shell is slidably connected to a limiting plate, the bottom of the limiting plate is fixedly connected to the top of the workbench, the inner wall of the sliding shell is slidably connected to a sliding plate, the sliding plate is fixedly connected to a spring on the side away from the rotating plate, the spring is fixedly connected to the inner wall of the sliding shell at one end away from the sliding plate, the sliding plate is fixedly connected to a positioning plate on the side close to the rotating plate, and by providing a spring, a reset force can be given to the sliding plate when it is compressed.

[0009] Preferably, the top of the sliding plate is fixedly connected to the bottom of the rack, the outer surface of the sliding shell is fixedly connected to the outer surface of the support plate, the outer surface of the gear rod is fixedly connected to a rope-collecting roller, the outer surface of the rope-collecting roller is fixedly connected to a traction rope 1, the outer surface of traction rope 1 is slidably connected to the outer surface of the support plate, the outer surface of traction rope 1 contacts the limiting wheel, the outer surface of the limiting wheel is rotatably connected to the inner wall of the positioning plate, and by setting the limiting wheel, the traction rope can be limited.

[0010] Preferably, traction rope 1 is fixedly connected to a sliding rod at the end away from the rope collecting roller, spring 2 is fixedly connected to the bottom of the sliding rod, a limiting ring is fixedly connected to the bottom of spring 2, the outer surface of the limiting ring is fixedly connected to the inner wall of the positioning plate, a clamping plate is slidably connected to the inner wall of the sliding rod, spring 3 is sleeved on the outer surface of the clamping plate, the top of spring 3 is fixedly connected to the outer surface of the sliding rod, and the bottom of spring 3 is fixedly connected to the outer surface of the clamping plate. By setting the limiting ring, the sliding rod can be limited.

[0011] Preferably, the outer surface of the sliding rod is fixedly connected to the outer surface of the pressure rod, the fixed box is fixedly connected to the side of the positioning plate away from the rotating plate on the side close to the rotating plate, the air guide hose 1 is fixedly connected to the air guide plate on the side away from the fixed box, the bottom of the air guide plate is fixedly connected to the air guide hose 2, the air guide hose 2 is fixedly connected to the fixed block at the end away from the air guide plate, the inner wall of the fixed block is slidably connected to the laser generator 1, the left side of the laser generator 1 is fixedly connected to the pressure plate, the outer surface of the pressure plate is slidably connected to the inner wall of the fixed block, the top of the pressure plate is fixedly connected to a sealing plate, the outer surface of the sealing plate is slidably connected to the inner wall of the fixed block, and by providing the sealing plate, the internal sealing of the fixed block can be always maintained when the laser generator 1 descends.

[0012] Preferably, a spring four is fixedly connected to the bottom of the pressure plate, a limiting block is fixedly connected to the bottom of the spring four, the left side of the limiting block is fixedly connected to the left side of the inner wall of the fixed block, a card block is slidably connected to the inner wall of the laser generator one, the bottom of the card block contacts the top of the limiting block, a spring five is fixedly connected to the right side of the card block, the right side of the spring five is fixedly connected to the inner wall of the laser generator one, a connecting rod is rotatably connected to the back side of the fixed block, the outer wall of the connecting rod is slidably connected to the outer surface of the laser generator one, the outer wall of the connecting rod is slidably connected to the laser generator two, the outer surface of the laser generator two is slidably connected to the inner wall of the fixed block, a joint is fixedly connected to the bottom of the fixed block, and by setting a spring four, a force for resetting the pressure plate can be given.

[0013] Preferably, the top of the sliding rod is fixedly connected to the bottom of the second traction rope, the top of the workbench is fixedly connected to a top plate, the outer surface of the lifting plate is slidably connected to the inner wall of the top plate, the top of the lifting plate is fixedly connected to a limiting plate two, the outer surface of the limiting plate two is slidably connected to the inner wall of the top plate, the bottom of the limiting plate two is fixedly connected to a spring six, and the bottom of the spring six is ​​fixedly connected to the inner wall of the top plate. By setting the spring six, a force to reset the lifting plate can be given when it is compressed.

[0014] A cutting method of a laser cutting device for semiconductor device processing, comprising the following steps:

[0015] S1: When using this device, first move the device to the specified position, then stack the circular semiconductor materials to be cut and place them on the top of the workbench, then start the motor, the sliding plate will drive the positioning plate to move together, and the positioning plate will position the materials;

[0016] S2: When the sliding plate is retracted into the sliding shell, the rope collecting roller rotates to collect the rope, and the sliding rod is pulled downward by the traction rope 1. The sliding rod slides downward and drives the clamping plate to move downward through the spring 3, and the upper surface of the material is clamped by the elastic force of the spring 3;

[0017] S3: The downward movement of the sliding rod drives the pressure rod downward, thereby compressing the air and pushing the laser generator 1 downward through the thrust of the air to replace laser generators of different powers. During the downward movement of the sliding rod, it will also pull the traction rope 2 downward to move the laser generator 2 and the laser generator 1 downward, so that the bottom of the laser head always maintains a suitable distance from the top of the material.

[0018] The present invention has the following beneficial effects:

[0019] 1. The present invention utilizes the downward movement of the sliding rod to drive the pressure rod to move downward, thereby compressing the air and pushing the laser generator 1 downward through the thrust of the air, so as to replace the laser generators of different powers. Specifically, in the process of the sliding rod moving downward, it will drive the pressure rod and move downward. The downward movement of the pressure rod will compress the air in the fixed box and push the air into the air guide hose 1. The air guide hose 1 will pass the air into the air guide plate. The air guide plate will pass the air into the air guide hose 2. The air guide hose 2 will pass the air into the interior of the fixed block. The air passed into the fixed block will accumulate therein and push the pressure plate downward. The pressure plate will give the laser generator 1 a downward thrust. At this time, because the card block is stuck on the top of the limiting block, and the force given by the pressure plate is not enough to make the card block compress the spring 5, the laser generator 1 will not move. As the air passed into the fixed block gradually increases, the air pressure therein It will also increase. When the pressure rod moves down to a certain position, the compressed air pressure is large enough, the block will compress the spring five and retract it into the laser generator one, and the pressure plate will drive the laser generator one to move down quickly for a distance. At this time, the block will extend again and be stuck at the bottom of the limiting block. When the laser generator one moves downward, it will drive the laser generator two to move upward through the connecting rod, so that the laser generator two is separated from the joint. At this time, the laser generator one will contact the joint, and then the current can be passed through the laser generator one. At this time, the laser generator one performs the cutting work. This design can automatically determine whether the laser generator needs to be replaced according to the height of the material stacking, and can automatically replace the laser generator with different powers when the laser generator needs to be replaced, thereby preventing the use of a higher-power laser generator when the material stacking height is low, resulting in energy waste.

[0020] 2. The present invention starts the motor, and the motor will drive the worm wheel to rotate through the worm, and the worm wheel will drive the connecting rod to rotate through the rotating plate, and the connecting rod will drive the sliding shell to slide linearly under the limiting action of the limiting plate 1, and the sliding shell will drive the sliding plate 1 to move together through the spring 1, and the sliding plate will drive the positioning plate 1 to move together, and when the positioning plate contacts the material, it will push the material, and position the material through the joint action of the three positioning plates, and after the positioning is completed, as the sliding shell continues to move, the sliding plate will compress the spring 1 to retract into the sliding shell, and the elastic force of the spring 1 will continue to apply thrust to the material after the positioning is completed, thereby clamping and fixing the material. This design can automatically position and clamp the material, and thus can quickly complete the positioning and clamping of the workpiece in a short time, reduce the production cycle, improve production efficiency, and reduce the intervention of human operation, which can reduce the error and inconsistency caused by human operation.

[0021] 3. In the process of the sliding plate being retracted into the sliding shell, the gear rod is driven to rotate through the rack, and the gear rod drives the rope collecting roller to rotate. The rope collecting roller rotates to wrap the traction rope 1 around the outer surface of the rope collecting roller to collect the rope. It should be noted that the radius of the rope collecting roller is large enough. In the process of the sliding plate being retracted into the sliding shell, the rope collecting roller rotates to keep the traction rope 1 in a taut state. The rotation of the rope collecting roller can also pull the sliding rod downward through the traction rope 1. The traction rope 1 is limited by the support plate and the limiting wheel. The sliding rod slides downward. The clamping plate is driven downward by spring three. When the clamping plate moves downward to contact the material, the sliding rod is continuously pulled, and the clamping plate will compress spring three and clamp the upper surface of the material through the elastic force of spring three. When spring three is fully compressed, the motor is controlled to stop rotating, and the material is clamped at this time. This design can clamp the materials to be stacked and cut from the top down, and can adapt to different stacking quantities. The downward clamping can effectively reduce the vibration and deformation of the material during the cutting process, and help maintain the stability and accuracy of the material during the cutting process.

[0022] 4. In the process of the sliding rod moving downward, the present invention will also pull the traction rope 2 downward, the traction rope 2 will drive the fixed ring to move downward, the fixed ring will drive the two lifting plates to move downward together, and compress the spring 6 through the limit plate 2. In the process of moving downward, the lifting plate will drive the fixed block to move downward as a whole, thereby moving the laser generator 2 and the laser generator 1 downward, so that the bottom of the laser generator 2 or the laser generator 1 can always maintain a certain distance from the top of the material. This design can keep the bottom of the laser head at a suitable distance from the top of the material regardless of the height of the material stacking, so that the laser focus position can be controlled more accurately, thereby improving the cutting precision and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0024] Figure 1 It is a schematic diagram of the internal cross-sectional structure of the workbench of the present invention;

[0025] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the overall structure of the rotating plate of the present invention;

[0027] Figure 4 It is a schematic diagram of the overall structure of the sliding shell of the present invention;

[0028] Figure 5 It is a schematic diagram of the overall structure of the clamping plate of the present invention;

[0029] Figure 6 It is a schematic diagram of the overall structure of the air guide plate of the present invention;

[0030] Figure 7 This is a schematic diagram of the back structure of the fixing block of the present invention;

[0031] Figure 8 This is a schematic diagram of the internal cross-sectional structure of the fixing block of the present invention;

[0032] Fig. 9 For the present invention Figure 8 A is a schematic diagram of the enlarged structure of the middle part;

[0033] Fig.10 It is a schematic diagram of the overall structure of the lifting plate of the present invention;

[0034] Fig.11 It is a schematic diagram of the working process of the present invention.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] In the figure: 1. Positioning assembly; 101. Workbench; 102. Motor; 103. Worm; 104. Worm wheel; 105. Turn plate; 106. Connecting rod; 107. Sliding shell; 108. Limiting plate 1; 110. Sliding plate; 111. Spring 1; 112. Positioning plate; 2. Clamping assembly; 201. Rack; 202. Gear rod; 203. Support plate; 204. Rope roller; 205. Traction rope 1; 206. Limiting wheel; 207. Sliding rod; 208. Spring 2; 209. Limiting ring; 210. Clamping plate; 211. Spring 3; 3. Switch Components; 301, pressure rod; 302, fixing box; 303, air guide hose 1; 304, air guide plate; 305, air guide hose 2; 306, fixing block; 307, laser generator 1; 308, pressure plate; 309, spring 4; 310, limiting block; 311, clamping block; 312, spring 5; 313, connecting rod; 314, laser generator 2; 315, joint; 316, sealing plate; 4, following component; 401, traction rope 2; 402, fixing ring; 403, lifting plate; 404, limiting plate 2; 405, spring 6; 406, top plate. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] For example, see Figure 1 - Figure 4 The present invention is a laser cutting device for semiconductor device processing, comprising a positioning assembly 1, the positioning assembly 1 comprising a workbench 101, a motor 102 is fixedly connected to the inner wall of the workbench 101, a worm 103 is fixedly connected to the output end of the motor 102, and further comprising:

[0039] The clamping assembly 2 includes a rack 201 disposed on the top of the workbench 101, a gear rod 202 is meshedly connected to the top of the rack 201, and a support plate 203 is rotatably connected to the outer surface of the gear rod 202;

[0040] The switching assembly 3 includes a pressure rod 301 disposed on the top of the workbench 101, a fixing box 302 is slidably connected to the outer surface of the pressure rod 301, and an air guide hose 303 is fixedly connected to the fixing box 302 on one side close to the rack 201;

[0041] The following component 4 includes a traction rope 401 arranged on the top of the workbench 101 , a fixing ring 402 is fixedly connected to the top of the traction rope 401 , and a lifting plate 403 is fixedly connected to the top of the fixing ring 402 .

[0042] The front of the worm 103 is meshed with a worm wheel 104, the inner wall of the worm wheel 104 is rotatably connected to a rotating plate 105, the outer surface of the rotating plate 105 is rotatably connected to the inner wall of the workbench 101, the inner wall of the rotating plate 105 is rotatably connected to a connecting rod 106, the inner wall of the connecting rod 106 is rotatably connected to a sliding shell 107, the outer surface of the sliding shell 107 is slidably connected to the inner wall of the workbench 101, the outer surface of the sliding shell 107 is slidably connected to a limit plate 108, the bottom of the limit plate 108 is connected to the top of the workbench 101 The sliding plate 110 is fixedly connected to the inner wall of the sliding shell 107, and the sliding plate 110 is fixedly connected to a spring 111 on the side away from the rotating plate 105. The spring 111 is fixedly connected to the inner wall of the sliding shell 107 at one end away from the sliding plate 110. The sliding plate 110 is fixedly connected to a positioning plate 112 on the side close to the rotating plate 105. The motor 102 is started, and the motor 102 drives the worm wheel 104 to rotate through the worm 103. The worm wheel 104 rotates through the rotating plate 105. 05 drives the connecting rod 106 to rotate, and the connecting rod 106 will drive the sliding shell 107 to slide linearly under the limiting action of the limiting plate 108. The sliding shell 107 will drive the sliding plate 110 to move together through the spring 111, and the sliding plate 110 will drive the positioning plate 112 to move together. When the positioning plate 112 contacts the material, it will push the material and position the material through the joint action of the three positioning plates 112. After the positioning is completed, as the sliding shell 107 continues to move, the sliding plate 110 will compress the spring 111 to retract into the sliding shell 107, and the elastic force of the spring 111 will continue to apply thrust to the material after the positioning is completed, thereby clamping and fixing the material. This design can automatically position and clamp the material, and thus can quickly complete the positioning and clamping of the workpiece in a short time, reduce the production cycle, improve production efficiency, and reduce the intervention of human operation, which can reduce the error and inconsistency caused by human operation.

[0043] For example 2, please refer to Figure 5 - Fig.10 The present invention is a laser cutting device for processing semiconductor devices. On the basis of the first embodiment, the top of the sliding plate 110 is fixedly connected to the bottom of the rack 201, the outer surface of the sliding shell 107 is fixedly connected to the outer surface of the support plate 203, the outer surface of the gear rod 202 is fixedly connected to the rope collection roller 204, the outer surface of the rope collection roller 204 is fixedly connected to the traction rope 1 205, the outer surface of the traction rope 1 205 is slidably connected to the outer surface of the support plate 203, the outer surface of the traction rope 1 205 contacts the limiting wheel 206, the outer surface of the limiting wheel 206 is rotatably connected to the inner wall of the positioning plate 112, when the sliding plate 110 is retracted into the sliding shell 107, it will drive the gear rod 202 to rotate through the rack 201, the gear rod 202 will drive the rope collection roller 204 to rotate, the rotation of the rope collection roller 204 will wrap the traction rope 1 205 around the outer surface of the rope collection roller 204, and perform the rope collection work.

[0044] The traction rope 1 205 is fixedly connected to a sliding rod 207 at one end away from the rope collecting roller 204, and a spring 208 is fixedly connected to the bottom of the sliding rod 207. The bottom of the spring 208 is fixedly connected to a limiting ring 209, and the outer surface of the limiting ring 209 is fixedly connected to the inner wall of the positioning plate 112. The inner wall of the sliding rod 207 is slidably connected to a clamping plate 210, and a spring 3 211 is sleeved on the outer surface of the clamping plate 210. The top of the spring 3 211 is fixedly connected to the outer surface of the sliding rod 207, and the bottom of the spring 3 211 is fixedly connected to the outer surface of the clamping plate 210. The radius of the rope collecting roller 204 is large enough. When the sliding plate 110 is retracted into the sliding shell 107, the rope collecting roller 204 rotates to keep the traction rope 1 205 always in a taut state, and the rotation of the rope collecting roller 204 can also be The sliding rod 207 is pulled downward, and the traction rope 1 205 is limited by the support plate 203 and the limiting wheel 206. The sliding rod 207 slides downward to drive the clamping plate 210 to move downward through the spring 3 211. When the clamping plate 210 moves downward to contact the material, the sliding rod 207 is continuously pulled, and the clamping plate 210 compresses the spring 3 211 and clamps the upper surface of the material through the elastic force of the spring 3 211. When the spring 3 211 is fully compressed, the motor 102 is controlled to stop rotating, and the material is clamped at this time. This design can clamp the material to be stacked and cut from the top downward, which can adapt to different stacking quantities. The downward clamping can effectively reduce the vibration and deformation of the material during the cutting process, which helps to maintain the stability and accuracy of the material during the cutting process.

[0045] The outer surface of the sliding rod 207 is fixedly connected to the outer surface of the pressure rod 301, the fixed box 302 is fixedly connected to the side of the positioning plate 112 away from the rotating plate 105 on the side close to the rotating plate 105, the air guide hose 1 303 is fixedly connected to the air guide plate 304 on the side away from the fixed box 302, the bottom of the air guide plate 304 is fixedly connected to the air guide hose 2 305, the air guide hose 2 305 is fixedly connected to the fixed block 306 at the end away from the air guide plate 304, the inner wall of the fixed block 306 is slidably connected to the laser generator 1 307, the left side of the laser generator 1 307 is fixedly connected to the pressure plate 308, the outer surface of the pressure plate 308 is slidably connected to the inner wall of the fixed block 306, and the top of the pressure plate 308 is fixed A sealing plate 316 is connected, and the outer surface of the sealing plate 316 is slidably connected to the inner wall of the fixed block 306. When the sliding rod 207 moves downward, it will drive the pressure rod 301 to move downward together. The downward movement of the pressure rod 301 will compress the air in the fixed box 302 and push the air into the air guide hose 1 303. The air guide hose 1 303 will pass the air into the air guide plate 304. The air guide plate 304 will pass the air into the air guide hose 2 305. The air guide hose 2 305 will pass the air into the interior of the fixed block 306. The air passed into the fixed block 306 will accumulate therein and push the pressure plate 308 downward. The pressure plate 308 will give the laser generator 1 307 a downward thrust.

[0046] The bottom of the pressure plate 308 is fixedly connected with a spring 4 309, the bottom of the spring 4 309 is fixedly connected with a limiting block 310, the left side of the limiting block 310 is fixedly connected to the left side of the inner wall of the fixed block 306, the inner wall of the laser generator 1 307 is slidably connected with a clamping block 311, the bottom of the clamping block 311 contacts the top of the limiting block 310, the right side of the clamping block 311 is fixedly connected with a spring 5 312, the right side of the spring 5 312 is fixedly connected to the inner wall of the laser generator 1 307, the back of the fixed block 306 is rotatably connected with a connecting rod 313, and the connecting rod 313 is connected to the inner wall of the laser generator 1 307. The outer wall of the rod 313 is slidably connected to the outer surface of the laser generator 1 307, the outer wall of the connecting rod 313 is slidably connected to the laser generator 2 314, the outer surface of the laser generator 2 314 is slidably connected to the inner wall of the fixed block 306, and the bottom of the fixed block 306 is fixedly connected to a joint 315. Since the clamping block 311 is clamped on the top of the limiting block 310, and the force given by the pressure plate 308 is not enough to make the clamping block 311 compress the spring 5 312, the laser generator 1 307 will not move. As the air gradually increases, the air pressure therein will also increase. When the pressure rod 301 moves down to a certain position, the compressed air pressure is large enough at this time, the block 311 will compress the spring five 312 and shrink it into the laser generator one 307, and the pressure plate 308 will drive the laser generator one 307 to move downward quickly for a distance. At this time, the block 311 will extend again and be stuck at the bottom of the limiting block 310. When the laser generator one 307 moves downward, it will drive the laser generator two 314 to move upward through the connecting rod 313, so that the laser generator two 314 is separated from the joint 315. At this time, the laser generator one 307 will contact the joint 315, and then the current can be passed through the laser generator one 307. At this time, the laser generator one 307 performs the cutting work. This design can automatically determine whether the laser generator needs to be replaced according to the height of the material stacking, and can automatically replace the laser generator with different powers when the laser generator needs to be replaced, thereby preventing the use of a laser generator with higher power when the height of the material stacking is low, resulting in energy waste.

[0047] The top of the sliding rod 207 is fixedly connected to the bottom of the traction rope 401, the top of the workbench 101 is fixedly connected to the top plate 406, the outer surface of the lifting plate 403 is slidably connected to the inner wall of the top plate 406, the top of the lifting plate 403 is fixedly connected to the limit plate 404, the outer surface of the limit plate 404 is slidably connected to the inner wall of the top plate 406, the bottom of the limit plate 404 is fixedly connected to the spring 6 405, the bottom of the spring 6 405 is fixedly connected to the inner wall of the top plate 406, when the sliding rod 207 moves downward, it will also pull the traction rope 401 downward, the traction rope 401 will drive the fixing ring 402 to move downward, and the fixing ring 40 2 will drive the two lifting plates 403 to move downward together, and compress the spring six 405 through the limit plate two 404. In the process of moving downward, the lifting plate 403 will drive the fixed block 306 to move downward as a whole, thereby moving the laser generator two 314 and the laser generator one 307 downward, so that the bottom of the laser generator two 314 or the laser generator one 307 can always keep a certain distance from the top of the material. This design can keep the bottom of the laser head at a suitable distance from the top of the material regardless of the height of the material stacking, so that the laser focus position can be controlled more accurately, thereby improving the cutting precision and accuracy.

[0048] The cutting method of the laser cutting equipment for semiconductor device processing comprises the following steps:

[0049] S1: When using the device, first move the device to a designated position, then stack the circular semiconductor material to be cut on the top of the workbench 101, then start the motor 102, the sliding plate 110 will drive the positioning plate 112 to move together, and the positioning plate 112 will position the material;

[0050] S2: When the sliding plate 110 is retracted into the sliding shell 107, the rope collecting roller 204 rotates to collect the rope, and the sliding rod 207 is pulled downward by the traction rope 1 205. The sliding rod 207 slides downward and drives the clamping plate 210 to move downward through the spring 3 211, and the upper surface of the material is clamped by the elastic force of the spring 3 211;

[0051] S3: The sliding rod 207 moves downward to drive the pressure rod 301 to move downward, thereby compressing the air and pushing the laser generator 307 downward through the thrust of the air to replace laser generators of different powers. During the downward movement of the sliding rod 207, it will also pull the traction rope 401 downward to move the laser generator 314 and the laser generator 307 downward, so that the bottom of the laser head always maintains a suitable distance from the top of the material.

[0052] A specific application of the present embodiment is: when using the present device, first move the present device to a specified position, then stack the circular semiconductor materials to be cut and place them on the top of the workbench 101, then start the motor 102, the motor 102 will drive the worm wheel 104 to rotate through the worm 103, the worm wheel 104 will drive the connecting rod 106 to rotate through the rotating plate 105, the connecting rod 106 will drive the sliding shell 107 to slide linearly under the limiting action of the limiting plate 108, the sliding shell 107 will drive the sliding plate 110 to move together through the spring 111, the sliding plate 110 will drive the positioning plate 112 to move together, when the positioning plate 112 contacts the material, it will push the material, and the three positioning plates 112 will work together to move the material. After the positioning is completed, as the sliding shell 107 continues to move, the sliding plate 110 will compress the spring 111 to retract into the sliding shell 107, and the elastic force of the spring 111 will continue to apply thrust to the material after the positioning is completed, so as to clamp and fix the material. This design can automatically position and clamp the material, and thus can quickly complete the positioning and clamping of the workpiece in a short time, shorten the production cycle, improve production efficiency, and reduce the intervention of human operation, which can reduce the error and inconsistency caused by human operation. In the process of the sliding plate 110 retracting into the sliding shell 107, it will drive the gear rod 202 to rotate through the rack 201, and the gear rod 202 will drive the rope collection roller 204 to rotate, and the rope collection roller 204 The rotation will wrap the traction rope 1 205 around the outer surface of the rope collection roller 204 to perform the rope collection work. It should be noted that the radius of the rope collection roller 204 is large enough. When the sliding plate 110 is retracted into the sliding shell 107, the rope collection roller 204 rotates to keep the traction rope 1 205 always in a taut state, and the rotation of the rope collection roller 204 can also pull the sliding rod 207 downward through the traction rope 1 205. The traction rope 1 205 is limited by the support plate 203 and the limiting wheel 206. The sliding rod 207 slides downward and drives the clamping plate 210 to move downward through the spring three 211. When the clamping plate 210 moves downward until it contacts the material, the sliding rod 207 continues to be pulled, and the clamping plate 210 compresses the spring three 211 and through the spring three 211 The elastic force clamps the upper surface of the material. When the spring three 211 is fully compressed, the motor 102 is controlled to stop rotating. At this time, the material is clamped. This design can clamp the material to be stacked and cut from the top downward, which can adapt to different stacking quantities. The downward clamping can effectively reduce the vibration and deformation of the material during the cutting process, which helps to maintain the stability and accuracy of the material during the cutting process. When the sliding rod 207 moves downward, it will drive the pressure rod 301 to move downward together. The downward movement of the pressure rod 301 will compress the air in the fixed box 302 and push the air into the air guide hose 1 303. The air guide hose 1 303 will pass the air into the air guide plate 304. The air guide plate 304 will pass the air into the air guide hose 2 305.The air guide hose 2 305 will pass air into the interior of the fixed block 306. The air passed into the fixed block 306 will accumulate therein and push the pressure plate 308 downward. The pressure plate 308 will give a downward thrust to the laser generator 1 307. At this time, the block 311 is stuck on the top of the limiting block 310, and the force given by the pressure plate 308 is not enough to make the block 311 compress the spring 5 312. Therefore, the laser generator 1 307 will not move. As the air passed into the fixed block 306 gradually increases, the air pressure therein will also increase. When the pressure rod 301 moves down to a certain position, at this time When the compressed air pressure is large enough, the block 311 will compress the spring 5 312 and shrink it into the laser generator 1 307. The pressure plate 308 will drive the laser generator 1 307 to move downward quickly for a distance. At this time, the block 311 will extend again and get stuck at the bottom of the limiting block 310. When the laser generator 1 307 moves downward, it will drive the laser generator 2 314 to move upward through the connecting rod 313, so that the laser generator 2 314 is separated from the joint 315. At this time, the laser generator 1 307 will contact the joint 315, and then the laser generator 1 307 can be powered. At this time, the cutting work is performed by the laser generator 307. This design can automatically determine whether the laser generator needs to be replaced according to the height of the material stack, and can automatically replace the laser generator with different powers when the laser generator needs to be replaced, thereby preventing the use of a high-power laser generator when the material stack height is low, causing energy waste. During the downward movement of the sliding rod 207, it will also pull the traction rope 401 downward, the traction rope 401 will drive the fixing ring 402 to move downward, and the fixing ring 402 will drive the two lifting plates 403 to move downward together. The lifting plate 403 moves and compresses the spring 6 405 through the limit plate 2 404. The lifting plate 403 drives the fixing block 306 to move downward as a whole, thereby moving the laser generator 2 314 and the laser generator 1 307 downward, so that the bottom of the laser generator 2 314 or the laser generator 1 307 can always keep a certain distance from the top of the material. This design can keep the bottom of the laser head at a suitable distance from the top of the material regardless of the height of the material stacking, so that the laser focus position can be controlled more accurately, thereby improving the precision and accuracy of cutting.

[0053] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A laser cutting device for semiconductor device processing, comprising a positioning assembly (1), the positioning assembly (1) comprising a workbench (101), a motor (102) being fixedly connected to the inner wall of the workbench (101), a worm (103) being fixedly connected to the output end of the motor (102), characterized in that: Also includes: A clamping assembly (2), the clamping assembly (2) comprising a rack (201) arranged on the top of the workbench (101), the top of the rack (201) being meshingly connected to a gear rod (202), the outer surface of the gear rod (202) being rotatably connected to a support plate (203); A switching assembly (3), the switching assembly (3) comprising a pressure rod (301) arranged on the top of the workbench (101), a fixing box (302) being slidably connected to the outer surface of the pressure rod (301), and a gas guide hose (303) being fixedly connected to a side of the fixing box (302) close to the rack (201); A following component (4), the following component (4) comprising a second traction rope (401) arranged on the top of the workbench (101), the top of the second traction rope (401) being fixedly connected to a fixing ring (402), and the top of the fixing ring (402) being fixedly connected to a lifting plate (403); The worm (103) is meshingly connected to a worm wheel (104) at the front side; the inner wall of the worm wheel (104) is rotatably connected to a rotating plate (105); the outer surface of the rotating plate (105) is rotatably connected to the inner wall of the workbench (101); the inner wall of the rotating plate (105) is rotatably connected to a connecting rod (106); the inner wall of the connecting rod (106) is rotatably connected to a sliding shell (107); the outer surface of the sliding shell (107) is slidably connected to the inner wall of the workbench (101); the outer surface of the sliding shell (107) is slidably connected to a limit plate One (108), the bottom of the limit plate one (108) is fixedly connected to the top of the workbench (101), the inner wall of the sliding shell (107) is slidably connected to a sliding plate (110), the sliding plate (110) is fixedly connected to a spring one (111) at a side away from the rotating plate (105), the spring one (111) is fixedly connected to the inner wall of the sliding shell (107) at one end away from the sliding plate (110), and the sliding plate (110) is fixedly connected to a positioning plate (112) at a side close to the rotating plate (105); The top of the sliding plate (110) is fixedly connected to the bottom of the rack (201), the outer surface of the sliding shell (107) is fixedly connected to the outer surface of the support plate (203), the outer surface of the gear rod (202) is fixedly connected to a rope collecting roller (204), the outer surface of the rope collecting roller (204) is fixedly connected to a traction rope 1 (205), the outer surface of the traction rope 1 (205) is slidably connected to the outer surface of the support plate (203), the outer surface of the traction rope 1 (205) contacts a limiting wheel (206), and the outer surface of the limiting wheel (206) is rotatably connected to the inner wall of the positioning plate (112); The traction rope 1 (205) is fixedly connected to a sliding rod (207) at one end away from the rope collecting roller (204), the bottom of the sliding rod (207) is fixedly connected to a spring 2 (208), the bottom of the spring 2 (208) is fixedly connected to a limiting ring (209), the outer surface of the limiting ring (209) is fixedly connected to the inner wall of the positioning plate (112), the inner wall of the sliding rod (207) is slidably connected to a clamping plate (210), the outer surface of the clamping plate (210) is sleeved with a spring 3 (211), the top of the spring 3 (211) is fixedly connected to the outer surface of the sliding rod (207), and the bottom of the spring 3 (211) is fixedly connected to the outer surface of the clamping plate (210); The outer surface of the sliding rod (207) is fixedly connected to the outer surface of the pressing rod (301); the fixing box (302) is fixedly connected to the side of the positioning plate (112) away from the rotating plate (105) on the side close to the rotating plate (105); the air guide hose 1 (303) is fixedly connected to the air guide plate (304) on the side away from the fixing box (302); the bottom of the air guide plate (304) is fixedly connected to the air guide hose 2 (305); the air guide hose 2 (305) is fixedly connected to the side away from the air guide plate (304); One end of the gas plate (304) is fixedly connected to a fixed block (306), the inner wall of the fixed block (306) is slidably connected to a laser generator (307), the left side of the laser generator (307) is fixedly connected to a pressure plate (308), the outer surface of the pressure plate (308) is slidably connected to the inner wall of the fixed block (306), the top of the pressure plate (308) is fixedly connected to a sealing plate (316), and the outer surface of the sealing plate (316) is slidably connected to the inner wall of the fixed block (306); The bottom of the pressure plate (308) is fixedly connected to a spring four (309), the bottom of the spring four (309) is fixedly connected to a limiting block (310), the left side of the limiting block (310) is fixedly connected to the left side of the inner wall of the fixed block (306), the inner wall of the laser generator one (307) is slidably connected to a clamping block (311), the bottom of the clamping block (311) is in contact with the top of the limiting block (310), the right side of the clamping block (311) is fixedly connected to a spring five (312), the spring five (312) ) The right side is fixedly connected to the inner wall of laser generator one (307), the back side of the fixed block (306) is rotatably connected to a connecting rod (313), the outer wall of the connecting rod (313) is slidably connected to the outer surface of laser generator one (307), the outer wall of the connecting rod (313) is slidably connected to laser generator two (314), the outer surface of laser generator two (314) is slidably connected to the inner wall of the fixed block (306), and the bottom of the fixed block (306) is fixedly connected to a joint (315); The top of the sliding rod (207) is fixedly connected to the bottom of the second traction rope (401); the top of the workbench (101) is fixedly connected to a top plate (406); the outer surface of the lifting plate (403) is slidably connected to the inner wall of the top plate (406); the top of the lifting plate (403) is fixedly connected to a second limiting plate (404); the outer surface of the second limiting plate (404) is slidably connected to the inner wall of the top plate (406); the bottom of the second limiting plate (404) is fixedly connected to a sixth spring (405); the bottom of the sixth spring (405) is fixedly connected to the inner wall of the top plate (406).

2. A cutting method using a laser cutting device for semiconductor device processing, using the laser cutting device for semiconductor device processing as claimed in claim 1, characterized in that: The following steps are included: S1: When using the device, the device is first moved to a designated position, and then the circular semiconductor material to be cut is stacked and placed on the top of the workbench (101), and then the motor (102) is started, and the sliding plate (110) drives the positioning plate (112) to move together, and the material is positioned by the positioning plate (112); S2: When the sliding plate (110) is retracted into the sliding shell (107), the rope collecting roller (204) rotates to collect the rope, and the sliding rod (207) is pulled downward by the traction rope (205). The sliding rod (207) slides downward, and the clamping plate (210) is driven to move downward by the spring (211), and the upper surface of the material is clamped by the elastic force of the spring (211); S3: The sliding rod (207) moves downward, driving the pressure rod (301) to move downward, thereby compressing the air and pushing the laser generator 1 (307) downward through the thrust of the air to replace the laser generators of different powers. During the downward movement of the sliding rod (207), it also pulls the traction rope 2 (401) downward to move the laser generator 2 (314) and the laser generator 1 (307) downward, so that the bottom of the laser head always maintains a suitable distance from the top of the material.

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