A chip test insulation test system

Abstract

The present invention discloses a chip test insulation test system, which relates to the field of semiconductor technology, including a conveying unit, a high-temperature heating detection unit, a heat preservation test unit, a non-contact heating and heat preservation unit and a cooling unit. The high-temperature heating detection unit stores a plurality of orderly arranged chips inside, and can heat the chips. The heat preservation test unit can detect the temperature of the chips during the conveying process, can directly heat the chips with too low temperature, and can perform performance test on the heated chips. The non-contact heating and heat preservation unit is installed on the upper part of the heat preservation test unit, and can heat the ambient temperature of the chip conveying path. The cooling unit can cool down multiple chips at one time in an air-cooled manner. The chip test insulation test system can jointly complete the performance test of the chip itself under high temperature conditions through the mutual cooperation of various units, and can perform performance test on a large number of chips with high efficiency.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a chip test insulation test system. Background Art

[0002] During the processing and production process of the chip, the chip will generate a lot of heat after it is put into use. The temperature of the chip itself will continue to remain at a high temperature. High temperature will affect the performance of the chip. Therefore, the chip needs to undergo performance testing before leaving the factory. This test requires that the chip be kept in a high temperature range from beginning to end.

[0003] In the prior art, the chip is first heated to a specified temperature, and then the chip heated to the specified temperature is transported to a test fixture for performance testing. Because the chip will lose heat when it comes out of the heating device and then into the test fixture, the specified temperature at which the heating device heats the chip at the beginning must be at least 5°C higher than the test temperature. In other words, if you want to test the performance of the chip at a temperature of 150°C, the actual specified temperature at which the heating device heats the chip is around 155°C. This method has many uncontrollable factors. For example, after the chip is heated to 155°C, due to different ambient temperatures, when it arrives at the test fixture, it may be lower than 150°C or between 150°C and 155°C, which has a great impact on the test results. Therefore, we propose a chip test insulation test system, which can keep the chip in an insulation state during transportation, thereby ensuring that the temperature of the chip is constant from the heating device to the test fixture. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a chip test insulation test system, which solves the problems raised by the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A chip test insulation test system, including a conveying unit, the conveying unit picks up the chip by adsorption, can intermittently drive the chip to rotate, and the angle of each rotation is fixed, around the conveying unit and arranged in sequence in a fixed direction:

[0006] A high temperature heating detection unit, wherein a plurality of orderly arranged chips are stored inside the high temperature heating detection unit and the chips can be heated;

[0007] A heat preservation test unit, which can detect the temperature of the chip during transportation, can directly heat the chip with too low temperature, and can perform performance test on the heated chip;

[0008] A non-contact heating and heat preservation unit, which is installed on the upper part of the heat preservation test unit and can heat the ambient temperature of the chip conveying path;

[0009] A cooling unit is provided, wherein the cooling unit can cool a plurality of chips at a time by means of air cooling.

[0010] Furthermore, the conveying unit includes a pneumatic spindle, which can be both extended and rotated. A driven frame is installed on the outside of the pneumatic spindle. The edge of the driven frame has multiple installation stations, and each installation station is correspondingly equipped with a material picking and placing air nozzle that can carry the chip.

[0011] Furthermore, the thermal insulation test unit includes an equipment box having a chip inlet and a chip outlet, a second infrared thermometer is installed inside the chip inlet, and a third infrared thermometer is installed inside the chip outlet.

[0012] Furthermore, the thermal insulation test unit also includes:

[0013] A contact heating and heat preservation mechanism, which is installed inside the equipment box, and the chip is placed in a heating station of the contact heating and heat preservation mechanism for heating treatment;

[0014] The performance test fixture is installed inside the equipment box, and a total of several groups of the performance test fixtures are provided, which can detect the performance of the chip under high temperature conditions.

[0015] Furthermore, the contact heating and heat preservation mechanism and the performance testing fixture are both located between infrared thermometer 2 and infrared thermometer 3, and according to the chip conveying path, the contact heating and heat preservation mechanism is located before the performance testing fixture, and the contact heating and heat preservation mechanism and the performance testing fixture are distributed in an arc shape.

[0016] Furthermore, the contact heating and insulation mechanism includes a base installed at the bottom end of the equipment box, a heat-conducting block is installed on the upper part of the base, a heat-conducting station capable of heating the chip is arranged on the upper part of the heat-conducting block, and a heating component is installed inside the heat-conducting block, and the heating component is in contact with the heat-conducting block.

[0017] Furthermore, the cooling unit includes a base two, a station switching drive motor is installed on the side of the base two, a driven turntable is installed on the driving end of the station switching drive motor, the station switching drive motor can intermittently drive the driven turntable to rotate, and the angle of rotation each time is the same, and a plurality of cooling stations capable of accommodating chips are arranged on the top of the driven turntable.

[0018] Furthermore, a wind deflector is installed at the top of the base 2, and a plurality of air supply channels are opened through the interior of the wind deflector, and an air nozzle is installed at the entrance of each air supply channel.

[0019] Furthermore, the station switching drive motor, driven turntable, and air guide cover are all tilted and have the same inclination angle, and the chip carrying surface inside each cooling station is horizontally arranged.

[0020] Furthermore, the positions of the plurality of air supply channels correspond one-to-one to the positions of the plurality of cooling stations, and the air blowing nozzle can blow the airflow directly onto the surface of the chip contained in the cooling station.

[0021] The present invention provides a chip test insulation test system. Compared with the prior art, it has the following beneficial effects:

[0022] 1. The chip test insulation test system, through the cooperation of the conveying unit, high-temperature heating detection unit, insulation test unit, non-contact heating insulation unit and cooling unit, can jointly complete the performance test of the chip itself under high temperature conditions, and can perform performance tests on large quantities of chips with high efficiency.

[0023] 2. The chip test insulation test system can heat the chip itself through the insulation test unit, and the non-contact heating insulation unit can heat the ambient temperature of the chip conveying path. Both heating methods can ensure that the temperature of the chip is always kept within the set temperature range during the conveying process and before the test, preventing the test results from being affected by the temperature drop of the chip during the conveying process.

[0024] 3. The chip test insulation test system can quickly cool down the tested chip by air cooling through the cooling unit, and the structure of the cooling unit adopts multi-station cooling, which can cool down multiple chips at the same time. During the cooling process, the air guide hood can quickly diffuse the airflow and increase the cooling speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention;

[0026] Figure 2 This is a schematic diagram of the non-contact heating and heat preservation unit of the present invention being installed on the upper part of the heat preservation test unit;

[0027] Figure 3 It is a structural schematic diagram of the conveying unit in the present invention;

[0028] Figure 4 It is a structural schematic diagram of the thermal insulation test unit in the present invention;

[0029] Figure 5 It is a structural schematic diagram of the contact heating and heat preservation mechanism in the present invention;

[0030] Figure 6 It is a structural schematic diagram of the cooling unit in the present invention;

[0031] Figure 7 It is a structural schematic diagram of the high temperature heating detection unit in the present invention;

[0032] Figure 8 This is a schematic diagram of the movable seat of the present invention being installed on the upper part of the linear drive module;

[0033] Fig. 9 It is a structural schematic diagram of the rotary motion mechanism in the present invention;

[0034] Fig.10 This is a schematic diagram of the disassembly of the high temperature heating turntable of the present invention;

[0035] Fig.11 It is a schematic diagram of the disassembly of the non-contact heating and heat preservation unit in the present invention;

[0036] Fig.12 It is a schematic diagram of the assembly of the non-contact heating and heat preservation unit of the present invention;

[0037] Fig.13 It is a schematic diagram of the structure of the heat conduction track in the present invention.

[0038] In the figure: 1. conveying unit; 11. pneumatic spindle; 12. driven frame; 13. material taking and discharging nozzle; 2. high temperature heating detection unit; 21. linear drive module; 211. movable seat; 22. rotary motion mechanism; 221. base plate; 222. roller; 223. roller ring; 224. driven synchronous wheel; 225. rotary drive motor; 226. active synchronous wheel; 227. synchronous belt; 228. synchronous belt tensioning adjustment wheel; 23. high temperature heating turntable; 231. heat insulation board; 232. ceramic heating plate; 233. heating tube; 234. thermocouple; 235. heat insulation ring; 236. retaining ring; 237. material storage turntable; 238. turntable cover; 239. product taking and discharging hole; 2310. heat insulation cover; 25. infrared thermometer 1; 26. laser sensor; 261. Bracket; 3. Insulation test unit; 31. Equipment box; 32. Infrared thermometer 2; 33. Infrared thermometer 3; 34. Contact heating and insulation mechanism; 341. Base 1; 342. Heat transfer block; 343. Heat transfer station; 344. Heating component 1; 35. Performance test fixture; 4. Non-contact heating and insulation unit; 41. Base 1; 42. Upper cover; 43. Heat transfer track; 431. Track groove; 432. Heat transfer initial protrusion; 433. Mounting hole 1; 434. Mounting hole 2; 44. Heating component 2; 45. Detection component; 46. Base 2; 461. Reserved groove; 47. Side cover; 5. Cooling unit; 51. Base 2; 52. Station switching drive motor; 53. Driven turntable; 54. Cooling station; 55. Wind deflector; 56. Air blowing nozzle. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See also Figure 1 , 2The present invention provides a technical solution: a chip test insulation test system, which consists of a conveying unit 1, a high-temperature heating detection unit 2, a heat preservation test unit 3, a non-contact heating and heat preservation unit 4 and a cooling unit 5, wherein the high-temperature heating detection unit 2, the heat preservation test unit 3, the non-contact heating and heat preservation unit 4 and the cooling unit 5 are arranged around the conveying unit 1, and the distribution order between them is based on the processing flow of the chip test. The conveying unit 1 picks up the chip by adsorption, and can drive the chip to rotate intermittently, and the angle of each rotation is fixed. The high-temperature heating detection unit 2 stores a plurality of orderly arranged chips inside and can heat the chips. The heat preservation test unit 3 can detect the temperature of the chip during the conveying process, can directly heat the chip with too low temperature, and can perform performance test on the heated chip. The non-contact heating and heat preservation unit 4 is installed on the upper part of the heat preservation test unit 3, and can heat the ambient temperature of the chip conveying path. The cooling unit 5 can cool multiple chips at one time in an air-cooling manner.

[0041] The chip test insulation test system can jointly complete the test of the performance of the chip itself under high temperature conditions through the mutual cooperation of the conveying unit 1, the high-temperature heating detection unit 2, the insulation test unit 3, the non-contact heating and insulation unit 4 and the cooling unit 5. In addition, the insulation test unit 3 can heat the chip itself, and the non-contact heating and insulation unit 4 can heat the ambient temperature of the chip conveying path. Both heating methods can ensure that the temperature of the chip is always maintained within the set temperature range during the conveying process and before the detection, so as to prevent the test results from being affected by the temperature drop of the chip during the conveying process.

[0042] See also Figure 3 The conveying unit 1 includes a pneumatic spindle 11, which can be both retracted and rotated. A driven frame 12 is installed on the outside of the pneumatic spindle 11. The edge of the driven frame 12 has multiple installation stations, and each installation station is correspondingly installed with a material taking and placing air nozzle 13 that can carry chips.

[0043] When the conveying unit 1 is working, the pneumatic spindle 11 is a common device in the prior art, so the specific structure of the pneumatic spindle 11 and the principle of how to achieve extension and rotation are not described in detail here. The pneumatic spindle 11 can drive the driven frame 12 to rotate intermittently, and the driven frame 12 drives several picking and discharging air nozzles 13 to perform intermittent rotational motion synchronously, and the picking and discharging air nozzles 13 have the same angle of rotation each time, that is, after rotating a fixed angle in one direction, the next picking and discharging air nozzle 13 can replace the position of the previous picking and discharging air nozzle 13, and the picking and discharging air nozzle 13 can pick up the chip to be tested from the feed outlet of the high-temperature heating detection unit 2.

[0044] See also Figure 4 , 5 The heat preservation test unit 3 includes an equipment box 31, which has a chip inlet and a chip outlet. An infrared thermometer 2 32 is installed inside the chip inlet, and an infrared thermometer 3 33 is installed inside the chip outlet. The heat preservation test unit 3 also includes a contact heating and heat preservation mechanism 34 and a performance test fixture 35. The contact heating and heat preservation mechanism 34 is installed inside the equipment box 31. The chip will be placed in the heating station of the contact heating and heat preservation mechanism 34 for heating treatment. The performance test fixture 35 is installed inside the equipment box 31, and a total of several groups are set up to detect the performance of the chip under high temperature conditions. The contact heating and heat preservation mechanism 3 4. The performance test fixtures 35 are located between the infrared thermometer 2 32 and the infrared thermometer 33, and according to the chip conveying path, the contact heating and insulation mechanism 34 is located before the performance test fixture 35, and the contact heating and insulation mechanism 34 and the performance test fixture 35 are distributed in an arc shape; wherein, the contact heating and insulation mechanism 34 includes a base 341 installed at the bottom end of the equipment box 31, a heat conductive block 342 is installed on the upper part of the base 341, a heat conductive station 343 capable of heating the chip is arranged on the upper part of the heat conductive block 342, and a heating component 344 is installed inside the heat conductive block 342, and the heating component 344 is in contact with the heat conductive block 342.

[0045] When the insulation test unit 3 is working, when the conveying unit 1 carries multiple chips to be tested and rotates to the position of the infrared thermometer 2 32, the infrared thermometer 2 32 detects the temperature of the chip at this position. If the temperature of the chip does not meet the test requirements and needs secondary heating, the conveying unit 1 will place the chip on the contact heating and insulation mechanism 34. After the heating component 1 344 works, heat is generated. The heat is transferred to the heat conduction block 342, and then to the heat conduction station 343, and finally to the chip, so as to achieve secondary heating of the chip. After the temperature of the chip meets the test requirements, the conveying unit 1 places the chip in the test station of the performance test fixture 35 (the performance test fixture 35 is a well-known technology in the field and will not be described in detail here), and the performance test fixture 35 will detect the performance of the chip under high temperature conditions.

[0046] See also Figure 6The cooling unit 5 includes a base 51, a station switching drive motor 52 is installed on the side of the base 51, and a driven turntable 53 is installed on the driving end of the station switching drive motor 52. The station switching drive motor 52 can intermittently drive the driven turntable 53 to rotate, and the angle of each rotation is the same. A plurality of cooling stations 54 that can accommodate chips are arranged on the top of the driven turntable 53. A guide air cover 55 is installed on the top of the base 51. A plurality of air supply channels are opened inside the guide air cover 55. A blowing nozzle 56 is installed at the entrance of each air supply channel. The station switching drive motor 52, the driven turntable 53, and the guide air cover 55 are all inclined, and the inclination angle is the same. The chip carrying surface inside each cooling station 54 is horizontally arranged. The positions of the plurality of air supply channels correspond to the positions of the plurality of cooling stations 54 one by one. The blowing nozzle 56 can blow the airflow directly onto the surface of the chip accommodated inside the cooling station 54.

[0047] When the cooling unit 5 is working, after the performance test of the chip is completed, the conveying unit 1 will place the tested chip in several cooling stations 54. After the high-temperature chip is located in the cooling station 54, the blowing nozzle 56 will blow air to the chip. The guide wind hood 55 covers the upper part of the several cooling stations 54. The guide wind hood 55 only reserves a notch for taking and placing the chip. The airflow takes away the temperature of the chip to achieve cooling. After the chip is cooled, the station switching drive motor 52 rotates the cooled chip to the notch of the guide wind hood 55, and the conveying unit 1 takes away the cooled chip, and then the conveying unit 1 places the cooled chip in the cooling station 54 where the chip was taken away before, and the cycle is repeated in sequence.

[0048] See also Figure 7 , 8 , 9, 10, the high temperature heating detection unit 2 includes a linear drive module 21, a rotary motion mechanism 22, a high temperature heating turntable 23, an infrared thermometer 25 and a laser sensor 26, wherein the upper portion of the linear drive module 21 has a movable seat 211, the movable seat 211 is driven by a linear motor built in the linear drive module 21 (using the existing technology, which will not be described in detail here), the rotary motion mechanism 22 is installed on the top of the movable seat 211, and the linear drive module 21 can drive the rotary motion mechanism 22 to move back and forth horizontally through the movable seat 211, The driving source of the rotary motion mechanism 22 is a synchronous belt transmission structure, and the high-temperature heating turntable 23 is installed on the top of the rotary motion mechanism 22. The rotary motion mechanism 22 can drive the high-temperature heating turntable 23 to rotate, and the high-temperature heating turntable 23 can heat multiple electronic components inside. The infrared thermometer 25 is located above the high-temperature heating turntable 23, and the detection end of the infrared thermometer 25 corresponds to the electronic component pick-up and placement position. The laser sensor 26 is located above the high-temperature heating turntable 23, and the electronic component pick-up and placement position is set on the laser path of the laser sensor 26;

[0049] In order to facilitate the installation of the laser sensor 26 and the infrared thermometer 25 above the high-temperature heating turntable 23, two brackets 261 are installed on the side of the linear drive module 21. The top of one bracket 261 is installed with the transmitting end of the laser sensor 26, and the top of the other bracket 261 is installed with the receiving end of the laser sensor 26. In addition, the infrared thermometer 25 is also installed on the top of one of the brackets 261.

[0050] The rotary motion mechanism 22 includes a base plate 221 mounted on the top of the movable seat 211, a plurality of rollers 222 are mounted on the top of the base plate 221, and a roller ring 223 is supported on the inner side of the plurality of rollers 222. The rollers 222 and the roller ring 223 can rotate relative to each other, and the edges of the rollers 222 and the roller ring 223 are both complementary "V" shaped structures. The synchronous belt transmission structure includes a driven synchronous wheel 224 mounted on the top of the roller ring 223, and a rotary drive motor 22 mounted on the bottom of the base plate 221. 5. The driving end of the rotary drive motor 225 extends to the top of the base plate 221 and is installed with an active synchronous wheel 226. The active synchronous wheel 226 and the driven synchronous wheel 224 are connected to a synchronous belt 227. The top of the base plate 221 is also installed with a plurality of synchronous belt tensioning adjustment wheels 228. The synchronous belt 227 is located on the inner side of the plurality of synchronous belt tensioning adjustment wheels 228. By adjusting the position of the synchronous belt tensioning adjustment wheel 228, the synchronous belt 227 is squeezed together, so that the synchronous belt 27 can be tightened.

[0051] When the rotary motion mechanism 22 is working, the rotary drive motor 225 drives the active synchronous wheel 226 to rotate, and the active synchronous wheel 226 drives the driven synchronous wheel 224 to rotate synchronously through the synchronous belt 227. During the rotation of the driven synchronous wheel 224, the plurality of rollers 222 will also rotate synchronously in the opposite direction, and the driven synchronous wheel 224 will also drive the entire high-temperature heating turntable 23 to rotate synchronously.

[0052] The high temperature heating turntable 23 includes a heat insulation plate 231, a ceramic heating plate 232 is installed on the top of the heat insulation plate 231, a vortex line shaped heating tube 233 is installed on the bottom of the ceramic heating plate 232, and a thermocouple 234 is also installed inside the ceramic heating plate 232. A storage turntable 237 is installed on the top of the ceramic heating plate 232, and a retaining ring 236 can transfer heat to the storage turntable 237. A plurality of station slots for placing electronic components are reserved inside the storage turntable 237. A heat insulating ring 235 and a retaining ring 236 are stacked on the upper part of the heating disk 232. A material storage turntable 237 is located inside the retaining ring 236. A turntable cover 238 is installed on the top of the retaining ring 236. A product taking and placing hole 239 is reserved inside the turntable cover 238. Through the product taking and placing hole 239, the material taking and placing nozzle 13 can pick up or place the electronic components in the station slot. The outermost layer of the high-temperature heating turntable 23 is provided with a heat insulating cover 2310, which is installed on the substrate 221.

[0053] When the high-temperature heating turntable 23 is working, the heating tube 233 emits heat, which is transferred to the ceramic heating disk 232. During the heating process, the thermocouple 234 monitors the temperature value of the ceramic heating disk 232 in real time. The ceramic heating disk 232 then transfers the heat to the storage turntable 237. Several electronic components are placed in the work station slots in the storage turntable 237. The storage turntable 237 finally transfers the heat to the electronic components.

[0054] See also Fig.11 , 12 13. The non-contact heating and heat preservation unit 4 is composed of a base 1 41, an upper cover 42, a heat-conducting track 43, a heating component 2 44, a detection component 45, a base 2 46 and a side cover 47, wherein the upper cover 42 and the heat-conducting track 43 are respectively mounted on the base 1 41 and the base 2 46, and the heat-conducting track 43 is an integrally formed structure. During the forming process, a track groove 431 is automatically formed inside the heat-conducting track 43, and a heat-conducting initial protrusion 432 is automatically formed on the edge, and a mounting hole 1 433 and a mounting hole 2 434 are automatically formed inside the heat-conducting initial protrusion 432. During the conveying and heat preservation process, the chip will be located in the track groove 431;

[0055] In addition, the upper cover plate 42 and the second base 46 are both made of materials with low thermal conductivity, such as ceramics, plastics, etc., and the base 1 41 is not in contact with the thermal conductive track 43. Similarly, in order to achieve the best heat conduction effect, the thermal conductive track 43 is made of a material with high thermal conductivity, preferably copper. A reserved groove 461 is opened inside the second base 46, and the initial heat conductive protrusion 432 is fixed inside the reserved groove 461. The side cover plate 47 is installed at the end of the second base 46. The initial heat conductive protrusion 432 and the side cover plate 47 are both reserved with mounting holes 1 433 and 2 434. The heating component 2 44 and the detection component 45 are respectively fixed inside the mounting holes 1 433 and 2 434. The heating component 1 344 and the heating component 2 44 are both electric heating structures, preferably electric heating tubes. The detection component 45 is a temperature sensor, and the electric heating tube and the temperature sensor are both in contact with the initial heat conductive protrusion 432.

[0056] During the operation of the heating unit mold, the electric heating tube first emits heat, which is then quickly transferred to the heat-conducting initial protrusion 432, and then quickly transferred to other areas of the heat-conducting track 43, so that the temperature of the entire heat-conducting track 43 rises rapidly. During the heating process of the electric heating tube, the temperature sensor monitors the heating temperature. When the temperature of the heat-conducting track 43 reaches the set temperature, the chip is moved in the track groove 431 through an external air nozzle (not shown in the figure). The heat-conducting track 43 will increase the ambient temperature around the chip, ensuring that the temperature of the chip will not drop suddenly during transportation, thereby achieving the heat preservation effect of the chip during transportation.

[0057] When the chip test insulation test system is working, the chip to be tested is initially placed in order in the high-temperature heating detection unit 2. After the high-temperature heating detection unit 2 heats the chip to be tested for the first time, the conveying unit 1 takes the chip away and conveys the chip to the position of the insulation test unit 3. During the conveying process, the non-contact heating and insulation unit 4 always keeps the ambient temperature on the chip conveying path warm to prevent the chip's own temperature from dissipating too quickly after the first heating. When the chip is conveyed to the position of the insulation test unit 3, the insulation test unit 3 will first detect the temperature of the chip. The chip that does not meet the detection temperature will be heated for the second time by the insulation test unit 3. After being heated to meet the requirements, a performance surface test will be performed. The tested chip is placed by the conveying unit 1 inside the cooling unit 5 for air cooling. The cooled chip is then conveyed by the conveying unit 1 to the discharge station.

Claims

1. A chip test insulation test system, comprising a conveying unit (1), characterized in that: The conveying unit (1) picks up the chip by adsorption and can intermittently drive the chip to rotate, and the angle of each rotation is fixed. The following are arranged in sequence around the conveying unit (1) in a fixed direction: A high temperature heating detection unit (2), wherein a plurality of orderly arranged chips are stored inside the high temperature heating detection unit (2) and the chips can be heated; A heat preservation test unit (3), the heat preservation test unit (3) being capable of detecting the temperature of the chip during the transportation process, being capable of directly heating a chip with a temperature that is too low, and being capable of performing a performance test on the heated chip; A non-contact heating and heat preservation unit (4), wherein the non-contact heating and heat preservation unit (4) is installed on the upper part of the heat preservation test unit (3) and is capable of heating the ambient temperature of the chip conveying path; A cooling unit (5), wherein the cooling unit (5) is capable of cooling a plurality of chips at a time by means of air cooling; The heat preservation test unit (3) comprises an equipment box (31), wherein the equipment box (31) has a chip inlet and a chip outlet, a second infrared thermometer (32) is installed inside the chip inlet, and a third infrared thermometer (33) is installed inside the chip outlet; The thermal insulation testing unit (3) further comprises: A contact heating and heat preservation mechanism (34), wherein the contact heating and heat preservation mechanism (34) is installed inside the equipment box (31), and the chip is placed in a heating station of the contact heating and heat preservation mechanism (34) for heating treatment; A performance test fixture (35), wherein the performance test fixture (35) is installed inside the equipment box (31), and a total of several sets of the performance test fixtures (35) are provided, and are capable of detecting the performance of the chip under a high temperature state; The contact heating and heat preservation mechanism (34) and the performance test fixture (35) are both located between the second infrared thermometer (32) and the third infrared thermometer (33), and according to the chip conveying path, the contact heating and heat preservation mechanism (34) is located before the performance test fixture (35), and the contact heating and heat preservation mechanism (34) and the performance test fixture (35) are distributed in an arc shape; The contact heating and heat preservation mechanism (34) comprises a base (341) installed at the bottom end of the equipment box (31), a heat conduction block (342) is installed on the top of the base (341), a heat conduction station (343) capable of heating the chip is arranged on the top of the heat conduction block (342), and a heating component (344) is installed inside the heat conduction block (342), and the heating component (344) is in contact with the heat conduction block (342); The high temperature heating detection unit (2) comprises a linear drive module (21), a rotary motion mechanism (22), a high temperature heating turntable (23), an infrared thermometer (25) and a laser sensor (26); The non-contact heating and heat preservation unit (4) is composed of a base one (41), an upper cover plate (42), a heat conduction track (43), a heating component two (44), a detection component (45), a base two (46) and a side cover plate (47), wherein the upper cover plate (42) is mounted on the base one (41), the heat conduction track (43) is mounted on the base two (46), and the heat conduction track (43) is an integrally formed structure. During the forming process, a track groove (431) is automatically formed inside the heat conduction track (43), and a heat conduction initial protrusion (432) is automatically formed at the edge. A mounting hole one (433) and a mounting hole two (434) are automatically formed inside the heat conduction initial protrusion (432). During the conveying and heat preservation process, the chip is located in the track groove (431); A reserved groove (461) is provided inside the second base (46), the heat-conducting initial protrusion (432) is fixed inside the reserved groove (461), the side cover plate (47) is installed at the end of the second base (46), the heat-conducting initial protrusion (432) and the side cover plate (47) are both reserved with a first mounting hole (433) and a second mounting hole (434), the second heating component (44) is fixed inside the first mounting hole (433), and the detection component (45) is fixed inside the second mounting hole (434).

2. A chip test insulation test system according to claim 1, characterized in that: The conveying unit (1) comprises a pneumatic spindle (11), the pneumatic spindle (11) being both retractable and rotatable, a driven frame (12) being mounted on the outside of the pneumatic spindle (11), the edge of the driven frame (12) being provided with a plurality of mounting stations, each mounting station being provided with a corresponding pick-up and place air nozzle (13) capable of carrying a chip.

3. A chip test insulation test system according to claim 1, characterized in that: The cooling unit (5) comprises a second base (51), a station switching drive motor (52) is installed on the side of the second base (51), a driven turntable (53) is installed on the driving end of the station switching drive motor (52), the station switching drive motor (52) can intermittently drive the driven turntable (53) to rotate, and each rotation angle is the same, and a plurality of cooling stations (54) capable of accommodating chips are arranged on the top of the driven turntable (53).

4. A chip test insulation test system according to claim 3, characterized in that: A guide air cover (55) is installed at the top of the second base (51), and a plurality of air supply channels are provided through the interior of the guide air cover (55), and an air nozzle (56) is installed at the entrance of each air supply channel.

5. A chip test insulation test system according to claim 4, characterized in that: The station switching drive motor (52), the driven turntable (53), and the air guide cover (55) are all arranged tilted and have the same inclination angle, and the chip carrying surface inside each cooling station (54) is arranged horizontally.

6. A chip test insulation test system according to claim 5, characterized in that: The positions of the plurality of air supply channels correspond one to one with the positions of the plurality of cooling stations (54), and the air blowing nozzle (56) can blow the air flow directly onto the surface of the chip contained inside the cooling station (54).

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