Electrochemical mechanical polishing control method and device

Abstract

The embodiment of the present invention relates to the technical field of metal polishing, and discloses an electrochemical mechanical polishing control method, including: sending a spray signal to a polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of a workpiece to be polished; sending a driving signal to a polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished; controlling a power supply to output a polishing voltage to perform electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V, and electrochemical polishing is performed on the polishing surface of the workpiece to be polished while the workpiece to be polished is mechanically polished. In the electrochemical mechanical polishing control method of the embodiment of the present invention, electrochemical polishing is performed while mechanical polishing is performed, and the two can promote each other; selecting a polishing voltage setting higher than the passivation voltage can ensure that the two functions are performed simultaneously and efficiently, thereby obtaining a better overall polishing effect.

Description

Technical Field

[0001] The invention relates to the technical field of metal polishing, and in particular to an electrochemical mechanical polishing control method and device. Background Art

[0002] At present, in order to obtain smoother and brighter plates, manufacturers generally rely on polishing machines for processing, among which five-axis polishing machines are particularly common. This type of equipment uses the circumference of the polishing wheel to polish the workpiece. Although it can achieve the expected polishing effect to a certain extent and has a relatively high polishing efficiency (this is mainly due to the large area of ​​the circumference of the polishing wheel), it also has certain limitations.

[0003] Existing electrochemical polishing is generally divided into two types. One is to treat the workpiece surface purely by electrochemical means. This method has low efficiency and poor surface finish treatment effect. The other is a method of combining electrochemical and mechanical polishing. This method has greatly improved efficiency and better surface finish treatment effect.

[0004] Electrochemical combined with mechanical polishing is currently a common way to improve the polishing effect, but there are still some problems with the existing electrochemical combined with mechanical polishing: 1. The electrochemical parameters and mechanical parameters need to be debugged multiple times through experience before they can be implemented, which requires a large amount of work in the early stage, and the polishing time is relatively long; 2. When some parameters are actively or passively adjusted, the polishing effect will deteriorate, and other parameters cannot be adaptively adjusted to adapt to the active or passive adjustment of some parameters; 3. The polishing time of a single workpiece is relatively long. Therefore, designing a solution that can improve the polishing efficiency while ensuring the polishing effect has become a technical problem that technicians in this field need to solve urgently. Summary of the invention

[0005] In view of the above-mentioned defects, an embodiment of the present invention discloses an electrochemical mechanical polishing control method, which combines mechanical polishing with electrochemical polishing to improve the polishing effect and efficiency.

[0006] The first aspect of the embodiment of the present invention discloses an electrochemical mechanical polishing control method, comprising:

[0007] Sending a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished;

[0008] Sending a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished;

[0009] The power supply is controlled to output a polishing voltage for electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V. The polishing surface of the workpiece to be polished is electrochemically polished while the workpiece to be polished is mechanically polished. During the electrochemical polishing process, the workpiece to be polished is used as the anode and the polishing wheel is used as the cathode.

[0010] As an optional implementation, in the first aspect of the embodiment of the present invention, the pH value of the polishing liquid is any value between 8 and 10, and the temperature of the polishing liquid is any value between 20 and 45.

[0011] As an optional implementation, in the first aspect of the embodiment of the present invention, the sending of a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished also includes:

[0012] A spray control signal is sent to the polishing spray device to control the polishing spray device to spray the polishing liquid according to a set direction, a set angle and a set pressure so as to spray or soak the polishing liquid on the surface of the workpiece to be polished. The set angle is the angle between the spray direction of the spray head and the polishing plane.

[0013] As an optional implementation, in the first aspect of the embodiment of the present invention, the rotation axis of the polishing wheel is parallel to the plane to be polished; the sending of a driving signal to the polishing wheel to drive the polishing wheel to mechanically polish the workpiece to be polished comprises:

[0014] A driving signal is sent to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished according to a set travel path; wherein the rotation direction of the polishing wheel is the same as the travel direction of the polishing wheel.

[0015] As an optional embodiment, in the first aspect of the embodiment of the present invention, in the electrochemical polishing process, the initial contact position between the spray liquid sprayed by the polishing spray device and the workpiece to be polished is behind the contact point between the polishing wheel and the workpiece to be polished; the travel path of the polishing spray device is the same as the mechanical polishing path of the polishing wheel.

[0016] As an optional implementation, in the first aspect of the embodiment of the present invention, the controlling power supply to output a polishing voltage to perform an electrochemical polishing process includes:

[0017] Obtain the pressure value of the polishing wheel on the workpiece to be polished, as well as the speed of the motor or the speed of the polishing wheel;

[0018] According to the pressure value and the rotation speed, the polishing voltage value is calculated based on the polishing voltage formula; the polishing voltage formula is: ; Among them, U0 is the polishing voltage value, is the relationship coefficient, F is the pressure value, V is the rotation speed, and R is the load size during electrochemical polishing;

[0019] The power supply is controlled to output the polishing voltage as the polishing voltage to perform electrochemical polishing processing.

[0020] As an optional implementation manner, in the first aspect of the embodiment of the present invention, the polishing control method further includes:

[0021] Determine the polishing stage to which the current electrochemical mechanical polishing belongs according to the current polishing state information, wherein the polishing stages are divided into a rough polishing stage, a medium polishing stage and a fine polishing stage in order of polishing time;

[0022] When it is detected that the current stage is rough polishing, a first spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid on the surface of the workpiece to be polished according to the first spray pressure;

[0023] When it is detected that the workpiece is currently in the middle polishing stage, a second spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid on the surface of the workpiece to be polished according to the second spray pressure;

[0024] When it is detected that the current stage is fine polishing, a third spray signal is sent to the polishing spray device so that the polishing spray device soaks the polishing liquid in the surface of the workpiece to be polished according to the third spray pressure, wherein the first spray pressure, the second spray pressure and the third spray pressure are reduced successively.

[0025] A second aspect of an embodiment of the present invention discloses an electrochemical mechanical polishing control device, comprising:

[0026] The first sending module is used to send a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished;

[0027] The second sending module is used to send a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished;

[0028] Control module: used to control the power supply to output a polishing voltage for electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V, and electrochemically polishes the polished surface of the workpiece to be polished while mechanically polishing the workpiece to be polished. During the electrochemical polishing process, the workpiece to be polished is used as the anode and the polishing wheel is used as the cathode.

[0029] The third aspect of an embodiment of the present invention discloses an electronic device, comprising: a memory storing executable program code; a processor coupled to the memory; the processor calls the executable program code stored in the memory to execute the electrochemical mechanical polishing control method disclosed in the first aspect of the embodiment of the present invention.

[0030] A fourth aspect of an embodiment of the present invention discloses a computer-readable storage medium storing a computer program, wherein the computer program enables a computer to execute the electrochemical mechanical polishing control method disclosed in the first aspect of an embodiment of the present invention.

[0031] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0032] The electrochemical mechanical polishing control method in the embodiment of the present invention performs electrochemical polishing at the same time as mechanical polishing, and the two can promote each other. Mechanical polishing removes surface materials through physical action, while electrochemical polishing further smoothes the surface through electrochemical reaction; and selecting a polishing voltage setting higher than the passivation voltage can ensure that the two actions are carried out efficiently at the same time, thereby obtaining a better overall polishing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 It is a schematic flow chart of the electrochemical mechanical polishing control method disclosed in an embodiment of the present invention;

[0035] Figure 2 It is a schematic diagram of a process for determining a polishing voltage disclosed in an embodiment of the present invention;

[0036] Figure 3 It is a schematic diagram of a process for determining the polishing stage disclosed in an embodiment of the present invention;

[0037] Figure 4 is a schematic structural diagram of an electrochemical mechanical polishing control device provided by an embodiment of the present invention;

[0038] Figure 5 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be noted that the terms "first", "second", "third", "fourth", etc. in the specification and claims of the present invention are used to distinguish different objects rather than to describe a specific order. The terms "including" and "having" in the embodiments of the present invention and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0041] The existing electrochemical polishing is generally divided into two types. One is to treat the workpiece surface purely by electrochemical means. This method has low efficiency and poor surface finish treatment effect. The other is electrochemical combined with mechanical polishing. This method has greatly improved efficiency and better surface finish treatment effect. The use of electrochemical combined with mechanical polishing is currently a common implementation method to improve the polishing effect, but the existing electrochemical combined with mechanical polishing still has some problems: 1. The electrochemical parameters and mechanical parameters need to be debugged many times through experience before they can be implemented. A large amount of work is required in the early stage, and the polishing time is relatively long; 2. When some parameters are actively or passively adjusted, the polishing effect will deteriorate, and other parameters cannot be adaptively adjusted to adapt to some parameters that are actively or passively adjusted; 3. The polishing time of a single workpiece is relatively long. Based on this, the embodiment of the present invention discloses an electrochemical mechanical polishing control method, device, electronic device and storage medium, which can promote each other by performing electrochemical polishing at the same time as mechanical polishing. Mechanical polishing removes surface material through physical action, while electrochemical polishing further smoothes the surface through electrochemical reaction; and choosing a polishing voltage setting higher than the passivation voltage can ensure that these two actions are carried out efficiently at the same time, thereby obtaining a better overall polishing effect.

[0042] Embodiment 1

[0043] See also Figure 1 , Figure 1It is a flow chart of the electrochemical mechanical polishing control method disclosed in the embodiment of the present invention. Among them, the execution subject of the method described in the embodiment of the present invention is an execution subject composed of software and / or hardware, and the execution subject can receive relevant information by wired or / and wireless means, and can send certain instructions. Of course, it can also have certain processing functions and storage functions. The execution subject can control multiple devices, such as a remote physical server or cloud server and related software, or it can be a local host or server and related software that performs related operations on a device placed somewhere. In some scenarios, multiple storage devices can also be controlled, and the storage devices can be placed in the same place or different places as the devices. For example Figure 1 As shown, the electrochemical mechanical polishing control method includes the following steps:

[0044] S101: Sending a spray signal to a polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished;

[0045] S102: Sending a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished;

[0046] S103: Control the power supply to output a polishing voltage for electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V, and electrochemically polish the polishing surface of the workpiece to be polished while mechanically polishing the workpiece to be polished. During the electrochemical polishing process, the workpiece to be polished serves as an anode and the polishing wheel serves as a cathode.

[0047] In the present invention, an organic combination of mechanical polishing and chemical polishing is adopted, which can integrate the advantages of both mechanical and electrochemical polishing processes, and utilize the "peak clipping" effect of electrochemistry on the microstructure on the basis of mechanical polishing to further improve the flatness and brightness of the metal workpiece to be polished; in addition, on the one hand, the solid particles generated by mechanical polishing will have a smaller particle size due to the effect of electrochemical corrosion, and on the other hand, the polishing liquid can also wrap most of the solid particles, greatly reducing the damage of the particles generated by mechanical polishing to the polishing surface of the workpiece due to splashing; and, with the reduction of the amount of particles generated by polishing and the reduction of particle size, the service life of the polishing wheel is also greatly improved.

[0048] The workpiece to be polished in the embodiment of the present invention is a metal workpiece, which can be a workpiece made of a single metal material or a workpiece made of an alloy material (such as an aluminum alloy workpiece or a magnesium alloy workpiece). Of course, the metal workpiece in the present invention does not require that the material of the workpiece is 100% metal, and it can also contain metal oxides, metal nitrides, etc., and can also be a workpiece containing metal material that can conduct electricity or can undergo electrochemical polishing processing.

[0049] In the embodiment of the present invention, the polishing voltage is slightly greater than the passivation voltage, and the passivation voltage under the polishing condition is 2.0V; below the passivation voltage, it is the activation zone, exceeding the passivation voltage, it enters the passivation zone, and if the output voltage is continuously increased, it will enter the over-passivation zone; since the scheme of the embodiment of the present invention is mainly used in polishing, for those skilled in the art, it is generally not thought of using a voltage exceeding the passivation voltage as the output voltage, because at this time, the surface of the workpiece to be polished is prone to produce an oxide film, thereby reducing the difficulty of surface corrosion, and ultimately prone to uneven conditions. The workpiece to be polished in the embodiment of the present invention has an appropriate oxidation capacity, and the embodiment of the present invention adopts a combination of mechanical and electrochemical methods, so when it is implemented, a value slightly greater than the passivation voltage can be selected as the output voltage for surface electrolysis, so that the anode can be slightly passivated, which can effectively improve the quality of the processed surface. And since there is also mechanical polishing while performing electrochemical polishing in the embodiment of the present invention, it will have a certain cleaning effect on the oxide film formed on the surface, and this combination can greatly improve the overall polishing efficiency. When it is implemented, it is most preferred to select between 2V and 2.5V.

[0050] In order to further improve the polishing efficiency of the workpiece, the metal workpiece can be degreased and / or deashed before polishing to avoid the influence of impurities on polishing; the workpiece can also be cleaned and / or dried after polishing to wash away the polishing liquid and avoid continuous corrosion of the workpiece that affects the flatness and brightness of the workpiece; drying the workpiece can also avoid excessive corrosion and oxidation of the workpiece, which can better ensure the polishing effect of the workpiece.

[0051] More preferably, the pH value of the polishing liquid is any value between 8 and 10, and the temperature of the polishing liquid is any value between 20 and 45.

[0052] In order to improve the polishing efficiency and reduce the quality loss of the workpiece caused by the polishing process, the following settings can be made: the pH value of the electropolishing liquid is 8-10. When the pH value exceeds 10 (excluding 10), the alkalinity of the polishing liquid is too strong, which will increase the amount of aluminum and other elements dissolved on the workpiece, thereby increasing the quality loss of the workpiece; when the pH is less than 8 (excluding 8), the polishing liquid has a low solubility in aluminum in a neutral environment, an acidic environment, and a weakly alkaline environment with a pH value less than 8. Although the quality loss is small, the dissolution efficiency is slow; and when the pH value of the polishing liquid is 8-10, the polishing liquid has good corrosion resistance and polishing effect on aluminum, and also makes the loss of the workpiece very small;

[0053] In order to improve the polishing efficiency, it is also possible to set the temperature of the polishing liquid to 20-45°C. When the temperature exceeds 45°C (excluding 45°C), the temperature of the polishing liquid is relatively high. During polishing, the heat generated by the polishing wheel grinding and polishing the metal workpiece in mechanical polishing combined with the temperature of the polishing liquid increases the activity of the polishing liquid and the metal element, which will cause the corrosion rate to be too fast, and more foam will be produced, which is prone to gas defects; when the temperature exceeds 20°C (excluding 20°C), the temperature of the polishing liquid is too low, and even under the temperature increase of mechanical polishing, the improvement of the polishing efficiency is not obvious; when the temperature of the polishing liquid is set to 20-45°C, it can achieve just the right effect in terms of corrosion efficiency, polishing efficiency, etc., and can also avoid gas defects.

[0054] More preferably, the sending of a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished also includes:

[0055] A spray control signal is sent to the polishing spray device to control the polishing spray device to spray the polishing liquid according to a set direction, a set angle and a set pressure so as to spray or soak the polishing liquid on the surface of the workpiece to be polished. The set angle is the angle between the spray direction of the spray head and the polishing plane.

[0056] During specific implementation, since the present invention adopts an electrolyte spraying method rather than an immersion method, during specific implementation, electrochemical corrosion only occurs between the polishing wheel and the workpiece to be polished, and no electrochemical corrosion occurs in other areas of the workpiece to be polished. In the embodiment of the present invention, the electrolyte spraying needs to be performed at a set angle, direction and force when spraying; if the spraying force is too large, it is easy to damage the polishing surface, and if the polishing force is too small, it is not possible to provide enough electrolyte to achieve the corresponding electrochemical reaction between the polishing wheel and the workpiece to be polished. Therefore, during specific implementation, it is necessary to spray the polishing liquid at a set angle and pressure. The polishing liquid and the electrolyte mentioned in the embodiment of the present invention are the same content, and they are both part of the electrochemical reaction.

[0057] The solution of the embodiment of the present invention can ensure that the polishing liquid is evenly and effectively distributed on the surface of the workpiece to be polished by accurately controlling the spray direction, angle and pressure of the spray head. This helps to avoid the accumulation or shortage of polishing liquid on the surface of the workpiece, thereby improving the polishing effect and consistency. Through directional spraying, the splashing and waste of polishing liquid can be reduced. This not only helps to save the amount of polishing liquid used, but also reduces the environmental pollution and equipment maintenance costs caused by the splashing of polishing liquid. Optimized spray control can ensure that the polishing liquid works where it is needed, thereby improving the polishing efficiency. At the same time, the uniform distribution of polishing liquid also helps to reduce scratches and flaws during the polishing process and improve the surface quality of the workpiece. By adjusting the spray direction, angle and pressure of the spray head, it can adapt to workpieces of different shapes and sizes. This makes the polishing control method more adaptable and flexible, and can meet diverse processing needs. By accurately controlling the spraying process, the splashing and mist generated during the polishing process can be reduced, thereby improving the working environment. This is beneficial to protecting the health of operators and improving work efficiency.

[0058] More preferably, the rotating axis of the polishing wheel is parallel to the plane to be polished; the sending of a driving signal to the polishing wheel to drive the polishing wheel to mechanically polish the workpiece to be polished comprises:

[0059] A driving signal is sent to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished according to a set travel path; wherein the rotation direction of the polishing wheel is the same as the travel direction of the polishing wheel.

[0060] In the embodiment of the present invention, the circumferential side of the polishing wheel is mainly used to polish the workpiece to be polished, rather than the bottom surface of the polishing wheel. When performing the polishing operation, the corresponding polishing operation is performed according to the set travel path.

[0061] Since the axis of rotation of the polishing wheel is parallel to the plane to be polished, this ensures that the polishing wheel can apply pressure more evenly on the surface of the workpiece, reducing polishing marks or defects caused by uneven pressure. At the same time, polishing according to the set path can ensure that the entire surface of the workpiece is treated evenly and consistently, further improving the surface quality. By precisely controlling the path and rotation direction of the polishing wheel, the consistency and stability of the polishing process can be ensured. This helps to reduce quality problems caused by improper operation or equipment failure, and improves the stability and reliability of the process.

[0062] More preferably, in the electrochemical polishing process, the initial contact position between the spray liquid sprayed by the polishing spray device and the workpiece to be polished is behind the contact point between the polishing wheel and the workpiece to be polished; the travel path of the polishing spray device is the same as the mechanical polishing path of the polishing wheel.

[0063] By setting the initial contact position between the spray liquid and the workpiece to be polished behind the contact point between the polishing wheel and the workpiece, it can be ensured that the polishing liquid immediately infiltrates the surface of the workpiece after the mechanical polishing. This helps the polishing liquid to work better, removes minor flaws or unevenness that may remain after mechanical polishing, and avoids the waste of polishing liquid. And because a certain amount of metal debris will be generated during mechanical polishing, by setting the spray liquid behind the contact point between the polishing wheel and the workpiece to be polished, the corresponding metal debris can be removed in time, thereby improving the polishing stability. In the specific implementation, the corresponding spray direction can be directed toward the path that has been traveled, so that the metal debris will not appear on the subsequent polishing path, which can further improve the stability; however, before this method is implemented, the workpiece to be polished needs to be infiltrated with the polishing liquid once. If the spray direction is not in the travel position, then it is necessary to increase a certain spray pressure, so that the metal debris can be washed to a farther distance without affecting the next stage of polishing.

[0064] More preferably, Figure 3 As shown, the polishing control method further includes:

[0065] S100a: determining the polishing stage to which the current electrochemical mechanical polishing belongs according to the current polishing state information, wherein the polishing stages are divided into a rough polishing stage, a medium polishing stage and a fine polishing stage in order of polishing time;

[0066] S100b: when it is detected that the current stage is the rough polishing stage, a first spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid onto the surface of the workpiece to be polished according to the first spray pressure;

[0067] S100c: when it is detected that the workpiece is currently in the middle polishing stage, a second spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid onto the surface of the workpiece to be polished according to the second spray pressure;

[0068] S100d: When it is detected that the current stage is fine polishing, a third spray signal is sent to the polishing spray device so that the polishing spray device soaks the polishing liquid into the surface of the workpiece to be polished according to the third spray pressure, wherein the first spray pressure, the second spray pressure and the third spray pressure are reduced successively.

[0069] In the embodiment of the present invention, the polishing process is divided into three stages: rough polishing, medium polishing and fine polishing, and fine control can be performed according to the polishing requirements of different stages. The rough polishing stage can quickly remove most of the material on the workpiece surface, the medium polishing stage further smoothes the surface and removes smaller unevenness, and the fine polishing stage can achieve fine polishing of the surface, thereby achieving higher surface quality. By adjusting the spray pressure according to the polishing stage, it can be ensured that the most appropriate spray parameters are used in each stage. This helps to speed up the polishing speed and improve the overall polishing efficiency.

[0070] In different polishing stages, the size of metal chips is different. In the rough polishing stage, the metal chips are relatively large, so a higher pressure is required for spraying. In the medium and fine polishing stages, smaller metal chips are produced, and a slightly lower pressure can be used for spraying. However, in the implementation process, the smaller metal chips will have a greater adsorption force on the polishing wheel, so the polishing wheel can be rinsed every once in a while during the polishing process, which can improve the cleanliness of the polishing wheel surface and reduce the wear of the polishing wheel on the surface of the workpiece to be polished. Even in the rough polishing stage, a larger pressure can be used to partially remove the surface oxide film; this can further improve the polishing efficiency. In other embodiments, a multi-level spray path can be set. For example, the travel path of the polishing wheel on the workpiece to be polished includes a first travel path, a second travel path, a third travel path, etc., and each travel path is parallel to each other. This allows for subsequent implementation, each time a path is completed, a spray device is used to flush the next travel path. Even the cleaning here can be carried out at the same time. Another spray device can be set in front of the contact point for spray flushing, so that the metal chips on its surface are reduced, thereby improving the polishing effect.

[0071] Different output voltages can even be set in different polishing stages. In the rough polishing stage, since the injection pressure is large enough, the possibility of oxide film formation on the surface of the workpiece to be polished can be further reduced. Therefore, a higher voltage can be set to accelerate corrosion. In the medium polishing and fine polishing stages, a relatively smaller polishing voltage can be set.

[0072] More preferably, Figure 2 As shown, the control power supply outputs a polishing voltage to perform electrochemical polishing, including:

[0073] S1031: Obtaining the pressure value of the polishing wheel on the workpiece to be polished, and the rotation speed of the motor or the rotation speed of the polishing wheel;

[0074] S1032: Calculate a polishing voltage value based on the pressure value and the rotation speed based on a polishing voltage formula; the polishing voltage formula is: ; Among them, U0 is the polishing voltage value, is the relationship coefficient, F is the pressure value, V is the rotation speed, and R is the load size during electrochemical polishing;

[0075] S1033: Control the power supply to output the polishing voltage as the polishing voltage to perform electrochemical polishing processing.

[0076] The pressure value of the polishing wheel on the metal workpiece can be realized by a pressure sensor installed under the metal workpiece. Under normal circumstances, the metal workpiece has a certain gravity. When the polishing wheel polishes it, it needs to apply a certain pressure to the metal workpiece. The difference between the signal value collected by the pressure sensor at this time and the initial gravity of the metal workpiece is regarded as the pressure value of the polishing wheel on the metal workpiece. The metal workpiece here is the workpiece to be polished.

[0077] In other embodiments, the pressure value can also be characterized by the displacement of the Z-axis adjustment mechanism (whether it drives the polishing wheel to move up and down or drives the metal workpiece to move up and down). If the polishing wheel is driven by a pulley, the pressure value can also be characterized by the tightness (i.e., tension) of the pulley.

[0078] The rotation speed of the motor or the polishing wheel can be collected through an encoder or a speed sensor. Since there is a certain corresponding relationship between the rotation speed of the motor and the rotation speed of the polishing wheel, it is sufficient to obtain only one of the rotation speeds.

[0079] In a preferred embodiment of the present invention, the pressure value and the rotational speed are collected using the same sampling frequency and the same sampling time point. The controller can simultaneously trigger the pressure sensor and the encoder to start acquiring corresponding signals and send the collected signals to the controller.

[0080] The higher the speed, the higher the efficiency of mechanical polishing, and the higher the polishing voltage, the higher the efficiency of electrochemical polishing. In order to complete the entire polishing process within the preset time, it can be seen that the speed and polishing voltage are inversely proportional, and both are related to the pressure of the polishing wheel on the metal workpiece (mechanical polishing is obviously directly related to the polishing pressure, and electrochemical polishing is because the electric field is generated between the polishing wheel and the metal workpiece, so it is also related to the distance between the polishing wheel and the metal workpiece). For those skilled in the art, polishing voltage = polishing current multiplied by load; so it can be known that there is a corresponding correlation between polishing voltage and polishing current. In the subsequent description, the polishing current can also be used to describe the corresponding relationship, and the two are consistent.

[0081] From this, it can be seen that when the polishing pressure value is maintained unchanged or increased and the rotation speed is reduced, the reference current value (corresponding to the polishing current) will increase. At this time, electrochemical mechanical polishing is mainly electrochemical polishing, supplemented by mechanical polishing. Conversely, if the polishing pressure value is maintained unchanged or reduced and the rotation speed is increased, the reference current value (corresponding to the polishing current) will decrease. At this time, electrochemical mechanical polishing is mainly mechanical polishing, supplemented by electrochemical polishing.

[0082] Of course, there is a constraint value for both polishing pressure and polishing current. If the constraint value is exceeded, the surface to be polished may be damaged. For example, in the polishing scheme for aluminum plate in the embodiment of the present invention, the polishing pressure value is generally set at 12-21N, the polishing current is set at 0.3-0.5A, and the polishing wheel speed is set at 1000-3500rmp. Of course, other constraints can also be set according to the material of the metal workpiece, polishing requirements, etc. Similarly, there are certain constraints for the relationship coefficient, such as 20-50.

[0083] In a preferred embodiment of the present invention, the entire polishing process (for any polishing point) can be divided into three polishing stages: rough polishing, medium polishing and fine polishing. The main polishing method, that is, the proportion of mechanical polishing and electrochemical polishing, can be set for each polishing stage.

[0084] For example, the rough polishing can be set to be mainly mechanical polishing, for which a larger polishing pressure value and a faster rotation speed can be set (the ratio of the pressure value to the rotation speed is smaller than that of other polishing stages). For example, the polishing pressure value is set to 17-21N, and the rotation speed is set to 2500-3200 rpm. At this time, the polishing current is approximately 0.3A.

[0085] During medium polishing, mechanical polishing and electrochemical polishing can occupy a similar proportion. For example, the polishing pressure value is set to 15-17N, and the speed is set to 1500-2000 rpm. At this time, the polishing current is roughly around 0.4A.

[0086] When fine polishing, it is set to mainly electrochemical polishing. For example, the polishing pressure value is set to 12-15N, and the speed is set to 1000-1500rmp accordingly. At this time, the polishing current is roughly around 0.5A.

[0087] Based on this, the polishing pressure value and the polishing wheel speed can be adjusted in real time on the basis of this method to achieve the proportion of mechanical polishing and electrochemical polishing. For example, at the beginning of rough polishing, the polishing pressure value and the polishing wheel speed can be set to the maximum value of the constraint value, and then gradually reduced as the polishing time progresses. For example, the pressure curve and the speed curve can be set in the controller by setting the pressure curve and the speed curve, and the controller adjusts the pressure value and the speed value in real time according to the pressure curve and the speed curve.

[0088] The electrochemical mechanical polishing control method in the embodiment of the present invention performs electrochemical polishing at the same time as mechanical polishing, and the two can promote each other. Mechanical polishing removes surface materials through physical action, while electrochemical polishing further smoothes the surface through electrochemical reaction; and selecting a polishing voltage setting higher than the passivation voltage can ensure that the two actions are carried out efficiently at the same time, thereby obtaining a better overall polishing effect.

[0089] Embodiment 2

[0090] See also Figure 4 , Figure 4 Schematic diagram of the structure of the electrochemical mechanical polishing control device disclosed in the embodiment of the present invention. Figure 4 As shown, the electrochemical mechanical polishing control device may include:

[0091] The first sending module 21 is used to send a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished;

[0092] The second sending module 22 is used to send a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished;

[0093] Control module 23: used to control the power supply to output a polishing voltage for electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V, and electrochemically polishes the polished surface of the workpiece to be polished while mechanically polishing the workpiece to be polished. During the electrochemical polishing process, the workpiece to be polished is used as the anode and the polishing wheel is used as the cathode.

[0094] More preferably, the pH value of the polishing liquid is any value between 8 and 10, and the temperature of the polishing liquid is any value between 20 and 45.

[0095] More preferably, the sending of a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished also includes:

[0096] Spray control module: used to send a spray control signal to the polishing spray device to control the polishing spray device to spray the polishing liquid according to the set direction, set angle and set pressure so as to spray or soak the polishing liquid on the surface of the workpiece to be polished. The set angle is the angle between the spray direction of the spray head and the polishing plane.

[0097] More preferably, the rotating axis of the polishing wheel is parallel to the plane to be polished; the sending of a driving signal to the polishing wheel to drive the polishing wheel to mechanically polish the workpiece to be polished comprises:

[0098] Drive control module: used to send a drive signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished according to a set travel path; wherein the rotation direction of the polishing wheel is the same as the travel direction of the polishing wheel.

[0099] More preferably, in the electrochemical polishing process, the initial contact position between the spray liquid sprayed by the polishing spray device and the workpiece to be polished is behind the contact point between the polishing wheel and the workpiece to be polished; the travel path of the polishing spray device is the same as the mechanical polishing path of the polishing wheel.

[0100] More preferably, the controlling power supply to output a polishing voltage to perform electrochemical polishing treatment comprises:

[0101] Parameter acquisition module: used to obtain the pressure value of the polishing wheel on the workpiece to be polished, as well as the speed of the motor or the speed of the polishing wheel;

[0102] Voltage determination module: used to calculate the polishing voltage value according to the pressure value and the rotation speed based on the polishing voltage formula; the polishing voltage formula is: ; Among them, U0 is the polishing voltage value, is the relationship coefficient, F is the pressure value, V is the rotation speed, and R is the load size during electrochemical polishing;

[0103] Output control module: used to control the power supply to output the polishing voltage as the polishing voltage to perform electrochemical polishing treatment.

[0104] More preferably, the polishing control method further comprises:

[0105] Polishing determination module: used to determine the polishing stage to which the current electrochemical mechanical polishing belongs according to the current polishing state information, wherein the polishing stages are divided into a rough polishing stage, a medium polishing stage and a fine polishing stage in the order of polishing time;

[0106] Rough polishing control module: when detecting that the current stage is rough polishing, sending a first spray signal to the polishing spray device so that the polishing spray device sprays the polishing liquid on the surface of the workpiece to be polished according to the first spraying pressure;

[0107] Mid-polishing control module: used for sending a second spray signal to the polishing spray device when it is detected that the current mid-polishing stage is in progress, so that the polishing spray device sprays the polishing liquid onto the surface of the workpiece to be polished according to the second spraying pressure;

[0108] Fine polishing control module: when it is detected that the current stage is fine polishing, it sends a third spray signal to the polishing spray device so that the polishing spray device soaks the polishing liquid in the surface of the workpiece to be polished according to the third spray pressure, wherein the first spray pressure, the second spray pressure and the third spray pressure decrease successively.

[0109] The electrochemical mechanical polishing control method in the embodiment of the present invention performs electrochemical polishing at the same time as mechanical polishing, and the two can promote each other. Mechanical polishing removes surface materials through physical action, while electrochemical polishing further smoothes the surface through electrochemical reaction; and selecting a polishing voltage setting higher than the passivation voltage can ensure that the two actions are carried out efficiently at the same time, thereby obtaining a better overall polishing effect.

[0110] Embodiment 3

[0111] See also Figure 5 , Figure 5 Schematic diagram of the structure of an electronic device disclosed in an embodiment of the present invention. The electronic device may be a computer, a server, etc. Of course, in certain circumstances, it may also be a smart device such as a mobile phone, a tablet computer, a monitoring terminal, and an image acquisition device with processing functions. Figure 5 As shown, the electronic device may include:

[0112] A memory 510 storing executable program codes;

[0113] a processor 520 coupled to the memory 510;

[0114] The processor 520 calls the executable program code stored in the memory 510 to execute part or all of the steps in the electrochemical mechanical polishing control method in the first embodiment.

[0115] An embodiment of the present invention discloses a computer-readable storage medium storing a computer program, wherein the computer program enables a computer to execute part or all of the steps in the electrochemical mechanical polishing control method in the first embodiment.

[0116] The embodiment of the present invention further discloses a computer program product, wherein when the computer program product is run on a computer, the computer is enabled to execute part or all of the steps in the electrochemical mechanical polishing control method in the first embodiment.

[0117] An embodiment of the present invention further discloses an application publishing platform, wherein the application publishing platform is used to publish a computer program product, wherein when the computer program product runs on a computer, the computer executes part or all of the steps in the electrochemical mechanical polishing control method in embodiment one.

[0118] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the processes does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0119] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, i.e., they may be located in one place or distributed over multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0120] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0121] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-accessible memory. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a memory and includes several requests to enable a computer device (which can be a personal computer, server or network device, etc., specifically a processor in a computer device) to perform some or all steps of the method described in each embodiment of the present invention.

[0122] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0123] A person of ordinary skill in the art may understand that part or all of the steps in the various methods of the embodiments may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, the storage medium including a read-only memory (ROM), a random access memory (RAM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), a one-time programmable read-only memory (OTPROM), an electronically-erasable programmable read-only memory (EEPROM), a compact disc (CD-ROM) or other optical disc storage, magnetic disk storage, magnetic tape storage, or any other computer-readable medium that can be used to carry or store data.

[0124] The electrochemical mechanical polishing control method, device, electronic device and storage medium disclosed in the embodiments of the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An electrochemical mechanical polishing control method, characterized in that: include: Sending a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished; Sending a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished; Controlling the power supply to output a polishing voltage to perform electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V, and electrochemically polishing the polished surface of the workpiece to be polished while mechanically polishing the workpiece to be polished. During the electrochemical polishing process, the workpiece to be polished is used as an anode and the polishing wheel is used as a cathode; The controlling power supply to output a polishing voltage to perform electrochemical polishing treatment comprises: Obtain the pressure value of the polishing wheel on the workpiece to be polished, as well as the speed of the motor or the speed of the polishing wheel; According to the pressure value and the rotation speed, the polishing voltage value is calculated based on the polishing voltage formula; the polishing voltage formula is: Among them, U0 is the polishing voltage value, α is the relationship coefficient, the constraint range of the relationship coefficient is 20-50, F is the pressure value, V is the rotation speed, and R is the load size during electrochemical polishing; The power supply is controlled to output the polishing voltage as the polishing voltage to perform electrochemical polishing processing.

2. The electrochemical mechanical polishing control method according to claim 1, characterized in that: The pH value of the polishing liquid is any value between 8 and 10, and the temperature of the polishing liquid is any value between 20 and 45.

3. The electrochemical mechanical polishing control method according to claim 1, characterized in that: The method of sending a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished also includes: A spray control signal is sent to the polishing spray device to control the polishing spray device to spray the polishing liquid according to a set direction, a set angle and a set pressure so as to spray or soak the polishing liquid on the surface of the workpiece to be polished. The set angle is the angle between the spray direction of the spray head and the polishing plane.

4. The electrochemical mechanical polishing control method according to claim 3, characterized in that: The rotating axis of the polishing wheel is parallel to the plane to be polished; The step of sending a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished comprises: A driving signal is sent to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished according to a set travel path; wherein the rotation direction of the polishing wheel is the same as the travel direction of the polishing wheel.

5. The electrochemical mechanical polishing control method according to claim 4, characterized in that: In the electrochemical polishing process, the first contact position between the spray liquid sprayed by the polishing spray device and the workpiece to be polished is behind the contact point between the polishing wheel and the workpiece to be polished; the travel path of the polishing spray device is the same as the mechanical polishing path of the polishing wheel.

6. The electrochemical mechanical polishing control method according to claim 1, characterized in that: The polishing control method further comprises: Determine the polishing stage to which the current electrochemical mechanical polishing belongs according to the current polishing state information, wherein the polishing stages are divided into a rough polishing stage, a medium polishing stage and a fine polishing stage in order of polishing time; When it is detected that the current stage is rough polishing, a first spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid on the surface of the workpiece to be polished according to the first spray pressure; When it is detected that the workpiece is currently in the middle polishing stage, a second spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid onto the surface of the workpiece to be polished according to the second spray pressure; When it is detected that the current stage is fine polishing, a third spray signal is sent to the polishing spray device so that the polishing spray device sprays the polishing liquid on the surface of the workpiece to be polished according to the third spray pressure, wherein the first spray pressure, the second spray pressure and the third spray pressure decrease successively.

7. An electrochemical mechanical polishing control device, characterized in that: include: The first sending module is used to send a spray signal to the polishing spray device so that the polishing spray device sprays or soaks the polishing liquid on the surface of the workpiece to be polished; The second sending module is used to send a driving signal to the polishing wheel to drive the polishing wheel to perform mechanical polishing on the workpiece to be polished; Control module: used to control the power supply to output a polishing voltage for electrochemical polishing, wherein the polishing voltage has a value range of 2V to 2.5V, and electrochemically polishes the polished surface of the workpiece to be polished while mechanically polishing the workpiece to be polished. During the electrochemical polishing process, the workpiece to be polished is used as an anode and the polishing wheel is used as a cathode; The controlling power supply to output a polishing voltage to perform electrochemical polishing treatment comprises: Obtain the pressure value of the polishing wheel on the workpiece to be polished, as well as the speed of the motor or the speed of the polishing wheel; According to the pressure value and the rotation speed, the polishing voltage value is calculated based on the polishing voltage formula; the polishing voltage formula is: Among them, U0 is the polishing voltage value, α is the relationship coefficient, the constraint range of the relationship coefficient is 20-50, F is the pressure value, V is the rotation speed, and R is the load size during electrochemical polishing; The power supply is controlled to output the polishing voltage as the polishing voltage to perform electrochemical polishing processing.

8. An electronic device, characterized in that: include: A memory storing executable program code; a processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the electrochemical mechanical polishing control method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program enables a computer to execute the electrochemical mechanical polishing control method according to any one of claims 1 to 6.

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