Quartz wafer polishing method

Abstract

The invention discloses a quartz wafer polishing method which comprises a main body unit, the main body unit comprises a bottom plate, two sets of vertical plates are fixedly connected to the upper side surface of the bottom plate, a polishing roller is rotationally connected between the vertical plates, a driving motor is fixedly connected to the surface of one side of one set of vertical plates, and the output end of the driving motor is fixedly connected with a rotating shaft. An electric push rod is started through a control panel to push a second clamping plate to move on the surface of a supporting rod, then two sets of rotating plates rotationally connected with a first clamping plate and the second clamping plate clamp a quartz wafer, and then a lifting motor is started through the control panel to drive a threaded rod to rotate; and the threaded block in threaded connection with the threaded rod moves downwards under the limiting effect of the limiting rod, and then the quartz wafer is driven to move downwards synchronously, so that the quartz wafer is attached to the surface of the grinding roller, the quartz wafers of different sizes and thicknesses can be clamped and fixed, then the different quartz wafers are polished, and the practicability is improved.

Description

Technical Field

[0001] The invention relates to the technical field of quartz wafer processing, in particular to a quartz wafer polishing method. Background Art

[0002] Quartz wafer is a thin slice of natural mineral quartz that is precisely processed. It is widely used in electronics, communications, optics and many other high-tech fields. During the processing, in order to improve the surface quality and improve the optical properties, the surface of the quartz wafer will be polished, which can not only improve the physical and optical properties of the quartz wafer, but also extend its service life and improve the dimensional accuracy of the product.

[0003] In the existing polishing process, the front or back side of the quartz wafer is mostly polished. When polishing the side of the quartz wafer, the quartz wafer is usually fixed before polishing, and then the quartz wafer is manually rotated during the polishing process to adjust the polishing surface, resulting in uneven polishing of the side, affecting the polishing quality. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above existing problems, the present invention is proposed.

[0006] Therefore, the purpose of the present invention is to provide a quartz wafer polishing method, which is to solve the problem that "the existing polishing process is mostly to polish the front or back of the quartz wafer. When polishing the side of the quartz wafer, the quartz wafer is mostly fixed before polishing, and then the quartz wafer is manually rotated during the polishing process to adjust the polishing surface, resulting in uneven polishing of the side, affecting the polishing quality."

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0008] A quartz wafer polishing method comprises a main unit, a fixing unit and a polishing unit, characterized in that:

[0009] The main unit comprises a bottom plate, two groups of vertical plates are fixedly connected to the upper surface of the bottom plate, and a grinding roller is rotatably connected between the vertical plates, a driving motor is fixedly connected to one side surface of one group of vertical plates, and a rotating shaft is fixedly connected to the output end of the driving motor, the surface of the rotating shaft is rotatably connected to the vertical plate, and the surface of the rotating shaft is fixedly connected to the grinding roller, a water collecting tank is arranged between the two groups of vertical plates, and a cleaning component is arranged inside the water collecting tank, and a control panel is installed on the surface of one group of vertical plates;

[0010] The fixing unit comprises a stand fixedly connected to a group of stand plates, the upper side surface of the stand fixedly connected to a lifting motor, and the output end of the lifting motor fixedly connected to a threaded rod, the surface of the threaded rod is rotatably connected to the stand, the surface of the threaded rod is threadedly connected to a threaded block, and one side surface of the threaded block is fixedly connected to a connecting plate, two groups of limiting rods are slidably connected inside the threaded block, and the lower end of the limiting rod is fixedly connected to the stand plate, one end of the connecting plate is fixedly connected to a clamping plate 1, and a rotating component is arranged inside the clamping plate 1, the lower side surface of the connecting plate is slidably connected to a clamping plate 2, and a pushing component is arranged on one side of the clamping plate 2;

[0011] The polishing unit includes a reduction gear 1 fixedly connected to the rotating shaft, and the upper side of the reduction gear 1 is meshedly connected with a reduction gear 2, the interior of the reduction gear 2 is fixedly connected to a rotating shaft, and the surface of the rotating shaft is rotatably connected to another vertical plate, the other end of the rotating shaft is fixedly connected to a bevel gear 1, and one side of the bevel gear 1 is meshedly connected to a bevel gear 2, the interior of the bevel gear 2 is fixedly connected to a round rod, and the lower end of the round rod is rotatably connected to a stabilizing plate, the stabilizing plate is fixedly connected to another vertical plate, a slide groove is provided on the surface of one side of the round rod, and a transmission assembly is provided on the surface of the slide groove.

[0012] As a preferred solution of the polishing method of a quartz wafer described in the present invention, the cleaning component includes a scraper rotatably connected to a vertical plate, two groups of springs are fixedly connected to the upper surface of the scraper, and the other ends of the springs are fixedly connected to fixed seats, the surfaces of the two groups of fixed seats facing each other are fixedly connected to the vertical plate, the upper surface of the scraper is movably connected to the surface of a grinding roller, and a leakage groove is opened on the surface of the scraper.

[0013] As a preferred solution of the quartz wafer polishing method described in the present invention, the pushing assembly includes an electric push rod fixedly connected to the threaded block, and the output end of the electric push rod is fixedly connected to the second clamping plate, and the internal sliding connection of the second clamping plate is provided with two groups of support rods, and one end of the support rod is fixedly connected to the first clamping plate, and the other ends of the two groups of support rods are fixedly connected to the threaded block.

[0014] As a preferred solution of the polishing method of a quartz wafer described in the present invention, the rotating assembly includes two groups of rotating plates arranged between clamp plate one and clamp plate two, the surfaces of the two groups of rotating plates on the side facing away from each other are fixedly connected with rotating rods, and the surfaces of the rotating rods are respectively rotatably connected to clamp plate one and clamp plate two, the surface of one group of the rotating rods is fixedly connected to a limiting ring, and the limiting ring is rotatably connected to clamp plate two, the surfaces of the two groups of rotating plates on the side close to each other are fixedly connected with soft pads, and the soft pads are all made of rubber material.

[0015] As a preferred solution of the quartz wafer polishing method described in the present invention, the surfaces of the adjacent sides of the clamping plate one and clamping plate two are provided with rolling grooves, the surfaces of the opposite sides of the two sets of rotating plates are fixedly connected with a plurality of balls, and the balls are movably connected with the inner wall surfaces of the rolling grooves.

[0016] As a preferred solution of the quartz wafer polishing method described in the present invention, the transmission assembly includes a bevel gear three fixedly connected to another rotating rod, and one side of the bevel gear three is meshingly connected to a bevel gear four, the interior of the bevel gear four is fixedly connected to a slide cylinder, and the slide cylinder is slidably connected to the round rod, the inner wall surface of the slide groove is slidably connected to a slider, and the slider is fixedly connected to the slide cylinder.

[0017] As a preferred solution of the polishing method of a quartz wafer described in the present invention, wherein: the surface of the slide cylinder is rotatably connected to a side fixing plate, and the upper surface of the side fixing plate is rotatably connected to a support ring, the side fixing plate is fixedly connected to a clamping plate, and the support ring is fixedly connected to the slide cylinder.

[0018] As a preferred solution of the quartz wafer polishing method described in the present invention, one side surface of the reduction gear 2 is rotatably connected to another vertical plate, and the inner diameter of the reduction gear 1 is one quarter of the inner diameter of the reduction gear 1.

[0019] As a preferred solution of the quartz wafer polishing method described in the present invention, a liquid storage tank is provided on one side surface of the two groups of grinding rollers, and a pump is installed on the side surface of the liquid storage tank close to the grinding roller, a nozzle is installed on one side output end of the pump, and mounting plates are fixedly connected to both side surfaces of the liquid storage tank, and the mounting plates are fixedly connected to the vertical plates.

[0020] The method for using the quartz wafer polishing method of the present invention is characterized by comprising the following steps:

[0021] S1, clamp the quartz wafer between the clamping plate 1 and the clamping plate 2 by pushing the assembly, start the lifting motor to drive the threaded rod to rotate, so that the clamping plate 1 can be flexibly adjusted in height, and then the quartz wafer is fitted with the surface of the grinding roller;

[0022] S2, driving the rotating shaft to rotate by driving the motor, so that the grinding roller can polish the quartz wafer, and at the same time, the quartz wafer being polished is driven to rotate by the transmission component to polish the side of the quartz wafer as a whole;

[0023] S3. When the grinding roller is rotating and polishing, the cleaning component can clean the surface of the grinding roller. At the same time, the pump can extract the polishing liquid in the liquid storage tank and spray it on the surface of the grinding roller through the nozzle to improve the polishing effect.

[0024] Beneficial effects of the present invention:

[0025] 1. Place the quartz wafer between the second clamping plate and the first clamping plate, and then start the electric push rod through the control panel to push the second clamping plate to move on the surface of the support rod, so that the two sets of rotating plates rotatably connected to the first clamping plate and the second clamping plate clamp the quartz wafer, and then start the lifting motor through the control panel to drive the threaded rod to rotate, and the threaded block threadedly connected to the threaded rod moves downward under the limiting action of the limiting rod, thereby driving the quartz wafer to move downward synchronously, so that the quartz wafer fits the surface of the grinding roller, and can clamp and fix quartz wafers of different sizes and thicknesses, and then polish different quartz wafers to improve practicality.

[0026] 2. Start the driving motor through the control panel to drive the rotating shaft to rotate, and the grinding roller fixedly connected to the rotating shaft can polish the fitted quartz wafer. At the same time, the reduction gear 1 fixedly connected to the rotating shaft drives the meshing reduction gear 2 to rotate synchronously, and the rotating shaft fixedly connected to the reduction gear 2 drives the bevel gear 1 to rotate, and the bevel gear 2 meshing with the bevel gear 1 drives the fixedly connected round rod to rotate inside the stabilizing plate, thereby making the slide groove rotate synchronously, and then the slider slidingly connected to the slide groove drives the slide cylinder to rotate inside the side fixing plate, and the bevel gear 4 fixedly connected to the surface of the slide cylinder drives the meshing bevel gear 3 to rotate, so that the rotating rod fixedly connected to the bevel gear 3 drives the rotating plate to rotate, and at the same time, the ball fixedly connected to the rotating plate rotates inside the rolling groove, reducing the rotational friction of the rotating plate, so that the grinding roller can rotate rapidly while the quartz wafer can rotate synchronously and slowly, and the side of the quartz wafer can be polished as a whole, ensuring that the side of the quartz wafer can be polished evenly.

[0027] 3. When the grinding roller is rotating to polish the quartz wafer, starting the pump can extract the polishing liquid in the liquid storage tank, and then spray it on the surface of the grinding roller through the nozzle to improve the polishing effect. Then the scraper can fit tightly with the grinding roller under the elastic force of the spring, and can clean the surface of the grinding roller. At the same time, the particles cleaned by the scraper can fall into the water collection tank through the spring, so that there will be no residual particles on the surface of the grinding roller to scratch the quartz wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0029] Figure 1 A schematic diagram of the three-dimensional structure of a quartz wafer polishing method of the present invention;

[0030] Figure 2 For the present invention Figure 1 A rear view schematic diagram of a three-dimensional structure;

[0031] Figure 3 For the present invention Figure 1 A schematic cross-sectional view of the three-dimensional structure;

[0032] Figure 4 For the present invention Figure 3 A schematic diagram of the structure enlargement in the middle;

[0033] Figure 5 For the present invention Figure 3 A magnified schematic diagram of the structure at B in the middle;

[0034] Figure 6 It is a schematic diagram of the three-dimensional structure of the liquid storage tank of the present invention.

[0035] In the figure: 100, main unit; 101, bottom plate; 102, vertical plate; 103, driving motor; 104, rotating shaft; 105, grinding roller; 106, water collecting tank; 107, cleaning component; 107a, scraper; 107b, spring; 107c, fixed seat; 107d, drain tank; 108, liquid storage tank; 109, pump; 110, nozzle; 111, mounting plate; 200, fixing unit; 201, vertical frame; 202, lifting motor; 203, threaded rod; 204, threaded block; 205, limit rod; 206, connecting plate; 207, clamping plate 1; 208, clamping plate 2; 209, pushing group Parts; 209a, electric push rod; 209b, support rod; 210, rotating assembly; 210a, rotating plate; 210b, rotating rod; 210c, ball; 210d, rolling groove; 210e, soft pad; 210f, limit ring; 300, polishing unit; 301, reduction gear one; 302, reduction gear two; 303, rotating shaft; 304, bevel gear one; 305, bevel gear two; 306, round rod; 307, slide groove; 308, transmission assembly; 308a, bevel gear three; 308b, bevel gear four; 308c, slide cylinder; 308d, slider; 308e, side fixing plate; 308f, support ring. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0037] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0038] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0039] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0040] Reference Figure 1-6 The present invention provides a quartz wafer polishing method, comprising a main unit 100, a fixing unit 200 and a polishing unit 300, characterized in that:

[0041] The main unit 100 includes a base plate 101, and two groups of vertical plates 102 are fixedly connected to the upper surface of the base plate 101, and a grinding roller 105 is rotatably connected between the vertical plates 102. A driving motor 103 is fixedly connected to the surface of one side of a group of vertical plates 102, and the output end shaft of the driving motor 103 is fixedly connected to a rotating shaft 104, the surface of the rotating shaft 104 is rotatably connected to the vertical plates 102, and the surface of the rotating shaft 104 is fixedly connected to the grinding roller 105. A water collecting tank 106 is arranged between the two groups of vertical plates 102, and a cleaning component 107 is arranged inside the water collecting tank 106. A control panel is installed on the surface of one group of vertical plates 102, and the driving motor 103 is electrically connected to the control panel. The driving motor 103 can drive the grinding roller 105 to start rotating, so that the grinding roller 105 can have a polishing effect.

[0042] The fixing unit 200 includes a stand 201 fixedly connected to a set of stand plates 102, the upper surface of the stand 201 is fixedly connected to a lifting motor 202, and the output end shaft of the lifting motor 202 is fixedly connected to a threaded rod 203, the surface of the threaded rod 203 is rotatably connected to the stand 201, the surface of the threaded rod 203 is threadedly connected to a threaded block 204, and one side surface of the threaded block 204 is fixedly connected to a connecting plate 206, the interior of the threaded block 204 is slidably connected to two sets of limit rods 205, and the limit rods 205 are fixedly connected to the upper surface of the stand 201. The lower end of the rod 205 is fixedly connected to the vertical plate 102, one end of the connecting plate 206 is fixedly connected to a clamp plate 207, and a rotating component 210 is arranged inside the clamp plate 207, the lower surface of the connecting plate 206 is slidably connected to a clamp plate 208, and a pushing component 209 is arranged on one side of the clamp plate 208, the lifting motor 202 is electrically connected to the control panel, and can adjust the height of the threaded block 204, and the clamp plate 207 can clamp and fix the quartz wafer under the action of the clamp plate 208.

[0043] The polishing unit 300 includes a reduction gear 1 301 fixedly connected to the rotating shaft 104, and the upper side of the reduction gear 1 301 is meshedly connected with a reduction gear 2 302, the interior of the reduction gear 2 302 is fixedly connected with a rotating shaft 303, and the surface of the rotating shaft 303 is rotatably connected to another vertical plate 102, the other end of the rotating shaft 303 is fixedly connected with a bevel gear 1 304, and one side of the bevel gear 1 304 is meshedly connected with a bevel gear 2 305, the interior of the bevel gear 2 305 is fixedly connected with a round rod 306, and the lower end of the round rod 306 is rotatably connected to a stabilizing plate, the stabilizing plate is fixedly connected to another vertical plate 102, a slide groove 307 is provided on the surface of one side of the round rod 306, and a transmission assembly 308 is provided on the surface of the slide groove 307, which can drive the rotating shaft 303 to rotate synchronously when the grinding roller 105 is installed, thereby driving the round rod 306 to rotate simultaneously.

[0044] Among them, the cleaning component 107 includes a scraper 107a rotatably connected to the vertical plate 102, two groups of springs 107b are fixedly connected to the upper surface of the scraper 107a, and the other ends of the springs 107b are fixedly connected to the fixing seats 107c, the surfaces of the two groups of fixing seats 107c opposite to each other are fixedly connected to the vertical plate 102, the upper surface of the scraper 107a is movably connected to the surface of the grinding roller 105, and a leakage groove 107d is provided on the surface of the scraper 107a. When the grinding roller 105 rotates, the scraper 107a can clean the surface particles of the grinding roller 105 to prevent the particles from affecting the polishing effect.

[0045] Further, the pushing assembly 209 includes an electric push rod 209a fixedly connected to the threaded block 204, and the output end shaft of the electric push rod 209a is fixedly connected to the second clamping plate 208, and two groups of support rods 209b are slidably connected inside the second clamping plate 208, and one end of the support rod 209b is fixedly connected to the first clamping plate 207, and the other ends of the two groups of support rods 209b are fixedly connected to the threaded block 204. Under the support of the support rod 209b, 209s can push the second clamping plate 208 to move toward the first clamping plate 207.

[0046] Furthermore, the rotating assembly 210 includes two groups of rotating plates 210a arranged between the first clamp plate 207 and the second clamp plate 208. The surfaces of the two groups of rotating plates 210a on the side opposite to each other are fixedly connected with rotating rods 210b, and the surfaces of the rotating rods 210b are respectively rotatably connected to the first clamp plate 207 and the second clamp plate 208. The surface of one group of rotating rods 210b is fixedly connected with a limiting ring 210f, and the limiting ring 210f is rotatably connected to the second clamp plate 208. The surfaces of the two groups of rotating plates 210a on the side close to each other are fixedly connected with soft pads 210e, and the soft pads 210e are made of rubber material. The two groups of rotating plates 210a can clamp and fix the quartz wafer while driving the quartz wafer to rotate.

[0047] Furthermore, the surfaces of the adjacent sides of the clamping plate 1 207 and the clamping plate 2 208 are both provided with rolling grooves 210d, and the surfaces of the opposite sides of the two sets of rotating plates 210a are both fixedly connected with a plurality of balls 210c, and the balls 210c are movably connected with the inner wall surfaces of the rolling grooves 210d, thereby reducing the friction of the rotation of the two sets of rotating plates 210a.

[0048] Furthermore, the transmission assembly 308 includes a bevel gear three 308a fixedly connected to another rotating rod 210b, and one side of the bevel gear three 308a is meshingly connected to the bevel gear four 308b, the interior of the bevel gear four 308b is fixedly connected to a slide cylinder 308c, and the slide cylinder 308c is slidably connected to the round rod 306, the inner wall surface of the slide groove 307 is slidably connected to a slider 308d, and the slider 308d is fixedly connected to the slide cylinder 308c, and the round rod 306 can rotate while driving the rotating rod 210b to rotate synchronously, thereby causing the rotating plate 210a to drive the quartz chip to rotate.

[0049] Furthermore, the surface of the slide 308c is rotatably connected to the side fixing plate 308e, and the upper surface of the side fixing plate 308e is rotatably connected to the support ring 308f, the side fixing plate 308e is fixedly connected to the clamping plate 207, and the support ring 308f is fixedly connected to the slide 308c, so as to support and limit the bevel gear four 308b, so that the bevel gear three 308a can rotate at any height.

[0050] Further, one side surface of the reduction gear 2 302 is rotatably connected to another vertical plate 102, and the inner diameter of the reduction gear 1 301 is one-fourth the inner diameter of the reduction gear 1 301, which can reduce the rotation speed of the quartz wafer by multiples.

[0051] Furthermore, a liquid storage tank 108 is provided on one side surface of the two groups of grinding rollers 105, and a pump 109 is installed on the side surface of the liquid storage tank 108 close to the grinding roller 105, and a nozzle 110 is installed on one output end of the pump 109. Both side surfaces of the liquid storage tank 108 are fixedly connected with mounting plates 111, and the mounting plates 111 are fixedly connected to the vertical plate 102. The pump 109 is electrically connected to the control panel, and the pump 109 can extract the polishing liquid inside the liquid storage tank 108 and spray it on the surface of the grinding roller 105 through the nozzle 110.

[0052] Furthermore, a method for using the quartz wafer polishing method is characterized by comprising the following steps:

[0053] S1, clamp the quartz wafer between the clamping plate 1 207 and the clamping plate 2 208 by pushing the assembly 209, start the lifting motor 202 to drive the threaded rod 203 to rotate, so that the clamping plate 1 207 can be flexibly adjusted in height, and then the quartz wafer is bonded to the surface of the grinding roller 105;

[0054] S2, the rotating shaft 104 is driven to rotate by the driving motor 103, so that the grinding roller 105 can polish the quartz wafer, and at the same time, the quartz wafer being polished is driven to rotate by the transmission assembly 308, so as to polish the side of the quartz wafer as a whole;

[0055] S3. When the grinding roller 105 is rotating and polishing, the cleaning component 107 can clean the surface of the grinding roller 105. At the same time, the pump 109 can extract the polishing liquid in the liquid storage tank 108 and spray it on the surface of the grinding roller 105 through the nozzle 110 to improve the polishing effect.

[0056] During use, the quartz wafer is placed between the second clamping plate 208 and the first clamping plate 207, and then the electric push rod 209a is started through the control panel to push the second clamping plate 208 to move on the surface of the support rod 209b, so that the two sets of rotating plates 210a rotatably connected to the first clamping plate 207 and the second clamping plate 208 clamp the quartz wafer, and then the lifting motor 202 is started through the control panel to drive the threaded rod 203 to rotate, and the threaded block 204 threadedly connected to the threaded rod 203 moves downward under the limiting action of the limiting rod 205, thereby driving the quartz wafer to move downward synchronously, so that the quartz wafer and the polishing The surface of the roller 105 is fitted, and quartz wafers of different sizes and thicknesses can be clamped and fixed. The driving motor 103 is started through the control panel to drive the rotating shaft 104 to rotate, and the grinding roller 105 fixedly connected to the rotating shaft 104 can polish the fitted quartz wafer. At the same time, the reduction gear 1 301 fixedly connected to the rotating shaft 104 drives the meshing reduction gear 2 302 to rotate synchronously, and the rotating shaft 303 fixedly connected to the reduction gear 2 302 drives the bevel gear 1 304 to rotate, and the bevel gear 2 305 meshing with the bevel gear 1 304 drives the fixedly connected round rod 306 to rotate stably. The inner part of the plate rotates, thereby causing the slide groove 307 to rotate synchronously, and then the slider 308d slidably connected to the slide groove 307 drives the slide cylinder 308c to rotate inside the side fixed plate 308e, and the bevel gear 4 308b fixedly connected to the surface of the slide cylinder 308c drives the meshing bevel gear 3 308a to rotate, so that the rotating rod 210b fixedly connected to the bevel gear 3 308a drives the rotating plate 210a to rotate, and at the same time, the ball 210c fixedly connected to the rotating plate 210a rotates inside the rolling groove 210d, reducing the rotational friction of the rotating plate 210a, thereby causing the grinding roller 105 to rotate rapidly. At the same time, the quartz wafer can rotate synchronously at a slow speed, and can polish the entire side of the quartz wafer. Starting the pump 109 can extract the polishing liquid inside the liquid storage tank 108, and then spray it on the surface of the grinding roller 105 through the nozzle 110 to improve the polishing effect. Then, the scraper 107a can fit tightly with the grinding roller 105 under the elastic force of the spring 107b, and can clean the surface of the grinding roller 105. At the same time, the particles cleaned by the scraper 107a can fall into the inside of the water collection tank 106 through the leakage groove 107d, so that there will be no residual particles on the surface of the grinding roller 105 to scratch the quartz wafer.

[0057] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A quartz wafer polishing method, comprising a main unit (100), a fixing unit (200) and a polishing unit (300), characterized in that: The main unit (100) comprises a bottom plate (101), the upper surface of the bottom plate (101) being fixedly connected to two groups of vertical plates (102), and a grinding roller (105) being rotatably connected between the vertical plates (102), a side surface of one group of the vertical plates (102) being fixedly connected to a driving motor (103), and an output end of the driving motor (103) being fixedly connected to a rotating shaft (104), a surface of the rotating shaft (104) being rotatably connected to the vertical plates (102), and a surface of the rotating shaft (104) being fixedly connected to the grinding roller (105), a water collecting tank (106) being arranged between the two groups of the vertical plates (102), and a cleaning component (107) being arranged inside the water collecting tank (106), and a control panel being installed on the surface of one group of the vertical plates (102); The fixing unit (200) comprises a stand (201) fixedly connected to a set of stand plates (102); a lifting motor (202) is fixedly connected to the upper surface of the stand (201); a threaded rod (203) is fixedly connected to the output end of the lifting motor (202); a surface of the threaded rod (203) is rotatably connected to the stand (201); a threaded block (204) is threadedly connected to the surface of the threaded rod (203); and a connection member (204) is fixedly connected to the surface of the threaded block (204). The connecting plate (206) is provided with two sets of limit rods (205) which are slidably connected inside the threaded block (204), and the lower ends of the limit rods (205) are fixedly connected to the vertical plate (102); one end of the connecting plate (206) is fixedly connected to a clamping plate 1 (207), and a rotating assembly (210) is arranged inside the clamping plate 1 (207); the lower surface of the connecting plate (206) is slidably connected to a clamping plate 2 (208), and a pushing assembly (209) is arranged on one side of the clamping plate 2 (208); The polishing unit (300) comprises a reduction gear 1 (301) fixedly connected to a rotating shaft (104), and the upper side of the reduction gear 1 (301) is meshedly connected to a reduction gear 2 (302), the interior of the reduction gear 2 (302) is fixedly connected to a rotating shaft (303), and the surface of the rotating shaft (303) is rotatably connected to another vertical plate (102), the other end of the rotating shaft (303) is fixedly connected to a bevel gear 1 (304), and one side of the bevel gear 1 (304) is meshedly connected to a bevel gear 2 (305), the interior of the bevel gear 2 (305) is fixedly connected to a round rod (306), and the lower end of the round rod (306) is rotatably connected to a stabilizing plate, and the stabilizing plate is fixedly connected to another vertical plate (102), a sliding groove (307) is provided on one side surface of the round rod (306), and a transmission assembly (308) is provided on the surface of the sliding groove (307).

2. A quartz wafer polishing method according to claim 1, characterized in that: The cleaning component (107) comprises a scraper (107a) rotatably connected to the vertical plate (102); two groups of springs (107b) are fixedly connected to the upper surface of the scraper (107a); and the other ends of the springs (107b) are fixedly connected to fixed seats (107c); the surfaces of the two groups of fixed seats (107c) facing away from each other are fixedly connected to the vertical plate (102); the upper surface of the scraper (107a) is movably connected to the surface of the grinding roller (105); and a leakage groove (107d) is provided on the surface of the scraper (107a).

3. The method for polishing a quartz wafer according to claim 1, characterized in that: The pushing assembly (209) includes an electric push rod (209a) fixedly connected to the threaded block (204), and the output end of the electric push rod (209a) is fixedly connected to the second clamping plate (208), and the second clamping plate (208) is internally slidably connected with two groups of support rods (209b), and one end of the support rod (209b) is fixedly connected to the first clamping plate (207), and the other ends of the two groups of support rods (209b) are fixedly connected to the threaded block (204).

4. The method for polishing a quartz wafer according to claim 1, characterized in that: The rotating assembly (210) includes two groups of rotating plates (210a) arranged between the first clamp plate (207) and the second clamp plate (208); the surfaces of the two groups of rotating plates (210a) facing away from each other are fixedly connected with rotating rods (210b), and the surfaces of the rotating rods (210b) are respectively rotatably connected to the first clamp plate (207) and the second clamp plate (208); the surface of one group of rotating rods (210b) is fixedly connected with a limiting ring (210f), and the limiting ring (210f) is rotatably connected to the second clamp plate (208); the surfaces of the two groups of rotating plates (210a) facing each other are fixedly connected with soft pads (210e), and the soft pads (210e) are all made of rubber material.

5. A quartz wafer polishing method according to claim 4, characterized in that: The surfaces of the adjacent sides of the first clamping plate (207) and the second clamping plate (208) are both provided with rolling grooves (210d), and the surfaces of the opposite sides of the two sets of rotating plates (210a) are both fixedly connected with a plurality of balls (210c), and the balls (210c) are movably connected with the inner wall surfaces of the rolling grooves (210d).

6. A quartz wafer polishing method according to claim 1, characterized in that: The transmission assembly (308) includes a bevel gear three (308a) fixedly connected to another rotating rod (210b), and one side of the bevel gear three (308a) is meshingly connected to a bevel gear four (308b), the interior of the bevel gear four (308b) is fixedly connected to a slide cylinder (308c), and the slide cylinder (308c) is slidably connected to the round rod (306), and the inner wall surface of the slide groove (307) is slidably connected to a slider (308d), and the slider (308d) is fixedly connected to the slide cylinder (308c).

7. A quartz wafer polishing method according to claim 6, characterized in that: The surface of the slide cylinder (308c) is rotatably connected to a side fixing plate (308e), and the upper surface of the side fixing plate (308e) is rotatably connected to a support ring (308f), the side fixing plate (308e) is fixedly connected to the clamping plate (207), and the support ring (308f) is fixedly connected to the slide cylinder (308c).

8. The method for polishing a quartz wafer according to claim 1, characterized in that: One side surface of the reduction gear 2 (302) is rotatably connected to another vertical plate (102), and the inner diameter of the reduction gear 1 (301) is one quarter of the inner diameter of the reduction gear 1 (301).

9. The method for polishing a quartz wafer according to claim 1, characterized in that: A liquid storage tank (108) is provided on one side surface of the two groups of grinding rollers (105), and a pump (109) is installed on the side surface of the liquid storage tank (108) close to the grinding rollers (105), and a nozzle (110) is installed on one output end of the pump (109). Both side surfaces of the liquid storage tank (108) are fixedly connected to mounting plates (111), and the mounting plates (111) are fixedly connected to the vertical plate (102).

10. The method for using the quartz wafer polishing method according to claim 1, characterized in that: The following steps are involved: S1, clamping the quartz wafer between the first clamping plate (207) and the second clamping plate (208) by pushing the assembly (209), starting the lifting motor (202) to drive the threaded rod (203) to rotate, so that the height of the first clamping plate (207) can be flexibly adjusted, and then the quartz wafer is bonded to the surface of the grinding roller (105); S2, driving the rotating shaft (104) to rotate by the driving motor (103), so that the grinding roller (105) can polish the quartz wafer, and at the same time, the quartz wafer being polished is driven to rotate by the transmission component (308), so as to polish the side of the quartz wafer as a whole; S3. When the grinding roller (105) is rotating and polishing, the cleaning assembly (107) can clean the surface of the grinding roller (105), and at the same time, the pump (109) can extract the polishing liquid in the liquid storage tank (108) and spray it on the surface of the grinding roller (105) through the nozzle (110), thereby improving the polishing effect.

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