A microscopic infrared hotspot positioning test machine

Abstract

The invention relates to the field of infrared hotspot detection technology, and discloses a microscopic infrared hotspot positioning test machine, comprising a base, the back of the base is connected to a support frame, the bottom of the top of the support frame is connected to an electric push rod, and the bottom of the electric push rod is connected to an infrared imager; sealing mechanisms are arranged on both sides of the top of the base, which are used to form a relatively closed space above the base; a cleaning mechanism is arranged on the left side of the top of the base, which is used to clean the object to be detected; a temperature control mechanism is arranged on the top of the base, which is used to simulate an operating environment with different temperatures. By setting the temperature control mechanism, the temperature can be adjusted once after each rotation of the turntable, so as to complete the collection of infrared images of each group of chips on the turntable at each temperature stage, so as to obtain the detection results of the hotspots on the chip at each temperature stage, so as to detect the reliability of the chip under different temperature environments.

Description

Technical Field

[0001] The invention relates to the technical field of infrared hotspot detection, in particular to a microscopic infrared hotspot positioning test machine. Background Art

[0002] The micro-infrared hotspot positioning tester is a high-precision intelligent testing system designed for electronic product fault analysis (FA). It can be used in PCBA short-circuit hotspot failure analysis, IC device defect positioning, dynamic collection of temperature rise heat distribution, power device hot spot detection, integrated circuit failure analysis, lossless failure analysis, subtle defect detection, thermal gradient and other aspects.

[0003] In the prior art, thermal imaging technology is generally used to record and detect the state of the chip after the power is turned on to locate the hotspot. However, this method has certain limitations. The operating environment of the chip itself is different during conventional use. In particular, the temperature difference of the operating environment is large. The operating environment will be very different due to the fact that it is installed in different devices or different areas on the device. Therefore, it is necessary to simulate the operating state of the chip itself in different temperature environments to improve the overall reliability of the detection. Therefore, a microscopic infrared hotspot positioning tester is proposed to solve the above-mentioned problems. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies of the prior art, the present invention provides a microscopic infrared hotspot positioning test machine, which solves the problem of operating status detection under different temperature environments.

[0006] (II) Technical solution

[0007] To achieve the above object, the present invention provides the following technical solution: a microscopic infrared hotspot positioning test machine, comprising a base, a support frame connected to the back of the base, an electric push rod connected below the top of the support frame, and an infrared imager connected to the bottom of the electric push rod;

[0008] Sealing mechanisms are provided on both sides of the top of the base to form a relatively closed space above the base;

[0009] A cleaning mechanism is provided on the left side of the top of the base for cleaning the object to be detected;

[0010] A temperature control mechanism is arranged on the top of the base for simulating operating environments with different temperatures.

[0011] Preferably, a circular groove is provided on the top of the base, a turntable is rotatably connected inside the circular groove, a stepper motor for driving the turntable to rotate is connected to the inner wall of the base, a card slot is provided on the top of the turntable, and electrode contacts are connected to the top of the turntable on both sides of the card slot, an elastic electrode connecting rod is connected to the top of the base, and the elastic electrode connecting rod is used to electrically connect the electrode contacts, and a comparison slot is connected to the top right side of the base, by placing the chip to be tested in the card slot and placing the qualified chip in the comparison slot, and collecting images through the infrared imager above, by using two groups of chips to test at the same time, the image of the qualified chip can be collected as a reference, which can play a role in rapid comparison to determine whether there is an abnormal hot spot, and by providing multiple groups of card slots, multiple groups of chips can be tested, and the chip is replaced for testing by driving the turntable to rotate with a stepper motor, and the rotation angle each time is sixty degrees, and the elastic electrode connecting rod contacts the electrode contacts to facilitate the current to be turned on each time the chip is switched.

[0012] Preferably, the sealing mechanism includes a slide rail, which is connected to the side of the base. Both ends of the slide rail are respectively connected to sealing covers, which can be opened and closed conveniently by sliding on the slide rail. By arranging the sealing cover on the top of the base, the chip to be detected is relatively located in a relatively closed space, so that the internal environment is relatively stable, which can effectively reduce the influence of the external environment on the detection.

[0013] Preferably, a notch for fitting the electric push rod is provided on the top of the sealing cover, and sealing strips are respectively connected to corresponding sides of the sealing cover. The sealing strips can be provided to increase the sealing performance of the sealing cover after closing.

[0014] Preferably, the front side of the support frame is connected to a cylinder, and both ends of the inner wall of the cylinder are slidably connected to sliding columns, and the sliding columns are connected to the sealing cover at the corresponding positions, and the sliding columns slide in the cylinder to facilitate the closing or opening of the sealing cover.

[0015] Preferably, a first piston rod is connected to the lower part of the top of the support frame, and the telescopic end of the first piston rod is connected to the output end of the electric push rod. The interior of the first piston rod is connected to the interior of the cylinder through a first connecting tube. When the electric push rod drives the infrared imager to descend for image acquisition, the first piston rod is driven to extend. When the first piston rod is extended, the air in the cylinder is extracted through the first connecting tube, so that the sliding column is retracted into the interior of the cylinder, and the sealing cover is driven to close through the sliding column.

[0016] Preferably, the cleaning mechanism includes a second piston rod, which is connected to the top of the base, and the interior of the second piston rod is connected to a spring for resetting. An annular tube is provided between the second piston rods, and the interior of the annular tube is connected to the interior of the second piston rod through a second connecting tube. A nozzle is connected to the corresponding positions of the card slot and the comparison slot at the bottom of the annular tube, and the nozzle is inclined. By setting the second piston rod, during the sliding and closing process of the sealing cover, the sealing cover will contact and squeeze the second piston rod, so that the air inside the second piston rod enters the interior of the annular tube from the second connecting tube and is ejected from the nozzle, so as to facilitate the cleaning of impurities such as dust attached to the surface of the chip, and avoid the attachments affecting heat dissipation and subsequent detection.

[0017] Preferably, the temperature control mechanism includes a sliding rheostat connected to the top of the base. When the chip is tested, since the amount of heat generated by the sliding rheostat is related to the amount of resistance when current passes through it, the amount of heat generated by the sliding rheostat when current passes through it can be controlled by adjusting the resistance of the sliding rheostat, so as to facilitate the adjustment of the temperature in the molding cavity of the sealing cover, so as to facilitate the simulation of the state of the chip operating in different temperature environments and improve the overall reliability of the detection results.

[0018] Preferably, the top of the base is connected to a support rod, the top of the support rod is connected to a limiting ring, the inner wall of the limiting ring is slidably connected to a sliding rod, and the top of the sliding rod is connected to a limiting block, the outer wall of the sliding rod is provided with an annular groove, the outer wall of the sliding rod is provided with a supporting ring, and the supporting ring is connected to the sliding contact of the sliding rheostat.

[0019] Preferably, one side of the inner wall of the supporting ring is connected with a card connection frame, and the card connection frame is provided with a slide groove, and the inner wall of the slide groove is slidably connected with an inclined magnetic block, and the position between the inclined magnetic block and the inner wall of the slide groove is rotatably connected with an adjusting magnetic block, and the top of the adjusting magnetic block is connected with a knob, and the outer wall of the turntable is rotatably connected with an inclined push block. By arranging the inclined push block to be connected to one side of the turntable, when all the chips on the turntable are detected, the turntable rotates and rotates one circle, the inclined push block also contacts the slide rod once, and pushes the slide rod up through the inclined surface, and the magnetic force of the adjusting magnetic block repel the effect, the inclined magnetic block will be pushed, so that the inclined magnetic block is always in an extended state, but when the slide rod moves up, the annular groove is in contact with the inclined surface at the bottom of the inclined magnetic block, and the inclined magnetic block will be pushed into the slide groove at this time, and the supporting ring will not be driven to move, and when the inclined push block below leaves, the slide rod loses support. When the slider sinks due to its own gravity, the annular groove is against the plane of the inclined magnetic block when the slider descends. At this time, the slider can drive the supporting ring to move downward together when it descends, so that the supporting ring drives the sliding contact connected to the sliding rheostat to move together, so as to facilitate the adjustment of resistance, thereby achieving the purpose of adjusting the temperature, so as to facilitate the simulation of different temperature environments. Before the test, the adjustment magnetic block will be driven to rotate by turning the knob, and the inclined magnetic block will be retracted into the slide groove through the adsorption phenomenon of different magnetic poles to avoid getting stuck in the annular groove and affecting the movement of the slider. The sliding contact of the sliding rheostat is manually adjusted to the highest position, and then the test is carried out. The temperature can be adjusted once after each rotation of the turntable, so as to complete the acquisition of infrared images of each group of chips on the turntable at each temperature stage, so as to obtain the test results of each temperature stage of the hot spots on the chip, and to detect the reliability of the chip under different temperature environments.

[0020] (III) Beneficial effects

[0021] Compared with the prior art, the present invention provides a microscopic infrared hotspot positioning test machine, which has the following beneficial effects:

[0022] 1. The microscopic infrared hotspot positioning test machine can adjust the temperature after each rotation of the turntable by setting a temperature control mechanism, so as to complete the acquisition of infrared images of each group of chips on the turntable at each temperature stage, so as to obtain the detection results of the hot spots on the chip at each temperature stage, and detect the reliability of the chip under different temperature environments.

[0023] 2. The microscopic infrared hotspot positioning test machine is provided with a second piston rod. When the sealing cover slides and closes, the sealing cover will contact and squeeze the second piston rod, so that the air inside the second piston rod enters the inside of the annular tube from the second connecting tube and is ejected from the nozzle, so as to blow away dust and other impurities attached to the surface of the chip, avoid the attachments affecting heat dissipation and affecting subsequent detection.

[0024] 3. The microscopic infrared hotspot positioning test machine, by setting a sealing mechanism, makes the chip to be tested in a relatively closed space, making the internal environment relatively stable, which can effectively reduce the impact of the external environment on the detection, so as to improve the accuracy of the detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 A top view of the present invention;

[0027] Figure 3 It is a partial cross-sectional view of the present invention;

[0028] Figure 4 It is a structural schematic diagram of the cleaning mechanism in the present invention;

[0029] Figure 5 For the present invention Figure 3 A magnified view of A;

[0030] Figure 6 It is a structural schematic diagram of the turntable in the present invention;

[0031] Figure 7 It is a structural schematic diagram of the clamping frame in the present invention.

[0032] In the figure: 1. base; 11. round groove; 12. turntable; 121. slot; 122. electrode contact; 123. elastic electrode connecting rod; 13. comparison groove; 2. support frame; 21. electric push rod; 22. infrared imager; 3. sealing mechanism; 31. slide rail; 32. sealing cover; 33. notch; 34. sealing strip; 35. cylinder; 36. slide column; 37. first piston rod; 371. first connecting pipe; 4. cleaning Mechanism; 41, second piston rod; 42, annular tube; 43, second connecting tube; 44, nozzle; 5, temperature control mechanism; 51, sliding rheostat; 52, support rod; 521, limit ring; 53, slide rod; 531, limit block; 532, annular groove; 54, support ring; 541, snap-on frame; 5411, slide groove; 5412, inclined magnetic block; 5413, adjustment magnetic block; 5414, knob; 55, inclined push block. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1

[0035] like Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6As shown, a microscopic infrared hotspot positioning test machine includes a base 1, a support frame 2 is connected to the back of the base 1, an electric push rod 21 is connected to the bottom of the top of the support frame 2, and an infrared imager 22 is connected to the bottom of the electric push rod 21. Sealing mechanisms 3 are arranged on both sides of the top of the base 1 to form a relatively closed space above the base 1, a cleaning mechanism 4 is arranged on the left side of the top of the base 1 to clean the object to be tested, a temperature control mechanism 5 is arranged on the top of the base 1 to simulate an operating environment with different temperatures, a circular groove 11 is provided on the top of the base 1, a turntable 12 is rotatably connected to the inside of the circular groove 11, a stepping motor for driving the turntable 12 to rotate is connected to the inner wall of the base 1, a card slot 121 is provided on the top of the turntable 12, and the turntable 1 The top of the base 1 is connected to the electrode contacts 122 on both sides of the card slot 121, and the top of the base 1 is connected to an elastic electrode connecting rod 123, which is used to electrically connect the electrode contacts 122. The top of the right side of the base 1 is connected to a comparison slot 13. By placing the chip to be tested in the card slot 121 and the qualified chip in the comparison slot 13, the infrared imager 22 above is used to collect images. By using the method of using two groups of chips to test at the same time, the image of the qualified chip can be collected as a reference, which can play a role in rapid comparison to determine whether there is an abnormal hot spot. In addition, by opening a plurality of card slots 121, multiple groups of chips can be tested. The stepper motor is used to drive the turntable 12 to rotate. The chip is replaced for detection in this way, and the rotation angle is sixty degrees each time, and the elastic electrode connecting rod 123 contacts the electrode contact 122, so as to facilitate the current to be turned on each time the chip is switched. The sealing mechanism 3 includes a slide rail 31, and the slide rail 31 is connected to the side of the base 1. The two ends of the slide rail 31 are respectively connected with a sealing cover 32, and the sealing cover 32 slides on the slide rail 31 to facilitate opening and closing. By setting the sealing cover 32 to be set on the top of the base 1, the chip to be detected is relatively in a relatively closed space, so that the internal environment is relatively stable, and the influence of the external environment on the detection can be effectively reduced. The top of the sealing cover 32 is provided with a notch 33 for fitting the electric push rod 21, and the corresponding one between the sealing covers 32 The sides are respectively connected with sealing strips 34, and the sealing strips 34 can be provided to increase the sealing performance of the sealing cover 32 after closing. The front of the support frame 2 is connected with a cylinder 35, and the two ends of the inner wall of the cylinder 35 are respectively slidably connected with sliding columns 36, and the sliding columns 36 are connected to the sealing cover 32 at the corresponding position, and the sliding columns 36 slide in the cylinder 35 to facilitate the closing or opening of the sealing cover 32. A first piston rod 37 is connected to the bottom of the top of the support frame 2, and the telescopic end of the first piston rod 37 is connected to the output end of the electric push rod 21. The interior of the first piston rod 37 is connected to the interior of the cylinder 35 through a first connecting pipe 371. When the electric push rod 21 drives the infrared imager 22 to descend for image acquisition, the first piston rod 37 is driven to extend.When the first piston rod 37 is extended, it will draw air from the cylinder 35 through the first connecting pipe 371, so that the slide column 36 is retracted into the cylinder 35, and the sealing cover 32 is driven to close through the slide column 36.

[0036] In this embodiment, the chip to be tested is placed in the card slot 121, and the qualified chip is placed in the comparison slot 13. The electric push rod 21 drives the infrared imager 22 to descend for image acquisition. By adopting the method of simultaneously testing two groups of chips, the image of the qualified chip can be collected as a reference, which can play a role in rapid comparison to determine whether there is an abnormal hot spot. In addition, by providing multiple groups of card slots 121, multiple groups of chips can be tested. The stepper motor is used to drive the turntable 12 to rotate to replace the chip for testing. The rotation angle is sixty degrees each time, and the rotation angle is 60 degrees. By means of the elastic electrode connecting rod 123 contacting the electrode contact 122, it is convenient to turn on the current each time the chip is switched. While the infrared imager 22 is driven down by the electric push rod 21 to collect images, the first piston rod 37 is driven to extend. When the first piston rod 37 is extended, the air in the cylinder 35 is extracted through the first connecting tube 371, so that the sliding column 36 is retracted into the interior of the cylinder 35, and the sealing cover 32 is driven to close by the sliding column 36, so that the chip to be detected is relatively in a relatively closed space, so that the internal environment is relatively stable, which can effectively reduce the influence of the external environment on the detection.

[0037] Example 2

[0038] like Figure 4 As shown, the cleaning mechanism 4 includes a second piston rod 41, the second piston rod 41 is connected to the top of the base 1, the second piston rod 41 is internally connected with a spring for resetting, an annular tube 42 is arranged between the second piston rods 41, and the interior of the annular tube 42 is connected to the interior of the second piston rod 41 through a second connecting tube 43, and the positions corresponding to the card slot 121 and the comparison slot 13 at the bottom of the annular tube 42 are respectively connected with a nozzle 44, and the nozzle 44 is arranged at an angle. By arranging the second piston rod 41, during the sliding and closing process of the sealing cover 32, the sealing cover 32 will contact and squeeze the second piston rod 41, so that the air inside the second piston rod 41 enters the interior of the annular tube 42 from the second connecting tube 43 and is ejected from the nozzle 44, so as to facilitate the cleaning of impurities such as dust attached to the surface of the chip, and avoid the attachments affecting heat dissipation and subsequent detection.

[0039] In this embodiment, by providing a second piston rod 41, during the sliding and closing process of the sealing cover 32, the sealing cover 32 will contact and squeeze the second piston rod 41, so that the air inside the second piston rod 41 enters the interior of the annular tube 42 from the second connecting tube 43 and is ejected from the nozzle 44, so as to facilitate the removal of dust and other impurities attached to the surface of the chip, thereby preventing the attached objects from affecting heat dissipation and affecting subsequent detection.

[0040] Example 3

[0041] like Figure 3 , Figure 5 , Figure 6 , Figure 7As shown, the temperature control mechanism 5 includes a sliding rheostat 51, which is connected to the top of the base 1. When the chip is tested, the heat generated by the sliding rheostat 51 is related to the resistance when the current passes through, so that the heat generated by the sliding rheostat 51 when the current passes through can be controlled by adjusting the resistance of the sliding rheostat 51, so as to facilitate the adjustment of the temperature in the molding cavity of the sealing cover 32, so as to facilitate the simulation of the state of the chip operating in different temperature environments, and improve the overall reliability of the test results. The top of the base 1 is connected with a support rod 52, and the top of the support rod 52 is connected with a limit ring 521. The inner wall of the limit ring 521 is slidably connected with a slide rod 53, and the top of the slide rod 53 is connected with a limit block 531. An annular groove 532 is provided on the outer wall, a supporting ring 54 is provided on the outer wall of the slide rod 53, the supporting ring 54 is connected to the sliding contact of the sliding rheostat 51, a clamping frame 541 is connected to one side of the inner wall of the supporting ring 54, a slide groove 5411 is provided on the clamping frame 541, an inclined magnetic block 5412 is slidably connected to the inner wall of the slide groove 5411, an adjusting magnetic block 5413 is rotatably connected to the position between the inclined magnetic block 5412 and the inner wall of the slide groove 5411, and a knob 5414 is connected to the top of the adjusting magnetic block 5413, and an inclined push block 55 is rotatably connected to the outer wall of the turntable 12. By setting the inclined push block 55 to be connected to one side of the turntable 12, when all the chips on the turntable 12 are detected, the turntable 12 rotates one circle, and the inclined push block 55 is also connected to the slide rod 53. When the slider 53 is in contact with the outer surface, the annular groove 532 contacts the inclined surface at the bottom of the inclined magnet 5412, and the inclined magnet 5412 is pushed into the sliding groove 5411 without driving the supporting ring 54 to move. When the inclined push block 55 below leaves, the slider 53 loses its support, and the slider 53 sinks due to its own gravity. When the slider 53 descends, the annular groove 532 is against the plane of the inclined magnet 5412. At this time, the slider 53 can drive the supporting ring 54 to move downward together when it descends, so that the supporting ring 54 drives the connecting sliding variable The sliding contacts of the resistor 51 move together to facilitate the adjustment of resistance, thereby achieving the purpose of adjusting temperature, so as to facilitate the simulation of different temperature environments. Before the test, the adjustment magnet 5413 will be driven to rotate by turning the knob 5414. Through the adsorption phenomenon of different magnetic poles, the inclined magnet 5412 will be retracted into the slide groove 5411 to avoid being stuck in the annular groove 532 and affecting the movement of the slide rod 53. The sliding contacts of the sliding rheostat 51 are manually adjusted to the highest position, and then the test is performed. The temperature can be adjusted once after each rotation of the turntable 12, so as to complete the collection of infrared images of each group of chips on the turntable 12 at each temperature stage, so as to obtain the detection results of the hot spots on the chip at each temperature stage, so as to detect the reliability of the chip under different temperature environments.

[0042] When the slider 53 is moved downward, the annular groove 532 contacts the inclined surface of the bottom of the inclined magnet 5412, and the inclined magnet 5412 is pushed into the slide groove 5411 without moving the support ring 54. When the inclined push block 55 below leaves, the slider 53 loses its support and the slider 53 sinks due to its own gravity. When the slider 53 descends, the annular groove 532 contacts the plane of the inclined magnet 5412. At this time, the slider 53 can be lowered when it descends. The supporting ring 54 is driven to move downward, so that the supporting ring 54 drives the sliding contact connected to the sliding rheostat 51 to move together, so as to facilitate the adjustment of resistance, and then achieve the purpose of adjusting temperature, so as to facilitate the simulation of different temperature environments. Before the test, the adjustment magnet 5413 will be driven to rotate by turning the knob 5414, and the inclined magnet 5412 will be retracted into the slide groove 5411 through the adsorption phenomenon of different magnetic poles to avoid being stuck in the annular groove 532 and affecting the movement of the slide rod 53. The sliding contact of the sliding rheostat 51 is manually adjusted to the highest position, and then the test is carried out. The temperature can be adjusted once after each rotation of the turntable 12, so as to complete the collection of infrared images of each group of chips on the turntable 12 at each temperature stage, so as to obtain the detection results of the hot spots on the chip at each temperature stage, so as to detect the reliability of the chip under different temperature environments.

[0043] How it works

[0044] In summary, the microscopic infrared hotspot positioning test machine places the chip to be tested in the card slot 121, puts the qualified chip into the comparison slot 13, and drives the infrared imager 22 to descend for image acquisition through the electric push rod 21. By adopting the method of simultaneously testing two groups of chips, the image of the qualified chip can be collected as a reference, which can play a role in rapid comparison to determine whether there is an abnormal hotspot. In addition, by providing multiple groups of card slots 121, multiple groups of chips can be tested. The stepper motor drives the turntable 12 to rotate to replace the chip for testing. The rotation angle is sixty degrees each time. The elastic electrode connecting rod 123 contacts the electrode contact 122 to facilitate the current to be turned on each time the chip is switched. When the infrared imager 22 is driven down by the electric push rod 21 to collect images, the first piston rod 37 is driven to extend. When the first piston rod 37 is extended, the air in the cylinder 35 is extracted through the first connecting pipe 371, so that the sliding column 36 is retracted into the cylinder 35, and the sealing cover 32 is driven to close through the sliding column 36, so that the chip to be detected is relatively in a relatively closed space, so that the internal environment is relatively stable, which can effectively reduce the influence of the external environment on the detection. By setting the second piston rod 41, during the process of the sealing cover 32 sliding and closing, the sealing cover 32 will contact and squeeze the second piston rod 41, so that the air inside the second piston rod 41 enters the interior of the annular tube 42 from the second connecting pipe 43 and is ejected from the nozzle 44. When all the chips on the turntable 12 are inspected, the turntable 12 has rotated one circle, and the inclined push block 55 has contacted the slide bar 53 once, and pushed the slide bar 53 upward through the inclined surface. Due to the magnetic repulsion of the adjusting magnetic block 5413, the inclined magnetic block 5412 is pushed, so that the inclined magnetic block 5412 is always in an extended state. However, when the slide bar 53 moves upward, the annular groove 532 is in contact with the inclined surface at the bottom of the inclined magnetic block 5412, and the inclined magnetic block 5412 is pushed into the slide groove 5411, which will not drive the support ring 54 to move. When the inclined push block 55 below leaves, the slide bar 53 is lost. The support is removed. At this time, the slide bar 53 will sink due to its own gravity. When the slide bar 53 descends, the annular groove 532 is against the plane of the inclined magnetic block 5412. At this time, when the slide bar 53 descends, it can drive the supporting ring 54 to move downward together, so that the supporting ring 54 drives the sliding contact connected to the sliding rheostat 51 to move together, so as to facilitate the adjustment of resistance, thereby achieving the purpose of adjusting temperature, so as to facilitate the simulation of different temperature environments. Before the test, the adjustment magnetic block 5413 will be driven to rotate by turning the knob 5414, and the inclined magnetic block 5412 will be retracted into the slide groove 5411 through the adsorption phenomenon of different magnetic poles to avoid being stuck in the annular groove 532 and affecting the movement of the slide bar 53. The sliding contact of the sliding rheostat 51 is manually adjusted to the highest position, and then the test is carried out.The temperature can be adjusted once after each rotation of the turntable 12, so as to complete the acquisition of infrared images of each group of chips on the turntable 12 at each temperature stage, so as to obtain the detection results of each temperature stage of the hot spots on the chip, and detect the reliability of the chip under different temperature environments.

[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A microscopic infrared hotspot positioning test machine, comprising a base (1), characterized in that: The back of the base (1) is connected to a support frame (2), the bottom of the top of the support frame (2) is connected to an electric push rod (21), and the bottom of the electric push rod (21) is connected to an infrared imager (22); Sealing mechanisms (3) are provided on both sides of the top of the base (1) for forming a relatively closed space above the base (1); A cleaning mechanism (4) is provided on the left side of the top of the base (1) for cleaning the object to be detected; A temperature control mechanism (5) is provided on the top of the base (1) for simulating operating environments of different temperatures; A circular groove (11) is provided on the top of the base (1), a turntable (12) is rotatably connected inside the circular groove (11), a stepping motor for driving the turntable (12) to rotate is connected to the inner wall of the base (1), a clamping groove (121) is provided on the top of the turntable (12), and electrode contacts (122) are respectively connected to the top of the turntable (12) and on both sides of the clamping groove (121), an elastic electrode connecting rod (123) is connected to the top of the base (1), and the elastic electrode connecting rod (123) is used to electrically connect the electrode contacts (122), and a contrast groove (13) is connected to the top of the right side of the base (1); The temperature control mechanism (5) comprises a sliding rheostat (51), and the sliding rheostat (51) is connected to the top of the base (1); The top of the base (1) is connected to a support rod (52), the top of the support rod (52) is connected to a limit ring (521), the inner wall of the limit ring (521) is slidably connected to a slide rod (53), and the top of the slide rod (53) is connected to a limit block (531), the outer wall of the slide rod (53) is provided with an annular groove (532), the outer wall of the slide rod (53) is provided with a support ring (54), and the support ring (54) is connected to the sliding contact of the sliding rheostat (51); A snap-fit ​​frame (541) is connected to one side of the inner wall of the support ring (54), a slide groove (5411) is provided on the snap-fit ​​frame (541), an inclined magnetic block (5412) is slidably connected to the inner wall of the slide groove (5411), an adjusting magnetic block (5413) is rotatably connected to the position between the inclined magnetic block (5412) and the inner wall of the slide groove (5411), and a knob (5414) is connected to the top of the adjusting magnetic block (5413), and an inclined push block (55) is rotatably connected to the outer wall of the turntable (12).

2. The microscopic infrared hotspot positioning tester according to claim 1, characterized in that: The sealing mechanism (3) comprises a slide rail (31), the slide rail (31) being connected to a side surface of the base (1), and both ends of the slide rail (31) being respectively connected to sealing covers (32).

3. A microscopic infrared hotspot positioning tester according to claim 2, characterized in that: A notch (33) for fitting the electric push rod (21) is provided on the top of the sealing cover (32), and sealing strips (34) are respectively connected to corresponding sides of the sealing cover (32).

4. The microscopic infrared hotspot positioning tester according to claim 3, characterized in that: The front side of the support frame (2) is connected to a cylinder (35), and two ends of the inner wall of the cylinder (35) are slidably connected to sliding columns (36), and the sliding columns (36) are connected to the sealing covers (32) at corresponding positions.

5. The microscopic infrared hotspot positioning tester according to claim 4, characterized in that: A first piston rod (37) is connected below the top of the support frame (2), and a telescopic end of the first piston rod (37) is connected to an output end of the electric push rod (21), and the interior of the first piston rod (37) is connected to the interior of the cylinder (35) via a first connecting pipe (371).

6. The microscopic infrared hot spot positioning tester according to claim 5, characterized in that: The cleaning mechanism (4) comprises a second piston rod (41), the second piston rod (41) being connected to the top of the base (1), the interior of the second piston rod (41) being connected to a spring for resetting, an annular tube (42) being provided between the second piston rods (41), the interior of the annular tube (42) being connected to the interior of the second piston rod (41) via a second connecting tube (43), and nozzles (44) being connected to the positions of the bottom of the annular tube (42) corresponding to the card slot (121) and the comparison slot (13), respectively, and the nozzles (44) being arranged in an inclined manner.

Images