A transmission device for semiconductor processing equipment

Abstract

The present invention provides a transmission device for semiconductor processing equipment, including a mounting base plate, an adjustable side plate, a support plate, an adsorption frame, a steel pipe and a lifting frame, wherein the mounting base plate is symmetrically welded on both sides of the support plate, the adjustable side plate is integrally cast on the side of the top of the mounting base plate away from each other, the adsorption frame is arranged between two sets of adjustable side plates, and the lifting frame is arranged on the top of the support plate. The present invention can adjust the conveying position to adapt to production needs, and can independently and quickly perform detection operations on the conveying parts according to detection needs, so as to solve the problems that most of the existing transmission devices are fixed production lines, and their conveying positions cannot be adjusted. After debugging, they are fixed assembly lines, and their corresponding fixtures need to be adjusted and replaced according to the needs of the production line, and their adaptability is poor; the detection method during the transmission process is single, and a mechanical arm needs to intervene to adsorb the semiconductor transmission line, and then detect it, which affects the processing speed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a transmission device for semiconductor processing equipment. Background Art

[0002] The conveying devices in semiconductor processing equipment are usually used to convey the following semiconductor parts:

[0003] 1. Wafer: It is the basic material for manufacturing semiconductor devices;

[0004] 2. Chip: A semiconductor component that has completed some or all of the processing steps;

[0005] 3. Mask: a key part used in photolithography;

[0006] 4. Photoresist: used in the photolithography process;

[0007] 5. Chemical reagents: used for cleaning, etching and other processes;

[0008] 6. Metal interconnect material: used for connections inside the chip;

[0009] 7. Dopant: changes the conductivity of semiconductors;

[0010] 8. Substrate: the supporting structure of the chip;

[0011] 9. Test probe: used to test the performance of the chip;

[0012] 10. Packaging materials: packaging and protecting the chip;

[0013] 11.MEMS devices: micro-electromechanical system components;

[0014] 12. Sensor elements: such as temperature, pressure sensors, etc.;

[0015] 13.LED chip: the core part of the light-emitting diode.

[0016] These parts need to be transferred between different processing steps during the semiconductor manufacturing process to complete the entire manufacturing process. The role of the transmission device is to ensure the precise placement, rapid movement and efficient processing of the parts to improve production efficiency and product quality. The above-mentioned semiconductor parts that need to be transported during the processing, especially wafers, usually need to undergo the following inspections: Appearance inspection: Check whether there are defects, scratches or other abnormalities on the wafer surface; Size measurement: Ensure that the size of the wafer meets the specifications; Cleanliness inspection: Detect the cleanliness of the wafer surface; Flatness inspection: Confirm the flatness of the wafer surface; Crystal orientation inspection: Check whether the crystal orientation of the wafer is correct; Defect detection: Detect defects inside the wafer, such as lattice defects, impurities, etc.; Thickness measurement: Measure the thickness of the wafer; Resistance test: Evaluate the resistance characteristics of the wafer; Optoelectronic performance detection: Perform relevant performance tests on wafers with optoelectronic properties; Surface roughness detection: Understand the roughness of the wafer surface.

[0017] The purpose of these tests is to ensure that wafer quality meets requirements, detect problems in a timely manner, prevent defective wafers from entering subsequent processing links, and provide data support for process optimization.

[0018] The detection methods include: 1. Manual visual inspection; 2. Use of automated detection equipment.

[0019] The transmission device of the existing semiconductor processing equipment has the following defects:

[0020] 1. Most of the transmission devices are fixed production lines, and their conveying positions cannot be adjusted. After debugging, they are fixed production lines. The corresponding fixtures need to be adjusted and replaced according to the needs of the production line, and the adaptability is poor;

[0021] 2. The detection method during the transmission process is single, and a robotic arm is required to intervene to absorb the semiconductor transmission line and then detect it. It is not suitable for detection and affects the processing speed. Summary of the invention

[0022] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a transmission device for semiconductor processing equipment, which can adjust the transmission position to adapt to production needs and can independently and quickly perform detection operations on the conveyed parts according to detection needs, so as to solve the problems that most of the existing transmission devices are fixed production lines and cannot adjust their transmission positions. After debugging, they are fixed assembly lines, and their corresponding fixtures need to be adjusted and replaced according to the needs of the production line, and have poor adaptability; the detection method during the transmission process is single, and a robotic arm needs to intervene to adsorb the semiconductor transmission line and then detect it, which is not suitable for detection and affects the processing speed.

[0023] In order to achieve the above-mentioned purpose, the present invention is realized through the following technical scheme: a transmission device for semiconductor processing equipment, comprising a mounting base plate, an adjustable side plate, a support plate, an adsorption frame, a steel pipe and a lifting frame, wherein the mounting base plate is symmetrically welded on both sides of the support plate, the adjustable side plate is integrally cast on the side of the top of the mounting base plate away from each other, the adsorption frame is arranged between two groups of adjustable side plates, the lifting frame is arranged on the top of the support plate, the side of the lifting frame close to each other is fixedly installed by a steel pipe, and a plurality of groups of spaced transmission blocks are slidably installed on the top of the lifting frame;

[0024] The driving mechanism is arranged on one side of the inner wall of the supporting plate and is used to drive the lifting frame to perform circular lifting, pushing and feeding;

[0025] A lifting height adjustment mechanism is provided between the lifting frame and the support plate and is used to adjust the longitudinal distance between the lifting frame and the support plate;

[0026] The conveying height adjustment mechanism is arranged inside the adjustable side plate and is used to adjust the conveying height of the adsorption rack;

[0027] The conveying interval adjustment mechanism is arranged on both sides of the lifting frame and is used to adjust the interval of the semiconductor after conveying;

[0028] The feeding synchronization detection mechanism is arranged on the interval transmission block and is used for lifting, transferring and transmitting the semiconductor and flipping the semiconductor at the top.

[0029] Furthermore, the lifting height adjustment mechanism includes a supporting shaft frame, a lifting shaft, a lifting height adjustment frame, a fixed block, an adjusting screw, an adjusting block and a transmission shaft, the supporting shaft frame is welded on both sides of the top of the supporting plate, the lifting shaft is fixedly installed on both sides of the side where the two groups of lifting frames are away from each other, the lifting height adjustment frame is rotatably installed on the surface of the lifting shaft, the fixed block is fixedly installed on the top of one side of the lifting height adjustment frame by bolts, the adjusting screw is rotatably installed on the top of the fixed block, the adjusting block is threadedly connected to the bottom of the surface of the adjusting screw, the transmission shaft is fixedly installed on one side of the adjustment block close to the supporting shaft frame, the transmission shaft passes through the supporting shaft frame and rotates with the supporting shaft frame, and the surface of the adjusting screw is clamped with a retaining spring located at the bottom of the fixed block.

[0030] Furthermore, the driving mechanism includes a reduction motor 1, a first driving wheel, a second driving wheel, a third driving wheel and a belt. The reduction motor 1 is fixedly mounted on one side of the inner wall of the support plate, and the output end of the reduction motor 1 passes through the support plate and is fixedly mounted on the first driving wheel. The second driving wheel is provided with two groups, and the two groups of second driving wheels are symmetrically mounted on the top of the support plate near the first driving wheel. The third driving wheel is provided with two groups, and the two groups of third driving wheels are fixedly mounted on the transmission shaft. The belt is sleeved on the surfaces of the third driving wheel, the second driving wheel and the first driving wheel, and the first driving wheel is transmission-connected to the third driving wheel via a belt.

[0031] Furthermore, the conveying height adjustment mechanism includes a stepper motor, a screw rod, a screw sleeve, a conveying height adjustment sleeve, an inclination adapter sleeve and an adsorption plate. The stepper motor is fixedly mounted on the bottom of the adjustable side plate, the screw rod is fixedly mounted on the output end of the stepper motor, the screw sleeve is slidably mounted inside the adjustable side plate and is threadedly connected to the screw rod, the conveying height adjustment sleeve is rotatably mounted with the screw sleeve through an axle pin, the inclination adapter sleeve is fixedly mounted on both ends of the adsorption frame and slidably cooperates with the conveying height adjustment sleeve, and a plurality of adsorption plates are fixedly mounted on the top of the adsorption frame, and the adsorption plates are all connected to an external air source through an air pipe.

[0032] Furthermore, the conveying interval adjustment mechanism includes a limiting side plate, a second reduction motor, a second screw, a lifting block, a limiting bar, an adjusting shaft, an adjusting plate and an adjusting slot. The second reduction motor is fixedly embedded in both sides of the lifting frame, the second screw is fixedly installed at the output end of the second reduction motor, the lifting block is threadedly connected to the surface of the second screw, the adjusting plate and the two groups of the lifting blocks are fixedly installed, the limiting side plate is fixedly installed on the side of the lifting frame close to each other, the limiting bar is fixedly installed on the top and bottom of the limiting side plate close to the interval transmission block by bolts, the adjusting shaft is fixedly installed on the top of the interval transmission block close to the adjustment plate, the adjusting slot is opened inside the adjusting plate, and the number of the openings corresponds to the number of interval transmission blocks, the adjusting shaft is slidably matched with the adjusting slot, several groups of the adjusting slots are located in the middle and are vertical longitudinal slots, and the remaining several groups of adjusting slots away from the middle are symmetrically inclined.

[0033] Furthermore, the feeding synchronization detection mechanism includes a ejection plate, a rotating frame, a positioning block, a rotating shaft, a conveying plate, an anti-separation component and a flipping component, the ejection plate is fixedly installed on the top of the interval transmission block by bolts, and the bottom of the ejection plate is close to the limiting side plate on one side and slides with the limiting side plate, the rotating frame is slidably installed on the top of the ejection plate, and the cross-section of the bottom of the rotating frame and the top sliding part of the ejection plate is trapezoidal in design, the positioning block is welded on both sides of the rotating frame away from the interval transmission block, the positioning block is fixed by friction with the top of the ejection plate by bolts, the rotating shaft is rotatably installed inside the rotating frame, the conveying plate is welded at the end of the rotating shaft away from the interval transmission block, the anti-separation component is arranged on the top of the rotating shaft, for limiting and preventing the semiconductor on the top of the conveying plate from separating, so as to facilitate stable flipping through the flipping component, and the flipping component is arranged on the limiting side plate, for driving the rotating shaft to flip.

[0034] Furthermore, the anti-disengagement component includes a connecting block, an electric push rod 1 and a limiting clamp, the connecting block is fixedly installed on the top of the rotating shaft, the electric push rod 1 is fixedly installed on the top of the connecting block, and the limiting clamp is fixedly installed on the output end of the electric push rod 1.

[0035] Furthermore, the flipping assembly includes an electric push rod 2, a gear cylinder, a drive plate and a tooth plate. The electric push rod 2 is fixedly mounted on one side of the top of the limiting side plate, the gear cylinder is fixedly mounted on the side of the rotating shaft surface away from the limiting clamping plate, the drive plate is fixedly mounted on the output end of the electric push rod 2, the tooth plate is slidably mounted on the top of the spacing transmission block, and the top of the tooth plate is meshed with the gear cylinder.

[0036] Furthermore, a mounting plate is fixedly mounted on the top of the supporting shaft frame, an infrared proximity sensor is fixedly mounted inside the mounting plate, and the infrared proximity sensor is used in conjunction with the lifting height adjustment frame.

[0037] The beneficial effects of the present invention are as follows: the present invention drives the lifting frame to move horizontally in a circular manner through a driving mechanism in cooperation with a lifting height adjustment mechanism to push the wafer, and when the circular lifting reaches the highest point, the feeding synchronization detection mechanism can be cooperated to limit the wafer and then flip the wafer for convenient detection, and after detection, it can be placed on the top of the adsorption frame more accurately. When the wafer specifications change, the conveying interval adjustment mechanism can be used to change the conveying interval of the wafer, and the lifting height adjustment mechanism can be used at the same time to complete the adaptation of the assembly line, thereby improving adaptability and detection convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0039] Figure 1It is a structural schematic diagram of the present invention;

[0040] Figure 2 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0041] Figure 3 It is a schematic diagram of the three-dimensional structure of the mounting substrate of the present invention;

[0042] Figure 4 It is a schematic diagram of the exploded three-dimensional structure of the conveying interval adjustment mechanism of the present invention;

[0043] Figure 5 It is a schematic diagram of the three-dimensional structure of the interval transmission block of the present invention;

[0044] Figure 6 It is a schematic diagram of the three-dimensional explosion structure of the synchronous detection mechanism for feeding of the present invention;

[0045] Figure 7 For the present invention Figure 1 The enlarged schematic diagram of point A in the middle;

[0046] Figure 8 It is a schematic diagram of the three-dimensional exploded structure of the jacking height adjustment frame of the present invention;

[0047] Fig. 9 For the present invention Figure 1 A magnified schematic diagram of point B in the middle.

[0048] In the figure: 1, mounting base plate; 11, adjustable side plate; 111, stepping motor; 112, screw rod 1; 113, screw sleeve; 114, conveying height adjustment sleeve; 115, inclination adaptation set; 2, reduction motor 1; 21, first driving wheel; 22, second driving wheel; 23, third driving wheel; 24, belt; 3, support plate; 31, support shaft frame; 311, mounting plate; 312, infrared proximity sensor; 4, adsorption frame; 41, adsorption plate; 5, lifting frame; 501, limit side plate; 502, limit strip; 503, interval transmission block; 504, adjustment Joint shaft; 505, adjustment plate; 506, adjustment slot; 51, lifting shaft; 511, reduction motor 2; 512, screw 2; 513, lifting block; 52, lifting height adjustment frame; 53, fixing block; 54, adjusting screw; 55, adjusting block; 56, transmission shaft; 6, ejector plate; 61, rotating frame; 611, positioning block; 62, rotating shaft; 63, conveyor plate; 64, connecting block; 641, electric push rod 1; 642, limit clamp; 65, electric push rod 2; 651, gear cylinder; 652, drive plate; 653, tooth plate; 7, steel pipe. DETAILED DESCRIPTION

[0049] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0050] See also Figure 1 , Figure 1 It is a structural schematic diagram of the present invention.

[0051] A transmission device for semiconductor processing equipment, a transmission device for semiconductor processing equipment, comprising a mounting base plate 1, an adjustable side plate 11, a support plate 3, an adsorption frame 4, a steel pipe 7 and a lifting frame 5, the mounting base plate 1 is symmetrically welded on both sides of the support plate 3, the adjustable side plate 11 is integrally cast on the side of the top of the mounting base plate 1 away from each other, the adsorption frame 4 is arranged between two groups of adjustable side plates 11, the lifting frame 5 is arranged on the top of the support plate 3, the side of the lifting frame 5 close to each other is fixedly installed by the steel pipe 7, and a plurality of groups of spaced transmission blocks 503 are slidably installed on the top of the lifting frame 5;

[0052] The driving mechanism is arranged on one side of the inner wall of the support plate 3 and is used to drive the lifting frame 5 to perform annular lifting, pushing and feeding;

[0053] A lifting height adjustment mechanism is provided between the lifting frame 5 and the support plate 3 and is used to adjust the longitudinal distance between the lifting frame 5 and the support plate 3;

[0054] The conveying height adjustment mechanism is arranged inside the adjustable side plate 11 and is used to adjust the conveying height of the adsorption rack 4;

[0055] The conveying interval adjustment mechanism is arranged on both sides of the lifting frame 5 and is used to adjust the interval of the semiconductor after conveying;

[0056] The feeding synchronization detection mechanism is arranged on the interval transmission block 503 and is used to lift, transfer and transmit the semiconductor and flip the semiconductor at the top.

[0057] See also Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 , Figure 2 It is a schematic diagram of a partial three-dimensional structure of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the mounting substrate of the present invention; Figure 4 It is a schematic diagram of the exploded three-dimensional structure of the conveying interval adjustment mechanism of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the interval transmission block of the present invention; Figure 6 It is a schematic diagram of the three-dimensional explosion structure of the synchronous detection mechanism for feeding of the present invention; Figure 7 For the present invention Figure 1 The enlarged schematic diagram of point A in the middle; Figure 8 It is a schematic diagram of the three-dimensional exploded structure of the jacking height adjustment frame of the present invention; Fig. 9For the present invention Figure 1 A magnified schematic diagram of point B in the middle.

[0058] The lifting height adjustment mechanism includes a support shaft frame 31, a lifting shaft 51, a lifting height adjustment frame 52, a fixed block 53, an adjusting screw 54, an adjusting block 55 and a transmission shaft 56. The support shaft frame 31 is welded to both sides of the top of the support plate 3. The lifting shaft 51 is fixedly installed on both sides of the side where the two groups of lifting frames 5 are away from each other. The lifting height adjustment frame 52 is rotatably installed on the surface of the lifting shaft 51. The fixed block 53 is fixedly installed on the top of one side of the lifting height adjustment frame 52 by bolts. The adjusting screw 54 is rotatably installed on the top of the fixed block 53. The adjusting block 55 is threadedly connected to the bottom of the surface of the adjusting screw 54. The transmission shaft 56 is fixedly installed on one side of the adjusting block 55 close to the support shaft frame 31. The transmission shaft 56 penetrates the support shaft frame 31 and rotates with the support shaft frame 31. The surface of the adjusting screw 54 is clamped with a retaining spring located at the bottom of the fixed block 53.

[0059] The support shaft frame 31 provides support for the transmission shaft 56, and can be driven to rotate by connection with the third driving wheel 23. The rotating transmission shaft 56 can drive the adjustment block 55 to rotate accordingly. The rotation of the adjustment block 55 drives the lifting height adjustment frame 52 to twist accordingly through the limit of the lifting height adjustment frame 52. At the same time, due to the threaded connection relationship between the adjusting screw 54 and the adjusting block 55, the vertical distance between the axial line of the lifting shaft 51 and the transmission shaft 56 can be controlled, so as to facilitate the adjustment of the lifting height and the lateral transmission distance of the overall lifting frame 5. When the vertical distance between the transmission shaft 56 and the axial line of the lifting shaft 51 is the largest, the twisted lifting height adjustment frame 52 annularly lifts the lifting shaft 51. The lateral moving distance of the push is in the maximum range, which is convenient for conveying larger wafers. Similarly, when the vertical distance between the axis of the transmission shaft 56 and the lifting shaft 51 is the smallest, it is convenient for conveying smaller wafers. The adjustment of the adjustment block 55 requires the use of a wrench to twist the top of the adjusting screw 54. The adjusting screw 54 cooperates with the limit of the retaining spring to prevent up and down movement. At the same time, it can drive the adjustment block 55 threadedly connected to it to be limited by the lifting height adjustment frame 52 and then stably adjusted up and down, which is convenient for driving the transmission shaft 56 and the lifting shaft 51 to adjust the vertical distance between their axes. The fixed block 53 can limit the rotation of the adjusting screw 54, and at the same time, it is convenient to dismantle and repair or replace the adjusting block 55 and the adjusting screw 54.

[0060] The driving mechanism includes a reduction motor 2, a first driving wheel 21, a second driving wheel 22, a third driving wheel 23 and a belt 24. The reduction motor 2 is fixedly mounted on one side of the inner wall of the support plate 3. The output end of the reduction motor 2 passes through the support plate 3 and is fixedly mounted on the first driving wheel 21. Two groups of second driving wheels 22 are provided, and the two groups of second driving wheels 22 are symmetrically rotated and mounted on the top of the support plate 3 near the first driving wheel 21. Two groups of third driving wheels 23 are provided, and the two groups of third driving wheels 23 are fixedly mounted on the transmission shaft 56. The belt 24 is sleeved on the surfaces of the third driving wheel 23, the second driving wheel 22 and the first driving wheel 21. The first driving wheel 21 is connected to the third driving wheel 23 through the belt 24.

[0061] After the reduction motor 2 is started, it can drive the first drive wheel 21 to rotate through the reduction output. The first drive wheel 21 is tensioned by the two sets of second drive wheels 22 through the belt 24, and then drives the two sets of third drive wheels 23 to rotate synchronously, so as to drive the transmission shaft 56 to rotate through the third drive wheel 23.

[0062] The conveying height adjustment mechanism includes a stepping motor 111, a screw rod 112, a screw sleeve 113, a conveying height adjustment sleeve 114, an inclination adapter sleeve 115 and an adsorption plate 41. The stepping motor 111 is fixedly mounted at the bottom of the adjustable side plate 11, the screw rod 112 is fixedly mounted at the output end of the stepping motor 111, the screw sleeve 113 is slidably mounted inside the adjustable side plate 11 and is threadedly connected to the screw rod 112, the conveying height adjustment sleeve 114 is rotatably mounted with the screw sleeve 113 through an axle pin, the inclination adapter sleeve 115 is fixedly mounted at both ends of the adsorption frame 4, and is slidably matched with the conveying height adjustment sleeve 114, and a plurality of adsorption plates 41 are fixedly mounted on the top of the adsorption frame 4, and the adsorption plates 41 are all connected to the external air source through the air pipe;

[0063] When the two corresponding stepper motors 111 are started independently, the output end can be used to drive the screw 112 to rotate. The rotation of the screw 112 drives the screw sleeve 113 to cooperate with the limit of the adjustable side plate 11 to adjust the height up and down, so as to adapt to different conveying heights and adapt to the next stage of assembly line processing. When the conveying height is changed, the vertical distance between the axes of the transmission shaft 56 and the lifting shaft 51 is synchronously adjusted, so that the new conveying requirements can be adapted after adjustment. At the same time, the conveying height adjustment sleeve 114 and the screw sleeve 113 are rotatably installed so that the inclination adaptation sleeve 115 and the adsorption frame 4 can be tilted to adapt to small-angle conveying height changes. Finally, the adsorption force of the adsorption plate 41 can prevent the wafer from falling during transportation, and when it falls on the top of the adsorption frame 4, it can be fixed by the adsorption force of the adsorption plate 41.

[0064] The conveying interval adjustment mechanism includes a limiting side plate 501, a second reduction motor 511, a second screw rod 512, a lifting block 513, a limiting bar 502, an adjusting shaft 504, an adjusting plate 505 and an adjusting slot 506. The second reduction motor 511 is fixedly embedded on both sides of the lifting frame 5, the second screw rod 512 is fixedly installed at the output end of the second reduction motor 511, the lifting block 513 is threadedly connected to the surface of the second screw rod 512, the adjusting plate 505 is fixedly installed with two groups of lifting blocks 513, and the limiting side plate 501 is fixedly installed on the side of the lifting frame 5 close to each other. The limit bar 502 is fixedly installed on the top and bottom of the limit side plate 501 close to the spacing transmission block 503 by bolts, the adjustment shaft 504 is fixedly installed on the top of the spacing transmission block 503 close to the adjustment plate 505, the adjustment slots 506 are opened inside the adjustment plate 505, and the number of the openings corresponds to the number of spacing transmission blocks 503, the adjustment shaft 504 and the adjustment slots 506 are slidably matched, and several groups of adjustment slots 506 located in the middle are all vertical longitudinal slots, and the remaining several groups of adjustment slots 506 away from the middle are all symmetrically inclined.

[0065] After the limiting side plate 501 is fixed on the lifting frame 5, it can provide sliding limiting for multiple interval transmission blocks 503. When the interval positions of the interval transmission blocks 503 need to be adjusted, the reduction motor 2 511 is started to drive the lifting block 513 threadedly connected to it to move up and down through the output end, and then the lifting block 513 drives the adjustment plate 505 fixed to it to move up and down. The adjustment plate 505 slides with the adjustment shaft 504 through the internal adjustment groove 506. When moving downward, the multiple groups of interval transmission blocks 503 can be moved away from each other, and the interval transmission blocks 503 are more stably limited by the limiting strip 502 during the lateral sliding process. When the adjustment plate 505 moves upward, the multiple groups of interval transmission blocks 503 can be brought closer to each other, thereby achieving the effect of conveying detection adjustment.

[0066] The feeding synchronization detection mechanism includes a feed plate 6, a rotating frame 61, a positioning block 611, a rotating shaft 62, a conveying plate 63, an anti-separation component and a flipping component. The feed plate 6 is fixedly installed on the top of the interval transmission block 503 by bolts. The bottom of the feed plate 6 is close to the limiting side plate 501 and slides with the limiting side plate 501. The rotating frame 61 is slidably installed on the top of the feed plate 6. The cross-section of the sliding part between the bottom of the rotating frame 61 and the top of the feed plate 6 is trapezoidal in design. The positioning blocks 611 are welded on both sides of the rotating frame 61 away from the interval transmission block 503. The positioning blocks 611 are fixed by friction with the top of the feed plate 6 by bolts. The rotating shaft 62 is rotatably installed inside the rotating frame 61. The conveying plate 63 is welded at one end of the rotating shaft 62 away from the interval transmission block 503. The anti-separation component is arranged on the top of the rotating shaft 62, which is used to limit and prevent the semiconductor on the top of the conveying plate 63 from separating, so as to facilitate stable flipping through the flipping component. The flipping component is arranged on the limiting side plate 501, which is used to drive the rotating shaft 62 to flip.

[0067] After being fixed on the interval transmission block 503, the ejector plate 6 can slide and support the rotating frame 61 through the sliding cooperation between the bottom supporting structure and the limiting side plate 501. At the same time, the sliding part between the bottom of the rotating frame 61 and the top of the ejector plate 6 adopts a trapezoidal design, which can prevent the rotating frame 61 and the ejector plate 6 from falling up and down and separating. The rotating frame 61 can be frictionally fixed at any position on the top of the ejector plate 6 by rotating the mounting bolts in the positioning block 611, which is convenient for adjustment to adapt to wafers of different sizes. Therefore, when the lifting frame 5 rotates clockwise around the transmission shaft 56, the interval transmission block 503 will lift the wafer from the left quadrant point to the right quadrant through the top rotating shaft 62 and the transmission plate 63. At this point, a clockwise circular lifting and conveying process is completed. During the lifting process of the interval transmission block 503, the rotating shaft 62 inside the rotating frame 61 cooperates with the conveying plate 63 to lift the wafer on the left side of the adsorption frame 4 to the right side of the adsorption frame 4. At the same time, when it is lifted to the highest point, the wafer can be restricted by the anti-separation component. Then, the rotating shaft 62 is flipped in cooperation with the flipping component to drive the conveying plate 63 to flip the wafer on the top of the conveying plate 63 vertically, which is convenient for detection operation and does not require manual picking and putting back. After the detection is completed, it is flipped to a horizontal state through the flipping component. Finally, the restriction is released through the anti-separation component, and the wafer can be stably conveyed again.

[0068] The anti-separation assembly includes a connecting block 64, an electric push rod 641 and a limiting clamp 642. The connecting block 64 is fixedly mounted on the top of the rotating shaft 62, the electric push rod 641 is fixedly mounted on the top of the connecting block 64, and the limiting clamp 642 is fixedly mounted on the output end of the electric push rod 641.

[0069] The connecting block 64 is fixed on the top of the rotating shaft 62 and can rotate with the rotating shaft 62. At the same time, starting the electric push rod 641 can drive the limiting clamp 642 to advance toward the conveying material plate 63, and press and limit the wafer on the conveying material plate 63 up and down to prevent the wafer from falling when flipping.

[0070] The flip assembly includes an electric push rod 65, a gear cylinder 651, a drive plate 652 and a tooth plate 653. The electric push rod 65 is fixedly mounted on one side of the top of the limiting side plate 501, the gear cylinder 651 is fixedly mounted on the side of the surface of the rotating shaft 62 away from the limiting clamping plate 642, the drive plate 652 is fixedly mounted on the output end of the electric push rod 65, the tooth plate 653 is slidably mounted on the top of the interval transmission block 503, and the top of the tooth plate 653 is meshed with the gear cylinder 651;

[0071] After the electric push rod 65 is started, it can drive the drive plate 652 to follow the movement through the output end, and the drive plate 652 drives the tooth plate 653 to move horizontally, thereby driving the gear cylinder 651 meshing with it to rotate. The rotation of the gear cylinder 651 drives the rotating shaft 62 fixed to it to rotate, so that the rotating shaft 62 drives the transmission plate 63 to rotate, and the transmission plate 63 cooperates with the limiting clamp 642 to flip the wafer for easy detection operation.

[0072] A mounting plate 311 is fixedly mounted on the top of the support shaft frame 31, and an infrared proximity sensor 312 is fixedly mounted inside the mounting plate 311. The infrared proximity sensor 312 is used in conjunction with the lifting height adjustment frame 52;

[0073] The mounting plate 311 is fixed at the angle to be detected on the top of the support shaft frame 31, and then the infrared proximity sensor 312 is installed to detect the signal of whether the lifting height adjustment frame 52 is at the top after being flipped. If detection is required, when the infrared proximity sensor 312 detects that the lifting height adjustment frame 52 is flipped and is at the top, the reduction motor 2 is turned off, and then the wafer is flipped through the flipping mechanism and the anti-detachment mechanism, which is convenient for detection during the transmission process.

[0074] Working principle: When it is necessary to transfer the wafer, the position of the rotating frame 61 on the top of the ejector plate 6 is adjusted by sliding according to the specifications of the wafer. After the position is determined, the bolts in the positioning block 611 are rotated to fix the rotating frame 61 on the top of the ejector plate 6. Then, the reduction motor 2 511 is started according to the required conveying interval, and the lifting block 513 threadedly connected thereto is driven up and down through the output end, and then the lifting block 513 drives the adjustment plate 505 fixed thereto to move up and down. The adjustment plate 505 slides with the adjustment shaft 504 through the internal adjustment groove 506. When moving downward, multiple groups of interval transmission blocks 503 can be moved away from each other, and the interval transmission blocks 503 are more stably limited by the limit strip 502 during the lateral sliding process. When the adjustment plate 505 moves upward, multiple groups of interval transmission blocks 503 can be brought closer to each other. After the conveying interval adjustment is completed, the reduction motor 2 511 can be turned off.

[0075] Then, the lifting height is adjusted according to the specifications of the wafers produced in this batch. By using a wrench to twist the top of the adjusting screw 54, the adjusting screw 54 cooperates with the limit of the retaining spring to prevent up and down movement. At the same time, the adjusting block 55 threadedly connected thereto can be driven to be stably adjusted up and down after being limited by the lifting height adjustment frame 52, which is convenient for driving the transmission shaft 56 and the lifting shaft 51 to adjust the vertical distance between the axes. The fixed block 53 can limit the rotation of the adjusting screw 54. After the adjustment is completed;

[0076] Then, according to the required conveying height, two sets of corresponding stepper motors 111 are started. When started independently, the output end can be used to drive the screw 112 to rotate. The rotation of the screw 112 drives the screw sleeve 113 to cooperate with the limit of the adjustable side plate 11 to adjust the height up and down, so as to adapt to different conveying heights and adapt to the next stage of assembly line processing. When the conveying height is changed, the vertical distance between the axis of the transmission shaft 56 and the lifting shaft 51 is synchronously adjusted, so that the new conveying requirements can be adapted after adjustment. At the same time, the conveying height adjustment sleeve 114 and the screw sleeve 113 are rotatably installed so that the inclination adaptation sleeve 115 and the adsorption frame 4 can be tilted to adapt to the small angle conveying height change. Finally, the adsorption force of the adsorption plate 41 can be used to prevent the wafer from falling during transportation. When it falls on the top of the adsorption frame 4, it can be fixed by the adsorption force of the adsorption plate 41. The stepper motor 111 is started synchronously to adjust the height as a whole.

[0077] After all adjustments are completed, the reduction motor 2 is started to drive the first driving wheel 21 to rotate through the reduction output, and the first driving wheel 21 is tensioned by the two sets of second driving wheels 22 through the belt 24, and then drives the two sets of third driving wheels 23 to rotate synchronously, so as to drive the transmission shaft 56 to rotate through the third driving wheel 23. The rotating transmission shaft 56 can drive the adjustment block 55 to rotate accordingly, and the adjustment block 55 rotates and then drives the lifting height adjustment frame 52 to follow the twisting through the limit of the lifting height adjustment frame 52, and the lifting height adjustment frame 52 drives the lifting frame 5 to rotate clockwise around the transmission shaft 56 through the lifting shaft 51;

[0078] By rotating the mounting bolts in the positioning block 611, the rotating frame 61 can be frictionally fixed at any position on the top of the ejector plate 6, so as to be adjusted to suit wafers of different sizes. When the lifting frame 5 rotates clockwise around the transmission shaft 56, the interval transmission block 503 will lift the wafer from the left quadrant point to the right quadrant point through the top rotating shaft 62 and the conveying plate 63, completing a clockwise circular lifting and conveying process. During the lifting process of the interval transmission block 503, the rotating shaft 62 inside the rotating frame 61 cooperates with the conveying plate 63 to lift the wafer on the left side of the adsorption frame 4 to the right side of the adsorption frame 4. At the same time, if detection is required when the lifting reaches the highest point, the infrared proximity sensor 312 detects that the lifting height adjustment frame 52 is flipped and in the top state at this time, and the reduction motor 2 is turned off;

[0079] The wafer is then flipped through the flipping mechanism and the anti-detachment mechanism to facilitate detection during the transmission process. The electric push rod 1 641 can be started to drive the limit clamping plate 642 to advance toward the conveying plate 63, and the wafer on the conveying plate 63 is pressed and limited by the upper and lower cooperation to prevent the wafer from falling during flipping. Subsequently, after the electric push rod 2 65 is started, it can drive the drive plate 652 to follow the movement through the output end, and the toothed plate 653 is driven to move horizontally through the drive plate 652, thereby driving the gear cylinder 651 meshing with it to rotate. The rotation of the gear cylinder 651 drives the rotating shaft 62 fixed thereto to rotate, so that the rotating shaft 62 drives the conveying plate 63 to rotate, and the conveying plate 63 cooperates with the limit clamping plate 642 to flip the wafer, and the wafer at the top of the conveying plate 63 is flipped vertically, which is convenient for detection operation, and there is no need for manual picking and putting back. After the detection is completed, it is flipped to a horizontal state through the flipping component, and finally the restriction is released through the anti-detachment component, and the wafer can be stably transported again.

[0080] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the attached claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0081] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A transmission device for semiconductor processing equipment, comprising a mounting base (1), an adjustable side plate (11), a support plate (3), an adsorption frame (4), a steel pipe (7) and a lifting frame (5), wherein the mounting base (1) is symmetrically welded on both sides of the support plate (3), the adjustable side plate (11) is integrally molded and cast on the side of the top of the mounting base (1) that is away from each other, the adsorption frame (4) is arranged between two sets of adjustable side plates (11), the lifting frame (5) is arranged on the top of the support plate (3), the side of the lifting frame (5) that is close to each other is fixedly installed by a steel pipe (7), and a plurality of sets of spaced transmission blocks (503) are slidably installed on the top of the lifting frame (5), characterized in that: include: A driving mechanism, arranged on one side of the inner wall of the support plate (3), and used for driving the lifting frame (5) to perform annular lifting, pushing and feeding; A lifting height adjustment mechanism, disposed between the lifting frame (5) and the support plate (3), and used to adjust the longitudinal distance between the lifting frame (5) and the support plate (3); A conveying height adjustment mechanism, which is arranged inside the adjustable side plate (11) and is used to adjust the conveying height of the adsorption rack (4); A conveying interval adjustment mechanism is arranged on both sides of the lifting frame (5) and is used to adjust the interval of the semiconductor after conveying; A feeding synchronization detection mechanism is arranged on the interval transmission block (503) and is used to lift, transfer and transmit the semiconductor and flip the semiconductor at the top; The lifting height adjustment mechanism comprises a support shaft frame (31), a lifting shaft (51), a lifting height adjustment frame (52), a fixing block (53), an adjustment screw (54), an adjustment block (55) and a transmission shaft (56); the support shaft frame (31) is welded to both sides of the top of the support plate (3); the lifting shaft (51) is fixedly mounted on both sides of a side away from each other of the two sets of lifting frames (5); the lifting height adjustment frame (52) is rotatably mounted on the surface of the lifting shaft (51); the fixing block (53) is fixedly mounted on the surface of the lifting shaft (51) by bolts The adjusting screw (54) is fixedly mounted on the top of one side of the lifting height adjustment frame (52), the adjusting screw (54) is rotatably mounted on the top of the fixing block (53), the adjusting block (55) is threadedly connected to the bottom of the surface of the adjusting screw (54), the transmission shaft (56) is fixedly mounted on the side of the adjusting block (55) close to the supporting shaft frame (31), the transmission shaft (56) passes through the supporting shaft frame (31) and is rotatably matched with the supporting shaft frame (31), and the surface of the adjusting screw (54) is clamped with a retaining spring located at the bottom of the fixing block (53); The driving mechanism comprises a reduction motor (2), a first driving wheel (21), a second driving wheel (22), a third driving wheel (23) and a belt (24); the reduction motor (2) is fixedly mounted on one side of the inner wall of the support plate (3); the output end of the reduction motor (2) passes through the support plate (3) and is fixedly mounted on the first driving wheel (21); two groups of the second driving wheels (22) are provided, and the two groups of the second driving wheels (22) are symmetrically rotatably mounted on the top of the support plate (3) near the first driving wheel (21); two groups of the third driving wheels (23) are provided, and the two groups of the third driving wheels (23) are fixedly mounted on the transmission shaft (56); the belt (24) is sleeved on the surfaces of the third driving wheel (23), the second driving wheel (22) and the first driving wheel (21); the first driving wheel (21) is transmission-connected to the third driving wheel (23) via the belt (24).

2. A transmission device for semiconductor processing equipment according to claim 1, characterized in that: The conveying height adjustment mechanism comprises a stepping motor (111), a screw rod (112), a screw sleeve (113), a conveying height adjustment sleeve (114), an inclination adapting sleeve (115) and an adsorption plate (41). The stepping motor (111) is fixedly mounted on the bottom of an adjustable side plate (11), the screw rod (112) is fixedly mounted on the output end of the stepping motor (111), the screw sleeve (113) is slidably mounted inside the adjustable side plate (11) and is threadedly connected to the screw rod (112), the conveying height adjustment sleeve (114) is rotatably mounted on the screw sleeve (113) via an axle pin, the inclination adapting sleeve (115) is fixedly mounted on both ends of an adsorption frame (4) and is slidably matched with the conveying height adjustment sleeve (114), and a plurality of adsorption plates (41) are fixedly mounted on the top of the adsorption frame (4), and the adsorption plates (41) are all connected to an external air source via an air pipe.

3. A transmission device for semiconductor processing equipment according to claim 1, characterized in that: The conveying interval adjustment mechanism comprises a limiting side plate (501), a second reduction motor (511), a second screw rod (512), a lifting block (513), a limiting strip (502), an adjustment shaft (504), an adjustment plate (505) and an adjustment slot (506); the second reduction motor (511) is fixedly embedded on both sides of the lifting frame (5); the second screw rod (512) is fixedly installed on the output end of the second reduction motor (511); the lifting block (513) is threadedly connected to the surface of the second screw rod (512); the adjustment plate (505) is fixedly installed with two groups of the lifting blocks (513); the limiting side plate (501) is fixedly installed on the lifting frame (5); On the side close to each other, the limit bar (502) is fixedly installed by bolts at the top and bottom of the limit side plate (501) close to the spacing transmission block (503), the adjustment shaft (504) is fixedly installed at the top of the spacing transmission block (503) close to the adjustment plate (505), the adjustment slots (506) are opened inside the adjustment plate (505), and the number of the openings corresponds to the number of spacing transmission blocks (503), the adjustment shaft (504) and the adjustment slots (506) are slidably matched, and several groups of the adjustment slots (506) located in the middle are all vertical longitudinal slots, and the remaining several groups of the adjustment slots (506) away from the middle are all symmetrically inclined.

4. A transmission device for semiconductor processing equipment according to claim 3, characterized in that: The feeding synchronization detection mechanism comprises a feed plate (6), a rotating frame (61), a positioning block (611), a rotating shaft (62), a conveying plate (63), an anti-separation component and a flipping component. The feed plate (6) is fixedly mounted on the top of the spacing transmission block (503) by bolts. The bottom of the feed plate (6) is close to the side plate (501) and is slidably matched with the side plate (501). The rotating frame (61) is slidably mounted on the top of the feed plate (6). The cross section of the sliding part between the bottom of the rotating frame (61) and the top of the feed plate (6) is of trapezoidal design. The positioning block (61) is fixedly mounted on the top of the feeding plate (6) by bolts. 11) are welded on both sides of the rotating frame (61) away from the spacing transmission block (503), the positioning block (611) is fixed by friction with the top of the top plate (6) through bolts, the rotating shaft (62) is rotatably installed inside the rotating frame (61), the transmission plate (63) is welded on one end of the rotating shaft (62) away from the spacing transmission block (503), the anti-detachment component is arranged on the top of the rotating shaft (62) and is used to limit the semiconductor on the top of the transmission plate (63) to prevent detachment, and the flipping component is arranged on the limiting side plate (501) and is used to drive the rotating shaft (62) to flip.

5. A transmission device for semiconductor processing equipment according to claim 4, characterized in that: The anti-separation component comprises a connecting block (64), an electric push rod 1 (641) and a limiting clamp (642), wherein the connecting block (64) is fixedly mounted on the top of the rotating shaft (62), the electric push rod 1 (641) is fixedly mounted on the top of the connecting block (64), and the limiting clamp (642) is fixedly mounted on the output end of the electric push rod 1 (641).

6. A transmission device for semiconductor processing equipment according to claim 5, characterized in that: The flip assembly comprises a second electric push rod (65), a gear cylinder (651), a drive plate (652) and a tooth plate (653); the second electric push rod (65) is fixedly mounted on one side of the top of the limiting side plate (501); the gear cylinder (651) is fixedly mounted on the side of the surface of the rotating shaft (62) away from the limiting clamping plate (642); the drive plate (652) is fixedly mounted on the output end of the second electric push rod (65); the tooth plate (653) is slidably mounted on the top of the spacing transmission block (503); and the top of the tooth plate (653 is meshed with the gear cylinder (651).

7. A transmission device for semiconductor processing equipment according to claim 1, characterized in that: A mounting plate (311) is fixedly mounted on the top of the support shaft frame (31), an infrared proximity sensor (312) is fixedly mounted inside the mounting plate (311), and the infrared proximity sensor (312) is used in conjunction with a lifting height adjustment frame (52).

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