Liquid cooling device capable of cooperating with heat sink

Abstract

This invention discloses a liquid cooling device that can be used with a heat sink, including a liquid cooling base, a coolant pipe, a coolant pipe interface, and a matching heat sink. The coolant pipe is connected to the coolant base through the coolant pipe interface. The matching heat sink is located at the bottom of the liquid cooling base and is in contact with the heat sink. Heat on the heat sink is transferred to the liquid cooling base through the matching heat sink, and then carried away by the coolant in the coolant pipe, thus completing the cooling process. The liquid cooling device provided by this invention, which can be used with a heat sink, utilizes the advantages of liquid cooling, such as low energy consumption, high heat dissipation, low noise, and low total cost of ownership (TCO), and has higher cooling efficiency than air cooling, thus replacing air cooling and achieving the purpose of heat dissipation for the heat sink.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation and refrigeration technology, and specifically relates to a liquid cooling device that can be used with heat sinks. Background Technology

[0002] Chip heat dissipation is one of the major problems plaguing electronic device users, and the heat dissipation problem is particularly serious for high-power chips. A common solution is to install heat sinks on chips with a power greater than 3W. Heat sinks are generally made of copper and aluminum, two metals with high thermal conductivity, and their alloys. Heat sinks can conduct heat from the chip to the heat sink, and through their relatively large heat dissipation area and better thermal conductivity, combined with an air cooling system, the heat is dissipated into the air to achieve the purpose of heat dissipation.

[0003] Traditional heat sinks have relatively low heat dissipation efficiency, failing to fully utilize their cooling potential. Aluminum and aluminum alloys used in heat sinks have a thermal conductivity exceeding 200 W / (m·K); some heat sinks are made of copper, which has a thermal conductivity of approximately 401 W / (m·K). These metals' excellent thermal conductivity allows them to quickly absorb heat generated by the chip and concentrate it on the heat sink. However, the heat on the heat sink needs to be dissipated through airflow via convection. Because air has poor thermal conductivity, this increases the overall energy consumption of the cooling system and prevents the full utilization of the thermally conductive metals to further improve heat dissipation. Summary of the Invention

[0004] The purpose of this invention is to solve the above-mentioned problems and provide a liquid cooling device that is low in energy consumption, high in heat dissipation, low in noise, low in TCO, and has a higher cooling efficiency than air cooling and can be used with heat sinks.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is: a liquid cooling device that can be used with a heat sink, comprising a liquid cooling base, a coolant pipe, a coolant pipe interface and a matching heat sink. The coolant pipe is connected to the coolant base through the coolant pipe interface. The matching heat sink is located at the bottom of the liquid cooling base and is in contact with the heat sink. The heat on the heat sink is transferred to the liquid cooling base through the matching heat sink and then carried away by the coolant in the coolant pipe, thus completing the cooling.

[0006] Preferably, the liquid-cooled base is a cuboid structure with a liquid-cooled base through hole in the middle, and the coolant pipe interface is installed at the opening of the liquid-cooled base through hole.

[0007] Preferably, the liquid-cooled base is made of Al, Cu, or an alloy of Al and Cu.

[0008] Preferably, the liquid cooling base, except for the surface connected to the heat sink, has a heat insulation material layer covering the other five surfaces.

[0009] Preferably, the cross-section of the coolant pipe is circular, and the two coolant pipes are distributed on both sides of the liquid cooling base.

[0010] Preferably, the material used to manufacture the heat sink includes Al, Cu, or an alloy of Al and Cu.

[0011] Preferably, the material used to manufacture the heat sink is the same as the material used to manufacture the liquid cooling base.

[0012] Preferably, the number of the heat sinks is six, and they are linearly distributed on the liquid cooling base.

[0013] The beneficial effects of this invention are:

[0014] 1. The liquid cooling device provided by the present invention can be used with a heat sink. It utilizes the advantages of liquid cooling such as low energy consumption, high heat dissipation, low noise, and low TCO, and has higher cooling efficiency than air cooling, so as to replace air cooling and achieve the purpose of heat dissipation for the heat sink.

[0015] 2. This invention has higher heat dissipation efficiency, further explores the heat dissipation potential of heat sinks, and can cope with occasions with greater heat dissipation requirements. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a liquid cooling device that can be used with a heat sink according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the liquid-cooled base structure according to Embodiment 1 of the present invention;

[0018] Figure 3 This is a schematic diagram of the usage state of Embodiment 1 of the present invention;

[0019] Figure 4 This is a schematic diagram of the overall structure of Embodiment 2 of the present invention;

[0020] Figure 5 This is a schematic diagram of the liquid-cooled base structure in Embodiment 2 of the present invention;

[0021] Figure 6 This is a schematic diagram of the overall structure of Embodiment 3 of the present invention;

[0022] Figure 7 This is a schematic diagram of the liquid-cooled base structure in Embodiment 3 of the present invention.

[0023] Explanation of reference numerals in the attached diagram: 1. Liquid cooling base; 2. Coolant pipe; 3. Coolant pipe interface; 4. Fitting heat sink. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0025] Example 1

[0026] like Figures 1 to 3 As shown, the present invention provides a liquid cooling device that can be used with a heat sink, including a liquid cooling base 1, a coolant pipe 2, a coolant pipe interface 3, and a matching heat sink 4. The coolant pipe 2 is connected to the coolant base 1 through the coolant pipe interface 3. The matching heat sink 4 is located at the bottom of the liquid cooling base 1 and is in contact with the heat sink. The heat on the heat sink is transferred to the liquid cooling base 1 through the matching heat sink 4, and then carried away by the coolant in the coolant pipe 2, thus completing the cooling.

[0027] The liquid cooling base 1 has a cuboid structure with a through hole in the middle. The coolant pipe interface 3 is installed at the opening of the through hole. The coolant pipe interface 3 is an existing pipe connector used to connect the coolant pipe 2 and the liquid cooling base 1, so that the interior of the coolant pipe 2 is connected to the through hole of the liquid cooling base, facilitating the flow of coolant.

[0028] In this embodiment, the liquid cooling base 1 has a circular through-hole in the middle for the coolant pipe 2 to pass through. The coolant pipe 2 passes sequentially through the coolant pipe interface 3 and the liquid cooling base through-hole. The coolant flows through the coolant pipe 2 without directly contacting the cooling base, and heat exchange is completed through the pipe wall. The pipe direction and the flow direction of the coolant inside the coolant pipe 2 do not affect its use. The liquid cooling base 1 has a cavity structure inside, and the coolant pipe 2 is located inside the cavity structure. The coolant pipe 2 is a pipe structure, and its material is the same as that used to manufacture the liquid cooling base 1.

[0029] The liquid cooling base 1 is made of materials including Al, Cu, or an alloy of Al and Cu, which have good thermal conductivity. Except for the surface connected to the heat sink 4, the other five surfaces of the liquid cooling base 1 are covered with a layer of heat insulation material to reduce the waste of cooling resources due to irrelevant heat exchange.

[0030] The coolant pipe 2 has a circular cross-section, and there are three coolant pipes 2 in total. Two coolant pipes 2 are distributed on both sides of the liquid cooling base 1, and one coolant pipe 2 is located inside the liquid cooling base 1. The coolant pipes 2 located on both sides of the liquid cooling base 1 are connected to the coolant pipe 2 located inside the liquid cooling base 1.

[0031] The materials used to manufacture the heat sink 4 include Al, Cu, or an alloy of Al and Cu. The materials used to manufacture the heat sink 4 are the same as those used to manufacture the liquid cooling base 1. There are six heat sinks 4, which are linearly distributed on the liquid cooling base 1. The number and arrangement of the heat sinks 4, as well as the distance between adjacent heat sinks 4, can be adaptively adjusted according to actual usage requirements to increase the applicability of the invention and thus enhance its practicality.

[0032] In practical use, the coolant pipe 2 is connected to an existing pump and cooling mechanism to achieve coolant circulation. The existing pump and cooling mechanism provide coolant to the coolant pipe 2.

[0033] The heat sink has a heat sink base. During use, the heat sink 4 comes into contact with the existing heat sink. The heat sink base and the heat sink absorb the heat generated by the existing chip, which accumulates on the heat sink. The heat sink 4 absorbs the heat accumulated on the heat sink, and this heat is conducted to the liquid cooling base 1 through the heat sink 4. Finally, it is carried away by the coolant in the coolant pipe 2, completing the cooling process.

[0034] Traditional heat sinks require an air-cooling system to remove waste heat from the heat sink through thermal convection. This invention utilizes a liquid-cooled base 1 and a matching heat sink 4 to conduct the heat accumulated on the heat sink to the coolant pipe 2, and finally the coolant removes the heat, thus completing the heat dissipation.

[0035] The heat sink 4 can be inserted into the gap between adjacent heat sinks on an existing heat sink. Both the heat sink 4 and the heat sink are made of Al, Cu, or their alloys, which have high thermal conductivity. Together, they provide a considerable contact area, allowing for efficient heat transfer. Except for the side connected to the heat sink 4, the other five sides of the liquid cooling base 1 are covered with insulating material to reduce the waste of cooling resources. The internal design of the liquid cooling base 1 can be varied, and is not limited to the examples described above; it connects to the coolant pipe 2.

[0036] Example 2

[0037] The differences between this implementation and Example 1 are as follows:

[0038] like Figure 4 and Figure 5 As shown, the structure of the liquid-cooled base 1 differs from the corresponding structure in Embodiment 1, and the number of coolant pipes 2 also differs. Specifically, in this embodiment, the liquid-cooled base 1 has two parallel through holes in the middle. In actual use, the number of through holes can be increased or decreased as needed. A single coolant pipe 2 can be passed through the liquid-cooled base 1 multiple times, or multiple coolant pipes 2 can be used in parallel, increasing the heat dissipation efficiency of the liquid-cooled base 1. The coolant pipe 2 is connected to a coolant pipe interface 3, which is externally connected to an existing pump and cooling mechanism to achieve coolant circulation. The coolant flows into the portion of the coolant pipe 2 located within the liquid-cooled base 1 through the coolant pipe interface 3.

[0039] The rest of this embodiment is the same as that in Embodiment 1.

[0040] Example 3

[0041] The differences between this implementation and Example 1 are as follows:

[0042] like Figure 6 and Figure 7 As shown, the structure of the liquid-cooled base 1 differs from that in Embodiment 1, and the number of coolant pipes 2 also differs. Specifically, in this embodiment, the liquid-cooled base 1 has a liquid-cooled base through hole in the middle, which is an "S"-shaped liquid-cooling channel. Coolant pipe interfaces 3 are installed at both ends of the liquid-cooled base through hole. The coolant flows in the liquid-cooling channel and directly contacts the liquid-cooled base 1, completing heat exchange through the channel wall. Compared with the aforementioned embodiment, the heat dissipation efficiency of the liquid-cooled base is further increased. The coolant pipes 2 are connected to the coolant pipe interfaces 3, and the coolant flows in through the coolant pipe interfaces 3.

[0043] The rest of this embodiment is the same as that in Embodiment 1.

[0044] Those skilled in the art will recognize that the embodiments described herein are intended to help the reader understand the principles of the invention, and should be understood that the scope of protection of the invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the technical teachings disclosed in this invention without departing from the spirit of the invention, and these modifications and combinations are still within the scope of protection of this invention.

Claims

1. A liquid cooling system compatible with heat sinks, characterized in that: It includes a heat sink, a heat sink base, a liquid cooling base (1), a coolant pipe (2), a coolant pipe interface (3), and a matching heat sink (4). The coolant pipe (2) is connected to the liquid cooling base (1) through the coolant pipe interface (3), and the matching heat sink (4) is located at the bottom of the liquid cooling base (1). The liquid cooling base (1) is a cuboid structure. The liquid cooling base (1) has a liquid cooling base through hole in the middle. The coolant pipe interface (3) is installed at the opening of the liquid cooling base through hole. The coolant pipe interface (3) is an existing pipe connector used to connect the coolant pipe (2) and the liquid cooling base (1). The interior of the coolant pipe (2) is connected to the liquid cooling base through hole. The liquid cooling base (1) has a circular through hole in the middle, through which the coolant pipe (2) passes. The coolant pipe (2) passes through the coolant pipe interface (3) and the liquid cooling base through hole in sequence. The coolant passes through the coolant pipe (2) without directly contacting the cooling base, and the heat exchange is completed through the pipe wall of the coolant pipe (2). The liquid cooling base (1) has a cavity structure inside, and the coolant pipe (2) is located in the cavity structure. The coolant pipe (2) is a pipe structure, and its material is the same as that of the liquid cooling base (1). The liquid-cooled base (1) is made of Al, Cu or an alloy of Al and Cu; Except for the surface connected to the heat sink (4), the other five surfaces of the liquid cooling base (1) are covered with a heat insulation material layer; The cross-section of the coolant pipe (2) is circular. There are three coolant pipes (2). Two coolant pipes (2) are distributed on both sides of the liquid cooling base (1), and one coolant pipe (2) is located inside the liquid cooling base (1). The coolant pipes (2) located on both sides of the liquid cooling base (1) are connected to the coolant pipe (2) located inside the liquid cooling base (1). The coolant pipes (2) are connected to the existing pumping mechanism and cooling mechanism to realize the circulation of coolant. The existing pumping mechanism and cooling mechanism provide coolant to the coolant pipes (2). The materials used to make the heat sink (4) are the same as those used to make the liquid cooling base (1); The number of heat sinks (4) is six, which are linearly distributed on the liquid cooling base (1). The heat sink is provided with a heat sink base. The heat sinks (4) are inserted into the gaps of adjacent heat sinks. The heat sinks (4) are in contact with the heat sinks. The heat sink base and the heat sink absorb the heat generated by the existing chip and accumulate on the heat sink. The heat is absorbed by the heat sink (4), and the heat is conducted to the liquid cooling base (1) through the heat sink (4), and finally carried away by the coolant in the coolant pipe (2) to complete the cooling.

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