A kind of semiconductor chip welding appearance automatic detection equipment and detection method

Abstract

The present invention relates to the field of chip appearance detection technology, specifically to an automatic appearance detection device and detection method for semiconductor chips after welding, comprising a frame, a conveyor belt is arranged inside the frame, an auxiliary frame is fixedly connected inside the frame, a support plate is fixedly connected to the top of the auxiliary frame, a driving cylinder is fixedly connected to the top of the support plate, a movable plate is fixedly connected to the output end of the driving cylinder, a plurality of industrial cameras are arranged at the bottom of the movable plate, the two ends of the movable plate are respectively fixedly connected to the limit plate, a guide rod slidably connected to the limit plate is fixedly connected inside the support plate, a transmission sleeve is rotatably connected inside the limit plate, a driving assembly adapted to the transmission sleeve is arranged inside the guide rod, and a transmission assembly for driving the rotation of the plurality of industrial cameras is arranged on the outer surface of the transmission sleeve. By setting the mutual cooperation between the driving assembly and the transmission assembly, the angle and height position of the industrial camera can be effectively changed, thereby increasing the possibility of discovering defects.

Description

Technical Field

[0001] The present invention relates to the technical field of chip appearance detection, and in particular to an automatic appearance detection device and a detection method for a semiconductor chip after welding. Background Art

[0002] With the rapid development of semiconductor technology, semiconductor chips, as the core components of electronic products, their quality and reliability are crucial to the overall performance of the product. In the manufacturing process of semiconductor chips, welding is a key process step, and the welding quality directly affects the electrical performance and stability of the chip. However, the traditional post-welding appearance inspection method has many shortcomings, such as slow inspection speed, strong subjectivity, low accuracy, etc., which cannot meet the needs of modern semiconductor manufacturing industry for high-efficiency and high-quality inspection. Therefore, the development of a new type of automatic inspection equipment for the appearance of semiconductor chips after welding has important practical significance and broad market prospects.

[0003] For example, the patent application with the prior art publication number CN116106221A relates to the field of chip appearance inspection, specifically, to an automatic inspection device for the appearance of semiconductor chips after welding, which includes a device body, a material conveying track and a sorting component arranged next to the material conveying track, a material tray moving along its length direction is arranged at the material conveying track, a plurality of placement slots for placing chips are arranged at the upper end surface of the material tray, and a loading section, a front visual inspection section for visual inspection of the front of the chip, a chip sorting section and a unloading section are sequentially formed at the material conveying track along the length direction; the sorting component is used to sort the chips located in the chip sorting section, and the sorting range of the sorting component includes the chip sorting section. The device body in this application can first realize the automatic transportation of chips; and the accuracy of the appearance inspection results can be better improved by identifying and inspecting the front and back sides of the chips.

[0004] The above-mentioned prior art improves the accuracy of its detection results by inspecting the front and back sides of the chip, but in actual application, the size difference of semiconductor chips is a common problem. Different chip sizes mean that they require different fields of view and focal lengths during the detection process. For larger chips, the camera may not be able to fully capture its entire surface, resulting in missed detection of some areas; for smaller chips, the detection accuracy may be reduced due to the large field of view. At the same time, when there are welding defects at specific angles on the semiconductor chip, the fixed camera angle may not be able to capture the best defect image. Welding defects often have complex shapes and characteristics, such as bubbles, cracks, misalignment, etc. These defects may present different appearances at different angles. Therefore, some defects may be obscured or blurred due to angle problems, resulting in the inability of the detection system to accurately identify them. To this end, the present application proposes an automatic appearance detection device and detection method for semiconductor chips after welding. Summary of the invention

[0005] The object of the present invention is to provide an automatic inspection device and method for the appearance of a semiconductor chip after welding, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic inspection device for the appearance of semiconductor chips after welding, comprising a frame, a conveyor belt is arranged inside the frame, an auxiliary frame is fixedly connected inside the frame, a support plate is fixedly connected to the top of the auxiliary frame, a driving cylinder is fixedly connected to the top of the support plate, a movable plate is fixedly connected to the output end of the driving cylinder, a plurality of industrial cameras are arranged at the bottom of the movable plate, the two ends of the movable plate are respectively fixedly connected to limit plates, a guide rod slidably connected to the limit plate is fixedly connected inside the support plate, a transmission sleeve is rotatably connected inside the limit plate, a driving assembly adapted to the transmission sleeve is arranged inside the guide rod, a transmission assembly for driving the plurality of industrial cameras to rotate is arranged on the outer surface of the transmission sleeve, and a feeding assembly for driving itself to move is arranged inside the conveyor belt.

[0007] Preferably, the drive assembly includes a guide ball fixedly connected to the inside of the transmission sleeve, the inside of the guide rod is fixedly connected to a transmission screw, the transmission sleeve is arranged on the outer surface of the transmission screw, and the guide ball is slidably connected to the thread of the transmission screw.

[0008] Preferably, the transmission assembly includes a driving wheel fixedly connected to the outer surface of the transmission sleeve, the bottom of the limiting plate is rotatably connected to a rotating shaft, the outer surface of the rotating shaft is fixedly connected to a driven wheel connected to a driving wheel belt, the bottom of the rotating shaft is fixedly connected to a driving gear, the bottom of the movable plate is rotatably connected to a turntable, the multiple industrial cameras are respectively fixedly connected to the bottom of the turntable, and the outer surface of the turntable is fixedly connected to a driven gear meshing with the driving gear.

[0009] Preferably, a connecting ring is fixedly connected to the bottom of the limiting plate, a buffer spring is fixedly connected to the bottom of the connecting ring, a movable ring is fixedly connected to the bottom of the buffer spring, and protrusions are fixedly connected to both ends of the movable ring.

[0010] Preferably, the feeding assembly includes two conveyor rollers rotatably connected to the inside of the conveyor belt, an active roller is arranged inside the conveyor belt, an active tooth is fixedly connected to the outer surface of the active roller, a plurality of rack teeth are evenly and fixedly connected to the inside of the conveyor belt, and the active tooth is adapted to the rack tooth.

[0011] Preferably, the outer surfaces of the two conveyor rollers are evenly provided with limiting teeth, the limiting teeth are meshed with rack teeth, and the tops of the auxiliary frames are respectively fixedly connected with bearing seats for supporting the conveyor rollers.

[0012] Preferably, the two ends of the active roller are respectively fixedly connected with connecting rods, the two ends of the two connecting rods are respectively connected with extension rods with one-way bearings, the outer surface of the extension rod is fixedly connected with a transmission gear, the inside of the guide rod is slidably connected with a slide plate, and the bottom of the slide plate is fixedly connected with a rack meshing with the transmission gear.

[0013] Preferably, a spring rod is fixedly connected inside the guide rod, a force storage block is fixedly connected to the telescopic end of the spring rod, a slope is constructed on the top of the force storage block, and balls are rotatably connected to the sides of two force storage blocks that are close to each other.

[0014] Preferably, a crank is rotatably connected inside the guide rod, a lifting plate is rotatably connected to the bottom of the crank, and the bottom of the lifting plate is fixedly connected to the slide plate.

[0015] The present invention also provides the following technical solution: a method for automatically detecting the appearance of a semiconductor chip after welding, comprising the following steps:

[0016] S1. When in use, first place the semiconductor chip that needs to be inspected for appearance on the top surface of the conveyor belt, and then operate multiple industrial cameras to perform appearance inspection on the semiconductor chip;

[0017] S2. The driving cylinder can be turned on to push the movable plate downward, thereby adjusting the height positions of multiple industrial cameras. At the same time, when the movable plate moves downward, it will drive the limit plate to move with it, so that the limit plate slides inside the guide rod, thereby driving the transmission sleeve to move, so that the transmission sleeve drives the driving assembly to start, and then drives the transmission assembly to start, thereby adjusting the height and angle of multiple industrial cameras;

[0018] S3. When the limit plate moves downward, the feeding assembly will be started, thereby driving the conveyor belt to rotate, so that the semiconductor chip to be inspected placed on the top surface of the conveyor belt moves, thereby moving another semiconductor chip to be inspected to the bottom of multiple industrial cameras.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] By setting the cooperation between the guide ball and the transmission screw, the transmission sleeve can be effectively driven to rotate, wherein the transmission sleeve is connected to the driven pulley belt to rotate the shaft and then the driving gear to rotate, thereby driving the turntable to rotate. At this time, the industrial camera will be able to change its angle position, thereby increasing the possibility of discovering defects. Under the action of the driving cylinder, the turntable can be pushed down to change the height of multiple industrial cameras, and the semiconductor chip can be photographed from different angles and viewing angles, which helps to capture different areas and details on the chip surface more comprehensively. The combination of height adjustment and horizontal rotation can realize all-round and multi-angle detection of semiconductor chips, covering a wider range of surface areas and features. Through multi-angle and multi-height shooting, more information about the chip surface can be captured, thereby improving the accuracy and reliability of detection. The combination of height adjustment and rotation adjustment can optimize the detection process and improve detection efficiency. Through the linkage of the driving cylinder and the movable plate, the height position of multiple industrial cameras can be accurately adjusted to meet the detection needs of semiconductor chips of different sizes or thicknesses. The design of the transmission mechanism enables the turntable to rotate while descending, thereby adjusting the angle of the industrial camera, increasing the detection range and accuracy of the system.

[0021] 2. By setting up the feeding assembly, the conveyor belt can be effectively driven to rotate and thus drive the transportation of semiconductors. Through the combination of the connecting ring, buffer spring, movable ring, bump and force storage block, the system can store energy when the limit plate descends, and quickly release energy when the bump passes over the force storage block, impacting the crank to achieve rapid response. This buffering and rapid response setting not only ensures stability and safety, but also improves the degree of automation and efficiency in the detection process. When the bump impacts the crank, the active roller is driven to rotate through the transmission mechanism, thereby driving the conveyor belt to move, thereby realizing automatic transportation of semiconductor chips. When the bump acts on the force storage block, the impact force of the bump is precisely controlled through the compression of the spring rod and the misalignment of the force storage block. This control ensures that the bump can provide stable and sufficient power when impacting the crank to drive the subsequent material conveying mechanism, thereby realizing the coordinated work of detection and transportation, that is, while detecting a semiconductor chip, the next semiconductor chip to be detected is moved to the detection position through the automated conveying system, thereby realizing a continuous and efficient detection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the local structure of the present invention;

[0024] Figure 3 It is a schematic diagram of the structure in which the support plate is removed in the present invention;

[0025] Figure 4 It is a structural schematic diagram of the conveyor belt in the present invention;

[0026] Figure 5 It is a structural schematic diagram of the present invention in which the frame is removed;

[0027] Figure 6 It is a structural schematic diagram of the industrial camera in the present invention;

[0028] Figure 7 It is a schematic diagram of the exploded structure of the guide rod and the transmission screw in the present invention;

[0029] Figure 8 It is a schematic diagram of the cross-sectional structure of the guide rod in the present invention;

[0030] Fig. 9 It is a schematic diagram of the explosion structure of the transmission sleeve and the limiting plate in the present invention;

[0031] Fig.10 It is a structural schematic diagram of the limiting plate in the present invention;

[0032] Fig.11 For the present invention Fig.10 A schematic diagram of the structure enlargement in the middle;

[0033] Fig.12 It is a structural schematic diagram of the active roller in the present invention;

[0034] Fig.13 For the present invention Fig.12 A magnified schematic diagram of the structure at B in the middle;

[0035] Fig.14 It is a structural schematic diagram of the power storage block in the present invention;

[0036] Fig.15 It is a schematic diagram of the structure of the rack in the present invention.

[0037] In the figure: 100, frame; 101, foot; 102, auxiliary frame; 103, industrial camera; 104, support plate; 105, light source; 200, conveyor roller; 201, conveyor belt; 202, driving roller; 203, driving teeth; 204, limiting teeth; 205, rack teeth; 206, bearing seat; 300, driving cylinder; 301, movable plate; 302, limiting plate; 303, guide rod; 304, driving screw; 305, turntable; 30 6. Driven gear; 307. Driving gear; 308. Rotating shaft; 309. Driven wheel; 310. Transmission sleeve; 311. Driving wheel; 312. Guide ball; 400. Connecting rod; 401. Extension rod; 402. Transmission gear; 403. Slide plate; 404. Rack; 405. Lifting plate; 406. Crank; 500. Connecting ring; 501. Buffer spring; 502. Movable ring; 503. Bump; 504. Spring rod; 505. Power storage block. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Example 1: Please refer to Figure 1 , Figure 5 as well as Figure 7 The present invention provides a technical solution: an automatic inspection device for the appearance of semiconductor chips after welding, comprising a frame 100, a conveyor belt 201 is arranged inside the frame 100, the conveyor belt 201 is used to place the semiconductors to be inspected, an auxiliary frame 102 is fixedly connected inside the frame 100, a support plate 104 is fixedly connected to the top of the auxiliary frame 102, a driving cylinder 300 is fixedly connected to the top of the support plate 104, a movable plate 301 is fixedly connected to the output end of the driving cylinder 300, a plurality of industrial cameras 103 are arranged at the bottom of the movable plate 301, and the plurality of industrial cameras 103 are used to inspect the appearance of semiconductors according to the prior art, the two ends of the movable plate 301 are respectively fixedly connected to the limiting plate 302, the support plate 104 is fixedly connected to the guide rod 300 slidably connected to the limiting plate 302 3, wherein the guide rod 303 is used to guide the limit plate 302, the limit plate 302 is internally rotatably connected with a transmission sleeve 310, the guide rod 303 is internally provided with a driving component adapted to the transmission sleeve 310, and the outer surface of the transmission sleeve 310 is provided with a transmission component for driving the plurality of industrial cameras 103 to rotate, and the driving component can effectively drive the transmission sleeve 310 to rotate, so that the transmission sleeve 310 rotates and then drives the transmission component to start, thereby driving the plurality of industrial cameras 103 to rotate, so that the plurality of industrial cameras 103 can rotate and rise and fall at the same time, and by changing the height of the industrial camera 103, the semiconductor chip can be photographed from different angles and viewing angles, and by changing the adaptation position of the industrial camera 103, the dynamic detection scene can be simulated, which is helpful to find problems that may be missed in static detection.

[0040] Among them, see Fig. 9 , Fig.10 as well as Fig.11The driving assembly includes a guide ball 312 fixedly connected to the inside of the transmission sleeve 310, and the inside of the guide rod 303 is fixedly connected to the transmission screw 304. The transmission sleeve 310 is sleeved on the outer surface of the transmission screw 304, and the guide ball 312 is slidably connected to the thread of the transmission screw 304. The transmission sleeve 310 moves along with it through the up and down movement of the limit plate 302, so that the transmission sleeve 310 will drive the guide ball 312 to move in the thread of the transmission screw 304 when it moves, and the limit plate 302 will drive the guide ball 312 to slide on the thread of the transmission screw 304 when it moves, thereby causing the transmission sleeve 310 to rotate.

[0041] For further information, see Figure 7 , Figure 8 as well as Fig. 9 In order to realize the up and down movement of the limit plate 302 and drive the multiple industrial cameras 103 to rotate, the transmission component includes a driving wheel 311 fixedly connected to the outer surface of the transmission sleeve 310, the bottom of the limit plate 302 is rotatably connected with a rotating shaft 308, the outer surface of the rotating shaft 308 is fixedly connected with a driven wheel 309 connected to the driving wheel 311 by a belt, the bottom of the rotating shaft 308 is fixedly connected with a driving gear 307, the bottom of the movable plate 301 is rotatably connected with a turntable 305, and the multiple industrial cameras 103 are respectively fixedly connected to the bottom of the turntable 305, and the outer surface of the turntable 305 is fixedly connected with a driven gear 306 meshing with the driving gear 307. When the transmission sleeve 310 moves, it will drive the driving wheel 311 to rotate with it. Under the action of the belt, the rotating shaft 308 rotates and then drives the driving gear 307 to rotate, so that the turntable 305 rotates and then the angles of the multiple industrial cameras 103 are adjusted.

[0042] It is worth mentioning that when the movable plate 301 moves downward, it will drive multiple industrial cameras 103 to move downward together, thereby changing their height positions. At the same time, when the movable plate 301 moves downward, the driving gear 307 rotates, thereby driving the turntable 305 to rotate, thereby changing the horizontal position of the industrial camera 103. At this time, the telescopic end of the driving cylinder 300 can be controlled to sensitively change the height and angle position of the multiple industrial cameras 103.

[0043] Specifically, the driving cylinder 300 is turned on to push the movable plate 301 downward and then drive the turntable 305 downward, so as to adjust the height position of multiple industrial cameras 103. At the same time, when the movable plate 301 moves downward, it will drive the limit plate 302 to move with it, so that the limit plate 302 slides inside the guide rod 303, and then drives the guide ball 312 in the transmission sleeve 310 to slide on the outer surface of the transmission screw 304, so that the transmission sleeve 310 rotates, thereby driving the driving wheel 311 to rotate, so that the driving wheel 311 is transmitted through the belt and the driven wheel 309, thereby driving the rotating shaft 308 to rotate, and then driving the driving gear 307 to rotate, so that the turntable 305 moves downward and rotates, so as to adjust the height and angle of multiple industrial cameras 103.

[0044] In summary, by setting the cooperation between the guide bead 312 and the transmission screw 304, the transmission sleeve 310 can be effectively driven to rotate, wherein the transmission sleeve 310 is connected to the driven wheel 309 by a belt, thereby rotating the shaft 308 and then rotating the driving gear 307 to drive the turntable 305 to rotate. At this time, the industrial camera 103 will be able to change its angular position, thereby increasing the possibility of discovering defects. Under the action of the driving cylinder 300, the turntable 305 can be pushed down to change the height of multiple industrial cameras 103, so that the semiconductor chip can be photographed from different angles and viewing angles, which helps to capture different areas and details on the chip surface more comprehensively. The height adjustment and horizontal rotation are combined. It can realize all-round and multi-angle detection of semiconductor chips, covering a wider range of surface areas and features. Through multi-angle and multi-height shooting, more information about the chip surface can be captured, thereby improving the accuracy and reliability of detection. The combination of height adjustment and rotation adjustment can optimize the detection process and improve detection efficiency. By driving the linkage of the cylinder 300 and the movable plate 301, the height position of multiple industrial cameras 103 can be accurately adjusted to meet the detection requirements of semiconductor chips of different sizes or thicknesses. The design of the transmission mechanism enables the turntable 305 to rotate while descending, thereby adjusting the angle of the industrial camera, increasing the detection range and accuracy of the system.

[0045] Example 2: Please refer to Figure 2 , Figure 3 as well as Figure 4The present invention also provides a technical solution, which is different from the technical solution of embodiment 1: an automatic inspection device for the appearance of semiconductor chips after welding, wherein a feeding component that drives itself to move is arranged inside the conveyor belt 201, and the feeding component includes two conveyor rollers 200 that are rotatably connected to the inside of the conveyor belt 201, and an active roller 202 is arranged inside the conveyor belt 201, and an active tooth 203 is fixedly connected to the outer surface of the active roller 202, and a plurality of rack teeth 205 are evenly fixedly connected inside the conveyor belt 201. The active teeth 203 are adapted to the rack teeth 205, and the outer surfaces of the two conveyor rollers 200 are evenly provided with limit teeth 204, which are meshed with the rack teeth 205. The tops of the auxiliary frames 102 are respectively fixedly connected with bearing seats 206 for supporting the conveyor rollers 200, wherein the conveyor rollers 200 are used to support the conveyor belt 201 and tighten the conveyor belt 201 at the same time to improve its feeding efficiency, and the meshing of the limit teeth 204 and the rack teeth 205 can effectively improve the conveying accuracy of the conveyor belt 201.

[0046] Among them, see Fig.12 , Fig.14 as well as Fig.15 In order to improve the automatic appearance inspection, the guide rod 303 is internally rotatably connected with a crank 406, wherein torsion springs are arranged on both sides of the crank 406 to pull the crank 406 to reset, and the bottom of the crank 406 is rotatably connected with a lifting plate 405, and a groove for the crank 406 to move is provided on the top of the lifting plate 405, so that the crank 406 can pull the lifting plate 405 to move upward, and the bottom of the lifting plate 405 is fixedly connected to the slide plate 403, and the two ends of the active roller 202 are respectively fixedly connected with connecting rods 400, and the two ends of the two connecting rods 400 are respectively connected with extension rods 401 by one-way bearings, and the extension rods 401 The outer surface of the guide rod 303 is fixedly connected with a transmission gear 402, the inner part of the guide rod 303 is slidably connected with a slide plate 403, and the bottom of the slide plate 403 is fixedly connected with a rack 404 meshing with the transmission gear 402, wherein the rack 404 moves up to make the transmission gear 402 mesh with it, thereby driving the extension rod 401 to rotate, and the one-way bearing connection between the extension rod 401 and the connecting rod 400 can make the rack 404 move up to drive the transmission gear 402 to rotate in one direction, and then drive the connecting rod 400 to rotate, and when the rack 404 moves down, it will make the transmission gear 402 rotate in the opposite direction, thereby driving the extension rod 401 to rotate idly.

[0047] For further information, see Figure 2 , Fig.12 as well as Fig.13The bottom of the limit plate 302 is fixedly connected with a connecting ring 500, the bottom of the connecting ring 500 is fixedly connected with a buffer spring 501, the bottom of the buffer spring 501 is fixedly connected with a movable ring 502, both ends of the movable ring 502 are fixedly connected with bumps 503, the inside of the guide rod 303 is fixedly connected with a spring rod 504, the telescopic end of the spring rod 504 is fixedly connected with a force storage block 505, the top of the force storage block 505 is structured with an inclined surface, and the sides of the two force storage blocks 505 close to each other are respectively rotatably connected with balls. When the limit plate 302 moves downward, it will drive the connecting ring 500 to move downward, and under the action of the buffer spring 501, it can give The industrial camera 103 performs detection in a certain space, so that when the conveyor belt 201 is stationary, multiple industrial cameras 103 can effectively realize multi-faceted detection. When the connecting ring 500 continues to move downward, the buffer spring 501 will be compressed so that the movable ring 502 is pushed by the elastic force. At this time, the protrusion 503 will continuously exert pressure on the force storage block 505, so that the transmission spring rod 504 of the force storage block 505 is continuously misplaced, and then the protrusion 503 passes over the two force storage blocks 505 and quickly impacts the crank 406, and the transmission connecting rod 400 rotates. At the same time, one side of the force storage block 505 is rotated and connected with a ball to improve the smoothness of the downward movement of the protrusion 503.

[0048] It is worth mentioning that the inclined surface on the top of the force storage block 505 can effectively block the protrusion 503 to store force, thereby increasing the force of the crank 406 transmission, so that the gear rack 404 and the transmission gear 402 can be effectively driven to engage with each other, and when the protrusion 503 moves upward, the inclined surface on its top can contact the bottom of the force storage block 505. At this time, the protrusion 503 can effectively contact the two force storage blocks 505 to move away from each other, thereby making it easier to drive the two force storage blocks 505 away from each other. The top of the protrusion 503 is constructed as an inclined surface and the bottom is a plane, so that the force storage block 505 can move flexibly.

[0049] Specifically, when the limit plate 302 moves downward, it will drive the connecting ring 500 to move downward and compress the buffer spring 501 to shrink, so that the transmission movable ring 502 moves downward, causing the protrusion 503 to move downward under force to push the force storage block 505. At this time, the bottom surface of the protrusion 503 will conflict with the top surfaces of the two force storage blocks 505, so that the inclined surface at the top of the force storage block 505 is resisted by the protrusion 503, thereby compressing the spring rod 504 and causing the force storage block 505 to be misplaced. At this time, the two force storage blocks 505 move away from each other, thereby releasing the resistance to the protrusion 503, so that the protrusion 503 passes over the two force storage blocks 505 and moves downward quickly, thereby impacting The protrusion 503 hits the crank 406, and when the protrusion 503 hits the crank 406, the other end of the crank 406 pulls the lifting plate 405 upward, and then pulls the rack 404 upward to engage with the transmission gear 402, thereby driving the connecting rod 400 to rotate, and then drives the active roller 202 to rotate so that the active teeth 203 on its outer surface engage with the rack teeth 205 inside the conveyor belt 201, thereby driving the conveyor belt 201 to rotate, so that the semiconductor chip to be inspected placed on the top surface of the conveyor belt 201 moves, thereby moving another semiconductor chip to be inspected to the bottom of the multiple industrial cameras 103.

[0050] In summary, by setting the feeding assembly, the conveyor belt 201 can be effectively driven to rotate and thus drive the transportation of semiconductors. Through the combination of the connecting ring 500, the buffer spring 501, the movable ring 502, the protrusion 503 and the force storage block 505, the system can store energy when the limit plate 302 descends, and quickly release the energy when the protrusion 503 passes over the force storage block 505, impacting the crank 406 to achieve rapid response. This buffering and rapid response setting not only ensures stability and safety, but also improves the degree of automation and efficiency in the detection process. When the protrusion 503 impacts the crank 406, the active roller 202 is driven to rotate through the transmission mechanism. The conveyor belt 201 is driven to move, thereby realizing automatic conveying of semiconductor chips. When the bump 503 acts on the force storage block 505, the compression of the spring rod 504 and the misalignment of the force storage block 505 can realize precise control of the impact force of the bump 503. This control ensures that the bump 503 can provide stable and sufficient power when impacting the crank 406 to drive the subsequent material conveying mechanism, thereby realizing the coordinated work of detection and conveying, that is, while detecting a semiconductor chip, the next semiconductor chip to be detected is moved to the detection position through the automatic conveying system, thereby realizing a continuous and efficient detection process.

[0051] Example 3: Please refer to Figures 1 to 15 The present invention also provides a technical solution: a method for automatically detecting the appearance of a semiconductor chip after welding, comprising the following steps:

[0052] S1. When in use, first place the semiconductor chip that needs to be inspected for appearance on the top surface of the conveyor belt 201, then turn on the light source 105, and simultaneously operate multiple industrial cameras 103 to perform appearance inspection on the semiconductor chip;

[0053] S2. The driving cylinder 300 can be turned on to push the movable plate 301 downward and then drive the turntable 305 downward, so as to adjust the height positions of the multiple industrial cameras 103. At the same time, when the movable plate 301 moves downward, it will drive the limit plate 302 to move with it, so that the limit plate 302 slides inside the guide rod 303, and then drives the guide ball 312 in the transmission sleeve 310 to slide on the outer surface of the transmission screw 304, so that the transmission sleeve 310 rotates, thereby driving the driving wheel 311 to rotate, so that the driving wheel 311 drives the driven wheel 309 through the belt and drives the rotating shaft 308 to rotate, and then drives the driving gear 307 to rotate, so that the turntable 305 moves downward and rotates, so as to adjust the height and angle of the multiple industrial cameras 103;

[0054] S3, when the limit plate 302 moves downward, it will drive the connecting ring 500 to move downward and compress the buffer spring 501 to shrink, so that the transmission movable ring 502 moves downward, so that the protrusion 503 is forced to move downward to push the force storage block 505, at this time, the bottom surface of the protrusion 503 will conflict with the top surfaces of the two force storage blocks 505, so that the inclined surface on the top of the force storage block 505 is resisted by the protrusion 503, thereby compressing the spring rod 504 to dislocate the force storage block 505, and at this time, the two force storage blocks 505 move away from each other, thereby releasing the resistance to the protrusion 503, so that the protrusion 503 passes over the two force storage blocks 505 and moves downward quickly to impact the crank 406;

[0055] S4. When the bump 503 hits the crank 406, the other end of the crank 406 will pull the lifting plate 405 upward, and then pull the rack 404 upward to engage with the transmission gear 402, thereby driving the connecting rod 400 to rotate, and then driving the active roller 202 to rotate so that the active teeth 203 on its outer surface engage with the rack teeth 205 inside the conveyor belt 201, thereby driving the conveyor belt 201 to rotate, so that the semiconductor chip to be inspected placed on the top surface of the conveyor belt 201 moves, thereby moving another semiconductor chip to be inspected to the bottom of the multiple industrial cameras 103.

[0056] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic inspection device for the appearance of a semiconductor chip after welding, comprising a frame (100), characterized in that: A conveyor belt (201) is arranged inside the frame (100), an auxiliary frame (102) is fixedly connected inside the frame (100), a support plate (104) is fixedly connected to the top of the auxiliary frame (102), a driving cylinder (300) is fixedly connected to the top of the support plate (104), a movable plate (301) is fixedly connected to the output end of the driving cylinder (300), a plurality of industrial cameras (103) are arranged at the bottom of the movable plate (301), and both ends of the movable plate (301) are respectively fixedly connected to The support plate (104) is connected to a limit plate (302), the interior of the support plate (104) is fixedly connected to a guide rod (303) slidably connected to the limit plate (302), the interior of the limit plate (302) is rotatably connected to a transmission sleeve (310), the interior of the guide rod (303) is provided with a driving component adapted to the transmission sleeve (310), the outer surface of the transmission sleeve (310) is provided with a transmission component for driving a plurality of industrial cameras (103) to rotate, and the interior of the conveyor belt (201) is provided with a feeding component for driving itself to move; The driving assembly comprises a guide bead (312) fixedly connected to the interior of the transmission sleeve (310); a transmission screw (304) is fixedly connected to the interior of the guide rod (303); the transmission sleeve (310) is sleeved on the outer surface of the transmission screw (304), and the guide bead (312) is slidably connected to the thread of the transmission screw (304); The transmission assembly comprises a driving wheel (311) fixedly connected to the outer surface of the transmission sleeve (310); the bottom of the limit plate (302) is rotatably connected to a rotating shaft (308); the outer surface of the rotating shaft (308) is fixedly connected to a driven wheel (309) connected to the driving wheel (311) by a belt; the bottom of the rotating shaft (308) is fixedly connected to a driving gear (307); the bottom of the movable plate (301) is rotatably connected to a turntable (305); the plurality of industrial cameras (103) are respectively fixedly connected to the bottom of the turntable (305); and the outer surface of the turntable (305) is fixedly connected to a driven gear (306) meshing with the driving gear (307); The bottom of the limit plate (302) is fixedly connected to a connecting ring (500), the bottom of the connecting ring (500) is fixedly connected to a buffer spring (501), the bottom of the buffer spring (501) is fixedly connected to a movable ring (502), and both ends of the movable ring (502) are respectively fixedly connected to protrusions (503); The feeding assembly comprises two conveyor rollers (200) rotatably connected to the inside of a conveyor belt (201); an active roller (202) is arranged inside the conveyor belt (201); an active tooth (203) is fixedly connected to the outer surface of the active roller (202); a plurality of rack teeth (205) are evenly and fixedly connected to the inside of the conveyor belt (201); the active tooth (203) is matched with the rack teeth (205); The two ends of the active roller (202) are respectively fixedly connected to connecting rods (400), the two ends of the two connecting rods (400) are respectively connected to extension rods (401) via one-way bearings, the outer surface of the extension rod (401) is fixedly connected to a transmission gear (402), the interior of the guide rod (303) is slidably connected to a slide plate (403), and the bottom of the slide plate (403) is fixedly connected to a rack (404) meshing with the transmission gear (402); A spring rod (504) is fixedly connected inside the guide rod (303), a force storage block (505) is fixedly connected to the telescopic end of the spring rod (504), a slope is formed on the top of the force storage block (505), and balls are rotatably connected to the sides of the two force storage blocks (505) that are close to each other; The guide rod (303) is rotatably connected to a crank (406) inside, the bottom of the crank (406) is rotatably connected to a lifting plate (405), and the bottom of the lifting plate (405) is fixedly connected to the slide plate (403).

2. The automatic inspection device for the appearance of semiconductor chips after welding according to claim 1, characterized in that: The outer surfaces of the two conveyor rollers (200) are evenly provided with limit teeth (204), the limit teeth (204) meshing with the rack teeth (205), and the tops of the auxiliary frames (102) are respectively fixedly connected with bearing seats (206) for supporting the conveyor rollers (200).

3. A method for automatically detecting the appearance of a semiconductor chip after welding, using the automatic detection device for the appearance of a semiconductor chip after welding as claimed in any one of claims 1 and 2, characterized in that: The following steps are involved: S1. When in use, firstly placing a semiconductor chip that needs to be inspected for appearance on the top surface of a conveyor belt (201), and then operating a plurality of industrial cameras (103) to perform an appearance inspection on the semiconductor chip; S2. The driving cylinder (300) can be turned on to push the movable plate (301) downward, thereby adjusting the height positions of the plurality of industrial cameras (103). At the same time, when the movable plate (301) moves downward, it will drive the limit plate (302) to move along with it, so that the limit plate (302) slides inside the guide rod (303), thereby driving the transmission sleeve (310) to move, so that the transmission sleeve (310) drives the driving component to start, and then drives the transmission component to start, thereby adjusting the height and angle of the plurality of industrial cameras (103); S3. When the limit plate (302) moves downward, it drives the feeding assembly to start, thereby driving the conveyor belt (201) to rotate, so that the semiconductor chip to be inspected placed on the top surface of the conveyor belt (201) moves, thereby moving another semiconductor chip to be inspected to the bottom of the multiple industrial cameras (103).

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