A method and system for testing the performance of thermal conductivity and heat dissipation structure of computer circuits

Abstract

The present invention provides a method and system for testing the performance of a heat-conducting and heat-dissipating structure of a computer circuit, and relates to the field of testing technology. The method comprises: setting a plurality of temperature sensors in the air path of the heat-conducting and heat-dissipating structure; controlling the computer circuit to operate at maximum power and collecting first temperature data; starting the heat dissipation fan, operating the second preset time period and collecting second temperature data, and then determining the temperature control performance score; detecting wind speed data, and then determining the heat dissipation performance score; controlling the computer circuit to stop operating, keeping the heat dissipation fan operating for a third time period and collecting third temperature data, and then determining the heat dissipation speed score; determining the performance test score according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score. According to the present invention, the performance of the heat-conducting and heat-dissipating structure can be fully grasped based on the scores of the three aspects, which is helpful to control the temperature of the computer's integrated circuit, improve the performance of the computer, and reduce the aging speed of the computer's electronic components.

Description

Technical Field

[0001] The present invention relates to the field of testing technology, and in particular to a method and system for testing the performance of a heat conduction and heat dissipation structure of a computer circuit. Background Art

[0002] In the related art, whether the performance of the thermal conductive heat dissipation structure meets the standard is usually determined by directly measuring the temperature inside the computer case or the temperature of the electronic devices that can generate heat in the computing-level integrated circuit. However, this test method has poor accuracy and it is difficult to accurately and comprehensively understand the performance of the thermal conductive heat dissipation structure.

[0003] The information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Summary of the invention

[0004] The present invention provides a method and system for testing the performance of a heat-conducting and heat-dissipating structure of a computer circuit, which can solve the technical problem of poor accuracy in testing the performance of a heat-conducting and heat-dissipating structure in the related art.

[0005] According to a first aspect of the present invention, there is provided a method for testing the performance of a thermal conductive heat dissipation structure of a computer circuit, comprising:

[0006] A plurality of temperature sensors are arranged in the air path of the heat-conducting and heat-dissipating structure, wherein each temperature sensor has a serial number;

[0007] Controlling the computer circuit to operate at maximum power for a first preset time period, and obtaining first temperature data detected by each temperature sensor at each moment in the first preset time period;

[0008] Maintaining the state where the computer circuit operates at maximum power, and starting the heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtaining second temperature data detected by each temperature sensor at each moment in the second preset time period;

[0009] Determining a temperature control performance score according to the first temperature data, the second temperature data, and a serial number of the temperature sensor;

[0010] In the second preset time period, wind speed data at an air path outlet is detected, wherein a temperature sensor is provided at the air path outlet;

[0011] Determining a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;

[0012] Control the computer circuit to stop running, and keep the cooling fan running at maximum power for a third time period, and obtain third temperature data detected by each temperature sensor at each moment in the third time period;

[0013] Determining a heat dissipation speed score according to the third temperature data;

[0014] A performance test score of the thermally conductive heat dissipation structure is determined according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.

[0015] According to a second aspect of the present invention, there is provided a thermal conductivity and heat dissipation structure performance testing system for a computer circuit, comprising:

[0016] A setting module, used to set a plurality of temperature sensors in the air path of the heat-conducting and heat-dissipating structure, wherein each temperature sensor has a serial number;

[0017] A first detection module, used to control the computer circuit to operate at maximum power for a first preset time period, and to obtain first temperature data detected by each temperature sensor at each moment in the first preset time period;

[0018] a second detection module, configured to maintain the computer circuit in a state of operating at maximum power, and start a heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtain second temperature data detected by each temperature sensor at each moment in the second preset time period;

[0019] a temperature control performance scoring module, configured to determine a temperature control performance score according to the first temperature data, the second temperature data, and a sequence number of a temperature sensor;

[0020] A wind speed module, used for detecting wind speed data at an air path outlet in the second preset time period, wherein a temperature sensor is provided at the air path outlet;

[0021] a heat dissipation performance scoring module, configured to determine a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;

[0022] a third detection module, used for controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and obtaining third temperature data detected by each temperature sensor at each moment in the third time period;

[0023] A heat dissipation speed scoring module, used to determine a heat dissipation speed score according to the third temperature data;

[0024] The performance test scoring module is used to determine the performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.

[0025] Technical effect: According to the present invention, multiple temperature sensors can be set in the air path of the heat-conducting heat dissipation structure, so as to accurately and comprehensively detect the temperature data of each position in the heat-conducting heat dissipation structure, improve the accuracy and comprehensiveness of the detection, and can respectively determine the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score based on the temperature data under different working conditions and other related data, so that the performance of the heat-conducting heat dissipation structure can be fully grasped based on the scores of the three aspects, which is helpful to control the temperature of the computer's integrated circuit, improve the performance of the computer, and reduce the aging speed of the computer's electronic devices. When determining the temperature control performance score, the weight of the relative change of the temperature change trend at the location of the target temperature sensor can be determined by the power ratio, and the weight of the relative change of the temperature change trend at the location of the non-target temperature sensor can be determined by the difference in the serial number between the non-target temperature sensor and the closest target temperature sensor, so that the temperature control performance score can accurately reflect the importance of temperature control at each position, and the weight of the item related to the target temperature sensor can be made greater than the weight of the item related to the non-target temperature sensor, so that the temperature control ability of the heat-conducting heat dissipation structure for each position in the air path can be accurately reflected. When determining the heat dissipation performance score, the total heat discharged from the chassis by the cooling fan in the second preset time period and the total power consumption of each electronic device in the second time period can be determined, and the ratio of the two can be used as the heat dissipation performance score, thereby accurately and objectively describing the proportion of heat generated by the electronic device that is discharged from the chassis, which can accurately reflect the heat dissipation performance of the thermal conductive heat dissipation structure. When determining the heat dissipation speed score, the speed of the heat dissipation can be determined by the ratio of the decrease rate of the third temperature data detected by the temperature sensor to the increase rate of the first temperature data, and the importance of the heat dissipation speed at different positions can be expressed by preset weights, so that the heat dissipation speed score can objectively and accurately express the heat dissipation performance of the thermal conductive heat dissipation structure.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and do not limit the present invention. Other features and aspects of the present invention will become more apparent from the following detailed description of exemplary embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other embodiments can be obtained based on these drawings without creative work.

[0028] Figure 1 A schematic diagram exemplarily shows a flow chart of a method for testing the performance of a heat conduction and heat dissipation structure of a computer circuit according to an embodiment of the present invention;

[0029] Figure 2 A block diagram of a thermal conductive and heat dissipation structure performance testing system for a computer circuit according to an embodiment of the present invention is exemplarily shown. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0032] Figure 1 A schematic flow chart of a method for testing the performance of a heat conduction and heat dissipation structure of a computer circuit according to an embodiment of the present invention is exemplarily shown, the method comprising:

[0033] Step S101, setting a plurality of temperature sensors in the air path of the heat conduction and heat dissipation structure, wherein each temperature sensor has a serial number;

[0034] Step S102, controlling the computer circuit to operate at maximum power for a first preset time period, and obtaining first temperature data detected by each temperature sensor at each moment in the first preset time period;

[0035] Step S103, maintaining the state where the computer circuit operates at maximum power, and starting the heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtaining second temperature data detected by each temperature sensor at each moment in the second preset time period;

[0036] Step S104, determining a temperature control performance score according to the first temperature data, the second temperature data, and the serial number of the temperature sensor;

[0037] Step S105, in the second preset time period, detecting wind speed data at the wind path outlet, wherein a temperature sensor is provided at the wind path outlet;

[0038] Step S106, determining a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;

[0039] Step S107, controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and obtaining third temperature data detected by each temperature sensor at each moment in the third time period;

[0040] Step S108, determining a heat dissipation speed score according to the third temperature data;

[0041] Step S109, determining a performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.

[0042] According to the thermal conductive heat dissipation structure performance testing method of a computer circuit according to an embodiment of the present invention, a plurality of temperature sensors can be arranged in the air path of the thermal conductive heat dissipation structure, so as to accurately and comprehensively detect the temperature data of each position in the thermal conductive heat dissipation structure, thereby improving the accuracy and comprehensiveness of the detection, and can respectively determine the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score based on the temperature data under different working conditions and other relevant data, so as to comprehensively grasp the performance of the thermal conductive heat dissipation structure based on the scores of the three aspects, which is helpful to control the temperature of the computer's integrated circuit, improve the computer's performance, and reduce the aging rate of the computer's electronic components.

[0043] According to one embodiment of the present invention, in step S101, the heat conduction and heat dissipation structure in the computer circuit may generally include an air path made of a conductive material, such as a copper pipe. The heat conduction and heat dissipation structure may also include a heat dissipation fan, which may be arranged at the end of the air path. The rotation of the heat dissipation fan allows the air in the air path to flow, thereby discharging the heat dissipated by the electronic device into the air path out of the computer chassis. Electronic devices capable of generating heat may be arranged adjacent to multiple positions in the air path, so as to facilitate dissipating the generated heat into the air path and discharging it out of the chassis through the air path, thereby reducing the accumulation of heat in the chassis, and reducing the possibility of excessive temperature in the chassis, resulting in reduced circuit performance or even damage to the circuit. Temperature sensors may be arranged at multiple positions in the air path to detect temperature data at multiple positions in the air path, and the multiple positions may include positions adjacent to the electronic device, positions of the air path outlet, etc.

[0044] According to one embodiment of the present invention, in step S102, when testing the performance of the heat-conducting and heat-dissipating structure, the computer circuit can be first controlled to run at maximum power for a first preset time period, for example, 1 minute, 3 minutes, 5 minutes, etc. The present invention does not limit the length of the first preset time period. Multiple electronic devices in the computer circuit are fully heated, and first temperature data can be obtained at multiple moments in the first preset time period. The real-time temperature and heating rate at each position of the air path can be determined through the first temperature data. The time interval between each moment can be 1 second, 3 seconds, 5 seconds, etc. The present invention does not limit the time interval between moments.

[0045] According to an embodiment of the present invention, in step S103, after the first time period, the operating power of the computer circuit can be maintained, and the heat dissipation fan can be started to discharge heat outside the chassis. Further, the second temperature data of each temperature sensor can be detected at multiple times within the second preset time period after the heat dissipation fan is turned on, so that the real-time temperature and cooling speed at each position of the air path can be determined, which is convenient for subsequent determination of the performance of the heat conduction and heat dissipation structure for temperature control.

[0046] According to one embodiment of the present invention, in step S104, a temperature control performance score can be determined based on the first temperature data and the second temperature data obtained above and the serial number of each temperature sensor, and the score can be used to describe the temperature control capability of the thermal conductive heat dissipation structure.

[0047] According to one embodiment of the present invention, step S104 may include: fitting the first temperature data detected by each temperature sensor with the moment within a first preset time period to obtain a first temperature function of each temperature sensor; fitting the second temperature data detected by each temperature sensor with the moment within a second preset time period to obtain a second temperature function of each temperature sensor; according to the serial number of the temperature sensor, screening out a target temperature sensor that is arranged adjacent to an electronic device that can generate heat from a plurality of temperature sensors; and determining a temperature control performance score according to the first temperature function, the second temperature function, and the serial number of the target temperature sensor.

[0048] According to one embodiment of the present invention, the first temperature function can be used to describe the change trend of the first temperature data detected by each temperature sensor within the first preset time period, and the second temperature function can be used to describe the change trend of the second temperature data detected by each temperature sensor within the second preset time period. If the heat-conducting and heat-dissipating structure has a strong control ability over the temperature, the change trend of the second temperature data will be greatly different from the change trend of the first temperature data. For example, the change trend of the first temperature data is a rapid increase in temperature, while the change trend of the second temperature data is to curb the momentum of temperature increase or even reduce the temperature. The temperature sensor arranged adjacent to the electronic device can be used as a target temperature sensor. Since the temperature data detected by the target temperature sensor can directly reflect the real-time temperature of the electronic device and the temperature change trend of the electronic device, the temperature data detected by the target temperature sensor can be monitored intensively.

[0049] According to one embodiment of the present invention, determining a temperature control performance score according to the first temperature function, the second temperature function, and the serial number of the target temperature sensor includes: determining a first temperature derivative of the first temperature function of each temperature sensor; substituting the time in the first preset time period into the first temperature derivative to obtain the first temperature change rate at each time; determining a first average change rate of the first temperature data detected by each temperature sensor according to the first temperature change rate at each time; determining a second temperature derivative of the second temperature function of each temperature sensor; substituting the time in the second preset time period into the second temperature derivative to obtain the second temperature change rate at each time; determining a second average change rate of the second temperature data detected by each temperature sensor according to the second temperature change rate at each time; determining a maximum operating power of the electronic device capable of generating heat; and determining the temperature control performance score according to formula (1). ,

[0050] (1)

[0051] in, is the first average change rate corresponding to the i-th target temperature sensor, is the second average change rate corresponding to the i-th target temperature sensor, is the maximum operating power of the electronic device capable of generating heat and arranged adjacent to the i-th target temperature sensor, m is the number of target temperature sensors, is the first average change rate corresponding to the jth non-target temperature sensor among the temperature sensors except the target temperature sensor, is the second average change rate corresponding to the jth non-target temperature sensor, is the serial number of the jth non-target temperature sensor, is the serial number of the i-th target temperature sensor, min is the minimum value function, n is the number of non-target temperature sensors, i≤m, j≤n, and i, j, m and n are all positive integers. and is the preset weight, and .

[0052] According to an embodiment of the present invention, the first average change rate can be used to describe the temperature rise trend within the first preset time period, and the second average change rate can be used to describe the temperature change trend after the cooling fan is turned on. For example, the temperature may turn to drop, or the temperature rise speed may slow down. Therefore, in formula (1), It can represent the change of the temperature trend at the location of the i-th target temperature sensor. is the relative change of the temperature change trend at the location of the i-th target temperature sensor. The larger the relative change value, the stronger the temperature control performance of the heat conduction and heat dissipation structure after the cooling fan is turned on. The weight of the relative change corresponding to the target temperature sensor is , that is, the ratio of the power of the electronic device adjacent to the i-th target temperature sensor to the total power of all electronic devices. The larger the weight, the greater the power of the electronic device adjacent to the i-th target temperature sensor, and the higher the importance of temperature control. The weight can be used to perform weighted summation on the above relative changes.

[0053] According to one embodiment of the present invention, similarly, is the relative change of the temperature change trend at the location of the jth non-target temperature sensor, and its weight is , is the serial number difference between the jth non-target temperature sensor and the closest target temperature sensor. Since the temperature sensors are arranged in sequence according to the serial numbers, the serial number difference can also represent the distance between the jth non-target temperature sensor and the closest target temperature sensor. The closer the distance between the non-target temperature sensor and the closest target temperature sensor is, the greater the influence of the heat dissipation of the electronic devices near the target temperature sensor is, and the higher the importance of temperature control is. The weight value can be used to perform weighted average on the above relative changes.

[0054] According to an embodiment of the present invention, the temperature control performance score can be obtained by weighted summing the above two items using preset weights. That is, the weight of the item related to the target temperature sensor is greater than the weight of the item related to the non-target temperature sensor, so that the temperature control performance score can accurately reflect the temperature control capability of the thermal conductive heat dissipation structure for each position in the air path (including the position where the electronic device is set and other positions).

[0055] In this way, the weight of the relative change of the temperature change trend at the location of the target temperature sensor can be determined by the power ratio, and the weight of the relative change of the temperature change trend at the location of the non-target temperature sensor can be determined by the difference in serial numbers between the non-target temperature sensor and the closest target temperature sensor, so that the temperature control performance score can accurately reflect the importance of temperature control at each location, and the weight of the item related to the target temperature sensor can be made greater than the weight of the item related to the non-target temperature sensor, so as to accurately reflect the temperature control capability of the thermal conductive heat dissipation structure for each location in the air path.

[0056] According to an embodiment of the present invention, in step S105, during the second preset time period, the wind speed data at the air outlet can be detected to determine the air volume of the cooling fan and the heat transferred from the computer case to the outside of the case.

[0057] According to one embodiment of the present invention, step S106 may include: determining the cross-sectional area of ​​the wind path at the wind path outlet according to the design parameters of the wind path; fitting the wind speed data and the moments within the second preset time period to obtain a wind speed function; determining the maximum operating power of the electronic device that can generate heat; and determining a heat dissipation performance score according to the cross-sectional area of ​​the wind path, the wind speed function, the maximum operating power and the second temperature function corresponding to the temperature sensor at the wind path outlet.

[0058] According to an embodiment of the present invention, the heat dissipation performance score is determined according to the wind path cross-sectional area, the wind speed function, the maximum operating power and the second temperature function corresponding to the temperature sensor at the wind path outlet, including: determining the heat dissipation performance score according to formula (2): ,

[0059] (2)

[0060] in, is the air density, is the specific heat capacity of air, is the cross-sectional area of ​​the wind path, is the wind speed function, is the second temperature function corresponding to the temperature sensor at the air path outlet, is room temperature, is the first moment in the second preset time period, is the last moment in the second preset time period, is the maximum operating power of the electronic device capable of generating heat and arranged adjacent to the i-th target temperature sensor, m is the number of target temperature sensors, i≤m, and i and m are both positive integers.

[0061] According to one embodiment of the present invention, in formula (2), The mass of air discharged from the chassis by the cooling fan per unit time, the product of the mass and the specific heat capacity of the air, and the temperature difference between the second temperature function and the room temperature, is the heat discharged from the chassis by the cooling fan per unit time. The heat discharged from the chassis per unit time is integrated to obtain the total heat discharged from the chassis by the cooling fan during the second preset time period. The denominator of formula (2) is the total power consumption of each electronic device in the second time period. A certain proportion of the total power consumption is used for heat generation. Therefore, the total power consumption can be used to reflect the heat generated by each electronic device in the second time period. Formula (2) can reflect the ratio of the total heat discharged from the chassis by the cooling fan to the total power consumption of each electronic device, which can be used as a heat dissipation performance score. The higher the heat dissipation performance score, the higher the proportion of heat discharged from the chassis in the heat generated by the electronic device, and the better the heat dissipation performance.

[0062] In this way, the total heat discharged from the chassis by the cooling fan during the second preset time period and the total power consumption of each electronic component during the second time period can be determined, and the ratio of the two can be used as the heat dissipation performance score, thereby accurately and objectively describing the proportion of heat generated by the electronic components that is discharged from the chassis, and accurately reflecting the heat dissipation performance of the thermal conductive heat dissipation structure.

[0063] According to one embodiment of the present invention, in step S107, the computer circuit stops running, but the heat dissipation fan continues to run and detects third temperature data at multiple times within a third time period, so as to determine the heat dissipation speed of the thermal conductive heat dissipation structure for the remaining heat after the computer circuit no longer generates new heat.

[0064] According to one embodiment of the present invention, step S108 may include: fitting the third temperature data detected by each temperature sensor with the moments within a third preset time period to obtain a third temperature function of each temperature sensor; determining a third temperature derivative of the third temperature function of each temperature sensor; substituting the moments within the third preset time period into the third temperature derivative to obtain a third temperature change rate at each moment; determining a third average change rate of the third temperature data detected by each temperature sensor based on the third temperature change rate at each moment; and determining a heat dissipation speed score based on the third average change rate and the first average change rate.

[0065] According to an embodiment of the present invention, the third average change rate may represent the temperature drop rate caused by the heat conduction and heat dissipation structure in the process of continuing to dissipate heat after the computer circuit no longer generates heat. Determining the heat dissipation speed score based on the third average change rate and the first average change rate includes: determining the heat dissipation speed score based on formula (3) ,

[0066] (3)

[0067] in, is the third average change rate corresponding to the i-th target temperature sensor, is the third average change rate corresponding to the j-th non-target temperature sensor.

[0068] According to one embodiment of the present invention, in formula (3), It represents the ratio of the decreasing rate of the third temperature data detected by the i-th target temperature sensor to the increasing rate of the first temperature data. The larger the ratio is, the faster the heat dissipation speed of the heat conduction heat dissipation structure is. If the value is greater than 1, it means that the heat dissipation speed of the heat conduction heat dissipation structure is faster than the speed at which the electronic device generates heat. Similarly, represents the ratio of the decreasing rate of the third temperature data detected by the jth non-target temperature sensor to the increasing rate of the first temperature data. and The average values ​​of the above ratios are weighted and summed to obtain a heat dissipation speed score, so that the heat dissipation speed score can represent the importance of the heat dissipation speed at different positions.

[0069] In this way, the speed of heat dissipation can be determined by the ratio of the decrease rate of the third temperature data detected by the temperature sensor to the increase rate of the first temperature data, and the importance of the heat dissipation speed at different positions can be represented by preset weights, so that the heat dissipation speed score can objectively and accurately express the heat dissipation performance of the thermal conductive heat dissipation structure.

[0070] According to one embodiment of the present invention, in step S109, the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score may be weighted and summed to obtain a performance test score of the thermal conductive heat dissipation structure, thereby accurately and comprehensively evaluating the thermal conductive heat dissipation performance of the thermal conductive heat dissipation structure from multiple aspects.

[0071] According to the performance test method of the heat conduction and heat dissipation structure of the computer circuit of the embodiment of the present invention, multiple temperature sensors can be set in the air path of the heat conduction and heat dissipation structure, so as to accurately and comprehensively detect the temperature data of each position in the heat conduction and heat dissipation structure, improve the accuracy and comprehensiveness of the detection, and can respectively determine the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score based on the temperature data under different working conditions and other related data, so as to comprehensively grasp the performance of the heat conduction and heat dissipation structure based on the scores of the three aspects, which is helpful to control the temperature of the integrated circuit of the computer, improve the performance of the computer, and reduce the aging speed of the electronic components of the computer. When determining the temperature control performance score, the weight of the relative change of the temperature change trend at the location of the target temperature sensor can be determined by the power ratio, and the weight of the relative change of the temperature change trend at the location of the non-target temperature sensor can be determined by the difference in the serial number between the non-target temperature sensor and the closest target temperature sensor, so that the temperature control performance score can accurately reflect the importance of the temperature control of each position, and the weight of the item related to the target temperature sensor can be made greater than the weight of the item related to the non-target temperature sensor, so as to accurately reflect the temperature control ability of the heat conduction and heat dissipation structure for each position in the air path. When determining the heat dissipation performance score, the total heat discharged from the chassis by the cooling fan in the second preset time period and the total power consumption of each electronic device in the second time period can be determined, and the ratio of the two can be used as the heat dissipation performance score, thereby accurately and objectively describing the proportion of heat generated by the electronic device that is discharged from the chassis, which can accurately reflect the heat dissipation performance of the thermal conductive heat dissipation structure. When determining the heat dissipation speed score, the speed of the heat dissipation can be determined by the ratio of the decrease rate of the third temperature data detected by the temperature sensor to the increase rate of the first temperature data, and the importance of the heat dissipation speed at different positions can be expressed by preset weights, so that the heat dissipation speed score can objectively and accurately express the heat dissipation performance of the thermal conductive heat dissipation structure.

[0072] Figure 2 A block diagram of a thermal conductivity and heat dissipation structure performance testing system for a computer circuit according to an embodiment of the present invention is exemplarily shown, the system comprising:

[0073] A setting module, used to set a plurality of temperature sensors in the air path of the heat-conducting and heat-dissipating structure, wherein each temperature sensor has a serial number;

[0074] A first detection module, used to control the computer circuit to operate at maximum power for a first preset time period, and to obtain first temperature data detected by each temperature sensor at each moment in the first preset time period;

[0075] a second detection module, configured to maintain the computer circuit in a state of operating at maximum power, and start a heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtain second temperature data detected by each temperature sensor at each moment in the second preset time period;

[0076] a temperature control performance scoring module, configured to determine a temperature control performance score according to the first temperature data, the second temperature data, and a sequence number of a temperature sensor;

[0077] A wind speed module, used for detecting wind speed data at an air path outlet in the second preset time period, wherein a temperature sensor is provided at the air path outlet;

[0078] a heat dissipation performance scoring module, configured to determine a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct;

[0079] a third detection module, used for controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and obtaining third temperature data detected by each temperature sensor at each moment in the third time period;

[0080] A heat dissipation speed scoring module, used to determine a heat dissipation speed score according to the third temperature data;

[0081] The performance test scoring module is used to determine the performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.

[0082] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for testing the performance of a heat conduction and heat dissipation structure of a computer circuit, characterized in that: include: A plurality of temperature sensors are arranged in the air path of the heat-conducting and heat-dissipating structure, wherein each temperature sensor has a serial number; Controlling the computer circuit to operate at maximum power for a first preset time period, and obtaining first temperature data detected by each temperature sensor at each moment in the first preset time period; Maintaining the state where the computer circuit operates at maximum power, and starting the heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtaining second temperature data detected by each temperature sensor at each moment in the second preset time period; Determining a temperature control performance score according to the first temperature data, the second temperature data, and a serial number of the temperature sensor; In the second preset time period, wind speed data at an air path outlet is detected, wherein a temperature sensor is provided at the air path outlet; Determining a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct; Control the computer circuit to stop running, and keep the cooling fan running at maximum power for a third time period, and obtain third temperature data detected by each temperature sensor at each moment in the third time period; Determining a heat dissipation speed score according to the third temperature data; Determining a performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score; Determining a temperature control performance score according to the first temperature data, the second temperature data, and the serial number of the temperature sensor includes: Fitting the first temperature data detected by each temperature sensor with the time in the first preset time period to obtain a first temperature function of each temperature sensor; Fitting the second temperature data detected by each temperature sensor with the moments within a second preset time period to obtain a second temperature function of each temperature sensor; According to the serial number of the temperature sensor, a target temperature sensor disposed adjacent to the electronic device capable of generating heat is selected from among the multiple temperature sensors; Determining a temperature control performance score according to the first temperature function, the second temperature function, and the serial number of the target temperature sensor; Determining a temperature control performance score according to the first temperature function, the second temperature function, and the sequence number of the target temperature sensor includes: determining a first temperature derivative of a first temperature function for each temperature sensor; Substituting the moments within the first preset time period into the first temperature derivative function to obtain the first temperature change rate at each moment; Determine a first average change rate of the first temperature data detected by each temperature sensor according to the first temperature change rate at each moment; determining a second temperature derivative of a second temperature function for each temperature sensor; Substituting the moments within the second preset time period into the second temperature derivative function to obtain the second temperature change rate at each moment; Determine a second average change rate of the second temperature data detected by each temperature sensor according to the second temperature change rate at each moment; Determine the maximum operating power of electronic devices that can generate heat; According to the formula Determining the Temperature Control Performance Rating ,in, is the first average change rate corresponding to the i-th target temperature sensor, is the second average change rate corresponding to the i-th target temperature sensor, is the maximum operating power of the electronic device capable of generating heat and arranged adjacent to the i-th target temperature sensor, m is the number of target temperature sensors, is the first average change rate corresponding to the jth non-target temperature sensor among the temperature sensors except the target temperature sensor, is the second average change rate corresponding to the jth non-target temperature sensor, is the serial number of the jth non-target temperature sensor, is the serial number of the i-th target temperature sensor, min is the minimum value function, n is the number of non-target temperature sensors, i≤m, j≤n, and i, j, m and n are all positive integers. and is the preset weight, and ; Determining a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct includes: Determining the cross-sectional area of ​​the air passage at the air passage outlet according to the design parameters of the air passage; Fitting the wind speed data to the moments in the second preset time period to obtain a wind speed function; Determine the maximum operating power of electronic devices that can generate heat; determining a heat dissipation performance score according to the wind path cross-sectional area, the wind speed function, the maximum operating power, and a second temperature function corresponding to a temperature sensor at an outlet of the wind path; Determining a heat dissipation performance score according to the wind path cross-sectional area, the wind speed function, the maximum operating power, and a second temperature function corresponding to a temperature sensor at an outlet of the wind path includes: According to the formula Determining the Thermal Performance Rating ,in, is the air density, is the specific heat capacity of air, is the cross-sectional area of ​​the wind path, is the wind speed function, is the second temperature function corresponding to the temperature sensor at the air path outlet, is room temperature, is the first moment in the second preset time period, is the last moment in the second preset time period, is the maximum operating power of the electronic device capable of generating heat and arranged adjacent to the i-th target temperature sensor, m is the number of target temperature sensors, i≤m, and both i and m are positive integers; Determining a heat dissipation speed score according to the third temperature data includes: Fitting the third temperature data detected by each temperature sensor with the moments within a third preset time period to obtain a third temperature function of each temperature sensor; determining a third temperature derivative of a third temperature function for each temperature sensor; Substituting the moments within the third preset time period into the third temperature derivative function to obtain a third temperature change rate at each moment; Determine a third average change rate of the third temperature data detected by each temperature sensor according to the third temperature change rate at each moment; Determining a heat dissipation speed score according to the third average change rate and the first average change rate; Determining a heat dissipation speed score according to the third average change rate and the first average change rate includes: According to the formula Determining the Cooling Speed ​​Rating ,in, is the third average change rate corresponding to the i-th target temperature sensor, is the third average change rate corresponding to the j-th non-target temperature sensor.

2. A thermal conductivity and heat dissipation structure performance testing system for a computer circuit for executing the method according to claim 1, characterized in that: include: A setting module, used to set a plurality of temperature sensors in the air path of the heat-conducting and heat-dissipating structure, wherein each temperature sensor has a serial number; A first detection module, used to control the computer circuit to operate at maximum power for a first preset time period, and to obtain first temperature data detected by each temperature sensor at each moment in the first preset time period; a second detection module, configured to maintain the computer circuit in a state of operating at maximum power, and start a heat dissipation fan of the heat conduction and heat dissipation structure, so that the heat dissipation fan operates at maximum power for a second preset time period, and obtain second temperature data detected by each temperature sensor at each moment in the second preset time period; a temperature control performance scoring module, configured to determine a temperature control performance score according to the first temperature data, the second temperature data, and a sequence number of a temperature sensor; A wind speed module, used for detecting wind speed data at an air path outlet in the second preset time period, wherein a temperature sensor is provided at the air path outlet; a heat dissipation performance scoring module, configured to determine a heat dissipation performance score according to the design parameters of the air duct, the wind speed data, and second temperature data detected by a temperature sensor at an outlet of the air duct; a third detection module, used for controlling the computer circuit to stop running, and keeping the cooling fan running at maximum power for a third time period, and obtaining third temperature data detected by each temperature sensor at each moment in the third time period; A heat dissipation speed scoring module, used to determine a heat dissipation speed score according to the third temperature data; The performance test scoring module is used to determine the performance test score of the thermal conductive heat dissipation structure according to the temperature control performance score, the heat dissipation performance score and the heat dissipation speed score.

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