Power combiners and power combiner components

Abstract

The present application provides a power synthesizer and a power synthesizer component. The signal transmission layer of the power synthesizer is located on one side of the ground layer, and includes a first layer, a second layer and a third layer. The first layer is located on the side of the second layer facing the ground layer, and the third layer is located on the side of the second layer away from the ground layer. The first layer includes a first portion of the first layer located in the first area and a second portion of the first layer located in the second area, the second layer includes a second portion of the second layer located in the second area, and the third layer includes a first portion of the third layer located in the first area and a second portion of the third layer located in the second area. The first portion of the first layer and the second portion of the first layer are respectively connected to the ground layer, the second portion of the second layer is connected to the second portion of the first layer, and the first portion of the third layer is connected to the second portion of the third layer. The first portion of the third layer includes a first input terminal and an output terminal, and the second portion of the third layer includes a second input terminal. The power synthesizer of the present application has the advantages of low loss and high bandwidth.

Description

Technical Field

[0001] The present application relates to the technical field of high-frequency passive devices, and in particular to a power combiner and a power combiner assembly. Background Art

[0002] With the rapid development of information technology, microwave systems have higher and higher requirements for signal bandwidth and communication capacity. The millimeter wave terahertz band will become the key development direction of high-speed communication due to its excellent broadband characteristics. The power of a single power device in the terahertz band is relatively small. In order to achieve the necessary transmission distance, it is necessary to achieve a higher power output through power synthesis.

[0003] The existing terahertz band power combiner has a low impedance matching freedom and a narrow matching bandwidth, and cannot achieve a wider bandwidth matching while having a lower power loss. Summary of the invention

[0004] A first aspect of the present application provides a power combiner and a power combiner component.

[0005] The power combiner comprises:

[0006] Ground plane;

[0007] a signal transmission layer, located on one side of the ground layer, the signal transmission layer comprising a first layer, a second layer and a third layer stacked in sequence; wherein the first layer is located on a side of the second layer facing the ground layer, and the third layer is located on a side of the second layer facing away from the ground layer;

[0008] The signal transmission layer includes a first area and a second area, the first area and the second area are spaced apart; the first layer includes a first portion of the first layer located in the first area and a second portion of the first layer located in the second area; the second layer includes a first portion of the first layer located in the first area and a second portion of the first layer located in the second area;

[0009] The second part of the second layer in the second area; the third layer includes the first part of the third layer located in the first area and the second part of the third layer located in the second area;

[0010] The end of the first portion of the first layer away from the second area is connected to the ground layer, and the end of the second portion of the first layer away from the first area is connected to the ground layer; the second portion of the second layer is connected to the second portion of the first layer; the first portion of the third layer is connected to the second portion of the third layer;

[0011] The third layer first part includes a first input terminal and an output terminal, and the third layer second part includes a second input terminal.

[0012] In one embodiment, the second layer and the second part include a first signal line and two first ground lines extending along the first direction, and the first ground lines are arranged at both sides of the first signal line at intervals along the second direction; one end of the first signal line toward the first area is connected to the first layer and the second part, and the first ground lines are respectively connected to the first layer and the second part.

[0013] In one embodiment, the second layer also includes a second layer first portion located in the first area; the second layer first portion includes a first signal line and two first ground lines extending along the first direction, and the first ground lines are arranged at intervals on both sides of the first signal line along the second direction; the first ground lines are respectively connected to the first layer first portion.

[0014] In one embodiment, the first portion of the third layer includes a second signal line and two second ground lines extending along the first direction, the second ground lines are arranged at intervals on both sides of the second signal line along the second direction, and the second ground lines are respectively connected to the first portion of the first layer;

[0015] The second portion of the third layer includes a second signal line and two second grounding lines extending along the first direction, the second grounding lines are arranged at intervals on both sides of the second signal line along the second direction, and the second signal lines are respectively connected to the first portion of the first layer;

[0016] The second signal line of the third layer first portion is connected to the second signal line of the third layer second portion.

[0017] In one embodiment, the structures of the power combiner on both sides along the first direction and / or the second direction are substantially the same.

[0018] In one embodiment, an end of the second signal line of the first portion of the third layer away from the first region extends outward to form an extension segment.

[0019] In one embodiment, the power synthesizer also includes a power supply layer. When the power synthesizer includes the power supply layer, the end of the first part of the first layer away from the second area is connected to the power supply layer, and the end of the second part of the first layer away from the first area is connected to the power supply layer.

[0020] In one embodiment, the ground layer is provided with a first window region at a position corresponding to the first region and the second region.

[0021] A second aspect of the present application provides a power combiner component, which includes a plurality of the above-mentioned power combiners, wherein the plurality of the power combiners are arranged along the first direction, and the third layers of adjacent power combiners are connected.

[0022] In one embodiment, the power combiner component includes 2n power combiners, where n is a natural number greater than or equal to 1, and the output end of the power combiner component is located between the nth power combiner and the (n+1)th power combiner.

[0023] The power combiner provided in the embodiment of the present application adds an open-terminal transmission line and a short-terminal transmission line, which is equivalent to adding a series resonant network composed of an inductor and a capacitor, which can provide a resonance point and an additional impedance adjustment freedom for the power combiner. By adjusting the value of the capacitor or inductor, the impedance matching characteristics of the power combiner can be improved within a wider frequency range, and the bandwidth can be expanded, so that the power combiner can maintain efficient power transmission and signal integrity within a wider frequency range.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0026] Figure 1 A schematic diagram of the structure of a power combiner provided in one embodiment of the present application;

[0027] Figure 2 A schematic diagram of the decomposed structure of a power combiner provided in one embodiment of the present application;

[0028] Figure 3 A schematic diagram of the decomposed structure of a power combiner provided in another embodiment of the present application;

[0029] Figure 4 for Figure 1 A circuit diagram of a power combiner in the illustrated embodiment;

[0030] Figure 5 for Figure 4 An equivalent circuit diagram of the illustrated embodiment;

[0031] Figure 6 for Figure 5 An equivalent circuit diagram of the illustrated embodiment;

[0032] Figure 7 for Figure 6 An equivalent circuit diagram of the illustrated embodiment;

[0033] Figure 8 A schematic diagram of a substrate and a metal layer of a process for a power combiner provided in an embodiment of the present application;

[0034] Fig. 9 Based on Figure 8 A layout simulation diagram of a power combiner prepared by the process of the illustrated embodiment;

[0035] Fig.10 A schematic diagram of the structure of a power combiner assembly provided in one embodiment of the present application. DETAILED DESCRIPTION

[0036] The power combiner and the power combiner assembly of the embodiment of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can complement or be combined with each other.

[0037] The present application embodiment provides a power combiner, such as Figure 1 and Figure 2 As shown, the power combiner 100 includes a ground layer 10 and a signal transmission layer 20. The signal transmission layer 20 is located on one side of the ground layer 10, and the signal transmission layer 20 includes a first layer 21, a second layer 22, and a third layer 23 stacked in sequence. The first layer 21 is located on the side of the second layer 22 facing the ground layer 10, and the third layer 23 is located on the side of the second layer 22 facing away from the ground layer 10.

[0038] The signal transmission layer 20 includes a first area 201 and a second area 202, and the first area 201 is spaced from the second area 202. The first layer 21 includes a first layer first portion 21' located in the first area 201 and a first layer second portion 21", located in the second area 202, the second layer 22 includes a second layer second portion 22", located in the second area 202, and the third layer 23 includes a third layer first portion 23' located in the first area 201 and a third layer second portion 23", located in the second area 202.

[0039] The end of the first layer first part 21' away from the second area 202 is connected to the ground layer 10, and the end of the first layer second part 21" away from the first area 201 is connected to the ground layer 10. The second layer second part 22" located in the second area 202 is connected to the first layer second part 21" located in the second area 202. The third layer first part 23' located in the first area 201 is connected to the third layer second part 23" located in the second area 202.

[0040] The third layer first portion 23 ′ in the first region 201 includes a first input terminal 231 and an output terminal 233 , and the third layer second portion 23 ″ in the second region 202 includes a second input terminal 232 .

[0041] Figure 4 The circuit structure of the power combiner 100 of the present application is shown, and the circuit structure includes a power combiner circuit 40, an input circuit 50 and an output circuit 60. Figure 2 and Figure 4 , Z1 represents the characteristic impedance of the first layer 21; Z2 represents the characteristic impedance of the second layer 22; Z3, Z A represents the characteristic impedance of the third layer 23; and θ represents the electrical length. Figure 4 Can be equivalent to Figure 5 , wherein the portion of the third layer second portion 23" located in the second region 202 and the ground layer 10 form a terminal open circuit transmission line (Z A ,θ A ), open-terminal transmission line (Z A ,θ A ) can be equivalent to a capacitor C A The second layer second portion 22" and the first layer second portion 21" located in the second region 202 form a terminal short-circuit transmission line (Z2, θ0), and the terminal short-circuit transmission line (Z2, θ0) can be equivalent to an inductor L A , inductance L A and capacitor C A In series, and connected between the third layer second part 23 "and the first layer second part 21 ", so that Figure 5 Get as Figure 6 The equivalent circuit diagram is shown. Figure 5 The first layer second portion 21" located in the second region 202 and the ground layer 10 form a terminal short-circuited transmission line (Z1, θ0), and the terminal short-circuited transmission line (Z1, θ0) can be equivalent to an inductor L C , inductance L C The output capacitance C of the core transistor of the power amplifier of the input circuit 50 C The circuit structure of the power combiner 100 can realize the process of converting the differential signal into a single-ended signal, which can be equivalent to an ideal 1:1 transformer, and finally the following can be obtained: Figure 7 The equivalent circuit is shown.

[0042] The first input terminal 231 and the second input terminal 232 of the power synthesizer 100 of the present application are connected to a signal source, which may be, for example, the output of a signal generator or a power amplifier, etc., to provide the RF signal to be synthesized. In order to ensure the transmission effect of the signal, the output impedance matching value of the signal source is a standard impedance of 50Ω to reduce reflection and improve transmission efficiency. The output terminal 233 is connected to the load, which may be, for example, a subsequent component of the RF system such as an antenna, and the signal synthesized by the signal source is transmitted to the load through the output terminal 233. The power synthesizer 100 can combine two differential signals into a single-ended signal, thereby achieving the effect of voltage synthesis.

[0043] Compared with the power combiner with the traditional three-layer conductor balun structure, the power combiner 100 of the present application increases the terminal open circuit transmission line (Z A ,θ A ) and the terminal short-circuited transmission line (Z2,θ0), which is equivalent to adding the inductor L A and capacitor L C The series resonant network formed can provide a resonance point and an additional impedance adjustment freedom for the power combiner 100. By adjusting the value of the capacitor or inductor, the impedance matching characteristics of the power combiner 100 can be improved in a wider frequency range, thereby expanding the bandwidth, so that the power combiner 100 can maintain efficient power transmission and signal integrity in a wider frequency range. The terminal short-circuit transmission line (Z1, θ0) formed by the first layer 21 and the ground layer 10 is equivalent to the inductor L C , inductance L C The output capacitance C of the power amplifier core transistor C Parallel resonance is achieved to achieve impedance matching of the circuit, thereby reducing losses and improving system efficiency. The power combiner 100 can also set a resonance peak within a required bandwidth range to keep the insertion loss within the broadband at a relatively low and flat level, thereby realizing a passive power combining network that can work efficiently within a wide frequency range.

[0044] In one embodiment, Figure 1 and Figure 2 As shown, in the second area 202, the second layer second part 22" includes a first signal line 221" and two first grounding lines 222" extending along the first direction X, the first grounding lines 222" are arranged at intervals on both sides of the first signal line 221" along the second direction Y, and the first signal line 221" is connected to the first layer second part 21" at one end facing the first area 201, and the first grounding lines 222" are respectively connected to the first layer second part 21" in the second area 202. The first signal line 221" and the two first grounding lines 222" form a coplanar waveguide line, and the first signal line 221" in the coplanar waveguide line is separated from the "grounding layer 10". The propagation of the signal is controlled by the first grounding lines 222" on both sides, which can effectively reduce the direct electromagnetic coupling between the first signal line 221" and the grounding layer 10, and can reduce the imbalance of the power combiner. In some embodiments, the first direction X is perpendicular to the second direction Y. For example, the first direction X can be a horizontal direction, and the second direction Y can be a vertical direction.

[0045] In one embodiment, Figure 1 and Figure 2As shown, the power combiner 100 also includes a second layer first portion 22' located in the first area 201. In the first area 201, the second layer first portion 22' includes a first signal line 221' and two first grounding lines 222' extending along the first direction X. The first grounding lines 222' are arranged at intervals on both sides of the first signal line 221' along the second direction Y. The first grounding lines 222' are respectively connected to the first layer first portion 21' in the first area 201, that is, the first signal line 221' and the two first grounding lines 222' form a coplanar waveguide line. The power combiner 100 also includes the second layer first portion 22' in the first area 201 and the second layer second portion 22" in the second area 202. The power combiner 100 is more symmetrical. During the signal transmission process, the symmetrical structure of the second layer 22 is conducive to reducing the imbalance of the power combiner, thereby improving the synthesis efficiency of the power combiner 100.

[0046] In one embodiment, Figure 1 and Figure 2 As shown, in the first area 201, the third layer first part 23' includes a second signal line 234' and two second grounding lines 235' extending along the first direction X, the second grounding lines 235' are arranged at intervals on both sides of the second signal line 234' along the second direction Y, and the second grounding lines 235' are respectively connected to the first layer first part 21' in the first area 201; in the second area 202, the third layer second part 23" includes a second signal line 234" extending along the first direction X and two second grounding lines 235", the second grounding lines 235" are arranged at intervals on both sides of the second signal line 234" along the second direction Y, and the second grounding lines 235" are respectively connected to the first layer second part 21" in the second area 202; the second signal line 234' in the first area 201 is connected to the second signal line 234" in the second area 202. The second signal line 234' and the two second ground lines 235' form a coplanar waveguide line, and the second signal line 234" and the two second ground lines 235" form a coplanar waveguide line. The second signal line 234' (234") in the coplanar waveguide line is separated from the ground layer 10. The propagation of the signal is controlled by the second ground lines 235' (235") on both sides, which can effectively reduce the direct electromagnetic coupling between the second signal line 234' (234") and the ground layer 10, reduce the imbalance of the power combiner, and further reduce the loss during signal transmission.

[0047] It should be noted that, when the second layer first part 22' includes two first grounding wires 222', the two second grounding wires 235' included in the third layer first part 23' can be respectively connected to the two first grounding wires 222', and connected to the first layer first part 21' through the first grounding wires 222'; when the second layer second part 22" includes two first grounding wires 222", the two second grounding wires 235" included in the third layer second part 23" can be respectively connected to the two first grounding wires 222", and connected to the first layer second part 21" through the first grounding wires 222".

[0048] In one embodiment, Figure 1 and Figure 2 As shown, the structures of the power combiner 100 on both sides along the first direction X are substantially the same, or the structures of the power combiner 100 on both sides along the second direction Y are substantially the same, or the structures of the power combiner 100 on both sides in the first direction X and the second direction Y are substantially the same. The symmetrical structural design of the power combiner 100 can reduce the imbalance, reduce the mutual interference between different signal channels, reduce the loss in the power combining process, and is conducive to improving the performance of the power combiner.

[0049] The “substantially the same” in the above embodiment means that the structures of the power combiner 100 along the first direction X and / or the second direction Y on both sides are substantially the same in shape, area, thickness, spacing, etc. Figure 1 and Figure 2 As shown, one of the second grounding lines 235' and one of the second grounding lines 235" are respectively provided with a first input terminal 231 and a second input terminal 232, so the structure of the power combiner 100 on both sides of the first direction X and / or the second direction Y may also have certain differences in structure according to actual needs.

[0050] In one embodiment, the second signal line 234" located in the second area 202 extends outward from one end of the first area 201 to form an extension section 2341'. The extension section 2341' protrudes and is not connected to other structural layers, forming a capacitor C A The open-terminal transmission line (Z A ,θ A ).

[0051] Furthermore, the second signal line 234' located in the first area 201, at one end away from the second area 202, extends outward to form an extension section 2341", and the length of the extension section 2341" is equal to the length of the extension section 2341', so as to achieve impedance matching of the power combiner. Of course, in some embodiments, the length and width of the extension section 2341" may also be different from the length and width of the extension section 2341'.

[0052] In one embodiment, Figure 1 and Figure 3 As shown, the power combiner 100 also includes a power layer 30. When the power combiner 100 includes the power layer 30, the first layer first portion 21' located in the first area 201 and the first layer second portion 21" located in the second area 202 are not connected to the ground layer 10, but are directly connected to the power layer 30. The power combiner 100 usually needs to supply direct current to the drain or collector of the transistor. The power layer 30 can provide direct current, and a flat capacitor is formed between the power layer 30 and the ground layer 10. When the area of ​​the power layer 30 and the ground layer 10 is large, the formed flat capacitor has high capacitance and low impedance, which can form an effective AC grounding, so that the performance of the power combiner is further optimized.

[0053] In one embodiment, Figure 1 and Figure 2 As shown, the ground layer 10 is provided with a first window area 101 at a position corresponding to the first area 201 and the second area 202. The size of the first window area 101 can be specifically set according to the characteristic impedance required by the signal transmission layer of the power combiner 100. For the same signal transmission layer, the larger the first window area 101 of the ground layer 10 is, the larger the characteristic impedance of the first layer 21 of the signal transmission layer is, and the higher the quality factor is.

[0054] Further, when the power synthesizer 100 includes a power supply layer 30, the connection structure between the first layer first portion 21' in the first area 201 and the first layer second portion 21" located in the second area 202 and the power supply layer 30 can directly pass through the first window area 101 to connect the first layer 21 with the power supply layer 30. Specifically, the end of the first layer first portion 21' facing away from the second area 202 is connected to the power supply layer 30, and the end of the first layer second portion 21" facing away from the first area 201 is connected to the power supply layer 30.

[0055] Furthermore, the power layer 30 is provided with a second window area 301 , and the size of the second window area 301 can be specifically set according to the required characteristic impedance of the first layer 21 of the signal transmission layer of the power combiner 100 .

[0056] The embodiment of the present application further provides a design method of a power combiner, the design method is used to design the above-mentioned power combiner, and the design method comprises the following steps:

[0057] Step 401: Determine the matching impedance of the input end. Taking the output of the power amplifier as the signal source of the power combiner as an example, the output impedance of the differential transistor at the maximum output power is extracted from the final amplifier circuit of the power amplifier by load-pull simulation, and matched to the standard impedance of 50Ω, such as Figure 7As shown, the differential transistor is equivalent to a capacitor and a resistor in parallel, and the differential transistor equivalent impedance Matching value 50Ω.

[0058] Step 402: Based on the impedance determined in step 401, use Figure 7 The lumped elements in the equivalent circuit shown in Figure 1 are impedance matched to determine the inductance L. A 、Inductance L C , capacitor C A And the initial values ​​of the transmission line characteristic impedance Z3 and the electrical length θ0 of the third layer 23, wherein the transformation ratio of the transformer is 1:1.

[0059] Step 403: Transform the lumped elements whose initial values ​​have been determined in step 402 to the transmission lines to obtain the characteristic impedances Z1, Z2, and Z A and electrical length θ A The value of inductance L A It is equivalent to a terminal short-circuited transmission line (Z2,θ0), and the inductance L C It is equivalent to a terminal short-circuited transmission line (Z1,θ0), and the capacitor C A Equivalent to an open-ended transmission line (Z A ,θ A ). The corresponding formulas are:

[0060] jωL C =jZ1sinθ0

[0061] jωL A =jZ2sinθ0

[0062]

[0063] Step 404: According to the preparation process of the power combiner, the thickness, height, dielectric constant and other parameters of the metal layer used to prepare the transmission line are obtained, and the characteristic impedance and electrical length of the transmission line determined in step 403 are used to calculate the width and length of the transmission line under the corresponding process.

[0064] Step 405: Draw the corresponding power combiner in the layout, optimize the power combiner by electromagnetic simulation, and obtain the final power combiner according to the simulation results.

[0065] The power combiner 100 of the present application can be manufactured by a 130nm SiGe BiCMOS G3 (130nm silicon germanium bipolar complementary metal oxide semiconductor) process. Figure 8The schematic diagram of the substrate and metal layer of the 130nm SiGe BiCMOS G3 process shows three thick metal layers: ThickAl layer, ThickCu1 layer, ThickCu2 layer, and five thin metal layers: ThiAl layer, Metal1 layer to Matal4 layer. Among them, the Meatl1 layer can be used as the power layer 30, the Metal2 layer can be used as the ground layer 10, the ThickCu1 layer can be used as the first layer 21, the ThickCu2 layer can be used as the second layer 22, and the ThickAl layer can be used as the third layer 23. The remaining metal layers are not involved. The corresponding connection points between the layers can be connected by vias filled with metal materials. With this arrangement, the power combiner includes a multi-layer structure arranged in the vertical direction, which is conducive to improving the integration of the power combiner.

[0066] The present application has conducted a simulation test on the power combiner 100 prepared by the above process, and the simulation results are as follows: Fig. 9 As shown, Fig. 9 The horizontal axis is frequency in GHz; the vertical axis is S-parameters (Sc attering Parameters) in dB. Curve S(2,1) and curve S(3,1) are the insertion losses from the two input ports to the output port of the power combiner 100, respectively. The difference between curve S(2,1) and curve S(3,1) is the imbalance. Curve (1,1) is the return loss, that is, the proportion of the signal reflected at the output port. The power combiner 100 has a 3dB bandwidth of 200GHz to 415GHz in the ultra-wide frequency band of 300GHz. Since the power combiner 100 includes two input ports, the loss should be subtracted from the inherent 3dB loss of the power combiner, resulting in an actual loss of 1.8dB. The imbalance of the power combiner is less than 0.5dB, and in most of the frequency band range of 200GHz to 415GHz, the return loss of the power combiner is less than -10dB. Therefore, the power combiner has a good impedance matching effect.

[0067] The present application also provides a power combiner component, such as Fig.10 As shown, the power combiner assembly 200 includes a plurality of the above-mentioned power combiners 100, and the plurality of the power combiners 100 are arranged along the first direction X, and the third layers 23 of the adjacent power combiners 100 are connected. Fig.10 In the illustrated embodiment, the power combiner assembly 200 includes two power combiners 100 , and the second signal lines 234 in the coplanar waveguide lines of the two power combiners 100 are connected to each other. Fig.10 The power combiner component 200 shown includes four input terminals and one output terminal, and can directly combine the output currents of two power combiners, that is, can achieve further power combination.

[0068] In some other embodiments, the number of the power combiner 100 included in the power combiner component 200 is 2n, where n is a natural number greater than or equal to 1, and the output end 210 of the power combiner component 200 is located between the nth power combiner and the n+1th power combiner 100. The output end 210 being located in the middle position helps to make the power combiner component 200 symmetrical and balanced in circuit structure, which is conducive to achieving high-efficiency and low-loss power combination.

Claims

1. A power combiner, It is characterized in that The power combiner comprises: Ground plane; a signal transmission layer, located on one side of the ground layer, the signal transmission layer comprising a first layer, a second layer and a third layer stacked in sequence; wherein the first layer is located on a side of the second layer facing the ground layer, and the third layer is located on a side of the second layer facing away from the ground layer; The signal transmission layer includes a first area and a second area, the first area and the second area are spaced apart; the first layer includes a first portion of the first layer located in the first area and a second portion of the first layer located in the second area; the second layer includes a second portion of the second layer located in the second area; the third layer includes a first portion of the third layer located in the first area and a second portion of the third layer located in the second area; The end of the first portion of the first layer away from the second area is connected to the ground layer, and the end of the second portion of the first layer away from the first area is connected to the ground layer; the second portion of the second layer is connected to the second portion of the first layer; the first portion of the third layer is connected to the second portion of the third layer; The second portion of the second layer includes a first signal line and two first grounding lines extending along the first direction, wherein the first grounding lines are arranged at intervals on both sides of the first signal line along the second direction; one end of the first signal line facing the first region is connected to the second portion of the first layer, and the first grounding lines are respectively connected to the second portions of the first layer; The first portion of the third layer includes a second signal line and two second grounding lines extending along the first direction, the second grounding lines are arranged at intervals on both sides of the second signal line along the second direction, and the second grounding lines are respectively connected to the first portion of the first layer; The second portion of the third layer includes a second signal line and two second grounding lines extending along the first direction, the second grounding lines are arranged at intervals on both sides of the second signal line along the second direction, and the second signal lines are respectively connected to the first portion of the first layer; The second signal line of the first part of the third layer is connected to the second signal line of the second part of the third layer; The third layer first part includes a first input terminal and an output terminal, and the third layer second part includes a second input terminal.

2. The power combiner according to claim 1, It is characterized in that The second layer also includes a second layer first part located in the first area; the second layer first part includes a first signal line and two first grounding lines extending along the first direction, and the first grounding lines are arranged at intervals on both sides of the first signal line along the second direction; the first grounding lines are respectively connected to the first layer first part.

3. The power combiner according to claim 1, It is characterized in that The structures of the power combiner on both sides along the first direction and / or the second direction are substantially the same.

4. The power combiner according to claim 1, It is characterized in that An end of the second signal line of the first portion of the third layer away from the first region extends outward to form an extension section.

5. The power combiner according to claim 1, It is characterized in that The power synthesizer also includes a power supply layer. When the power synthesizer includes the power supply layer, the first part of the first layer and the second part of the first layer are not connected to the ground layer, the end of the first part of the first layer away from the second area is connected to the power supply layer, and the end of the second part of the first layer away from the first area is connected to the power supply layer.

6. The power combiner according to claim 1, It is characterized in that The ground layer is provided with a first window area at a position corresponding to the first area and the second area.

7. A power combiner assembly, It is characterized in that The power combiner assembly comprises a plurality of power combiners according to any one of claims 1 to 6, wherein the plurality of power combiners are arranged along a first direction, and the third layers of adjacent power combiners are connected.

8. The power combiner assembly according to claim 7, It is characterized in that The power combiner component includes 2n power combiners, wherein n is a natural number greater than or equal to 1, and the output end of the power combiner component is located between the nth power combiner and the (n+1)th power combiner.

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