A semiconductor chip mounter with self-cleaning function

Abstract

The present invention discloses a semiconductor mounter with a self-cleaning function, which relates to the technical field of mounters and includes a frame, a patch head group, a nozzle, a connecting frame, a plurality of docking heads, a lower pressing plate and a plurality of sliding rods. The connecting frame is connected to the frame. A first positioning plate is slidably connected to one side of the connecting frame in the vertical direction. A first spring is connected between the first positioning plate and the connecting frame. A plurality of docking heads all penetrate through the first positioning plate. The lower pressing plate is slidably connected to the connecting frame in the vertical direction. A second spring is connected between the lower pressing plate and the first positioning plate. The plurality of sliding rods cooperate with the plurality of docking heads. The sliding rods are inserted into the docking heads and are slidably connected to the docking heads. A thimble is coaxially connected to the lower end of the sliding rod, and the thimble can coaxially penetrate through the nozzle. The present invention does not require additional complex cleaning equipment, can effectively prevent the problem of complete blockage of the nozzle, saves the complex processes of disassembling the completely blocked nozzle, transporting the nozzle, and then cleaning, and saves production costs.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounters, in particular to a semiconductor chip mounter with a self-cleaning function. Background Art

[0002] Microelectronic components are miniaturized electronic system chips and devices created using microelectronics process technology. Currently, the placement of these components is performed using automatic placement machines. These machines, also known as "mounters" or "surface mount systems," are located after the dispensing machine or screen printer in the production line. They accurately place surface mount components on PCB pads using a mobile placement head. Fully automatic placement machines, designed for high-speed, high-precision, fully automated placement of components, are the most critical and complex equipment in the entire SMT production process. They are the primary equipment in SMT production lines, evolving from early low-speed mechanical placement machines to high-speed optically aligned placement machines, and are also developing towards multifunctional, flexible, and modular systems.

[0003] The nozzle of the placement machine is an equipment part used for surface mount components. Its function is to accurately place the surface mount components to the corresponding position on the circuit board. The nozzle of the placement machine is an important component that carries the suction and placement of electronic components.

[0004] During the operation of the placement machine, it is easy for the suction nozzle to fail to suck up components normally, resulting in the inability to install components. The most important cause of the failure is the blockage of the suction nozzle. Therefore, various types of ultrasonic cleaning equipment have been derived to specifically clean the suction nozzle.

[0005] However, the current placement machines do not have the function of cleaning the suction nozzles. When cleaning the suction nozzles, the nozzles that are clogged or have suction problems are removed from the head group and then transferred to additional special cleaning equipment for cleaning. This process is cumbersome and time-consuming to remove and replace the suction nozzles and clean the nozzles, which increases the downtime of the placement machine and requires additional cleaning equipment, which greatly increases production costs. Summary of the Invention

[0006] In response to the above problems, the present invention provides a semiconductor placement machine with a self-cleaning function, which does not require additional complex cleaning equipment and can effectively prevent the problem of complete clogging of the suction nozzle, saving the complicated process of disassembling the completely clogged suction nozzle, transferring the suction nozzle, and then cleaning, and saving production costs.

[0007] The technical solution adopted to solve the above technical problems is as follows: A semiconductor mounter with a self-cleaning function, comprising a frame, a patch head group, a nozzle, a connecting frame, a plurality of docking heads, a lower pressing plate and a plurality of sliding rods. The patch head group moves in multiple axes on the frame. The nozzle is connected to the patch head group. The connecting frame is connected to the frame. A first positioning plate is slidably connected to one side of the connecting frame in the vertical direction. A first spring is connected between the first positioning plate and the connecting frame. A plurality of docking heads all penetrate through the first positioning plate. The lower pressing plate is slidably connected to the connecting frame in the vertical direction. The lower pressing plate slides in the same direction as the first positioning plate. A second spring is connected between the lower pressing plate and the first positioning plate. The plurality of sliding rods cooperate with the plurality of docking heads. The sliding rods are inserted into the docking heads and are slidably connected to the docking heads. A thimble is coaxially connected to the lower end of the sliding rod, and the thimble can coaxially penetrate through the nozzle.

[0008] Further, it further comprises: a rotary cylinder, a second positioning plate, a third spring, a plurality of air nozzles, a transition box and an air pump. The rotary cylinder is connected to the frame. The output end of the rotary cylinder is connected to a main shaft. The connecting frame is fixedly connected to the main shaft. The connecting frame is rotatably connected to the frame through the main shaft. The second positioning plate is slidably connected to the other side of the connecting frame in the vertical direction. The first positioning plate and the second positioning plate are symmetrically arranged. The first positioning plate and the second positioning plate are fixedly connected by a connecting plate. The third spring is connected between the second positioning plate and the connecting frame. The plurality of air nozzles all penetrate through the second positioning plate. The plurality of air nozzles and the plurality of docking heads are arranged in the same layout. The air nozzles can be sleeved on the upper end of the nozzle. The transition box is hermetically connected to the upper side of the second positioning plate. The upper end of the air nozzle penetrates through the second positioning plate and is inside the transition box. The air pump is connected to one side of the frame. The output end of the air pump is communicated with a flexible air pipe, and the flexible air pipe is communicated with the transition box.

[0009] Further, it further comprises a lower pressing mechanism. The lower pressing mechanism is connected to the frame and drives the lower pressing plate to move downward. The lower pressing mechanism comprises: a mounting plate, a double-sided rack, a connecting member, two spur gears, two pressing rods, two bevel gear sets, a pressing block and a second cylinder. The mounting plate is connected to the frame. A first cylinder is connected to the mounting plate. The end of the double-sided rack is connected to the output end of the first cylinder. The connecting member is slidably connected to the mounting plate in the vertical direction. The connecting member is connected with a fourth spring. The two spur gears are respectively rotatably connected to both sides of the connecting member through a first rotating shaft. The two spur gears are respectively meshed with both sides of the double-sided rack. The two pressing rods are respectively rotatably connected to both sides of the connecting member through a second rotating shaft. The pressing rods are used for pressing the first positioning plate and the second positioning plate. The two bevel gear sets realize the linkage of the corresponding first rotating shaft and the second rotating shaft. The pressing block is connected to one side of the double-sided rack, and the pressing block acts on the connecting member. The second cylinder is connected to the upper side of the mounting plate, and the output end of the second cylinder acts on the lower pressing plate.

[0010] Further, it further includes a first replacement component. The first replacement component is slidably connected to the frame in the horizontal direction. A plurality of suction nozzles of the pick-and-place head group are detachably placed on the first replacement component. The first replacement component includes: a placement table, a limiting rod, a clamping plate member, and a plurality of card slots. The placement table is slidably connected to the frame in the horizontal direction. A plurality of placement holes are arranged side by side on the placement table. The placement holes are matched with the docking heads. The suction nozzles are clamped in the placement holes. A plurality of docking heads cooperate with a plurality of suction nozzles on the first replacement component. The docking heads can be sleeved on the upper ends of the suction nozzles. The limiting rod penetrates through the lower side of the placement table. The limiting rod is slidably connected to the placement table. A fifth spring is sleeved on the limiting rod. The clamping plate member is connected to the end of the limiting rod. The clamping plate member is slidably connected to the placement table through the limiting rod. A plurality of card slots are opened on the clamping plate member. The card slots are matched with the placement holes. The clamping plate member cooperates with the placement table through the card slots to fix the suction nozzles. When the fifth spring is in its natural length, the first replacement component locks and fixes the suction nozzles.

[0011] Further, it further includes: a push-pull electromagnet. The push-pull electromagnet is connected to the frame. The output end of the push-pull electromagnet is connected with a top member. The top member acts on the clamping plate member. When the top member pushes the clamping plate member, the first replacement component unlocks the suction nozzles.

[0012] Further, it further includes a second replacement component. The second replacement component is slidably connected to the frame in the horizontal direction. The sliding direction of the second replacement component is parallel to the sliding direction of the first replacement component. The second replacement component has the same structure as the first replacement component. The position distribution of the second replacement component and the first replacement component is diagonally arranged.

[0013] Further, it further includes: a sprocket group and a motor. The sprocket group is connected to the frame. The sprocket group is located between the first replacement component and the second replacement component. The motor is connected to the frame. The output shaft of the motor is fixedly connected to one of the sprockets of the sprocket group. One side of the placement table is fixedly connected to the chain of the sprocket group through a connecting block. The sprocket group realizes the linkage of the movements of the first replacement component and the second replacement component.

[0014] The beneficial effects of the present invention are:

[0015] 1. The present invention automatically disassembles the suction nozzle by cooperating with the replacement component and the patch head group. After the suction nozzle is disassembled on the replacement component, the replacement component slides to the cleaning area, and the first positioning plate on the connecting frame cooperates with the replacement component. The downward movement of the first positioning plate drives multiple docking joints to move downward, and the docking joints are sleeved on the upper end of the suction nozzle one by one to ensure that the ejector pin can pass through the suction nozzle smoothly. The downward movement of the lower pressure plate drives the sliding rod and the ejector pin to move downward, and the ejector pin dredges and cleans the suction nozzle. A spare suction nozzle is placed on the replacement component. It only needs to be automatically replaced regularly. During the continuous operation of the placement machine, the replaced suction nozzle can be cleaned, and the replaced suction nozzle becomes a spare suction nozzle with qualified suction force again. This cycle does not require additional complex cleaning equipment, can effectively prevent the suction nozzle from being completely blocked, saves the complicated process of disassembling the completely blocked suction nozzle, transporting the suction nozzle, and then cleaning, and saves production costs.

[0016] 2. The rotating cylinder is used to drive the main shaft to rotate, thereby changing the cleaning method. After the ejector pin is unblocked and cleaned, the second positioning plate moves to the upper side of the disassembly component. Similarly, the second positioning plate moves downward so that the air nozzle and the suction nozzle are in contact with each other. The air pump is operated to introduce high-pressure gas into the transition box through the soft air pipe. The transition box then guides the high-pressure gas to each air nozzle for high-pressure blowing cleaning. After the ejector pin is cleaned, the suction nozzle is cleaned again by high-pressure blowing, which cooperates with the ejector pin to achieve a better cleaning effect.

[0017] 3. The present invention provides a first replacement component, a second replacement component and an air pump, etc., so that the device can clean nozzles of various materials. It is not only suitable for rigid nozzles such as tungsten steel and carbon steel, but also for colloid and ceramic nozzles, and has good practicality and superiority. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the position of the first replacement component of the present invention.

[0020] Figure 3 This is a schematic diagram of the position of the second replacement component of the present invention.

[0021] Figure 4 It is a schematic diagram of the position of the pressing mechanism of the present invention.

[0022] Figure 5 Schematic diagram of the pressing mechanism structure of the present invention Figure 1 .

[0023] Figure 6 It is a schematic diagram of the ejector structure of the present invention.

[0024] Figure 7Schematic diagram of the pressing mechanism of the present invention Figure 2 。

[0025] Figure 8 Schematic diagram of the pressing mechanism of the present invention Figure 3 。

[0026] Figure 9 Schematic diagram of the connecting member structure of the present invention.

[0027] Figure 10 Schematic diagram of the position of the pressing block of the present invention

[0028] Figure 11 Schematic diagram of the pressing rod structure of the present invention

[0029] Figure 12 Schematic diagram of the sprocket structure of the present invention

[0030] Figure 13 Schematic diagram of the placement table structure of the present invention

[0031] Figure 14 Schematic diagram of the position of the placement hole of the present invention

[0032] Figure 15 Schematic diagram of the card plate member structure of the present invention

[0033] Figure 16 Schematic diagram of the card slot structure of the present invention

[0034] Reference numerals: 1, frame; 2, chip placement head group; 3, first replacement component; 31, placement table; 32, placement hole; 33, limiting rod; 34, fifth spring; 35, card plate member; 36, card slot; 4, suction nozzle; 5, connecting frame; 6, first positioning plate; 7, first spring; 8, docking head; 10, lower pressing plate; 11, second spring; 12, sliding rod; 13, ejector pin; 14, pressing mechanism; 141, mounting plate; 142, first cylinder; 143, double-sided rack; 144, connecting member; 145, fourth spring; 146, spur gear; 147, first rotating shaft; 148, pressing rod; 149, second rotating shaft; 1410, bevel gear set; 1411, pressing block; 1412, second cylinder; 15, rotating cylinder; 16, main shaft; 17, second positioning plate; 18, connecting plate; 19, third spring; 20, air nozzle; 21, transition box; 22, air pump; 23, flexible air pipe; 24, push-pull electromagnet; 25, ejecting member; 26, second replacement component; 27, sprocket group; 28, motor. Detailed implementation manners

[0035] In order to make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0036] As Figures 1-6 shown, a semiconductor mounter with a self-cleaning function provided in this embodiment includes: a frame 1, a patch head group 2, a nozzle 4, a first replacement component 3, a connecting frame 5, a plurality of docking heads 8, a lower pressing plate 10, a plurality of sliding rods 12, and a lower pressing mechanism 14. The patch head group 2 performs multi-axis movement on the frame 1. The nozzle 4 is connected to the patch head group 2. The first replacement component 3 is slidably connected to the frame 1 in the horizontal direction. A plurality of nozzles 4 of the patch head group 2 are detachably placed on the first replacement component 3. The connecting frame 5 is connected to the frame 1. A first positioning plate 6 is slidably connected to one side of the connecting frame 5 in the vertical direction. A first spring 7 is connected between the first positioning plate 6 and the connecting frame 5. A plurality of docking heads 8 all penetrate through the first positioning plate 6. The plurality of docking heads 8 cooperate with a plurality of nozzles 4 on the first replacement component 3. The docking head 8 can be sleeved on the upper end of the nozzle 4. The lower pressing plate 10 is slidably connected to the connecting frame 5 in the vertical direction. The lower pressing plate 10 slides in the same direction as the first positioning plate 6. A second spring 11 is connected between the lower pressing plate 10 and the first positioning plate 6. A plurality of sliding rods 12 cooperate with a plurality of docking heads 8. The sliding rod 12 is inserted into the docking head 8. The sliding rod 12 is slidably connected to the docking head 8. A thimble 13 is coaxially connected to the lower end of the sliding rod 12. The thimble 13 can coaxially penetrate through the nozzle 4. The lower pressing mechanism 14 is connected to the frame 1. The lower pressing mechanism 14 drives the lower pressing plate 10 to move downward.

[0037] The present invention automatically disassembles the nozzle 4 through the cooperation of the replacement component and the patch head group 2. After the nozzle 4 is disassembled on the replacement component, the replacement component slides to the cleaning area. The first positioning plate 6 on the connecting frame 5 cooperates with the replacement component. The downward movement of the first positioning plate 6 drives the plurality of docking heads 8 to move downward. The docking head 8 is sleeved on the upper end of the nozzle 4 one by one to ensure that the thimble 13 can smoothly pass through the nozzle 4. Then, through the downward movement of the lower pressing plate 10, the sliding rod 12 and the thimble 13 are driven to move downward. The thimble 13 dredges and cleans the nozzle 4. A spare nozzle 4 is placed on the replacement component. Only by regularly and automatically replacing the spare nozzle 4, during the continuous operation of the mounter, the replaced nozzle 4 can be cleaned. The replaced nozzle 4 becomes a spare nozzle 4 with qualified suction again. In this way, without additional complex cleaning equipment, the problem of complete blockage of the nozzle 4 can be effectively prevented, saving the complex processes of disassembling the completely blocked nozzle 4, transporting the nozzle 4, and then cleaning, and saving production costs.

[0038] In the above embodiments, when the pick - and - place head group 2 runs to the upper side of the replacement component, the pick - and - place head group 2 drives the nozzle 4 to move down into the replacement component to cooperate to complete the disassembly of the nozzle 4. This process is the same as the process and principle of automatically replacing the nozzle 4 in the prior art. The connecting frame 5 and the lower pressing plate 10 are both slidably connected to the connecting frame 5 in the way of guide rods.

[0039] As Figure 1 , Figure 4 and Figure 5 shown, it further includes: a rotary cylinder 15, a second positioning plate 17, a third spring 19, a plurality of air nozzles 20, a transition box 21 and an air pump 22. The rotary cylinder 15 is connected to the frame 1. The output end of the rotary cylinder 15 is connected with a main shaft 16. The connecting frame 5 is fixedly connected to the main shaft 16. The connecting frame 5 is rotatably connected to the frame 1 through the main shaft 16. The second positioning plate 17 is slidably connected to the other side of the connecting frame 5 in the vertical direction. The first positioning plate 6 and the second positioning plate 17 are symmetrically arranged. The first positioning plate 6 and the second positioning plate 17 are fixedly connected by a connecting plate 18. The third spring 19 is connected between the second positioning plate 17 and the connecting frame 5. A plurality of air nozzles 20 all penetrate through the second positioning plate 17. The plurality of air nozzles 20 are arranged in the same layout as the plurality of docking heads 8. The air nozzles 20 can be sleeved on the upper end of the nozzle 4. The transition box 21 is hermetically connected to the upper side of the second positioning plate 17. The upper ends of the air nozzles 20 penetrate through the second positioning plate 17 and are inside the transition box 21. The air pump 22 is connected to one side of the frame 1. The output end of the air pump 22 is communicated with a flexible air pipe 23. The flexible air pipe 23 is communicated with the transition box 21.

[0040] In the above embodiments, the rotary cylinder 15 adopts a 180 - degree specification, and the rotation direction does not affect the normal ventilation of the flexible air pipe 23. The second positioning plate 17 also adopts the way of guide rods to be slidably connected to the connecting frame 5. After the ejector pin 13 finishes cleaning the nozzle 4, the rotary cylinder 15 is operated to drive the main shaft 16 to rotate. The main shaft 16 drives the connecting frame 5 to rotate, and the first positioning plate 6 and the second positioning plate 17 change positions. The second positioning plate 17 is on the upper side of the replacement component. The air nozzles 20 on the second positioning plate 17 correspond to the nozzles 4. Then, the second positioning plate 17 is pressed by the pressing mechanism 14 to realize the docking of the air nozzles 20 and the nozzles 4. After that, the air pump 22 operates to blow high - pressure air to clean the nozzles 4.

[0041] As Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 7 , Figure 8 , Figure 9 and Figure 10 inside, Figure 11As shown in the figure, the pressing mechanism 14 includes: a mounting plate 141, a double-sided rack 143, a connecting member 144, two spur gears 146, two pressing rods 148, two bevel gear sets 1410, a pressing block 1411, and a second cylinder 1412. The mounting plate 141 is connected to the frame 1. A first cylinder 142 is connected to the mounting plate 141. The end of the double-sided rack 143 is connected to the output end of the first cylinder 142. The connecting member 144 is slidably connected to the mounting plate 141 in the vertical direction. The connecting member 144 is connected with a fourth spring 145. The two spur gears 146 are respectively rotatably connected to both sides of the connecting member 144 through a first rotating shaft 147. The two spur gears 146 are respectively engaged with both sides of the double-sided rack 143. The two pressing rods 148 are respectively rotatably connected to both sides of the connecting member 144 through a second rotating shaft 149. The pressing rods 148 are used to press the first positioning plate 6 and the second positioning plate 17. The two bevel gear sets 1410 realize the linkage of the corresponding first rotating shaft 147 and the second rotating shaft 149. The pressing block 1411 is connected to one side of the double-sided rack 143. The pressing block 1411 acts on the connecting member 144. The second cylinder 1412 is connected to the upper side of the mounting plate 141. The output end of the second cylinder 1412 acts on the lower pressing plate 10.

[0042] In the above embodiments, the connecting member 144 is slidably connected to the mounting plate 141 in the form of a guide rod. When the first positioning plate 6 or the second positioning plate 17 rotates to the upper side of the replacement component, the pressing mechanism 14 operates. The first cylinder 142 moves to push the double-sided rack 143 downward. At this time, the fourth spring 145 has a large elastic force to ensure that the connecting member 144 and the pressing rods 148 will not have too large a downward movement distance. At this time, the elastic force of the fourth spring 145 is much greater than the frictional force between the double-sided rack 143 and the two spur gears 146. The double-sided rack 143 drives the spur gears 146 on both sides to rotate. The two spur gears 146 respectively drive the two first rotating shafts 147 to rotate. Through the bevel gear sets 1410, the two second rotating shafts 149 are driven to rotate. The second rotating shaft 149 is fixedly connected to the pressing rod 148. The second rotating shaft 149 drives the pressing rod 148 to rotate. The two pressing rods 148 change from the open state to the locked state. At this time, the two pressing rods 148 rotate to the upper side of the first positioning plate 6 or the second positioning plate 17. After the pressing rod 148 rotates to 90 degrees, the pressing block 1411 just contacts the connecting member 144. The first cylinder 142 continues to move, and the double-sided rack 143 continues to move downward. At this time, the connecting member 144, the two spur gears 146, the two bevel gear sets 1410, and the two pressing rods 148 move downward synchronously. The fourth spring 145 is further compressed. The pressing rod 148 presses the first positioning plate 6 or the second positioning plate 17 downward, so that the docking head 8 is docked with the suction nozzle 4 or the air nozzle 20 is docked with the suction nozzle 4. After the docking is completed, the first cylinder 142 stops operating. The second cylinder 1412 moves downward to push the lower pressing plate 10, so that the lower pressing plate 10 drives the sliding rod 12 and the ejector pin 13 to move downward. The ejector pin 13 dredges and cleans the inside of the suction nozzle 4.

[0043] As shown Figures 13-16 in FIG. 1, the first replacement component 3 includes: a placement table 31, a limiting rod 33, a clamping plate member 35, and a plurality of card slots 36. The placement table 31 is slidably connected to the frame 1 in the horizontal direction. The placement table 31 is slidably connected to the frame 1 by means of a chute. A plurality of placement holes 32 are arranged side by side on the placement table 31. The placement holes 32 are matched with the docking head 8. The suction nozzle 4 is clamped in the placement hole 32. The limiting rod 33 penetrates through the lower side of the placement table 31. The limiting rod 33 is slidably connected to the placement table 31. A fifth spring 34 is sleeved on the limiting rod 33. The clamping plate member 35 is connected to the end of the limiting rod 33. The clamping plate member 35 is slidably connected to the placement table 31 through the limiting rod 33. A plurality of card slots 36 are formed in the clamping plate member 35. The card slots 36 are matched with the placement holes 32. The clamping plate member 35 cooperates with the placement table 31 through the card slots 36 to fix the suction nozzle 4. When the fifth spring 34 is in its natural length, the first replacement component 3 locks and fixes the suction nozzle 4.

[0044] In the above embodiment, due to the action of the fifth spring 34 on the limiting rod 33, the limiting rod 33 always abuts against one side of the placement table 31. At this time, the card slots 36 on the clamping plate member 35 cooperate with the placement holes 32, and the suction nozzle 4 is in a locked state.

[0045] As shown Figure 2 in FIGS. 2 Figure 3 and Figure 12 3, it further includes: a push-pull electromagnet 24. The push-pull electromagnet 24 is connected to the frame 1. The output end of the push-pull electromagnet 24 is connected with a top member 25. The top member 25 acts on the clamping plate member 35. When the top member 25 pushes the clamping plate member 35, the first replacement component 3 unlocks the suction nozzle 4.

[0046] In the above embodiment, only when the patch head group 2 cooperates with the replacement component to replace the suction nozzle 4, the push-pull electromagnet 24 operates, and the top member 25 acts on the clamping plate member 35, so that the clamping plate member 35 drives the limiting rod 33 to slide. At this time, the fifth spring 34 is in a compressed state. The clamping plate member 35 slides, causing the position of the card slot 36 to change, so that the placement hole 32 is in an unlocked state. At this time, the suction nozzle 4 can be placed or replaced.

[0047] As shown Figure 2 in FIGS. 4 Figure 3 and Figure 12 5, it further includes a second replacement component 26. The second replacement component 26 is slidably connected to the frame 1 in the horizontal direction. The sliding direction of the second replacement component 26 is parallel to the sliding direction of the first replacement component 3. The second replacement component 26 has the same structure as the first replacement component 3. The position distribution of the second replacement component 26 and the first replacement component 3 is diagonally arranged.

[0048] In the above embodiments, the second replacement component 26 is provided, and the rubber suction nozzle 4 and the ceramic suction nozzle 4 can be placed thereon. Since the suction nozzles 4 of these two materials are easily damaged, they are cleaned by means of high-pressure air blowing, which can prevent damage to the suction nozzles 4 during the cleaning process.

[0049] As Figure 2 , Figure 3 and Figure 12 shown, it further includes: a sprocket group 27 and a motor 28. The sprocket group 27 is connected to the frame 1, and the sprocket group 27 is located between the first replacement component 3 and the second replacement component 26. The motor 28 is connected to the frame 1, and the output shaft of the motor 28 is fixedly connected to one of the sprockets of the sprocket group 27. One side of the placement table 31 is fixedly connected to the chain of the sprocket group 27 through a connecting block, and the sprocket group 27 realizes the linkage of the movements of the first replacement component 3 and the second replacement component 26.

[0050] In the above embodiments, when the motor 28 operates to drive the sprocket group 27 to move, the first replacement component 3 and the second replacement component 26 move synchronously and reversely in a straight line direction.

[0051] The working principle of the present invention is as follows.

[0052] First, the rigid suction nozzles 4 such as tungsten steel and carbon steel are placed in the first replacement component 3, and the rubber suction nozzle 4 and the ceramic suction nozzle 4 are placed in the second replacement component 26. The first replacement component 3 can perform the dredging and cleaning of the ejector pin 13 and the high-pressure air flushing cleaning, and the suction nozzles 4 in the second replacement component 26 only perform the high-pressure air flushing cleaning.

[0053] When disassembling and replacing the suction nozzle 4, the motor 28 is operated to drive the sprocket group 27 to rotate, so that the first replacement component 3 or the second replacement component 26 is in the position for replacing the suction nozzle 4. The patch head group 2 moves to the upper side of the first replacement component 3 or the second replacement component 26, and the push-pull electromagnet 24 operates, so that the ejector 25 pushes the clamping plate member 35 to slide on the placement table 31. At this time, the limit rod 33 slides synchronously on the placement table 31, the fifth spring 34 is in a compressed state, the card slot 36 is aligned with the placement hole 32, and the placement hole 32 is in an open state. The suction nozzle 4 is moved downwards so that the suction nozzle 4 enters the placement hole 32. The push-pull electromagnet 24 operates, and the ejector 25 is separated from the clamping plate member 35. Due to the action of the fifth spring 34, the limit rod 33 and the clamping plate member 35 are reset. At this time, the clamping plate member 35 locks the suction nozzle 4 on the placement table 31 through the card slot 36. The steps of installing the suction nozzle 4 are similar. The suction nozzle 4 is moved downwards so that the suction nozzle 4 is docked with the patch head group 2, the placement hole 32 is unlocked, and the suction nozzle 4 is moved upwards.

[0054] Clean the rigid nozzle 4 on the first replacement component 3. Run the motor 28 to drive the sprocket group 27 to move, so that the first replacement component 3 moves to the cleaning area. In the initial state, the first positioning plate 6 is exactly above the clamping plate member 35. Run the first cylinder 142 to push the double-sided rack 143 downward. The double-sided rack 143 drives the spur gears 146 on both sides to rotate. At this time, due to the elastic force of the fourth spring 145, components such as the connecting member 144, the spur gear 146, and the pressing rod 148 will not undergo a serious downward movement operation, only having a partial downward trend. The spur gear 146 rotates to drive the first rotating shaft 147 to rotate. The first rotating shaft 147 drives the second rotating shaft 149 to rotate through the bevel gear set 1410. The second rotating shaft 149 drives the pressing rod 148 to rotate. At this time, the two pressing rods 148 that are initially open come into contact with each other. The two pressing rods 148 rotate to the upper side of the first positioning plate 6. At the same time, the pressing block 1411 contacts the connecting member 144. The pressing block 1411 drives the connecting member 144, the spur gear 146, the bevel gear set 1410, and the pressing rod 148 to move downward synchronously. The fourth spring 145 is compressed. The pressing rod 148 drives the first positioning plate 6 to move downward. The first positioning plate 6, the connecting plate 18, and the second positioning plate 17 move downward synchronously. The first spring 7 is in a compressed state, so that the docking head 8 is docked with the nozzle 20. After the docking is completed, the first cylinder 142 locks and stops moving. Run the second cylinder 1412 to push the lower pressing plate 10 downward. The lower pressing plate 10 moves downward to drive the slide rod 12 to move downward. The slide rod 12 drives the ejector pin 13 to move downward. The ejector pin 13 penetrates the nozzle 4 through the docking head 8 to dredge and clean the nozzle 4. At this time, the second spring 11 is in a compressed state. The second cylinder 1412 can be reciprocated multiple times for multiple cleanings. After the cleaning is completed, first, the second cylinder 1412 retracts. The lower pressing plate 10, the slide rod 12, and the ejector pin 13 are reset under the action of the second spring 11. The ejector pin 13 is separated from the nozzle 4. Then, the first cylinder 142 retracts. When the double-sided rack 143 moves upward, the connecting member 144, the spur gear 146, and the pressing rod 148 move upward. At the same time, the double-sided rack 143 drives the spur gear 146 to rotate. After the cylinder retracts completely, the two pressing rods 148 are in the open state again.

[0055] After that, perform high-pressure air flushing and cleaning. Run the rotary cylinder 15 to drive the main shaft 16 to rotate 180 degrees. The first positioning plate 6 and the second positioning plate 17 change positions. Repeat the above operations to make the nozzle 20 dock with the nozzle 4. Then run the air pump 22 to perform secondary cleaning on the nozzle 4.

[0056] Clean the rubber suction nozzle 4 on the second replacement component 26. Run the motor 28 to make the sprocket rotate. The sprocket drives the second replacement component 26 to move to the cleaning area, so that the second positioning plate 17 is directly above the second replacement component 26. Repeat the above operation to lower the first positioning plate 6. The first positioning plate 6 is fixedly connected to the second positioning plate 17 through the connecting plate 18, so that the second positioning plate 17 moves down, realizing the docking of the suction nozzle 4 on the second replacement component with the air nozzle 20. Repeat the above operation for high-pressure air inflation.

[0057] The above is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A semiconductor chip mounter with a self-cleaning function, comprising a frame (1), a chip head group (2) and a nozzle (4), wherein the chip head group (2) moves in multiple axes on the frame (1), and the nozzle (4) is connected to the chip head group (2), and is characterized in that, Further included are: A connecting frame (5) is connected to the frame (1). On one side of the connecting frame (5), a first positioning plate (6) is slidably connected in the vertical direction. A first spring (7) is connected between the first positioning plate (6) and the connecting frame (5); A plurality of docking heads (8) all penetrate through the first positioning plate (6); A lower pressing plate (10) is slidably connected to the connecting frame (5) in the vertical direction. The lower pressing plate (10) slides in the same direction as the first positioning plate (6). A second spring (11) is connected between the lower pressing plate (10) and the first positioning plate (6); A plurality of sliding rods (12) cooperate with the plurality of docking heads (8). The sliding rods (12) are inserted into the docking heads (8). The sliding rods (12) are slidably connected to the docking heads (8). A thimble (13) is coaxially connected to the lower end of the sliding rod (12). The thimble (13) can coaxially penetrate through the suction nozzle (4); A lower pressing mechanism (14) is connected to the frame (1). The lower pressing mechanism (14) drives the lower pressing plate (10) to move downward; The lower pressing mechanism (14) includes: A mounting plate (141) is connected to the frame (1). A first air cylinder (142) is connected to the mounting plate (141); A double-sided rack (143) has its end connected to the output end of the first air cylinder (142); A connecting member (144) is slidably connected to the mounting plate (141) in the vertical direction. The connecting member (144) is connected with a fourth spring (145); Two spur gears (146) are respectively rotatably connected to both sides of the connecting member (144) through a first rotating shaft (147). The two spur gears (146) are respectively meshed with both sides of the double-sided rack (143); Two pressing rods (148) are respectively rotatably connected to both sides of the connecting member (144) through a second rotating shaft (149). The pressing rods (148) are used to press the first positioning plate (6) and the second positioning plate (17); Two bevel gear sets (1410) link the corresponding first rotating shaft (147) and the second rotating shaft (149) in a linkage manner; A pressing block (1411) is connected to one side of the double-sided rack (143). The pressing block (1411) acts on the connecting member (144); A second air cylinder (1412) is connected to the upper side of the mounting plate (141). The output end of the second air cylinder (1412) acts on the lower pressing plate (10); A first replacement component (3) is slidably connected to the frame (1) in the horizontal direction. The plurality of suction nozzles (4) of the chip placement head group (2) are detachably placed on the first replacement component (3); The first replacement component (3) includes: A placement table (31) is slidably connected to the frame (1) in the horizontal direction. A plurality of placement holes (32) are arranged side by side on the placement table (31). The placement holes (32) cooperate with the docking heads (8). The suction nozzle (4) is snap-fitted into the placement hole (32); A plurality of the docking heads (8) cooperate with a plurality of the suction nozzles (4) on the first replacement component (3), and the docking heads (8) can be sleeved on the upper ends of the suction nozzles (4); A limiting rod (33) penetrates through the lower side of the placing table (31), the limiting rod (33) is slidably connected to the placing table (31), and a fifth spring (34) is sleeved on the limiting rod (33); A clamping plate member (35) is connected to the end of the limiting rod (33), and the clamping plate member (35) is slidably connected to the placing table (31) through the limiting rod (33); A plurality of clamping grooves (36) are formed in the clamping plate member (35), the clamping grooves (36) are matched with the placing holes (32), and the clamping plate member (35) cooperates with the placing table (31) through the clamping grooves (36) to fix the suction nozzle (4); When the fifth spring (34) is in its natural length, the first replacement component (3) locks and fixes the suction nozzle (4); It further includes a second replacement component (26), and the second replacement component (26) is slidably connected to the frame (1) in the horizontal direction; The sliding direction of the second replacement component (26) is parallel to the sliding direction of the first replacement component (3); The second replacement component (26) has the same structure as the first replacement component (3); The second replacement component (26) and the first replacement component (3) are diagonally arranged in terms of position distribution.

2. The semiconductor chip mounter with self-cleaning function according to claim 1, characterized in that, It further includes: A rotary cylinder (15) is connected to the frame (1), the output end of the rotary cylinder (15) is connected with a main shaft (16), the connecting frame (5) is fixedly connected to the main shaft (16), and the connecting frame (5) is rotatably connected to the frame (1) through the main shaft (16); A second positioning plate (17) is slidably connected to the other side of the connecting frame (5) in the vertical direction, the first positioning plate (6) is symmetrically arranged with the second positioning plate (17), and the first positioning plate (6) and the second positioning plate (17) are fixedly connected through a connecting plate (18); A third spring (19) is connected between the second positioning plate (17) and the connecting frame (5); A plurality of air nozzles (20) all penetrate through the second positioning plate (17), and the plurality of air nozzles (20) are arranged in the same layout as the plurality of docking heads (8), and the air nozzles (20) can be sleeved on the upper ends of the suction nozzles (4); A transition box (21) is hermetically connected to the upper side of the second positioning plate (17), and the upper ends of the air nozzles (20) penetrate through the second positioning plate (17) and are inside the transition box (21); An air pump (22) is connected to one side of the frame (1), the output end of the air pump (22) is communicated with a flexible air pipe (23), and the flexible air pipe (23) is communicated with the transition box (21).

3. A semiconductor mounter with a self-cleaning function according to claim 1, characterized in that, It further includes: A push-pull electromagnet (24) is connected to the frame (1), the output end of the push-pull electromagnet (24) is connected with a top member (25), and the top member (25) acts on the clamping plate member (35); When the top piece (25) pushes the clamping plate piece (35), the first replacement component (3) unlocks the nozzle (4).

4. The semiconductor mounter with self-cleaning function according to claim 3, characterized in that, Further included are: A sprocket wheel set (27), connected to the frame (1), and the sprocket wheel set (27) is located between the first replacement component (3) and the second replacement component (26); A motor (28), connected to the frame (1), and the output shaft of the motor (28) is fixedly connected to one of the sprocket wheels of the sprocket wheel set (27); One side of the placement table (31) is fixedly connected to the chain of the sprocket wheel set (27) through a connecting block; The sprocket wheel set (27) realizes the linkage of the movements of the first replacement component (3) and the second replacement component (26).

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