A wafer dry etching device for semiconductor production

Abstract

The invention discloses a wafer dry etching device for semiconductor production, which relates to the technical field of wafer dry etching, and comprises a frame, a sealed chamber and a base, and also comprises a movable frame, wherein a supporting sleeve is installed at the bottom of the movable frame, a movable sleeve is installed inside the supporting sleeve, an annular panel is fixedly installed at one end of the movable sleeve, and a supporting frame is installed on the outer wall of the annular panel, a moving part is arranged inside the supporting frame, a scraper is installed on the moving part, and a plurality of tubes for outputting thermal conductive silicone oil are fixedly installed on the scraper. The wafer dry etching device for semiconductor production utilizes the scraper and the tubes thereon to apply thermal conductive silicone oil to the surface of the base, firstly, the thermal conductive silicone oil is transported to the surface of the base through the tube, and the silicone oil on the surface of the base is flattened under the action of the scraper, thereby avoiding the situation that the thermal conductive silicone oil is applied too much or too little.

Description

Technical Field

[0001] The invention relates to the technical field of wafer dry etching, in particular to a wafer dry etching device used for semiconductor production. Background Art

[0002] Wafer dry etching is a key step in semiconductor manufacturing. Its steps usually include the following main stages: first, clean the wafer. Before etching, the wafer surface must be thoroughly cleaned to remove any impurities that may affect the etching quality. Evenly coat a layer of photoresist (photosensitive material) on the surface of the wafer. Dry the wafer coated with photoresist to fix the photoresist and prepare it for photolithography. Place the designed mask (transparent glass or photoresist board with the desired pattern) on top of the photoresist on the wafer and ensure precise alignment between the two. Use an ultraviolet light source to irradiate the photoresist on the wafer through the mask so that the photoresist is in the area corresponding to the transparent part of the mask. A chemical reaction occurs, the exposed wafer is placed in a chemical solution to dissolve the part of the photoresist that is not exposed to light, thereby leaving the desired pattern on the wafer surface. An etching gas (such as a fluorine-based gas) is introduced into the etching chamber, and the gas molecules are ionized into a plasma state through an electric field or other means. The physical bombardment of ions or free radicals in the plasma is used to knock out the material atoms on the surface of the wafer to achieve etching. The etching process is monitored by sensors or other equipment to ensure that etching is performed according to preset parameters and time. After etching is completed, the wafer is cleaned to remove residual etching gas and by-products, and the etched wafer is inspected to ensure that its quality meets the preset standards;

[0003] In the dry etching process, a corresponding base is often selected according to the size of the wafer to ensure that the wafer will not be offset during the etching process. Under normal circumstances, the base is usually 6 inches, 8 inches or 12 inches. However, in the actual etching process, smaller wafers will inevitably appear due to actual needs. When etching these smaller wafers, if a separate base is designed, the cost will be relatively increased and human resources will be wasted. Therefore, when etching small-sized wafers, the staff usually apply thermal conductive silicone oil on the surface of the base. For small-sized wafers, due to their relatively small surface area, the heat generated during the etching process may more easily cause local overtemperature, thereby affecting Etching uniformity and precision, therefore, applying thermal grease can more effectively transfer heat from the wafer surface to the base and disperse it to a larger area, maintaining the temperature uniformity of the wafer surface. At the same time, small-sized samples can be attached to the base through thermal silicone oil. However, when applying thermal silicone oil, the staff's application method often causes too much or too little thermal silicone oil on the base. Applying too much will cause the excess silicone grease to form a thick layer, hindering the effective transfer of heat. Applying too little may cause the wafer temperature to be too high during the etching process, thereby affecting the etching effect and wafer performance. For this reason, we propose a wafer dry etching device for semiconductor production. Summary of the invention

[0004] The object of the present invention is to provide a wafer dry etching device for semiconductor production to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a wafer dry etching device for semiconductor production, comprising a frame, a sealed chamber fixedly mounted on the frame, wherein a base is fixedly mounted inside the frame, and the communication state between the sealed chamber and the inside of the frame is controlled by an automatic sealing door panel, and further comprising:

[0006] A movable frame is arranged inside the sealed chamber, and guide rails are fixedly installed inside the sealed chamber and the frame, and the ends of the guide rails are in contact with both sides of the automatic sealing door panel, and the movable frame slides within the guide rails within a limited position: a supporting sleeve is fixedly installed at the bottom of the movable frame, and a movable sleeve slidably connected to its inner wall is installed inside the supporting sleeve, and an annular panel is fixedly installed at one end of the movable sleeve, and a supporting frame is fixedly installed on the outer wall of the annular panel, wherein a movable part is arranged inside the supporting frame, and a scraper is installed on the movable part, and a plurality of pipe bodies for outputting heat-conducting silicone oil are fixedly installed on the scraper, wherein a cylinder is fixedly installed on the outer wall of the sealed chamber, and the output end of the cylinder is fixedly connected to the movable frame;

[0007] The lifting mechanism is arranged on the moving frame and is used to control the moving sleeve to perform lifting movement, so that under the action of the annular panel and the supporting frame, the moving part drives the scraper to adjust the height;

[0008] The power mechanism is arranged inside the annular panel and is used to control the moving part to adjust its lateral position so that the scraper can apply thermal conductive silicone oil to the surface of the base.

[0009] Preferably, the lifting mechanism includes a servo motor, a rotating shaft, a threaded groove, an annular groove and a guide plate frame.

[0010] The servo motor is fixedly mounted on the top of the moving frame, and the output end thereof penetrates the inner wall of the moving frame and extends to the inside of the moving sleeve;

[0011] The rotating shaft is fixedly connected to the output end of the servo motor;

[0012] The threaded groove body and the annular groove body are both arranged on the outer wall of the rotating shaft body, and the annular groove body is in a communicating state with one end of the threaded groove body;

[0013] The guide plate frame is fixedly installed at the intersection of the threaded groove body and the annular groove body. One side of the guide plate frame is an inclined surface and the other side is a right-angle surface. The side located in the annular groove body is an inclined surface, and the side located at the intersection of the threaded groove body and the annular groove body is a right-angle surface.

[0014] Preferably, a retractable sphere is fixedly mounted on the inner wall of the movable sleeve, and the retractable sphere slides within the threaded groove and the annular groove, wherein a plurality of constant force springs are connected between the bottom of the support sleeve and the top of the annular panel.

[0015] Preferably, the power mechanism includes a rotating sleeve disposed inside the annular panel, and the rotating sleeve is rotatably connected to the inner wall of the annular panel, and the end of the rotating shaft sequentially passes through the moving sleeve, the annular panel and the rotating sleeve and extends to the bottom of the rotating sleeve, wherein the outer wall of the rotating shaft does not contact the moving sleeve, the annular panel and the inner wall of the rotating sleeve;

[0016] A force-applying rod frame is fixedly installed at the end of the rotating shaft, and a force-receiving rod frame is fixedly installed on the inner wall of the rotating sleeve. The force-applying rod frame is located below the force-receiving rod frame and on the descending trajectory of the force-receiving rod frame. A steel cable A is wound on the outer wall of the rotating sleeve, and the steel cable A is connected to the moving part.

[0017] Preferably, a fixed sleeve is fixedly installed at one end of the support frame, and a rope winding mechanism rotatably connected to the inner wall of the fixed sleeve is installed inside the fixed sleeve, and the rope winding mechanism and the moving part are connected by a steel cable B, wherein a leaf spring is sleeved on the rope winding mechanism.

[0018] Preferably, the moving part includes a moving slider installed inside the supporting frame, wherein sliding grooves are provided on both sides of the supporting frame, and both sides of the moving slider penetrate the sliding grooves and extend to the outside, and the moving slider slides in a limited position under the action of the sliding grooves;

[0019] Limiting frames are fixedly installed on both sides of the movable slider, and a supporting slider slidably connected to the inner wall of the limiting frame is installed inside the limiting frame, a return spring is connected between the supporting slider and the bottom of the limiting frame, and a vertical sliding groove is opened on the limiting frame, and a retractable column is fixedly installed on the supporting slider, and the retractable column slides in a limited position in the vertical sliding groove.

[0020] Preferably, limiting grooves are provided on the outer walls on both sides of the support frame, and the limiting grooves are in the shape of an inverted isosceles trapezoid, and the limiting grooves include an inclined downward area, a straight area connected to the inclined downward area, an inclined upward area connected to the straight area, and a return area for connecting the inclined upward area and the inclined downward area; wherein limiting plate frames are fixedly installed at the intersection of the inclined upward area and the return area, and at the intersection of the return area and the inclined downward area, the retractable column slides in a limited position in the limiting grooves, wherein the limiting plate frame is used to limit the movement trajectory of the retractable column.

[0021] Preferably, a connecting sleeve is fixedly mounted on the supporting slider, and a connecting shaft body rotatably connected to its inner wall is mounted inside the connecting sleeve, a cleaning roller is arranged below the connecting shaft body, the cleaning roller and the scraper are fixedly connected to the connecting shaft body through the supporting shaft body, and there is an angle difference between the cleaning roller and the scraper.

[0022] Preferably, an electric magnetic group is fixedly installed inside the connecting sleeve, and a movable shaft body is installed inside the connecting shaft body in a sliding connection with its inner wall, wherein a rolling ball is fixedly installed on the outer wall of the movable shaft body, and an arc-shaped groove body for limiting the movement of the rolling ball is provided on the inner wall of the connecting sleeve, and a spring body is connected between the movable shaft body and the inner wall of the connecting shaft body, the end of the movable shaft body close to the electric magnetic group is a magnetic end, and when the electric magnetic group is energized, a repulsive force is generated on the magnetic end of the movable shaft body.

[0023] Preferably, a sensing element is installed at the end of the inclined upward area, and the sensing element is located on the movement track of the telescopic column, wherein the sensing element is electrically connected to the electrical magnetic group.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The present invention utilizes a scraper and a tube body thereon to apply thermal conductive silicone oil to the surface of a base. First, the thermal conductive silicone oil is transported to the surface of the base through the tube body, and the silicone oil on the surface of the base is scraped flat under the action of the scraper, thereby avoiding the situation where too much or too little thermal conductive silicone oil is applied. Under the action of a servo motor and a rotating shaft, a spiral groove body, an annular groove body and a guide plate frame are utilized to adjust the movable sleeve in a directional position, thereby enabling the supporting frame to drive the movable part to perform corresponding position adjustment through the annular panel, so that the scraper is close to the surface of the base, so as to facilitate the application of thermal conductive silicone oil to the surface of the base.

[0026] The present invention utilizes a cleaning roller to clean dust on the surface of the base to prevent the dust from affecting the thermal conductivity of the thermal silicone oil. At the same time, under the action of the rotating sleeve and the rope winding mechanism, the steel cable A and the steel cable B drive the moving part to adjust its position within the support frame, so that the cleaning roller can effectively clean the surface of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the structure of the present invention;

[0029] Figure 3 It is a schematic diagram of the base and the mobile frame structure of the present invention;

[0030] Figure 4 It is a schematic diagram of the local structure of the mobile frame of the present invention;

[0031] Figure 5 This is a schematic diagram of the separation of the supporting sleeve, the moving sleeve and the rotating shaft structure of the present invention;

[0032] Figure 6 This is a schematic diagram of the internal structure of the annular panel of the present invention;

[0033] Figure 7 This is a schematic diagram of the internal structure of the rotating sleeve of the present invention;

[0034] Figure 8 This is a schematic diagram of the internal structure of the support frame, annular panel and fixed sleeve of the present invention;

[0035] Fig. 9 This is a schematic diagram of the movable slider and the limit frame structure of the present invention;

[0036] Fig.10 It is a schematic diagram of the structure of the limiting groove body of the present invention;

[0037] Fig.11 This is a schematic diagram of the cleaning roller, scraper and connecting shaft structure of the present invention;

[0038] Fig.12 This is a schematic diagram of the internal structure of the connecting sleeve of the present invention;

[0039] Fig.13 It is a schematic diagram of the structure of the connecting sleeve of the present invention;

[0040] Fig.14 This is a schematic diagram of the front structure of the connecting shaft and the moving shaft of the present invention;

[0041] Fig.15 This is a schematic diagram of the cleaning roller and scraper structure of the present invention;

[0042] Fig.16 This is a schematic diagram of applying thermal conductive silicone oil to the substrate of the present invention.

[0043] In the figure: 1-frame; 2-sealed chamber; 21-cylinder; 3-base; 4-automatic sealing door panel; 5-movable frame; 51-support sleeve; 52-movable sleeve; 521-retractable ball; 53-annular panel; 54-support frame; 541-sliding groove; 55-constant force spring; 56-fixed sleeve; 561-winding mechanism; 562-steel cable B; 563-leaf spring; 57-limiting groove; 571-inclined downward area; 572-straight area; 573-inclined upward area; 574-return area; 575-limiting plate frame; 576-sensing element; 6-guide rail; 7-moving part; 71-moving slider ;72-limiting frame;721-vertical slide;73-supporting slider;731-retractable column;74-reset spring;75-connecting sleeve;751-electric magnetic group;752-arc groove;76-connecting shaft;761-moving shaft;762-rolling ball;763-spring body;77-cleaning roller;78-supporting shaft;8-scraper;81-tube;9-lifting mechanism;91-servo motor;92-rotating shaft;921-force rod frame;93-threaded groove;94-annular groove;95-guide plate frame;10-power mechanism;101-rotating sleeve;102-force rod frame;103-steel cable A. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] See also Figure 1-Figure 16The present invention provides a technical solution: a wafer dry etching device for semiconductor production, the present invention makes corresponding improvements to the technical problems in the background technology, including a frame 1, a sealed chamber 2 fixedly installed on the frame 1, wherein a base 3 is fixedly installed inside the frame 1, and a sealing chamber 2 is fixedly installed inside the frame 1. Figure 2 As shown, the communication state between the sealed chamber 2 and the inside of the frame 1 is controlled by the automatic sealing door plate 4. It should be noted that the automatic sealing door plate 4 is composed of a plate body and an electric push rod (not shown in the figure). Since the automatic sealing door plate 4 is a prior art component, the present invention does not describe it too much. A movable frame 5 is provided inside the sealed chamber 2, and guide rails 6 are fixedly installed inside the sealed chamber 2 and the frame 1, and the ends of the guide rails 6 are in contact with both sides of the automatic sealing door plate 4 (as shown in the attached figure). Figure 2 As shown), and the opening and closing of the automatic sealing door panel 4 will not affect the fixed state of the guide rail 6. In order to reduce friction, a pulley can be installed at the contact point between the guide rail 6 and the automatic sealing door panel 4, and the movable frame 5 slides within the guide rail 6 within a limited position, wherein a cylinder 21 is fixedly installed on the outer wall of the sealing chamber 2, and the output end of the cylinder 21 is fixedly connected to the movable frame 5, and then under the action of the cylinder 21, the movable frame 5 can be adjusted in position within the guide rail 6, wherein a supporting sleeve 51 is fixedly installed at the bottom of the movable frame 5, and a movable sleeve 52 slidably connected to its inner wall is installed inside the supporting sleeve 51, and an annular panel 53 is fixedly installed at one end of the movable sleeve 52, and a supporting frame 54 is fixedly installed on the outer wall of the annular panel 53, and further Step description, one end of the support frame 54 away from the annular panel 53 can be fixedly connected to the movable frame 5 by installing a telescopic shaft, wherein a movable part 7 is arranged inside the support frame 54, and a scraper 8 is installed on the movable part 7, and a plurality of tubes 81 for outputting thermal conductive silicone oil are fixedly installed on the scraper 8, wherein a cleaning roller 77 is also installed on the movable part 7, and there is an angle difference between the cleaning roller 77 and the scraper 8, so that only one of the cleaning roller 77 and the scraper 8 can contact the surface of the base 3. For example, when the cleaning roller 77 contacts the surface of the base 3, due to the angle difference between the scraper 8 and the cleaning roller 77, the scraper 8 does not contact the surface of the base 3, and correspondingly, when the scraper 8 contacts the surface of the base 3, the cleaning roller 77 does not contact the surface of the base 3;

[0046] As a further limitation of the present invention, Figure 8-Figure 9As shown, the moving part 7 includes a moving slider 71 installed inside the supporting frame 54, wherein sliding grooves 541 are arranged on both sides of the supporting frame 54, and both sides of the moving slider 71 penetrate the sliding grooves 541 and extend to the outside, and the moving slider 71 slides in a limited position under the action of the sliding grooves 541; both sides of the moving slider 71 are fixedly installed with a limiting frame 72, and a supporting slider 73 slidably connected to the inner wall of the limiting frame 72 is installed inside the limiting frame 72, a return spring 74 is connected between the supporting slider 73 and the bottom of the limiting frame 72, and a vertical sliding groove 721 is opened on the limiting frame 72, and a retractable column 731 is fixedly installed on the supporting slider 73, and the retractable column 731 slides in a limited position in the vertical sliding groove 721;

[0047] The outer walls of the two sides of the support frame 54 are provided with limited slots 57. Fig.10 As shown, the limiting groove body 57 is in the shape of an inverted isosceles trapezoid, and the limiting groove body 57 includes an inclined downward area 571, a straight area 572 connected to the inclined downward area 571, an inclined upward area 573 connected to the straight area 572, and a return area 574 for connecting the inclined upward area 573 and the inclined downward area 571; wherein the intersection of the inclined upward area 573 and the return area 574 and the intersection of the return area 574 and the inclined downward area 571 are fixedly installed with a limiting plate frame 575, and the retractable column 731 is fixed at the limit The limit plate frame 575 is used to limit the movement trajectory of the telescopic column 731. One side of the limit plate frame 575 is an inclined surface, and the other side is a right-angle surface. The first limit plate frame 575 (i.e., the intersection of the inclined upward area 573 and the return area 574): the side located in the inclined upward area 573 is an inclined surface, and the side close to the return area 574 is a right-angle surface; the second limit plate frame 575: the side of the return area 574 is an inclined surface, and the side close to the inclined downward area 571 is a right-angle surface.

[0048] Combined with Fig.11 As shown, a connecting sleeve 75 is fixedly installed on the supporting slider 73, and a connecting shaft 76 is installed inside the connecting sleeve 75 to be rotatably connected to its inner wall. The above-mentioned scraper 8 and cleaning roller 77 are fixedly connected to the connecting shaft 76 through the supporting shaft 78. Fig.15As shown, the diagram shows the state when the cleaning roller 77 contacts the surface of the base 3 and the scraper 8 contacts the surface of the base 3, wherein an electric magnetic group 751 is fixedly installed inside the connecting sleeve 75, and a moving shaft 761 slidably connected to the inner wall of the connecting shaft 76 is installed inside the connecting shaft 76, wherein a rolling ball 762 is fixedly installed on the outer wall of the moving shaft 761, and an arc groove 752 for limiting the movement of the rolling ball 762 is provided on the inner wall of the connecting sleeve 75, and a spring body 763 is connected between the moving shaft 761 and the inner wall of the connecting shaft 76, and the end of the moving shaft 761 close to the electric magnetic group 751 is a magnetic end, and the electric magnetic group 751 is energized to generate a repulsive force on the magnetic end of the moving shaft 761, and a sensing element 576 is installed at the end of the inclined upward area 573, and the sensing element 576 is located on the movement trajectory of the retractable column 731, wherein the sensing element 576 is electrically connected to the electric magnetic group 751;

[0049] Continuing from the above, in the initial state, the retractable column 731 is located at the initial end of the inclined downward area 571 (i.e., the intersection with the return area 574), and at this time, the cleaning roller 77 is located directly above the base 3, and then when the movable slider 71 is adjusted in position in the support frame 54, the limit frames 72 on both sides of the movable slider 71 will drive the support slider 73 to adjust the directional position, that is, the retractable column 731 on the support slider 73 will move along the trajectory of the inclined downward area 571, and move to the straight area 572, and then pass through the inclined upward area 573, and cross the inclined surface of the limit plate frame 575 to enter the return area 574. When entering the return area 574, the retractable column 731 will press the sensing element 576 in the return area 574, so that the sensing element 576 controls the electric magnetic group 751 to be energized, and when the retractable column 731 touches the sensing element 576 again, the electric magnetic group 751 will stop being energized;

[0050] The movable frame 5 is provided with a lifting mechanism 9, and the lifting mechanism 9 is used to control the movable sleeve 52 to perform lifting movement; and a power mechanism 10 is provided inside the annular panel 53, and the power mechanism 10 is used to control the movable part 7 to perform lateral position adjustment. As a further limitation of the present invention, in combination with the attached Figure 4-Figure 5As shown, the lifting mechanism 9 includes a servo motor 91 fixedly mounted on the top of the moving frame 5, and the output end of the servo motor 91 passes through the inner wall of the moving frame 5 and extends to the inside of the moving sleeve 52, and a rotating shaft 92 is fixedly mounted on the output end of the servo motor 91, and a threaded groove 93 and an annular groove 94 are provided on the outer wall of the rotating shaft 92, and the annular groove 94 is in a connected state with one end of the threaded groove 93, and a guide plate frame 95 is fixedly mounted at the intersection of the threaded groove 93 and the annular groove 94, and one side of the guide plate frame 95 is an inclined surface and the other side is a right-angle surface, the side located in the annular groove 94 is an inclined surface, and the side located at the intersection of the threaded groove 93 and the annular groove 94 is a right-angle surface, and the guide plate frame 95 is fixedly mounted at the intersection of the threaded groove 93 and the annular groove 94. A retractable ball 521 is fixedly installed on the inner wall of the cylinder 52, and the retractable ball 521 slides within the threaded groove 93 and the annular groove 94, wherein a plurality of constant force springs 55 are connected between the bottom of the support sleeve 51 and the top of the annular panel 53; then the servo motor 91 is started, and its output end drives the rotating shaft 92 to rotate, and during the rotation of the rotating shaft 92, the threaded groove 93 on its outer wall acts on the retractable ball 521 on the inner wall of the movable sleeve 52, so that the movable sleeve 52 performs a directional downward movement inside the support sleeve 51 under the action of the retractable shaft, thereby causing the movable sleeve 52 to drive the annular panel 53, the support frame 54 and the components therein to perform a synchronous downward movement;

[0051] As a further limitation of the present invention, Figure 6-Figure 8 As shown, the power mechanism 10 includes a rotating sleeve 101 disposed inside the annular panel 53, and the rotating sleeve 101 is rotatably connected to the inner wall of the annular panel 53, and the end of the rotating shaft body 92 sequentially passes through the movable sleeve 52, the annular panel 53 and the rotating sleeve 101 and extends to the bottom of the rotating sleeve 101, wherein the outer wall of the rotating shaft body 92 does not contact the inner walls of the movable sleeve 52, the annular panel 53 and the rotating sleeve 101; a force rod frame 921 is fixedly installed at the end of the rotating shaft body 92, and a force rod frame 921 is fixedly installed on the inner wall of the rotating sleeve 101 The force-bearing rod frame 102 and the force-applying rod frame 921 are located below the force-bearing rod frame 102 and on the descending trajectory of the force-bearing rod frame 102, wherein the outer wall of the rotating sleeve 101 is wound with a steel cable A103, and the steel cable A103 is connected to the moving part 7; and a fixed sleeve 56 is fixedly installed at one end of the support frame 54, and a rope winding mechanism 561 rotatably connected to the inner wall of the fixed sleeve 56 is installed inside the fixed sleeve 56, and the rope winding mechanism 561 is connected to the moving part 7 by a steel cable B562, wherein a leaf spring 563 is sleeved on the rope winding mechanism 561.

[0052] When etching a small-sized wafer, it is necessary to apply thermal silicone oil on the base 3. In order to avoid the situation where the thermal silicone oil is applied too much or too little on the base 3 due to artificial application of the thermal silicone oil, the present invention uses a pipeline to output the thermal silicone oil and uses a scraper 8 to apply the thermal silicone oil. Since impurities and particulate matter in the dust may chemically react with the thermal silicone oil, causing the performance of the thermal silicone oil to decrease or even deteriorate, before applying the thermal silicone oil, the present invention uses a cleaning roller 77 to clean the surface of the base 3 to avoid dust adhering to the base 3.

[0053] Step a: First, the cylinder 21 is started, and its output end acts on the movable frame 5 to move its position on the guide slide rail 6 and move it to the top of the base 3. Then, the servo motor 91 is started to make the servo motor 91 rotate forward, and then the output end of the servo motor 91 drives the rotating shaft 92 to rotate. During the rotation of the rotating shaft 92, the threaded groove 93 thereon acts on the retractable ball 521, so that under the action of the retractable ball 521, the movable sleeve 52 is directed downward inside the supporting sleeve 51, and then the annular panel 53, the supporting frame 54, the supporting slider 73 at the bottom of the movable sleeve 52, and the cleaning roller 77 and the scraper 8 connected by the above components are synchronously descended, so as to achieve a wide range of position adjustment of the cleaning roller 77 and the scraper 8 to adapt to bases 3 at different heights. It should be noted that the force-applying rod frame 921 is located on the descending trajectory of the force-bearing rod frame 102. When the retractable ball 521 descends, When it drops to the end of the threaded groove 93, that is, when it intersects with the annular groove 94, the force-bearing rod frame 102 is located on the rotation trajectory of the force-applying rod frame 921. When the retractable ball 521 drops into the annular groove 94, when the rotating shaft 92 rotates, the retractable ball 521 will not drop, and when the servo motor 91 rotates forward, the retractable ball 521 will pass through the inclined surface of the guide plate frame 95, and will not be guided by the guide plate frame 95, and the rotating shaft 92 will rotate. 92 rotates in this state, and the force-applying rod frame 921 thereon applies a force to the force-receiving rod frame 102 during the rotation process, so that the rotating sleeve 101 rotates, and the steel cable A103 on the rotating sleeve 101 pulls the moving slider 71 to slide in a directional manner in the support frame 54. At the same time, the moving slider 71 pulls the steel cable B562 during the movement process, so that the rope winding mechanism 561 rotates in the fixed sleeve 56, and the leaf spring 563 is in a deformed state;

[0054] When the movable slider 71 is in motion, the limit frames 72 on both sides thereof will move synchronously therewith, and then the retractable column 731 on the supporting slider 73 will move from the initial end to the end of the inclined downward area 571, and then the supporting slider 73 will descend in the limit frame 72 and compress the return spring 74. When the supporting slider 73 descends to the lowest point (that is, the retractable column 731 moves to the straight area 572), the connecting sleeve 75 on the supporting slider 73 will drive the connecting shaft 76 to synchronously descend to the lowest point, and then the cleaning roller 77 on the connecting shaft 76 will contact the surface of the base 3. When the movable slider 71 moves in the supporting frame 54, the cleaning roller 77 cleans the dust on the surface of the base 3. When the retractable column 731 moves to the inclined upward area 573, the cleaning roller 77 is separated from the surface of the base 3 and attached. Fig.16 As shown, this diagram refers to: the cleaning range of the surface of the base 3 and the application range of the thermal conductive silicone oil before etching the small-sized wafer;

[0055] Step b: When the retractable column 731 enters the inclined upward area 573 and moves along its trajectory through the inclined surface of the limiting plate frame 575 to the initial end of the return area 574, the retractable shaft will touch the sensing element 576, and the sensing element 576 controls the electric magnetic group 751 to be energized through an electrical signal. The electric magnetic group 751 is energized to generate a repulsive force on the magnetic end of the moving shaft 761 (the spring body 763 is in a compressed state), and the moving shaft 761 slides within the connecting shaft 76, and then the rolling ball 762 on the moving shaft 761 moves along the trajectory of the arc groove 752, so that the moving shaft 761 drives the connecting shaft 76 to rotate, so that the connecting shaft 76 drives the cleaning roller 77 and the scraper 8 to adjust the angle through the supporting shaft 78, so that the scraper 8 contacts the surface of the base 3 when it drops to the lowest point;

[0056] In this state, the servo motor 91 reverses to make the rotating shaft 92 rotate in the opposite direction, and the retractable column 731 will be close to the right-angled surface of the guide plate frame 95. At the same time, since the force-applying rod frame 921 moves in the opposite direction with the rotating shaft 92, no force will be applied to the force-bearing rod frame 102. The rope winding mechanism 561, under the action of the leaf spring 563, makes the steel cable B562 pull the movable slider 71 to move in the opposite direction in the support frame 54, and then the retractable column 731 on the supporting slider 73 will move along the trajectory of the return area 574, and finally move to the initial end of the inclined downward area 571. During this process, the retractable column 731 will pass through the inclined surface of the limiting plate frame 575. When the retractable column 731 returns to the initial position; at this time, the servo motor 91 is controlled to rotate forward and the above action is repeated. When the scraper 8 contacts the base 3, the tube 81 on its surface will output heat conduction Silicone oil, so that the thermal conductive silicone oil is applied to the surface of the base 3, and then the scraper 8 flattens the thermal conductive silicone oil, so as to avoid the situation where the thermal conductive silicone oil is applied too much or too little. When the retractable column 731 touches the sensing element 576 again, the electric magnetic group 751 is powered off, and under the action of the spring mechanism, the cleaning roller 77 and the scraper 8 return to the initial angle, and then the servo motor 91 reverses, so that the cleaning roller 77 and the scraper 8 return to the initial position, and the movable sleeve 52 and the connected mechanical parts return to the initial position, and then the cylinder 21 drives the movable frame 5 back to the sealed chamber 2, and the automatic sealing door panel 4 is closed. The robot in the prior art places the small-sized wafer on the surface of the base 3 for etching, and then through the structural design of the present invention, the thermal conductive silicone oil on the surface of the base 3 is evenly applied, avoiding the situation where the thermal conductive silicone oil is applied too much or too little, so as to improve the etching quality of small-sized wafers.

[0057] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer dry etching device for semiconductor production, characterized in that: The invention comprises a frame (1), a sealed chamber (2) fixedly mounted on the frame (1), wherein a base (3) is fixedly mounted inside the frame (1), and the communication state between the sealed chamber (2) and the inside of the frame (1) is controlled by an automatic sealing door panel (4), and further comprises: The movable frame (5) is arranged inside the sealed chamber (2), and guide rails (6) are fixedly installed inside the sealed chamber (2) and the frame (1), and the ends of the guide rails (6) are in contact with the two sides of the automatic sealing door panel (4), and the movable frame (5) slides within the guide rails (6) within a limited position: wherein a support sleeve (51) is fixedly installed at the bottom of the movable frame (5), and a movable sleeve (52) slidably connected to the inner wall of the support sleeve (51) is installed inside the support sleeve (51), and an annular panel (53) is fixedly installed at one end of the movable sleeve (52), and a support frame (54) is fixedly installed on the outer wall of the annular panel (53), wherein a movable part (7) is arranged inside the support frame (54), and a scraper (8) is installed on the movable part (7), and a plurality of pipe bodies (81) for outputting heat-conducting silicone oil are fixedly installed on the scraper (8), wherein a cylinder (21) is fixedly installed on the outer wall of the sealed chamber (2), and the output end of the cylinder (21) is fixedly connected to the movable frame (5); A lifting mechanism (9) is arranged on the movable frame (5) and is used to control the movable sleeve (52) to perform lifting movement, so that under the action of the annular panel (53) and the supporting frame (54), the movable part (7) drives the scraper (8) to adjust its height; The power mechanism (10) is arranged inside the annular panel (53) and is used to control the lateral position adjustment of the moving part (7) so as to facilitate the scraper (8) to apply thermal conductive silicone oil to the surface of the base (3); the lifting mechanism (9) comprises a servo motor (91), a rotating shaft (92), a threaded groove (93), an annular groove (94) and a guide plate frame (95); the servo motor (91) is fixedly mounted on the top of the moving frame (5), and the output end thereof passes through the inner wall of the moving frame (5) and extends to the inside of the moving sleeve (52); the rotating shaft (92), The guide plate frame (95) is fixedly connected to the output end of the servo motor (91); the threaded groove body (93) and the annular groove body (94) are both arranged on the outer wall of the rotating shaft body (92), and the annular groove body (94) and one end of the threaded groove body (93) are in a communicating state; the guide plate frame (95) is fixedly installed at the intersection of the threaded groove body (93) and the annular groove body (94), one side of the guide plate frame (95) is an inclined surface, and the other side is a right-angled surface, the side located inside the annular groove body (94) is the inclined surface, and the side located at the intersection of the threaded groove body (93) and the annular groove body (94) is the right-angled surface.

2. The wafer dry etching device for semiconductor production according to claim 1, characterized in that: A retractable sphere (521) is fixedly mounted on the inner wall of the movable sleeve (52), and the retractable sphere (521) slides within the threaded groove (93) and the annular groove (94) in a limited manner, wherein a plurality of constant force springs (55) are connected between the bottom of the supporting sleeve (51) and the top of the annular panel (53).

3. The wafer dry etching device for semiconductor production according to claim 2, characterized in that: The power mechanism (10) comprises a rotating sleeve (101) arranged inside the annular panel (53), and the rotating sleeve (101) is rotatably connected to the inner wall of the annular panel (53), and the end of the rotating shaft body (92) sequentially penetrates the movable sleeve (52), the annular panel (53) and the rotating sleeve (101) and extends to the bottom of the rotating sleeve (101), wherein the outer wall of the rotating shaft body (92) does not contact the movable sleeve (52), the annular panel (53) and the inner wall of the rotating sleeve (101); A force-applying rod frame (921) is fixedly mounted on the end of the rotating shaft (92), and a force-bearing rod frame (102) is fixedly mounted on the inner wall of the rotating sleeve (101), and the force-applying rod frame (921) is located below the force-bearing rod frame (102) and on the descending trajectory of the force-bearing rod frame (102), wherein a steel cable A (103) is wound on the outer wall of the rotating sleeve (101), and the steel cable A (103) is connected to the moving part (7).

4. The wafer dry etching device for semiconductor production according to claim 3, characterized in that: A fixed sleeve (56) is fixedly mounted on one end of the support frame (54), and a rope winding mechanism (561) rotatably connected to an inner wall of the fixed sleeve (56) is mounted inside the fixed sleeve (56), and the rope winding mechanism (561) is connected to the moving part (7) via a steel cable B (562), wherein a leaf spring (563) is sleeved on the rope winding mechanism (561).

5. The wafer dry etching device for semiconductor production according to claim 1, characterized in that: The moving part (7) comprises a moving slider (71) installed inside the supporting frame (54), wherein sliding grooves (541) are arranged on both sides of the supporting frame (54), and both sides of the moving slider (71) penetrate the sliding grooves (541) and extend to the outside, and the moving slider (71) slides in a limited position under the action of the sliding grooves (541); A limit frame (72) is fixedly installed on both sides of the movable slider (71), and a support slider (73) is installed inside the limit frame (72) and is slidably connected to the inner wall thereof. A return spring (74) is connected between the support slider (73) and the bottom of the limit frame (72), and a vertical slide groove (721) is provided on the limit frame (72), and a retractable column (731) is fixedly installed on the support slider (73), and the retractable column (731) slides in a limited position in the vertical slide groove (721).

6. The wafer dry etching device for semiconductor production according to claim 5, characterized in that: The outer walls of both sides of the support frame (54) are provided with limiting grooves (57), and the limiting grooves (57) are in the shape of an inverted isosceles trapezoid. The limiting grooves (57) include an inclined downward area (571), a straight area (572) connected to the inclined downward area (571), an inclined upward area (573) connected to the straight area (572), and a return area (574) used to connect the inclined upward area (573) and the inclined downward area (571); wherein the intersection of the inclined upward area (573) and the return area (574) and the intersection of the return area (574) and the inclined downward area (571) are fixedly mounted with limiting plate frames (575), and the retractable column (731) is limitedly slidable in the limiting grooves (57), wherein the limiting plate frames (575) are used to limit the movement trajectory of the retractable column (731).

7. The wafer dry etching device for semiconductor production according to claim 6, characterized in that: A connecting sleeve (75) is fixedly mounted on the supporting slider (73), and a connecting shaft (76) is mounted inside the connecting sleeve (75) and is rotatably connected to the inner wall thereof. A cleaning roller (77) is arranged below the connecting shaft (76), and the cleaning roller (77) and the scraper (8) are both fixedly connected to the connecting shaft (76) via the supporting shaft (78), and an angle difference exists between the cleaning roller (77) and the scraper (8).

8. The wafer dry etching device for semiconductor production according to claim 7, characterized in that: An electric magnetic group (751) is fixedly installed inside the connecting sleeve (75), and a movable shaft (761) is installed inside the connecting shaft (76) and is slidably connected to the inner wall thereof, wherein a rolling ball (762) is fixedly installed on the outer wall of the movable shaft (761), and an arc-shaped groove (752) for limiting the movement of the rolling ball (762) is provided on the inner wall of the connecting sleeve (75), and a spring body (763) is connected between the movable shaft (761) and the inner wall of the connecting shaft (76), and one end of the movable shaft (761) close to the electric magnetic group (751) is a magnetic end, and when the electric magnetic group (751) is energized, a repulsive force is generated on the magnetic end of the movable shaft (761).

9. The wafer dry etching device for semiconductor production according to claim 8, characterized in that: A sensing element (576) is installed at the end of the inclined upward area (573), and the sensing element (576) is located on the movement track of the retractable column (731), wherein the sensing element (576) is electrically connected to the electrical magnetic group (751).

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