Wafer electroplating process metal parts sealing equipment and sealing method

Abstract

The present invention relates to the field of integrated circuits and discloses a wafer electroplating process metal parts sealing device and a sealing method. The wafer electroplating process metal parts sealing device is used for wafer electroplating process metal parts curing glue sealing, including: an upper mold is used for pressing materials, and a convex portion corresponding to a material injection slot is formed on the lower end surface; a middle upper mold and a middle lower mold jointly form a metal part curing glue coating cavity, and a material injection slot is formed on the upper end surface of the middle upper mold; a plurality of first through holes are evenly distributed in the material injection slot; a plurality of second through holes are formed in the middle lower mold, and each second through hole corresponds to the position of a metal column on the front of the metal part; a plurality of through parts are formed on the middle lower mold for retractable connectors to pass through; the lower mold is formed to receive a template; a plurality of elastic parts are evenly arranged between the lower mold and the middle lower mold; and a plurality of retractable connectors are arranged in the third through hole of the lower mold. The present invention does not require a separate production of a blank jig, nor does it require pre-production of blanks, and can reduce production process steps and improve production efficiency compared to the prior art.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuits, and in particular to a metal part sealing device and a sealing method for a wafer electroplating process. Background Art

[0002] Electroplating process technology, also known as ECP process, is very important in the integrated circuit manufacturing process. ECP uses the principle of electrolysis to convert metal ions into metal atoms and deposits a thin metal layer on the surface of the wafer. Its advantage is that it can form a very high surface flatness, reduce wafer defects and contamination, thereby improving the conductivity and signal transmission efficiency of the wafer. In the electroplating process of integrated circuit manufacturing, metal-coated seals play a vital role. These seals are usually used to protect the non-electroplated surface of the wafer in the electroplating tank, ensure the smooth progress of the electroplating process, and prevent the electroplating solution from damaging other parts of the wafer. However, the conductive and sealed integrated metal-coated seals currently used have complex structures and high precision, resulting in problems such as difficulty in manufacturing, complex processes, and low yields.

[0003] The existing metal rubber seal production mold structure is a three-layer template: upper mold, middle mold, and lower mold. The upper mold corresponds to the back of the metal part without protrusions, the middle mold corresponds to the front of the metal part with protrusions, and the middle mold corresponds to the metal column position of the metal part. Through holes are made on the middle mold corresponding to the protruding metal column of the metal part. The diameter of the through hole is slightly larger than the outer diameter of the metal claw foot by 0.5 to 3mm. The lower mold is used to fix the middle mold. The metal parts are pre-processed and manufactured. During pre-processing, the outer diameter of the metal column of the metal part is slightly larger than the normal size by 0.5 to 3mm and consistent with the inner diameter of the mold hole. After the product is formed, it is processed to the normal size by secondary processing. Rubber rubber is pre-made into blanks, and two types of blanks are required. One blank corresponds to the surface of the metal part with a metal column. The overall shape and size are consistent with the metal part. Holes need to be made at the corresponding metal column position. The hole size is consistent with the size of the mold cavity. The thickness of the blank is 0.5 to 2mm thicker than the thickness of the rubber coating required for the metal part. The other blank corresponds to the back of the metal part, and its overall size is consistent with that of the metal part. Its thickness is 0.5 to 2 mm thicker than the thickness of the rubber coating required for the metal part. Both blanks need to be processed with tooling.

[0004] The existing manufacturing process of metal rubber-coated seals includes: 1. Pre-processing of metal parts and enlarging the size of metal column claws; 2. Pre-processing of two types of rubber blanks, the details of the two types of blanks are as mentioned above; 3. Rubber-coating molding. First, the molding process needs to be set at a low temperature for a long time (for example: 150℃×1200 seconds). Place the blank with holes on the middle mold, and then place the metal parts. The metal columns of the metal parts correspond to the holes in the middle mold, and a rubber hammer is needed to knock the metal parts completely into the middle mold cavity, and finally place another blank; 4. The upper mold is closed and vulcanized. After the product is formed, the mold needs to be cooled before the product can be removed. After the product is removed, the mold must be reheated to the required temperature before production can begin; 5. Baking; 6. Trimming; 7. Secondary metal part processing, processing the metal column claws into the required shape and size; 8. Coating; 9. Sintering. The structure of the metal rubber-coated seal is as follows: Figure 1 As shown, the main body of the metal part is formed into an annular disc-shaped body, and a plurality of metal columns are formed on the front side of the metal part. The main body of the metal part is sealed with glue, and only the metal columns are exposed.

[0005] The existing production of metal-coated seals has technical problems such as many process steps, complex operations, low efficiency and high costs. Summary of the invention

[0006] A series of simplified concepts are introduced in the Summary of the Invention, which are all simplifications of the prior art in the field, and will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention of the present invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0007] The technical problem to be solved by the present invention is to provide a wafer electroplating process metal parts sealing device which does not require a separate blank jig to be made to pre-make blanks, and can reduce production process steps and improve production efficiency compared to the prior art. And, the sealing method of the wafer electroplating process metal parts sealing device.

[0008] In order to solve the above technical problems, the present invention provides a wafer electroplating process metal parts sealing device, which is used for curing and sealing the wafer electroplating process metal parts, and comprises: an upper mold, a middle upper mold, a middle lower mold and a lower mold arranged in sequence from top to bottom;

[0009] The upper mold is used for pressing the material, and a convex portion corresponding to the injection groove is formed on the lower end surface of the upper mold, and the convex portion is used to press down the original rubber material in the injection groove;

[0010] The middle upper mold, which together with the middle and lower molds forms a cavity for curing and coating the metal part, has an injection groove formed on its upper end surface, and its lower end surface is correspondingly formed in the shape of the back of the metal part; illustratively, the back of the metal part is usually in the shape of an annular plane;

[0011] A plurality of first through holes are evenly distributed in the injection slot, forming injection holes;

[0012] The middle and lower molds have their upper end surfaces formed correspondingly to the front shape of the metal part, that is, the surface of the annular disc-shaped body formed with the metal column;

[0013] A plurality of second through holes are formed in the middle and lower molds, each of the second through holes corresponds to a position of a metal column on the front side of the metal piece, and is used for the metal column on the front side of the metal piece to pass through;

[0014] A plurality of through-portions are formed on the middle and lower molds, and are used for the telescopic connector to pass through; the shape of the through-portions is not limited, and can be a through hole or a through groove, in short, as long as the telescopic connector can pass through;

[0015] A lower mold is formed to receive the template and receive the upper mold, the middle upper mold and the middle lower mold;

[0016] A plurality of elastic members are evenly arranged between the lower die and the middle lower die, and the height of the elastic members in a natural state is greater than the maximum distance between the lower die and the middle lower die, and the elastic members are preferably springs;

[0017] A plurality of retractable connecting members are arranged in the third through hole of the lower mold, and can extend from the third through hole, pass through the middle and lower molds, and then form a connection with the edge of the metal piece to pull the metal piece into the middle and lower molds;

[0018] A plurality of third through holes are evenly distributed on the lower mold.

[0019] There is no restriction on whether the retractable connector is connected to the inner edge or the outer edge of the metal component, as long as the metal component can be evenly stressed and the upward movement of the metal component can be restricted.

[0020] Correspondingly, the shape of the third through hole is not limited. For example, the third through hole and the telescopic connector form a one-to-one correspondence, that is, one third through hole is for one telescopic connector to pass through; the third through hole can also be formed as an arc-shaped slot, and one slot is for two or even more telescopic connectors to pass through.

[0021] Preferably, the wafer electroplating process metal part sealing device is further improved, and the injection groove is formed as an annular groove, and the width of its cross section is greater than or equal to the width of the metal part annular structure.

[0022] The shape of the injection groove is not limited as long as it can accommodate the raw rubber material; the purpose of preferably forming it into an annular groove is to avoid the waste of raw rubber material and achieve accurate feeding; preferably, the width of the annular groove is slightly larger than the width of the metal part and covers the metal part in the vertical direction, which can avoid the waste of raw rubber material and is beneficial to energy saving and environmental protection. Assuming that the injection groove is directly made into a circular concave part, the center of the circular concave part will easily waste the raw rubber material when pressing the material.

[0023] Preferably, the wafer electroplating process metal parts sealing equipment is further improved, and the width of the cross section of the injection slot is 1.5 to 3 times, preferably 1.5 times, 2 times, 2.5 times or 3 times the width of the metal parts annular structure.

[0024] Preferably, the wafer electroplating process metal part sealing equipment is further improved, the metal part is installed in place in the middle and lower molds, and in the vertical direction, the geometric center of the injection slot and the geometric center of the metal part are collinear in the vertical direction.

[0025] Preferably, the wafer electroplating process metal parts sealing equipment is further improved, the volume of the injection slot is greater than or equal to the volume of the original rubber material required to complete the coating sealing, and the required volume of the original rubber material can be obtained by calibration.

[0026] Preferably, the wafer electroplating process metal parts sealing device is further improved, and the first through hole is formed as a conical hole from top to bottom, with the small diameter end at the bottom.

[0027] Preferably, the wafer electroplating process metal parts sealing equipment is further improved, the diameter range of the large diameter end of the tapered hole is 2mm to 4mm, preferably 2mm, 3mm or 4mm, and the diameter range of the small diameter end of the tapered hole is 0.1mm to 0.5mm, preferably 0.1mm, 0.2mm, 0.3mm, 0.4mm or 0.5mm.

[0028] Preferably, the wafer electroplating process metal parts sealing equipment is further improved, and further includes:

[0029] The boss is formed on the upper end surface of the lower mold and is located below the cavity where the metal part is cured and coated with glue, and can form a close contact with the lower end surface of the middle and lower molds; preferably, the geometric center of the boss, the geometric center of the injection slot, and the geometric center of the metal part are collinear in the vertical direction;

[0030] There is no restriction on the position of the elastic member as long as it can provide uniform restoring elastic force. Preferably, the elastic member is uniformly arranged around the boss.

[0031] The blind hole is formed on the edge of the upper end surface of the lower mold, and is used to accommodate the end of the metal column that passes through the middle and lower molds. When the middle and lower molds are in contact with the lower mold, the raw material glue that is pressed in will enter the blind hole. Combined with the calibrated material amount, it can prevent the raw material glue from forming uncontrollable flow everywhere and reduce the workload of subsequent trimming.

[0032] Preferably, the wafer electroplating process metal parts sealing equipment is further improved, and further includes:

[0033] The upper mold and the middle lower mold are connected by a rotating shaft at the first side edge, and the middle upper mold and the lower mold are connected by a rotating shaft at the first side opposite side edge. That is, the upper mold can rotate around the rotating shaft, similar to the way of turning the pages of a book, and the middle upper mold can also rotate around the rotating shaft, similar to the way of turning the pages of a book.

[0034] Preferably, the wafer electroplating process metal parts sealing device is further improved, and the retractable connecting part is a retractable column with a hook at the end, and the hook is used to hang and fix the metal part.

[0035] In order to solve the above technical problems, the present invention provides a wafer electroplating process metal part sealing method, which is implemented by using any of the wafer electroplating process metal part sealing devices described above, and comprises the following steps:

[0036] S1, obtaining a metal part, which is a prefabricated part relative to the present invention, and is used for coating and sealing the metal part with glue to prevent corrosion of the metal part in the electroplating process liquid;

[0037] S2, moving the lower film into the die-casting equipment, lifting and opening the upper die, the middle upper die and the middle lower die;

[0038] S3, installing the metal parts in place in the middle and lower molds;

[0039] S4, lowering the middle and lower molds, so that the middle and lower molds and the lower film are close to the compression elastic member, and at the same time, the retractable connecting member is pushed out through the middle and lower molds to connect and fix the metal member; the elastic member is compressed to generate a restoring elastic force, and the restoring elastic force is located between the middle and lower molds and the lower film, so that the middle and lower molds and the lower film tend to separate; the retractable connecting member is pushed out through the middle and lower molds to connect and fix the metal member, and the retractable connecting member limits the middle and lower molds from moving upwards under the resetting elastic force; therefore, the metal member can be fixed by using the resetting elastic force and the retractable connecting member;

[0040] S5, lowering the middle upper die to make it contact with the middle lower die;

[0041] S6, putting the raw rubber material into the injection tank according to the designed raw rubber material feeding amount;

[0042] S7, the upper mold is pressed downward, and the existing molding process conditions are provided at the same time, and the existing molding process is executed;

[0043] S8, after the forming process is completed, the upper mold and the middle upper mold are opened, the coated metal part is taken out, and the subsequent baking, trimming, coating and sintering processes are performed. The baking, trimming, coating and sintering processes are implemented using existing processes, which are not the key points of improvement of the present invention. Any existing baking, trimming, coating and sintering processes can be applied to the present invention.

[0044] The present invention can at least achieve the following technical effects:

[0045] 1. The present invention designs the injection slot according to the metal parts and calibrates the designed feeding amount of the original rubber material, which can reduce the waste of raw materials to the maximum extent and is more energy-saving and environmentally friendly than the existing technology.

[0046] 2. Because the calibrated feeding amount of the present invention can be infinitely close to the amount of original rubber material required for coating, the amount of original rubber material can just complete the sealing of metal parts coating, but there is too much residual rubber, so it will not cause uncontrollable overflow of rubber, thereby reducing the workload of subsequent trimming and improving production efficiency.

[0047] 3. The present invention forms a connection and fixation for metal parts through elastic parts and retractable connecting parts, which can quickly and effectively install metal parts. After the glue coating and sealing are completed, the retractable connecting parts can be separated from the metal parts to take out the metal parts after the glue coating and sealing. The operation is convenient, the connection and fixation are rapid, and the production efficiency can be improved.

[0048] 4. The present invention does not require separate prefabricated jigs and pre-made blanks. The material can be prepared normally according to the designed raw rubber material feeding amount obtained by calibration. After molding, there is no need to cool the mold before taking out the molded product. The molded product can be taken out directly while it is warm. Therefore, the production rhythm can be improved, a continuous cycle production of products can be formed, and the production efficiency is greatly improved. Compared with the existing technology, it is more energy-saving and environmentally friendly.

[0049] 5. The present invention seals metal parts in the wafer electroplating process with glue, which can reduce process steps (for example, prefabricating jigs, pre-making blanks, and waiting for cooling, etc.) compared with the prior art, thereby reducing production costs and improving production efficiency. Compared with the prior art, it is more energy-saving and environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The drawings of the present invention are intended to illustrate the general characteristics of the methods, structures and / or materials used in specific exemplary embodiments of the present invention, and to supplement the description in the specification. However, the drawings of the present invention are schematic diagrams not drawn to scale, and thus may not accurately reflect the precise structure or performance characteristics of any given embodiment, and the drawings of the present invention should not be interpreted as limiting or restricting the range of values ​​or properties covered by the exemplary embodiments of the present invention. The present invention is further described in detail below in conjunction with the drawings and specific embodiments.

[0051] Figure 1 It is a schematic diagram of the structure of metal parts used in the wafer electroplating process.

[0052] Figure 2 It is a schematic diagram of the overall structure of the first embodiment of the present invention.

[0053] Figure 3 It is an overall cross-sectional schematic diagram of the first embodiment of the present invention.

[0054] Figure 4This is a schematic diagram of the first embodiment of the present invention. Figure 1 , which shows that the upper die is out of the disassembled state.

[0055] Figure 5 This is a schematic diagram of the first embodiment of the present invention. Figure 2 , which shows that the middle upper die and the middle lower die are out of the disassembled state.

[0056] Figure 6 This is a schematic diagram of the first embodiment of the present invention. Figure 3 , which shows that the middle and lower dies and the lower die are out of the disassembled state.

[0057] Figure 7 It is a schematic structural diagram of an embodiment of the telescopic connector of the present invention.

[0058] Description of reference numerals:

[0059] Metal body 1;

[0060] Metal part front metal column 2;

[0061] Upper mold 3;

[0062] Middle upper die 4;

[0063] Middle and lower mold 5;

[0064] Lower mold 6;

[0065] Injection tank 7;

[0066] A first through hole 8;

[0067] A second through hole 9;

[0068] Elastic member 10;

[0069] Retractable connector 11;

[0070] Boss 12;

[0071] Blind hole 13. DETAILED DESCRIPTION

[0072] The following is an explanation of the embodiments of the present invention by specific specific embodiments, and those skilled in the art can fully understand other advantages and technical effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments, and the details in this specification can also be applied based on different viewpoints, and various modifications or changes can be made without deviating from the general design concept of the invention. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. The following exemplary embodiments of the present invention can be implemented in a variety of different forms and should not be interpreted as being limited to the specific embodiments described here. It should be understood that these embodiments are provided to make the disclosure of the present invention thorough and complete, and to fully convey the technical solutions of these exemplary specific embodiments to those skilled in the art. It should be understood that when an element is referred to as "connected" or "coupled" to another element, the element can be directly connected or coupled to another element, or there can be an intermediate element. The difference is that when an element is referred to as "directly connected" or "directly coupled" to another element, there is no intermediate element. In all the drawings, the same reference numerals always represent the same elements.

[0073] First embodiment, reference Figure 2 Combination Figure 3 As shown, the present invention provides a wafer electroplating process metal parts sealing device, which is used for curing and sealing the metal parts of the wafer electroplating process, comprising: an upper mold 3, a middle upper mold 4, a middle lower mold 5 and a lower mold 6 arranged in sequence from top to bottom;

[0074] It should be noted that the upper mold 3, the middle upper mold 4, the middle lower mold 5 and the lower mold 6 may not be connected to form a separate structure from each other, and can be connected, contacted and pressed down by pressure when in use;

[0075] This embodiment provides a preferred structure, refer to Figure 3 As shown, the upper mold 3 and the middle and lower molds 5 are connected by a rotating shaft at the first side edge, and the upper mold 3 can be flipped open by connecting the rotating shaft. The middle and upper mold 4 and the lower mold 6 are connected by a rotating shaft at the first side edges, and the middle and upper mold 4 can be flipped open by connecting the rotating shaft.

[0076] refer to Figure 4 As shown, the upper mold 3 is used for pressing the material, and a convex portion corresponding to the injection groove 7 is formed on the lower end surface of the upper mold 3, and the convex portion is used to press down the raw rubber material in the injection groove 7; the shape of the upper mold 3 is not limited. From the perspective of saving materials and facilitating operation, the area of ​​the upper mold 3 can completely cover the injection groove 7 to achieve the pressing of the raw rubber;

[0077] refer to Figure 5 Combination Figure 6As shown, the middle upper mold 4 and the middle lower mold 5 together form a cavity for curing and coating the metal part, the upper end surface of the middle upper mold 4 is formed with a material injection groove 7, and the lower end surface of the middle upper mold 4 is correspondingly formed into the shape of the back of the metal part;

[0078] A plurality of first through holes 8 are evenly distributed in the injection slot 7, and the first through holes 8 are formed as injection holes;

[0079] The upper end surface of the middle and lower molds 5 is formed correspondingly to the front shape of the metal part;

[0080] A plurality of second through holes 9 are formed in the middle and lower molds 5, each of the second through holes 9 corresponds to the position of the metal pillar 2 on the front side of the metal piece, and the second through holes 9 are for the metal pillar 2 on the front side of the metal piece to pass through;

[0081] A plurality of through-portions are formed on the middle and lower molds, and the through-portions are used for the telescopic connector to pass through. The position and shape of the through-portions are not limited, as long as the telescopic connector can pass through. That is, the telescopic connector can connect the metal part at the outer edge of the metal part annular structure, or can connect the metal part from the inner circle edge of the metal part annular structure.

[0082] Continue to refer Figure 6 As shown, the lower mold 6 is formed to receive the template, receiving the upper mold 3, the middle upper mold 4 and the middle lower mold 5;

[0083] A plurality of elastic members 10 are evenly arranged between the lower die 6 and the middle and lower die 5. The height of the elastic members 10 in a natural state is greater than the maximum distance between the lower die 6 and the middle and lower die 5. Preferably, the height of the elastic members 10 is any value between 1CM and 30CM. The position of the elastic members may not be limited as long as they can provide uniform elastic reset force to push up the middle and lower die 5.

[0084] A plurality of retractable connectors 11 are arranged in the third through hole of the lower mold. The retractable connectors 11 can extend from the third through hole through the middle and lower molds to form a connection with the edge of the metal piece and pull the metal piece into the middle and lower molds 5.

[0085] Preferably, reference Figure 7 As shown, the telescopic connecting member 11 is a telescopic column with a hook at the end, and the hook is used to hang a fixed metal member.

[0086] In a further improvement of the above embodiment, the injection groove 7 is formed as an annular groove, and the width of the cross section of the annular groove is greater than or equal to the width of the metal ring structure. Preferably, the width of the annular groove ring is 1.5 to 3 times the width of the metal ring structure ring, and the volume of the injection groove 7 is greater than or equal to the volume of the original rubber material required to complete the rubber coating seal.

[0087] As a further improvement to the above embodiment, the metal part is installed in place in the middle and lower molds, and in the vertical direction, the geometric center of the injection groove and the geometric center of the metal part are collinear in the vertical direction.

[0088] As a further improvement to the above embodiment, the first through hole is formed as a conical hole from top to bottom, with the small diameter end at the bottom, the large diameter end of the conical hole has a diameter range of 2 mm to 4 mm, and the small diameter end of the conical hole has a diameter range of 0.1 mm to 0.5 mm.

[0089] To further improve the above embodiment, continue to refer to Figure 6 As shown, it also includes:

[0090] The boss 12 is formed on the upper end surface of the lower mold 6 and is located below the metal part curing and coating cavity. The boss 12 can form a close contact with the lower end surface of the middle and lower molds 5;

[0091] The elastic members 10 are evenly arranged around the boss 12;

[0092] A blind hole 13 is formed on the edge of the upper end surface of the lower mold 6 , and the blind hole 13 is used to accommodate the end of the metal column passing through the middle and lower molds 5 .

[0093] In addition, it should also be understood that, although the terms "first", "second", etc. may be used here to describe different elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of exemplary embodiments of the present invention, the first element, component, region, layer or part discussed below may also be referred to as the second element, component, region, layer or part.

[0094] In a second embodiment, the present invention provides a method for sealing metal parts in a wafer electroplating process, which is implemented using the metal parts sealing device in a wafer electroplating process described in the first embodiment, and includes the following steps:

[0095] S1, obtain metal parts;

[0096] S2, moving the lower film into the die-casting equipment, lifting and opening the upper die, the middle upper die and the middle lower die;

[0097] S3, installing the metal parts in place in the middle and lower molds;

[0098] S4, lowering the middle and lower molds to make the middle and lower molds and the lower membrane close to the compression elastic member, and at the same time, pushing out the retractable connecting member through the middle and lower molds to connect with the fixed metal member;

[0099] S5, lowering the middle upper die to make it contact with the middle lower die;

[0100] S6, putting the raw rubber material into the injection tank according to the designed raw rubber material feeding amount;

[0101] S7, the upper mold is pressed down, and the existing molding process conditions are provided at the same time, such as 165°C × 500 seconds, and the existing vulcanization molding process is performed;

[0102] S8, after the vulcanization molding process is completed, the upper mold and the middle upper mold are opened, the glue-coated metal parts are taken out, and subsequent baking, trimming, coating and sintering processes are performed.

[0103] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will also be understood that, unless expressly defined herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not interpreted in an ideal or overly formal sense.

[0104] The present invention has been described in detail above through specific implementation modes and embodiments, but these do not constitute limitations of the present invention. Without departing from the principles of the present invention, those skilled in the art may also make many variations and improvements, which should also be regarded as the protection scope of the present invention.

Claims

1. A wafer electroplating process metal parts sealing equipment, which is used for wafer electroplating process metal parts curing glue sealing, characterized in that: include: An upper die, a middle upper die, a middle lower die and a lower die are arranged in sequence from top to bottom; The upper mold is used for pressing the material, and a convex portion corresponding to the injection groove is formed on the lower end surface of the upper mold, and the convex portion is used to press down the original rubber material in the injection groove; The middle upper mold, which together with the middle and lower molds forms a cavity for curing and coating the metal part, has an injection groove formed on its upper end surface, and its lower end surface is formed in the shape of the back of the metal part; A plurality of first through holes are evenly distributed in the injection slot, forming injection holes; The middle and lower molds have upper end surfaces correspondingly formed into the front shape of the metal part; A plurality of second through holes are formed in the middle and lower molds, each of the second through holes corresponds to a position of a metal column on the front side of the metal piece, and is used for the metal column on the front side of the metal piece to pass through; A plurality of penetration portions are formed on the middle and lower molds, and are used for the telescopic connector to pass through; A lower mold is formed to receive the template and receive the upper mold, the middle upper mold and the middle lower mold; A plurality of elastic members are evenly arranged between the lower die and the middle lower die, and the height of the elastic members in a natural state is greater than the maximum distance between the lower die and the middle lower die; A plurality of retractable connecting members are arranged in the third through hole of the lower mold, and can extend from the third through hole, pass through the middle and lower molds, and then form a connection with the edge of the metal piece to pull the metal piece into the middle and lower molds; A plurality of third through holes are evenly distributed on the lower mold.

2. The wafer electroplating process metal parts sealing equipment according to claim 1, characterized in that: The injection groove is formed as an annular groove, and the width of its cross section is greater than or equal to the width of the annular structure of the metal part.

3. The wafer electroplating process metal parts sealing equipment according to claim 2, characterized in that: The width of the cross section of the injection groove is 1.5 to 3 times the width of the annular structure of the metal part.

4. The wafer electroplating process metal parts sealing device according to claim 1, characterized in that: The metal part is installed in place in the middle and lower molds, and in the vertical direction, the geometric center of the injection groove and the geometric center of the metal part are collinear in the vertical direction.

5. The wafer electroplating process metal parts sealing equipment according to claim 1, characterized in that: The volume of the injection groove is greater than or equal to the volume of the original rubber material required to complete the rubber coating seal.

6. The wafer electroplating process metal parts sealing equipment according to claim 1, characterized in that: The first through hole is formed as a tapered hole from top to bottom, with the small diameter end at the bottom.

7. The wafer electroplating process metal parts sealing device according to claim 6, characterized in that: The diameter of the large diameter end of the tapered hole ranges from 2mm to 4mm, and the diameter of the small diameter end of the tapered hole ranges from 0.1mm to 0.5mm.

8. The wafer electroplating process metal parts sealing equipment according to claim 1, characterized in that: Also includes: The boss is formed on the upper end surface of the lower mold and is located below the cavity where the metal part is cured and coated with glue, and can form a close contact with the lower end surface of the middle and lower molds; The elastic members are evenly arranged around the boss; A blind hole is formed on the edge of the upper end surface of the lower mold and is used to accommodate the end of the metal column passing through the middle and lower molds.

9. The wafer electroplating process metal parts sealing equipment according to claim 1, characterized in that: Also includes: The upper mold and the middle and lower molds are connected via a rotating shaft at the first side edge, and the middle and upper mold and the lower mold are connected via a rotating shaft at the first side edge.

10. The wafer electroplating process metal parts sealing equipment according to claim 1, characterized in that: The telescopic connector is a telescopic column with a hook at the end, and the hook is used to hang and fix the metal part.

11. A method for sealing metal parts in a wafer electroplating process, which is implemented by using the wafer electroplating process metal parts sealing device according to any one of claims 1 to 10, characterized in that: The following steps are involved: S1, obtain metal parts; S2, moving the lower die into the die-casting equipment, lifting and opening the upper die, the middle upper die and the middle lower die; S3, installing the metal parts in place in the middle and lower molds; S4, lowering the middle and lower molds so that the middle and lower molds and the lower mold are close to the compression elastic member, and at the same time, the retractable connecting member is pushed out through the middle and lower molds to connect and fix the metal member; S5, lowering the middle upper die to make it contact with the middle lower die; S6, putting the raw rubber material into the injection tank according to the designed raw rubber material feeding amount; S7, the upper mold is pressed downward, and the existing molding process conditions are provided at the same time, and the existing molding process is executed; S8, after the forming process is completed, the upper mold and the middle upper mold are opened, the coated metal parts are taken out, and subsequent baking, trimming, coating and sintering processes are performed.

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