A temperature-compensated quartz crystal oscillator test method and device
Patent Information
- Application Number
- CN202410705781.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2044-06-03
AI Technical Summary
The existing temperature-compensation test methods cannot efficiently and accurately process the key operating data of the quartz crystal oscillator, resulting in the inability to accurately perform temperature compensation and cannot meet the requirements of improving the performance stability of the quartz crystal oscillator.
By obtaining the operating data of the temperature sensor circuit of the quartz crystal oscillator, analyzing the performance trust index of the temperature sensor, collecting the data processing information of the data processing circuit, and evaluating the data processing reliability index. The neural network model is used to fit the temperature compensation algorithm, match the temperature compensation scheme, and communicate with the upper computer through Bluetooth to realize temperature compensation and temperature compensation testing.
It improves the accuracy and efficiency of temperature compensation of quartz crystal oscillator, enhances the stable performance after temperature compensation, reduces maintenance costs, and improves overall economic benefits.
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Figure CN118655442B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of quartz crystal oscillator testing, and in particular to a temperature-compensated quartz crystal oscillator testing method and device. Background Art
[0002] With the continuous development of electronic technology, quartz crystal oscillators, as key components in electronic equipment, have increasingly higher requirements for performance stability and precision. Temperature compensation testing of quartz crystal oscillators has become an important research direction. However, the current temperature compensation test methods have limitations in quartz crystal oscillator data processing and are unable to efficiently and accurately process the key operating data of quartz crystal oscillators, resulting in failure to accurately perform temperature compensation on quartz crystal oscillators, and thus failing to meet the requirements for improving the performance stability of quartz crystal oscillators.
[0003] For example, the invention patent with the announcement number CN101609126B discloses an automatic test system for a temperature compensated crystal oscillator, including a power supply, an incubator, a data transmission module, multiple crystal oscillator selection modules, a display module and a central control module. The crystal oscillator selection module includes multiple test control boards and multiple groups of decoders and multi-way switches. The test control board is arranged in the incubator, and each of the test control boards accommodates multiple crystal oscillators to be tested. The central control module includes a computer, a frequency standard, a frequency meter, and a temperature control unit. The frequency meter is electrically connected to the frequency standard and the computer respectively and is provided with an interface connected to the crystal oscillator to be tested. The computer is electrically connected to the crystal oscillator to be tested through the crystal oscillator selection module and the data transmission module respectively, and the computer is electrically connected to the incubator through the temperature control unit.
[0004] For example, the invention patent with announcement number CN108957282B provides a crystal oscillator electrical performance test system, which includes: a first power interface for connecting to a test power supply; a second power interface for connecting to a power-on preheating power supply; multiple on-off switching modules for connecting or disconnecting a crystal oscillator to be tested based on a first external control signal; a test selection module for selecting a crystal oscillator to be tested and matching it with test items; and multiple matching interfaces for connecting to an external test instrument and transmitting signals with the external test instrument according to the test item matching.
[0005] However, in the process of implementing the embodiments of the present application, it was found that the above-mentioned technology has at least the following technical problems: in the process of testing the temperature compensated crystal oscillator, the above-mentioned application does not focus on temperature compensation. Even if the crystal oscillator is tested to multiple degrees, the efficiency of the temperature compensated crystal oscillator test will be reduced, and the repeatability of the temperature compensated crystal oscillator test will be reduced; at the same time, when testing the electrical performance of the crystal oscillator, the above-mentioned application does not consider the importance of the operating condition of the crystal oscillator to the electrical performance of the crystal oscillator, and unilaterally analyzes the circuit data of the crystal oscillator, which cannot guarantee the comprehensiveness and reliability of the electrical performance test of the crystal oscillator. Summary of the invention
[0006] In view of the deficiencies in the prior art, the present invention provides a temperature compensated quartz crystal oscillator testing method and device, which can effectively solve the problems involved in the above-mentioned background technology.
[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: In the first aspect, the present invention provides a temperature compensated quartz crystal oscillator test method, including: S1. Acquire the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, and analyze the performance trust index of the temperature sensor belonging to the quartz crystal oscillator; S2. Collect data processing information of the data processing circuit belonging to the quartz crystal oscillator, and analyze the data processing reliability index of the data processing circuit belonging to the quartz crystal oscillator according to the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator; S3. According to the data processing information of the data processing circuit belonging to the quartz crystal oscillator, extract the data processing execution set of the data processing circuit belonging to the quartz crystal oscillator, perform data processing on the data processing execution set to obtain the temperature characteristic value of the quartz crystal oscillator, thereby matching the temperature compensation scheme of the quartz crystal oscillator, and record the temperature compensated quartz crystal oscillator as a quartz crystal debugging oscillator; S4. Acquire the working parameters of the quartz crystal debugging oscillator from the upper computer, evaluate the temperature compensation adaptability index of the quartz crystal debugging oscillator, and adjust and feedback the temperature compensation adaptability of the quartz crystal debugging oscillator.
[0008] As a further method, the data processing execution set of the data processing circuit to which the quartz crystal oscillator belongs specifically includes the transient average temperature of the quartz crystal oscillator and the transient average frequency of the quartz crystal oscillator.
[0009] As a further method, the data processing execution set is processed to obtain the temperature characteristic value of the quartz crystal oscillator. The specific data processing process is: through the neural network model, the obtained compensation temperature value corresponding to the quartz crystal oscillator is fitted to obtain a temperature compensation algorithm, and the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs, the transient average temperature of the quartz crystal oscillator and the transient average frequency of the quartz crystal oscillator are input into the temperature compensation algorithm to generate the temperature characteristic value of the quartz crystal oscillator.
[0010] As a further method, the matching obtains a temperature compensation scheme for the quartz crystal oscillator. The specific analysis process is: performing difference processing on the temperature characteristic value of the quartz crystal oscillator and the temperature compensation reference value to obtain the temperature value to be compensated of the quartz crystal oscillator, matching the temperature value to be compensated of the quartz crystal oscillator with the temperature compensation scheme corresponding to each temperature value interval to be compensated, obtaining the temperature compensation scheme of the quartz crystal oscillator, and thereby performing temperature compensation on the quartz crystal oscillator.
[0011] As a further method, the temperature compensation adaptability of the quartz crystal debugging oscillator is adjusted and fed back. The specific feedback process is: comparing the temperature compensation adaptability index of the quartz crystal debugging oscillator with the temperature compensation adaptability threshold. If the temperature compensation adaptability index of the quartz crystal debugging oscillator is less than the temperature compensation adaptability threshold, then adjusting and feeding back the temperature compensation adaptability of the quartz crystal debugging oscillator.
[0012] The second aspect of the present invention provides a device for a temperature-compensated quartz crystal oscillator test method, comprising: a quartz crystal oscillator, various temperature sensor circuits, a data processing circuit, a host computer and Bluetooth; the data processing circuit receives and processes the operating data of each temperature sensor circuit in the quartz crystal oscillator through Bluetooth, realizes the temperature compensation function of the quartz crystal oscillator, communicates the working parameters of the quartz crystal oscillator after temperature compensation with the host computer through Bluetooth, and finally realizes the temperature compensation test of the quartz crystal oscillator; the temperature sensor is used to collect the various temperatures of the quartz crystal oscillator within the temperature monitoring period and the temperature value of each temperature sensor self-heating within the temperature monitoring period; the voltage sensor is used to collect the real-time voltage of the quartz crystal debugging oscillator within the temperature compensation debugging period; the current sensor is used to collect the real-time current of the quartz crystal debugging oscillator within the temperature compensation debugging period; the processor is used to obtain the various temperatures of the quartz crystal oscillator within the temperature monitoring period, the temperature value of each temperature sensor self-heating within the temperature monitoring period, and the real-time current, the average current and the average voltage after the real-time current is averaged, and perform a comprehensive analysis, thereby adjusting and feeding back the temperature compensation adaptability of the quartz crystal oscillator.
[0013] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:
[0014] (1) The present invention provides a temperature-compensated quartz crystal oscillator testing method and device. By analyzing the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, it is helpful to fully understand the operating conditions of the temperature sensor. By analyzing the data processing information of the data processing circuit belonging to the quartz crystal oscillator, it is helpful to evaluate the data processing capability of the data processing circuit in the quartz crystal oscillator, and then the temperature compensation scheme of the quartz crystal oscillator can be matched in a targeted manner. The temperature compensation adaptability of the temperature-compensated quartz crystal oscillator is adjusted and fed back, which is beneficial to ensuring the stable performance of the quartz crystal oscillator and improving the adjustment capability of the quartz crystal oscillator at different temperatures.
[0015] (2) By analyzing the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, the present invention can more efficiently match the temperature compensation scheme of the quartz crystal oscillator, thereby performing temperature compensation on the quartz crystal oscillator, which is beneficial to reducing the problem of unstable performance of the quartz crystal oscillator caused by abnormal temperature, thereby reducing the frequency of repair and replacement of the quartz crystal oscillator, thereby reducing the maintenance cost of the quartz crystal oscillator and improving the overall economic benefits of the quartz crystal oscillator.
[0016] (3) The present invention can ensure the accuracy and reliability of the collected temperature of the quartz crystal oscillator by analyzing the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, and obtain the performance trust index of the temperature sensor belonging to the quartz crystal, thereby providing a reliable data source for the data processing circuit belonging to the quartz crystal oscillator and providing basic data accuracy guarantee for the quartz crystal oscillator test. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.
[0018] Figure 1 The figure is a schematic flow chart of the method steps of the present invention.
[0019] Figure 2 It is a schematic diagram of the temperature change curve involved in the present invention.
[0020] Figure numerals: 1, temperature one; 2, temperature two. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0022] Reference Figure 1 As shown, the first aspect of the present invention provides a temperature compensated quartz crystal oscillator testing method, including: S1. Acquire the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, and analyze the performance trust index of the temperature sensor belonging to the quartz crystal oscillator.
[0023] In a specific embodiment, the present invention can ensure the accuracy and reliability of the collected temperature of the quartz crystal oscillator by analyzing the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, and obtain the performance trust index of the temperature sensor belonging to the quartz crystal, thereby providing a reliable data source for the data processing circuit belonging to the quartz crystal oscillator and providing basic data accuracy guarantee for the quartz crystal oscillator test.
[0024] Specifically, the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs, in a specific embodiment, can be estimated through a Bayesian estimation method in combination with the temperature already measured by the temperature sensor to which the quartz crystal oscillator belongs, and the probability distribution of the accuracy of the temperature sensor to which the quartz crystal oscillator belongs can be analyzed to obtain the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs.
[0025] The performance trust index of the temperature sensor of the quartz crystal oscillator is obtained by comprehensive analysis of the temperature update sensitivity level and self-heating influence level of each temperature sensor of the quartz crystal oscillator in the temperature monitoring cycle in this embodiment, and is used to determine the performance trust value of the temperature sensor of the quartz crystal oscillator. The specific expression is:
[0026]
[0027] Among them, σ is the performance trust index of the temperature sensor of the quartz crystal oscillator. The performance of the temperature sensor of the quartz crystal oscillator is a key indicator of the temperature compensation process of the quartz crystal oscillator. If the temperature update sensitivity level of the temperature sensor of the quartz crystal oscillator is low, it means that the temperature sensor cannot quickly respond to the temperature change of the quartz crystal oscillator, resulting in insufficient timely temperature compensation of the quartz crystal oscillator, which makes the frequency stability of the quartz crystal oscillator insufficient, and it is impossible to provide accurate data for the actual application scenario. At the same time, if the self-heating influence level of the temperature sensor of the quartz crystal oscillator is high, it will reduce the temperature compensation effect of the quartz crystal oscillator and reduce the accuracy of the quartz crystal oscillator after temperature compensation. Therefore, the temperature update sensitivity level and self-heating influence level of each temperature sensor of the quartz crystal oscillator are expressed into an expression through analysis, which can comprehensively evaluate the performance of the temperature sensor of the quartz crystal oscillator and provide accurate data support for the data processing circuit of the quartz crystal oscillator, thereby improving the temperature compensation effect of the quartz crystal oscillator and improving the stability of the quartz crystal oscillator frequency.
[0028] LE(T) m It is the temperature update sensitivity level of the mth temperature sensor belonging to the quartz crystal oscillator within the temperature monitoring cycle. The above temperature update sensitivity level is obtained by matching the cumulative update time period of the temperature sensor. It is used to describe the response speed level of the temperature sensor belonging to the quartz crystal oscillator to temperature changes. The higher the level, the faster the temperature sensor reacts to temperature changes and can provide timely data, thus providing timely data decisions for temperature compensation of the quartz crystal oscillator.
[0029] LE(H) m It is the self-heating impact level of the mth temperature sensor belonging to the quartz crystal oscillator within the temperature monitoring cycle. The above self-heating impact level is obtained by matching the average temperature of the temperature sensor. It is used to describe the degree of influence of the temperature sensor's own heating during operation on the quartz crystal oscillator. The higher the level, the more obvious the heating of the temperature sensor will be. It will cause a large performance deviation of the quartz crystal oscillator.
[0030] r1 is the impact factor corresponding to the unit value of the temperature update sensitivity level, and r2 is the impact factor corresponding to the unit value of the self-heating impact level. The impact factors corresponding to the unit values of the temperature update sensitivity level and the impact factors corresponding to the unit values of the self-heating impact level are designed with different temperature update sensitivity levels and different self-heating impact levels, and the impact on the temperature sensor belonging to the quartz crystal oscillator is tested. The impact factors corresponding to the unit values of the temperature update sensitivity level and the impact factors corresponding to the unit values of the self-heating impact level are determined according to the test results; the impact factors corresponding to the unit values of the temperature update sensitivity level have a numerical range of 0.2 to 0.65, and the numerical value in this example is specified as 0.6; the impact factors corresponding to the unit values of the self-heating impact level have a numerical range of 0.2 to 0.9, and the numerical value in this example is specified as 0.8.
[0031] m is the serial number of each temperature sensor, m={1, 2, 3, ..., p}, and p is the total number of temperature sensors.
[0032] Furthermore, the performance trust index of the temperature sensor belonging to the quartz crystal oscillator is analyzed, and the specific analysis process is: according to the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, the temperature change curve of each temperature sensor circuit belonging to the quartz crystal oscillator is extracted, and the temperature monitoring time point corresponding to each temperature of each temperature sensor is located. It should be explained that the above temperature monitoring time points are all within the temperature monitoring period; the above temperature change curve refers to the use of a time series analysis model to fit the various temperatures of the quartz crystal oscillator collected by the temperature sensor within the temperature monitoring period, so as to obtain the following: Figure 2 The temperature change curve shown is the temperature change curve of one of the temperature sensors, the ordinate is temperature in degrees Celsius, the abscissa is temperature monitoring time point in seconds, and the temperature monitoring time point corresponding to each temperature of the temperature sensor can be read and located from the abscissa of the temperature change curve. For example, temperature one represented by 1 and temperature two represented by 2 in the temperature change curve correspond to 8 seconds and 17 seconds respectively, and the difference between the two is 8 seconds, which is one update time period in the cumulative update time period; the temperature change curve can be used to more quickly and clearly understand the temperature change and temperature update time period of the quartz crystal oscillator, and reading data from the temperature change curve can reduce the addition of other sensors inside the quartz crystal oscillator and reduce the production complexity of the quartz crystal oscillator.
[0033] And the differences of adjacent temperature monitoring time points are accumulated to obtain the cumulative update time period of each temperature sensor, which is matched with the temperature update sensitivity level corresponding to each cumulative update time period interval to obtain the temperature update sensitivity level of each temperature sensor belonging to the quartz crystal oscillator within the temperature monitoring cycle; the above-mentioned temperature monitoring cycle is formulated by professional and technical personnel based on the performance of the quartz crystal oscillator, and is a period for monitoring the performance of each temperature sensor circuit belonging to the quartz crystal oscillator, which will be adjusted according to the different real-time response times of temperature changes; it needs to be explained that the above-mentioned matching of the temperature update sensitivity level corresponding to each cumulative update time period interval, wherein the temperature update sensitivity level corresponding to each cumulative update time period interval refers to the performance requirements in the specification manual of the quartz crystal oscillator, formulating each cumulative update time period interval and the temperature update sensitivity level one by one, matching the cumulative update time period of each temperature sensor with the cumulative update time period interval, and the temperature update sensitivity level corresponding to the cumulative update time period interval is the temperature update sensitivity level of each temperature sensor belonging to the quartz crystal oscillator within the temperature monitoring cycle.
[0034] According to the temperature change curve of each temperature sensor circuit belonging to the quartz crystal oscillator, the temperature value of each temperature sensor belonging to the quartz crystal oscillator at each temperature monitoring time point is extracted therefrom, and the average temperature of each temperature sensor belonging to the quartz crystal oscillator in the temperature monitoring period is obtained by averaging, and matched with the self-heating impact level corresponding to each average temperature interval to obtain the self-heating impact level of each temperature sensor belonging to the quartz crystal oscillator in the temperature monitoring period; the above temperature value refers to the temperature value of each temperature sensor self-heating in the temperature monitoring period extracted from the data recorded by the temperature change curve; the above matching with the self-heating impact level corresponding to each average temperature interval, wherein the self-heating impact level corresponding to each average temperature interval refers to the performance requirements for the temperature sensor in the specification manual of the quartz crystal oscillator, and the average temperature of each temperature sensor in the temperature monitoring period is matched with each average temperature interval, and the self-heating impact level corresponding to the average temperature interval is the self-heating impact level of each temperature sensor belonging to the quartz crystal oscillator in the temperature monitoring period.
[0035] The performance trust index of the temperature sensor of the quartz crystal oscillator is obtained by analyzing the temperature update sensitivity level and self-heating influence level of each temperature sensor of the quartz crystal oscillator during the temperature monitoring period.
[0036] S2. Collect data processing information of the data processing circuit belonging to the quartz crystal oscillator, and analyze the data processing reliability index of the data processing circuit belonging to the quartz crystal oscillator based on the operation data of each temperature sensor circuit belonging to the quartz crystal oscillator.
[0037] In a specific embodiment, the present invention can more efficiently match the temperature compensation scheme of the quartz crystal oscillator by analyzing the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, thereby performing temperature compensation on the quartz crystal oscillator, which is beneficial to reducing the problem of unstable performance of the quartz crystal oscillator caused by temperature abnormality, thereby reducing the frequency of repair and replacement of the quartz crystal oscillator, thereby reducing the maintenance cost of the quartz crystal oscillator and improving the overall economic benefits of the quartz crystal oscillator.
[0038] Specifically, the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs is analyzed, and the specific analysis process is as follows: according to the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, each signal receiving time point of the data processing circuit to which the quartz crystal oscillator belongs is extracted, and the difference processing is performed with the signal sending time point corresponding to each acquired temperature sensor to obtain each data synchronization time difference of the data processing circuit to which the quartz crystal oscillator belongs. The above-mentioned signal receiving time point of the data processing circuit to which the quartz crystal oscillator belongs is obtained from the signal receiving time point information recorded in the timestamp added when the data processing circuit receives the signal; the above-mentioned signal sending time point corresponding to each temperature sensor is obtained from the signal sending time point information recorded in the built-in timestamp of each temperature sensor; the above-mentioned signal sending time point corresponding to each temperature sensor is all within the temperature monitoring cycle; the above-mentioned signal receiving time point of the data processing circuit to which the quartz crystal oscillator belongs, it needs to be explained that the signals received at the signal receiving time point are all signals sent by each temperature sensor within the temperature monitoring cycle.
[0039] And the data synchronization time differences of the data processing circuit belonging to the quartz crystal oscillator are averaged to obtain the data synchronization time average difference of the data processing circuit belonging to the quartz crystal oscillator, and matched with the data synchronization degree corresponding to each data synchronization time average difference interval to obtain the data synchronization degree of the data processing circuit belonging to the quartz crystal oscillator; the above-mentioned data synchronization degree corresponding to each data synchronization time average difference interval is matched, wherein the data synchronization degree corresponding to each data synchronization time average difference interval refers to the specific requirements for communication delay in the specification manual of the quartz crystal oscillator, formulating a one-to-one correspondence between each data synchronization time average difference interval and the data synchronization degree, matching the data synchronization time average difference of the data processing circuit belonging to the quartz crystal oscillator with each data synchronization time average difference interval, then the data synchronization degree corresponding to the data synchronization time average difference interval is the data synchronization degree of the data processing circuit belonging to the quartz crystal oscillator.
[0040] The number of signal reception time points of the data processing circuit belonging to the quartz crystal oscillator is counted, recorded as the number of signal receptions of the data processing circuit belonging to the quartz crystal oscillator, the signal reception time points of the data processing circuit belonging to the quartz crystal oscillator are sorted in chronological order, the signal reception time point ranked last is differenced with the signal reception time point ranked first to obtain the signal reception time period of the data processing circuit belonging to the quartz crystal oscillator, and the signal reception time period is ratio analyzed with the number of signal receptions of the data processing circuit belonging to the quartz crystal oscillator to obtain the sampling rate of the data processing circuit belonging to the quartz crystal oscillator; the above-mentioned number of signal reception time points of the data processing circuit belonging to the quartz crystal oscillator is obtained by counting the number of signal reception timestamps recorded in the log file of the quartz crystal oscillator using a log analysis tool.
[0041] According to the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, the signal receiving codes of the data processing circuit to which the quartz crystal oscillator belongs are extracted, and the error comparison is performed with the signal sending codes corresponding to each temperature sensor circuit through a signal verification model, the number of error signals occurring is counted, and the ratio processing is performed with the number of signals received by the data processing circuit to which the quartz crystal oscillator belongs to obtain the error occurrence rate of the data processing circuit to which the quartz crystal oscillator belongs; the signal receiving codes of the data processing circuit to which the quartz crystal oscillator belongs refer to the signal receiving codes obtained by parsing the received signals of the data processing circuit into binary signals through a data analysis circuit; the signal sending codes corresponding to the temperature sensor circuits refer to the signal sending codes obtained by parsing the sent signals of each temperature sensor circuit into binary signals through a data analysis circuit; the signal verification model refers to the use of a cyclic redundancy check method to verify the signal receiving codes of the data processing circuit to which the quartz crystal oscillator belongs and the corresponding signal sending codes to determine whether there is a deviation in the signal receiving codes.
[0042] The data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs is obtained by comprehensively analyzing the occurrence rate of error definition and the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs. In a specific embodiment, the state of the data processing circuit to which the quartz crystal oscillator belongs can be analyzed through a Markov model to obtain the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs.
[0043] The data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs, in this embodiment, is obtained by comprehensive analysis of the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs, the data synchronization degree, sampling rate and error occurrence rate of the data processing circuit to which the quartz crystal oscillator belongs, and is used to determine the data processing reliability of the data processing circuit to which the quartz crystal oscillator belongs. The specific expression is:
[0044]
[0045] Among them, γ is the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs. The performance of the temperature sensor to which the quartz crystal oscillator belongs is the basis for analyzing the data processing reliability of the data processing circuit to which the quartz crystal oscillator belongs. If the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs is low, the reliability of the data received by the data processing circuit to which the quartz crystal oscillator belongs will be reduced, which will in turn lead to a reduction in the data processing reliability index. The data synchronization and sampling rate of the data processing circuit to which the quartz crystal oscillator belongs will affect the timeliness of data processing. If the data processing is not timely, the current state of the quartz crystal oscillator cannot be fed back, and the temperature compensation scheme of the quartz crystal oscillator is not accurately matched, resulting in the quartz The working capacity of the crystal oscillator decreases, and the error occurrence rate of the data processing circuit of the quartz crystal oscillator reflects the working performance of the data processing circuit of the quartz crystal oscillator. If the working performance of the data processing circuit is low, the data of the temperature sensor cannot be accurately processed. The temperature characteristics of the quartz crystal oscillator have a large deviation, and temperature compensation cannot improve the working performance of the quartz crystal oscillator. Therefore, analyzing the parameters of the temperature sensor of the quartz crystal oscillator and the parameters of the data processing circuit of the quartz crystal oscillator at the same time is conducive to a more comprehensive understanding of the mutual influence of the temperature sensor and the data processing circuit of the quartz crystal oscillator, and thus can provide more convincing data for formulating a more effective temperature compensation scheme.
[0046] σ is the performance trust index of the temperature sensor of the quartz crystal oscillator, which is obtained by comprehensive analysis of the temperature update sensitivity level and self-heating influence level of each temperature sensor of the quartz crystal oscillator within the temperature monitoring cycle, and is used to determine the performance trust of the temperature sensor of the quartz crystal oscillator.
[0047] VS is the data synchronization degree of the data processing circuit to which the quartz crystal oscillator belongs. The above-mentioned data synchronization degree refers to the value obtained by matching the average difference of the data synchronization time of the data processing circuit to which the quartz crystal oscillator belongs, and is used to describe the consistency of the signal receiving code of the data processing circuit and the signal sending code of the temperature sensor circuit.
[0048] DS is the sampling rate of the data processing circuit to which the quartz crystal oscillator belongs, and refers to the rate at which the data processing circuit receives the signal sent by the temperature sensor.
[0049] ER(D) is the error occurrence rate of the data processing circuit to which the quartz crystal oscillator belongs, indicating the probability of an error in the data processing circuit when processing the signal sent by the temperature sensor.
[0050] ER is the error limit occurrence rate, which refers to the upper limit value of the error occurrence rate extracted from the quartz crystal oscillator specification manual and is used to determine the error occurrence rate of the data processing circuit of the quartz crystal oscillator.
[0051] e is a natural constant, s1 is the influence factor corresponding to the unit value of data synchronization, s2 is the influence factor corresponding to the unit value of sampling rate, s3 is the correction factor corresponding to the error occurrence rate, and f is the weight factor corresponding to the performance trust index. The influence factors corresponding to the unit value of data synchronization, the influence factors corresponding to the unit value of sampling rate, the correction factors corresponding to the error occurrence rate, and the weight factor corresponding to the performance trust index can all be obtained by constructing a hierarchical model of the data processing circuit to which the quartz crystal oscillator belongs, using the principal component analysis method to compare the data synchronization, sampling rate, error occurrence rate, and performance trust index, and constructing a judgment matrix. By calculating the eigenvector values of the data synchronization, sampling rate, error occurrence rate, and performance trust index in the judgment matrix , determine the impact factor corresponding to the data synchronization unit value, the impact factor corresponding to the sampling rate unit value, the correction factor corresponding to the error occurrence rate, and the weight factor corresponding to the performance trust index; the impact factor corresponding to the data synchronization unit value, the impact factor corresponding to the sampling rate unit value, and the correction factor corresponding to the error occurrence rate are all in the range of 0.35 to 0.95. In this example, the impact factor corresponding to the data synchronization unit value is specified as 0.41, the impact factor corresponding to the sampling rate unit value is specified as 0.56, the correction factor corresponding to the error occurrence rate is specified as 0.35, and the weight factor corresponding to the performance trust index ranges from 0.4 to 0.6. In this example, the weight factor corresponding to the performance trust index is specified as 0.5.
[0052] In this embodiment, the numerical variation of the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs is shown in Table 1:
[0053] Table 1 Data processing reliability index of the data processing circuit of the quartz crystal oscillator
[0054] Performance Trust Index Data synchronization Sampling rate / Hz Error rate / % 0.95 0.85 1000 0.05 0.9 0.8 900 0.06 1.1 0.9 1100 0.04
[0055] In this example embodiment, according to the table of the data processing reliability index of the data processing circuit to which the above-mentioned quartz crystal oscillator belongs, it can be learned that when the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs is higher, the error occurrence rate of the data processing circuit to which the quartz crystal oscillator belongs is lower, the data synchronization degree of the data processing circuit to which the quartz crystal oscillator belongs is increased, and the sampling rate of the data processing circuit to which the quartz crystal oscillator belongs is also increased accordingly. Finally, the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs is increased. Therefore, it is necessary to ensure that the performance trust index, data synchronization degree, sampling rate and error occurrence rate are within a reliable range, so that the data processing reliability index result of the data processing circuit to which the quartz crystal oscillator belongs is within an ideal range.
[0056] S3. According to the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, the data processing execution set of the data processing circuit to which the quartz crystal oscillator belongs is extracted, and the data processing execution set is processed to obtain the temperature characteristic value of the quartz crystal oscillator, thereby matching the temperature compensation scheme of the quartz crystal oscillator, and the quartz crystal oscillator after temperature compensation is recorded as a quartz crystal debugging oscillator.
[0057] Specifically, the matching obtains a temperature compensation scheme for a quartz crystal oscillator, and the specific analysis process is: performing difference processing on the temperature characteristic value of the quartz crystal oscillator and the temperature compensation reference value to obtain the temperature value to be compensated of the quartz crystal oscillator, matching the temperature value to be compensated of the quartz crystal oscillator with the temperature compensation scheme corresponding to each temperature value interval to be compensated, obtaining the temperature compensation scheme of the quartz crystal oscillator, thereby performing temperature compensation on the quartz crystal oscillator; the above-mentioned temperature compensation reference value refers to the condition that the quartz crystal oscillator can continue to have a temperature monitoring cycle with a frequency fluctuation of no more than one millionth, and locating the corresponding temperature, and obtaining the temperature compensation reference value through mean analysis; the above-mentioned temperature value to be compensated of the quartz crystal oscillator and the temperature compensation scheme corresponding to each temperature value interval to be compensated are matched, and the temperature compensation scheme of the quartz crystal oscillator is obtained. The temperature compensation scheme corresponding to the temperature value interval to be compensated is matched, wherein the temperature compensation scheme refers to adjusting the driving force and load capacitance of the quartz crystal oscillator according to the temperature value to be compensated of the quartz crystal oscillator, so that the temperature of the quartz crystal oscillator is close to or equal to the temperature compensation reference value; each temperature value interval to be compensated is matched with the temperature compensation scheme one by one, and the temperature value to be compensated of the quartz crystal oscillator is matched with each temperature value interval to be compensated, then the temperature compensation scheme corresponding to the temperature value interval to be compensated is the temperature compensation scheme of the quartz crystal oscillator; the above-mentioned temperature compensation of the quartz crystal oscillator refers to the quartz crystal oscillator receiving the temperature compensation scheme signal, and its internal control circuit will adjust the corresponding parameters according to the temperature compensation scheme signal.
[0058] Furthermore, the data processing execution set is processed to obtain the temperature characteristic value of the quartz crystal oscillator. The specific data processing process is: through the neural network model, the compensation temperature value corresponding to the obtained quartz crystal oscillator is fitted to obtain a temperature compensation algorithm. The compensation temperature value corresponding to the above-mentioned quartz crystal oscillator refers to the historical compensation temperature value for temperature compensation of the quartz crystal oscillator. The above-mentioned temperature compensation algorithm technology specifically refers to inputting the historical compensation temperature value into the neural network model. The neural network model automatically generates a temperature compensation algorithm based on the existing historical compensation temperature value data. The algorithm can generate predicted temperature characteristic values of the quartz crystal oscillator according to different input parameters.
[0059] The data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs, the transient average temperature of the quartz crystal oscillator and the transient average frequency of the quartz crystal oscillator are input into the temperature compensation algorithm to generate the temperature characteristic value of the quartz crystal oscillator. The above temperature characteristic value refers to the numerical value describing the temperature characteristic of the quartz crystal oscillator, which not only takes into account the transient average temperature of the quartz crystal oscillator, but also takes into account the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs and the transient average frequency of the quartz crystal oscillator, so as to correct the temperature of the quartz crystal oscillator and improve the accuracy of the temperature compensation scheme.
[0060] Furthermore, the data processing execution set of the data processing circuit to which the quartz crystal oscillator belongs specifically includes the transient average temperature and the transient average frequency of the quartz crystal oscillator, wherein the transient average temperature of the quartz crystal oscillator refers to the temperatures of the quartz crystal oscillator within 5 seconds adjacent to the end time point of the temperature monitoring cycle recorded by the temperature sensor, and the transient average temperature of the quartz crystal oscillator is obtained by averaging; the transient average frequency of the quartz crystal oscillator refers to the frequencies of the quartz crystal oscillator within 5 seconds adjacent to the end time point of the temperature monitoring cycle recorded by the frequency meter, and the transient average frequency of the quartz crystal oscillator is obtained by averaging.
[0061] S4. Obtain the working parameters of the quartz crystal debugging oscillator from the host computer, evaluate the temperature compensation adaptability index of the quartz crystal debugging oscillator, and adjust and feedback the temperature compensation adaptability of the quartz crystal debugging oscillator.
[0062] Specifically, the temperature compensation adaptability index of the quartz crystal debugging oscillator is adjusted and fed back, and the specific feedback process is: comparing the temperature compensation adaptability index of the quartz crystal debugging oscillator with the temperature compensation adaptability threshold; if the temperature compensation adaptability index of the quartz crystal debugging oscillator is less than the temperature compensation adaptability threshold, adjusting and feeding back the temperature compensation adaptability index of the quartz crystal debugging oscillator; the above-mentioned temperature compensation adaptability threshold refers to the value formulated by relevant experts through the actual application scenarios and industry specifications of the quartz crystal debugging oscillator; if the temperature compensation adaptability index of the quartz crystal debugging oscillator is less than the temperature compensation adaptability threshold, it means that after the implementation of the temperature compensation scheme, the working performance of the quartz crystal debugging oscillator does not meet the expected requirements, and the above-mentioned quartz crystal debugging oscillator The temperature compensation adaptability of the quartz crystal oscillator is adjusted and fed back, which means that under the condition that the temperature compensation adaptability index of the quartz crystal debugging oscillator is less than the temperature compensation adaptability threshold, the drift frequency, aging level, error occurrence rate, self-heating influence level and temperature update sensitivity level involved in the present invention are displayed in the host computer, the link with the problem is diagnosed, and the hardware of the link with the problem is optimized in a targeted manner, thereby completing the feedback adjustment to reduce the maintenance cost of the quartz crystal oscillator and improve the overall economic benefit of the quartz crystal oscillator; if the temperature compensation adaptability index of the quartz crystal debugging oscillator is greater than or equal to the temperature compensation adaptability threshold, it means that after the implementation of the temperature compensation scheme, the working performance of the quartz crystal debugging oscillator meets the expected requirements and there is no need to make feedback adjustment to it.
[0063] Furthermore, the temperature compensation adaptability index of the quartz crystal debugging oscillator is evaluated, and the specific evaluation process is as follows: according to the working parameters of the quartz crystal debugging oscillator, the first-stage average output frequency of the quartz crystal debugging oscillator in the temperature compensation debugging cycle is extracted, and the second-stage average output frequency of the quartz crystal debugging oscillator in the next adjacent temperature compensation debugging cycle is extracted, and the difference processing is performed with the first-stage average output frequency of the quartz crystal debugging oscillator in the temperature compensation debugging cycle to obtain the drift frequency of the quartz crystal debugging oscillator; the above-mentioned temperature compensation debugging cycle is formulated by professional and technical personnel based on the performance of the quartz crystal debugging oscillator. It is a cycle for observing the performance of the quartz crystal debugging oscillator, and will be adjusted according to the speed of the output frequency of the quartz crystal debugging oscillator; the above-mentioned first-stage average output frequency refers to the various frequencies of the quartz crystal debugging oscillator in the temperature compensation debugging cycle recorded by the frequency meter, and the first-stage average output frequency is obtained by mean analysis; the above-mentioned second-stage average output frequency refers to the various frequencies of the quartz crystal debugging oscillator in the next adjacent temperature compensation debugging cycle recorded by the frequency meter, and the second-stage average output frequency is obtained by mean analysis.
[0064] The average output frequency of the quartz crystal debugging oscillator in the temperature monitoring period is collected, and the difference analysis is performed with the average output frequency of the quartz crystal debugging oscillator in the first stage in the temperature compensation debugging period to obtain the aging frequency of the quartz crystal debugging oscillator, which is matched with the aging level corresponding to each aging frequency interval to obtain the aging level of the quartz crystal debugging oscillator; the above-mentioned average output frequency of the quartz crystal debugging oscillator in the temperature monitoring period refers to each frequency of the quartz crystal debugging oscillator in the temperature monitoring period recorded by the frequency meter, and the average output frequency of the quartz crystal debugging oscillator in the temperature monitoring period is obtained by mean analysis; it should be explained that the temperature monitoring period is before the temperature compensation debugging period, and the temperature monitoring period and the temperature compensation debugging period are of equal length; the above-mentioned matching with the aging level corresponding to each aging frequency interval, wherein the aging level corresponding to each aging frequency interval refers to the performance requirements of the temperature sensor in the specification manual of the quartz crystal oscillator, formulating a one-to-one correspondence between each aging frequency interval and the aging level, matching the aging frequency of the quartz crystal debugging oscillator with each aging frequency interval, and the aging level corresponding to the aging frequency interval is the aging level of the quartz crystal debugging oscillator.
[0065] The average current and average voltage of the quartz crystal debugging oscillator during the temperature compensation debugging period are collected, and the apparent power consumption of the quartz crystal debugging oscillator during the temperature compensation debugging period is obtained by multiplication processing; the average current and average voltage of the quartz crystal debugging oscillator during the temperature compensation debugging period are obtained by using a current sensor installed in series on the power supply of the quartz crystal debugging oscillator to obtain the real-time current of the quartz crystal debugging oscillator during the temperature compensation debugging period, and the average current is obtained by using a mean analysis; the average voltage is obtained by using a voltage sensor installed in parallel on the power supply of the quartz crystal debugging oscillator to obtain the real-time voltage of the quartz crystal debugging oscillator during the temperature compensation debugging period, and the average voltage is obtained by using a mean analysis.
[0066] The temperature compensation adaptability index of the quartz crystal debugged oscillator is obtained by combining the apparent power consumption reference value. In a specific embodiment, the frequency data after the quartz crystal is debugged is plotted into a line graph, and the fluctuation of the line graph is analyzed to obtain the temperature compensation adaptability index of the quartz crystal debugged oscillator.
[0067] The temperature compensation adaptability index of the quartz crystal debugging oscillator is obtained by comprehensive analysis of the drift frequency, aging level and apparent power consumption of the quartz crystal debugging oscillator during the temperature compensation debugging period. It is used to determine the temperature compensation adaptability of the quartz crystal debugging oscillator. The specific expression is:
[0068]
[0069] Among them, ω is the temperature compensation adaptability index of the quartz crystal debugging oscillator. If the drift frequency of the quartz crystal debugging oscillator is too large after the temperature compensation scheme is implemented on the quartz crystal debugging oscillator, it means that the quartz crystal debugging oscillator is not compatible with the temperature compensation scheme and the temperature compensation scheme needs to be re-matched. If the aging level of the quartz crystal debugging oscillator is high and the apparent power consumption of the quartz crystal debugging oscillator is high, it means that the working performance of the quartz crystal debugging oscillator is reduced after temperature compensation and may not meet the requirements of the application scenarios of the quartz crystal debugging oscillator. Therefore, the drift frequency, aging level and apparent power consumption of the quartz crystal debugging oscillator during the temperature compensation debugging cycle of the quartz crystal debugging oscillator are comprehensively considered, and the expression analysis of the relationship between the three is performed. The temperature compensation adaptability of the quartz crystal debugging oscillator can be accurately analyzed to guide the optimization of the temperature compensation scheme and provide specific and accurate data for improving the long-term reliability of the quartz crystal debugging oscillator.
[0070] FR is the drift frequency of the quartz crystal debugging oscillator, which refers to the difference between the average output frequency of the second stage of the quartz crystal debugging oscillator and the average output frequency of the second stage of the quartz crystal debugging oscillator. If the difference is too large, it indicates that the output frequency of the quartz crystal debugging oscillator is unstable and cannot meet the actual working requirements.
[0071] TE is the aging level of the quartz crystal debugging oscillator, which is obtained by matching the aging frequency of the quartz crystal debugging oscillator and is used to reflect the aging degree of the quartz crystal debugging oscillator.
[0072] PD is the apparent power consumption of the quartz crystal debugging oscillator during the temperature compensation debugging cycle, which refers to the total power consumed by the quartz crystal debugging oscillator during the temperature compensation debugging cycle.
[0073] ΔPD is the power consumption reference value, which is extracted from the specification sheet of the quartz crystal debugged oscillator and is used to evaluate the reference standard of the apparent power consumption of the quartz crystal debugged oscillator during the temperature compensation debug cycle.
[0074] d1 is the influence factor corresponding to the drift frequency unit value, d2 is the influence factor corresponding to the aging level unit value, and d3 is the correction factor corresponding to the apparent power consumption. The influence factor corresponding to the drift frequency unit value, the influence factor corresponding to the aging level unit value, and the correction factor corresponding to the apparent power consumption can be used to analyze the regression coefficients of the historical drift frequency, the historical aging level, and the historical apparent power consumption in the temperature compensation adaptability index of the quartz crystal debugging oscillator through a multivariate regression model. The drift frequency regression coefficient, the aging level regression coefficient, and the apparent power consumption regression coefficient are the influence factor corresponding to the drift frequency unit value, the influence factor corresponding to the aging level unit value, and the correction factor corresponding to the apparent power consumption; the influence factor corresponding to the drift frequency unit value and the influence factor corresponding to the aging level unit value are both in the range of 0.4 to 0.8. In this example, the influence factor corresponding to the drift frequency unit value is specified to be 0.5, the influence factor corresponding to the aging level unit value is specified to be 0.55, the correction factor corresponding to the apparent power consumption is in the range of 0.1 to 0.25, and the correction factor corresponding to the apparent power consumption is specified to be 0.15 in this example.
[0075] In this embodiment, the value change of the temperature compensation adaptability index of the above quartz crystal debugging oscillator is shown in Table 2:
[0076] Table 2 Temperature compensation adaptability index of quartz crystal debugging oscillator
[0077] Drift frequency / Hz Aging level Apparent power consumption / Watt 0.04 0.09 1.8 0.05 0.1 2.0 0.06 0.12 2.2
[0078] In this example embodiment, according to the table of the temperature compensation adaptability index of the quartz crystal debugging oscillator, the drift frequency, aging level and apparent power consumption show the same change trend. When the drift frequency, aging level and apparent power consumption increase together, the temperature compensation adaptability index of the quartz crystal debugging oscillator will decrease, indicating that the temperature compensation adaptability of the quartz crystal debugging oscillator has deteriorated; conversely, the temperature compensation adaptability index of the quartz crystal debugging oscillator will increase, indicating that the temperature compensation adaptability of the quartz crystal debugging oscillator is good.
[0079] In a specific embodiment, the present invention provides a temperature-compensated quartz crystal oscillator testing method and device. By analyzing the operating data of each temperature sensor circuit belonging to the quartz crystal oscillator, it is helpful to fully understand the operating conditions of the temperature sensor. By analyzing the data processing information of the data processing circuit belonging to the quartz crystal oscillator, it is helpful to evaluate the data processing capability of the data processing circuit in the quartz crystal oscillator, and then the temperature compensation scheme of the quartz crystal oscillator can be matched in a targeted manner. The temperature compensation adaptability of the temperature-compensated quartz crystal oscillator is adjusted and fed back, which is beneficial to ensuring the stable performance of the quartz crystal oscillator and can improve the adjustment capability of the quartz crystal oscillator at different temperatures.
[0080] The second aspect of the present invention provides a device for a temperature-compensated quartz crystal oscillator test method, comprising: a quartz crystal oscillator, various temperature sensor circuits, a data processing circuit, a host computer and Bluetooth; the data processing circuit receives and processes the operating data of each temperature sensor circuit in the quartz crystal oscillator through Bluetooth, realizes the temperature compensation function of the quartz crystal oscillator, communicates the working parameters of the quartz crystal oscillator after temperature compensation with the host computer through Bluetooth, and finally realizes the temperature compensation test of the quartz crystal oscillator; the temperature sensor is used to collect the various temperatures of the quartz crystal oscillator within the temperature monitoring period and the temperature value of each temperature sensor self-heating within the temperature monitoring period; the voltage sensor is used to collect the real-time voltage of the quartz crystal debugging oscillator within the temperature compensation debugging period; the current sensor is used to collect the real-time current of the quartz crystal debugging oscillator within the temperature compensation debugging period; the processor is used to obtain the various temperatures of the quartz crystal oscillator within the temperature monitoring period, the temperature value of each temperature sensor self-heating within the temperature monitoring period, and the real-time current, the average current and the average voltage after the real-time current is averaged, and perform a comprehensive analysis, thereby adjusting and feeding back the temperature compensation adaptability of the quartz crystal oscillator.
[0081] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.
Claims
1. A temperature compensated quartz crystal oscillator testing method, characterized in that: include: S1. Obtain the operating data of each temperature sensor circuit of the quartz crystal oscillator, and analyze the performance trust index of the temperature sensor of the quartz crystal oscillator; S2. Collecting data processing information of the data processing circuit of the quartz crystal oscillator, and analyzing the data processing reliability index of the data processing circuit of the quartz crystal oscillator according to the operation data of each temperature sensor circuit of the quartz crystal oscillator; S3. According to the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, extract the data processing execution set of the data processing circuit to which the quartz crystal oscillator belongs, perform data processing on the data processing execution set to obtain the temperature characteristic value of the quartz crystal oscillator, thereby matching the temperature compensation scheme of the quartz crystal oscillator, and record the temperature-compensated quartz crystal oscillator as a quartz crystal debugging oscillator; S4. Obtain the working parameters of the quartz crystal debugging oscillator from the host computer, evaluate the temperature compensation adaptability index of the quartz crystal debugging oscillator, and adjust the temperature compensation adaptability of the quartz crystal debugging oscillator to provide feedback; The performance trust index of the temperature sensor of the quartz crystal oscillator is obtained by comprehensive analysis of the temperature update sensitivity level and self-heating influence level of each temperature sensor of the quartz crystal oscillator within the temperature monitoring cycle, and is used to determine the performance trust value of the temperature sensor of the quartz crystal oscillator; The data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs is obtained by comprehensive analysis of the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs, the data synchronization degree, sampling rate and error occurrence rate of the data processing circuit to which the quartz crystal oscillator belongs, and is used to determine the data processing reliability of the data processing circuit to which the quartz crystal oscillator belongs; The temperature compensation adaptability index of the quartz crystal debugging oscillator is obtained by comprehensive analysis of the drift frequency, aging level and apparent power consumption of the quartz crystal debugging oscillator during the temperature compensation debugging period, and is used to determine the temperature compensation adaptability of the quartz crystal debugging oscillator.
2. A temperature compensated quartz crystal oscillator testing method according to claim 1, characterized in that: The specific analysis process of analyzing the performance trust index of the temperature sensor to which the quartz crystal oscillator belongs is as follows: According to the operation data of each temperature sensor circuit belonging to the quartz crystal oscillator, the temperature change curve of each temperature sensor circuit belonging to the quartz crystal oscillator is extracted, the temperature monitoring time point corresponding to each temperature of each temperature sensor is located, and the difference accumulation processing of adjacent temperature monitoring time points is performed to obtain the cumulative update time period of each temperature sensor, and the temperature update sensitivity level corresponding to each cumulative update time period is matched to obtain the temperature update sensitivity level of each temperature sensor belonging to the quartz crystal oscillator within the temperature monitoring period; According to the temperature change curve of each temperature sensor circuit belonging to the quartz crystal oscillator, the temperature value of each temperature sensor belonging to the quartz crystal oscillator at each temperature monitoring time point is extracted, and the average temperature of each temperature sensor belonging to the quartz crystal oscillator in the temperature monitoring period is obtained by averaging, and the self-heating impact level corresponding to each average temperature interval is matched to obtain the self-heating impact level of each temperature sensor belonging to the quartz crystal oscillator in the temperature monitoring period; The performance trust index of the temperature sensor of the quartz crystal oscillator is obtained by analyzing the temperature update sensitivity level and self-heating influence level of each temperature sensor of the quartz crystal oscillator during the temperature monitoring period.
3. A temperature compensated quartz crystal oscillator testing method according to claim 2, characterized in that: The performance trust index of the temperature sensor to which the quartz crystal oscillator belongs is specifically expressed as: ; in, is the performance trust index of the temperature sensor of the quartz crystal oscillator, is the temperature update sensitivity level of the mth temperature sensor of the quartz crystal oscillator during the temperature monitoring cycle, is the self-heating impact level of the mth temperature sensor of the quartz crystal oscillator during the temperature monitoring cycle, The impact factor corresponding to the unit value of the temperature update sensitivity level, is the impact factor corresponding to the unit value of the self-heating impact level, m is the number of each temperature sensor, , p is the total number of temperature sensors.
4. A temperature compensated quartz crystal oscillator testing method according to claim 1, characterized in that: The data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs is analyzed, and the specific analysis process is as follows: According to the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, extract each signal receiving time point of the data processing circuit to which the quartz crystal oscillator belongs, perform difference processing with the signal sending time point corresponding to each temperature sensor obtained, obtain each data synchronization time difference of the data processing circuit to which the quartz crystal oscillator belongs, and perform average processing on each data synchronization time difference of the data processing circuit to which the quartz crystal oscillator belongs to obtain the data synchronization time average difference of the data processing circuit to which the quartz crystal oscillator belongs, match it with the data synchronization degree corresponding to each data synchronization time average difference interval, and obtain the data synchronization degree of the data processing circuit to which the quartz crystal oscillator belongs; Counting the number of signal reception time points of the data processing circuit to which the quartz crystal oscillator belongs, recording it as the number of signal receptions of the data processing circuit to which the quartz crystal oscillator belongs, sorting the signal reception time points of the data processing circuit to which the quartz crystal oscillator belongs in chronological order, performing difference processing on the signal reception time point ranked last and the signal reception time point ranked first to obtain the signal reception time period of the data processing circuit to which the quartz crystal oscillator belongs, performing ratio analysis with the number of signal receptions of the data processing circuit to which the quartz crystal oscillator belongs, and obtaining the sampling rate of the data processing circuit to which the quartz crystal oscillator belongs; According to the data processing information of the data processing circuit to which the quartz crystal oscillator belongs, each signal receiving code of the data processing circuit to which the quartz crystal oscillator belongs is extracted, and the signal sending code corresponding to each temperature sensor circuit is compared with the error through the signal verification model, and the number of error signals occurring is counted, and the ratio processing is performed with the number of signal receiving codes of the data processing circuit to which the quartz crystal oscillator belongs, so as to obtain the error occurrence rate of the data processing circuit to which the quartz crystal oscillator belongs; The data processing reliability index of the data processing circuit of the quartz crystal oscillator is obtained by combining the error definition occurrence rate and the performance trust index of the temperature sensor of the quartz crystal oscillator.
5. A temperature compensated quartz crystal oscillator testing method according to claim 1, characterized in that: The data processing execution set of the data processing circuit to which the quartz crystal oscillator belongs specifically includes the transient average temperature of the quartz crystal oscillator and the transient average frequency of the quartz crystal oscillator.
6. A temperature compensated quartz crystal oscillator testing method according to claim 5, characterized in that: The data processing execution set is processed to obtain the temperature characteristic value of the quartz crystal oscillator. The specific data processing process is as follows: Through the neural network model, the compensation temperature value corresponding to the quartz crystal oscillator is fitted to obtain a temperature compensation algorithm, and the data processing reliability index of the data processing circuit to which the quartz crystal oscillator belongs, the transient average temperature of the quartz crystal oscillator and the transient average frequency of the quartz crystal oscillator are input into the temperature compensation algorithm to generate the temperature characteristic value of the quartz crystal oscillator.
7. A temperature compensated quartz crystal oscillator testing method according to claim 6, characterized in that: The matching obtains the temperature compensation scheme of the quartz crystal oscillator, and the specific analysis process is as follows: The temperature characteristic value of the quartz crystal oscillator is differenced with the temperature compensation reference value to obtain the temperature value of the quartz crystal oscillator that needs to be compensated. The temperature value of the quartz crystal oscillator that needs to be compensated is matched with the temperature compensation scheme corresponding to each temperature value interval that needs to be compensated to obtain the temperature compensation scheme of the quartz crystal oscillator, thereby temperature compensating the quartz crystal oscillator.
8. A temperature compensated quartz crystal oscillator testing method according to claim 1, characterized in that: The specific evaluation process of evaluating the temperature compensation adaptability index of the quartz crystal debugging oscillator is as follows: According to the working parameters of the quartz crystal debugging oscillator, the average output frequency of the first stage of the quartz crystal debugging oscillator in the temperature compensation debugging cycle is extracted, and the average output frequency of the second stage of the quartz crystal debugging oscillator in the next adjacent temperature compensation debugging cycle is extracted, and the difference processing is performed with the average output frequency of the first stage of the quartz crystal debugging oscillator in the temperature compensation debugging cycle to obtain the drift frequency of the quartz crystal debugging oscillator; The average output frequency of the quartz crystal debugging oscillator in the temperature monitoring period is collected, and the difference analysis is performed with the average output frequency of the quartz crystal debugging oscillator in the first stage in the temperature compensation debugging period to obtain the aging frequency of the quartz crystal debugging oscillator, and the aging level corresponding to each aging frequency interval is matched to obtain the aging level of the quartz crystal debugging oscillator; The average current and average voltage of the quartz crystal debugging oscillator during the temperature compensation debugging period are collected, and the apparent power consumption of the quartz crystal debugging oscillator during the temperature compensation debugging period is obtained by multiplication processing; the temperature compensation adaptability index of the quartz crystal debugging oscillator is obtained by combining the apparent power consumption reference value.
9. A temperature compensated quartz crystal oscillator testing method according to claim 8, characterized in that: The adjustment feedback of the temperature compensation adaptability of the quartz crystal debugging oscillator is as follows: The temperature compensation adaptability index of the quartz crystal debugging oscillator is compared with the temperature compensation adaptability threshold. If the temperature compensation adaptability index of the quartz crystal debugging oscillator is less than the temperature compensation adaptability threshold, the temperature compensation adaptability degree of the quartz crystal debugging oscillator is adjusted and fed back.
10. A device for testing a temperature compensated quartz crystal oscillator according to any one of claims 1 to 9, characterized in that: include: Quartz crystal oscillator, temperature sensor circuits, data processing circuit, host computer and Bluetooth; The data processing circuit receives and processes the operating data of each temperature sensor circuit in the quartz crystal oscillator via Bluetooth, realizes the temperature compensation function of the quartz crystal oscillator, communicates the operating parameters of the quartz crystal oscillator after temperature compensation with the host computer via Bluetooth, and finally realizes the temperature compensation test of the quartz crystal oscillator; The temperature sensor is used to collect the temperatures of the quartz crystal oscillator during the temperature monitoring period and the temperature value of each temperature sensor itself during the temperature monitoring period; Voltage sensor, used to collect the real-time voltage of the quartz crystal debugging oscillator during the temperature compensation debugging cycle; Current sensor, used to collect the real-time current of the quartz crystal debugging oscillator during the temperature compensation debugging cycle; The processor is used to obtain the various temperatures of the quartz crystal oscillator during the temperature monitoring period, the temperature value of each temperature sensor's own heating during the temperature monitoring period, and the real-time current, the average current and the average voltage after the real-time current is averaged, and perform a comprehensive analysis, thereby adjusting and feeding back the temperature compensation adaptability of the quartz crystal oscillator.
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